US8737073B2 - Systems and methods providing thermal spreading for an LED module - Google Patents
Systems and methods providing thermal spreading for an LED module Download PDFInfo
- Publication number
- US8737073B2 US8737073B2 US13/024,017 US201113024017A US8737073B2 US 8737073 B2 US8737073 B2 US 8737073B2 US 201113024017 A US201113024017 A US 201113024017A US 8737073 B2 US8737073 B2 US 8737073B2
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- Prior art keywords
- thermal
- led
- heat spreading
- circuit board
- pad
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
- F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
Definitions
- the present disclosure relates generally to Light Emitting Diode (LED) module manufacturing. Specifically, the present disclosure relates to systems and methods that provide a front-side heat spreading structure for an LED module.
- LED Light Emitting Diode
- LEDs can produce heat, so some conventional systems include mechanisms to remove the heat.
- a system to remove the heat is a heat sink mounted to the back side of the circuit board. The heat can be moved from the front side LED to the backside heat sink using a thermal via or a thermal pad and an intermediate layer of thermal conductive material.
- a Light Emitting Diode (LED) module includes a circuit board having a front side and a back side, a heat sink coupled to the back side of the circuit board, a thermal pad disposed on a front side of the circuit board, an LED disposed on the front side of the circuit board, the LED in thermal contact with the thermal pad, and a heat spreading device placed over the thermal pad and in thermal contact with the thermal pad.
- LED Light Emitting Diode
- a method for manufacturing an LED module includes creating a circuit layout on a front side surface of a circuit board.
- the circuit layout includes a metal thermal pad.
- the method also includes disposing a plurality of LEDs on the circuit layout so that each of the LEDs is in thermal communication with the thermal pad and assembling a heat spreading structure over the front side surface of the circuit board so that the heat spreading structure is in thermal communication with the thermal pad.
- the heat spreading structure exposes the plurality of LEDs.
- an LED assembly in another embodiment, includes a circuit substrate that has a front side and a back side, a thermal pad formed of thermally conductive material on the front side of the circuit substrate, an LED disposed on the front side of the circuit substrate and in contact with the thermal pad, and means for spreading heat produced by the LED, the heat spreading means placed over the front side of the circuit substrate and having a hole to expose the LED.
- FIG. 1 is an illustration of an exemplary LED module according to one embodiment.
- FIG. 2 is a cross-sectional illustration of an exemplary LED package according to one embodiment.
- FIG. 3 is an illustration of the exemplary circuit board of FIG. 2 , shown with LEDs mounted thereon.
- FIG. 4 is an illustration of a portion of another exemplary circuit board shown as it would appear using Computer Aided Design (CAD), according to one embodiment.
- CAD Computer Aided Design
- FIG. 5 shows an exemplary LED for use with the circuit board of the embodiment of FIG. 4 .
- FIG. 6 is an illustration of another exemplary LED package according to one embodiment.
- FIG. 7 is an illustration of exemplary method for manufacturing an LED module according to one embodiment.
- the present disclosure relates generally to LED modules. Specifically, the present disclosure relates to a front side heat spreading structure for an LED module. While the examples herein discuss applying the techniques to a Metal Core Printed Circuit Board (MCPCB), it is understood that the scope of embodiments is not limited to MCPCBs or even PCBs generally. The scope of embodiments includes all kinds of substrates for circuit layouts, including ceramic, FR-4, and the like.
- MCPCB Metal Core Printed Circuit Board
- FIG. 1 is an illustration of an exemplary LED module 100 according to one embodiment.
- LED module 100 has LEDs 105 , which are disposed upon circuit board 120 by, e.g., Surface Mount Technology (SMT) or through-hole mounting.
- Circuit board 120 in this example has a front side (top) and back side (contacting heat sink 130 ).
- the front side, and perhaps other intermediate layers, has metal conductive paths formed of copper (Cu) or other metal.
- Some of the conductive paths are for power, ground, or signals and are referred to herein as electrical conductive paths.
- Others of the conductive paths are thermal conductive paths.
- the thermal conductive paths are isolated from the electrical conductive paths and are arranged to create pathways for heat to travel from LEDs 105 to heat spreading structure 110 and/or heat sink 130 .
- electrical conductive paths are used as thermal conductive paths so long as placement of heat spreading structure 110 over the electrical conductive paths does not cause short circuits.
- various embodiments add electrically-insulative thermal conductive material to be the interface between the electrical conductive path and heat spreading structure. Thermal conductive paths are shown and described in more detail with respect to FIG. 4 .
- heat spreading structure 110 is placed on the front side of module 100 .
- Heat spreading structure 110 has holes that expose LEDs 105 but otherwise heat spreading structure 110 covers substantially all of the front side of circuit board 120 . Together, heat spreading structure 110 and heat sink 130 spread heat from top to bottom and side to side of module 100 , as shown by the arrows.
- FIG. 2 is a cross-sectional illustration of exemplary LED package 200 according to one embodiment.
- Package 200 includes MCPCB 220 , upon which LEDs 205 are mounted using solder pads (e.g., solder pad 226 ).
- PCB 220 includes Cu layer 221 with etched electrical paths (not shown), solder mask 222 , thermally conductive material 223 , and aluminum (Al) layer 224 .
- Thermally conductive material 223 includes in this example electrically insulative gel.
- LED package 200 also includes heat spreading structure 210 disposed over the front side of LED package 200 .
- the interface 225 of heat spreading structure 110 and PCB 220 includes a thermally conductive material, such as thermal grease or tape (not shown) to ensure reliable contact and heat transfer between the surface of PCB 220 and heat spreading structure 210 .
- Heat spreading structure 110 may be electrically isolated from circuitry (not shown) at interface 225 by use of grease, tape, or even ink.
- PCB 220 in this example can be manufactured using conventional methods.
- heat spreading structure 110 is formed of Al as a separate component that is positioned over PCB 220 and attached thereto using screws or tape.
- other techniques now known or later developed for manufacturing PCB 220 and structure 210 and for attaching structure 210 may be employed in some embodiments.
- LED package 200 may include a back side mounted heat sink as well.
- FIG. 3 is an illustration of exemplary circuit board 220 of FIG. 2 , shown with LEDs mounted thereon.
- FIG. 3 provides a view of thermal path 310 , which in this example includes a metal layer on the front side surface that contacts the bottoms of the respective LEDs.
- Thermal path 310 has thin portions (e.g., portions 310 a and 310 b ) that contact the LEDs and wider portions (portions 310 c and 310 d ) arranged laterally on the front surface.
- Electrical contact pads 315 , 316 provide for an interface to a power supply and ground and distribute the power through electrical paths (not shown) underneath the layer illustrated in FIG. 3 .
- FIG. 4 is an illustration of a portion of another exemplary circuit board 400 shown as it would appear using Computer Aided Design (CAD).
- Circuit board 400 includes power paths 410 - 404 , which are in electrical communication with power (LED+, path 404 ) and ground (LED ⁇ , path 403 ).
- Power paths 401 - 404 are also in electrical communication with solder pads 410 , 420 .
- Circuit board 400 also includes thermal pads 405 , 406 , which are electrically isolated from power paths 401 - 404 . It should be noted that in some embodiments, the Cu that makes up paths 401 - 404 is covered in electrically insulative, thermally conductive ink from a PCB etch process (except for the portions under pads 410 , 420 ).
- Thermal pad 405 is in thermal communication with solder pad 410
- thermal pad 406 is in thermal communication with solder pad 420 .
- thermal pads 405 , 406 are configured to distribute heat away from LEDs (not shown) mounted upon respective solder pads 410 , 420 .
- a front side-mounted heat spreading structure (such as heat spreading structure 110 of FIG. 1 ) may be mounted upon circuit board 400 so that it is in thermal communication with thermal pads 405 , 406 and can dissipate heat to another structure or to the atmosphere.
- FIG. 5 shows exemplary LED 500 for use with circuit board 400 of the embodiment of FIG. 4 .
- LED 500 is shown in a variety of views for a better understanding of this particular embodiment.
- the bottom surface of LED 500 is mounted to solder pad 410 so that middle contact 501 is coupled to thermal pad 405 , contact 502 is coupled to power path 401 , and contact 503 is coupled to power path 402 .
- FIG. 6 is an illustration of another exemplary LED package 600 according to one embodiment.
- heat spreading structure 620 is mounted upon circuit board 220 so that heat spreading structure 620 is in thermal communication with the LEDs through solder pads 610 .
- solder pads 610 are in thermal communication with one or more thermal pads that distribute heat from the LEDs.
- Interface 625 between solder pads 610 and heat spreading structure 620 may or may not include a thermal grease or tape.
- the solder pads 610 act as thermal spreading surfaces that make reliable contact with heat spreading structure 620 so that thermal grease and tape can be omitted.
- Some embodiments may also include a back side mounted heat sink (not shown) as well.
- FIG. 7 is an illustration of exemplary method 700 , for manufacturing an LED module, according to one embodiment.
- Method 700 may be performed in some instances by one or more persons and/or machines in a single manufacturing site or multiple manufacturing sites.
- a circuit layout is created on a front side surface of a circuit board.
- the circuit board includes a thin layer of metal, such as Cu, on its surface.
- the layer of metal is then patterned using a mask and etchant.
- any technique now known or later developed may be used to create the circuit layout.
- the circuit layout includes electrical conductive paths for power, ground, and signals and thermal conductive paths for distributing heat.
- the thermal conductive paths may be different from the electrical paths.
- An example of a circuit layout is shown in FIG. 4 .
- a plurality of LEDs are disposed in the circuit layout so that each of the LEDs is in thermal communication with a thermal pad in the circuit layout.
- FIGS. 4 and 5 above illustrate how an LED can be arranged upon a circuit layout in one embodiment to be in thermal communication with appropriate components.
- a heat spreading structure is assembled over the front side surface of the circuit board so that the heat spreading structure is in thermal communication with the thermal pad.
- the heat spreading structure may be thermally coupled to the thermal pad using a solder pad or not using a solder pad.
- some embodiments may or may not employ a heat-conductive thermal insulating material, such as thermal grease or tape or ink, at an interface of the heat spreading structure and the circuit layout.
- Block 730 includes in some embodiments arranging the heat spreading structure so that it covers substantially all of the circuit board, covering the entire circuit layout, while including one or more apertures to expose the LEDs.
- the heat spreading structure may leave some areas of the circuit layout exposed.
- the heat spreading structure can be assembled in any manner appropriate for a given application. Some embodiments employ screws, tape, and/or adhesive to secure the heat spreading structure to the circuit board.
- Method 700 is exemplary, and the scope of embodiments is not limited only to that shown in FIG. 7 .
- Other embodiments may add, omit, modify, or rearrange actions.
- some embodiments further include mounting a heat sink on the back side of the circuit board.
- some embodiments may further include deploying the LED module in an application, such as an LED display or LED lighting fixture.
- the application may include a control system that uses sophisticated algorithms to drive the LEDs to provide desired results, such as outputting a desired color of light, outputting a desired pattern, and/or the like.
- Table 1 includes examples of various embodiments using a variety of substrates and other materials. Table 1 is exemplary, as the scope of embodiments may include other materials adapted for use in some applications.
- Various embodiments may include advantages over other techniques that employ only a back side heat spreading structure. For instance, some embodiments improve the performance of the LED module by shortening the thermal path from the LEDs to a heat spreading structure, which makes for more effective use of the heat spreading structure. Furthermore, embodiments that employ heat spreading structures on both the front side and back side of the circuit board double the paths for thermal spreading. Increased thermal spreading may enhance reliability in applications where heat dissipation is crucial, such as in high-power LED lighting fixtures.
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- General Engineering & Computer Science (AREA)
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- Optics & Photonics (AREA)
- Led Device Packages (AREA)
Abstract
Description
TABLE 1 | ||||
Item | Material 1 | Material 2 | Material 3 | Material 4 |
substrate | Al-MCPCB | Cu-MCPCB | Ceramic | FR4 |
Heat sink (back | Al | Cu | Fe | Ag |
side) | ||||
PCB pad for | Chemical | Sn solder | OSP solder | OSP solder |
process | gold solder | |||
Heat spreading | Al | Cu | Fe | Ag |
structure (front | ||||
side) | ||||
Thermal | Grease | Tape | gel | |
interface | ||||
material | ||||
Claims (20)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US13/024,017 US8737073B2 (en) | 2011-02-09 | 2011-02-09 | Systems and methods providing thermal spreading for an LED module |
US14/286,534 US20140254180A1 (en) | 2011-02-09 | 2014-05-23 | Systems and Methods Providing Thermal Spreading for an LED Module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/024,017 US8737073B2 (en) | 2011-02-09 | 2011-02-09 | Systems and methods providing thermal spreading for an LED module |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US14/286,534 Continuation US20140254180A1 (en) | 2011-02-09 | 2014-05-23 | Systems and Methods Providing Thermal Spreading for an LED Module |
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Publication Number | Publication Date |
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US20120201007A1 US20120201007A1 (en) | 2012-08-09 |
US8737073B2 true US8737073B2 (en) | 2014-05-27 |
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US13/024,017 Active 2032-04-05 US8737073B2 (en) | 2011-02-09 | 2011-02-09 | Systems and methods providing thermal spreading for an LED module |
US14/286,534 Abandoned US20140254180A1 (en) | 2011-02-09 | 2014-05-23 | Systems and Methods Providing Thermal Spreading for an LED Module |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
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US14/286,534 Abandoned US20140254180A1 (en) | 2011-02-09 | 2014-05-23 | Systems and Methods Providing Thermal Spreading for an LED Module |
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US20150092350A1 (en) * | 2013-09-30 | 2015-04-02 | Robert Bosch Gmbh | Heat-conductive connection arrangement |
US20170079129A1 (en) * | 2014-05-23 | 2017-03-16 | Autonetworks Technologies, Ltd. | Circuit assembly and electric junction box |
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Also Published As
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US20140254180A1 (en) | 2014-09-11 |
US20120201007A1 (en) | 2012-08-09 |
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