CN101584044B - 集成电路封装体和用于在集成电路封装体中散热的方法 - Google Patents

集成电路封装体和用于在集成电路封装体中散热的方法 Download PDF

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CN101584044B
CN101584044B CN200680056609.4A CN200680056609A CN101584044B CN 101584044 B CN101584044 B CN 101584044B CN 200680056609 A CN200680056609 A CN 200680056609A CN 101584044 B CN101584044 B CN 101584044B
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radiating element
substrate
tube core
face
opening
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CN101584044A (zh
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K·H·S·蔡
B·恩乔曼
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Avago Technologies International Sales Pte Ltd
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Abstract

一种适合用于表面安装布置的IC封装体包括在IC管芯之下耦接到封装体底部的散热器件。将散热器件耦接到封装体的底部降低或者消除了如下的可能性：散热器件的放置将导致模塑料在散热器件之上渗出和在散热器件的底脚处分层，模塑料在散热器件的底脚处分层会导致封装体分层或者“爆玉米花”。

Description

集成电路封装体和用于在集成电路封装体中散热的方法
技术领域
本发明涉及集成电路(IC)。更具体地，本发明涉及用于在IC封装体中散热的方法和装置。 
背景技术
对于意图用作表面安装器件的被封装的IC器件，用于在封装体中散热的当前技术包括使用耦接到IC器件顶部的散热器件。图1示出了位于顶部模板(mold plate)3和底部模板4之间的被封装的IC器件2的侧面截面图。IC封装体2具有管芯(die)5，该管芯5被管芯附着材料6附着到引线框11的衬底8的管芯附着区7。在管芯5上的焊盘(未示出)通过电导体(例如金线)9连接到封装体2的引线框11。散热器件12在位于管芯5之上的封装体2的顶部上延伸并且具有通过附着材料附着到引线框11上的底脚(footing)。散热器件12通过模塑料(molding compound)13而与管芯5分开。当模塑料13固化时，其凝固并且将散热器件12固定在图1描述的位置。 
必须在封装体模制(mold)(即，密封)之前将散热器件12精确地放置于IC器件2的顶部上。如果在执行模制工艺时没有将散热器件12精确安放在器件2上，模塑料13可能渗出或者流动(即，流到散热器件12之上)。过多的模渗出(mold bleed)可能妨碍IC器件2的散热性能。另外，在合模(moldclamping)期间，存在着模夹钳将压到散热器件12上的可能性，这可能导致在散热器件12的底脚处分层(delamination)。接下来湿气可能被困于散热器件12的底脚附近的分层区域中，其又可能导致“爆玉米花(pop corn)”。“爆玉米花”会导致对IC器件2的机械损伤并且妨碍其正确地操作。 
图2示出了表示用于封装图1所示IC器件并且准备将其经由SMT安装到印刷电路板(PCB)上的当前组装工艺的流程图。如块21所指出的，具有许多IC管芯的晶片(wafer)经历背面研磨(back grind)工艺，在该背面研磨工艺期间该晶片被减薄。减薄晶片减小了最终IC封装体的尺寸并且降低了最终IC封装体的热阻。然后将该晶片切割成独立的管芯，如块22所指出的。然后在管芯附着工艺期间，用附着膏剂将该管芯附着到引线框衬底上，如块23所指出的。然后固化管芯附着膏剂，如块24所指出的。接下来在引线结合工艺期间将该管芯的焊盘结合到引线框的导体上，如块25所指出的。接下来附着该散热器件，如块26所指出的。附着该散热器件包括在引线框上的特定位置处放置附着材料，并且将该散热器件精确地安放于该管芯之上，使得散热器件的支柱的足部与该附着材料接触。接下来固化该附着材料，如块27所指出的，该附着材料将该散热器件的支柱的足部固定到引线框上。接下来该IC器件经历模制工艺，如块28所指出的。 
在执行了模制工艺后，该封装体通常经历激光标记工艺，其用一些标记(例如零件名称和零件号)来标记该封装体，如块29所指出的。接下来该封装体经历模制后固化工艺，如块31所指出的。当用于SMT中时，接下来该封装引线框通常经历焊球安装工艺，如块32所指出的，其将焊球放置在引线框上，随后将使用该焊球来将引线框焊接到PCB。然后执行切单(singulation)工艺，如块33所指出的，其将IC封装体的引线框与其它的引线框分离，所述其它的引线框意图连接到其它的类似IC器件以形成其它类似IC封装体。该IC封装引线框现在已经准备好在随后的安装工艺(未示出)期间经由焊接连接到PCB。 
如上所述，如果该散热器件在模制工艺(块8)开始前没有被精确安放，则在模制工艺期间该模塑料(例如，树脂)可能渗出或者流动，其可能妨碍该封装体的散热性能。施加在该散热器件上的夹紧力(clamp force)也可能导致在散热器件的底脚上的分层，其可能导致在以后某个时间(例如在焊球安装回流期间或者在其已经安装到PCB后)“爆玉米花”。 
已经被提出来防止该问题的另一种技术是使用具有高热导率的模塑料。使用高热导率的模塑料可以改善该器件的热性能。然而，使用该模塑料通常导致在模制工艺期间出现的高度的引线倾斜(sway)和高度的封装体翘曲(warp)。例如在将IC器件安装到PCB期间，高度的翘曲将导致诸如球短路(ball short)的处理困难。该技术没有完全成熟并且没有在IC制造工业中被广泛采用。 
因此，需要一种避免了诸如模渗出、分层、高度的引线变形(sweep) 和最终IC封装体的高度翘曲的问题的将散热器件与IC器件合并的方法。 
发明内容
本发明提供了一种IC封装体和用于在IC封装体中散热的方法。该IC封装体包括衬底、IC管芯和散热器件。该衬底具有顶面和底面以及形成于其中的开口。该IC管芯具有顶面和底面。该管芯的顶面具有一个或多个置于其上的导电焊盘。该散热器件的顶面耦接到底面并且基本上覆盖所述形成在衬底中的开口并且耦接或者邻近于管芯的底面。 
根据一个实施例，该方法包括在管芯放置位置处的衬底中形成开口，并且将散热器件的顶面耦接到邻近于该开口的衬底的底面。 
根据另一实施例，该方法包括：在管芯放置位置处的衬底中形成开口；用粘性带状材料覆盖该开口和该衬底的至少一部分底面；在用粘性带状材料覆盖开口和衬底的底面之后，移除该带状材料；并且将散热器件的顶面放置为与在该衬底的底面上的粘性材料接触，使得当该粘性材料固化时，该散热器件的顶面耦接到该衬底的底面。 
本发明的这些和其它的特征和优点将在下面的描述、附图和权利要求中变得显而易见。 
附图说明
图1示出了公知IC器件的侧面截面图，该IC器件在组装工艺期间位于顶部模板与底部模板之间并且具有附着到其顶部的散热器件。 
图2示出了表示用于产生图1所示IC封装体并且准备将其经由SMT安装到PCB上的当前组装工艺的流程图。 
图3示出了根据具有耦接到其底部的散热器件的本发明示例性实施例的、被封装的IC器件的侧面截面图。 
图4示出了表示根据用于封装IC并且准备将其经由SMT安装到PCB上的示例性实施例的、本发明的组装工艺的流程图。 
图5示出了表示根据用于在衬底中形成开口并且将散热器件耦接到开口之下的衬底的底面的一个示例性实施例的、本发明的工艺的流程图。 
图6示出了根据本发明示例性实施例的、表示组装工艺的流程图， 该组装工艺用于封装IC器件并且准备将其经由SMT安装到PCB上。 
图7示出了表示根据一个用于预先胶带粘附(pre-tape)衬底的底面并且在衬底中形成开口的示例性实施例的、本发明的工艺的流程图。 
具体实施方式
根据本发明，适合用于表面安装布置的IC封装体包括耦接到IC管芯下面的该封装体的底部的散热器件。将该散热器件固定到封装体的底部减少或者消除了如下的可能性：散热器件的放置将导致模塑料在散热器件之上渗出或者在该散热器件底脚处分层，模塑料在散热器件之上渗出或者在该散热器件底脚处分层会导致封装体“爆玉米花”。可以在执行模制工艺之前或者之后将散热器件耦接到封装体，如现在将参考本发明的几个示例性实施例所描述的。 
图3示出了根据要经历模制工艺的示例性实施例的IC封装体30的截面图。封装体30与图1所示的封装体2的相似之处在于它包括通过管芯附着材料32耦接到引线框36的衬底34上的管芯31以及通过电导体(例如金线)35连接到引线框36的导体(未示出)的焊盘(未示出)。引线框36的衬底34用作绝缘层用于使管芯31与引线框36的导体绝缘。根据本发明，封装体30包括耦接到封装体30的底部的散热器件40。 
根据这个实施例，在邻近管芯31执行模制工艺之前的某个时间耦接散热器件40。衬底34具有形成于其中的位于封装体30底部的开口，并且在区域50内管芯31与散热器件40接触，其中管芯31与散热器件40在该开***界。 
散热器件40的外部41通过一些附着器件或材料(未示出)耦接到引线框36以提供用于散热的从管芯31至引线框36的热路径。顶部模板43的内表面与模塑料45接触，其与管芯31和封装体30的其它部分接触。底部模板44的内表面未与模塑料45接触，但是与散热器件40和封装体30的其它部分接触。在模制工艺期间，底部模板44的内表面被成形为与散热器件40的底面和邻接模板44内表面的封装体30的其它部分的形状匹配。因此，散热器件40的放置不会影响模塑料45并且因此不会导致模渗出。 
图4示出了表示根据用于封装IC并且准备将其经由SMT安装到PCB上的示例性实施例的、本发明的组装工艺的流程图。图4所示的流程图除了去掉了图2中与耦接散热器件和固化附着材料有关的块26和块27之外，其 余与图2所示的流程图相同。这是因为根据本发明的该实施例，在执行组装工艺之前耦接该散热器件。图4所示的块51-55分别对应于图2所示的块21-25。同样，图4所示的块58-63分别对应于图2所示的块28-33。 
图5示出了表示根据用于在IC器件的衬底中形成开口并且将散热器件耦接到开口之下的衬底的底面的一个示例性实施例的、本发明的工艺的流程图。如块70所指出的，开口形成在管芯放置位置处的该IC器件的底部上的IC器件的衬底中。这可以在晶片级或者管芯级执行。如果作为图4所表示的组装工艺的一部分来执行块70所表示的工艺，则会例如在对应于块51的背面研磨工艺执行后但是在块52表示的切片工艺执行之前形成开口。可替代地，例如可以在执行块55所表示的引线结合工艺之后但是在执行块58所表示的模制工艺之前形成开口。关于何时形成开口，本发明没有限制。 
在衬底中形成了开口之后，散热器件耦接到衬底的底面，如块80所指出的。通常通过在衬底的底面上和/或在散热器件的顶面上放置例如粘性膜的附着材料来完成此步骤。然后将该散热器件的顶面邻接该衬底的底面放置并且固化该附着材料，从而将该散热器件的顶面结合到该衬底的底面。 
如果作为图4所表示的封装工艺的一部分来执行块80所表示的工艺，则将例如在执行块55所表示的引线结合工艺之后但是在执行块58所表示的模制工艺之前耦接散热器件。关于何时耦接散热器件，本发明没有限制。然而，如果在执行图4所表示的组装工艺之前或者在执行该组装工艺期间但是在执行模制工艺之前耦接该散热器件，则模渗出发生的可能性将大大减小或者完全消除。该散热器件可以被精确地放置在衬底的底面上并且在执行模制工艺之前通过粘性膜耦接。接下来，在块53和54所表示的管芯附着工艺期间，该管芯通过形成在衬底中的开口直接耦接到该散热器件的顶面。 
无论何时耦接该散热器件，相比于图1所描述的散热器件位于管芯之上时的从管芯到散热器件的热路径长度，根据本发明将该散热器件置于管芯的下方将大大减小从管芯到散热器件的热路径长度。虽然期望将从管芯到散热器件的热路径长度减到最小，但是该管芯无需直接位于散热器件的顶面上。相反，开口的尺寸可以稍微小于该管芯的尺寸使得该管芯位于该衬底的顶面上并且与该散热器件的顶面分开等于开口形成处的衬底的厚度的距离。在后一种情况中，可以将高热导率的材料置于该开口中并且与管芯的底面和散热器件的顶 面接触。与图1所描述的散热器件位于管芯之上时的热路径长度相比，这两个布置大大减小了从管芯到位于管芯下方的散热器件的热路径长度。 
还应当注意，无需在耦接散热器件之前形成开口。可以在开口形成于衬底中之前耦接该散热器件。这样，块70和80的顺序可以与图5中所描述的顺序相反。 
图6示出了根据本发明示例性实施例的、表现组装工艺的流程图，该组装工艺用于封装IC器件并且准备将其经由SMT安装到PCB上。图6所示的流程图除了加入了表示去除带状去除物的工艺的块59并且加入了表示耦接该散热器件的工艺与固化该附着材料的块82和83之外与图4所示的流程图是相同的。这是因为，根据本发明的该实施例，在执行模制工艺之后并且优选在执行切单工艺之后耦接该散热器件。根据该实施例，通过使用粘性带状材料盖住(laminate)衬底34的底面来对衬底34的底面进行预先胶带粘附。使用粘性带状材料是有利的，因为其允许在模制工艺(块58)之前将管芯直接附着到带状材料。可以在晶片级或者在管芯级执行该预先胶带粘附工艺。关于何时对衬底进行预先胶带粘附，本发明没有限制。 
在执行了块58所表示的模制工艺后，如块59所指出的，移除该带状材料，在衬底的底面和管芯上留下粘性材料。在执行了块64所表示的切单工艺后，如块82所指出的，放置散热器件的顶面与位于衬底的底面和管芯上的粘性材料相接触。然后，如块83所指出的，固化该粘性附着材料，其将散热器件耦接到衬底上。关于何时执行块59、82和83所表示的步骤，本发明没有限制。通过在执行模制工艺后执行这些步骤，减小或者消除了模渗出发生的可能性。 
图7示出了表示根据一个用于预先胶带粘附衬底的底面并且在衬底中形成开口的示例性实施例的、本发明的工艺的流程图。如块110所指出的，开口形成在IC器件的底部上的IC器件的衬底中。该开口形成在管芯放置位置处。可以在组装工艺之前的晶片级或者在封装组装工艺期间的管芯级形成该开口。当在衬底中形成开口时，该管芯可以已经附着到衬底上或者可以未附着到衬底上。例如，可以在执行了对应于块51的背面研磨工艺之后，但是在执行块52所表示的切片工艺之前，形成该开口。可替代地，可以例如在执行了块55所表示的引线结合工艺之后，但是在执行块58所表示的模制工艺之前形成开口。关于何时形成开口，本发明没有限制。 
在衬底中形成开口之后，如块120所指出的，将粘性带状材料放置 于衬底的底面上。应当注意，无需在执行预先胶带粘附工艺之前形成该开口。可以在执行预先胶带粘附工艺之后形成该开口。这样，块110和120的顺序可以与图7中描述的顺序相反。 
应当注意的是，出于说明本发明的原理和概念的目的，已经参考几个示例性实施例描述了本发明。本发明不限于这些实施例。可以对在此描述的实施例进行修改，并且所有这样的修改都在本发明的范围内。 

Claims (1)

1.一种用于在集成电路IC封装体中散热的方法，所述方法包括：
在管芯放置位置处的衬底中形成开口；
用粘性带状材料覆盖所述开口和所述衬底的底面的至少一部分；
执行管芯附着工艺；
执行结合工艺，其中在结合工艺期间，一个或多个导体的第一末端连接到管芯的顶面上的一个或多个导电焊盘，并且所述一个或多个导体的第二末端连接到所述衬底位于其中的引线框的一个或多个导电引线；以及
执行模制工艺，其中在模制工艺期间，用模塑料至少覆盖所述管芯的顶面和所述一个或多个导体，并且使用一个或多个模板来模制所述模塑料，
在执行模制工艺之后，去除所述带状材料，其中去除所述带状材料在所述衬底的底面的至少一部分上留有粘性材料；
将散热器件的顶面放置为与所述衬底的底面上的所述粘性材料相接触，使得当所述粘性材料固化时，所述散热器件的顶面耦接到所述衬底的底面；
其中在管芯附着工艺期间，IC管芯的底面的一部分越过所述开口耦接到衬底的顶面，使得所述管芯的底面的另一部分被置于所述散热器件的顶面之上的所述开口上。
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CN101584044A (zh) 2009-11-18
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