TW202044461A - Gas bath device and lithography machine capable of improving maintenance and adjustment efficiency - Google Patents
Gas bath device and lithography machine capable of improving maintenance and adjustment efficiency Download PDFInfo
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G03F7/70408—Interferometric lithography; Holographic lithography; Self-imaging lithography, e.g. utilizing the Talbot effect
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
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Abstract
Description
本發明涉及光刻技術領域,特別涉及一種氣浴裝置和光刻機The invention relates to the technical field of lithography, in particular to a gas bath device and a lithography machine
光刻機是半導體產業中的關鍵設備,光刻機的精度要求極高、結構非常複雜,產品精度達奈米級。為實現高精度設備的正常運行,需要在光刻機整機內部建立一個穩定的工作環境。為了保證光刻機整機的正常運行,光刻機整機內部的溫度、壓力以及污染物的控制非常重要。The lithography machine is a key equipment in the semiconductor industry. The precision of the lithography machine is extremely high, the structure is very complicated, and the product precision is up to nanometer level. In order to realize the normal operation of high-precision equipment, it is necessary to establish a stable working environment inside the lithography machine. In order to ensure the normal operation of the lithography machine, the temperature, pressure and contaminants inside the lithography machine are very important.
通常光刻機整機內部的溫度、壓力及污染物的控制是藉由在光刻機整機各區域內形成存在一定正壓的環境實現的,一方面可確保整機各區域內氣體溫度及壓力恆定,另一方面可以確保外界的污染物無法進入整機各區域內。這種有一定正壓的環境一般藉由氣浴裝置不斷向光刻機內吹入潔淨氣體的方式實現的。氣浴裝置中的氣體發生裝置產生潔淨氣體,潔淨氣體藉由氣浴裝置中的換熱器控制溫度後輸送至氣浴裝置中的氣體調節單元(氣浴板),並藉由氣體調節單元將潔淨氣體吹向各被控對象,氣體排除裝置可將經過被控對象後的氣體及設備運行時產生的一些污染物排出光刻機整機內部。一般氣浴裝置的每個氣體調節單元都包括吹出高速氣體的第一氣浴組件和吹出低速氣體的第二氣浴組件。Generally, the temperature, pressure and pollutants inside the lithography machine are controlled by forming a positive pressure environment in each area of the lithography machine. On the one hand, it can ensure the gas temperature and The pressure is constant, on the other hand, it can ensure that external pollutants cannot enter all areas of the whole machine. Such a certain positive pressure environment is generally realized by a gas bath device that continuously blows clean gas into the lithography machine. The gas generating device in the gas bath device generates clean gas. The clean gas is sent to the gas conditioning unit (gas bath plate) in the gas bath device after the temperature is controlled by the heat exchanger in the gas bath device, and the gas The clean gas is blown to each controlled object, and the gas removal device can discharge the gas after the controlled object and some pollutants generated during the operation of the equipment out of the lithography machine. Generally, each gas conditioning unit of a gas bath device includes a first gas bath component that blows high-speed gas and a second gas bath component that blows low-speed gas.
光刻機整機內部不同區域對於溫度、壓力的要求各不相同,尤其是運動台區域和測量系統區域,對於溫度、壓力的要求較高。Different areas of the lithography machine have different requirements for temperature and pressure, especially the moving table area and the measurement system area, which have higher requirements for temperature and pressure.
在運動台區域中,由於運動台工作時有很高的速度和加速度,而且運動台本身就是一個移動的熱源,對周圍環境有影響,為了保證運動台的精密運動穩定可靠,運動台區域的環境需要較為穩定。然而,根據運動台的運動軌跡,氣浴裝置中固定設置在光刻機的框架上的氣體調節單元需要覆蓋整個運動台區域,氣體調節單元的面積較大,且需要佔據較大的空間。並且固定設置在光刻機的框架上的氣體調節單元吹出的氣體的風向不能調整,運動台區域內某些位置不能被氣體調節單元吹出的氣體較好的覆蓋。In the sports table area, because the sports table has high speed and acceleration when working, and the sports table itself is a mobile heat source, it has an impact on the surrounding environment. In order to ensure the stable and reliable precision movement of the sports table, the environment of the sports table area Need to be more stable. However, according to the motion trajectory of the motion table, the gas adjustment unit fixed on the frame of the lithography machine in the gas bath device needs to cover the entire motion table area, and the area of the gas adjustment unit is relatively large and needs to occupy a large space. In addition, the wind direction of the gas blown by the gas adjustment unit fixed on the frame of the lithography machine cannot be adjusted, and certain positions in the motion table area cannot be better covered by the gas blown by the gas adjustment unit.
光刻機的測量系統一般有干涉儀測量系統和/或光刪尺測量系統,但是無論是具有干涉儀測量系統還是光柵尺測量系統的光刻機,測量系統區域的環境均需要較為穩定。The measurement system of the lithography machine generally has an interferometer measurement system and/or an optical ruler measurement system, but whether it is a lithography machine with an interferometer measurement system or a grating ruler measurement system, the environment of the measurement system area needs to be relatively stable.
對於包括干涉儀測量系統的光刻機,第一氣浴組件需要覆蓋整個干涉儀光路,以使光路上的溫度穩定、壓力波動小,避免干涉儀光路受到周圍環境的影響。由於干涉儀光路的末端靠近物鏡,無法在整個干涉儀光路上全程設置第一氣浴組件,通常採用的辦法是使靠近干涉儀光路的末端處的第一氣浴組件具有斜向吹風的功能,使第一氣浴組件吹出的氣體能夠覆蓋干涉儀光路的末端。這種斜向吹風的功能通常藉由格柵導向板改變第一氣浴組件吹出的氣體的風向實現,其中,格柵導向板的結構示意圖如第1圖所示。但是,格柵導向板是固定設置在光刻機的框架上的,格柵導向板設計安裝好後吹出氣體的風向便也無法調整,因此改變吹出的氣體的風向的程度有限。For a lithography machine including an interferometer measurement system, the first gas bath component needs to cover the entire interferometer optical path, so that the temperature on the optical path is stable, the pressure fluctuation is small, and the interferometer optical path is not affected by the surrounding environment. Since the end of the optical path of the interferometer is close to the objective lens, the first gas bath assembly cannot be installed in the entire optical path of the interferometer. The usual method is to make the first gas bath assembly near the end of the optical path of the interferometer have the function of oblique blowing. The gas blown by the first gas bath assembly can cover the end of the optical path of the interferometer. This oblique blowing function is usually realized by the grille guide plate changing the wind direction of the gas blown out of the first gas bath assembly, wherein the schematic diagram of the structure of the grille guide plate is shown in Figure 1. However, the grid guide plate is fixed on the frame of the photoetching machine. After the grid guide plate is designed and installed, the wind direction of the blown gas cannot be adjusted. Therefore, the degree of changing the wind direction of the blown gas is limited.
對於包括光柵尺測量系統的光刻機,平面光柵尺110安裝在主基板120的下表面上,而光柵尺讀頭130安裝在運動台140上並跟隨運動台140一起運動。如下第2圖所示,第2圖是包括光柵尺測量系統的光刻機的結構示意圖,在曝光工作時運動台140按照預定軌跡掃描運動,運動台140的位置不斷變化導致光柵尺讀頭130的位置也不斷變化,運動台140讀頭附近需要氣體持續吹淋,才能使光柵尺讀頭130始終被氣浴覆蓋,從而保證測量系統溫度環境穩定。同時氣體持續吹淋也可以帶走運動台140散發的熱量,使運動台140溫度穩定,進而使運動台140熱變形對精度的影響減小,有利於提高運動台140的精度及測量系統的精度。根據運動台140的運動軌跡,氣浴裝置中固定設置在光刻機的框架上的多個氣體調節單元需要覆蓋整個運動台140區域,多個氣體調節單元的面積較大,且需要佔據較大的空間。然而,整個運動台140區域中有很大一部分區域是光柵尺所在,氣浴裝置的多個氣體調節單元無法佈置。For the lithography machine including the grating ruler measurement system, the
不論是包括光柵尺測量系統的光刻機還是包括干涉儀測量系統的光刻機,光刻機內部的氣浴裝置中的多個氣體調節單元都是相對光刻機的框架固定設置的,光刻機內部的氣浴裝置中的多個氣體調節單元設計安裝好後吹出氣體的風向便也無法調整。在實際工程應用中,若要使氣體調節單元吹出的氣體始終覆蓋運動台區域中的運動件、光柵尺讀頭和干涉儀光路,則需要調整氣體調節單元吹出的氣體的風向,而若要調整氣體調節單元吹出的氣體的風向則必須停機,更換氣體調節單元或者改變氣體調節單元的安裝角度來更改氣體調節單元吹出的氣體的風向,非常麻煩,並且光刻機中設置氣浴裝置的空間有限。同時在有些區域中被控對像是運動件時,在有限的空間裡相對光刻機的框架固定設置的多個氣體調節單元無法使運動件始終被氣浴覆蓋。Whether it is a lithography machine including a grating ruler measurement system or a lithography machine including an interferometer measurement system, the multiple gas regulating units in the gas bath device inside the lithography machine are fixedly arranged relative to the frame of the lithography machine. After the multiple gas adjustment units in the gas bath device inside the engraving machine are designed and installed, the wind direction of the blowing gas cannot be adjusted. In practical engineering applications, if the gas blown out by the gas regulating unit always covers the moving parts, the grating scale read head and the interferometer optical path in the moving platform area, the wind direction of the gas blown out by the gas regulating unit needs to be adjusted. The wind direction of the gas blown by the gas control unit must be shut down. Replace the gas control unit or change the installation angle of the gas control unit to change the wind direction of the gas blown by the gas control unit. This is very troublesome, and the space for the gas bath device in the lithography machine is limited. . At the same time, when the controlled object is a moving part in some areas, multiple gas regulating units fixedly arranged relative to the frame of the photoetching machine in a limited space cannot make the moving part always covered by the gas bath.
本發明的目的在於提供一種氣浴裝置和光刻機,以解決習知的氣浴裝置和光刻機吹送氣體的風向不能調整導致運動件不能被氣浴即時覆蓋的問題。The object of the present invention is to provide a gas bath device and a lithography machine to solve the problem that the conventional gas bath device and lithography machine cannot adjust the blowing direction of the gas, which leads to the problem that the moving parts cannot be immediately covered by the gas bath.
為解決上述技術問題,本發明提供一種氣浴裝置,所述氣浴裝置用於向運動件吹送氣體,所述氣浴裝置包括供氣單元、至少一個氣體調節單元和控制單元,所述供氣單元用於向每個所述氣體調節單元提供氣體,所述氣體調節單元用於吹送所述氣體,所述控制單元用於控制所述氣體調節單元即時調節吹送的所述氣體的方向,以使所述氣體調節單元吹送的所述氣體的方向隨著所述運動件位置的變化而即時變化。In order to solve the above technical problems, the present invention provides a gas bath device, the gas bath device is used to blow gas to the moving part, the gas bath device includes a gas supply unit, at least one gas adjustment unit and a control unit, the gas supply The unit is used to provide gas to each of the gas adjustment units, the gas adjustment unit is used to blow the gas, and the control unit is used to control the gas adjustment unit to adjust the direction of the gas blown in real time, so that The direction of the gas blown by the gas regulating unit changes instantly as the position of the moving part changes.
可選的,每個所述氣體調節單元包括至少一個氣浴,每個所述氣浴用於吹送所述氣體,其中,所述至少一個氣浴中的至少一個吹送的所述氣體的方向可調節。Optionally, each of the gas adjustment units includes at least one gas bath, and each of the gas baths is used to blow the gas, wherein the direction of the gas blown by at least one of the at least one gas bath is adjustable .
可選的,吹送的氣體的方向可調節的所述氣浴包括氣浴本體、調整機構、端板和連接件,所述氣浴本體具有一中空的腔體,所述氣浴本體的腔體與所述供氣單元連接,所述調整機構設置在所述氣浴本體的腔體內,所述調整機構與所述端板連接,所述調整機構用於驅動所述端板轉動,所述連接件用於撓性連接所述氣浴本體和所述端板,所述端板上設置有至少一個通孔,每個所述通孔允許所述氣體通過。Optionally, the gas bath whose blowing gas direction can be adjusted includes a gas bath body, an adjustment mechanism, an end plate and a connecting piece, the gas bath body has a hollow cavity, and the cavity of the gas bath body Connected to the air supply unit, the adjustment mechanism is arranged in the cavity of the gas bath body, the adjustment mechanism is connected to the end plate, the adjustment mechanism is used to drive the end plate to rotate, the connection The member is used to flexibly connect the gas bath body and the end plate, the end plate is provided with at least one through hole, and each through hole allows the gas to pass through.
可選的,所述連接件用於密封連接所述氣浴本體和所述端板。Optionally, the connecting member is used for sealingly connecting the gas bath body and the end plate.
可選的,吹送的氣體的方向可調節的所述氣浴還包括一鎖緊裝置,所述鎖緊裝置用於鎖緊所述調整機構以鎖定所述端板的位置。Optionally, the gas bath whose blowing gas direction is adjustable further includes a locking device for locking the adjustment mechanism to lock the position of the end plate.
可選的,至少一個所述氣體調節單元包括三個所述氣浴,分別為第一氣浴、第二氣浴和第三氣浴,所述第一氣浴、所述第二氣浴和所述第三氣浴均與所述供氣單元連通,從所述第一氣浴吹送出的氣體的風速大於從所述第二氣浴和所述第三氣浴送出的氣體的風速,其中,所述第一氣浴吹送的氣體的方向可調節。Optionally, at least one of the gas conditioning units includes three gas baths, which are a first gas bath, a second gas bath, and a third gas bath. The first gas bath, the second gas bath, and the The third gas bath is in communication with the gas supply unit, and the wind speed of the gas blown from the first gas bath is greater than the wind speed of the gas sent from the second gas bath and the third gas bath, wherein , The direction of the gas blown by the first gas bath can be adjusted.
可選的,所述控制單元包括運動件控制器、氣浴調整機構控制器和同步控制器,所述運動件控制器用於控制所述運動件運動,所述氣浴調整機構控制器用於控制所述氣體調節單元即時調節吹送氣體的方向,所述同步控制器用於控制所述運動件控制器和所述氣浴調整機構控制器同步動作,以使所述氣體調節單元吹送的氣體的方向隨著所述運動件位置的變化而即時變化。Optionally, the control unit includes a moving part controller, a gas bath adjustment mechanism controller, and a synchronization controller. The moving part controller is used to control the movement of the moving part, and the gas bath adjustment mechanism controller is used to control the The gas adjustment unit instantly adjusts the direction of blowing gas, and the synchronization controller is used to control the moving part controller and the gas bath adjustment mechanism controller to act in synchronization, so that the direction of the gas blowing by the gas adjustment unit follows The position of the moving part changes instantly.
可選的,所述控制單元還包括整機控制器,所述整機控制器用於發送運動件工作指令給所述運動件控制器,發送氣浴工作指令給所述氣浴調整機構控制器;所述運動件控制器接收所述運動件工作指令,並將所述運動件工作指令轉換成軌跡規劃參數,並藉由所述軌跡規劃參數控制所述運動件運動;所述氣浴調整機構控制器接收所述氣浴工作指令,並將所述氣浴工作指令轉換成初始參數設定值,藉由所述初始參數設定值控制所述氣體調節單元動作;所述同步控制器藉由同步時序流向所述運動件控制器和所述氣浴調整機構控制器發送同步控制時序訊息,以控制所述運動件控制器和所述氣浴調整控制器同步動作。Optionally, the control unit further includes a whole machine controller, the whole machine controller is used to send a moving part work instruction to the moving part controller, and a gas bath work instruction to the gas bath adjustment mechanism controller; The moving part controller receives the moving part work instruction, converts the moving part work instruction into a trajectory planning parameter, and controls the movement of the moving part by the trajectory planning parameter; the gas bath adjustment mechanism controls The device receives the gas bath work instruction, and converts the gas bath work instruction into an initial parameter setting value, and controls the action of the gas adjustment unit by the initial parameter setting value; the synchronization controller flows to The moving part controller and the gas bath adjusting mechanism controller send synchronization control timing messages to control the moving part controller and the gas bath adjusting controller to act in synchronization.
可選的,所述供氣單元包括氣體發生裝置、氣體過濾淨化裝置、氣體溫度控制裝置和管道,所述氣體發生裝置藉由所述管道與所有的所述氣體調節單元連接,所述氣體過濾淨化裝置設置在所述管道上並且位於所述氣體發生裝置和每個所述氣體調節單元之間,所述氣體溫度控制裝置設置在所述管道上並且位於所述氣體過濾淨化裝置和每個所述氣體調節單元之間,所述氣體發生裝置用於產生所述氣體,所述氣體過濾淨化裝置用於淨化所述氣體,所述溫度控制裝置用於控制所述氣體的溫度。Optionally, the gas supply unit includes a gas generating device, a gas filtering and purifying device, a gas temperature control device, and a pipeline, and the gas generating device is connected to all the gas regulating units through the pipeline, and the gas filter A purification device is provided on the pipeline and located between the gas generating device and each of the gas conditioning units, and the gas temperature control device is provided on the pipeline and located between the gas filtering and purification device and each of the gas conditioning units. Between the gas regulating units, the gas generating device is used to generate the gas, the gas filtering and purifying device is used to purify the gas, and the temperature control device is used to control the temperature of the gas.
本發明還提供一種光刻機,包括上述的氣浴裝置。The present invention also provides a photoetching machine including the above-mentioned gas bath device.
本發明提供的一種氣浴裝置和光刻機,具有以下有益效果:The gas bath device and lithography machine provided by the present invention have the following beneficial effects:
由於所述供氣單元用於提供氣體,所述氣體調節單元用於吹送氣體,且所述氣體調節單元吹送氣體的方向可調節,並且氣體調節單元吹送氣體的方向的調節是由控制單元控制的,控制單元控制的方式是使所述氣體調節單元即時調節所述氣體調節單元吹送的氣體的方向,以使所述氣體調節單元吹送的氣體的方向隨著運動件位置的變化而即時變化。所述氣體調節單元吹送的氣體的方向隨著運動件位置的變化而即時變化,因此相較於習知技術中吹送的氣體的方向不可調節的氣浴裝置,可使得氣體調節單元吹送的氣體的方向隨著運動件位置的變化而即時調節,從而使運動件能被氣體調節單元吹送的氣體即時覆蓋,即使運動件被氣浴即時覆蓋。也由於氣體調節單元吹送的氣體的方向可調節,因此可在減少氣體調節單元的面積的情況下使得運動件能被氣體調節單元吹送的氣體即時覆蓋,簡化氣浴裝置的體積,且便於調節氣體調節單元吹送的氣體的方向,提高氣浴裝置維護和調整效率。Since the gas supply unit is used to provide gas, the gas adjustment unit is used to blow gas, and the direction in which the gas adjustment unit blows the gas can be adjusted, and the adjustment of the direction in which the gas adjustment unit blows the gas is controlled by the control unit The control method of the control unit is to make the gas adjustment unit instantly adjust the direction of the gas blown by the gas adjustment unit, so that the direction of the gas blown by the gas adjustment unit changes instantly as the position of the moving part changes. The direction of the gas blown by the gas adjustment unit changes instantly with the change of the position of the moving part. Therefore, compared with the conventional gas bath device in which the direction of the gas blown is not adjustable, the gas blown by the gas adjustment unit can be The direction is adjusted instantly as the position of the moving part changes, so that the moving part can be instantly covered by the gas blown by the gas regulating unit, even if the moving part is instantly covered by the gas bath. Also, because the direction of the gas blown by the gas regulating unit can be adjusted, the moving parts can be instantly covered by the gas blown by the gas regulating unit while reducing the area of the gas regulating unit, simplifying the volume of the gas bath device and facilitating gas regulation Adjust the direction of the gas blown by the unit to improve the maintenance and adjustment efficiency of the gas bath device.
以下結合圖式和具體實施例對本發明提出的氣浴裝置和光刻機作進一步詳細說明。根據下面說明和申請專利範圍,本發明的優點和特徵將更清楚。需說明的是,圖式均採用非常簡化的形式且均使用非精准的比例,僅用以方便、明晰地輔助說明本發明實施例的目的。The gas bath device and lithography machine proposed by the present invention will be described in further detail below in conjunction with the drawings and specific embodiments. According to the following description and the scope of patent application, the advantages and characteristics of the present invention will be more clear. It should be noted that the drawings all adopt very simplified forms and all use imprecise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.
實施例一Example one
本實施例提供一種氣浴裝置。參考第3圖和第4圖,第3圖是本發明實施例一中氣浴裝置的主視圖,第4圖是第3圖中的氣浴裝置的俯視圖,所述氣浴裝置用於向所述運動件吹送氣體,所述氣浴裝置包括供氣單元、至少一個氣體調節單元300和控制單元,所述供氣單元用於提供氣體,所述氣體調節單元300用於吹送氣體,且所述氣體調節單元300吹送氣體的方向可調節,所述控制單元用於控制所述氣體調節單元300即時調節所述氣體調節單元300吹送氣體的方向,以使所述氣體調節單元300吹送氣體的方向隨著運動件位置的變化而即時變化。This embodiment provides a gas bath device. Referring to Figures 3 and 4, Figure 3 is a front view of the gas bath device in the first embodiment of the present invention, and Figure 4 is a top view of the gas bath device in Figure 3, which is used to The moving part blows gas, the gas bath device includes a gas supply unit, at least one gas regulating
由於所述供氣單元用於提供氣體,所述氣體調節單元300用於吹送氣體,且所述氣體調節單元300吹送氣體的方向可調節,並且氣體調節單元300吹送氣體的方向的調節是由控制單元控制的,控制單元控制的方式是使所述氣體調節單元300即時調節所述氣體調節單元300吹送氣體的方向,以使所述氣體調節單元300吹送氣體的方向隨著運動件位置的變化而即時變化。Since the gas supply unit is used to provide gas, the
所述氣體調節單元300吹送氣體的方向隨著運動件位置的變化而即時變化,因此相較於習知技術中吹送氣體的方向不可調節的氣浴裝置,可使得氣體調節單元300吹送氣體的方向隨著運動件位置的變化而即時調節,從而使運動件能被氣體調節單元300吹送的氣體即時覆蓋。也由於氣體調節單元300吹送氣體的方向可調節,因此可在減少氣體調節單元300的面積的情況下使得運動件能被氣體調節單元300吹送的氣體即時覆蓋,簡化氣浴裝置的體積,且便於調節氣體調節單元300吹送氣體的方向,提高維護和調整效率。The blowing direction of the
參考第3圖和第4圖,所述供氣單元用於吹送氣體,所述供氣單元包括氣體發生裝置210、氣體過濾淨化裝置220、氣體溫度控制裝置230和管道240。Referring to FIGS. 3 and 4, the gas supply unit is used for blowing gas. The gas supply unit includes a
所述氣體發生裝置210藉由管道240與所有的所述氣體調節單元300連接,所述氣體過濾淨化裝置220設置在所述管道240上,位於所述氣體發生裝置210和所述氣體調節單元300之間,所述氣體溫度控制裝置230設置在所述管道240上,位於所述氣體過濾淨化裝置220和所述氣體調節單元300之間。The
其中,所述氣體發生裝置210用於產生氣體。所述氣體通常為濕空氣,例如,在浸沒系統中浸液蒸發會帶來溫度變化,導致相關零部件及矽片的尺寸變化從而影響曝光精度,通入濕空氣可以有效降低浸液蒸發速率,從而可控制溫度的變化,進而降低由於溫度變化引起相關零部件及矽片的尺寸變化從而影響曝光精度的風險。所述氣體過濾淨化裝置220用於淨化所述氣體。所述氣體溫度控制裝置230用於控制所述氣體的溫度。Wherein, the
參考第5圖、第6圖和第7圖,第5圖是本發明實施例一中氣體調節單元300的結構示意圖,第6圖是本發明實施例一中第一氣浴310的結構示意圖,第7圖是本發明實施例一中第一氣浴310中第一端板313的結構示意圖,所述氣體調節單元300包括第一氣浴310、第二氣浴320和第三氣浴330。所述第一氣浴310、第二氣浴320和第三氣浴330均藉由所述管道240與所述供氣單元連通。所述第一氣浴310、第二氣浴320和第三氣浴330分別用於吹送氣體。其中,所述第一氣浴310吹送氣體的方向可調節。Referring to Fig. 5, Fig. 6 and Fig. 7, Fig. 5 is a schematic structural diagram of the
具體的,如第5圖所示,所述第一氣浴310、第二氣浴320和第三氣浴330並排設置,且所述第一氣浴310、第二氣浴320和第三氣浴330的進氣口均與所述管道240連通,經過所述氣體溫度控制裝置230的氣體可從所述第一氣浴310、第二氣浴320和第三氣浴330的進氣口進入第一氣浴310、第二氣浴320和第三氣浴330的腔體中,並從所述第一氣浴310、第二氣浴320和第三氣浴330的排氣口吹出。所述第一氣浴310、第二氣浴320和第三氣浴330可調節氣體的速度,以使所述第一氣浴310吹送的氣體為高速氣體,所述第二氣浴320和所述第三氣浴330吹送的氣體為低速氣體,即在本申請實施例中,所述第一氣浴310吹送的氣體速度較所述第二氣浴320和所述第三氣浴330吹送的氣體的速度高。Specifically, as shown in Figure 5, the
如第6圖所示,所述第一氣浴310包括第一氣浴本體311、第一調整機構312、第一端板313和第一連接件314。As shown in FIG. 6, the
所述第一氣浴本體311具有一中空的腔體,所述第一氣浴本體311的腔體與所述管道240連通。所述第一調整機構312設置在所述第一氣浴本體311的腔體內,所述第一調整機構312與所述第一端板313連接,所述第一調整機構312用於驅動所述第一端板313轉動。所述第一連接件314用於撓性連接所述第一氣浴本體311和所述第一端板313。所述第一端板313上設置有至少一個通孔,氣體可從所述通孔中流通。其中,所述第一氣浴本體311的腔體與所述管道240連通處為所述第一氣浴310的進氣口,所述第一端板313(上的通孔)為所述第一氣浴310的排氣口。The first
較佳地,所述第一連接件314還用於密封連接所述第一氣浴本體311和所述第一端板313,當所述氣浴裝置工作時,可使氣體僅能從所述第一端板313中流出,如此在藉由第一調整機構312驅動所述第一端板313轉動時,所述第一連接件314可避免氣體從所述第一端板313與所述第一氣浴本體311之間的間隙中洩漏,進而提高調節吹送氣體的方向的效率和準確度。Preferably, the first connecting
較佳地,所述第一氣浴310還包括一鎖緊裝置,所述鎖緊裝置用於鎖緊第一調整機構312,如此在所述第一調整機構312轉動後可藉由鎖緊裝置鎖緊,避免第一端板313在不需要轉動的時候,即不需要調整從所述第一端板313吹送的氣體的方向的時候轉動,進而導致第一端板313吹送的氣體的方向變化的問題,即將吹送氣體的方向鎖定在當前吹送方向下或者說鎖定在需要的吹送方向下,可進一步提高吹送氣體的方向的準確度。Preferably, the
具體的,本實施例中,所述第一氣浴本體311的內腔的形狀和大小從所述第一氣浴310的進氣端到所述第一氣浴本體311與所述第一端板313連接的一端依次變化,以使進入所述第一氣浴本體311的內腔中的氣體在內腔的作用下以預定的風速吹出,例如以較高的速度吹出。Specifically, in this embodiment, the shape and size of the inner cavity of the first
所述第一調整機構312可藉由氣動、電動或者液壓等方式驅動所述第一端板313轉動。所述第一調整機構312包括驅動裝置和傳動裝置,所述驅動裝置用於藉由所述傳動裝置驅動所述第一端板313轉動。具體的,所述驅動裝置可為輸出旋轉動力的氣缸,所述傳動裝置為連接桿,所述氣缸的輸出端與所述連接桿連接,所述連接桿與所述第一端板313固定連接,所述氣缸驅動所述連接桿轉動,所述連接桿驅動所述第一端板313轉動。The
所述第一端板313中通孔的數量大於兩個,所述第一端板313呈板狀,所有的所述通孔成蜂窩狀設置在所述第一端板313上。所述通孔與所述第一端板313之間的夾角為θ(即所述通孔的軸線與所述第一端板313所在平面的夾角為θ),0°>θ>90°,θ的大小可根據不同機台的需求設計。從所述第一端板313吹送氣體的風向與所述第一端板313與所述第一氣浴本體311的相對位置有關,還與所述通孔與所述第一端板313之間的夾角θ的大小有關。所述第一端板313可選用不銹鋼、PTFE等材料製成。The number of through holes in the
所述連接件的材質可為橡膠、矽膠等具有一定彈性的材料,在密封連接第一端板313與第一氣浴本體311時,連接件可發生一定的形變,從而可避免第一端板313在第一調整機構312的驅動下轉動時,第一端板313與第一氣浴本體311之間的密封性被破壞。The material of the connecting piece can be rubber, silicon rubber and other materials with certain elasticity. When the
所述第二氣浴320包括第二氣浴本體和第二端板。所述第二氣浴本體具有一中空的腔體,所述第二氣浴本體的腔體與所述管道240連通。所述第二端板上設置有至少一個通孔,氣體可從所述通孔中流過。所述第二端板固定設置在所述第二氣浴本體上。其中,所述第二氣浴本體的腔體與所述管道240連通處為所述第二氣浴320的進氣口,所述第二端板(上的通孔)為所述第二氣浴320的排氣口。所述第二氣浴本體的內腔的形狀和大小從所述第二氣浴320的進氣端到所述第二氣浴本體與所述第二端板連接的一端依次變化,以使進入所述第二氣浴本體的內腔中的氣體在內腔的作用下以預定的風速吹出,例如以較低的速度吹出。The
所述第三氣浴330的結構與所述第二氣浴320的結構類似。所述第三氣浴330包括第三氣浴本體和第三端板。所述第三氣浴本體具有一中空的腔體,所述第三氣浴本體的腔體與所述管道240連通。所述第三端板上設置有至少一個通孔,氣體可從所述通孔中流過。所述第三端板固定設置在所述第三氣浴本體上。其中,所述第三氣浴本體的腔體與所述管道240連通處為所述第三氣浴330的進氣口,所述第三端板(上的通孔)為所述第三氣浴330的排氣口。所述第三氣浴本體的內腔的形狀和大小從所述第三氣浴330的進氣端到所述第三氣浴本體與所述第三端板連接的一端依次變化,以使進入所述第三氣浴本體的內腔中的氣體在內腔的作用下以預定的風速吹出,例如以較低的速度吹出。The structure of the
較佳地,為了保證氣體進入第一氣浴310、第二氣浴320和第三氣浴330時的風速以及潔淨度,在所述氣體溫度控制裝置230與所述氣體調節單元300之間的管道240上還設置有過濾器。為了使經過氣體溫度控制裝置230後的氣體的溫度穩定,將氣體溫度控制裝置230與所述氣體調節單元300之間的管道240設計為雙層結構,中間填充保溫材料,以降低管道240內的氣體受周圍環境影響的風險。Preferably, in order to ensure the wind speed and cleanliness when the gas enters the
所述控制單元包運動件控制器、氣浴調整機構控制器和同步控制器。所述運動件控制器用於控制運動件運動,所述氣浴調整機構控制器用於控制所述氣體調節單元即時調節所述氣體調節單元吹送氣體的方向,所述同步控制器用於控制所述運動件控制器和所述氣浴調整機構控制器同步動作,以使所述氣體調節單元吹送氣體的方向隨著運動件位置的變化而即時變化。The control unit includes a moving part controller, a gas bath adjustment mechanism controller and a synchronization controller. The moving part controller is used to control the movement of the moving part, the gas bath adjustment mechanism controller is used to control the gas adjustment unit to instantly adjust the direction in which the gas adjustment unit blows gas, and the synchronization controller is used to control the moving part The controller and the controller of the gas bath adjusting mechanism act synchronously, so that the direction of the gas blowing by the gas adjusting unit changes instantly as the position of the moving part changes.
參考第8圖,第8圖是本發明實施例一中氣浴裝置的控制單元的結構方塊圖,所述控制單元還包括整機控制器710,所述整機控制器710用於發送運動件工作指令給運動件控制器720,發送氣浴工作指令給氣浴調整機構控制器730。所述運動件控制器720接收所述運動件工作指令,並將所述運動件工作指令轉換成軌跡規劃參數,並藉由所述軌跡規劃參數控制運動件750運動。所述氣浴調整機構控制器730接收所述氣浴工作指令,並將所述氣浴工作指令轉換成初始參數設定值,藉由所述初始參數設定值控制所述氣體調節單元300動作。所述同步控制器740藉由同步時序流向運動件控制器720和氣浴調整機構控制器730發送同步控制時序訊息,以控制運動件控制器720和氣浴調整控制器730同步動作。Referring to Figure 8, Figure 8 is a structural block diagram of the control unit of the gas bath device in the first embodiment of the present invention. The control unit further includes a
具體的,所述氣浴調整機構控制器730藉由所述初始參數設定值控制所述氣體調節單元300的第一氣浴310的第一調整機構312動作。Specifically, the gas bath
所述氣浴裝置還包括抽氣裝置510,所述抽氣裝置510用於吸入所述氣體,並將所述氣體排出。The gas bath device further includes an
所述氣浴裝置還包括排氣裝置520,所述排氣裝置520與所述抽氣裝置510連通,所述抽氣裝置510藉由所述排氣裝置520吸入所述氣體。例如,所述排氣裝置520可為具有若干開孔的管道。The gas bath device further includes an
以下以應用在光刻機中的氣浴裝置為例,具體說明氣浴裝置的工作過程。The following takes the gas bath device used in the lithography machine as an example to specifically describe the working process of the gas bath device.
如第3圖和第4圖所示,所述光刻機包括運動台框架410、運動台420、平面光柵尺430、光柵尺讀頭和主基板450,所述運動台420設置在所述運動台框架410上,所述平面光柵尺430安裝在所述主基板450的下表面上,所述光柵尺讀頭安裝在運動台420上並跟隨運動台420一起運動。As shown in Figures 3 and 4, the lithography machine includes a moving
所述氣體調節單元300的數量為八個,每四個所述氣體調節單元300沿Y軸方向呈一列設置,且八個所述氣體調節單元300分別以關於平行於Y軸的對稱軸對稱的方式設置在所述運動台框架410的兩側。所述抽氣裝置510的數量為兩個,兩個所述抽氣裝置分別以關於平行於X軸的對稱軸對稱的方式設置在所述運動台框架410的另外兩側。其中,由於所述抽氣裝置510和所述氣體調節單元300分別設置在所述運動台框架410兩組不同的側邊上,因此可便於從所述氣體調節單元300吹送的氣體較好的吹淋運動台420,再進入抽氣裝置510排出至光刻機外。所述氣體溫度控制裝置230的數量為兩個,兩個所述氣體溫度控制裝置230分別以關於平行於Y軸的對稱軸對稱的方式設置在所述運動台框架410的兩側。每個所述氣體溫度控制裝置230與同側的四個氣體調節單元300連接,經過所述氣體過濾淨化裝置220處理後的氣體分兩路分別進入兩個氣體溫度控制裝置230中,並從兩個氣體溫度控制裝置230分別流向與氣體溫度控制裝置230對應的四個氣體調節單元300中。The number of the
其中,所述運動件包括所述運動台420,以及安裝在運動台420上並跟隨運動台420一起運動的光柵尺讀頭,在其他的實施例中所述運動件可僅僅包括所述運動台420或者僅僅包括所述光柵尺讀頭。Wherein, the moving part includes the moving table 420, and a grating ruler reading head installed on the moving table 420 and moving along with the moving table 420. In other embodiments, the moving part may only include the moving table. 420 or just include the grating ruler reading head.
所述氣浴裝置向所述運動件吹送氣體以使所述運動件始終被氣體覆蓋的工作過程如下:The working process of the gas bath device blowing gas to the moving part so that the moving part is always covered by gas is as follows:
首先,供氣單元提供氣體。First, the gas supply unit supplies gas.
具體的,首先,氣體發生裝置210產生氣體,之後氣體藉由管道240流入氣體過濾淨化裝置220,經過氣體過濾淨化裝置220處理後,再藉由管道240流入氣體溫度控制裝置230中,藉由氣體溫度控制裝置230控制溫度後,藉由管道240進入氣體調節單元300中。較佳地,藉由氣體溫度控制裝置230控制溫度後的氣體經過過濾器再次過濾後,再藉由管道240進入氣體調節單元300中。Specifically, first, the
其次,氣體調節單元300在控制單元的控制下即時調節氣體調節單元300吹送氣體的方向,以使所述氣體調節單元300吹送氣體的方向隨著運動台420位置的變化而即時變化,同時所述氣體調節單元300吹送氣體。Secondly, under the control of the control unit, the
具體的,所述整機控制器710發送運動件工作指令給運動件控制器720,發送氣浴工作指令給氣浴調整機構控制器730。所述運動件控制器720接收所述運動件工作指令,並將所述運動件工作指令轉換成軌跡規劃參數,並藉由所述軌跡規劃參數控制運動台420運動。所述氣浴調整機構控制器730接收所述氣浴工作指令,並將所述氣浴工作指令轉換成初始參數設定值,藉由所述初始參數設定值控制所述氣體調節單元300動作。所述同步控制器740藉由同步時序流向運動件控制器720和氣浴調整機構控制器730發送同步控制時序訊息,以控制運動件控制器720和氣浴調整控制器730同步動作。Specifically, the
例如,參考第9圖,第9圖是本發明實施例一中運動台420在兩列氣體調節單元300之間的結構示意圖,當運動台420在兩列氣體調節單元300之間時,此時運動台420距兩側氣體調節單元300的距離一樣,兩側氣體調節單元300吹送氣體的方向與XOY平面之間的夾角相同,此時控制單元控制所述氣體調節單元300吹送氣體的方向與XOY平面之間的夾角相同,以使從氣體調節單元300吹送出的氣體可覆蓋當前位置的運動台420。For example, referring to Figure 9, Figure 9 is a structural diagram of the exercise table 420 between the two rows of
參考第10圖,第10圖是本發明實施例一中運動台420在兩列氣體調節單元300之間偏向X正向一側的結構示意圖,控制單元控制偏向X正向一側的氣體調節單元300吹送氣體的方向與XOY平面之間的夾角大於偏向X負向一側的氣體調節單元300吹送氣體的方向與XOY平面之間的夾角。Referring to Fig. 10, Fig. 10 is a structural diagram of the exercise table 420 in the first embodiment of the present invention that is biased toward the positive side of X between the two rows of
參考第11圖,第11圖是本發明實施例一中運動台420在兩列氣體調節單元300之間偏向X負向一側的結構示意圖,控制單元控制偏向X負向一側的氣體調節單元300吹送氣體的方向與XOY平面之間的夾角大於偏向X正向一側的氣體調節單元300吹送氣體的方向與XOY平面之間的夾角。Referring to Figure 11, Figure 11 is a structural diagram of the exercise table 420 in the first embodiment of the present invention, which is biased to the negative X side between the two rows of
由於主基板450下表面有大面積區域佈置著平面光柵尺430,沿Y方向設置的兩列氣體調節單元300可使氣體調節單元300吹送的氣體在Y方向上全面覆蓋平面光柵尺430,而在X方向上氣體調節單元300吹送的氣體有可能不能覆蓋靠近兩列氣體調節單元300中間位置,而運動台420所處的位置大部分位於兩列氣體調節單元300中間的位置。可藉由仿真計算本實施例中的運動台420在某一位置時光柵尺讀頭所在位置處的風速,以判斷氣體調節單元300吹送的氣體是否完全覆蓋位於相應位置處的光柵尺讀頭和運動台420。Since there is a large area on the lower surface of the
設定氣體調節單元300的排氣口處的風速為3m/s,光柵尺讀頭在不同位置處的風速如下:
其中,如第12圖所示,第12圖是本發明實施例一中運動台420運動到一位置其上的不同位置處的光柵尺讀頭的風速示意圖,在第一位置610、第二位置620、第三位置630和第四位置640處均有氣流藉由,因此當運動台420位於相應位置處時,所述運動台420和光柵尺讀頭均可以被氣流覆蓋。Among them, as shown in Figure 12, Figure 12 is a schematic diagram of the wind speed of the grating ruler reading head when the moving
實施例二Example two
本實施例提供一種氣浴裝置。本實施例中的氣浴裝置與實施例一中的氣浴裝置的區別在於,所述氣浴裝置的氣體調節單元不相同。This embodiment provides a gas bath device. The difference between the gas bath device in this embodiment and the gas bath device in the first embodiment is that the gas adjustment units of the gas bath device are different.
具體的,本實施例中,所述氣體調節單元僅具有第一氣浴。所述第一氣浴藉由所述管道與所述氣體發生裝置連通。所述第一氣浴用於吹送氣體,且所述第一氣浴吹送氣體的方向可調節。當氣體流經第一氣浴時,所述第一氣浴可使流經所述第一氣浴的氣體變為高速氣體。Specifically, in this embodiment, the gas regulating unit only has a first gas bath. The first gas bath communicates with the gas generating device through the pipe. The first gas bath is used for blowing gas, and the blowing direction of the first gas bath can be adjusted. When the gas flows through the first gas bath, the first gas bath can change the gas flowing through the first gas bath into a high-velocity gas.
本實施例中,所述第一氣浴與實施例一中的第一氣浴結構相同,功能相似,在此不再贅述。In this embodiment, the first gas bath has the same structure and functions as the first gas bath in the first embodiment, and will not be repeated here.
實施例三Example three
本實施例提供一種氣浴裝置。本實施例中的氣浴裝置與實施例二中的氣浴裝置的區別在於,所述第一氣浴不相同。This embodiment provides a gas bath device. The difference between the gas bath device in this embodiment and the gas bath device in the second embodiment is that the first gas bath is different.
具體的,本實施例中,所述第一氣浴包括第一氣浴本體、第一調整機構和第一端板。所述第一氣浴本體具有一中空的腔體,所述第一氣浴本體的腔體與所述管道連通。所述第一調整機構用於驅動所述第一氣浴本體轉動。所述第一氣浴本體與所述第一端板固定連接。所述第一端板上設置有至少一個通孔,氣體可從所述通孔中流通。其中,所述第一氣浴本體的腔體與所述管道連通處為所述第一氣浴的進氣口,所述第一端板(上的通孔)為所述第一氣浴的排氣口。Specifically, in this embodiment, the first gas bath includes a first gas bath body, a first adjustment mechanism and a first end plate. The first gas bath body has a hollow cavity, and the cavity of the first gas bath body communicates with the pipe. The first adjustment mechanism is used to drive the first gas bath body to rotate. The first gas bath body is fixedly connected with the first end plate. At least one through hole is provided on the first end plate, and gas can flow through the through hole. Wherein, the connection between the cavity of the first gas bath body and the pipeline is the air inlet of the first gas bath, and the first end plate (the through hole on the upper part) is the air inlet of the first gas bath. exhaust vent.
由於所述第一調整機構可用於驅動所述第一氣浴本體轉動,因此可間接驅動與所述第一氣浴本體固定連接的第一端板轉動,從而可調節所述第一端板的位置,進而調節所述第一氣浴吹送氣體的方向。即本實施例中,所述第一氣浴中的第一調整機構驅動第一氣浴本體轉動,並且由於所述第一氣浴本體和第一端板固定連接,因此無需設置第一連接件連接第一氣浴本體和第一端板。Since the first adjustment mechanism can be used to drive the first gas bath body to rotate, it can indirectly drive the first end plate fixedly connected to the first gas bath body to rotate, so that the first end plate can be adjusted. Position, and adjust the direction in which the first gas bath blows the gas. That is, in this embodiment, the first adjustment mechanism in the first gas bath drives the first gas bath body to rotate, and because the first gas bath body and the first end plate are fixedly connected, there is no need to provide a first connecting piece Connect the first gas bath body and the first end plate.
實施例四Example four
本實施例提供一種氣浴裝置。本實施例中的氣浴裝置與實施例一中的氣浴裝置的區別在於,所述氣浴裝置的氣體調節單元不相同。This embodiment provides a gas bath device. The difference between the gas bath device in this embodiment and the gas bath device in the first embodiment is that the gas adjustment units of the gas bath device are different.
本實施例中,所述氣體調節單元包括第一氣浴和第二氣浴。所述第一氣浴和第二氣浴均藉由管道與所述供氣單元連通,所述第一氣浴和第二氣浴分別用於吹送氣體。其中,所述第一氣浴吹送氣體的方向可調節。In this embodiment, the gas regulating unit includes a first gas bath and a second gas bath. The first gas bath and the second gas bath are both connected to the gas supply unit through a pipe, and the first gas bath and the second gas bath are respectively used for blowing gas. Wherein, the blowing direction of the first gas bath can be adjusted.
具體的,所述第一氣浴和第二氣浴並排設置,且所述第一氣浴和第二氣浴的進氣口均與所述管道連通,經過所述氣體溫度控制裝置的氣體可從所述第一氣浴和第二氣浴的進氣口進入第一氣浴和第二氣浴的腔體中,並從所述第一氣浴和第二氣浴的排氣口吹出。所述第一氣浴和第二氣浴可調節氣體的速度,以使所述第一氣浴吹送的氣體為高速氣體,所述第二氣浴吹送的氣體為低速氣體。Specifically, the first gas bath and the second gas bath are arranged side by side, and the air inlets of the first gas bath and the second gas bath are both connected to the pipeline, and the gas passing through the gas temperature control device can be It enters into the cavity of the first gas bath and the second gas bath from the air inlets of the first gas bath and the second gas bath, and blows out from the air outlets of the first gas bath and the second gas bath. The gas speed of the first gas bath and the second gas bath can be adjusted so that the gas blown by the first gas bath is a high-speed gas and the gas blown by the second gas bath is a low-speed gas.
所述第一氣浴包括第一氣浴本體、第一調整機構、第一端板和第一連接件。The first gas bath includes a first gas bath body, a first adjustment mechanism, a first end plate and a first connecting member.
所述第一氣浴本體具有一中空的腔體,所述第一氣浴本體的腔體與所述管道連通。所述第一調整機構設置在所述第一氣浴本體的腔體內,所述第一調整機構與所述第一端板連接,所述第一調整機構用於驅動所述第一端板轉動。所述第一連接件用於撓性連接所述第一氣浴本體和所述第一端板。所述第一端板上設置有至少一個通孔,氣體可從所述通孔中流通。其中,所述第一氣浴本體的腔體與所述管道連通處為所述第一氣浴的進氣口,所述第一端板(上的通孔)為所述第一氣浴的排氣口。The first gas bath body has a hollow cavity, and the cavity of the first gas bath body communicates with the pipe. The first adjustment mechanism is arranged in the cavity of the first gas bath body, the first adjustment mechanism is connected to the first end plate, and the first adjustment mechanism is used to drive the first end plate to rotate . The first connecting member is used to flexibly connect the first gas bath body and the first end plate. At least one through hole is provided on the first end plate, and gas can flow through the through hole. Wherein, the connection between the cavity of the first gas bath body and the pipeline is the air inlet of the first gas bath, and the first end plate (the through hole on the upper part) is the air inlet of the first gas bath. exhaust vent.
所述第二氣浴包括第二氣浴本體和第二端板。所述第二氣浴本體具有一中空的腔體,所述第二氣浴本體的腔體與所述管道連通。所述第二端板上設置有至少一個通孔,氣體可從所述通孔中流過。所述第二端板固定設置在所述第二氣浴本體上。其中,所述第二氣浴本體的腔體與所述管道連通處為所述第二氣浴的進氣口,所述第二端板(上的通孔)為所述第二氣浴的排氣口。所述第二氣浴本體的內腔的形狀和大小從所述第二氣浴的進氣端到所述第二氣浴本體與所述第二端板連接的一端依次變化,以使進入所述第二氣浴本體的內腔中的氣體在內腔的作用下以預定的風速吹出,例如以較低的速度吹出。The second gas bath includes a second gas bath body and a second end plate. The second gas bath body has a hollow cavity, and the cavity of the second gas bath body communicates with the pipe. At least one through hole is provided on the second end plate, and gas can flow through the through hole. The second end plate is fixedly arranged on the second gas bath body. Wherein, the connection between the cavity of the second gas bath body and the pipe is the air inlet of the second gas bath, and the second end plate (the through hole on the upper part) is the air inlet of the second gas bath. exhaust vent. The shape and size of the inner cavity of the second gas bath body changes sequentially from the inlet end of the second gas bath to the end where the second gas bath body is connected to the second end plate, so that the The gas in the inner cavity of the second gas bath body is blown out at a predetermined wind speed under the action of the inner cavity, for example, blown out at a relatively low speed.
在其他的實施例中,所述氣體調節單元僅包括第一氣浴和第三氣浴。所述第一氣浴和第三氣浴均藉由管道與所述供氣單元連通,所述第一氣浴和第三氣浴分別用於吹送氣體。其中,所述第一氣浴吹送氣體的方向可調節。所述第三氣浴與所述第一氣浴的連接關係,以及所述第三氣浴的結構與作用與本實施例中的第二氣浴相同,在此不再贅述。In other embodiments, the gas regulating unit only includes a first gas bath and a third gas bath. The first gas bath and the third gas bath are both connected with the gas supply unit through a pipe, and the first gas bath and the third gas bath are respectively used for blowing gas. Wherein, the blowing direction of the first gas bath can be adjusted. The connection relationship between the third gas bath and the first gas bath, and the structure and function of the third gas bath are the same as those of the second gas bath in this embodiment, and will not be repeated here.
實施例五Example five
本實施例提供一種氣浴裝置。本實施例中的氣浴裝置與實施例四中的氣浴裝置的區別在於,所述氣浴裝置的第二氣浴不相同,所述第二氣浴吹送氣體的方向也可調節。This embodiment provides a gas bath device. The difference between the gas bath device in this embodiment and the gas bath device in the fourth embodiment is that the second gas bath of the gas bath device is different, and the blowing direction of the second gas bath can also be adjusted.
本實施例中,所述第二氣浴包括第二氣浴本體、第二調整機構、第二端板和第二連接件。In this embodiment, the second gas bath includes a second gas bath body, a second adjustment mechanism, a second end plate and a second connecting member.
所述第二氣浴本體具有一中空的腔體,所述第二氣浴本體的腔體與所述管道連通。所述第二調整機構設置在所述第二氣浴本體的腔體內,所述第二調整機構與所述第二端板連接,所述第二調整機構用於驅動所述第二端板轉動。所述第二連接件用於撓性連接所述第二氣浴本體和所述第二端板。所述第二端板上設置有至少一個通孔,氣體可從所述通孔中流通。其中,所述第二氣浴本體的腔體與所述管道連通處為所述第二氣浴的進氣口,所述第二端板(上的通孔)為所述第二氣浴的排氣口。The second gas bath body has a hollow cavity, and the cavity of the second gas bath body communicates with the pipe. The second adjustment mechanism is arranged in the cavity of the second gas bath body, the second adjustment mechanism is connected with the second end plate, and the second adjustment mechanism is used to drive the second end plate to rotate . The second connecting member is used to flexibly connect the second gas bath body and the second end plate. At least one through hole is provided on the second end plate, and gas can flow through the through hole. Wherein, the connection between the cavity of the second gas bath body and the pipe is the air inlet of the second gas bath, and the second end plate (the through hole on the upper part) is the air inlet of the second gas bath. exhaust vent.
控制單元控制氣體調節單元中的第一氣浴和第二氣浴即時調節吹送氣體的方向,以使吹送氣體的方向隨著運動件位置的變化而即時變化。The control unit controls the first gas bath and the second gas bath in the gas adjustment unit to instantly adjust the direction of the blowing gas, so that the direction of the blowing gas changes instantly with the change of the position of the moving part.
實施例六Example Six
本實施例提供一種氣浴裝置。本實施例中的氣浴裝置與實施例一中的氣浴裝置的區別在於,所述氣浴裝置的氣體調節單元不相同。This embodiment provides a gas bath device. The difference between the gas bath device in this embodiment and the gas bath device in the first embodiment is that the gas adjustment units of the gas bath device are different.
本實施例中,所述氣體調節單元包括第一氣浴和第二氣浴,以及調整機構。所述第一氣浴和第二氣浴均藉由管道與所述供氣單元連通,所述第一氣浴和第二氣浴分別用於吹送氣體。其中,所述第一氣浴和所述第二氣浴吹送氣體的方向可同時調節。所述第一氣浴和第二氣浴連接,所述調整機構用於驅動所述第一氣浴和第二氣浴轉動。控制單元控制氣體調節單元中的調整機構同時即時調節第一氣浴和第二氣浴吹送氣體的方向,以使吹送氣體的方向隨著運動件位置的變化而即時變化。In this embodiment, the gas adjustment unit includes a first gas bath and a second gas bath, and an adjustment mechanism. The first gas bath and the second gas bath are both connected to the gas supply unit through a pipe, and the first gas bath and the second gas bath are respectively used for blowing gas. Wherein, the blowing direction of the first gas bath and the second gas bath can be adjusted simultaneously. The first gas bath and the second gas bath are connected, and the adjustment mechanism is used to drive the first gas bath and the second gas bath to rotate. The control unit controls the adjustment mechanism in the gas adjustment unit to simultaneously adjust the blowing direction of the first gas bath and the second gas bath in real time, so that the blowing direction of the gas changes instantly as the position of the moving part changes.
具體的,所述第一氣浴和第二氣浴並排設置,且所述第一氣浴和第二氣浴的進氣口均與所述管道連通,經過所述氣體溫度控制裝置的氣體可從所述第一氣浴和第二氣浴的進氣口進入第一氣浴和第二氣浴的腔體中,並從所述第一氣浴和第二氣浴的排氣口吹出。所述第一氣浴和第二氣浴可調節氣體的速度,以使所述第一氣浴吹送的氣體為高速氣體,所述第二氣浴吹送的氣體為低速氣體。Specifically, the first gas bath and the second gas bath are arranged side by side, and the air inlets of the first gas bath and the second gas bath are both connected to the pipeline, and the gas passing through the gas temperature control device can be It enters into the cavity of the first gas bath and the second gas bath from the air inlets of the first gas bath and the second gas bath, and blows out from the air outlets of the first gas bath and the second gas bath. The gas speed of the first gas bath and the second gas bath can be adjusted so that the gas blown by the first gas bath is a high-speed gas and the gas blown by the second gas bath is a low-speed gas.
所述第一氣浴包括第一氣浴本體和第一端板。所述第一氣浴本體具有一中空的腔體,所述第一氣浴本體的腔體與所述管道連通。所述第一氣浴本體與所述第一端板固定連接。所述第一端板上設置有至少一個通孔,氣體可從所述通孔中流通。其中,所述第一氣浴本體的腔體與所述管道連通處為所述第一氣浴的進氣口,所述第一端板(上的通孔)為所述第一氣浴的排氣口。The first gas bath includes a first gas bath body and a first end plate. The first gas bath body has a hollow cavity, and the cavity of the first gas bath body communicates with the pipe. The first gas bath body is fixedly connected with the first end plate. At least one through hole is provided on the first end plate, and gas can flow through the through hole. Wherein, the connection between the cavity of the first gas bath body and the pipeline is the air inlet of the first gas bath, and the first end plate (the through hole on the upper part) is the air inlet of the first gas bath. exhaust vent.
所述第二氣浴包括第二氣浴本體和第二端板。所述第二氣浴本體具有一中空的腔體,所述第二氣浴本體的腔體與所述管道連通。所述第二氣浴本體與所述第二端板固定連接。所述第二端板上設置有至少一個通孔,氣體可從所述通孔中流通。其中,所述第二氣浴本體的腔體與所述管道連通處為所述第二氣浴的進氣口,所述第二端板(上的通孔)為所述第二氣浴的排氣口。The second gas bath includes a second gas bath body and a second end plate. The second gas bath body has a hollow cavity, and the cavity of the second gas bath body communicates with the pipe. The second gas bath body is fixedly connected with the second end plate. At least one through hole is provided on the second end plate, and gas can flow through the through hole. Wherein, the connection between the cavity of the second gas bath body and the pipe is the air inlet of the second gas bath, and the second end plate (the through hole on the upper part) is the air inlet of the second gas bath. exhaust vent.
由於所述調整機構可用於驅動所述第一氣浴和第二氣浴同時轉動,因此可間接驅動與所述第一氣浴本體和第二氣浴本體固定連接的第一端板和第二端板轉動,從而可調節所述第一端板和第二端板的位置,進而調節所述第一氣浴和所述第二氣浴吹送氣體的方向。Since the adjustment mechanism can be used to drive the first gas bath and the second gas bath to rotate at the same time, it can indirectly drive the first end plate and the second end plate fixedly connected to the first gas bath body and the second gas bath body. The end plate rotates, so that the positions of the first end plate and the second end plate can be adjusted, and the direction in which the first gas bath and the second gas bath blow gas can be adjusted.
實施例七Example Seven
本實施例提供一種氣浴裝置。本實施例中的氣浴裝置與實施例一中的氣浴裝置的區別在於,所述氣浴裝置的第二氣浴不相同。This embodiment provides a gas bath device. The difference between the gas bath device in this embodiment and the gas bath device in the first embodiment is that the second gas bath of the gas bath device is different.
本實施例中,所述第二氣浴的結構和功能與所述第一氣浴的結構和功能相似,即可藉由第二氣浴中的第二調整機構調節所述第二端板轉動,進而改變所述第二氣浴吹送氣體的方向。In this embodiment, the structure and function of the second gas bath are similar to those of the first gas bath, and the rotation of the second end plate can be adjusted by the second adjustment mechanism in the second gas bath. , And then change the direction of the second gas bath blowing gas.
在其他的實施例中,所述第三氣浴結構和功能與所述第一氣浴的結構和功能相似,即可藉由第三氣浴中的第三調整機構調節所述第三端板轉動,進而改變所述第三氣浴吹送氣體的方向。也可以是第二氣浴和第三氣浴中的任一個與所述第一氣浴的結構和功能相似。In other embodiments, the structure and function of the third gas bath are similar to those of the first gas bath, and the third end plate can be adjusted by the third adjustment mechanism in the third gas bath. Rotate to change the direction in which the third gas bath blows gas. It is also possible that any one of the second gas bath and the third gas bath is similar in structure and function to the first gas bath.
實施例八Example eight
本實施例提供一種氣浴裝置。本實施例中的氣浴裝置與實施例一中的氣浴裝置的區別在於,所述氣體調節單元的結構不相同。This embodiment provides a gas bath device. The difference between the gas bath device in this embodiment and the gas bath device in the first embodiment is that the structure of the gas conditioning unit is different.
所述氣體調節單元包括第一氣浴、第二氣浴、第三氣浴以及調整機構。所述第一氣浴、第二氣浴和第三氣浴均藉由所述管道與所述供氣單元連通。所述第一氣浴、第二氣浴和第三氣浴分別用於吹送氣體。所述調整機構用於在控制單元的控制下驅動所述第一氣浴、第二氣浴、第三氣浴同時轉動,以調節所述第一氣浴、第二氣浴和第三氣浴吹送氣體的方向。The gas adjustment unit includes a first gas bath, a second gas bath, a third gas bath, and an adjustment mechanism. The first gas bath, the second gas bath and the third gas bath are all connected with the gas supply unit through the pipe. The first gas bath, the second gas bath and the third gas bath are respectively used for blowing gas. The adjustment mechanism is used to drive the first gas bath, the second gas bath, and the third gas bath to rotate simultaneously under the control of the control unit to adjust the first gas bath, the second gas bath and the third gas bath The direction of blowing gas.
實施例九Example 9
本實施例提供一種光刻機,所述光刻機包括上述實施例中的任一種氣浴裝置。This embodiment provides a lithography machine, which includes any one of the gas bath devices in the above embodiments.
上述描述僅是對本發明較佳實施例的描述,並非對本發明範圍的任何限定,所屬技術領域具有通常知識者根據上述揭示內容做的任何變更、修飾,均屬申請專利範圍的保護範圍。The above description is only a description of the preferred embodiments of the present invention and does not limit the scope of the present invention in any way. Any changes or modifications made by those with ordinary knowledge in the technical field based on the above disclosure are within the protection scope of the patent application.
110:平面光柵尺 120:主基板 130:光柵尺讀頭 140:運動台 210:氣體發生裝置 220:氣體過濾淨化裝置 230:氣體溫度控制裝置 240:管道 300:氣體調節單元 310:第一氣浴 311:第一氣浴本體 312:第一調整機構 313:第一端板 314:第一連接件 320:第二氣浴 330:第三氣浴 410:運動台框架 420:運動台 430:平面光柵尺 450:主基板 510:抽氣裝置 520:排氣裝置 610:第一位置 620:第二位置 630:第三位置 640:第四位置 710:整機控制器 720:運動件控制器 730:氣浴調整機構控制器 740:同步控制器 750:運動件110: Flat grating ruler 120: main substrate 130: grating ruler reading head 140: sports table 210: Gas generating device 220: Gas filtration and purification device 230: Gas temperature control device 240: pipeline 300: Gas conditioning unit 310: First gas bath 311: The first gas bath body 312: The first adjustment mechanism 313: first end plate 314: The first connector 320: second gas bath 330: The Third Gas Bath 410: Sports table frame 420: sports table 430: Flat grating ruler 450: main substrate 510: air extraction device 520: Exhaust device 610: first position 620: second position 630: third position 640: fourth position 710: Whole machine controller 720: Motion controller 730: Gas bath adjustment mechanism controller 740: Synchronous controller 750: moving parts
第1圖是格柵導向板的結構示意圖; 第2圖是包括光柵尺測量系統的光刻機的結構示意圖; 第3圖是本發明實施例一中氣浴裝置的主視圖; 第4圖是第3圖中的氣浴裝置的俯視圖; 第5圖是本發明實施例一中氣體調節單元的結構示意圖; 第6圖是本發明實施例一中第一氣浴的結構示意圖; 第7圖是本發明實施例一中第一氣浴中第一端板的結構示意圖; 第8圖是本發明實施例一中氣浴裝置的控制單元的結構方塊圖; 第9圖是本發明實施例一中運動台在兩列氣體調節單元之間的結構示意圖; 第10圖是本發明實施例一中運動台在兩列氣體調節單元之間偏向X正向一側的結構示意圖; 第11圖是本發明實施例一中運動台在兩列氣體調節單元之間偏向X負向一側的結構示意圖; 第12圖是本發明實施例一中運動台不同位置處光柵尺讀頭的風速示意圖。Figure 1 is a schematic diagram of the structure of the grille guide plate; Figure 2 is a schematic diagram of the structure of a lithography machine including a grating ruler measurement system; Figure 3 is a front view of the gas bath device in the first embodiment of the present invention; Figure 4 is a top view of the gas bath device in Figure 3; Figure 5 is a schematic structural diagram of a gas regulating unit in the first embodiment of the present invention; Figure 6 is a schematic diagram of the structure of the first gas bath in the first embodiment of the present invention; Figure 7 is a schematic structural diagram of the first end plate in the first gas bath in the first embodiment of the present invention; Figure 8 is a structural block diagram of the control unit of the gas bath device in the first embodiment of the present invention; Figure 9 is a schematic diagram of the structure of the exercise table between two rows of gas regulating units in the first embodiment of the present invention; Figure 10 is a schematic structural diagram of the exercise table in the first embodiment of the present invention that is biased toward the positive X side between two rows of gas regulating units; Figure 11 is a schematic structural diagram of the exercise table in the first embodiment of the present invention, which is biased to the negative X side between two rows of gas regulating units; Figure 12 is a schematic diagram of the wind speed of the grating ruler reading head at different positions of the moving platform in the first embodiment of the present invention.
210:氣體發生裝置 210: Gas generating device
220:氣體過濾淨化裝置 220: Gas filtration and purification device
230:氣體溫度控制裝置 230: Gas temperature control device
240:管道 240: pipeline
300:氣體調節單元 300: Gas conditioning unit
410:運動台框架 410: Sports table frame
420:運動台 420: sports table
430:平面光柵尺 430: Flat grating ruler
450:主基板 450: main substrate
510:抽氣裝置 510: air extraction device
520:排氣裝置 520: Exhaust device
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JP6883655B2 (en) * | 2017-02-03 | 2021-06-09 | エーエスエムエル ネザーランズ ビー.ブイ. | Exposure device |
JP6811119B2 (en) * | 2017-03-01 | 2021-01-13 | 株式会社Screenホールディングス | Exposure equipment, substrate processing equipment, substrate exposure method and substrate processing method |
JP6894281B2 (en) * | 2017-04-12 | 2021-06-30 | 株式会社Screenホールディングス | Exposure equipment, substrate processing equipment, substrate exposure method and substrate processing method |
CN109634061B (en) * | 2017-10-09 | 2020-11-27 | 上海微电子装备(集团)股份有限公司 | Substrate transfer device, substrate transfer method and lithographic apparatus |
CN207408742U (en) * | 2017-11-15 | 2018-05-25 | 上海微电子装备(集团)股份有限公司 | Mask cooling device and photoetching equipment |
CN109405226A (en) * | 2018-10-26 | 2019-03-01 | 美的集团武汉制冷设备有限公司 | Air conditioner and its control method, device and computer readable storage medium |
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2019
- 2019-04-17 CN CN201910310384.XA patent/CN111830790A/en active Pending
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2020
- 2020-04-17 TW TW109112968A patent/TWI751532B/en active
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Publication number | Publication date |
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TWI751532B (en) | 2022-01-01 |
CN111830790A (en) | 2020-10-27 |
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