CN110239832B - 基板收纳容器的锁止解除机构 - Google Patents
基板收纳容器的锁止解除机构 Download PDFInfo
- Publication number
- CN110239832B CN110239832B CN201810788930.6A CN201810788930A CN110239832B CN 110239832 B CN110239832 B CN 110239832B CN 201810788930 A CN201810788930 A CN 201810788930A CN 110239832 B CN110239832 B CN 110239832B
- Authority
- CN
- China
- Prior art keywords
- lock release
- locking
- sliding
- storage container
- substrate storage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D55/00—Accessories for container closures not otherwise provided for
- B65D55/02—Locking devices; Means for discouraging or indicating unauthorised opening or removal of closure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-042615 | 2018-03-09 | ||
JP2018042615A JP6952627B2 (ja) | 2018-03-09 | 2018-03-09 | 基板収納容器のロック解除機構 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110239832A CN110239832A (zh) | 2019-09-17 |
CN110239832B true CN110239832B (zh) | 2021-04-20 |
Family
ID=67764173
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810788930.6A Active CN110239832B (zh) | 2018-03-09 | 2018-07-18 | 基板收纳容器的锁止解除机构 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6952627B2 (ja) |
KR (1) | KR102148565B1 (ja) |
CN (1) | CN110239832B (ja) |
TW (1) | TWI662642B (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI772886B (zh) * | 2020-09-11 | 2022-08-01 | 樂華科技股份有限公司 | 智慧堆疊機構之解鎖裝置及其方法 |
CN116666275B (zh) * | 2023-07-25 | 2023-10-27 | 宁波润华全芯微电子设备有限公司 | 一种盘盖组件 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4674939A (en) * | 1984-07-30 | 1987-06-23 | Asyst Technologies | Sealed standard interface apparatus |
US4582219A (en) * | 1985-02-20 | 1986-04-15 | Empak, Inc. | Storage box having resilient fastening means |
JP3089590B2 (ja) * | 1991-07-12 | 2000-09-18 | キヤノン株式会社 | 板状物収納容器およびその蓋開口装置 |
DE19535178C2 (de) * | 1995-09-22 | 2001-07-19 | Jenoptik Jena Gmbh | Einrichtung zum Ver- und Entriegeln einer Tür eines Behälters |
JP3796782B2 (ja) * | 1995-11-13 | 2006-07-12 | アシスト シンコー株式会社 | 機械的インターフェイス装置 |
JP3954287B2 (ja) * | 1999-06-28 | 2007-08-08 | 東京エレクトロン株式会社 | ウェハキャリア用蓋体の着脱装置 |
KR100403663B1 (ko) * | 1999-07-14 | 2003-10-30 | 동경 엘렉트론 주식회사 | 피처리체 수용 박스의 개폐 덮개의 개폐 장치 및피처리체의 처리 시스템 |
JP3941359B2 (ja) * | 2000-08-23 | 2007-07-04 | 東京エレクトロン株式会社 | 被処理体の処理システム |
JP3766615B2 (ja) * | 2001-07-27 | 2006-04-12 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
JP3933921B2 (ja) * | 2001-12-04 | 2007-06-20 | Tdk株式会社 | 半導体ウェーハ保管用クリーンボックスパージ装置 |
JP4189178B2 (ja) * | 2002-07-15 | 2008-12-03 | アキレス株式会社 | 半導体ウェハー収納容器 |
JP2004115872A (ja) * | 2002-09-26 | 2004-04-15 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板処理方法 |
US7578392B2 (en) * | 2003-06-06 | 2009-08-25 | Convey Incorporated | Integrated circuit wafer packaging system and method |
JP2006339619A (ja) * | 2005-05-31 | 2006-12-14 | Dan-Takuma Technologies Inc | 手動式smifオプナー |
JP4851445B2 (ja) * | 2005-05-31 | 2012-01-11 | 三甲株式会社 | 薄板搬送容器の開閉構造 |
JP5365160B2 (ja) * | 2008-11-25 | 2013-12-11 | 住友化学株式会社 | 有害生物防除用組成物及び有害生物の防除方法 |
JP4748816B2 (ja) * | 2008-11-28 | 2011-08-17 | Tdk株式会社 | 密閉容器の蓋開閉システム |
US8813964B2 (en) * | 2009-08-26 | 2014-08-26 | Texchem Advanced Products Incorporated Sdn. Bhd. | Wafer container with recessed latch |
JP2014012032A (ja) * | 2012-07-03 | 2014-01-23 | Senju Sprinkler Kk | 予作動式流水検知装置 |
JP6084019B2 (ja) * | 2012-11-28 | 2017-02-22 | 信越ポリマー株式会社 | 基板収納容器用の蓋体及び基板収納容器 |
CN107112269A (zh) * | 2014-12-08 | 2017-08-29 | 恩特格里斯公司 | 用于衬底容置的具有整体拐角弹簧的水平衬底容器 |
CN205609490U (zh) * | 2016-05-09 | 2016-09-28 | 中勤实业股份有限公司 | 闩锁机构及具有该闩锁机构的晶圆盒 |
-
2018
- 2018-03-09 JP JP2018042615A patent/JP6952627B2/ja active Active
- 2018-07-13 KR KR1020180081621A patent/KR102148565B1/ko active IP Right Grant
- 2018-07-18 CN CN201810788930.6A patent/CN110239832B/zh active Active
- 2018-08-07 TW TW107127356A patent/TWI662642B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN110239832A (zh) | 2019-09-17 |
TW201939645A (zh) | 2019-10-01 |
JP2019160894A (ja) | 2019-09-19 |
KR20190106627A (ko) | 2019-09-18 |
JP6952627B2 (ja) | 2021-10-20 |
TWI662642B (zh) | 2019-06-11 |
KR102148565B1 (ko) | 2020-08-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN216120258U (zh) | 夹持机构以及具有其的暂存装置和晶圆盒开盒*** | |
CN110239832B (zh) | 基板收纳容器的锁止解除机构 | |
JP6275835B2 (ja) | 部品装着機 | |
US20190308220A1 (en) | Automatic labeling production line for solid state disk | |
US9378995B2 (en) | Port door positioning apparatus and associated methods | |
JP2665419B2 (ja) | 電気部品用接続器 | |
EP1195807A1 (en) | Open/close device for open/close lid of untreated object storing box and treating system for untreated object | |
JP3227997U (ja) | ロードポート装置 | |
US6431806B1 (en) | Adapter device for carrier pods containing at least one flat object in an ultraclean atmosphere | |
US11881377B2 (en) | Automated multi-grid handling apparatus | |
JP2003159686A (ja) | 把持装置及び搬送装置 | |
US20060045663A1 (en) | Load port with manual FOUP door opening mechanism | |
JP7285084B2 (ja) | ケース支持装置およびケース支持方法 | |
JPH0723068Y2 (ja) | ワーク搬送装置 | |
CN220514226U (zh) | 芯片联动定位装置及芯片处理装置 | |
CN115122067B (zh) | 电子卡组装装置 | |
CN112407714B (zh) | 一种自动取料装置 | |
CN219435837U (zh) | 一种用于电路板载具的开合盖装置 | |
EP3785912B1 (en) | Clam shell lamination system | |
CN118025801B (zh) | 光刻板传送装备及传送方法 | |
CN219074832U (zh) | 治具拆装夹设备 | |
JP2020123626A (ja) | ケース支持装置およびケース支持方法 | |
TWI798597B (zh) | 絲網裝載系統 | |
CN211661457U (zh) | 自动装配设备 | |
CN116946691A (zh) | 供料设备 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |