CN220400541U

CN220400541U - Air blowing device for cleaning wafer surface

Info

Publication number: CN220400541U
Application number: CN202321880130.XU
Authority: CN
Inventors: 熊金磊; 刘红星; 孙思华
Original assignee: Raintree Scientific Instruments Shanghai Corp
Current assignee: Raintree Scientific Instruments Shanghai Corp
Priority date: 2023-07-17
Filing date: 2023-07-17
Publication date: 2024-01-26
Anticipated expiration: 2033-07-17

Abstract

The utility model relates to a blowing device for cleaning the surface of a wafer, comprising: the air outlet and the air outlet plate penetrate through the first cavity and the second cavity, are fixed on the body at the opening at the other side, and an air blowing port is arranged between the air outlet plate and the top wall of the body; the diameter of the air outlet gradually increases from the position close to the position far from the air inlet pipe joint; the air pressure and the flow velocity of the air blown out by the device are uniform, and the wafer can be ensured to have uniform cleanliness.

Description

Air blowing device for cleaning wafer surface

Technical Field

The utility model relates to a wafer cleaning technology in the semiconductor industry, in particular to a blowing device for cleaning the surface of a wafer, and belongs to the technical field of semiconductor processing.

Background

In general semiconductor technology and measurement and detection equipment, before the corresponding action is carried out on a sample (wafer or panel), the surface of the sample is often required to be relatively clean and radiating, and the cleaning and temperature control processes are required to be as uniform as possible on the whole surface of the sample conventionally so as to ensure that the existing surface characteristics of the surface are not damaged. Because of the sample itself's precision and compactness of the space around the sample, it is not possible to use liquids or large cleaning, temperature control devices.

Therefore, there is a need in the art to solve the problems of uneven air flow, unstable air flow or excessive air flow range in the wafer cleaning process, damage to the surface characteristics of the sample itself or the key performance of the processing and measurement and detection machine, and the problems that the air blowing device is too large, is difficult to be configured inside the semiconductor equipment, or is easy to generate new surface pollution to the surface of the sample in the prior art.

Disclosure of Invention

The technical problems to be solved by the utility model are as follows: the blowing device is compact in structure and uniform in air flow, and can clean the surface of a wafer or a panel and realize local temperature control.

The utility model solves the technical problems by the following technical proposal:

the present utility model provides an air blowing device for cleaning a surface of a wafer, the device comprising: the air inlet and the strip-shaped air outlet are arranged on the shell, one homogenizing plate or a plurality of sequentially arranged homogenizing plates are arranged in the shell, through holes are formed in the homogenizing plates, and air enters the shell from the air inlet and passes through the through holes in all the homogenizing plates and then is discharged from the air outlet.

Preferably, the shell comprises a main body and side plates at two ends of the main body, wherein at least one side plate is of a detachable structure, and the air inlet is arranged at a rear position on one side plate; the front side of the main body is provided with an air outlet plate, and a gap between the air outlet plate and the main body forms the air outlet; the main body is also internally provided with a chute for limiting the homogenizing plate, and the homogenizing plate is movably connected with the chute.

Further preferably, the through holes on the homogenizing plate are arranged in a straight line along the direction in which the gas flows from the side plate provided with the gas inlet to the side plate on the other side.

Further preferably, the diameter of the preceding through hole in the gas flow direction is not larger than the diameter of the following through hole in the homogenizing plate.

Further preferably, the body is provided with a plurality of sliding grooves, the through holes on the homogenizing plate are divided into a plurality of groups, the diameters of the through holes in the same group are the same, and the diameters of the through holes in different groups become larger gradually along the flowing direction of the gas;

further preferably, when a homogenizing plate is arranged in the shell, the through holes on the homogenizing plate and the air outlet are not on the same horizontal plane; when a plurality of homogenizing plates are arranged in the shell, the homogenizing plates in the shell are sequentially arranged from back to front, and through holes and air outlets on different homogenizing plates are arranged at intervals in the horizontal direction according to the arrangement sequence.

Preferably, a sealing strip is arranged between the shell and the side plates at two sides;

preferably, the air outlet plate is provided with a waist hole connected with the main body and can be used for adjusting the size of the air outlet.

Preferably, a sealing strip is arranged at the contact part of the air outlet plate and the main body.

Compared with the prior art, the utility model has the following beneficial effects:

by using the air blowing device, the air flow is uniform and stable, more homogenization plates can be arranged and more stages of air homogenization treatment work can be performed, so that the cleanliness and the temperature control effect are greatly improved. Meanwhile, the device is compact and convenient to install and debug.

Drawings

FIG. 1 is a front view of an insufflation device;

FIG. 2 is a schematic diagram of the components of the blowing device;

FIG. 3 is a schematic diagram of the blower airflow;

FIG. 4 is a schematic diagram of a homogenizing plate air outlet configuration;

reference numerals: 100. an air blowing device; 101. a housing; 103. a first homogenizing plate; 102. a second homogenizing plate; 109. an air outlet plate; 107. a first sealing strip; 108. the first air outlet plate fixing piece; 106. the air outlet plate fixing piece II; 111. an air inlet; 105. a first side plate; 110. a second side plate; 104. a second sealing strip; 201. a first cavity; 202. a second cavity; 203. a third cavity; 204. an air outlet; 301. a first through hole; 304. a second through hole; 302. a third through hole; 303. and a through hole IV.

Detailed Description

In order to make the utility model more comprehensible, preferred embodiments accompanied with the accompanying drawings are described in detail as follows:

as shown in fig. 1-4, the present utility model provides an air blowing device for cleaning the surface of a wafer, comprising a housing 101, an air inlet 111 and a strip-shaped air outlet 204 arranged on the housing 101, one or more sequentially arranged homogenizing plates (102, 103) arranged in the housing, through holes arranged on the homogenizing plates, and air entering the housing 101 from the air inlet 111 and passing through the through holes (301, 302, 303, 304) on all the homogenizing plates is discharged from the air outlet 204;

the gas can be air or special gas such as nitrogen, and is determined according to specific requirements.

The shell 101 comprises a main body and side plates (105, 106) at two ends of the main body, wherein at least one side plate is of a detachable structure, and the air inlet 111 is arranged at the back position of one side plate; the front side of the main body is provided with an air outlet plate 109, and a gap between the air outlet plate 109 and the main body forms the air outlet 204; a chute for limiting the homogenizing plate is also arranged in the main body, and the homogenizing plate is movably connected with the chute;

the main body of the blowing device is divided into a plurality of chambers by each side sealing plate, the homogenizing plate and the air outlet plate, and the packaging form of each air cavity can be any form known to the expert, such as welding and assembling form of each scattered plate.

The through holes on the homogenizing plate are arranged in a straight line along the direction of the gas flowing from the side plate provided with the gas inlet 111 to the side plate at the other side; the diameter of the front through hole along the gas flowing direction is not larger than that of the rear through hole; the body is provided with a plurality of sliding grooves, the through holes on the homogenizing plate are divided into a plurality of groups, the diameters of the through holes in the same group are the same, and the diameters of the through holes in different groups gradually become larger along the flowing direction of the gas.

Through this technical scheme, make the device during operation, be close to the windage of air inlet department minimum in the first cavity, consequently the setting of first homogenization board air outlet is minimum, keeps away from the air inlet windage and is biggest, and the setting of corresponding air outlet is biggest to make the whole air current that the air current got into the second cavity more even.

The diameter arrangement mode of the through holes on the other homogenizing plates except the first homogenizing plate can be set to be larger as the homogenizing plate is far away from the air inlet or smaller as the homogenizing plate is far away from the middle position, etc. according to practical application scenes.

When a homogenizing plate is arranged in the air blowing device shell, the through holes on the homogenizing plate and the air outlet 204 are not on the same horizontal plane; when a plurality of homogenizing plates are arranged in the shell 101, the homogenizing plates in the shell are sequentially arranged from back to front, and through holes and air outlets on different homogenizing plates are arranged at intervals up and down in the horizontal direction according to the arrangement sequence; a first sealing strip 107 is arranged between the shell 101 and the side plates on two sides; the air outlet plate is provided with an air outlet plate fixing piece which is used for being connected with the main body and used for fixing the air outlet plate on the main body of the air blowing device, and if the mounting hole of the air outlet plate fixing piece is a waist hole, the size of the air outlet can be adjusted; and a second sealing strip 104 is arranged at the contact position of the air outlet plate and the main body.

Examples

The utility model provides an air blowing device for cleaning the surface of a wafer, wherein high-pressure air enters a first chamber 201 through an air inlet pipe joint 111, enters a second chamber 202 through an air outlet on a first homogenizing plate 103, enters a third chamber 203 through the second homogenizing plate 103, and finally is blown out through an air blowing port 204 formed by a body 101 and an air outlet plate 109. The air flow blown out from the air blowing port is uniform in air pressure and flow speed due to the twice pressure stabilization.

The inlet pipe joint may be provided in plurality, and the high-pressure gas is introduced into the first chamber via the plurality of inlet pipe joints.

While the utility model has been described with respect to preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the utility model as defined by the appended claims. Equivalent embodiments of the present utility model will be apparent to those skilled in the art having the benefit of the teachings disclosed herein, when considered in the light of the foregoing disclosure, and without departing from the spirit and scope of the utility model; meanwhile, any equivalent changes, modifications and evolution of the above embodiments according to the essential technology of the present utility model still fall within the scope of the technical solution of the present utility model.

Claims

1. The blowing device for cleaning the surface of the wafer is characterized by comprising a shell, wherein an air inlet and a strip-shaped air outlet are formed in the shell, one or more sequentially arranged homogenizing plates are arranged in the shell, through holes are formed in the homogenizing plates, and air enters the shell from the air inlet and passes through the through holes in all the homogenizing plates and then is discharged from the air outlet.

2. An air blowing device for cleaning a wafer surface as set forth in claim 1, wherein said housing includes a main body and side plates at both ends thereof, wherein at least one of the side plates is of a detachable structure, and said air inlet is provided at a rear position on one of the side plates; the front side of the main body is provided with an air outlet plate, and a gap between the air outlet plate and the main body forms the air outlet; the main body is also internally provided with a chute for limiting the homogenizing plate, and the homogenizing plate is movably connected with the chute.

3. A blowing apparatus for cleaning a wafer surface as set forth in claim 2, wherein the through holes in said homogenizing plate are aligned in a direction in which gas flows from the side plate provided with the gas inlet to the other side plate.

4. A gas blowing apparatus for cleaning a wafer surface as set forth in claim 3, wherein the diameter of the preceding through-hole in the direction of gas flow is not larger than the diameter of the following through-hole in the homogenizing plate.

5. A blowing apparatus for cleaning a wafer surface as defined in claim 4, wherein the through holes of said homogenizing plate are divided into a plurality of groups, the diameters of the through holes in the same group are the same, and the diameters of the through holes of different groups become larger gradually in the flow direction of the gas.

6. A blowing device for cleaning a wafer surface as defined in claim 3, wherein when a homogenizing plate is provided in said housing, the through holes of the homogenizing plate are not on the same horizontal plane as the air outlets; when a plurality of homogenizing plates are arranged in the shell, the homogenizing plates in the shell are sequentially arranged from back to front, and through holes and air outlets on different homogenizing plates are arranged at intervals in the horizontal direction according to the arrangement sequence.

7. The blowing device for cleaning a wafer surface as set forth in claim 2, wherein a sealing strip is provided between the housing and the side plates on both sides.

8. The air blowing apparatus for cleaning a wafer surface as recited in claim 2, wherein the air outlet plate is provided with a fixture mounting hole for connection with the main body.

9. The apparatus of claim 8, wherein the mounting holes are waist holes.

10. The air blowing device for cleaning the surface of a wafer as set forth in claim 2, wherein a sealing strip is provided at a contact portion of the air outlet plate with the main body.