CN104392675A - 显示装置基板及其制造方法 - Google Patents

显示装置基板及其制造方法 Download PDF

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CN104392675A
CN104392675A CN201410673729.5A CN201410673729A CN104392675A CN 104392675 A CN104392675 A CN 104392675A CN 201410673729 A CN201410673729 A CN 201410673729A CN 104392675 A CN104392675 A CN 104392675A
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substrate body
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substrate
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林佳桦
蔡志鸿
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AU Optronics Corp
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Abstract

本发明是提供一种显示装置基板及其制造方法。该显示装置基板包含一基板本体及多个信号线路。该基板本体具有一承载面；该承载面包含一可视区及位于该可视区一侧的一信号电路区。该些信号线路设置于该承载面上，并位于该信号电路区。该信号电路区形成有多个气孔贯穿该基板本体，且该些气孔不被该些信号线路所遮蔽。在制造过程中，基板本体设置于透光载板上。当以高能量光线通过该透光载板蚀刻基板本体的底面，以使基板本体与透光载板分离时，气孔可供产生的气体排出。该显示装置基板具有较低的形变量。

Description

显示装置基板及其制造方法
技术领域
本发明涉及一种显示装置基板；具体而言，本发明涉及一种超薄显示装置基板。
背景技术
显示装置广泛应用在电脑、电视、通信装置等各种电子产品中，并随产业技术的进步以及生活需求而有轻薄化及轻量化的趋势。除了通常具有的平面结构外，现今的显示面板更可具有弯曲或可挠的形态，以配合多样的显示器的设计或开发显示器的应用。其中显示器本身可即是主角，而附加有文书处理、通信、以及数据储存等功能。
就可挠性显示面板/显示器的制造而言，一般先形成或裁切柔性可挠基材(利用涂布方式制作可挠式基材于整板玻璃上，无须裁切)，再于其上设置电路、发光材料、及/或光源等元件。然而，单可挠性基材本身可能因其材料特性而不适于工艺中的高温步骤，因此通常需辅以非柔性的板材作为柔性可挠基板的载板。之后待工艺完成后，再以高能量激光进行柔性可挠基材与载板的分离。然而，分离过程中伴随高能量激光而来的热效应及气体生成会使基材产生形变。此形变可能改变扇出区(fan-out area)焊垫的间距，增加后续工艺的难度。
发明内容
本发明的目的在于提供一种显示装置基板，具有较低的形变量。
本发明的目的在于提供一种显示装置基板制造方法，可改善成品的形变量，提高成品良率。
本发明的显示装置基板包含一基板本体及多个信号线路。该基板本体具有一承载面。该承载面包含一可视区及位于该可视区一侧的一信号电路区。该些信号线路设置于该承载面上，并位于该信号电路区。该信号电路区形成有多个气孔贯穿该基板本体，且该些气孔不被该些信号线路所遮蔽。
本发明的显示装置基板制造方法，包含步骤(a)将一基板本体设置于一透光载板上；其中，该基板本体具有相对的一底面及一承载面，该底面贴附该透光载板，该承载面包含一可视区及位于该可视区一侧的一信号电路区；步骤(b)于该信号电路区上设置多个信号线路；步骤(c)于该信号电路区形成多个气孔贯穿该基板本体，且该些气孔不被该些信号线路所遮蔽；步骤(d)以高能量光线通过该透光载板蚀刻该底面，使该基板本体与该透光载板分离。
附图说明
图1所示为本发明显示装置基板实施例的俯视图；
图2所示为图1所示实施例的部分立体图；
图3所示为图2所示实施例沿AA的部分剖视示意图；
图4所示为本发明显示装置基板实施例的仰视图；
图5所示为本发明显示装置基板制造方法的流程图；
图6～7所示为本发明显示装置基板制造流程的示意图。
附图标记说明：
[本发明]
10 显示装置基板
100 基板本体
150 承载面
160 底面
200 可视区
300 信号电路区
350 信号线路
360 气孔
380 焊垫
400 透光载板
500 牺牲层
610 薄膜晶体管阵列
620 有机膜层
630 包覆层
S 刻痕
D 间距
W 直径
P 气体
A 空间
具体实施方式
本发明的显示装置基板，如图1～2所示，包含基板本体100及多个信号线路350。该基板本体100具有承载面150，且该些信号线路设置于承载面150。反之，基板本体100相对于承载面150的一侧另有底面160。详细来说，基板本体100可为塑性材料，且较佳为柔性并可挠；以较佳实施例而言，基板本体100可以是塑胶薄膜的形态。基板本体的材料例如为聚酰亚胺(Polyimide，PI)。此外，显示装置基板10可以是例如液晶显示器(LCD)显示模块的基板、有机发光显示器(OLED)的基板，但不限于此。
基板本体100的承载面350包含可视区200及信号电路区300，其中信号电路区300可至少部分为扇出区(fan-out area)及/或晶片接合区(ICbonding)。晶片设置于扇出区的方式包含COG(chip on glass)、COF(chipon film)等各种方式。前述多个信号线路350位于信号电路区300。较佳而言，多个信号线路350于信号电路区300形成至少一丛集。以图1～2所示实施例为例，多个信号线路350于信号电路区300形成五个丛集，并于各丛集内以特定形态分布。丛集内的多条信号线路350例如是朝向接点/焊垫380延伸同时收敛而构成似梯形或似扇形的线路丛集。
信号电路区300可依傍于可视区200的一侧，且通常沿可视区200的侧边分布。在其他实施例中，可视区200亦可能不仅一侧有信号电路区300。
承载面350的可视区200进一步包含电极及/或驱动元件如薄膜晶体管(TFT)、液晶、发光材料，及/或彩色滤光片。信号电路区300的信号电路350可与可视区200的电极及/或驱动元件电连接；此外，显示模块的驱动电路如驱动晶片(IC)可接合于基板本体100上信号电路区300的信号电路350。
信号电路区300进一步形成多个贯穿基板本体100的气孔360，如图3～4所示。换句话说，气孔360开口于承载面150及底面160，且较佳具有5～100微米(μm)的深度，而与基板本体100的厚度大致相当。其中，可以例如激光切割或冲压(punch)等钻孔技术于基板本体100形成孔直径W较佳不小于1微米，及/或形成孔间距D较佳不小于1微米的多个气孔360。另一方面，该些气孔360至少不完全被信号电路区300的信号线路350遮蔽，例如可形成于相邻信号线路350之间。在本发明实施例中，该些气孔360中至少部分气孔360位于相邻信号线路350之间。当多个信号线路350于信号电路区300形成如上述丛集，例如为扇形的线路丛集，该些分布于丛集内相邻信号线路350间的气孔360亦可能呈现扇形分布。
如上述，基板本体100相对于承载面150的一侧另有底面160。较佳而言，底面160进一步形成有刻痕S。该些刻痕S可为高能量光线如激光造成的刻痕。再者，该些刻痕S较佳分布于底面160的一部分，且该部分底面160与对侧承载面150的信号电路区300对应。贯穿基板本体100、且开口于承载面150及底面160的气孔360进一步开口于承载面150的信号电路区300以及底面160上与信号电路区300对应的该部分。该些气孔360在底面上的开口是为刻痕S所围绕。
在本发明实施例中，气孔360及刻痕S可为显示装置基板10成形过程中所形成、或遗留下来。进一步而言，气孔360为显示装置基板10于分离工艺所需要的结构，其功能在于做为气体逸散的通道。刻痕S则是分离工艺中，以高能激光光进行分离造成的痕迹。以下进一步介绍显示装置基板10的制造方法。
如图5所示实施例，本发明显示装置基板10的制造方法可包含步骤510，将一基板本体设置于一透光载板上；其中，该基板本体具有相对的一底面及一承载面，该底面贴附该透光载板，该承载面包含一可视区及位于该可视区一侧的一信号电路区。
由于显示装置基板10的基板本体100为柔性且通常不耐高温，一载板是提供来协助进行显示装置基板10的制造。该载板较佳透光，例如为玻璃载板；分离工艺中并得以使用光能。此外，基板本体100更可直接形成于该载板，如图6所示的透光载板400。举例来说，可于透光载板400涂布基板本体100的材料而成形。
成形的基板本体100有底面160以及朝外的一面。底面160贴附于透光载板400的表面，朝外的该面作为承载面150，如图6(b)所示。承载面150有所区分，且较佳至少区分有可视区200及信号电路区300。
另一方面，步骤510较佳还包含于透光载板上设置牺牲层500(请参考图7)或阻水层。牺牲层可直接形成于透光载板，例如于透光载板上涂布牺牲层的材料，如无机材料而成形之。牺牲层设置于基板本体及透光载板之间；换句话说，在设置完牺牲层之后，设置基板本体于牺牲层上，较佳并以其相对两面分别贴触透光载板及基板本体。牺牲层可以是分离工艺的一种消耗品，缓解基板本体于分离工艺中的损失。
本发明显示装置基板10的制造方法还包含步骤520，于该信号电路区上设置多个信号线路。
较佳而言，步骤520进一步包含于承载面150形成电极及/或驱动元件。在本发明较佳实施例中，如图6(c)所示，是于承载面150形成薄膜晶体管阵列610，其中包含进一步将薄膜晶体管阵列610的多个信号线路设置于信号电路区300。较佳而言，多个信号线路350于信号电路区300形成至少一丛集。多个信号线路350并于该至少一丛集内以特定形态分布，例如朝向接点/焊垫380延伸同时收敛而构成似梯形或似扇形的线路丛集。
此外，本发明显示装置基板10的制造方法可还包含于承载面150设置例如液晶、发光材料、滤光片，及/或包覆层。以图3所示实施例为例，在本发明较佳实施例中，是于承载面150进一步设置有机发光材料，例如以气或液相沉积、涂布等方式形成有机膜层620；此外，较佳于有机膜层以外形成包覆层630(thin film encapsulation)。如此制成的显示装置基板10可作为有机发光显示器(OLED)的基板。
本发明显示装置基板10的制造方法还包含步骤530，于该信号电路区形成多个气孔贯穿或几乎贯穿该基板本体，且该些气孔不被该些信号线路所遮蔽。当基板本体及透光载板之间设置有牺牲层，该些气孔较佳进一步贯穿牺牲层。其中，可以例如激光切割或冲压(punch)等钻孔技术于基板本体100形成孔直径较佳不小于1微米，及/或形成孔间距较佳不小于1微米的多个气孔360。以图6所示实施例为例，步骤530是自基板本体100背向透光载板400的一侧，即承载面150进行钻孔。进一步而言，钻孔是于承载面150的信号电路区300进行(也可从玻璃背面钻孔)，且避开该些信号线路350，并较佳作用及于承载面150与基板本体100的界面，确保贯穿基板本体100的气孔360的形成。气孔360可位于相邻信号线路350间的间隙。当多个信号线路350于信号电路区300形成丛集，例如为扇形的线路丛集，形成其间的气孔360亦可能随之呈现扇形分布。
本发明显示装置基板10的制造方法还包含步骤540，以高能量光线通过该透光载板蚀刻该底面，使该基板本体与该透光载板分离。步骤540又可称为分离工艺。在本发明较佳实施例中，该高能光线可为激光光，例如紫外线激光光。请同时参考图6(e)及图7，高能光线E可自透光载板400背向基板本体100的一侧入射透光载板400。高能光线E的能量可穿入透光载板400，且较佳抵达透光载板400与基板本体100的界面。
进一步而言，高能光线E可入射至少部分的透光载板400，且该部分透光载板400上的基板本体100部分的对侧包含承载面150的信号电路区300。因此，高能光线E穿入透光载板400，且能抵达信号电路区300对侧的底面160部分。高能光线E可分解、或破坏基板本体100与透光载板400贴合的底面160，解除基板本体100与透光载板400的贴合，使两者得相分离；此过程亦通常伴随热及气体P的产生。此外，高能量亦可能于底面160因其扫描路径产生刻痕。
产生的气体P可来自于基板本体100的分解、及/或汽化，且例如为碳族类的气体分子。该气体P先发生于基板本体100及透光载板400之间，且得经气孔360逸散离开基板本体100与透光载板400之间的空间A。基板本体100，尤其是具有信号电路区300的部分因此较难因小空间A内气体P及热的加乘效果发生形变。具体而言，该形变例如为基板本体100受到来自透光载板400方向的压力及热力产生的膨胀形变。
另一方面，当基板本体及透光载板之间设置有牺牲层，高能光线E可自透光载板400背向牺牲层500的一侧入射透光载板400。高能光线E的能量可穿入透光载板400，且较佳抵达透光载板400与牺牲层500的界面。高能光线E可分解或破坏牺牲层500，从而解除基板本体100与透光载板400的连接，使两者得相分离。藉此并缓解基板本体100于分离工艺中的损失。
相较于现有信号电路区300上焊垫间的间距(pitch)因基板本体100形变所造成的变异量，基板本体100的气孔360将该变异量减小(因尺寸同会使该数值变动)。本发明分离工艺对于基板本体100及其上元件的改善，改善其后工艺的困难度，并提升显示装置基板成品的良率。
另一方面，在本发明较佳实施例中，高能光线E可于信号电路区300的延伸方向(即其长边)入射透光载板400而使该延伸方向上的基板本体100部分同时与透光载板400发生分离。此外，激光光可同时于信号电路区300的宽边方向上进行扫描。依循激光光的走向，如图7所示，基板本体100于信号电路区300的部分大致依信号电路区300的宽边方向分离。
如图4所示，高能光线E蚀刻的刻痕S于底面160围绕着气孔360，其中底面160有刻痕S的部分反映高能光线E是作用于该处。因此，高能光线E是作用于气孔360附近、气孔360周围的基板本体100部分，使得该部分的基板本体100汽化产生的气体分子得经由气孔360逸散出来。
如图6(f)所示，在步骤540之后，基板本体100可轻易与透光载板400分离，完成显示装置基板10的制造。或者，在步骤540之后，举例来说，可于基板本体100/显示装置基板10进行驱动电路的设置。
本发明已由上述相关实施例加以描述，然而上述实施例仅为实施本发明的范例。必需指出的是，已公开的实施例并未限制本发明的范围。相反地，包含于权利要求的精神及范围的修改及均等设置均包含于本发明的范围内。

Claims (11)

1.一种显示装置基板，包含：
一基板本体，具有一承载面；其中，该承载面包含一可视区及位于该可视区一侧的一信号电路区；以及
多个信号线路，设置于该承载面上，并位于该信号电路区；
其中，该信号电路区形成有多个气孔贯穿该基板本体，且该些气孔至少不完全被该些信号线路所遮蔽。
2.如权利要求1所述的显示装置基板，其中该些气孔的至少部分位于相邻的该些信号线路之间。
3.如权利要求2所述的显示装置基板，其中该些信号线路形成扇形排列，位于该些信号线路间的该些气孔亦形成扇形分布。
4.如权利要求1所述的显示装置基板，其中该基板本体具有与该承载面相对的一底面，该底面上分布有激光蚀刻的刻痕。
5.如权利要求4所述的显示装置基板，其中该些气孔于该底面上的开口被该些刻痕所围绕。
6.如权利要求1所述的显示装置基板，其中该些气孔的孔直径不小于1μm。
7.如权利要求1所述的显示装置基板，其中该些气孔间的间距不小于1μm。
8.一种显示装置基板制造方法，包含下列步骤：
(a)将一基板本体设置于一透光载板上；其中，该基板本体具有相对的一底面及一承载面，该底面贴附该透光载板，该承载面包含一可视区及位于该可视区一侧的一信号电路区；
(b)于该信号电路区上设置多个信号线路；
(c)于该信号电路区形成多个气孔贯穿该基板本体，且该些气孔不被该些信号线路所遮蔽；
(d)以激光通过该透光载板蚀刻该底面，使该基板本体与该透光载板分离。
9.如权利要求8所述的显示装置基板制造方法，进一步包含：
(e)于该基板本体与该透光载板分离后，于该信号电路区设置驱动电路。
10.如权利要求9所述的显示模块制造基板方法，其中步骤(c)包含：
形成至少部分该些气孔于该些信号线之间。
11.如权利要求8所述的显示装置基板制造方法，进一步包含：
将一牺牲层设置于该透光载板上，以及将该基板本体设置于设置有该牺牲层的该透光载板上。
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110012602A (zh) * 2019-05-20 2019-07-12 无锡市方舟科技电子有限公司 一种反贴式数码管及其贴装方法
CN110908202A (zh) * 2019-06-13 2020-03-24 友达光电股份有限公司 显示面板及其制作方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI561325B (en) * 2014-08-01 2016-12-11 Au Optronics Corp Display module manufacturing method and display module
DE102019112472B3 (de) * 2019-05-13 2020-08-13 Lpkf Laser & Electronics Ag Verfahren zur Herstellung eines ein Trägersubstrat aufweisenden Displays sowie ein nach diesem Verfahren hergestelltes Trägersubstrat
KR20210153676A (ko) 2019-05-13 2021-12-17 엘피케이에프 레이저 앤드 일렉트로닉스 악티엔게젤샤프트 캐리어 기판을 구비하는 디스플레이를 제조하기 위한 방법, 이 방법에 따라 제조된 캐리어 기판, 그리고 유연한 디스플레이를 위해 의도된 커버 유리
EP4139255A1 (de) 2020-07-28 2023-03-01 LPKF Laser & Electronics AG Substrat aus glas und ein verfahren zu seiner herstellung

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201876643U (zh) * 2010-11-22 2011-06-22 京东方科技集团股份有限公司 阵列基板和液晶显示面板
JP2011198769A (ja) * 2011-06-15 2011-10-06 Mitsubishi Electric Corp 面状光源装置および表示装置
US20120293866A1 (en) * 2011-05-17 2012-11-22 Lg Display Co., Ltd. Stereoscopic Image Display Device Using Pattern Retarder Method and Method for Fabricating the Same
CN102890351A (zh) * 2011-07-18 2013-01-23 乐金显示有限公司 制造柔性显示装置的方法
CN103266310A (zh) * 2013-05-24 2013-08-28 上海和辉光电有限公司 分散板及具有该分散板的镀膜装置
US20140003022A1 (en) * 2012-06-29 2014-01-02 Byung-Jun Lee Flat panel display device
CN103811395A (zh) * 2012-11-14 2014-05-21 乐金显示有限公司 柔性显示装置的制造方法
CN103985823A (zh) * 2013-02-07 2014-08-13 三星显示有限公司 柔性显示装置以及用于制造柔性显示装置的方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5867236A (en) * 1996-05-21 1999-02-02 Rainbow Displays, Inc. Construction and sealing of tiled, flat-panel displays
CN1155911C (zh) 2000-09-26 2004-06-30 洋华光电股份有限公司 触控面板的制造方法
US7867791B2 (en) * 2005-07-29 2011-01-11 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device using multiple mask layers formed through use of an exposure mask that transmits light at a plurality of intensities
TWI379409B (en) * 2006-09-29 2012-12-11 Semiconductor Energy Lab Method for manufacturing semiconductor device
TWI365518B (en) * 2008-11-06 2012-06-01 Powertech Technology Inc Leadless semiconductor package and its assembly for improving heat dissipation
TWI486259B (zh) * 2010-12-27 2015-06-01 Au Optronics Corp 可撓式基板結構及其製作方法
TWI423739B (zh) * 2011-09-23 2014-01-11 Au Optronics Corp 可撓式基板結構之製造方法
CN102522420A (zh) 2011-11-16 2012-06-27 友达光电股份有限公司 具可挠性基板的显示装置及其制造方法
TWI428243B (zh) 2011-12-23 2014-03-01 Ind Tech Res Inst 可撓式元件的取下方法
JP5938313B2 (ja) * 2012-09-14 2016-06-22 ホシデン株式会社 剥離テープ及びそれを備えた液晶パネル、液晶モジュール
KR102015400B1 (ko) * 2012-11-29 2019-10-22 삼성디스플레이 주식회사 캐리어 기판의 박리 장치, 캐리어 기판의 박리 방법 및 표시 장치의 제조 방법
CN103337500B (zh) 2013-05-24 2015-12-23 友达光电股份有限公司 主动元件阵列基板及其制造方法
JP2015108765A (ja) * 2013-12-05 2015-06-11 パナソニック液晶ディスプレイ株式会社 表示装置
TWI518405B (zh) 2014-01-24 2016-01-21 友達光電股份有限公司 顯示面板及其製作方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201876643U (zh) * 2010-11-22 2011-06-22 京东方科技集团股份有限公司 阵列基板和液晶显示面板
US20120293866A1 (en) * 2011-05-17 2012-11-22 Lg Display Co., Ltd. Stereoscopic Image Display Device Using Pattern Retarder Method and Method for Fabricating the Same
JP2011198769A (ja) * 2011-06-15 2011-10-06 Mitsubishi Electric Corp 面状光源装置および表示装置
CN102890351A (zh) * 2011-07-18 2013-01-23 乐金显示有限公司 制造柔性显示装置的方法
US20140003022A1 (en) * 2012-06-29 2014-01-02 Byung-Jun Lee Flat panel display device
CN103811395A (zh) * 2012-11-14 2014-05-21 乐金显示有限公司 柔性显示装置的制造方法
CN103985823A (zh) * 2013-02-07 2014-08-13 三星显示有限公司 柔性显示装置以及用于制造柔性显示装置的方法
CN103266310A (zh) * 2013-05-24 2013-08-28 上海和辉光电有限公司 分散板及具有该分散板的镀膜装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110012602A (zh) * 2019-05-20 2019-07-12 无锡市方舟科技电子有限公司 一种反贴式数码管及其贴装方法
CN110908202A (zh) * 2019-06-13 2020-03-24 友达光电股份有限公司 显示面板及其制作方法
CN110908202B (zh) * 2019-06-13 2022-08-26 友达光电股份有限公司 显示面板及其制作方法

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