CN110239832B - 基板收纳容器的锁止解除机构 - Google Patents

基板收纳容器的锁止解除机构 Download PDF

Info

Publication number
CN110239832B
CN110239832B CN201810788930.6A CN201810788930A CN110239832B CN 110239832 B CN110239832 B CN 110239832B CN 201810788930 A CN201810788930 A CN 201810788930A CN 110239832 B CN110239832 B CN 110239832B
Authority
CN
China
Prior art keywords
lock release
locking
sliding
storage container
substrate storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201810788930.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN110239832A (zh
Inventor
森田泰史
滨田浩三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JEL Corp
Original Assignee
JEL Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JEL Corp filed Critical JEL Corp
Publication of CN110239832A publication Critical patent/CN110239832A/zh
Application granted granted Critical
Publication of CN110239832B publication Critical patent/CN110239832B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D55/00Accessories for container closures not otherwise provided for
    • B65D55/02Locking devices; Means for discouraging or indicating unauthorised opening or removal of closure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67259Position monitoring, e.g. misposition detection or presence detection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
CN201810788930.6A 2018-03-09 2018-07-18 基板收纳容器的锁止解除机构 Active CN110239832B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-042615 2018-03-09
JP2018042615A JP6952627B2 (ja) 2018-03-09 2018-03-09 基板収納容器のロック解除機構

Publications (2)

Publication Number Publication Date
CN110239832A CN110239832A (zh) 2019-09-17
CN110239832B true CN110239832B (zh) 2021-04-20

Family

ID=67764173

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810788930.6A Active CN110239832B (zh) 2018-03-09 2018-07-18 基板收纳容器的锁止解除机构

Country Status (4)

Country Link
JP (1) JP6952627B2 (ja)
KR (1) KR102148565B1 (ja)
CN (1) CN110239832B (ja)
TW (1) TWI662642B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI772886B (zh) * 2020-09-11 2022-08-01 樂華科技股份有限公司 智慧堆疊機構之解鎖裝置及其方法
CN116666275B (zh) * 2023-07-25 2023-10-27 宁波润华全芯微电子设备有限公司 一种盘盖组件

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4674939A (en) * 1984-07-30 1987-06-23 Asyst Technologies Sealed standard interface apparatus
US4582219A (en) * 1985-02-20 1986-04-15 Empak, Inc. Storage box having resilient fastening means
JP3089590B2 (ja) * 1991-07-12 2000-09-18 キヤノン株式会社 板状物収納容器およびその蓋開口装置
DE19535178C2 (de) * 1995-09-22 2001-07-19 Jenoptik Jena Gmbh Einrichtung zum Ver- und Entriegeln einer Tür eines Behälters
JP3796782B2 (ja) * 1995-11-13 2006-07-12 アシスト シンコー株式会社 機械的インターフェイス装置
JP3954287B2 (ja) * 1999-06-28 2007-08-08 東京エレクトロン株式会社 ウェハキャリア用蓋体の着脱装置
KR100403663B1 (ko) * 1999-07-14 2003-10-30 동경 엘렉트론 주식회사 피처리체 수용 박스의 개폐 덮개의 개폐 장치 및피처리체의 처리 시스템
JP3941359B2 (ja) * 2000-08-23 2007-07-04 東京エレクトロン株式会社 被処理体の処理システム
JP3766615B2 (ja) * 2001-07-27 2006-04-12 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP3933921B2 (ja) * 2001-12-04 2007-06-20 Tdk株式会社 半導体ウェーハ保管用クリーンボックスパージ装置
JP4189178B2 (ja) * 2002-07-15 2008-12-03 アキレス株式会社 半導体ウェハー収納容器
JP2004115872A (ja) * 2002-09-26 2004-04-15 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
US7578392B2 (en) * 2003-06-06 2009-08-25 Convey Incorporated Integrated circuit wafer packaging system and method
JP2006339619A (ja) * 2005-05-31 2006-12-14 Dan-Takuma Technologies Inc 手動式smifオプナー
JP4851445B2 (ja) * 2005-05-31 2012-01-11 三甲株式会社 薄板搬送容器の開閉構造
JP5365160B2 (ja) * 2008-11-25 2013-12-11 住友化学株式会社 有害生物防除用組成物及び有害生物の防除方法
JP4748816B2 (ja) * 2008-11-28 2011-08-17 Tdk株式会社 密閉容器の蓋開閉システム
US8813964B2 (en) * 2009-08-26 2014-08-26 Texchem Advanced Products Incorporated Sdn. Bhd. Wafer container with recessed latch
JP2014012032A (ja) * 2012-07-03 2014-01-23 Senju Sprinkler Kk 予作動式流水検知装置
JP6084019B2 (ja) * 2012-11-28 2017-02-22 信越ポリマー株式会社 基板収納容器用の蓋体及び基板収納容器
CN107112269A (zh) * 2014-12-08 2017-08-29 恩特格里斯公司 用于衬底容置的具有整体拐角弹簧的水平衬底容器
CN205609490U (zh) * 2016-05-09 2016-09-28 中勤实业股份有限公司 闩锁机构及具有该闩锁机构的晶圆盒

Also Published As

Publication number Publication date
CN110239832A (zh) 2019-09-17
TW201939645A (zh) 2019-10-01
JP2019160894A (ja) 2019-09-19
KR20190106627A (ko) 2019-09-18
JP6952627B2 (ja) 2021-10-20
TWI662642B (zh) 2019-06-11
KR102148565B1 (ko) 2020-08-26

Similar Documents

Publication Publication Date Title
CN216120258U (zh) 夹持机构以及具有其的暂存装置和晶圆盒开盒***
CN110239832B (zh) 基板收纳容器的锁止解除机构
JP6275835B2 (ja) 部品装着機
US20190308220A1 (en) Automatic labeling production line for solid state disk
US9378995B2 (en) Port door positioning apparatus and associated methods
JP2665419B2 (ja) 電気部品用接続器
EP1195807A1 (en) Open/close device for open/close lid of untreated object storing box and treating system for untreated object
JP3227997U (ja) ロードポート装置
US6431806B1 (en) Adapter device for carrier pods containing at least one flat object in an ultraclean atmosphere
US11881377B2 (en) Automated multi-grid handling apparatus
JP2003159686A (ja) 把持装置及び搬送装置
US20060045663A1 (en) Load port with manual FOUP door opening mechanism
JP7285084B2 (ja) ケース支持装置およびケース支持方法
JPH0723068Y2 (ja) ワーク搬送装置
CN220514226U (zh) 芯片联动定位装置及芯片处理装置
CN115122067B (zh) 电子卡组装装置
CN112407714B (zh) 一种自动取料装置
CN219435837U (zh) 一种用于电路板载具的开合盖装置
EP3785912B1 (en) Clam shell lamination system
CN118025801B (zh) 光刻板传送装备及传送方法
CN219074832U (zh) 治具拆装夹设备
JP2020123626A (ja) ケース支持装置およびケース支持方法
TWI798597B (zh) 絲網裝載系統
CN211661457U (zh) 自动装配设备
CN116946691A (zh) 供料设备

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant