CN101416305B - 具有集成通孔散热器引脚的模制半导体封装 - Google Patents
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Abstract
提供一种用于制造基于引线框架的过模制半导体封装(77)的方法和装置,其中所述封装具有暴露焊盘或功率管芯标记(70),所述暴露焊盘或功率管芯标记(70)具有多个集成的THT散热器引脚(71),该散热器引脚被配置为***在印刷电路板(78)中形成的一个或多个过孔(77)中。该***式散热器引脚(71)可以形成为所述暴露焊盘(52)的一体化组成部分或可与所述暴露焊盘(62)牢固地连接。
Description
发明背景
技术领域
本发明涉及基于引线框架的半导体封装及其制造方法。一方面,本发明涉及一种基于引线框架的具有暴露焊盘的过模制半导体封装,在该封装内以及在该封装和印刷电路板或者任何其它基板材料的完成的组装中,都具有改进的电热路径。
背景技术
具有暴露焊盘的半导体封装(例如PQFN,QFN,HSOP,SOIC,QFP,TQFP,MO-188等)在封装中提供热路径,以从集成电路管芯向印刷电路板(PCB)导热。在PCB组装后,通过PCB的热过孔引导目标热路径中的最高热阻值,该热过孔引导通过PCB到PCB背面上,在所述PCB背面有大面积的铜板用作散热片。热路径的热阻率还能够通过典型的组装问题诸如焊料空穴而增加。如在美国专利申请公开2005/0110137中所示,传统的散热方法中并未涉及由PCB的热过孔所产生的高热阻率问题。
因此,需要一种减小目标热路径中的热阻值的半导体封装装置和工艺。此外,需要一种减小从管芯附接焊盘到封装外部的热路径的封装器件和方法。还需要一种避免在封装工艺(packaging process)期间对与典型的组装问题相关的工艺和性能的限制的器件封装。此外,还需要改进的半导体工艺和器件来克服如上所述现有技术中存在的问题。对本领域技术人员而言,在参考下面的附图和具体说明,看了本申请剩余部分之后,传统工艺和技术的限制和缺陷将变得明显。
附图说明
当结合下面附图考虑下列详细说明时,可以理解本发明,同时,可以获得本发明的许多目标,特征和优势。
图1示出具有集成THT散热器引脚的暴露焊盘体结构的示例体结构的底部的对角视图。
图2示出具有单个THT散热器引脚体结构的示例封装组装的底视图。
图3示出具有多个集成THT散热器引脚的暴露焊盘体结构的替代示例体结构的底部的对角视图。
图4示出具有带有多个THT引脚的体结构的示例封装组装的底视图。
图5示出根据本发明的各种实施例的多引脚体结构的侧视图。
图6示出根据本发明的各种替代实施例的多引脚体结构的侧视图。
图7示出具有暴露焊盘的封装安装到印刷电路板上的截面,其中所述暴露焊盘具有多个集成THT散热器引脚。
图8是示出用于根据本发明的各种实施例的封装的制造工艺的框图。
图9是示出可以用于根据本发明的各种实施例的封装的各种制造工艺步骤的框图。
应了解,为了说明的简要和清楚,附图中示出的元件并不需要按比例绘制。例如,为了使本发明更加清楚和便于理解,一些元件的尺寸可以相对其它元件放大。此外,在适当的地方,在附图中重复表示相同的或类似的元件的参考标号。
具体实施方式
说明一种用于使用基于引线框架的过模制(over-molded)半导体封装来封装半导体器件的方法和装置,其中,该半导体封装具有在暴露焊盘上的一个或多个通孔技术(THT)散热器引脚作为具有减小了的热阻的直接的电热路径。通过将散热器引脚与暴露管芯焊盘一体地形成或附接到暴露管芯焊盘,从管芯附接焊盘到封装外部提供直接并且短的电热路径。THT散热器引脚可以在引线框架制造工艺中制造,也可以在实际的封装制造工艺之前预先形成。
现在,将参考附图详细描述本发明各种示意性实施例。虽然以下说明中阐述了各种细节,但是应了解本发明可以在没有这些细节的情况下实施,并且可以对这里说明的本发明做出许多特定实施结果,以达到器件设计者的特定目标,诸如依从工艺技术或者设计相关的约束,其中所述特定目标随实施方式的不同而变化。虽然这样的开发努力可能是复杂和耗时的,但是对具有本公开的益处的本领域的技术人员来说,仍然存在常规。例如,为了避免限制本发明或者使本发明含糊不清,参考没有包括每个特征或者几何构型的简化的截面图描绘了被选择的方面。还应注意,贯穿这些详细说明,描绘了可以使用任何需要的制造技术形成的示例封装结构,例如刻蚀、研磨、冲压、机械加工或其它用于形成具有合适尺寸和大小的结构的制造技术。这些细节是公知的,并且不认为教导本领域技术人员如何实现或使用本发明是必须的。
图1是示出具有集成THT散热器引脚12的暴露焊盘或引线框架10的体结构1的一个例子的底部的对角视图。引线框架10基本上是封装的基底或“主干”载体。引线框架10典型地是金属的并且导电的,但是并不总是如此。引线框架10包括承载半导体管芯的管芯标记。根据选择的实施例,暴露焊盘10的表面包括一个或多个THT散热器12。图2示出单个柱状的引脚结构12从封装的表面突起,但是应了解其它形状也可以用于引脚结构12,只要引脚结构从暴露焊盘10的表面足够地突起,以允许与PCB过孔的物理接合和接触(如在下文中所描述的)。无论使用什么形状,THT散热器引脚12可以形成为暴露焊盘10的一体化组成部分从而被制造为暴露焊盘10的一部分。例如,在引线框架制造工艺中,能够使用刻蚀、研磨、冲压或其它机械加工过程一体地制造焊盘和THT引脚。替代地,THT引脚12可以与焊盘10分离地单独制造,然后附接到暴露焊盘或与暴露焊盘连接,诸如通过在制造引线框架体或焊盘10后用压入配合(press fit),冷焊或其它适合的连接技术将THT引脚12加到或***到引线框架结构。生产THT引脚12的方法能够用于在这里描述的本发明的各种实施例的任何合适的类型。
现在参考图2,示出具有单个THT引脚体结构22的功率四方扁平无引线(PQFN)封装组装2的底视图。所描绘的封装被示出具有若干个引线框架组件或其它器件以及连接器26。此外,如前面在其它实施例和附图中所指出的,该封装被示出具有暴露焊盘20,所述暴露焊盘20以从暴露焊盘20的表面突起的一个集成THT散热器引脚22为特点。
参考图3,示出具有多个集成THT散热器引脚32、34的暴露焊盘或引线框架30的替代示例体结构3的底部的对角视图。如图所示,THT引脚被排列成行(例如,引脚行34)和列(例如,引脚列32),这些行和列定义了矩形网格的图形。图3示出的是形成网格图形的3行6列的THT引脚,尽管应了解也可以使用其它图形。此外,THT引脚32、34的网格或者图形能够与暴露焊盘30一体地形成,或者随后通过将引脚32、34***或附接到焊盘30来形成。
如图4示出具有多个THT引脚42、48的体结构的示例PQFN封装的底视图。该图中的封装被示出具有若干个引线框架组件或其它器件以及连接器46。如前面在其它实施例和附图中所指出的,如图所示,该封装具有暴露焊盘40,所述暴露焊盘40以从暴露焊盘40的表面突起的多个集成THT散热器引脚42、48为特点。
图5示出根据本发明的各种实施例的具有多个引脚体结构5的侧视图,其中,在引线框架的制造过程中制造一个或多个THT散热器引脚52作为暴露焊盘50的一体化组成部分。如图所示,每个一体地形成的引脚52从焊盘50垂直突起或延伸,但是,诸如当将引脚配置为用于***到具有非标准配置的PCB过孔时,也可以使用其它的突起角度。因此,用于THT引脚52的其它形状将提供与本发明同样的优点。根据本发明的各种替代实施例,图6示出具有多引脚体结构6的侧视图,其中,THT散热器引脚62被单独制造并***到暴露焊盘60中。例如,在焊盘60的引线框架制造过程中,在暴露焊盘60中形成一个或多个安装孔64。接着,使用任何需要的附接或连接技术,将THT散热器引脚62***到安装孔64中,以牢固连接引脚62和焊盘60。
图7示出组装在印刷电路板78上的具有暴露焊盘或功率管芯标记(flag)70的PQFN引线框架封装7的截面图,其中,暴露焊盘或功率管芯标记70具有多个集成THT散热器引脚71。尽管并未在图中示出,引脚71如前所述可以形成为行和列。所描绘的封装7包括一个或多个输入/输出(I/O)焊盘74、集成电路73(例如功率管芯)、引线框架70和将功率管芯73连接到引线框架70的管芯附接材料72(例如焊剂、导电环氧树脂或其它任何可用的粘接材料)。这些元件被装入在模料化合物75中,其中模料化合物典型地是环氧化合物或其它合适的材料的形式,可涂覆于装入如所示出的功率管芯73、I/O焊盘74和功率管芯标记70,并暴露焊盘70、74和THT散热器引脚71(其是与功率管芯标记70一体地形成或随后固定地附接到功率管芯标记70)的底部。然后,模料化合物密封封装可通过涂覆PCB78和任何位于其上的器件之间的焊点76而附接到印刷电路板(PCB)78,然后将THT散热器引脚71***在PCB78中形成的过孔开口77中。如图所示,PCB78包括以预定厚度在PCB过孔77的表面上以及PCB78的上表面和下表面上形成的PCB导体层79(大约0.35微米的铜)。每个过孔77有预定的宽度(例如直径大约为0.5mm),其宽度宽于THT引脚71的宽度(例如引脚直径大约0.4mm),并且THT引脚的长度(例如大约1.5mm)可被选择为使得引脚71接触在过孔77中的导体层79并延伸完全通过过孔77。当然,应了解,取决于引脚配置和封装类型,能够使用其它的厚度、宽度和长度尺寸。
在图7中所示的实施例中,管芯标记的上表面被放置为与集成电路管芯接触,以将在集成电路管芯处产生的热直接传送到THT散热器引脚71,THT散热器引脚71接着直接将热传送到PCB过孔77和铜板79。用这种方法,在组装后,THT散热器引脚71为封装提供了内建的、优化的到PCB78的热路径,从而与现有组装技术相比,通过提高热性能(例如至少提高到3倍)而提高了板上性能。此外,消除了大部分潜在的可能限制板上封装性能的与板附接相关的问题。同样地,散热器引脚71提供了在PCB组装中自对准的优点。因为散热器引脚71减少了管芯73和PCB铜板79之间的热路径的热阻,因此,引线框架70可以和功率应用一起用来将功率管芯73附接到PCB78。
图8是示出用于制造根据本发明的各种实施例的封装的示例工艺80的流程图。作为初步的步骤,通过刻蚀、研磨、冲压、机械加工或其它将THT引脚形成为焊盘(81)的一体化组成部分的方法在暴露焊盘中一体地形成一个或多个散热器引脚。对于具有已刻蚀的引线框架的封装,因为用于制造引线框的蚀刻工艺能够用于在暴露焊盘表面图形化THT引脚而无需在整个工艺中增加额外的步骤,所以可以容易地制造散热器引脚。替代地,散热器引脚可以单独地形成,并通过以下步骤附接到引线框架(83),即制造引线框架以包括安装孔(82),然后将单独形成的THT引脚插到引线框架(83),诸如通过附接、连接、压入配合、冷焊或其它将引脚耦合到引线框架的方法。
然后,要被连接到引线框架的各种组件可以附接在引线框架的上表面上。这些组件将典型地成为在某种程度或其它程度上被模制封的封装的一部分。这些组件的确切性质将取决于器件和最终的封装(84)的最终用途。然后模料化合物被涂覆于封装(85)的各种组件。该工艺可以以各种不同的方法实施,包括模制或其它模料化合物涂覆方法。然后,根据所要求的用途合适地完成该封装。这包括移除被包括的来自连接的某些区域、额外的引线的某些区域的一些模料化合物(86)。然后使用焊接工艺(87)将该封装附接到PCB或其它器件上。THT散热器引脚的存在允许该封装与PCB过孔对准。
该封装的制造工艺还可以进一步包括在半导体封装制造环境中的平常的步骤。图9示出可以用于根据本发明各种实施例的封装的制造工艺步骤的示例顺序,但应了解,还存在其它变化。如图9中所示,制造单个引线框架或一套(例如矩阵)引线框架90/92并且和在其暴露焊盘上形成的一个或多个THT散热器引脚93一起被图形化(150),在安装晶片后,一个或多个不同的硅晶片通过切割或其它合适的方法被分为单个半导体管芯,并且然后检测这些半导体管芯(152)。
在涂覆管芯焊膏或其它合适的管芯附接材料(94)(154)后,半导体管芯95被放置到管芯附接材料94中,而后被固化或回流。然后可以实施去焊剂和DI-水清洗工艺(156)。如果需要,涂覆环氧树脂或其它合适的管芯附接材料(158),并且将另外的半导体管芯放置到管芯附接材料中并且/或实施管芯附接固化(160)。载带(96)被附接至引线框架(162)以提供支撑面板,涂覆引线接合(99)(164),并且实施可视化检测(166)。
涂覆模料化合物(100)(168)并且移除载带96(170),以分离支撑面板。清洁阶段(176)接在封装后固化(post mold cure)步骤(172)和激光打标(174)步骤之后。该封装然后被分成单个元件(178)并且检测这些元件(180)。
一方面,本发明提供了一种通过将集成电路管芯安装到暴露焊盘上来制造半导体封装的方法,其中,暴露焊盘包括一个或多个位于暴露焊盘的暴露的第一表面上的散热器结构。该散热器结构可以由任何导热材料形成,诸如铜,并且该散热器结构可以使用任何需要的技术来形成为暴露焊盘的一体化组成部分,诸如通过刻蚀,研磨,冲压或机械加工引线框架来形成。替代地,也可以与暴露焊盘分离地单独形成该散热器结构,即通过形成具有在暴露的第一表面中形成的至少一个安装孔的暴露焊盘,形成一个或多个散热器引脚,然后将散热器引脚附加到暴露焊盘的安装孔中从而第一散热器引脚从暴露焊盘突起。在该方法中,集成电路管芯被附加到与暴露焊盘的暴露的第一表面相对的表面,然后集成电路管芯和暴露焊盘被装入在模制料中,留下被暴露的暴露的第一表面和第一散热器结构。接下来,第一散热器结构诸如通过将散热器结构***穿过在印刷电路板中形成的过孔中来附接到印刷电路板,。
另一方面,本发明提供了一种基于引线框架的具有暴露焊盘的过模制半导体封装。该暴露焊盘包括一个或多个通孔技术散热器引脚,该散热器引脚被配置为用于***到在印刷电路板中形成的过孔中,其中,该散热器引脚可以形成为该暴露焊盘的一体化组成部分,或者与暴露焊盘分离地形成为顺序地固定地附接到暴露焊盘。用该方式,散热器引脚可形成为任何需要的半导体封装的一部分,所述封装包括但不限于PQFN,QFN,HSOP,SOIC,QFP,TQFP或MO-188封装。在一个选择的实施例中,暴露焊盘和散热器引脚可以由铜形成,但是可以使用任何导电并导热的材料。
又一方面,本发明公开了一种电子器件,诸如功率四方扁平无引线(PQFN)封装组装结构,其包括至少部分密封在模制结构中的管芯。此外,耦合至管芯的管芯附接焊盘包括从模制结构暴露的第一表面以及一个或多个(一体地形成或单独地形成)从该第一表面突起的第一通孔技术散热器引脚。例如,其中模制结构具有第一底表面,将散热器引脚和管芯附接焊盘的第一表面置于模制结构中以从模制结构的第一表面暴露。当散热片被设置为与管芯附接焊盘的散热器引脚热交换时,来自管芯的热被热耦合到引脚并且可以被传送到散热片。
尽管在这里公开的所描述的示例性实施例针对各种基于引线框架的半导体封装结构及其制造方法,但本发明并不必限于示出本发明的发明方面的示例性实施例,本发明可应用到工艺和/或器件的广泛变化。因此,以上公开的具体实施例仅是示例性的,并不应用做对本发明的限制,本发明可以以对于从在这里的教导获益的本领域技术人员来说显而易见的、不同的但是等价的方式进行修改或实施。例如,图7未示出该封装的各种元件之间连接的所有细节,但应了解引线、过孔、接合以及其它连接方法能够用于影响任何电连接。类似地,其它绝缘材料能够用于电绝缘各种组件。同样地,能够根据对需要的封装的要求使用器件、焊盘、管芯等的任何组合。因此,前述说明并不意在要将本发明限于前述的具体示例,相反地,意在涵盖包括在由所附的权利要求限定的本发明的精神和范围内的各种替代、修改和等价物,从而本领域技术人员应该理解他们能够在不背离本发明最宽泛的形式的精神和范围内,做出各种变化、替换和改变。
以上参考具体实施例说明了本发明的优点、其它优势和解决问题的方法。例如,公开的基于引线框架的半导体封装结构在该封装内提供了优化的热路径,通过在穿过PCB到PCB背面(该背面以作为散热片的大面积铜板为特点)的目标散热路径中通过将导热或散热的引脚结构***PCB的导热过孔中来减小热阻值来提供上述散热路径。另外,消除了可能限制封装板上性能的典型的组装问题(例如焊料空穴),并且散热器引脚允许在PCB的组装过程中使该封装和PCB自对准。然而,这些优点,优势,解决问题的方法以及任何可以导致任何优点,优势,解决方法出现或者更加明了的要素都不应当被认为是任何或全部权利要求重要的、必要的或基本的特征或要素。如在这里使用的,术语“包括”意在覆盖非排它性的包括,从而包括列出的元素的工艺、方法、物品或装置,并不只包括这些元素,而是可以包括其它没有被表示为列出的元素或者属于该工艺、方法、物品或装置固有的元素。
Claims (20)
1.一种通过将集成电路管芯安装在焊盘上来制造半导体封装的方法,所述方法包括:
在所述焊盘的第一表面上形成至少第一散热器结构;
将集成电路管芯附加到与所述第一表面相对的所述焊盘的第二表面;并且
将所述集成电路管芯和所述焊盘装入在化合物中,留下暴露的所述第一表面和所述第一散热器结构。
2.如权利要求1所述的方法,进一步包括:将所述第一散热器结构附接到印刷电路板。
3.如权利要求2所述的方法,其中附接第一散热器结构的步骤包括:将所述散热器结构***通过在所述印刷电路板中形成的过孔。
4.如权利要求1所述的方法,其中形成至少第一散热器结构的步骤包括:形成第一散热器引脚,作为所述焊盘的一体化组成部分。
5.如权利要求4所述的方法,其中形成第一散热器引脚作为所述焊盘一体化组成部分的步骤包括:刻蚀、研磨、冲压或机械加工引线框架。
6.如权利要求1所述的方法,其中形成至少第一散热器结构的步骤包括:形成与所述焊盘一体化的多个散热器引脚。
7.如权利要求1所述的方法,其中形成至少第一散热器结构的步骤包括:
形成焊盘,该焊盘具有在所述第一表面中形成的至少一个安装孔;
形成至少第一散热器引脚;并且
将所述第一散热器引脚附加到所述焊盘的安装孔中,从而所述第一散热器引脚从所述焊盘突起。
8.如权利要求7所述的方法,其中将所述第一散热器引脚附加到所述安装孔的步骤包括:压入配合、冷焊、或***所述第一散热器引脚。
9.如权利要求1所述的方法,其中所述第一散热器结构包括铜。
10.一种具有暴露焊盘的、基于引线框架的过模制半导体封装,包括:至少一个THT散热器引脚,所述散热器引脚被配置为***在印刷电路中形成的过孔中。
11.如权利要求10所述的半导体封装,其中所述THT散热器引脚包括多个散热器引脚。
12.如权利要求10所述的半导体封装,其中所述THT散热器引脚形成为所述暴露焊盘的的一体化组成部分。
13.如权利要求10所述的半导体封装,其中所述THT散热器引脚与所述暴露焊盘分离地形成并且被附接到所述暴露焊盘。
14.如权利要求10所述的半导体封装,其中所述过模制半导体封装包括PQFN、QFN、HSOP、SOIC、QFP、TQFP或MO-188封装。
15.如权利要求10所述的半导体封装,其中所述暴露焊盘和THT散热器引脚包括铜。
16.一种包括封装结构的电子器件,包括:
模制结构:
被置于所述模制结构中的管芯;以及
耦合至所述管芯的管芯附接焊盘,所述管芯附接焊盘包括:从所述模制结构暴露的第一表面;以及,从所述第一表面突起的至少第一通孔技术散热器引脚。
17.如权利要求16所述的电子器件,其中所述模制结构具有第一表面,并且其中所述第一通孔技术散热器引脚和所述管芯附接焊盘的第一表面都从所述模制结构的所述第一表面暴露。
18.如权利要求16所述的电子器件,进一步包括:散热片,该散热片被放置为与所述管芯附接焊盘的散热器引脚进行热交换。
19.如权利要求16所述的电子器件,其中所述第一通孔技术散热器引脚包括多个散热器引脚。
20.如权利要求16所述的电子器件,其中所述第一通孔技术散热器引脚被形成为所述管芯附接焊盘的一体化组成部分。
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US11/398,944 US7772036B2 (en) | 2006-04-06 | 2006-04-06 | Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing |
US11/398,944 | 2006-04-06 | ||
PCT/US2007/063777 WO2007117819A2 (en) | 2006-04-06 | 2007-03-12 | Molded semiconductor package with integrated through hole heat spreader pin(s) |
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US8659146B2 (en) | 2014-02-25 |
KR20090004908A (ko) | 2009-01-12 |
WO2007117819A2 (en) | 2007-10-18 |
US20070238205A1 (en) | 2007-10-11 |
KR101388328B1 (ko) | 2014-04-22 |
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US20100237479A1 (en) | 2010-09-23 |
JP2014013908A (ja) | 2014-01-23 |
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EP2005470B1 (en) | 2019-12-18 |
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CN101416305A (zh) | 2009-04-22 |
EP2005470A4 (en) | 2010-12-22 |
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