CN207408742U - Mask cooling device and photoetching equipment - Google Patents
Mask cooling device and photoetching equipment Download PDFInfo
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- CN207408742U CN207408742U CN201721524036.5U CN201721524036U CN207408742U CN 207408742 U CN207408742 U CN 207408742U CN 201721524036 U CN201721524036 U CN 201721524036U CN 207408742 U CN207408742 U CN 207408742U
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Abstract
The utility model provides a kind of mask cooling device and photoetching equipment.The mask cooling device includes collecting unit, cooling unit and control unit, described control unit connects respectively with the collecting unit and cooling unit communication, the collecting unit is used to obtain in exposure process the temperature information on the surface with exposure area on mask and feeds back to control unit, the cooling unit is arranged on the one side of the mask and for the surface gas injection, described control unit to be used to adjust the spray regime of the cooling unit gas injection according to the temperature information.The photoetching equipment is included for the board platform for placing the mask and the mask cooling device.The utility model plays good cooling effect, so as to ensure that the stabilization of mask multiplying power in photoetching process, and then ensures the precision of photoetching by being cooled down on the key position that mask multiplying power is influenced on mask.
Description
Technical field
The utility model is related to field of semiconductor manufacture, and in particular to a kind of mask cooling device and photoetching equipment.
Background technology
In integrated circuit (Integrated Circuit, abbreviation IC) and Thin Film Transistor-LCD (ThinFilm
Transistor-Liquid Crystal Display, abbreviation TFT-LCD) etc. in the manufacture of products, litho machine is wherein most heavy
It will be one of with most accurate equipment.Recently as the reduction of lithographic feature size, also subtract therewith for the optical source wavelength of exposure
It is small, the laser light source of 248nm wavelength or even the laser light of 193nm wavelength are accordingly gradually transitions from the mercury lamp of 365nm wavelength
The laser plasma light source in source, moreover 13.5nm wavelength.
No matter which kind of light source, when illumination is mapped on mask, which part light through mask and pass through specific imaging
After system, lithographic images are formd in substrate surface, and another part light is masked metallic chromium layer reflection in version or absorbs.Mask
Version absorbs radiant light thermal expansion occurs by metallic chromium layer, and then deforms, and influences mask multiplying power.For different exposures
Radiant, with the increase of time for exposure, mask multiplying power can also increase therewith, specific as shown in Figure 1.Transverse axis is exposure in Fig. 1
Time (unit min), the longitudinal axis are mask multiplying power (unit PPM), and different curves represents different exposure light sources；Each is bent
Line represents and the situation that the mask multiplying power of mask changes with the time for exposure is corresponded to for particular exposure light source.
The change of mask multiplying power will influence lithographic accuracy, still, can not calibration mask at any time during actual volume production
Multiplying power, therefore, controling effectively to the temperature of mask, it is basic to be only.At present, the mode cooled down to mask is main
There are two types of：
The first is to carry out gas bath purging to entire mask board, and which cannot be effectively to the crucial position of mask
It puts and is cooled down, cooling effect is poor；
The second way is to utilize to clean dry air (Clean Dry Air, abbreviation CDA) to the upper surface of mask
Jet is carried out, by by being cooled down to mask upper surface in a manner of forced air-cooled, but mask is during exposure
The metallic chromium layer that most heat is masked edition lower surface absorbs, so the upper surface of mask, which is cooled down, to rise
Forced convertion to good cooling effect, while CDA can make mask generate vibration, and lithographic results is made to be deteriorated.
Utility model content
The purpose of this utility model is to provide a kind of mask cooling device and photoetching equipment, to solve existing mask
Version in exposure process cooling effect bad the problem of lithographic accuracy is caused to be lower.
To achieve the above object, the utility model provides a kind of mask cooling device, including collecting unit, cooling unit
And control unit, described control unit connect respectively with the collecting unit and cooling unit communication；The collecting unit
For obtaining the temperature information on a surface on mask in exposure process with exposure area and feeding back to described control unit；
The cooling unit is arranged on the one side of the mask and for the surface gas injection with exposure area；It is described
Control unit is used to adjust the spray regime during cooling unit gas injection according to the temperature information.
Optionally, the spray regime includes target injection pressure；Described control unit is used for according to the temperature information
And the mapping relations between the temperature of the mask and mask multiplying power, the target injection pressure of the gas is obtained, it is described
Cooling unit is used to spray the gas with the target injection pressure to the surface with exposure area.
Optionally, when described control unit obtains the target injection pressure, for according to the temperature information and institute
The target mask multiplying power that the mapping relations between the temperature of mask and mask multiplying power obtain the mask is stated, and for basis
Described in another mapping relations between the target mask multiplying power and the mask multiplying power of the mask and injection pressure obtain
Target injection pressure.
Optionally, the mask is arranged on a board platform；The cooling unit includes conveyance conduit, air compressor
And multiple nozzles；The conveyance conduit is arranged inside the board platform；One end of the conveyance conduit and multiple sprays
Mouth is connected, and the other end is connected with the air compressor.
Optionally, the pressure reducing valve with described control unit communication connection is provided on the transfer passage, the control is single
Target when member is used to adjust multiple nozzle sprays gas according to the temperature information and by the pressure reducing valve sprays pressure
Power.
Optionally, the spray regime includes target temperature；Described control unit be used for according to the temperature information and
Mapping relations between the temperature of the mask and mask multiplying power obtain the target temperature of the gas, the cooling unit
For spraying the gas with the target temperature to the surface with exposure area.
Optionally, the mask is arranged on a board platform；The cooling unit include conveyance conduit, refrigeration equipment with
And multiple nozzles；The conveyance conduit is arranged inside the board platform, and multiple nozzles are connected with the conveyance conduit, institute
State target temperature when refrigeration equipment is thermally connected with the conveyance conduit to adjust multiple nozzle sprays gas.
Optionally, the board platform tool is there are one the groove penetrated through, by the groove it can be seen that described have exposure region
The surface in domain, and multiple nozzles are arranged side by side in the table on the cell wall of the groove and described in alignment with exposure area
Face.
Optionally, a part of nozzle in multiple nozzles is used to suck the gas of another part nozzle injection.
Optionally, the collecting unit is non-contact temperature sensor, and the non-contact temperature sensor is set
In on board platform, the mask is placed on the board platform.
Optionally, the exposure area is metallic chromium layer.
In addition, the utility model also provides a kind of photoetching equipment, including being used to place the board platform of mask and above-mentioned
The mask cooling device of any one.
In conclusion mask cooling device provided by the utility model and photoetching equipment, are gathered by collecting unit
The temperature information on the surface with exposure area on mask, and pass through control unit and cooling unit is controlled according to the temperature information
To the surface gas injection, to cool down to the mask such as surface with metallic chromium layer, come with this on mask
The key position for influencing mask multiplying power is cooled down, and such type of cooling plays good cooling effect, so as to ensure that
The stabilization of mask multiplying power in photoetching process, and then ensure the precision of photoetching.
Description of the drawings
Fig. 1 is the graph that the mask multiplying power of mask changes with the time for exposure under different exposure light sources；
Fig. 2 is the structure diagram for the mask cooling device that one embodiment of the utility model provides；
Fig. 3 is the structure that the mask cooling device that one preferred embodiment of the utility model provides is installed on photoetching equipment
Schematic diagram；
When Fig. 4 is that mask cooling device imposes different pressure to pressure reducing valve on transfer passage shown in Fig. 3, mask
The graph that mask multiplying power changes with the time for exposure；
Fig. 5 is the knot that the mask cooling device that another preferred embodiment of the utility model provides is installed on photoetching equipment
Structure schematic diagram；
Fig. 6 is the local arrangement schematic diagram for the board platform that one embodiment of the utility model provides.
The reference numerals are as follows：
101- collecting units；102- control units；103- cooling units；
2011/2012- temperature sensors；The first controllers of 202-；The electronic pressure reducing valves of 203-；
2041/2042- nozzles；205- air compressors；206- conveyance conduits；207- board platforms；
208- metallic chromium layers；209- masks；301- second controllers；302- throttle valves；
303- evaporators；304- compressors；305- condensers；401- board platforms；402- vacuum absorption holes；
403- nozzles；404- temperature sensors.
Specific embodiment
Below in conjunction with attached drawing 2 to attached drawing 6 and specific embodiment, to the utility model proposes cooling device and light
Board is carved to be described in more detail.According to description below, will be become apparent from feature the advantages of the utility model.It should be noted
Be, attached drawing using very simplified form and using non-accurate ratio, only to it is convenient, lucidly aid in illustrating this reality
With the purpose of new embodiment.
Fig. 2 is the structure diagram for the mask cooling device that one embodiment of the utility model provides, which cools down
Device is used for having the key position of exposure area on mask in exposure process, i.e. the lower surface of mask is cooled down,
As shown in Fig. 2, the cooling device includes the collecting unit 101, control unit 102 and the cooling unit 103 that communicate connection successively,
Wherein, the cooling unit 103 is arranged on the one side for being installed on the mask on board platform, such as the lower section of mask,
Top, left side, right side etc., it is specific unlimited.
When carrying out photolithographic exposure：The collecting unit 101 gathers the lower surface with metallic chromium layer on the mask
Temperature information, and the temperature information is sent to control unit 102；Afterwards, described control unit 102 is according to collecting unit 101
The temperature information collected, controlling has metallic chromium layer lower surface from cooling unit 103 to the mask described in are sprayed
It emanates body, to cool down processing to the lower surface described in mask with metallic chromium layer.Preferably, the cooling is single
Member 103 is used to spray the air of clean dried to avoid pollution mask.So, when the exposure area for metallic chromium layer (i.e.
Photoresist layer) when, the air of clean dried can flow through metallic chromium layer to reduce the temperature of metallic chromium layer, so as to fulfill to mask
The cooling treatment of key position in version.
Cooling device provided in this embodiment gathers the surface on mask with exposure area by collecting unit 101
Temperature information, and by control unit 103 according to the temperature information, control cooling unit 103 is to being, for example, metal on mask
The key position of layers of chrome cools down, and can so play preferable cooling effect, so as to ensure the precision of photoetching, and
Mask will not be made to generate vibration, lithographic results are ensured while cooling.
Further, Fig. 3 is that the mask cooling device that one preferred embodiment of the utility model provides is installed on litho machine
On structure diagram, as shown in figure 3, in one embodiment, the mask cooling device includes two temperature sensors
2011st, electronic 203, the two groups of nozzles 2041 of pressure reducing valve of 2012, first controllers 202, one, 2042, air compressions
Machine 205 and a conveyance conduit 206.Here, the collecting unit 101 is a temperature sensor, and quantity is two.It is described
Cooling unit 103 includes 203, two groups of nozzles 2041 of valve, 2042, air compressor 205 and conveyance conduit 206, described defeated
One end of pipeline 206 is sent to connect air compressor 205, the other end connects two groups of nozzles 2041,2042, and every group includes multiple sprays
Mouth.Described control unit 102 includes the first controller 202, is connected with valve 203 and temperature sensor communication.The valve
203 be preferably electronic pressure reducing valve, and control accuracy is high, easy to operate.
Wherein, the temperature sensor 2011,2012 is preferably contactless temperature sensor, however, temperature sensing
The quantity of device can be one, and be installed on board platform 207, and mask 209, certainly, temperature can be placed on the board platform 207
Sensor includes but not limited to two and is equally mountable on board platform 207.Multiple temperature sensors can uniformly be installed on and hold
It is described with metallic chromium layer 208 on mask 209 to be gathered by multiple temperature sensors at the different position of pallet 207
Temperature information on lower surface at different position makes the temperature value of acquisition closer to actual conditions.
The temperature information collected is passed to the first controller 202 by each temperature sensor by communication cable, described
First controller 202 sprays gas according to the opening of the temperature information control valve 203 received so as to adjust each nozzle
Injection pressure during body.In the present embodiment, the opened by pressure at nozzle is bigger, and the flow velocity of mask lower surface is bigger, mask
The effect of cooling is better.In the present embodiment, existing PLC equal controllers, engineer can be used in first controller 202
The first controller 202 for meeting control requirement can be chosen on the market, can also be ordered to producer, people in the art is in the application
On the basis of disclosure, it should know how to realize the communication between the first controller 202 and each device.For example,
The temperature values that control valve 203 acts can be set by the first controller 202, in the temperature values, with temperature
Increase, first controller 202 by valve 203 control gas flow rate increase, it is achieved thereby that nozzle sprays gas
When spray pressure dynamic control；The temperature values can be set by mobile terminal APP, also can be by the first controller 202
Human-computer interaction interface setting.
It is preferably several but be not limited to two in addition, the quantity of the nozzle can be one.Preferably, multiple nozzles
It is evenly arranged in the groove walls of board platform 207.The tool of board platform 207 passes through this there are one the groove penetrated through
Groove is it can be seen that the lower surface of mask.When multiple nozzles are arranged at the groove walls of the groove, in preferred embodiment, two
Be provided with one or more nozzles in opposite groove walls, the nozzle in one of groove walls for gas injection, another
Nozzle in groove walls still, has metal for gas recovery (sucking gas) in the equal alignment mask version 209 of these nozzles
The lower surface of layers of chrome 208.
Wherein, the air compressor 205 is for providing compressed gas, and it is defeated by compressed gas to pass through conveyance conduit 206
It send to each nozzle, such as metallic chromium layer 208 on mask 209 can so be cooled down by compressed gas.The present embodiment
Air compressor 205 largely exist on the market at present, engineer can be chosen as needed or to producer order, this
The technical staff in field should know how to realize on the basis of disclosure.
The course of work of cooling device in the present embodiment is as follows：
Step 11：Start air compressor 205, compressed gas is made to be sprayed by conveyance conduit 206 from nozzle 2041, and from
Nozzle 2042 recycles；
Step 12：Temperature sensor 2011,2012 gathers the temperature information of metallic chromium layer 208, and by the temperature information
It is sent to the first controller 202；
Step 13：First controller 202 handles the temperature information, obtains the actual temperature of metallic chromium layer 208
Value, and according to the opening (i.e. Opening pressure) of the actual temperature value control valve 203, sprayed with being adjusted by valve 203
Flow velocity during 2041 gas injection of mouth, flow velocity is bigger, and cooling effect is better, and the gas that final nozzle 2041 sprays flows through crome metal
Layer 208 reduces the temperature of metallic chromium layer 208.
Wherein, the specific method of the opening according to the actual temperature value control valve 203 in step 13 includes：
By off-line test, the letter of the mask multiplying power variable quantity of mask and the temperature variation of metallic chromium layer 208 is obtained
Number relation (i.e. mapping relations)；
Afterwards, when temperature sensor 2011,2012 collects the actual temperature of metallic chromium layer 208, first control
Device 202 can be according to the actual temperature of metallic chromium layer 207 and with reference to above-mentioned functional relation, you can obtains actual mask multiplying power and becomes
Change amount, can according to the mask multiplying power variable quantity, the opening of control valve 203 to adjust the flow velocity of gas injection, after
And the control to mask temperature is realized, for example, when the mask multiplying power variable quantity increase that the first controller 202 obtains, then
Control valve 203 is pressurized, and increases the flow velocity of gas；When the mask multiplying power variable quantity that the first controller 202 obtains reduces, then
Control valve 203 depressurizes, and the flow velocity of gas is made to become smaller.
With reference to figure 4, Fig. 4 imposes not electronic pressure reducing valve on transfer passage for mask cooling device provided in this embodiment
During with pressure, graph that mask multiplying power changes with the time for exposure.Different curves in Fig. 4 are before same exposure light source
Put what is formed, in Fig. 4 transverse axis be the time for exposure (unit min), the longitudinal axis be mask multiplying power (unit PPM), different curved needles
To be electronic pressure reducing valve under different Opening pressures, situation that mask multiplying power changes over time.From fig. 4, it can be seen that pass through tune
The Opening pressure of whole electronic pressure reducing valve can effectively control the flow velocity of gas, so as to obtain changing relatively stable mask
Multiplying power.
Cooling device provided in this embodiment, the speed that metallic chromium layer is flowed through by adjusting the gas that nozzle sprays (are sprayed
Injection pressure), the control to the temperature of mask is realized, and metallic chromium layer is cooled down, good cooling results；It is meanwhile this
The mode that optional convection current is cooled down will not cause mask to shake so that lithographic results are unlikely to be deteriorated.
Further, referring to Fig. 5, Fig. 5 is the mask cooling device that another preferred embodiment of the utility model provides
The structure diagram being installed on litho machine, the mask cooling device include two temperature sensors 2011,2012, son's spray
Mouth 2041,2042,205, one, air compressor second controllers 301 of conveyance conduit 206, one and a refrigeration are set
It is standby.
The refrigeration equipment includes sequentially connected throttle valve 302, evaporator 303, compressor 304 and condenser 305.
The evaporator 303 is used to be thermally connected to realize heat exchange with conveyance conduit 206.The collecting unit 101 is a temperature sensing
Device, and quantity is two, communicates and connects with second controller 301.The cooling unit 103 include two groups of nozzles 2041,
2042nd, 205, conveyance conduits 206 of an air compressor and a refrigeration equipment.Described control unit 102 is wrapped
Include second controller 301.
Specifically, heat occurs and hands over equipped with refrigerant, refrigerant and the substance to cool down in the evaporator 303
It changes and evaporates so that the substance to cool down is needed to cool down.Compressor 304 is connected with evaporator 303 by conduit, and compressor 304 is
Low-pressure gas is promoted to a kind of driven fluid machinery of gases at high pressure, is the heart of refrigeration system；It sucks low from suction pipe
The refrigerant gas of warm low pressure is operated by motor after being compressed with piston to refrigeration machine gas, is discharged to exhaust pipe high
The refrigerant gas of warm high pressure provides power for refrigeration cycle.Condenser 305 is connected with compressor 304 by conduit, is belonged to and is changed
Gas or steam can be transformed into liquid by one kind of hot device, and the heat in pipe in a manner of quickly, is passed near pipe
Air in.Throttle valve 302 is connected with condenser 305 by conduit, and throttle valve 302 is by changing throttling section or throttling length
Degree is to control the valve of fluid flow.The second controller 301 is connected with the communication of throttle valve 302, and for controlling throttle valve
The flow of liquid in 302.
Existing PLC equal controllers can be used in the second controller 301, and engineer can choose satisfaction control on the market
Make requirement the first controller 202, can also be ordered to producer, people in the art on the basis of present disclosure,
It should know how the communication of realization second controller 301 and throttle valve.Such as it can be set by second controller 301 and open section
The temperature values of the throttleng surface size of valve 302 are flowed, which can be set by mobile terminal APP, can also pass through second
Human-computer interaction interface setting on controller 301.
It should be noted that the refrigeration system being made of throttle valve 302, evaporator 303, compressor 304 and condenser 305
System, has been widely present on the market at present, and engineer can choose or be customized to producer on the market as needed, this field
Technical staff should know how to realize on the basis of disclosure.
The course of work of cooling device in the present embodiment is as follows：
Step 21：Start air compressor 205, compressed gas is made to be sprayed by conveyance conduit 206 from nozzle 2041, and from
Nozzle 2042 recycles；
Step 22：Temperature sensor 2011/2012 gathers the temperature information of metallic chromium layer 208 on mask 209, and by institute
It states temperature information and is sent to second controller 301；
Step 23：Second controller 301 handles the temperature information, obtains the actual temperature of metallic chromium layer 208
Value, and according to the working condition (opening size) of actual temperature value control throttle valve 303, to be adjusted by throttle valve 303
The control of temperature during whole 2041 gas injection of nozzle, the gas that final nozzle 2041 sprays, which flows through metallic chromium layer 208, reduces gold
Belong to the temperature of layers of chrome 208.
Wherein, in step 23, the throttle valve 302 and 305 common groups of evaporator 303, compressor 304 and condenser
Into a refrigeration equipment.It is to be understood that the operation principle of the refrigeration equipment is：Refrigerant and conveying in the evaporator 303
Gas in pipeline 206 occurs heat exchange and evaporates；The compressor 304 is by conduit reception come the low of flash-pot 303
The gas of warm low pressure, and the gas of the low-temp low-pressure is compressed, to discharge the gas of high temperature and pressure；The condenser 305
The gas of the high temperature and pressure from compressor 304 is received by conduit, and the gas transition of the high temperature and pressure is discharged for liquid；
The throttle valve 302, come the liquid of condenser 305, and controls orifice size by conduit reception by second controller 301
Size, so as to which liquid be controlled to flow into the speed of evaporator 303.Above-mentioned refrigeration cycle operation as procedure described above, it is achieved thereby that
Cooling to gas in conveyance conduit 206.
Cooling device provided in this embodiment is realized by including the standby cooling unit of refrigerated medium to the gas of nozzle ejection
Temperature controls, and gas after cooling is made to flow through metallic chromium layer, realizes the cooling to mask.It present embodiments provides except control
Another way outside the mode that gas flow rate cools down to mask so that had more to the mode that mask cools down
Flexibility.
And then the board platform 207 that inventor considers to place mask 209 is a moving component, i.e. board platform 207
It is movable, therefore its bottom space is compact and cannot have fixing piece stop, therefore, as shown in fig. 6, by conveyance conduit 206 (not
Diagram) and nozzle 403 be arranged inside board platform 404, solve the installation question of cooling device.In one embodiment,
Multiple nozzles are arranged side by side on a cell wall of the above-mentioned groove of board platform 207, in a preferred embodiment, are one
Multiple nozzles have been arranged side by side on another opposite cell wall of cell wall simultaneously (for gas recovery).In addition, one or more temperature
On the cell wall for the groove that degree sensor 404 is arranged at board platform 401, and mask is positioned on board platform 401, and passes through vacuum
The absorption of adsorption hole 402 is fixed.
Further, one embodiment of the utility model also provides a kind of photoetching equipment, including board platform 401, the board platform
401 for placing mask 209, and the lower surface of the mask 209 is provided with metal (i.e. close to the one side of object to be exposed)
Layers of chrome 208.Particularly, the photoetching equipment further includes the cooling device of above-described embodiment offer.The photoetching equipment of the present embodiment
Due to including the cooling device of the present embodiment, so the advantageous effect brought in photoetching equipment by cooling device is please accordingly with reference to upper
State embodiment.
In short, in the above-described embodiments, the temperature information that described control unit 102 can be collected according to collecting unit 101
The spray regime of 103 gas injection of cooling unit is adjusted, which includes target injection pressure or including target temperature
Degree.
Wherein, when the spray regime includes target injection pressure, described control unit 102 is used for according to described
Functional relation (i.e. mapping relations) between the temperature of mask and mask multiplying power, and the temperature that collecting unit 101 is fed back to
Information is contrasted with the functional relation, you can is obtained the target injection pressure of 103 gas injection of cooling unit, thus be may be such that institute
Stating cooling unit 103 can spray to surface of the mask with exposure area with described in the target injection pressure
Gas.
Particularly, when described control unit 102 obtains the target injection pressure, can according to the temperature of the mask with
Mapping relations between mask multiplying power, and the temperature information received is combined, the target mask multiplying power of the mask is obtained, it
Afterwards, another functional relation between the mask multiplying power of the target mask multiplying power and the mask and injection pressure is carried out pair
According to, you can obtain the target injection pressure.
Either, when the spray regime includes target temperature, described control unit 102 can be according to the mask
Mapping relations between temperature and mask multiplying power, and compare the temperature information of acquisition, you can obtain 103 gas injection of cooling unit
Target temperature so that the cooling unit 103 can to surface of the mask with exposure area spray with the target temperature
The gas of degree.
In addition, the air compressor 205 in above-described embodiment is optional, and in other embodiments, the conveyance conduit
A pipe joint can be reserved, which can connect external air compressor 205 or the other equipment with similar functions,
So that dried and clean gas can input the cooling device by the pipe joint.
In conclusion mask cooling device provided by the utility model and photoetching equipment, are gathered by collecting unit
The temperature information on the surface with exposure area on mask, and pass through control unit and cooling unit is controlled according to the temperature information
To the surface gas injection, to for example the surface with metallic chromium layer cools down on mask, to be come with this to mask
The upper key position for influencing mask multiplying power is cooled down, and is played good cooling effect, is covered so as to ensure that in photoetching process
The stabilization of mould multiplying power, and then ensure the precision of photoetching.
The preferred embodiment of the utility model is above are only, does not play the role of any restrictions to the utility model.
Any person of ordinary skill in the field, in the range of the technical solution of the utility model is not departed from, to the utility model
The technical solution and technology contents of exposure make the variations such as any type of equivalent substitution or modification, belong to without departing from the utility model
Technical solution content, still fall within the scope of protection of the utility model.
Claims (12)
1. a kind of mask cooling device, which is characterized in that including collecting unit, cooling unit and control unit, the control
Unit connects respectively with the collecting unit and cooling unit communication；The collecting unit is covered for obtaining in exposure process
On masterplate there is the temperature information on a surface of exposure area and feed back to described control unit；The cooling unit is arranged on institute
State the one side of mask and for the surface gas injection with exposure area；Described control unit is used for according to
Temperature information adjusts the spray regime during cooling unit gas injection.
2. mask cooling device as described in claim 1, which is characterized in that the spray regime includes target injection pressure
Power；Described control unit is used to be closed according to the mapping between the temperature information and the temperature of the mask and mask multiplying power
System, obtains the target injection pressure of the gas, and the cooling unit is used to spray tool to the surface with exposure area
There is the gas of the target injection pressure.
3. mask cooling device as claimed in claim 2, which is characterized in that described control unit obtains the target injection
During pressure, institute is obtained for the mapping relations between the temperature according to the temperature information and the mask and mask multiplying power
The target mask multiplying power of mask is stated, and for according to the target mask multiplying power and the mask multiplying power of the mask and spray
Another mapping relations between injection pressure obtain the target injection pressure.
4. mask cooling device as claimed in claim 3, which is characterized in that the mask is arranged on a board platform；
The cooling unit includes conveyance conduit, air compressor and multiple nozzles；The conveyance conduit is arranged at the board platform
It is internal；One end of the conveyance conduit is connected with the multiple nozzle, and the other end is connected with the air compressor.
5. mask cooling device as claimed in claim 4, which is characterized in that be provided on the conveyance conduit and the control
The pressure reducing valve of unit communications connection processed, described control unit are used for according to the temperature information and pass through the pressure reducing valve adjustment institute
State target injection pressure during multiple nozzle sprays gas.
6. mask cooling device as described in claim 1, which is characterized in that the spray regime includes target temperature；Institute
Control unit is stated for according to the mapping relations between the temperature information and the temperature of the mask and mask multiplying power, obtaining
The target temperature of the gas is taken, the cooling unit is used to spray with the target to the surface with exposure area
The gas of temperature.
7. mask cooling device as claimed in claim 6, which is characterized in that the mask is arranged on a board platform；
The cooling unit includes conveyance conduit, refrigeration equipment and multiple nozzles；The conveyance conduit is arranged in the board platform
Portion, the multiple nozzle are connected with the conveyance conduit, and the refrigeration equipment is thermally connected multiple to adjust with the conveyance conduit
Target temperature during nozzle sprays gas.
8. the mask cooling device as described in claim 4 or 7, which is characterized in that there are one perforations for the board platform tool
Groove, by the groove it can be seen that the surface with exposure area, and the multiple nozzle is arranged side by side in described recessed
On the cell wall of the slot and alignment surface with exposure area.
9. mask cooling device as claimed in claim 8, which is characterized in that a part of nozzle in the multiple nozzle is used
In the gas of sucking another part nozzle injection.
10. the mask cooling device as any one of claim 1-7, which is characterized in that the collecting unit is non-
Contact type temperature sensor, and the non-contact temperature sensor is arranged on board platform, is placed on the board platform
State mask.
11. the mask cooling device as any one of claim 1-7, which is characterized in that the exposure area is gold
Belong to layers of chrome.
12. a kind of photoetching equipment, which is characterized in that including being used to place the board platform of mask, and further include such as claim
Mask cooling device any one of 1-11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721524036.5U CN207408742U (en) | 2017-11-15 | 2017-11-15 | Mask cooling device and photoetching equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721524036.5U CN207408742U (en) | 2017-11-15 | 2017-11-15 | Mask cooling device and photoetching equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207408742U true CN207408742U (en) | 2018-05-25 |
Family
ID=62319344
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721524036.5U Active CN207408742U (en) | 2017-11-15 | 2017-11-15 | Mask cooling device and photoetching equipment |
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| Country | Link |
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| CN (1) | CN207408742U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111381452A (en) * | 2018-12-29 | 2020-07-07 | 上海微电子装备（集团）股份有限公司 | Mask plate cooling device and photoetching equipment |
| TWI751532B (en) * | 2019-04-17 | 2022-01-01 | 大陸商上海微電子裝備（集團）股份有限公司 | Gas bath device and lithography machine |
-
2017
- 2017-11-15 CN CN201721524036.5U patent/CN207408742U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111381452A (en) * | 2018-12-29 | 2020-07-07 | 上海微电子装备（集团）股份有限公司 | Mask plate cooling device and photoetching equipment |
| CN111381452B (en) * | 2018-12-29 | 2021-11-02 | 上海微电子装备（集团）股份有限公司 | Mask plate cooling device and photoetching equipment |
| TWI751532B (en) * | 2019-04-17 | 2022-01-01 | 大陸商上海微電子裝備（集團）股份有限公司 | Gas bath device and lithography machine |
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