BR112015007837A2 - adesivos e métodos relacionados - Google Patents
adesivos e métodos relacionadosInfo
- Publication number
- BR112015007837A2 BR112015007837A2 BR112015007837A BR112015007837A BR112015007837A2 BR 112015007837 A2 BR112015007837 A2 BR 112015007837A2 BR 112015007837 A BR112015007837 A BR 112015007837A BR 112015007837 A BR112015007837 A BR 112015007837A BR 112015007837 A2 BR112015007837 A2 BR 112015007837A2
- Authority
- BR
- Brazil
- Prior art keywords
- acrylic
- diluent
- additives
- abstract
- adhesives
- Prior art date
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/26—Porous or cellular plastics
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/062—Copolymers with monomers not covered by C09J133/06
- C09J133/064—Copolymers with monomers not covered by C09J133/06 containing anhydride, COOH or COOM groups, with M being metal or onium-cation
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1808—C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
- C08F222/1025—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate of aromatic dialcohols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/103—Esters of polyhydric alcohols or polyhydric phenols of trialcohols, e.g. trimethylolpropane tri(meth)acrylate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/24—Presence of a foam
- C09J2400/243—Presence of a foam in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2453/00—Presence of block copolymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Polymerisation Methods In General (AREA)
- Materials For Photolithography (AREA)
Abstract
abstract cure in place pressure sensitive adhesive compositions are described that comprise one or more of a bodying component, a structural diluent, a radical diluent as well as additives such as crosslinkers, external catalysts, photoinitiators and stabilizers/ process aids. the bodying component can be acrylic or non-acrylic. tradução do resumo resumo patente de invenção: "adesivos e métodos relacionados". composições de adesivo sensível a pressão adequadas para cura são descritas, as quais compreendem um ou mais de um componente de corporificação, um diluente estrutural, um diluente de radicais, assim como aditivos tais como reticuladores, catalisadores externos, fotoiniciadores e estabilizantes/aditivos de processamento. o componente de corporificação pode ser acrílico ou não acrílico.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261711386P | 2012-10-09 | 2012-10-09 | |
US61/711,386 | 2012-10-09 | ||
PCT/US2013/064188 WO2014059056A1 (en) | 2012-10-09 | 2013-10-10 | Adhesives and related methods |
Publications (2)
Publication Number | Publication Date |
---|---|
BR112015007837A2 true BR112015007837A2 (pt) | 2017-07-04 |
BR112015007837B1 BR112015007837B1 (pt) | 2021-10-05 |
Family
ID=49447852
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112015007837-0A BR112015007837B1 (pt) | 2012-10-09 | 2013-10-10 | Adesivo sensível à pressão para cura local e método de ligação |
BR112015007832-0A BR112015007832B1 (pt) | 2012-10-09 | 2013-10-10 | Líquido para cura local |
BR112015007880-0A BR112015007880B1 (pt) | 2012-10-09 | 2013-10-10 | Adesivo para cura local |
BR112015007833-8A BR112015007833B1 (pt) | 2012-10-09 | 2013-10-10 | Liquido e adesivo sensível a pressão para cura local e uso |
Family Applications After (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112015007832-0A BR112015007832B1 (pt) | 2012-10-09 | 2013-10-10 | Líquido para cura local |
BR112015007880-0A BR112015007880B1 (pt) | 2012-10-09 | 2013-10-10 | Adesivo para cura local |
BR112015007833-8A BR112015007833B1 (pt) | 2012-10-09 | 2013-10-10 | Liquido e adesivo sensível a pressão para cura local e uso |
Country Status (10)
Country | Link |
---|---|
US (15) | US9738817B2 (pt) |
EP (4) | EP2906654B1 (pt) |
KR (1) | KR102295538B1 (pt) |
CN (4) | CN112876996A (pt) |
AU (9) | AU2013329253B2 (pt) |
BR (4) | BR112015007837B1 (pt) |
CA (1) | CA2887304A1 (pt) |
IN (3) | IN2015DN03074A (pt) |
MX (2) | MX2015004606A (pt) |
WO (4) | WO2014059057A1 (pt) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2013329253B2 (en) | 2012-10-09 | 2017-02-23 | Avery Dennison Corporation | Adhesives and related methods |
US9574039B1 (en) * | 2014-07-22 | 2017-02-21 | Full Spectrum Laser | Additive use in photopolymer resin for 3D printing to enhance the appearance of printed parts |
CN104536210B (zh) * | 2015-02-03 | 2017-09-29 | 京东方科技集团股份有限公司 | 一种配向膜印刷板的制备方法 |
BR112017016860A2 (pt) * | 2015-02-05 | 2018-03-27 | Avery Dennison Corp | conjuntos de etiquetas para ambientes adversos |
CN108472972A (zh) | 2015-12-28 | 2018-08-31 | 宝洁公司 | 用预畸变的转移部件将材料施加到制品上的方法和设备 |
EP3397494A1 (en) | 2015-12-28 | 2018-11-07 | The Procter and Gamble Company | Method and apparatus for applying a material onto articles using a transfer component that deflects on both sides |
DE102016207548A1 (de) * | 2016-05-02 | 2017-11-02 | Tesa Se | Härtbare Klebemasse und darauf basierende Reaktivklebebänder |
DE102016207540A1 (de) | 2016-05-02 | 2017-11-02 | Tesa Se | Wasserdampfsperrende Klebemasse mit hochfunktionalisiertem Poly(meth)acrylat |
CN116764558A (zh) * | 2016-09-16 | 2023-09-19 | 国际香料和香精公司 | 用粘度控制剂稳定的微胶囊组合物 |
US10526511B2 (en) | 2016-12-22 | 2020-01-07 | Avery Dennison Corporation | Convertible pressure sensitive adhesives comprising urethane (meth)acrylate oligomers |
JP7203056B2 (ja) | 2017-06-30 | 2023-01-12 | スリーエム イノベイティブ プロパティズ カンパニー | 印刷可能な硬化性混合物及び硬化組成物 |
EP3879459A1 (en) | 2017-08-29 | 2021-09-15 | Hill-Rom Services, Inc. | Rfid tag inlay for incontinence detection pad |
JP6566324B2 (ja) * | 2017-09-29 | 2019-08-28 | サイデン化学株式会社 | 粘着シート |
JP7359570B2 (ja) * | 2018-05-29 | 2023-10-11 | 日東電工株式会社 | 粘着剤組成物、粘着剤層及び粘着シート |
JP2019206699A (ja) * | 2018-05-29 | 2019-12-05 | 日東電工株式会社 | 粘着シート |
WO2019230677A1 (ja) * | 2018-05-29 | 2019-12-05 | 日東電工株式会社 | 粘着剤組成物、粘着剤層及び粘着シート |
WO2019230678A1 (ja) * | 2018-05-29 | 2019-12-05 | 日東電工株式会社 | 粘着シート |
EP3696110A1 (en) | 2019-02-12 | 2020-08-19 | The Procter & Gamble Company | Apparatus for applying a material onto articles using a transfer component |
KR102184587B1 (ko) * | 2019-02-28 | 2020-12-01 | 주식회사 케이씨씨 | 접착제 조성물 |
DE102019208668A1 (de) * | 2019-06-14 | 2020-12-17 | Tesa Se | Verklebungsverfahren mittels einer härtenden strukturellen Klebmasse |
DE102019120049A1 (de) * | 2019-07-24 | 2021-01-28 | Bundesdruckerei Gmbh | Verfahren und Schmelzklebstoff zur Herstellung eines aus mehreren Schichten bestehenden Wert- oder Sicherheitsdokumentes sowie Wert- oder Sicherheitsdokument |
CN110527475B (zh) * | 2019-09-26 | 2021-09-07 | 广东华南精细化工研究院有限公司 | 一种可喷涂抗下垂型硅烷改性聚醚密封胶及其制备方法 |
US11752792B2 (en) | 2020-03-09 | 2023-09-12 | The Procter & Gamble Company | Method and apparatus for applying a material onto articles using a transfer component |
CN111534269B (zh) * | 2020-05-07 | 2022-04-12 | 苏州金枪新材料股份有限公司 | 一种用于液晶屏幕粘接的双组份柔韧性丙烯酸酯结构胶及其制备方法 |
CN111826093A (zh) * | 2020-07-28 | 2020-10-27 | 中国石油化工股份有限公司 | 一种适用于油气集输管线修复的光固化材料及其制作方法 |
WO2022167907A1 (en) * | 2021-02-04 | 2022-08-11 | Sunstar Engineering Americas Inc. | Curable composition |
CN114853969B (zh) * | 2022-04-25 | 2023-11-24 | 广东深展实业有限公司 | 一种光热双重固化改性聚丙烯树脂及其制备方法 |
CN115044317B (zh) * | 2022-06-29 | 2024-05-28 | 湖北祥源高新科技有限公司 | 一种双面自粘结聚氨酯泡棉的制备方法和产品 |
Family Cites Families (226)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3408008A (en) | 1966-12-02 | 1968-10-29 | Eric H. Cocks | Apparatus for applying hot melt adhesives |
CH481197A (de) | 1967-02-22 | 1969-11-15 | Breveteam Sa | Kleber zur unterseitigen Beschichtung von Bodenbelägen |
US3639500A (en) | 1968-05-09 | 1972-02-01 | Avery Products Corp | Curable pressure sensitive adhesive containing a polyepoxide a carboxylated diene polymer and an acrylic ester tackifier |
DE2446438C2 (de) | 1974-09-28 | 1985-04-11 | Bayer Ag, 5090 Leverkusen | Verfahren zur Herstellung von Oxazolidingruppen enthaltenden Urethanen und ihre Verwendung |
US4049483A (en) | 1976-11-18 | 1977-09-20 | Minnesota Mining And Manufacturing Company | Pressure sensitive hot-melt adhesive system |
US4135033A (en) | 1977-02-16 | 1979-01-16 | Lawton William R | Heat-activated adhesive coating |
US4143858A (en) | 1977-08-29 | 1979-03-13 | Eastman Kodak Company | Substantially amorphous polyolefins useful as pressure-sensitive adhesives |
US4185050A (en) | 1978-12-26 | 1980-01-22 | Celanese Corporation | Pressure sensitive adhesive compositions comprising a mixture of terpolymers |
CA1154287A (en) | 1979-02-26 | 1983-09-27 | Joseph E. Gervay | Dry-developing photosensitive dry film resist |
US4288527A (en) | 1980-08-13 | 1981-09-08 | W. R. Grace & Co. | Dual UV/thermally curable acrylate compositions with pinacol |
JPS618471Y2 (pt) | 1980-09-01 | 1986-03-15 | ||
JPS58152074A (ja) | 1982-03-05 | 1983-09-09 | Mitsui Toatsu Chem Inc | 陶磁器質タイル用接着剤組成物 |
US4507429A (en) | 1984-01-12 | 1985-03-26 | Air Products And Chemicals, Inc. | Pressure sensitive adhesives with improved shear resistance |
DE335425T1 (de) | 1985-02-05 | 1993-04-29 | Avery International Corp., Pasadena, Calif. | Verbundfutter. |
US5082922A (en) | 1988-10-12 | 1992-01-21 | The Valspar Corporation | Modified-acrylate polymers and coating compositions made therefrom |
US4914253A (en) | 1988-11-04 | 1990-04-03 | Exxon Chemical Patents Inc. | Method for preparing polyethylene wax by gas phase polymerization |
ATE142557T1 (de) | 1989-05-11 | 1996-09-15 | Landec Corp | Von der temperatur aktivierte bindemitteleinheiten |
EP0400703A1 (en) | 1989-05-24 | 1990-12-05 | Akzo Nobel N.V. | Adhesive based on a thermoplastic polyester with an aluminium compound incorporated therein |
US5194486A (en) | 1989-06-09 | 1993-03-16 | H & N Chemical Company | Adhesive |
US5264532A (en) | 1989-08-14 | 1993-11-23 | Avery Dennison Corporation | Emulsion pressure-sensitive adhesives |
US5024880A (en) | 1990-01-03 | 1991-06-18 | Minnesota Mining And Manufacturing Company | Cellular pressure-sensitive adhesive membrane |
DE4021659A1 (de) | 1990-07-07 | 1992-01-09 | Bayer Ag | Bisoxazolane, im wesentlichen aus diesen bestehende oxazolangemische, ein verfahren zu deren herstellung und ihre verwendung als haerter fuer isocyanatgruppen aufweisende kunststoffvorlaeufer |
CA2048232A1 (en) | 1990-09-05 | 1992-03-06 | Jerry W. Williams | Energy curable pressure-sensitive compositions |
US5264278A (en) | 1991-03-20 | 1993-11-23 | Minnesota Mining And Manufacturing Company | Radiation-curable acrylate/silicone pressure-sensitive adhesive coated tapes adherable to paint coated substrates |
CA2076278A1 (en) | 1991-08-22 | 1993-02-23 | Joseph T. Braun | Curable silicone pressure sensitive adhesive tape |
JP3035565B2 (ja) | 1991-12-27 | 2000-04-24 | 株式会社半導体エネルギー研究所 | 薄膜太陽電池の作製方法 |
US5252694A (en) | 1992-01-22 | 1993-10-12 | Minnesota Mining And Manufacturing Company | Energy-polymerization adhesive, coating, film and process for making the same |
CA2077103C (en) | 1992-08-28 | 2003-06-10 | Moore U.S.A. Inc. | Multipurpose label construction |
AU5407794A (en) | 1992-10-20 | 1994-05-09 | Avery Dennison Corporation | Pressure-sensitive structural adhesive |
US5322731A (en) | 1993-03-09 | 1994-06-21 | Minnesota Mining And Manufacturing Company | Adhesive beads |
US7575653B2 (en) | 1993-04-15 | 2009-08-18 | 3M Innovative Properties Company | Melt-flowable materials and method of sealing surfaces |
US5468652A (en) | 1993-07-14 | 1995-11-21 | Sandia Corporation | Method of making a back contacted solar cell |
US5721289A (en) | 1994-11-04 | 1998-02-24 | Minnesota Mining And Manufacturing Company | Stable, low cure-temperature semi-structural pressure sensitive adhesive |
US5645764A (en) | 1995-01-19 | 1997-07-08 | International Business Machines Corporation | Electrically conductive pressure sensitive adhesives |
US5695837A (en) | 1995-04-20 | 1997-12-09 | Minnesota Mining And Manufacturing Company | Tackified acrylic adhesives |
US5905099A (en) * | 1995-11-06 | 1999-05-18 | Minnesota Mining And Manufacturing Company | Heat-activatable adhesive composition |
US5800724A (en) | 1996-02-14 | 1998-09-01 | Fort James Corporation | Patterned metal foil laminate and method for making same |
ID17196A (id) | 1996-03-14 | 1997-12-11 | Dow Chemical Co | Bahan-bahan perekat yang mengandung polimer-polimer olefin |
EP1249479B1 (en) | 1996-07-15 | 2004-02-18 | Sekisui Kagaku Kogyo Kabushiki Kaisha | Method for joining members |
ATE228554T1 (de) | 1996-07-22 | 2002-12-15 | Dow Chemical Co | Heissschmelzklebstoffe |
ZA977909B (en) | 1996-09-04 | 1999-03-03 | Dow Chemical Co | Compositions comprising a substantially random interpolymer of at least one alpha-olefin and at least one vinylidene aromatic monomer or hindered aliphatic vinylidene monomer |
US20020007910A1 (en) | 1996-11-12 | 2002-01-24 | Greggory Scott Bennett | Thermosettable pressure sensitive adhesive |
WO1998040439A1 (en) | 1997-03-14 | 1998-09-17 | Minnesota Mining And Manufacturing Company | Cure-on-demand, moisture-curable compositions having reactive silane functionality |
US6011307A (en) | 1997-08-12 | 2000-01-04 | Micron Technology, Inc. | Anisotropic conductive interconnect material for electronic devices, method of use and resulting product |
US6077527A (en) | 1997-10-28 | 2000-06-20 | National Starch And Chemical Investment Holding Corporation | Enhancer tolerant pressure sensitive adhesives for transdermal drug delivery |
US5951786A (en) | 1997-12-19 | 1999-09-14 | Sandia Corporation | Laminated photovoltaic modules using back-contact solar cells |
DE19800676A1 (de) | 1998-01-10 | 1999-07-15 | Henkel Kgaa | Verwendung ausgewählter Klebstoffgemische für die Überlappungsverklebung von Rundumetiketten bei ihrem Auftrag auf Kunststoff-Flaschen |
FI106470B (fi) | 1998-03-09 | 2001-02-15 | Neste Chemicals Oy | Vaahdotettu hartsiliima ja sen käyttö puupohjaisten levyjen liimaamiseen |
US6106982A (en) | 1998-05-11 | 2000-08-22 | Avery Dennison Corporation | Imaged receptor laminate and process for making same |
US6391415B1 (en) | 1998-08-31 | 2002-05-21 | Environmental Inks And Coatings Corporation | Label system |
US6362249B2 (en) * | 1998-09-04 | 2002-03-26 | Dsm Desotech Inc. | Radiation-curable coating compositions, coated optical fiber, radiation-curable matrix forming material and ribbon assembly |
US6844391B1 (en) | 1998-09-23 | 2005-01-18 | Avery Dennison Corporation | Adhesives with improved rivet properties and laminates using the same |
US6228486B1 (en) | 1998-10-06 | 2001-05-08 | Avery Dennison Corporation | Thermal transfer laminate |
BR9916097A (pt) * | 1998-12-11 | 2001-09-04 | Henkel Kgaa | Dispersões de polìmeros terminados em silila com elevado teor de sólidos, sua preparação e aplicação |
US6235850B1 (en) * | 1998-12-11 | 2001-05-22 | 3M Immovative Properties Company | Epoxy/acrylic terpolymer self-fixturing adhesive |
US6541872B1 (en) | 1999-01-11 | 2003-04-01 | Micron Technology, Inc. | Multi-layered adhesive for attaching a semiconductor die to a substrate |
US6503620B1 (en) | 1999-10-29 | 2003-01-07 | Avery Dennison Corporation | Multilayer composite PSA constructions |
US6664318B1 (en) | 1999-12-20 | 2003-12-16 | 3M Innovative Properties Company | Encapsulant compositions with thermal shock resistance |
JP2001288438A (ja) * | 2000-04-06 | 2001-10-16 | Sekisui Chem Co Ltd | 粘着剤組成物 |
JP5057626B2 (ja) | 2000-06-01 | 2012-10-24 | クレイトン・ポリマーズ・リサーチ・ベー・ベー | アルミニウムアセチルアセトナートで架橋された官能化ブロック共重合体を含む組成物 |
US6376075B1 (en) | 2000-06-17 | 2002-04-23 | General Electric Company | Article having reflecting coating and process for the manufacture |
US6353037B1 (en) | 2000-07-12 | 2002-03-05 | 3M Innovative Properties Company | Foams containing functionalized metal oxide nanoparticles and methods of making same |
US6841234B2 (en) | 2000-08-04 | 2005-01-11 | Scapa Tapes North America Inc. | Heat-activated adhesive tape having an acrylic foam-like backing |
US6497949B1 (en) | 2000-08-11 | 2002-12-24 | 3M Innovative Properties Company | Adhesive blends comprising hydrophilic and hydrophobic pressure sensitive adhesives |
ES2271090T3 (es) | 2000-09-18 | 2007-04-16 | Applied Research Systems Ars Holding N.V. | Metodo para la preparacion de 21-hidroxi-6,19-oxidoprogesterona (21oh-60p). |
US6756095B2 (en) | 2001-01-10 | 2004-06-29 | Avery Dennison Corporation | Heat-sealable laminate |
US6951596B2 (en) | 2002-01-18 | 2005-10-04 | Avery Dennison Corporation | RFID label technique |
JP2002285106A (ja) | 2001-03-27 | 2002-10-03 | The Inctec Inc | 活性エネルギー線硬化型感圧接着剤 |
US6686425B2 (en) | 2001-06-08 | 2004-02-03 | Adhesives Research, Inc. | High Tg acrylic polymer and epoxy-containing blend therefor as pressure sensitive adhesive |
US6602958B2 (en) | 2001-07-10 | 2003-08-05 | Ips Corporation | Adhesives for bonding composites |
ATE530951T1 (de) * | 2001-07-26 | 2011-11-15 | Basf Se | Lichtempfindliche harzzusammensetzung |
US20030095388A1 (en) | 2001-11-16 | 2003-05-22 | Jinbao Jiao | Method and apparatus for securing a circuit board to a rigid surface |
US6866919B2 (en) | 2002-02-21 | 2005-03-15 | Mitsubishi Gas Chemical Company, Inc. | Heat-resistant film base-material-inserted B-stage resin composition sheet for lamination and use thereof |
US6613587B1 (en) * | 2002-04-11 | 2003-09-02 | Micron Technology, Inc. | Method of replacing at least a portion of a semiconductor substrate deposition chamber liner |
BR0312763A (pt) | 2002-07-19 | 2005-04-26 | Avery Dennison Corp | Rótulo e método de rotulação empregando adesivos curáveis em duas partes |
US6613857B1 (en) * | 2002-07-26 | 2003-09-02 | Avery Dennison Corporation | UV-crosslinked, pressure-sensitive adhesives |
MXPA05001109A (es) | 2002-07-31 | 2005-09-08 | Surface Specialties Sa | Adhesivos de acrilico sensibles a la presion. |
WO2004015019A1 (en) | 2002-07-31 | 2004-02-19 | Nexicor Llc | Induction bondable high-pressure laminate |
US6653408B1 (en) | 2002-11-21 | 2003-11-25 | Kraton Polymers U.S. Llc | Compositions comprising a functionalized block copolymer crosslinked with aluminum acetylacetonate |
US6887917B2 (en) | 2002-12-30 | 2005-05-03 | 3M Innovative Properties Company | Curable pressure sensitive adhesive compositions |
US7225992B2 (en) | 2003-02-13 | 2007-06-05 | Avery Dennison Corporation | RFID device tester and method |
DE10322898A1 (de) | 2003-05-21 | 2004-12-16 | Tesa Ag | Flammfeste und Hitze-aktivierbare Haftklebemassen |
KR101204197B1 (ko) | 2003-06-06 | 2012-11-26 | 히다치 가세고교 가부시끼가이샤 | 접착시트, 다이싱 테이프 일체형 접착시트 및 반도체장치의 제조방법 |
JPWO2004108778A1 (ja) | 2003-06-09 | 2006-09-14 | 三井化学株式会社 | 架橋性メタクリル樹脂組成物および透明部材 |
US7170001B2 (en) | 2003-06-26 | 2007-01-30 | Advent Solar, Inc. | Fabrication of back-contacted silicon solar cells using thermomigration to create conductive vias |
US7691437B2 (en) | 2003-10-31 | 2010-04-06 | 3M Innovative Properties Company | Method for preparing a pressure-sensitive adhesive |
US7270889B2 (en) | 2003-11-04 | 2007-09-18 | Kimberly-Clark Worldwide, Inc. | Tackified amorphous-poly-alpha-olefin-bonded structures |
JPWO2005042612A1 (ja) * | 2003-11-04 | 2007-04-05 | 綜研化学株式会社 | 重合性組成物及び(メタ)アクリル系熱伝導性シート |
US7144751B2 (en) | 2004-02-05 | 2006-12-05 | Advent Solar, Inc. | Back-contact solar cells and methods for fabrication |
US7157584B2 (en) * | 2004-02-25 | 2007-01-02 | Takeda Pharmaceutical Company Limited | Benzimidazole derivative and use thereof |
EA011898B1 (ru) | 2004-03-09 | 2009-06-30 | Спир Груп Холдингз Лимитед | Этикетка для стеклянной бутылки и способ ее удаления |
US7524911B2 (en) | 2004-03-17 | 2009-04-28 | Dow Global Technologies Inc. | Adhesive and marking compositions made from interpolymers of ethylene/α-olefins |
US7088248B2 (en) | 2004-03-24 | 2006-08-08 | Avery Dennison Corporation | System and method for selectively reading RFID devices |
WO2005103178A1 (en) | 2004-03-29 | 2005-11-03 | Avery Dennison Corporation | Anaerobic pressure sensitive adhesive |
US7645829B2 (en) | 2004-04-15 | 2010-01-12 | Exxonmobil Chemical Patents Inc. | Plasticized functionalized propylene copolymer adhesive composition |
US20050266237A1 (en) | 2004-05-28 | 2005-12-01 | Siddhartha Asthana | Heat-activated sound and vibration damping sealant composition |
EP1640388B1 (en) | 2004-09-24 | 2015-02-25 | Rohm and Haas Company | Biomass based Michael addition composition |
AU2005299092B2 (en) | 2004-10-22 | 2010-02-18 | Sato, Kabushiki Kaisha | A method for applying a RFID tag carrying label on an object |
CN101053004B (zh) | 2004-11-10 | 2012-01-11 | 艾利丹尼森公司 | 模内标签及其用途 |
US7212127B2 (en) | 2004-12-20 | 2007-05-01 | Avery Dennison Corp. | RFID tag and label |
JP5231986B2 (ja) | 2005-03-17 | 2013-07-10 | ダウ グローバル テクノロジーズ エルエルシー | 官能化エチレン/α−オレフィン共重合体組成物 |
KR101413315B1 (ko) | 2005-03-17 | 2014-06-27 | 다우 글로벌 테크놀로지스 엘엘씨 | 에틸렌/알파-올레핀 혼성중합체로부터 제조된 접착제 및표지 조성물 |
US7786216B2 (en) | 2005-03-17 | 2010-08-31 | Dow Global Technologies Inc. | Oil based blends of interpolymers of ethylene/α-olefins |
US7756154B2 (en) | 2005-03-22 | 2010-07-13 | Netapp, Inc. | Shared implementation for multiple system interfaces |
TWI353360B (en) | 2005-04-07 | 2011-12-01 | Nippon Catalytic Chem Ind | Production process of polyacrylic acid (salt) wate |
US7298266B2 (en) | 2005-05-09 | 2007-11-20 | Avery Dennison | RFID communication systems and methods |
JP4634856B2 (ja) | 2005-05-12 | 2011-02-16 | 利昌工業株式会社 | 白色プリプレグ、白色積層板、及び金属箔張り白色積層板 |
US8287949B2 (en) | 2005-07-07 | 2012-10-16 | Dow Global Technologies Inc. | Aqueous dispersions |
CN101223257B (zh) | 2005-07-19 | 2011-06-29 | 陶氏康宁公司 | 压敏粘合剂及其制备方法 |
JP4711777B2 (ja) | 2005-08-11 | 2011-06-29 | 日東電工株式会社 | 粘着シートとその製造方法、及び、製品の加工方法 |
US20100311920A1 (en) * | 2005-08-26 | 2010-12-09 | Cid Centro De Investigacion Y Desarrollo Tecnologico Sa De Cv | Using Reactive Block Copolymers as Chain Extenders and Surface Modifiers |
US20070088145A1 (en) | 2005-10-19 | 2007-04-19 | Mgaya Alexander P | Adhesive useful for film laminating applications |
US20070092733A1 (en) | 2005-10-26 | 2007-04-26 | 3M Innovative Properties Company | Concurrently curable hybrid adhesive composition |
ES2557155T3 (es) | 2005-12-01 | 2016-01-22 | Henkel Ag & Co. Kgaa | Nuevo material formador de estructuras supramoleculares, proceso y usos |
CN101000899A (zh) | 2006-01-11 | 2007-07-18 | 南茂科技股份有限公司 | 晶片封装结构 |
US20070231571A1 (en) | 2006-04-04 | 2007-10-04 | Richard Lane | Pressure sensitive adhesive (PSA) laminates |
US8785531B2 (en) | 2006-07-06 | 2014-07-22 | Dow Global Technologies Llc | Dispersions of olefin block copolymers |
DE112007001861B4 (de) | 2006-08-08 | 2022-08-11 | World Properties, Inc. | Schaltungsmaterial mit verbesserter Bindung, Verfahren zu dessen Herstellung und mehrschichtige Schaltung |
JP2008060151A (ja) | 2006-08-29 | 2008-03-13 | Nitto Denko Corp | 半導体ウエハ裏面加工方法、基板裏面加工方法、及び放射線硬化型粘着シート |
US8074022B2 (en) | 2006-09-28 | 2011-12-06 | Virident Systems, Inc. | Programmable heterogeneous memory controllers for main memory with different memory modules |
US7776969B2 (en) | 2006-12-04 | 2010-08-17 | Bayer Materialscience Llc | Allophanate-modified stabilizers and the polymer polyols prepared from these stabilizers |
CN101547988B (zh) * | 2006-12-07 | 2014-01-29 | 3M创新有限公司 | 具有多种增粘剂的嵌段共聚物共混物粘合剂 |
TW200842174A (en) * | 2006-12-27 | 2008-11-01 | Cheil Ind Inc | Composition for pressure sensitive adhesive film, pressure sensitive adhesive film, and dicing die bonding film including the same |
KR100907982B1 (ko) * | 2006-12-27 | 2009-07-16 | 제일모직주식회사 | 점착필름 형성용 조성물에 의한 반도체 패키지용 점착필름을 포함하는 다이싱 다이본드 필름 |
WO2008093398A1 (ja) | 2007-01-30 | 2008-08-07 | Asics Corporation | シューズの製造方法、及びシューズ |
JP5089201B2 (ja) | 2007-03-12 | 2012-12-05 | 日東電工株式会社 | アクリル系粘着テープ又はシート、およびその製造方法 |
EP2139967B1 (en) | 2007-03-21 | 2014-12-10 | Avery Dennison Corporation | Pressure sensitive adhesives |
JP5419376B2 (ja) | 2007-04-20 | 2014-02-19 | 日東電工株式会社 | 粘着シートの自動車塗膜面への接着方法 |
JP5038770B2 (ja) | 2007-05-01 | 2012-10-03 | 日東電工株式会社 | 車両用塗膜面に対する粘着シートの接着方法 |
JP5118880B2 (ja) * | 2007-05-08 | 2013-01-16 | 日東電工株式会社 | 粘着剤組成物及びそれを用いた粘着製品、ディスプレイ |
US8334037B2 (en) * | 2007-05-11 | 2012-12-18 | 3M Innovative Properties Company | Multi-layer assembly, multi-layer stretch releasing pressure-sensitive adhesive assembly, and methods of making and using the same |
BRPI0815310B1 (pt) | 2007-08-24 | 2019-05-14 | Dow Global Technologies Inc. | Composição adesiva, artigo e método de aplicação de uma composição adesiva |
KR100922684B1 (ko) * | 2007-08-31 | 2009-10-19 | 제일모직주식회사 | 점착층용 광경화 조성물 및 이를 포함하는 다이싱 테이프 |
DE602007012372D1 (de) | 2007-09-19 | 2011-03-17 | Henkel Ag & Co Kgaa | Hochdämpfendes, expandierbares material und vorrichtungen |
US20090142506A1 (en) | 2007-11-29 | 2009-06-04 | Bayer Material Science Llc | Ethylenically unsaturated polyisocyanate addition compounds based on lysine triisocyanate, their use in coating compositions and processes for their preparation |
EP2224483A1 (en) * | 2007-12-04 | 2010-09-01 | Hitachi Chemical Company, Ltd. | Photosensitive adhesive |
US7786868B2 (en) | 2007-12-11 | 2010-08-31 | Avery Dennison Corporation | RFID device with multiple passive operation modes |
JP2009256607A (ja) | 2008-03-17 | 2009-11-05 | Nitto Denko Corp | アクリル系粘着剤、アクリル系粘着剤層、アクリル系粘着テープ又はシート |
ES2518417T3 (es) | 2008-04-30 | 2014-11-05 | Tesa Se | Cinta adhesiva |
US8289165B2 (en) | 2008-06-11 | 2012-10-16 | Avery Dennison Corporation | RFID device with conductive loop shield |
EP2302012B1 (en) | 2008-07-16 | 2015-03-18 | LG Chem, Ltd. | Pressure-sensitive adhesive composition, polarization plate, and liquid crystal display |
EP2307516B1 (en) | 2008-07-28 | 2012-09-05 | Dow Corning Corporation | Composite article |
US8080177B2 (en) | 2008-08-19 | 2011-12-20 | The Boeing Company | Low RF loss static dissipative adhesive |
BRPI0917383A2 (pt) * | 2008-08-27 | 2015-11-17 | Hitachi Chemical Co Ltd | composicao adesiva fotossensivel, adesivo em pelicula fotossensevel, padrao adesivo, wafer semicondutor com adesivo, dispositivo semicondutor e componente eletronico |
DE102008045802A1 (de) | 2008-09-05 | 2010-03-11 | Henkel Ag & Co. Kgaa | Schmelzklebstoff auf Basis von Metallocene-katalysierten Olefin-α-Olefin Copolymeren |
US8068028B2 (en) | 2008-09-26 | 2011-11-29 | Avery Dennison Corporation | Encapsulated RFID device for flexible, non-planar or curvilinear surfaces |
WO2010039623A2 (en) | 2008-09-30 | 2010-04-08 | Henkel Corporation | Shear-and/or pressure-resistant microspheres |
KR101605221B1 (ko) | 2008-12-26 | 2016-03-21 | 도요보 가부시키가이샤 | 접착제용 수지 조성물, 이것을 함유하는 접착제, 접착 시트 및 이것을 접착층으로서 포함하는 프린트 배선판 |
AT12321U1 (de) | 2009-01-09 | 2012-03-15 | Austria Tech & System Tech | Multilayer-leiterplattenelement mit wenigstens einem laserstrahl-stoppelement sowie verfahren zum anbringen eines solchen laserstrahl- stoppelements in einem multilayer- leiterplattenelement |
US20100200063A1 (en) | 2009-02-12 | 2010-08-12 | Derek Djeu | Thin film solar cell |
JP5294931B2 (ja) | 2009-03-11 | 2013-09-18 | 日東電工株式会社 | アクリル系粘着シート |
EP2236534A1 (de) | 2009-03-31 | 2010-10-06 | Sika Technology AG | Zweistufig aushärtende Zusammensetzung enthaltend ein oberflächendesaktiviertes Polyisocyanat |
JP5404174B2 (ja) | 2009-05-14 | 2014-01-29 | 日東電工株式会社 | 熱剥離性感圧接着テープ又はシート |
JP2011026551A (ja) * | 2009-05-21 | 2011-02-10 | Kaneka Corp | 紫外線硬化型粘接着剤組成物 |
KR20120029421A (ko) | 2009-06-11 | 2012-03-26 | 헨켈 코포레이션 | 다관능성 디엔 및 친디엔체 화합물을 함유하는 열 가역성 핫 멜트 접착제 조성물 |
US8593256B2 (en) | 2009-06-23 | 2013-11-26 | Avery Dennison Corporation | Washable RFID device for apparel tracking |
TR201900737T4 (tr) | 2009-07-24 | 2019-02-21 | Bostik Inc | Olefin blok kopoli̇merleri̇ bazli sicakta eri̇yen yapişkan. |
US8242185B2 (en) | 2009-08-03 | 2012-08-14 | Morgan Adhesives Company | Adhesive compositions for easy application and improved durability |
DE112010003180T5 (de) * | 2009-08-04 | 2012-07-26 | 3M Innovative Properties Company | Haftklebstoff aus einem Gemisch von nicht-halogeniertemPolyisobutylen und thermoplastischem Elastomer |
WO2011033736A1 (ja) | 2009-09-16 | 2011-03-24 | 日東電工株式会社 | アクリル系粘着テープ |
AU2010298113A1 (en) | 2009-09-24 | 2012-04-12 | Avery Dennison Corporation | Acrylic compositions for adhering to low surface energy subtrates |
JP2011096988A (ja) * | 2009-11-02 | 2011-05-12 | Keiwa Inc | 太陽電池モジュール裏面保護用粘着シート及びこれを用いた太陽電池モジュール |
EP2513220B1 (en) | 2009-12-16 | 2013-11-06 | Avery Dennison Corporation | Photovoltaic backsheet |
EP2513242B1 (en) * | 2009-12-18 | 2015-09-02 | 3M Innovative Properties Company | Pressure sensitive adhesives for low surface energy substrates |
US8759664B2 (en) | 2009-12-28 | 2014-06-24 | Hanergy Hi-Tech Power (Hk) Limited | Thin film solar cell strings |
KR101816330B1 (ko) | 2010-03-09 | 2018-01-08 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 디스플레이 패널을 접합하기 위한 열 활성화 광학 투명 접착제 |
WO2011119393A2 (en) | 2010-03-26 | 2011-09-29 | 3M Innovative Properties Company | Method of sterilization of wound dressings |
JP2011231319A (ja) | 2010-04-09 | 2011-11-17 | Nitto Denko Corp | 粘着性組成物およびアクリル系粘着テープ |
JP5749052B2 (ja) | 2010-04-12 | 2015-07-15 | 日東電工株式会社 | 硬化多層シートの製造方法及び硬化多層シート |
KR20170118955A (ko) | 2010-05-11 | 2017-10-25 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 경화성 조성물, 감압 접착제, 그의 제조 방법, 및 접착 용품 |
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JP5432853B2 (ja) | 2010-07-30 | 2014-03-05 | 日東電工株式会社 | ダイシングテープ一体型半導体裏面用フィルム及びその製造方法並びに半導体装置の製造方法 |
US20130136874A1 (en) | 2010-08-18 | 2013-05-30 | 3M Innovative Properties Company | Optical assemblies including stress-relieving optical adhesives and methods of making same |
CN103189461B (zh) | 2010-08-26 | 2016-05-11 | 汉高知识产权控股有限责任公司 | 低应用温度无定形聚-α-烯烃粘合剂 |
CN103097483B (zh) | 2010-08-27 | 2016-03-09 | 日东电工株式会社 | 丙烯酸类粘合剂组合物、丙烯酸类粘合剂层以及丙烯酸类粘合带 |
DE102010035889B4 (de) | 2010-08-30 | 2021-11-11 | Bundesdruckerei Gmbh | Wert- und/oder Sicherheitsdokument und Verfahren zu dessen Herstellung |
CN103108930B (zh) | 2010-09-17 | 2014-08-20 | 昭和电工株式会社 | 光固化性透明粘合片用组合物 |
JP6144868B2 (ja) | 2010-11-18 | 2017-06-07 | 日東電工株式会社 | フリップチップ型半導体裏面用フィルム、ダイシングテープ一体型半導体裏面用フィルム、及び、フリップチップ型半導体裏面用フィルムの製造方法 |
MY169514A (en) | 2010-11-23 | 2019-04-19 | Adhesives Res Inc | Reactive conductive pressure-sensitive adhesive tape |
CN103548093B (zh) | 2010-11-23 | 2016-08-10 | 西屋电气有限责任公司 | 全谱的loca评价模型及分析方法 |
EP2652060B1 (en) | 2010-12-13 | 2017-02-22 | 3M Innovative Properties Company | Pressure sensitive adhesives for low surface energy substrates |
US20120165455A1 (en) | 2010-12-22 | 2012-06-28 | Bostik, Inc. | OBC Based Packaging Adhesive |
JP5689336B2 (ja) | 2011-03-03 | 2015-03-25 | 日東電工株式会社 | 加熱剥離型粘着シート |
JP2012193317A (ja) | 2011-03-17 | 2012-10-11 | Nitto Denko Corp | 電子部品仮固定用粘着テープ |
EP2688967B1 (en) | 2011-03-24 | 2018-08-15 | Henkel IP & Holding GmbH | Stretch film lamination adhesive |
CN103562332B (zh) | 2011-04-08 | 2017-08-04 | 波士胶公司 | 含有固体增塑剂的基于聚烯烃的热熔粘合剂 |
JP2012229375A (ja) | 2011-04-27 | 2012-11-22 | Nitto Denko Corp | 粘着シート |
US9000659B2 (en) | 2011-05-09 | 2015-04-07 | Kenneth S. Chin | Lamp socket |
TWI564362B (zh) * | 2011-05-10 | 2017-01-01 | Dexerials Corp | Double - sided adhesive tape and manufacturing method thereof |
EP2545798B1 (en) | 2011-07-13 | 2018-02-21 | 3M Innovative Properties Company | Sanitary product system |
EP2546053B1 (en) * | 2011-07-15 | 2013-12-11 | Nitto Denko Corporation | Double-sided pressure-sensitive adhesive sheet |
EP2551102B1 (en) | 2011-07-29 | 2014-12-03 | 3M Innovative Properties Company | Self-stick foam adhesive |
EP2581423A1 (en) | 2011-10-14 | 2013-04-17 | 3M Innovative Properties Company | Primerless multilayer adhesive film for bonding glass substrates |
KR101367177B1 (ko) | 2011-11-08 | 2014-02-27 | 주식회사 엘지화학 | 대전방지성 보호필름용 점착제 조성물 및 이의 제조방법 |
DE102011088170A1 (de) | 2011-12-09 | 2013-06-13 | Bayer Materialscience Aktiengesellschaft | Reaktive Haftklebstoffe |
US20140335299A1 (en) | 2011-12-22 | 2014-11-13 | 3M Innovative Properties Company | Olefinic block copolymer based pressure sensitive adhesives |
DE102012200854A1 (de) | 2012-01-20 | 2013-07-25 | Tesa Se | Vernetzer-Beschleuniger-System für Polyacrylate |
WO2013115851A1 (en) | 2012-02-03 | 2013-08-08 | Avery Dennison Corporation | Laser patterning of photovoltaic backsheet |
CN104169386B (zh) | 2012-03-12 | 2016-10-26 | Lg化学株式会社 | 压敏性粘合剂组合物 |
JP5900091B2 (ja) | 2012-03-27 | 2016-04-06 | 大日本印刷株式会社 | 化粧シート及びそれを有する化粧板 |
JP6226951B2 (ja) | 2012-03-30 | 2017-11-08 | ダウ グローバル テクノロジーズ エルエルシー | ポリオレフィン接着剤組成物 |
JP6188252B2 (ja) | 2012-03-30 | 2017-08-30 | シラス・インコーポレイテッド | 重合性組成物の活性化方法、重合系およびこれにより形成される製品 |
CN102634286B (zh) | 2012-05-17 | 2013-08-14 | 深圳市飞世尔实业有限公司 | 一种光热双重固化型异方性导电膜的制备方法 |
EP2857474A4 (en) | 2012-05-29 | 2016-02-17 | Nitto Denko Corp | ADHESIVE AND TRANSPARENT SUBSTRATE THEREWITH |
DE102012209116A1 (de) | 2012-05-30 | 2013-12-05 | Tesa Se | Heißsiegelbares Klebeband |
DE102013209827A1 (de) | 2012-06-21 | 2013-12-24 | Tesa Se | Hitzebeständiges Klebeband |
JP5961055B2 (ja) | 2012-07-05 | 2016-08-02 | 日東電工株式会社 | 封止樹脂シート、電子部品パッケージの製造方法及び電子部品パッケージ |
WO2014007219A1 (ja) | 2012-07-05 | 2014-01-09 | 株式会社スリーボンド | シート状接着剤およびこれを用いた有機elパネル |
US10471681B2 (en) | 2012-07-26 | 2019-11-12 | 3M Innovative Properties Company | Heat de-bondable adhesive articles |
EP2877883B1 (en) | 2012-07-26 | 2017-08-23 | 3M Innovative Properties Company | Heat de-bondable optical articles |
AU2013329253B2 (en) * | 2012-10-09 | 2017-02-23 | Avery Dennison Corporation | Adhesives and related methods |
US20140162082A1 (en) | 2012-12-07 | 2014-06-12 | H.B. Fuller Company | Composition, an article and a method for the bonding of non-woven substrates |
US9023954B1 (en) | 2012-12-26 | 2015-05-05 | The United States Of America As Represented By The Secretary Of The Navy | Side-chain and end-group modified poly-p-phenylene oligomers |
ES2676694T3 (es) | 2013-01-24 | 2018-07-24 | Basf Se | Productos adhesivos reactivos sensibles a la presión |
BR112015017383A2 (pt) | 2013-01-24 | 2017-07-11 | Henkel Ag & Co Kgaa | composições de adesivo de fusão a quente espumável e uso das mesmas |
CA2904584A1 (en) | 2013-03-05 | 2014-09-12 | Avery Dennison Corporation | Differential dual functional foam tapes |
UA120162C2 (uk) | 2013-03-06 | 2019-10-25 | Інсайт Холдінгс Корпорейшн | Способи і проміжні сполуки при отриманні інгібітора jak |
CN107779091B (zh) | 2013-03-28 | 2020-05-19 | 美国陶氏有机硅公司 | 有机硅氧烷组合物和涂层、制成品、方法及用途 |
CN103275656B (zh) | 2013-05-29 | 2015-07-08 | 北京化工大学 | 固化后具有结构胶性能的反应型压敏胶黏剂及其制备方法 |
BR112016006260A2 (pt) | 2013-09-23 | 2017-08-01 | Lubrizol Advanced Mat Inc | sistema de adesivo, e, artigo adesivo |
US9982171B2 (en) | 2013-09-25 | 2018-05-29 | Bostik, Inc. | Hot melt adhesive with functionalized metallocene catalyzed polyolefins |
CN104870590A (zh) | 2013-10-10 | 2015-08-26 | 艾利丹尼森公司 | 胶黏剂和相关方法 |
CN106471083A (zh) | 2014-06-18 | 2017-03-01 | 艾利丹尼森公司 | 可转变压敏胶粘剂、制品及相关方法 |
RU2705509C2 (ru) | 2014-09-29 | 2019-11-07 | Авери Деннисон Корпорейшн | Метка радиочастотной идентификации для отслеживания шины |
BR112017016860A2 (pt) | 2015-02-05 | 2018-03-27 | Avery Dennison Corp | conjuntos de etiquetas para ambientes adversos |
US10526511B2 (en) | 2016-12-22 | 2020-01-07 | Avery Dennison Corporation | Convertible pressure sensitive adhesives comprising urethane (meth)acrylate oligomers |
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