CN111830790A - Gas bath device and photoetching machine - Google Patents
Gas bath device and photoetching machine Download PDFInfo
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- CN111830790A CN111830790A CN201910310384.XA CN201910310384A CN111830790A CN 111830790 A CN111830790 A CN 111830790A CN 201910310384 A CN201910310384 A CN 201910310384A CN 111830790 A CN111830790 A CN 111830790A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70408—Interferometric lithography; Holographic lithography; Self-imaging lithography, e.g. utilizing the Talbot effect
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention provides a gas bath device and a photoetching machine. The gas bath device is used for blowing gas to the moving part, the gas bath device comprises a gas supply unit, at least one gas adjusting unit and a control unit, the gas supply unit is used for supplying gas, the gas adjusting unit is used for blowing the gas, the direction of blowing the gas by the gas adjusting unit is adjustable, the control unit is used for controlling the gas adjusting unit to adjust the direction of blowing the gas by the gas adjusting unit in real time, so that the direction of blowing the gas by the gas adjusting unit is changed along with the change of the position of the moving part in real time, the moving part can be covered by the gas blown by the gas adjusting unit in real time, the area of the gas adjusting unit can be reduced, the volume of the gas bath device is simplified, and the gas blowing direction of the gas adjusting unit is convenient to adjust, and the maintenance and adjustment efficiency is improved.
Description
Technical Field
The invention relates to the technical field of photoetching, in particular to a gas bath device and a photoetching machine.
Background
The photoetching machine is a key device in the semiconductor industry, the photoetching machine has extremely high precision requirement and very complex structure, and the product precision reaches the nanometer level. In order to realize the normal operation of high-precision equipment, a stable working environment needs to be established inside the whole photoetching machine. In order to ensure the normal operation of the whole photoetching machine, the control of the temperature, the pressure and the pollutants in the whole photoetching machine is very important.
Generally, the control of the temperature, the pressure and the pollutants in the whole photoetching machine is realized by forming an environment with a certain positive pressure in each area of the whole photoetching machine, so that the temperature and the pressure of the gas in each area of the whole photoetching machine can be ensured to be constant, and the external pollutants can not enter each area of the whole photoetching machine. This environment with a certain positive pressure is generally achieved by continuously blowing a cleaning gas into the lithography machine through a gas bath device. The gas generating device in the gas bath device generates clean gas, the clean gas is conveyed to a gas regulating unit (gas bath plate) in the gas bath device after the temperature is controlled by a heat exchanger in the gas bath device, the clean gas is blown to each controlled object by the gas regulating unit, and the gas removing device can discharge the gas passing through the controlled object and some pollutants generated when equipment runs out of the whole photoetching machine. Each gas conditioning unit of a typical gas bath apparatus includes a first gas bath module that blows out a high-speed gas and a second gas bath module that blows out a low-speed gas.
The requirements of different areas in the whole photoetching machine on temperature and pressure are different, and especially the requirements of the area of the moving table and the area of the measuring system on temperature and pressure are higher.
In the motion table area, because the motion table has very high speed and acceleration when working, and the motion table itself is a moving heat source, has an influence on the surrounding environment, and in order to ensure that the precision motion of the motion table is stable and reliable, the environment in the motion table area needs to be relatively stable. However, the gas conditioning unit fixedly disposed on the frame of the lithography machine in the gas bath apparatus needs to cover the entire moving stage area according to the moving locus of the moving stage, the area of the gas conditioning unit is large, and a large space needs to be occupied. And the wind direction of the gas blown out by the gas conditioning unit fixedly arranged on the frame of the photoetching machine can not be adjusted, and certain positions in the moving table area can not be well covered by the gas blown out by the gas conditioning unit.
The measurement system of the lithography machine generally has an interferometer measurement system and/or an optical grating measurement system, but the environment of the measurement system area needs to be stable no matter the lithography machine has the interferometer measurement system or the optical grating measurement system.
For a lithography machine comprising an interferometer measurement system, the first gas bath component needs to cover the whole interferometer light path, so that the temperature on the light path is stable, the pressure fluctuation is small, and the influence of the ambient environment on the interferometer light path is avoided. Because the tail end of the interferometer light path is close to the objective lens, the first air bath component cannot be arranged on the whole interferometer light path, and the method generally adopted is to enable the first air bath component close to the tail end of the interferometer light path to have the function of oblique air blowing, so that the tail end of the interferometer light path can be covered by air blown out by the first air bath component. This function of diagonal blowing is generally achieved by changing the direction of the air blown out from the first air bath assembly by means of a grid guide plate, the structure of which is schematically shown in fig. 1. However, the grid guide plate is fixedly installed on the frame of the lithography machine, and the wind direction of the blown gas cannot be adjusted even after the grid guide plate is designed and installed, so that the degree of changing the wind direction of the blown gas is limited.
For a lithography machine including a grating scale measurement system, the planar grating scale 110 is mounted on the lower surface of the main substrate 120, and the grating scale reading head 130 is mounted on the moving stage 140 and moves together with the moving stage 140. As shown in fig. 2, fig. 2 is a schematic structural diagram of a lithography machine including a grating scale measurement system, when exposure is performed, the moving stage 140 moves according to a predetermined track, the position of the moving stage 140 constantly changes, which causes the position of the grating scale reading head 130 to constantly change, and gas is required to be continuously blown and showered near the reading head of the moving stage 140, so that the grating scale reading head 130 can be always covered by a gas bath, thereby ensuring that the temperature environment of the measurement system is stable. Meanwhile, the continuous blowing and showering of the gas can also take away the heat emitted by the motion table 140, so that the temperature of the motion table 140 is stable, the influence of the thermal deformation of the motion table 140 on the precision is reduced, and the improvement of the precision of the motion table 140 and the precision of a measurement system is facilitated. According to the motion track of the motion stage 140, a plurality of gas conditioning units fixedly arranged on the frame of the lithography machine in the gas bath device need to cover the whole motion stage 140 area, and the plurality of gas conditioning units have large area and need to occupy large space. However, a large part of the entire area of the moving stage 140 is the area where the grating ruler is located, and a plurality of gas conditioning units of the gas bath apparatus cannot be arranged.
In both the lithography machine including the grating scale measurement system and the lithography machine including the interferometer measurement system, the plurality of gas conditioning units in the gas bath device inside the lithography machine are fixedly arranged relative to the frame of the lithography machine, and the wind direction of the blown gas cannot be adjusted after the plurality of gas conditioning units in the gas bath device inside the lithography machine are designed and installed. In practical engineering applications, if the gas blown out from the gas conditioning unit is to always cover the moving object, the grating ruler reading head, and the interferometer optical path in the moving stage area, the wind direction of the gas blown out from the gas conditioning unit needs to be adjusted, and if the wind direction of the gas blown out from the gas conditioning unit needs to be adjusted, the machine must be stopped, and it is very troublesome to change the gas conditioning unit or change the installation angle of the gas conditioning unit to change the wind direction of the gas blown out from the gas conditioning unit, and the space for installing the gas bath device in the lithography machine is limited. Meanwhile, when the controlled object is a moving part in some areas, the moving part cannot be always covered by the gas bath by the plurality of gas regulating units fixedly arranged relative to the frame of the photoetching machine in a limited space.
Disclosure of Invention
The invention aims to provide a gas bath device and a photoetching machine, which aim to solve the problem that the moving part cannot be covered by a gas bath in real time because the wind direction of the gas blown by the existing gas bath device and photoetching machine cannot be adjusted.
In order to solve the above technical problem, the present invention provides a gas bath apparatus for blowing a gas to a moving object, the gas bath apparatus including a gas supply unit for supplying the gas, at least one gas adjusting unit for blowing the gas, and the direction in which the gas adjusting unit blows the gas is adjustable, and a control unit for controlling the gas adjusting unit to adjust the direction in which the gas adjusting unit blows the gas in real time so that the direction in which the gas adjusting unit blows the gas changes in real time as the position of the moving object changes.
Optionally, the gas regulating unit comprises at least one gas bath for blowing the gas, and the direction in which the gas is blown by the at least one gas bath is adjustable.
Optionally, the gas bath with the direction of blowing gas adjustable includes a gas bath body, an adjusting mechanism, an end plate and a connecting piece, the gas bath body has a hollow cavity, the cavity of the gas bath body is communicated with the pipeline, the adjusting mechanism is disposed in the cavity of the gas bath body, the adjusting mechanism is connected with the end plate, the adjusting mechanism is used for driving the end plate to rotate, the connecting piece is used for flexibly connecting the gas bath body and the end plate, the end plate is provided with at least one through hole, and the gas can flow through the through hole.
Optionally, the connecting piece is used for sealing and connecting the gas bath body and the end plate.
Optionally, the gas bath with the adjustable blowing direction further comprises a locking device for locking an adjusting mechanism of the gas bath.
Optionally, the gas regulating unit comprises a first gas bath, a second gas bath and a third gas bath, the first gas bath, the second gas bath and the third gas bath are all communicated with the gas supply unit, the wind speed of the gas blown out from the first gas bath is larger than the wind speed of the gas blown out from the second gas bath and the third gas bath, the first gas bath, the second gas bath and the third gas bath are respectively used for blowing gas, and the direction of blowing gas by the first gas bath is adjustable.
Optionally, the control unit comprises a moving part controller, a gas bath adjusting mechanism controller and a synchronous controller, the moving part controller is used for controlling the moving part to move, the gas bath adjusting mechanism controller is used for controlling the gas adjusting unit to adjust the gas blowing direction of the gas adjusting unit in real time, and the synchronous controller is used for controlling the moving part controller and the gas bath adjusting mechanism controller to act synchronously so that the gas blowing direction of the gas adjusting unit changes in real time along with the change of the position of the moving part.
Optionally, the control unit further includes a complete machine controller, and the complete machine controller is configured to send a moving part working instruction to the moving part controller, and send a gas bath working instruction to the gas bath adjustment mechanism controller; the moving part controller receives the moving part working instruction, converts the moving part working instruction into a track planning parameter and controls the moving part to move according to the track planning parameter; the gas bath adjusting mechanism controller receives the gas bath working instruction, converts the gas bath working instruction into an initial parameter set value, and controls the gas adjusting unit to act through the initial parameter set value; and the synchronous control system sends synchronous control time sequence information to the moving part controller and the gas bath adjusting mechanism controller through synchronous time sequence flow so as to control the moving part controller and the gas bath adjusting controller to synchronously act.
Optionally, the gas supply unit includes gas generator, gas filtration purifier, gas temperature control device and pipeline, gas generator passes through the pipeline is with all the gas conditioning unit is connected, gas filtration purifier sets up on the pipeline, be located gas generator with between the gas conditioning unit, gas temperature control device sets up on the pipeline, be located gas filtration purifier with between the gas conditioning unit, gas generator is used for producing gas, gas filtration purifier is used for purifying gas, temperature control device is used for control gaseous temperature.
The invention also provides a photoetching machine comprising the gas bath device.
The invention provides a gas bath device and a photoetching machine, which have the following beneficial effects:
since the gas supply unit is used for supplying gas, the gas adjusting unit is used for blowing gas, the direction of blowing gas by the gas adjusting unit is adjustable, and the adjustment of the direction of blowing gas by the gas adjusting unit is controlled by the control unit in a manner that the gas adjusting unit adjusts the direction of blowing gas by the gas adjusting unit in real time so that the direction of blowing gas by the gas adjusting unit changes in real time along with the change of the position of the moving part. The direction in which the gas is blown by the gas adjusting unit is changed in real time as the position of the moving object changes, so that the direction in which the gas is blown by the gas adjusting unit is adjusted in real time as the position of the moving object changes, compared to a gas bath apparatus in the prior art in which the direction in which the gas is blown is not adjustable, thereby enabling the moving object to be covered with the gas blown by the gas adjusting unit in real time even if the moving object is covered with the gas bath in real time. And the direction of the gas blown by the gas regulating unit can be regulated, so that the moving piece can be covered by the gas blown by the gas regulating unit in real time under the condition of reducing the area of the gas regulating unit, the volume of the gas bath device is simplified, the direction of the gas blown by the gas regulating unit is convenient to regulate, and the maintenance and regulation efficiency of the gas bath device is improved.
Drawings
FIG. 1 is a schematic view of a structure of a grid guide plate;
FIG. 2 is a schematic diagram of a lithography machine including a grating scale measurement system;
FIG. 3 is a front view of a gas bath apparatus according to a first embodiment of the present invention;
FIG. 4 is a top view of the gas bath apparatus of FIG. 3;
FIG. 5 is a schematic diagram of a gas conditioning unit according to an embodiment of the present invention;
FIG. 6 is a schematic view of the structure of a first gas bath in accordance with a first embodiment of the present invention;
FIG. 7 is a schematic view of the construction of a first end plate in a first gas bath in accordance with a first embodiment of the present invention;
FIG. 8 is a block diagram showing the structure of a control unit of a gas bath apparatus according to one embodiment of the present invention;
FIG. 9 is a schematic diagram of the structure of the motion stage between two rows of gas conditioning units according to one embodiment of the present invention;
FIG. 10 is a schematic view of the structure of the moving stage biased to the positive side X between two rows of gas conditioning units according to the first embodiment of the present invention;
FIG. 11 is a schematic view of the structure of the motion stage between two rows of gas conditioning units biased toward the negative X-direction side according to the first embodiment of the present invention;
FIG. 12 is a schematic diagram of wind speeds at different positions of a moving platform according to an embodiment of the present invention.
Description of reference numerals in the background art:
110-a planar grating scale; 120-a main substrate; 130-grating scale reading head; 140-a motion stage;
description of the reference numerals in the detailed description:
210-a gas generating device; 220-gas filtering and purifying device; 230-gas temperature control means; 240-a pipeline;
300-a gas conditioning unit;
310-first gas bath; 311-a first gas bath body; 312 — a first adjustment mechanism; 313-a first end plate; 314-a first connector;
320-second gas bath;
330-third air bath;
410-motion stage frame;
420-a motion stage;
430-plane grating ruler;
450-a main substrate;
510-air extraction means;
520-an exhaust;
610-a first position; 620-a second position; 630-a third position; 640-fourth position.
Detailed Description
The gas bath device and the lithography machine according to the present invention will be described in further detail with reference to the accompanying drawings and specific examples. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
Example one
The present embodiment provides a gas bath apparatus. Referring to fig. 3 and 4, fig. 3 is a front view of a gas bath apparatus according to an embodiment of the present invention, and fig. 4 is a plan view of the gas bath apparatus of fig. 3 for blowing gas to the moving object, the gas bath apparatus including a gas supply unit for supplying gas, at least one gas adjusting unit 300 for blowing gas, and the gas adjusting unit 300 having an adjustable direction of blowing gas, and a control unit for controlling the gas adjusting unit 300 to adjust the direction of blowing gas by the gas adjusting unit 300 in real time such that the direction of blowing gas by the gas adjusting unit 300 varies in real time with a variation in the position of the moving object.
Since the gas supply unit is used to supply gas, the gas adjusting unit 300 is used to blow gas, and the direction in which the gas adjusting unit 300 blows gas is adjustable, and the adjustment of the direction in which the gas adjusting unit 300 blows gas is controlled by the control unit in such a manner that the gas adjusting unit 300 adjusts the direction in which the gas adjusting unit 300 blows gas in real time so that the direction in which the gas adjusting unit 300 blows gas changes in real time as the position of the mover changes.
The direction in which the gas regulating unit 300 blows the gas is changed in real time according to the change of the position of the mover, so that the direction in which the gas regulating unit 300 blows the gas is regulated in real time according to the change of the position of the mover, compared to the related art gas bath apparatus in which the direction in which the gas is blown is not regulated, thereby enabling the mover to be covered with the gas blown by the gas regulating unit 300 in real time. Also, since the direction in which the gas regulating unit 300 blows the gas is adjustable, it is possible to allow the moving object to be covered with the gas blown by the gas regulating unit 300 in real time while reducing the area of the gas regulating unit 300, simplifying the volume of the gas bath apparatus, and facilitating the adjustment of the direction in which the gas regulating unit 300 blows the gas, improving maintenance and adjustment efficiency.
Referring to fig. 3 and 4, the gas supply unit is for blowing gas, and includes a gas generation device 210, a gas filtration purification device 220, a gas temperature control device 230, and a duct 240.
The gas generating device 210 is connected to all the gas conditioning units 300 through a pipe 240, the gas filtering and purifying device 220 is disposed on the pipe 240 between the gas generating device 210 and the gas conditioning units 300, and the gas temperature control device 230 is disposed on the pipe 240 between the gas filtering and purifying device 220 and the gas conditioning units 300.
Wherein the gas generating device 210 is used for generating gas. The gas is usually wet air, for example, the immersion liquid in the immersion system evaporates to bring about temperature changes, which causes dimensional changes of related parts and silicon wafers, thereby affecting the exposure precision, and the introduction of the wet air can effectively reduce the evaporation rate of the immersion liquid, thereby controlling the temperature changes, and further reducing the risk of affecting the exposure precision due to the dimensional changes of the related parts and silicon wafers caused by the temperature changes. The gas filtering and purifying device 220 is used for purifying the gas. The temperature control device is used for controlling the temperature of the gas.
Referring to fig. 5, 6 and 7, fig. 5 is a schematic structural diagram of a gas conditioning unit 300 according to a first embodiment of the present invention, fig. 6 is a schematic structural diagram of a first gas bath 310 according to a first embodiment of the present invention, and fig. 7 is a schematic structural diagram of a first end plate 313 in the first gas bath 310 according to a first embodiment of the present invention, wherein the gas conditioning unit 300 includes the first gas bath 310, a second gas bath 320 and a third gas bath 330. The first gas bath 310, the second gas bath 320 and the third gas bath 330 are all communicated with the gas supply unit through the pipe 240. The first, second and third gas baths 310, 320 and 330 are used for blowing gas, respectively. Wherein the direction of the gas blown by the first gas bath 310 is adjustable.
Specifically, as shown in fig. 5, the first gas bath 310, the second gas bath 320, and the third gas bath 330 are arranged side by side, and the gas inlets of the first gas bath 310, the second gas bath 320, and the third gas bath 330 are all communicated with the pipeline 240, so that the gas passing through the temperature control device can enter the cavities of the first gas bath 310, the second gas bath 320, and the third gas bath 330 from the gas inlets of the first gas bath 310, the second gas bath 320, and the third gas bath 330, and be blown out from the gas outlets of the first gas bath 310, the second gas bath 320, and the third gas bath 330. The first, second, and third gas baths 310, 320, and 330 may adjust the velocity of the gas such that the gas blown from the first gas bath 310 is a high velocity gas and the gas blown from the second and third gas baths 320 and 330 is a low velocity gas.
As shown in fig. 6, the first air bath 310 includes a first air bath body 311, a first adjustment mechanism 312, a first end plate 313, and a first connection member 314.
The first air bath body 311 has a hollow cavity, and the cavity of the first air bath body 311 is communicated with the pipeline 240. The first adjusting mechanism 312 is disposed in the cavity of the first air bath body 311, the first adjusting mechanism 312 is connected to the first end plate 313, and the first adjusting mechanism 312 is configured to drive the first end plate 313 to rotate. The first connecting member 314 is used for flexibly connecting the first air bath body 311 and the first end plate 313. The first end plate 313 is provided with at least one through hole through which gas can flow. The place where the cavity of the first gas bath body 311 communicates with the pipeline 240 is an air inlet of the first gas bath 310, and the first end plate 313 is an air outlet of the first gas bath 310.
Preferably, the first connecting member 314 is further used for hermetically connecting the first gas bath body 311 and the first end plate 313, so that gas can only flow out of the first end plate 313 when the gas bath apparatus is in operation, and thus when the first end plate 313 is driven to rotate by the first adjusting mechanism 312, the first connecting member 314 can prevent gas from leaking from a gap between the first end plate 313 and the first gas bath body 311, thereby improving the efficiency and accuracy of adjusting the direction of the blown gas.
Preferably, the first gas bath 310 further comprises a locking device for locking the first adjusting mechanism 312, so that the first adjusting mechanism 312 can be locked by the locking device after rotating, thereby avoiding the problem that the first end plate 313 rotates when rotation is not needed, i.e. when the direction of blowing gas from the first end plate 313 is not needed to be adjusted, and further causing the direction of blowing gas from the first end plate 313 to change, and further improving the accuracy of the direction of blowing gas.
Specifically, in this embodiment, the shape and size of the inner cavity of the first air bath body 311 are sequentially changed from the air inlet end of the first air bath 310 to the end of the first air bath body 311 connected to the first end plate 313, so that the air entering the inner cavity of the first air bath body 311 is blown out at a predetermined air speed, for example, at a higher speed, by the inner cavity.
The first adjustment mechanism 312 may be driven to rotate the first end plate 313 by pneumatic, electric, hydraulic, or the like. The first adjustment mechanism 312 includes a driving device and a transmission device, and the driving device is used for driving the first end plate 313 to rotate through the transmission device. Specifically, drive arrangement can be for exporting the cylinder of rotary power, transmission is the connecting rod, the output of cylinder with the connecting rod is connected, the connecting rod with first end plate 313 fixed connection, the cylinder drive the connecting rod rotates, the connecting rod drive first end plate 313 rotates.
The number of the through holes in the first end plate 313 is greater than two, the first end plate 313 is plate-shaped, and all the through holes are arranged on the first end plate 313 in a honeycomb shape. The through hole with the contained angle between the first terminal plate 313 is theta, 0 degree < theta <90 degrees, and the size of theta can be designed according to the requirements of different machines. The direction of the wind blowing the gas from the first end plate 313 is related to the relative position of the first end plate 313 and the first gas bath body 311, and also related to the size of the included angle theta between the through hole and the first end plate 313. The first end plate 313 may be made of stainless steel, PTFE, or the like.
The connecting piece can be made of rubber, silica gel and other materials with certain elasticity, and can deform to a certain extent when the first end plate 313 and the first air bath body 311 are connected in a sealing manner, so that the situation that the sealing performance between the first end plate 313 and the first air bath body 311 is damaged when the first end plate 313 rotates under the driving of the first adjusting mechanism 312 can be avoided.
The second gas bath 320 includes a second gas bath body and a second end plate. The second air bath body has a hollow cavity, and the cavity of the second air bath body is communicated with the pipeline 240. The second end plate is provided with at least one through hole, and gas can flow through the through hole. The second end plate is fixedly arranged on the second air bath body. The communicating part of the cavity of the second gas bath body and the pipeline 240 is the gas inlet of the second gas bath 320, and the second end plate is the gas outlet of the second gas bath 320. The shape and size of the inner cavity of the second gas bath body are changed from the gas inlet end of the second gas bath 320 to the end of the second gas bath body connected with the second end plate in sequence, so that the gas entering the inner cavity of the second gas bath body is blown out at a preset wind speed, for example, at a lower speed, under the action of the inner cavity.
The third gas bath 330 has a structure similar to that of the second gas bath 320. The third gas bath 330 includes a third gas bath body and a third end plate. The third air bath body has a hollow cavity, and the cavity of the third air bath body is communicated with the pipeline 240. The third end plate is provided with at least one through hole, and gas can flow through the through hole. The third end plate is fixedly arranged on the third gas bath body. The communicating part of the cavity of the third gas bath body and the pipeline 240 is the gas inlet of the third gas bath 330, and the third end plate is the gas outlet of the third gas bath 330. The shape and size of the inner cavity of the third gas bath body are sequentially changed from the gas inlet end of the third gas bath 330 to the end of the third gas bath body connected with the third end plate, so that the gas entering the inner cavity of the third gas bath body is blown out at a predetermined wind speed, for example, at a lower speed, under the action of the inner cavity.
Preferably, in order to ensure the wind speed and cleanliness of the gas entering the first, second and third gas baths 310, 320 and 330, a filter is further disposed on the pipe 240 between the gas temperature control device 230 and the gas conditioning unit 300. In order to stabilize the temperature of the gas passing through the gas temperature control device 230, the pipeline 240 between the gas temperature control device 230 and the gas conditioning unit 300 is designed to be a double-layer structure, and the middle is filled with a thermal insulation material, so that the risk that the gas in the pipeline 240 is affected by the surrounding environment is reduced.
The control unit comprises a motion piece controller, a gas bath adjusting mechanism controller and a synchronous controller. The moving part controller is used for controlling the moving part to move, the gas bath adjusting mechanism controller is used for controlling the gas adjusting unit to adjust the gas blowing direction of the gas adjusting unit in real time, and the synchronous controller is used for controlling the moving part controller and the gas bath adjusting mechanism controller to act synchronously so that the gas blowing direction of the gas adjusting unit changes in real time along with the change of the position of the moving part.
Referring to fig. 8, fig. 8 is a block diagram of a control unit of a gas bath apparatus according to an embodiment of the present invention, where the control unit further includes a complete machine controller, and the complete machine controller is configured to send a moving member operating instruction to the moving member controller, and send a gas bath operating instruction to the gas bath adjustment mechanism controller. And the moving part controller receives the moving part working instruction, converts the moving part working instruction into a track planning parameter and controls the moving part to move according to the track planning parameter. The gas bath adjusting mechanism controller receives the gas bath working instruction, converts the gas bath working instruction into an initial parameter set value, and controls the gas adjusting unit 300 to act according to the initial parameter set value. The synchronous control system sends synchronous control time sequence information to the moving part controller and the gas bath adjusting mechanism controller through synchronous time sequence flow so as to control the moving part controller and the gas bath adjusting mechanism controller to synchronously act.
Specifically, the gas bath adjustment mechanism controller controls the operation of the first adjustment mechanism 312 of the first gas bath 310 of the gas conditioning unit 300 according to the initial parameter setting value.
The gas bath apparatus further comprises a gas suction device 510, wherein the gas suction device 510 is used for sucking the gas and discharging the gas.
The gas bath device further comprises an exhaust device 520, the exhaust device 520 is communicated with the air suction device 510, and the air suction device 510 sucks the gas through the exhaust device 520. For example, the exhaust 520 may be a pipe having a plurality of openings.
The following describes the operation of the gas bath apparatus in a lithography machine by taking the gas bath apparatus as an example.
As shown in fig. 3 and 4, the lithography machine includes a moving stage frame 410, a moving stage 420, a planar grating scale 430, a grating scale reading head, and a main substrate 450, the moving stage 420 is disposed on the moving stage frame 410, the planar grating scale 430 is mounted on a lower surface of the main substrate 450, and the grating scale reading head is mounted on the moving stage 420 and moves along with the moving stage 420.
The number of the gas adjusting units 300 is eight, every four gas adjusting devices are arranged in a row along the Y-axis direction, and the eight gas adjusting devices are respectively arranged at both sides of the moving table frame 410 in a symmetrical manner about a symmetry axis parallel to the Y-axis. The number of the air suction devices is two, and the two air suction devices are respectively arranged on the other two sides of the moving table frame 410 in a symmetrical mode about a symmetry axis parallel to the X axis. Because the gas-extracting device and the gas-adjusting device are respectively disposed on two different sides of the motion stage frame 410, the gas blown from the gas-adjusting device can be blown to the motion stage 420 better, and then enter the gas-extracting device to be discharged out of the lithography machine. The number of the temperature control devices is two, and the two temperature control devices are respectively disposed at both sides of the moving table frame 410 in a symmetrical manner about a symmetry axis parallel to the Y-axis. Each of the temperature control devices is connected to the four gas conditioning units 300 on the same side, and the gas treated by the gas filtering and purifying device 220 is divided into two paths to enter the two temperature control devices, and flows from the two temperature control devices to the four gas conditioning units 300 corresponding to the temperature control devices.
Wherein the mover includes the moving stage 420 and the grating scale reading head mounted on the moving stage 420 and moving together with the moving stage 420, in other embodiments the mover may include only the moving stage 420 or only the grating scale reading head.
The technical process of blowing gas to the moving part by the gas bath device so that the moving part is always covered by the gas is as follows:
first, the gas supply unit supplies gas.
Specifically, first, the gas generating device 210 generates gas, and then the gas flows into the gas filtering and purifying device 220 through the pipeline 240, is processed by the gas filtering and purifying device 220, then flows into the temperature control device through the pipeline 240, and enters the gas conditioning unit 300 through the pipeline 240 after the temperature is controlled by the temperature control device. Preferably, the gas whose temperature is controlled by the temperature control device is filtered again by a filter and then introduced into the gas conditioning unit 300 through the pipe 240.
Next, the gas adjusting unit 300 adjusts the direction in which the gas adjusting unit 300 blows gas in real time under the control of the control unit so that the direction in which the gas adjusting unit 300 blows gas changes in real time as the position of the moving stage 420 changes, while the gas adjusting unit 300 blows gas.
Specifically, the complete machine controller sends a moving part working instruction to the moving part controller, and sends a gas bath working instruction to the gas bath adjusting mechanism controller. The motion piece controller receives the motion piece working instruction, converts the motion piece working instruction into a trajectory planning parameter, and controls the motion platform 420 to move according to the trajectory planning parameter. The gas bath adjusting mechanism controller receives the gas bath working instruction, converts the gas bath working instruction into an initial parameter set value, and controls the gas adjusting unit 300 to act according to the initial parameter set value. The synchronous control system sends synchronous control time sequence information to the moving part controller and the gas bath adjusting mechanism controller through synchronous time sequence flow so as to control the moving part controller and the gas bath adjusting mechanism controller to synchronously act.
For example, referring to fig. 9, fig. 9 is a schematic structural diagram of the moving stage 420 between two rows of gas conditioning units 300 according to the first embodiment of the present invention, when the moving stage 420 is between two rows of gas conditioning units 300, at this time, the distance between the moving stage 420 and the gas conditioning units 300 on both sides is the same, the angle between the gas blowing direction of the gas conditioning units 300 on both sides and the XOY plane needs to be the same, and at this time, the control unit controls the gas blowing direction of the gas conditioning units 300 and the angle between the XOY plane need to be the same, so that the gas blown out from the gas conditioning units 300 can cover the moving stage 420 at the current position.
Referring to fig. 10, fig. 10 is a schematic structural diagram of the moving stage 420 biased to the X positive direction side between two rows of gas adjusting units 300 according to the first embodiment of the present invention, and the control unit controls the gas adjusting units 300 biased to the X positive direction side to blow gas at an angle with the XOY plane that is greater than the gas adjusting units 300 biased to the X negative direction side to blow gas at an angle with the XOY plane.
Referring to fig. 11, fig. 11 is a schematic structural diagram of the moving stage 420 biased to the X negative direction side between two rows of gas adjusting units 300 according to the first embodiment of the present invention, and the control unit controls an included angle between a gas blowing direction of the gas adjusting unit 300 biased to the X negative direction side and an XOY plane to be smaller than an included angle between a gas blowing direction of the gas adjusting unit 300 biased to the X positive direction side and the XOY plane.
Since the planar grating 430 is disposed on the lower surface of the main substrate 450 in a large area, the two rows of gas conditioning units 300 arranged along the Y direction allow the gas blown by the gas conditioning units 300 to cover the planar grating 430 on the whole in the Y direction, while the gas blown by the gas conditioning units 300 in the X direction may not cover a position near the middle of the two rows of gas conditioning units 300, and the moving stage 420 is located at a position mostly in the middle of the two rows of gas conditioning units 300. The wind speed at the position of the grating scale reading head when the moving stage 420 in this embodiment is at a certain position can be calculated through simulation to determine whether the gas blown by the gas conditioning unit 300 completely covers the grating scale reading head and the moving stage 420 at the corresponding positions.
The wind speed at the exhaust port of the gas conditioning unit 300 is set to 3m/s, and the wind speeds of the grating ruler reading head at different positions are as follows:
| read head position | First position | Second position | Third position | The fourth position |
| Flow velocity (m/s) | 0.3488 | 0.4680 | 2.7259 | 2.7080 |
As shown in fig. 12, fig. 12 is a schematic diagram of wind speeds at different positions of the moving stage 420 according to an embodiment of the present invention, and airflow passes through the first position 610, the second position 620, the third position 630, and the fourth position 640, so that the moving stage 420 and the grating scale reading head can be covered by the airflow when the moving stage 420 is located at the corresponding position.
Example two
The present embodiment provides a gas bath apparatus. The gas bath apparatus in this embodiment is different from the gas bath apparatus in the first embodiment in that the gas regulating unit of the gas bath apparatus is different.
Specifically, in this embodiment, the gas conditioning unit has only the first gas bath. The first gas bath is communicated with the gas generating device through the pipeline. The first air bath is used for blowing gas, and the direction of the gas blown by the first air bath is adjustable. The first gas bath may change the gas flowing through the first gas bath to a high velocity gas as the gas flows through the first gas bath.
In this embodiment, the first gas bath has the same structure and similar function as the first gas bath in the first embodiment, and is not described herein again.
EXAMPLE III
The present embodiment provides a gas bath apparatus. The gas bath apparatus in this example differs from the gas bath apparatus in the second example in that the first gas bath is different.
Specifically, in this embodiment, the first air bath includes a first air bath body, a first adjustment mechanism, and a first end plate. The first air bath body is provided with a hollow cavity, and the cavity of the first air bath body is communicated with the pipeline. The first adjusting mechanism is used for driving the first air bath body to rotate. The first air bath body is fixedly connected with the first end plate. The first end plate is provided with at least one through hole, and gas can circulate in the through hole. The cavity of the first air bath body is communicated with the pipeline, the air inlet of the first air bath is formed in the position of the cavity of the first air bath body, and the first end plate is an air outlet of the first air bath.
Because the first adjusting mechanism can be used for driving the first air bath body to rotate, the first end plate fixedly connected with the first air bath body can be indirectly driven to rotate, so that the position of the first end plate can be adjusted, and the gas blowing direction of the first air bath can be adjusted. That is, in the present embodiment, the first adjustment mechanism in the first gas bath drives the first gas bath body to rotate, and since the first gas bath body and the first end plate are fixedly connected, there is no need to provide a first connecting member to connect the first gas bath body and the first end plate.
Example four
The present embodiment provides a gas bath apparatus. The gas bath apparatus in this embodiment is different from the gas bath apparatus in the first embodiment in that the gas regulating unit of the gas bath apparatus is different.
In this embodiment, the gas conditioning unit includes a first gas bath and a second gas bath. The first gas bath and the second gas bath are communicated with the gas supply unit through pipelines, and the first gas bath and the second gas bath are respectively used for blowing gas. Wherein the direction in which the first gas bath blows gas is adjustable.
Specifically, the first gas bath and the second gas bath are arranged side by side, the gas inlets of the first gas bath and the second gas bath are communicated with the pipeline, and gas passing through the temperature control device can enter the cavities of the first gas bath and the second gas bath from the gas inlets of the first gas bath and the second gas bath and is blown out from the gas outlets of the first gas bath and the second gas bath. The first gas bath and the second gas bath can adjust the speed of the gas, so that the gas blown by the first gas bath is high-speed gas, and the gas blown by the second gas bath is low-speed gas.
The first air bath comprises a first air bath body, a first adjusting mechanism, a first end plate and a first connecting piece.
The first air bath body is provided with a hollow cavity, and the cavity of the first air bath body is communicated with the pipeline. The first adjusting mechanism is arranged in a cavity of the first air bath body and connected with the first end plate, and the first adjusting mechanism is used for driving the first end plate to rotate. The first connecting piece is used for flexibly connecting the first air bath body and the first end plate. The first end plate is provided with at least one through hole, and gas can circulate in the through hole. The cavity of the first air bath body is communicated with the pipeline, the air inlet of the first air bath is formed in the position of the cavity of the first air bath body, and the first end plate is an air outlet of the first air bath.
The second gas bath includes a second gas bath body and a second end plate. The second air bath body is provided with a hollow cavity, and the cavity of the second air bath body is communicated with the pipeline. The second end plate is provided with at least one through hole, and gas can flow through the through hole. The second end plate is fixedly arranged on the second air bath body. The cavity of the second gas bath body and the pipeline communication position are the gas inlet of the second gas bath, and the second end plate is the gas outlet of the second gas bath. The shape and the size of the inner cavity of the second gas bath body are sequentially changed from the gas inlet end of the second gas bath to the end, connected with the second end plate, of the second gas bath body, so that the gas entering the inner cavity of the second gas bath body is blown out at a preset wind speed, for example, at a lower speed, under the action of the inner cavity.
In other embodiments, the gas conditioning unit includes only the first and third gas baths. The first gas bath and the third gas bath are communicated with the gas supply unit through pipelines, and the first gas bath and the third gas bath are respectively used for blowing gas. Wherein the direction in which the first gas bath blows gas is adjustable. The connection relationship between the third gas bath and the first gas bath, and the structure and function of the third gas bath are the same as those of the second gas bath in this embodiment, and are not described herein again.
EXAMPLE five
The present embodiment provides a gas bath apparatus. The gas bath apparatus in this embodiment is different from the gas bath apparatus in the fourth embodiment in that the second gas bath of the gas bath apparatus is different, and the direction in which the gas is blown by the second gas bath is also adjustable.
In this embodiment, the second gas bath includes a second gas bath body, a second adjustment mechanism, a second end plate, and a second connector.
The second air bath body is provided with two hollow cavities, and the cavities of the second air bath body are communicated with the pipeline. The second adjusting mechanism is arranged in a cavity of the second gas bath body and connected with the second end plate, and the second adjusting mechanism is used for driving the second end plate to rotate. The second connecting piece is used for flexibly connecting the second gas bath body and the second end plate. The second end plate is provided with at least one through hole, and gas can circulate in the through hole. The cavity of the second gas bath body and the pipeline communication position are the gas inlet of the second gas bath, and the second end plate is the gas outlet of the second gas bath.
The control unit controls the first gas bath and the second gas bath in the gas adjusting unit to adjust the direction of the blown gas in real time so that the direction of the blown gas changes in real time with the change of the position of the moving part.
EXAMPLE six
The present embodiment provides a gas bath apparatus. The gas bath apparatus in this embodiment is different from the gas bath apparatus in the first embodiment in that the gas regulating unit of the gas bath apparatus is different.
In this embodiment, the gas conditioning unit includes a first gas bath and a second gas bath, and an adjustment mechanism. The first gas bath and the second gas bath are communicated with the gas supply unit through pipelines, and the first gas bath and the second gas bath are respectively used for blowing gas. Wherein the direction in which the first and second gas baths blow gas is adjustable simultaneously. The first air bath and the second air bath are connected, and the adjusting mechanism is used for driving the first air bath and the second air bath to rotate. The control unit controls the adjusting mechanism in the gas adjusting unit to adjust the directions of the first gas bath and the second gas bath for blowing gas simultaneously in real time, so that the direction of the blown gas changes in real time along with the change of the position of the moving piece.
Specifically, the first gas bath and the second gas bath are arranged side by side, the gas inlets of the first gas bath and the second gas bath are communicated with the pipeline, and gas passing through the temperature control device can enter the cavities of the first gas bath and the second gas bath from the gas inlets of the first gas bath and the second gas bath and is blown out from the gas outlets of the first gas bath and the second gas bath. The first gas bath and the second gas bath can adjust the speed of the gas, so that the gas blown by the first gas bath is high-speed gas, and the gas blown by the second gas bath is low-speed gas.
The first air bath includes a first air bath body and a first end plate. The first air bath body is provided with a hollow cavity, and the cavity of the first air bath body is communicated with the pipeline. The first air bath body is fixedly connected with the first end plate. The first end plate is provided with at least one through hole, and gas can circulate in the through hole. The cavity of the first air bath body is communicated with the pipeline, the air inlet of the first air bath is formed in the position of the cavity of the first air bath body, and the first end plate is an air outlet of the first air bath.
The second gas bath includes a second gas bath body and a second end plate. The second air bath body is provided with a hollow cavity, and the cavity of the second air bath body is communicated with the pipeline. The second air bath body is fixedly connected with the second end plate. The second end plate is provided with at least one through hole, and gas can circulate in the through hole. The cavity of the second gas bath body and the pipeline communication position are the gas inlet of the second gas bath, and the second end plate is the gas outlet of the second gas bath.
Since the adjusting mechanism can be used for driving the first gas bath and the second gas bath to rotate simultaneously, the first end plate and the second end plate fixedly connected with the first gas bath body and the second gas bath body can be indirectly driven to rotate, so that the positions of the first end plate and the second end plate can be adjusted, and the gas blowing directions of the first gas bath and the second gas bath can be adjusted.
EXAMPLE seven
The present embodiment provides a gas bath apparatus. The gas bath apparatus in this example differs from the gas bath apparatus in the first example in that the second gas bath of the gas bath apparatus is different.
In this embodiment, the structure and function of the second gas bath are similar to those of the first gas bath, i.e., the second adjusting mechanism in the second gas bath can adjust the rotation of the second end plate, so as to change the direction of the gas blown by the second gas bath.
In other embodiments, the third gas bath has a structure and a function similar to those of the first gas bath, i.e., the third end plate can be adjusted to rotate by a third adjusting mechanism in the third gas bath, so as to change the direction of the gas blown by the third gas bath. It is also possible that either of the second and third gas baths is similar in structure and function to the first gas bath.
Example eight
The present embodiment provides a gas bath apparatus. The gas bath apparatus in this embodiment is different from the gas bath apparatus in the first embodiment in that the gas conditioning unit is different in structure.
The gas conditioning unit includes a first gas bath, a second gas bath, a third gas bath, and an adjustment mechanism. The first gas bath, the second gas bath and the third gas bath are communicated with the gas supply unit through the pipelines. The first gas bath, the second gas bath and the third gas bath are respectively used for blowing gas. The adjusting mechanism is used for driving the first gas bath, the second gas bath and the third gas bath to rotate simultaneously under the control of the control unit so as to adjust the blowing directions of the first gas bath, the second gas bath and the third gas bath.
Example nine
The present embodiment provides a lithographic apparatus comprising any one of the gas bath devices of the above embodiments.
The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.
Claims (10)
1. A gas bath device for blowing a gas to a moving object, comprising a gas supply unit for supplying the gas, at least one gas adjusting unit for blowing the gas, and a control unit for controlling the gas adjusting unit to adjust the direction in which the gas adjusting unit blows the gas in real time so that the direction in which the gas adjusting unit blows the gas changes in real time as the position of the moving object changes.
2. The gas bath apparatus according to claim 1, wherein the gas regulating unit comprises at least one gas bath for blowing the gas, wherein a direction in which the at least one gas bath blows the gas is adjustable.
3. The gas bath device according to claim 2, wherein the gas bath with the direction of blowing gas adjustable comprises a gas bath body having a hollow cavity connected to the gas supply unit, an adjustment mechanism provided in the cavity of the gas bath body, the adjustment mechanism being connected to the end plate, an end plate for driving the end plate to rotate, and a connector for flexibly connecting the gas bath body and the end plate, the end plate being provided with at least one through hole through which the gas can flow.
4. The gas bath apparatus according to claim 3, wherein the connector is adapted to sealingly connect the gas bath body and the end plate.
5. The gas bath apparatus according to claim 3, wherein said gas bath apparatus in which the direction of the blown gas is adjustable further comprises a locking means for locking said adjustment mechanism.
6. The gas bath apparatus according to claim 2, wherein the gas regulating unit includes a first gas bath, a second gas bath, and a third gas bath, each of the first gas bath, the second gas bath, and the third gas bath communicating with the gas supply unit, each of the first gas bath, the second gas bath, and the third gas bath for blowing gas, a wind speed of the gas blown from the first gas bath being greater than a wind speed of the gas blown from the second gas bath and the third gas bath, wherein a direction in which the first gas bath blows the gas is adjustable.
7. The gas bath device according to claim 1, wherein the control unit includes a mover controller for controlling the movement of the mover, a gas bath adjustment mechanism controller for controlling the gas adjusting unit to adjust the direction in which the gas adjusting unit blows gas in real time, and a synchronization controller for controlling the mover controller and the gas bath adjustment mechanism controller to be synchronized so that the direction in which the gas adjusting unit blows gas changes in real time as the position of the mover changes.
8. The gas bath apparatus according to claim 7, wherein the control unit further comprises a complete machine controller for sending a moving member operating command to the moving member controller and sending a gas bath operating command to the gas bath adjustment mechanism controller; the moving part controller receives the moving part working instruction, converts the moving part working instruction into a track planning parameter and controls the moving part to move according to the track planning parameter; the gas bath adjusting mechanism controller receives the gas bath working instruction, converts the gas bath working instruction into an initial parameter set value, and controls the gas adjusting unit to act through the initial parameter set value; and the synchronous control system sends synchronous control time sequence information to the moving part controller and the gas bath adjusting mechanism controller through synchronous time sequence flow so as to control the moving part controller and the gas bath adjusting mechanism controller to synchronously act.
9. The gas bath apparatus according to claim 1, wherein the gas supply unit includes a gas generating device connected to all of the gas conditioning units through the pipes, a gas filtering and purifying device disposed on the pipes between the gas generating device and the gas conditioning units, a gas temperature control device disposed on the pipes between the gas filtering and purifying device and the gas conditioning units, the gas generating device being configured to generate the gas, the gas filtering and purifying device being configured to purify the gas, and a pipe for controlling a temperature of the gas.
10. A lithographic apparatus comprising a gas bath device according to any one of claims 1 to 9.
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| CN201910310384.XA CN111830790A (en) | 2019-04-17 | 2019-04-17 | Gas bath device and photoetching machine |
| TW109112968A TWI751532B (en) | 2019-04-17 | 2020-04-17 | Gas bath device and lithography machine |
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Cited By (2)
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| CN112305866A (en) * | 2019-07-31 | 2021-02-02 | 上海微电子装备（集团）股份有限公司 | Gas bath device and lithographic apparatus |
| CN114669553A (en) * | 2022-03-18 | 2022-06-28 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Gas bath device and method for designing gas bath device |
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| TWI751532B (en) | 2022-01-01 |
| TW202044461A (en) | 2020-12-01 |
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Application publication date: 20201027 |
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| RJ01 | Rejection of invention patent application after publication |