CN108034946A - Spray etching system - Google Patents
Spray etching system Download PDFInfo
- Publication number
- CN108034946A CN108034946A CN201711153828.0A CN201711153828A CN108034946A CN 108034946 A CN108034946 A CN 108034946A CN 201711153828 A CN201711153828 A CN 201711153828A CN 108034946 A CN108034946 A CN 108034946A
- Authority
- CN
- China
- Prior art keywords
- etching
- substrate
- spray
- injection apparatus
- liquid injection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Weting (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
A kind of spray etching system, system include the equipment such as motor, etching case, etching liquid injection apparatus, oscillating guidebar mechanism, pressure gauge, flowmeter, plastic pump, etching solution collecting box, ORP redox meters, the temperature control system that is made of heating rod and cooling pipe.Etching solution is flowed into etching case under the driving of plastic pump by etching collecting box, it is ejected on etching substrate with certain pressure from the injection apparatus nozzle of polygon, to etch the exposed matrix between photoresist, period motor band kinetoplast makees plane motion, pendulum guide rod band kinetoplast rotates, temperature control system controls the temperature of etching solution, and ORP redox meters monitor the chemical reaction ability of etching solution.The present invention can control spray etching system to realize efficient controllability etching under different pressure, flow, temperature, spray equipment and matrix spacing, be conducive to study influence of each factor to pattern after etching quality and etching；Etch substrate and spray equipment to be distributed into polygon, be conducive to make full use of etching case space, improve etching efficiency to realize that polylith matrix etches at the same time；Substrate is etched under the drive of motor and oscillating guidebar mechanism, helps to realize the uniformity etched.
Description
Technical field：
It is more particularly to a kind of to can be used for preparing printed circuit sheet heat exchanger the invention belongs to mechanical micrometer-nanometer processing technology field
Spray etching system.
Background technology：
Micrometer-nanometer processing technology is the appearance with micro mechanical technology and a kind of new modernization manufacturing technology for producing.It
The mechanical processing in the range of miniature scale and assembling are realized, wherein photochemical etching technique is with its easy to operate, machining accuracy
It is high, cost is low, etching process without mechanical stress there are the advantages that be widely used in printing plate circuit, metal surface decorative pattern and fine
Processing and other fields.
It is the control ability to etching quality and surface topography to weigh one of whether successful main standard of etch process, and
The factor of influence etching quality and surface topography is numerous, how to control the influence of each factor efficiently to can control etching to become to realize
Difficult point.
The content of the invention：
It is an object of the invention to provide a kind of spray etching system, spraying device for etching is polygonized structure, etches base
Plate is in polygonal array, can increase etching of substrates while the plate number of etching；By using motor, pendulum guide rod, improve injection
The methods of device, increases the bearing capacity of spray system and improves uniformity of etching etc., can improve the matter of substrate etch
Amount；Substrate can be more accurately controlled in the work in a big way such as different pressures, flow, temperature, spray equipment and matrix spacing
Spray etching is carried out under condition, to analyze influence of each factor to etching speed, etch uniformity, lateral erosion and roughness in spray
Situation, finds the optimal etching condition of spray etching, so as to fulfill the efficient controllable processing of substrate topography.
To reach above-mentioned purpose, the present invention adopts the following technical scheme that：
A kind of spray etching system includes motor, etching case, etching liquid injection apparatus, oscillating guidebar mechanism, pressure gauge, stream
Gauge, plastic pump, etching solution collecting box, ORP redox meters, temperature control system for being made of heating rod and cooling pipe etc. are set
It is standby, it is characterised in that：Etching liquid injection apparatus is arranged in etching case and is in regular polygon with what is be made of multiple planes
The shape of cylinder, the both sides of etching liquid injection apparatus are respectively arranged with a clamping plate, have on clamping plate in regular polygon distribution
Substrate fixes hole array, and the substrate that etching substrate is fixed on clamping plate is fixed on the substrate mounting hole of hole array；Etching solution is from etching
Vertically spray arrives the erosion in polygon space distribution driven by motor and oscillating guidebar mechanism to multiple planes of liquid jetting device
Carve on substrate.
The etching substrate is in etching case in polygon and nozzle vertical distribution.
The substrate fixes hole array to be multiple, and the distance difference at each substrate fixation hole array to clamping plate center causes
The spacing of etching substrate and etching liquid injection apparatus adjusts.
Multiple nozzles are disposed with each plane of the etching liquid injection apparatus, nozzle is taper or sector.
The spray etching system is controlled by motor is horizontal, by motor contact connecting cleat and default running orbit with
Drive etching substrate translation.
The spray etching system is controlled by oscillating guidebar mechanism and rotated, and oscillating guidebar mechanism drives the rotation of circle distribution
Guide rod control clamping plate rotation makes etching substrate be circled around etching liquid injection apparatus.
The temperature control system is made of heating rod, cooling pipe and temperature controller, heating rod and cooling pipe control etching solution
Heating and cooling, to control etching solution temperature stabilization within a certain range.
The ORP redox meters are arranged in etching solution collecting box, can monitor the redox ability of etching solution in real time.
The etching case connection etching solution collecting box, etching solution collecting box connects and is disposed with close net at plastic pump, with filtering
Residue after etching solution impurity and etching, can prevent spray equipment blocking.
Relative to the prior art, the invention has the advantages that：
A kind of spray etching system of the present invention, the system are vertically sprayed to each side using Polygonal spray injection device from all directions
To adjustable berth away from etching substrate, etch quantity while increasing matrix, is advantageously implemented a large amount of productions of matrix.By using
Etching solution enters polygon injection body and the injection apparatus sprayed from multiple nozzles by two direction of left and right, improves injection apparatus
Bearing capacity and be conducive to etching solution and uniformly spray.Etching case both sides have the mounting hole array different apart from clamping plate center to block
Substrate is etched, it is adjustable to etch substrate from the distance between nozzle to provide different spray area and impulse force.Controlled using motor
Etching substrate movement velocity planar, pendulum guide rod control etching of substrates are circled around spray equipment, to overcome weight
The influence of power, same direction spray pressure inequality, to increase the uniformity of etching.Counted using ORP, temperature control system, pressure gauge, stream
The equipment such as gauge, can more be accurately controlled substrate and be sprayed at different pressures, flow, temperature etc. in a big way operating mode
Etching, the influence for helping to solve how to control each factor largely efficiently can control the difficult points of etching to realize.
Brief description of the drawings
Fig. 1 is the spray etching system construction drawing of the present invention.
Fig. 2 is the etching case spray equipment schematic diagram of the present invention.
Fig. 3 is both sides cleat plate EDS maps schematic diagram in etching case.
Numbering in attached drawing：
1 is motor, and 2 be etching case, and 3 be etching substrate, and 4 be etching liquid injection apparatus, and 5 be oscillating guidebar mechanism, and 6 be folder
Plate, 7 be pressure gauge, and 8 be flowmeter, and 9 be slide bar, and 10 be plastic pump, and 11 be plastic valve, and 12 be etching solution collecting box, and 13 be ORP
Meter, 14 be temperature controller, and 15 be heating rod, and 16 be cooling pipe, and 17 be filter screen, and 18 be some rotating guide-bars of circle distribution,
19 motor contacts, 20 be spray equipment etching solution inlet port, and 21 be injection body, and 22 be nozzle, and 23 fix for etching of substrates
Hole.
Embodiment
Below in conjunction with attached drawing, the present invention is described in further detail.
Fig. 1 is the spray etching system construction drawing of the present invention.
As shown in Figure 1, a kind of spray etching system, including motor 1, etching case 2, etching liquid injection apparatus 4, pendulum guide rod
Mechanism 5, pressure gauge 7, flowmeter 8, plastic pump 10, etching solution collecting box 12, ORP count 13, by heating rod 15 and cooling pipe 16
The equipment such as the temperature control system of composition.It is characterized in that：Etching liquid injection apparatus 4 is arranged in etching case 2 and with by multiple
The shape in regular polygon cylinder of plane composition, the both sides of etching liquid injection apparatus 4 are respectively arranged with a clamping plate 6, clamping plate 6
The substrate of the upper distribution with regular polygon fixes hole array, and the substrate that etching substrate 3 is fixed on clamping plate 6 fixes hole array
On substrate mounting hole 23；Etching solution is vertically sprayed to by motor 1 and pendulum guide rod machine from multiple planes of etching liquid injection apparatus 4
On the etching substrate 3 in polygon space distribution that structure 5 drives.
The controllable etching substrate 3 of the motor 1 in left side and the slide bar 9 on right side horizontal direction all around movement velocity with
Help the uniformity of etching.
Oscillating guidebar mechanism 5 can drive etching case 2 middle clamp plate 6 control etching substrate 3 to make circumference fortune around spray etching device 4
It is dynamic, to increase etch substrate while etch quantity suitable to help all directions etching 3 etching condition of substrate, and it is equal to improve etching
Even property.
Temperature control system is made of the thermocouple in etching solution collecting box 12, heating rod, cooling pipe and temperature controller, heating rod
15 and cooling pipe 16 control etching solution heating and cooling, to control etching solution temperature stabilization within a certain range.
ORP meters 13 in etching solution collecting box 12 can monitor the redox ability of etching solution in real time with time to etching solution
Middle addition reagent.
Pressure gauge 7, flowmeter 8 in etch system adjust and control etching operating mode can all lose in favor of studying each factor
Carve the influence of quality.
Etching case 2 connects etching solution collecting box 12, etching solution collecting box 12 connects and is disposed with close net at plastic pump 10, with mistake
Filter etching solution is in itself and the residue after etching is to prevent spray equipment blocking.
Fig. 2 is the etching case spray equipment schematic diagram of the present invention.
As shown in Fig. 2, etching liquid injection apparatus 4 is using polygon injection body 21 and arranges multiple nozzles 22, etching solution
Enter 21 by gengon the right and left 20, to improve the bearing capacity of injection apparatus, be conducive to etching solution and uniformly spray, nozzle root
Taper or fan nozzle are selected according to etch profile.
By all directions nozzle 22, vertically spray etches substrate 3, the substrate number for adding while etching to etching solution to all directions.
Etching substrate 3 is fixed by the clamping plate 6 of both sides, and guide rod of rolling to each side drives the rotation of some circle distributions on clamping plate 6
The control etching substrate 3 of guide rod 18 is circled around spray etching device 4, and under the action of gravity is considered, raising etches at the same time
Matrix uniformity.
Fig. 3 is both sides cleat plate EDS maps schematic diagram in etching case.
As shown in figure 3, the rotating guide-bars 18 of some circle distributions is dispersed with polygon clamping plate 6 turn etching of substrates
It is dynamic.Etching of substrates is inserted into the different etching of substrates mounting hole 23 in 6 center of clamping plate, adjust etching substrate with
The spacing of nozzle is to change the intensity of etching and area.Pendulum guide rod 5 drives the rotating guide-bar 18 of some circle distributions to control erosion
Carve substrate to rotate, motor contact 19 connects polygon clamping plate 6 and drives etching substrate to be translatable, and with increase etching area, increases
The uniformity etched by force.
In short, spray etching system proposed by the present invention adds the area of etching, improves the matter of substrate etch
Amount and efficiency, and increase etch uniformity, be conducive to etch on a large scale.System is by adding by groups such as heating rod and cooling pipes
Into temperature-controlling system, pressure gauge, the equipment such as flowmeter, realize substrate between different pressures, flow, temperature and spray equipment
Controllability spray etching is carried out under operating mode in a big way away from waiting, is conducive to the etch profile of control base board to find spray etching most
Excellent etching condition, to realize the efficient controllable processing of substrate topography.
It is to be understood that the embodiment is only illustrative of the invention and is not intended to limit the scope of the invention.In addition, it should also manage
Solution, after reading the content taught by the present invention, those skilled in the art can make the present invention various changes or repair
Change, however, these equivalent forms also fall within the scope of the appended claims of the present application.
Claims (9)
1. a kind of spray etching system includes motor (1), etching case (2), etching liquid injection apparatus (4), oscillating guidebar mechanism
(5), pressure gauge (7), flowmeter (8), plastic pump (10), etching solution collecting box (12), ORP redox meters (13), by heating
The equipment such as the temperature control system of rod (15) and cooling pipe (16) composition, it is characterised in that：Etching liquid injection apparatus (4) is arranged on erosion
Carve in case (2) and with the shape in regular polygon cylinder being made of multiple planes, the both sides of etching liquid injection apparatus (4)
A clamping plate (6) is respectively arranged with, has on clamping plate (6) and fixes hole array, etching substrate (3) in the substrate of regular polygon distribution
The substrate for being fixed on clamping plate (6) is fixed on the substrate mounting hole (23) of hole array；Etching solution is more from etching liquid injection apparatus (4)
Vertically spray arrives the etching substrate (3) in polygon space distribution driven by motor (1) and oscillating guidebar mechanism (5) to a plane
On.
2. spray etching system according to claim 1, it is characterised in that：The etching substrate (3) is in etching case (2)
Interior is in polygon and nozzle (22) vertical distribution.
3. spray etching system according to claim 1, it is characterised in that：The substrate fixes hole array to be multiple, and
And each substrate fixes hole array to the distance difference at clamping plate (6) center so that etching substrate (3) and etching liquid injection apparatus (4)
Spacing adjusts.
4. spray etching system according to claim 1, it is characterised in that：The etching liquid injection apparatus (4) it is each
Multiple nozzles (22) are disposed with plane, nozzle (22) is taper or sector.
5. spray etching system according to claim 1, it is characterised in that：The spray etching system (4) is by motor (1)
Level control, substrate (3) translation is etched by motor contact (19) connecting cleat (6) and default running orbit to drive.
6. spray etching system according to claim 1, it is characterised in that：The spray etching system (4) is by swing guide
Linkage (5) control rotates, and oscillating guidebar mechanism (5) drives rotating guide-bar (18) control clamping plate (6) rotation of circle distribution to make
Etching substrate (3) is circled around etching liquid injection apparatus (4).
7. spray etching system according to claim 1, it is characterised in that：The temperature control system is by heating rod (15), cold
But pipeline (16) and temperature controller (14) composition, the heating and cooling of heating rod (15) and cooling pipe (16) control etching solution, with
Control etching solution temperature stabilization within a certain range.
8. spray etching system according to claim 1, it is characterised in that：The ORP redox meters (13) are arranged on
In etching solution collecting box (12), the redox ability of etching solution can be monitored in real time.
9. spray etching system according to claim 1, it is characterised in that：Etching case (2) the connection etching solution is collected
Case (12), etching solution collecting box (12) connection plastic pump (10) place is disposed with close net, after filtered etch liquid impurity and etching
Residue, can prevent spray equipment blocking.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711153828.0A CN108034946B (en) | 2017-11-20 | 2017-11-20 | Spray etching system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711153828.0A CN108034946B (en) | 2017-11-20 | 2017-11-20 | Spray etching system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108034946A true CN108034946A (en) | 2018-05-15 |
| CN108034946B CN108034946B (en) | 2019-04-02 |
Family
ID=62092824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711153828.0A Active CN108034946B (en) | 2017-11-20 | 2017-11-20 | Spray etching system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108034946B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111901979A (en) * | 2020-08-13 | 2020-11-06 | 西安交通大学 | Multi-parameter automatic regulation and control efficient rotary spraying etching system |
| CN111970838A (en) * | 2020-08-24 | 2020-11-20 | 丰泽区泉育软件设计中心 | Etching machine for producing circuit board |
| CN112477388A (en) * | 2020-11-13 | 2021-03-12 | 上海新倬壮印刷科技有限公司 | Inclined-net non-net-knot screen printing plate and manufacturing method thereof |
| CN112730146A (en) * | 2021-03-30 | 2021-04-30 | 武汉大学 | Etching rate testing device and method for etching solution |
| CN112750738A (en) * | 2021-01-18 | 2021-05-04 | 中国电子科技集团公司第四十八研究所 | Ion beam etching equipment and etching method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101476125A (en) * | 2008-11-12 | 2009-07-08 | 长沙精达印刷制版有限公司 | Method for etching gravure printing roller by spraying copper chloride |
| CN104641456A (en) * | 2012-09-21 | 2015-05-20 | 应用材料公司 | Radical chemistry modulation and control using multiple flow pathways |
| CN205741219U (en) * | 2016-06-14 | 2016-11-30 | 深圳市百诣良科技发展有限公司 | A kind of two-way scouring type spraying device for etching |
| CN206521524U (en) * | 2017-01-19 | 2017-09-26 | 东莞美维电路有限公司 | PCB spraying device for etching |
-
2017
- 2017-11-20 CN CN201711153828.0A patent/CN108034946B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101476125A (en) * | 2008-11-12 | 2009-07-08 | 长沙精达印刷制版有限公司 | Method for etching gravure printing roller by spraying copper chloride |
| CN104641456A (en) * | 2012-09-21 | 2015-05-20 | 应用材料公司 | Radical chemistry modulation and control using multiple flow pathways |
| CN205741219U (en) * | 2016-06-14 | 2016-11-30 | 深圳市百诣良科技发展有限公司 | A kind of two-way scouring type spraying device for etching |
| CN206521524U (en) * | 2017-01-19 | 2017-09-26 | 东莞美维电路有限公司 | PCB spraying device for etching |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111901979A (en) * | 2020-08-13 | 2020-11-06 | 西安交通大学 | Multi-parameter automatic regulation and control efficient rotary spraying etching system |
| CN111970838A (en) * | 2020-08-24 | 2020-11-20 | 丰泽区泉育软件设计中心 | Etching machine for producing circuit board |
| CN111970838B (en) * | 2020-08-24 | 2021-09-21 | 泉州市创智工业设计服务有限公司 | Etching machine for producing circuit board |
| CN112477388A (en) * | 2020-11-13 | 2021-03-12 | 上海新倬壮印刷科技有限公司 | Inclined-net non-net-knot screen printing plate and manufacturing method thereof |
| CN112750738A (en) * | 2021-01-18 | 2021-05-04 | 中国电子科技集团公司第四十八研究所 | Ion beam etching equipment and etching method thereof |
| CN112750738B (en) * | 2021-01-18 | 2024-02-23 | 中国电子科技集团公司第四十八研究所 | Ion beam etching equipment and etching method thereof |
| CN112730146A (en) * | 2021-03-30 | 2021-04-30 | 武汉大学 | Etching rate testing device and method for etching solution |
| CN112730146B (en) * | 2021-03-30 | 2021-08-17 | 武汉大学 | Etching rate testing device and method for etching solution |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108034946B (en) | 2019-04-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108034946B (en) | Spray etching system | |
| CN108441417A (en) | Bacterial clump picking instrument | |
| CN206132494U (en) | Full -automatic appearance of clearing up of two module | |
| CN103551336A (en) | Cleaning device and cleaning method | |
| CN109406566B (en) | Nano fluid impact jet flow heat exchange characteristic and erosion wear performance experimental device | |
| CN1959938B (en) | Wet process device for etching wafer, and wet process etching method | |
| CN204018147U (en) | A kind of elevating mechanism and plater | |
| CN108375522B (en) | Electromagnetic device for rapidly adjusting sample orientation during particle impact abrasion experiment | |
| CN109323845B (en) | Fog drop generating device based on high-speed imaging technology | |
| CN203349794U (en) | Honing machine pneumatic measurement test bench | |
| CN102590480A (en) | Spray water curtain-type cooling device of geotechnical centrifuge test cabin | |
| US20120273462A1 (en) | Etching device and a method for etching a material of a workpiece | |
| CN206242674U (en) | PLATE SCREAM PRINTING and the united printing device of digit printing | |
| CN104674221B (en) | A kind of etching machine | |
| CN211086168U (en) | Spray cooling multi-process parameter test device | |
| CN106066234A (en) | A kind of laboratory table measuring minor diameter high-pressure water jet parameter | |
| CN111830790A (en) | Gas bath device and photoetching machine | |
| CN109490177B (en) | Method for measuring bubble filtration characteristics of separation screen | |
| CN110618165A (en) | Spray cooling multi-process parameter test device | |
| CN202548120U (en) | Spray water curtain type cooling unit for geotechnical centrifuge test chamber | |
| CN207651451U (en) | A kind of silicon chip single side etching device | |
| CN208744444U (en) | A kind of valve production multi-angle polished device | |
| CN207166876U (en) | A kind of printed circuit board production cleaning device | |
| CN204509462U (en) | A kind of etching machine | |
| CN110627173A (en) | Paint slag extraction device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |