CN102634286B - 一种光热双重固化型异方性导电膜的制备方法 - Google Patents

一种光热双重固化型异方性导电膜的制备方法 Download PDF

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CN102634286B
CN102634286B CN2012101539706A CN201210153970A CN102634286B CN 102634286 B CN102634286 B CN 102634286B CN 2012101539706 A CN2012101539706 A CN 2012101539706A CN 201210153970 A CN201210153970 A CN 201210153970A CN 102634286 B CN102634286 B CN 102634286B
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肖仁亮
赵昌后
刘呈贵
万贤飞
杨常武
尹化国
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Shenzhen Fisher New Material Co Ltd
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Abstract

本发明公开了一种光热双重固化型异方性导电胶,包括下列重量百分比的组分:光固化活性单体15.0-18.0%;光固化树脂4.5-12.5%;热固型树脂20.0-25.0%;弹性体5.0-10.0%;纳米绝缘粒子8.0-15.0%;导电微粒4.0-18.0%;光固化剂3.0-5.0%;潜伏性热固化剂12.0-16.0%。本发明还提出一种用上述导电胶制备的导电膜及其制备方法。本发明利用紫外光固化技术制造ACF,避免使用溶剂,保护环境,无污染,利用热固化使用ACF,保证邦定的品质及其可靠性。

Description

一种光热双重固化型异方性导电膜的制备方法
技术领域
本发明属于微电子封装技术领域,具体涉及一种通过光热双重固化的异方形导电膜的制备方法。
背景技术
异方性导电胶膜(Anisotropic Conductive Film;ACF)兼具单向导电及胶合固定的功能,目前使用于COG、TCP/COF、COB及FPC,其中尤以IC与ITO玻璃之电连接最受瞩目。可以解决一些以往连接器无法处理的细微导线连接问题。
异方性导电胶膜主要应用在移动手持设备、手机、数码相机、电脑、打印机、键盘、消费电子、电视机、GPS、电子词典等产品上。
现行的异方性导电膜是由热固性树脂、导电粒子、固化剂、增塑剂等组成,制造ACF时先要将上述成分溶解于甲苯、丁酮等挥发性溶剂中配制成异方性导电胶,再将导电胶涂布于塑料薄膜上,经过热风干燥去掉溶剂而成胶膜,再经过分切制成异方性导电胶带。生产过程中产生大量污染环境影响工人健康的有害废气。
而索尼化学专利CN1926675A、清华大学专利CN1367219A均提出光固化型异方性导电胶或导电膜,这些专利都是在使用ACF连接电子元件时采用光固化技术,该导电胶只能适用于透明电极(如ITO玻璃)的连接,而不适用于不透明电极(如等离子显示屏ADD等)。中国专利CN101724361提出以热固化促进光固化的方式,而不是采用光固化技术制造异方性导电膜。况且光固化的粘着强度不及热固化,近年来微电子封装技术中,电路板端子、IC芯片等电子元件之间的互联技术向集成化、高性能、多引线、窄间距的方向发展,对于异方性导电膜(ACF)的性能要求越来越高,光固化不能满足高粘结强度的要求。
发明内容
本发明要解决的技术问题在于:克服现有技术制造ACF采用溶剂造成严重的环境污染问题,采用光热双重固化技术制备异方性导电膜,用光固化方式制造ACF膜,避免使用溶剂,保护环境。最终进行电连接时采用热固化方式,保证互联电子元件之间的粘结强度。
为了解决上述技术问题,本发明提出以下技术方案:一种光热双重固化型异方性导电膜的制备方法,包括以下步骤:
步骤一:按照重量百分比称取光固化活性单体15.0-18.0%;光固化树脂4.5-12.5%;热固型树脂20.0-25.0%;弹性体5.0-10.0%;增塑剂3.0-6.0%;纳米绝缘粒子8.0-15.0%;导电微粒4.0-18.0%;光固化剂3.0-5.0%;潜伏性热固化剂12.0-16.0%;偶联剂0.5-1.0%;流平剂0.5-1.5%;抗氧剂0.5-1.0%;
步骤二:将其中固态的光固化树脂、热固型树脂、弹性体放入分散混合机中加热熔化,熔融温度是130-150℃,形成混合物;
步骤三:将液态的光固化活性单体、增塑剂加入上述混合物中,温度不超过80℃;
步骤四:将流平剂、抗氧剂、纳米绝缘粒子依次加入上述混合物中;
步骤五:将导电微粒加入上述混合物中;
步骤六:将光固化剂、潜伏性热固化剂、偶联剂加入上述混合物中,制得光热双重固化型异方性导电胶;
步骤七:用涂布机把上述导电胶涂布在一塑料薄膜基材上;
步骤八:将步骤七所得的半成品,通过紫外固化机,进行紫外光固化干燥成膜;
步骤九:将步骤八所得的半成品,经分条机粗切、精切、收卷得到ACF胶带成品。
上述技术方案的进一步限定在于,上述光固化剂、潜伏性热固化剂都属于自由基型或离子型或两者的混合物的潜伏性固化剂;
上述光固化剂由下列一种或者多种物质的混合物组成:苯偶姻醚衍生物、苯偶酰衍生物、二烷氧基苯乙酮、α-羟烷基苯酮、α-氨烷基苯酮、酰基膦氧化物、芳基过氧酯化合物、苯甲酰甲酸酯、二苯甲酮、叔胺、硫杂蒽酮、叔胺、蒽醌、叔胺、二苯基碘鎓盐;
上述潜伏性热固化剂由下列一种或者多种物质的混合物组成:双氰胺、乙二酸二酰肿、葵二酸二酰肿、1-苄基-2-2基咪唑、2MI-AER331环氧树脂加成物、微胶囊固化剂、BF3MEA\2MZ-AZINE、双氰基马来腈、二烯丙基三聚氰胺、聚(哌啶葵二酸)酰肼、三氟化硼苄胺络合物。
上述技术方案的进一步限定在于,上述光固化活性单体由下列一种或者多种物质的混合物组成:甲基丙烯酸羟乙酯、甲基丙烯酸酯羟丙酯、(甲基)丙烯酸异冰片酯、乙氧基乙氧基丙烯酸酯、月桂酸(甲基)丙烯酸酯、2-苯氧基乙基丙烯酸酯、2-二甲基丙酯二丙烯酸酯、三环癸烷二甲醇二丙烯酸酯、乙氧化双酚A二丙烯酸酯、(乙氧化-)2-甲基-1,3丙二醇二丙烯酸酯、二(三)丙二醇二丙烯酸酯、三(2-羟乙基)异氰尿酸三丙烯酸酯、乙氧化(丙氧化)三羟甲基丙烷三丙烯酸酯、丙氧化甘油三丙烯酸酯、二-三羟甲基丙烷四丙烯酸酯、(乙氧化)季戊四醇四丙烯酸酯、双季戊四醇五丙烯酸酯、双季戊四醇六丙烯酸酯。
上述技术方案的进一步限定在于,上述光固化树脂由下列一种或者多种物质的混合物组成:不饱和聚酯、环氧丙烯酸树脂、聚氨酯丙烯酸树脂、聚酯丙烯酸树脂、聚醚丙烯酸树脂、丙烯酸酯官能化的聚丙烯酸树脂、含不饱和双键的聚烯烃树脂、各种环氧树脂、环氧官能化聚硅氧烷树脂、具有乙烯基醚官能基的树脂。
上述技术方案的进一步限定在于,上述热固型树脂由下列类型中的一种或者多种物质的混合物组成:缩水甘油醚型环氧树脂、缩水甘油酯型环氧树脂、缩水甘油胺型环氧树脂、脂环族环氧树脂、线性脂肪族环氧化合物。
上述技术方案的进一步限定在于,上述弹性体由下列一种或者多种物质的混合物组成:端环氧基丁腈橡胶、聚氨酸酯橡胶、液体端羟基丁腈橡胶、羟基丁腈橡胶、端羟基聚丁二烯、聚硫橡胶、丙烯酸橡胶。
上述技术方案的进一步限定在于,上述导电微粒由下列一种组成:在高分子微球表面镀有铜、镍、金、银、锡、锌、钯、铁、钨、钼的复合导电粒子。
上述技术方案的进一步限定在于,上述纳米绝缘粒子由下列一种或者多种物质的混合物组成:纳米陶瓷粉、纳米SiO2、纳米TiO2、纳米碳酸钙。
上述技术方案的进一步限定在于,上述流平剂由下列一种或者多种物质的混合物组成:聚二甲基硅氧烷,聚甲基苯基硅氧烷。
上述技术方案的进一步限定在于,上述偶联剂由下列一种或者多种物质的混合物组成:(β-(3.4-环氧环己基)乙基三甲氧基硅烷、γ-缩水甘油氧丙基三甲氧基硅烷、γ-(甲基丙烯酰氧)丙基三甲氧基硅烷。
上述技术方案的进一步限定在于,上述抗氧剂由下列一种或者多种物质的混合物组成:芳香胺类抗氧剂、受阻酚类抗氧剂、辅助抗氧剂。
本发明具有如下有益效果:本发明利用紫外光固化技术制造ACF,避免使用溶剂,保护环境,无污染,在使用本发明异方性导电胶膜时,再进行热固化,确保了该导电膜的粘结强度。
附图说明
图1为本发明第一种结构的光热双重固化型异方性导电膜的剖视图。
图2是本发明第一种结构的光热双重固化型异方性导电膜的制备方法的示意图。
图3为本发明第二种结构的光热双重固化型异方性导电膜的剖视图。
图4是本发明第二种结构的光热双重固化型异方性导电膜的制备方法的示意图。
图5是本发明用于制备光热双重固化型异方性导电膜的自转公转速比可调的脱泡搅拌机的剖视示意图。
图6是本发明用于制备光热双重固化型异方性导电膜的自转公转速比可调的脱泡搅拌机的结构示意图。
具体实施方式
本发明提出一种光热双重固化型异方性导电胶,由下列重量百分比的组分组成:
上述光固化剂、潜伏性热固化剂都属于自由基型或离子型或两者的混合物的潜伏性固化剂。
上述光固化活性单体由下列一种或者多种物质的混合物组成:甲基丙烯酸羟乙酯、甲基丙烯酸酯羟丙酯、(甲基)丙烯酸异冰片酯、乙氧基乙氧基丙烯酸酯、月桂酸(甲基)丙烯酸酯、2-苯氧基乙基丙烯酸酯、2-二甲基丙酯二丙烯酸酯、三环癸烷二甲醇二丙烯酸酯、乙氧化双酚A二丙烯酸酯、(乙氧化-)2-甲基-1,3丙二醇二丙烯酸酯、二(三)丙二醇二丙烯酸酯、三(2-羟乙基)异氰尿酸三丙烯酸酯、乙氧化(丙氧化)三羟甲基丙烷三丙烯酸酯、丙氧化甘油三丙烯酸酯、二-三羟甲基丙烷四丙烯酸酯、(乙氧化)季戊四醇四丙烯酸酯、双季戊四醇五丙烯酸酯、双季戊四醇六丙烯酸酯。
上述光固化树脂由下列一种或者多种物质的混合物组成:不饱和聚酯、环氧丙烯酸树脂、聚氨酯丙烯酸树脂、聚酯丙烯酸树脂、聚醚丙烯酸树脂、丙烯酸酯官能化的聚丙烯酸树脂、含不饱和双键的聚烯烃树脂、各种环氧树脂、环氧官能化聚硅氧烷树脂、具有乙烯基醚官能基的树脂。
上述光固化剂由下列一种或者多种物质的混合物组成:苯偶姻醚衍生物、苯偶酰衍生物、二烷氧基苯乙酮、α-羟烷基苯酮、α-氨烷基苯酮、酰基膦氧化物、芳基过氧酯化合物、苯甲酰甲酸酯、二苯甲酮、叔胺、硫杂蒽酮、叔胺、蒽醌、叔胺、二苯基碘鎓盐。
上述热固型树脂优选各种环氧树脂,由下列类型中的一种或者多种物质的混合物组成:缩水甘油醚型环氧树脂、缩水甘油酯型环氧树脂、缩水甘油胺型环氧树脂、脂环族环氧树脂、线性脂肪族环氧化合物。
上述潜伏性热固化剂由下列一种或者多种物质的混合物组成:双氰胺、乙二酸二酰肿、葵二酸二酰肿、1-苄基-2-2基咪唑、2MI-AER331环氧树脂加成物、微胶囊固化剂、BF3MEA\2MZ-AZINE、双氰基马来腈、二烯丙基三聚氰胺、聚(哌啶葵二酸)酰肼、三氟化硼苄胺络合物。
上述弹性体由下列一种或者多种物质的混合物组成:端环氧基丁腈橡胶、聚氨酸酯橡胶、液体端羟基丁腈橡胶、羟基丁腈橡胶、端羟基聚丁二烯、聚硫橡胶、丙烯酸橡胶。
上述导电微粒由下列一种组成:在高分子微球表面镀有铜、镍、金、银、锡、锌、钯、铁、钨、钼的复合导电粒子。
上述纳米绝缘粒子由下列一种或者多种物质的混合物组成:纳米陶瓷粉、纳米SiO2、纳米TiO2、纳米碳酸钙。
上述增塑剂由下列一种或者多种物质的混合物组成:苯二甲酸酯类(包括邻苯、对苯、间苯二甲酸酯)、脂肪族二元酸酯类(包括己二酸酯、壬二酸酯、癸二酸酯)、磷酸酯类(包括磷酸脂肪醇酯、磷酸酚酯和含氯磷酸酯)、多元醇酯类(包括甘油三醋酸酯、一缩二乙二醇苯甲酸酯等)、苯多酸酯类(包括偏苯三酸三辛酯、偏苯三酸三己酯、均苯四酸四酯)、)柠檬酸酯类[包括柠檬酸三乙酯、乙酰柠檬酸三乙酯、柠檬酸三丁酯、乙酰柠檬酸三(2-乙基己)酯等]、聚酯类(包括己二酸丙二醇聚酯、癸二酸丙二醇聚酯、邻苯二甲酸聚酯等)、环氧类(包括环氧大豆油、环氧亚麻子油、环氧油酸丁酯、环氧硬脂酸辛酯、环氧化甘油三酸酯、环氧四氢邻苯二甲酸二辛酯等)、含氯类(包括氯化石蜡、五氯硬脂酸甲酯)、反应性增塑剂(包括顺丁烯二酸二丁酯、马来酸二辛酯、丙烯酸/甲基丙烯酸多元醇酯、富马酸酯、衣康酸酯、不饱和聚酯树脂等)。
上述流平剂由下列一种或者多种物质的混合物组成:聚二甲基硅氧烷,聚甲基苯基硅氧烷。
上述偶联剂由下列一种或者多种物质的混合物组成:(β-(3.4-环氧环己基)乙基三甲氧基硅烷、γ-缩水甘油氧丙基三甲氧基硅烷、γ-(甲基丙烯酰氧)丙基三甲氧基硅烷。
上述抗氧剂由下列一种或者多种物质的混合物组成:芳香胺类抗氧剂、受阻酚类抗氧剂、辅助抗氧剂。
上述光热双重固化型异方性导电胶的制备方法,包括如下步骤:
步骤一:按照重量百分比称取光固化活性单体15.0-18.0%;光固化树脂4.5-12.5%;光固化剂3.0-5.0%;热固型树脂20.0-25.0%;潜伏性热固化剂12.0-16.0%;弹性体5.0-10.0%;增塑剂3.0-6.0%;导电微粒4.0-18.0%;纳米绝缘粒子8.0-15.0%;偶联剂0.5-1.0%;;流平剂0.5-1.5%;抗氧剂0.5-1.0%;
步骤二:将其中固态的光固化树脂、热固型树脂、弹性体放入分散混合机中加热熔化,熔融温度是130-150℃,形成混合物;
步骤三:将液态的光固化活性单体、增塑剂加入上述混合物中,温度不超过80℃;
步骤四:将流平剂、抗氧剂、纳米绝缘粒子依次加入上述混合物中;
步骤五:将导电微粒加入上述混合物中;
步骤六:将光固化剂、潜伏性热固化剂、偶联剂加入上述混合物中,制得光热双重固化型异方性导电胶。
如图1和图3所示,本发明还提出两种不同结构的光热双重固化型异方性导电膜。
图1所示为本发明提出的第一种结构的光热双重固化型异方性导电膜,其包括一层塑料薄膜基材100、一层把上述导电胶涂布在该塑料薄膜基材100上后紫外光固化形成的导电胶层200。
所述塑料薄膜基材100优选PET(polyethylene terephthalate,聚对苯二甲酸乙二醇酯)材料。
图2所示为上述第一种结构的光热双重固化型异方性导电膜制备过程,其包括以下步骤:
步骤一:按照上述方法制备上述光热双重固化型异方性导电胶;
步骤二:用涂布机把上述导电胶涂布在塑料薄膜基材100上;
步骤三:将步骤二所得的半成品,通过紫外固化机,进行紫外光固化干燥成膜,形成的膜即是导电胶层200,即可制得本发明光热双重固化型异方性导电膜;
步骤四:将步骤三所得的半成品,经分条机粗切、精切、收卷得到ACF胶带成品。
图3所示为本发明提出的第二种结构的光热双重固化型异方性导电膜,其包括一层塑料薄膜基材100、一层把上述导电胶涂布在该塑料薄膜基材100上后紫外光固化形成的导电胶层200、一层保护膜层300。
所述塑料薄膜基材100优选PET(polyethylene terephthalate,聚对苯二甲酸乙二醇酯)材料。
图4所示为上述第一种结构的光热双重固化型异方性导电膜制备过程,其包括以下步骤:
步骤一:按照上述方法制备上述光热双重固化型异方性导电胶;
步骤二:把上述导电胶进行脱泡处理后,用涂布机把上述导电胶涂布在塑料薄膜基材100上;
步骤三:将步骤二所得的半成品,通过紫外固化机,进行紫外光固化干燥成膜,形成的膜即是导电胶层200;
步骤四:将一层保护膜300覆盖在该导电胶层200上,即可制得本发明光热双重固化型异方性导电膜;
步骤五:将步骤四所得的半成品,经分条机粗切、精切、收卷得到ACF胶带成品。
上述步骤二对导电胶进行脱泡处理时,需要用到如图5和图6所示的下述自转公转速比可调的脱泡搅拌机,其包括一个第一电机1、一个杯套支架2、一个永磁磁悬浮轴承3、一个第二电机4、一个第二电机同步轮5、一个磁悬浮轴承同步轮6、一个伞形齿轮7、三个同步轮皮带8、两个伞形齿轮同步轮9、四个轴承10、两个混合杯套11、两个杯套同步轮12。
该第一电机1上安装有一转动轴18。启动该第一电机1后,该转动轴18旋转。
该杯套支架2安装在该转动轴18的末端。该杯套支架2包括一个底边22、两个从该底边22两端向上呈135度角延伸的斜边24。
该转动轴18连接在该底边22的下部。
该转动轴18旋转时,该杯套支架2可以随之转动。
该永磁磁悬浮轴承3安装在该转动轴18外,其包括一个中央磁铁31、一个上部磁铁32、一个下部磁铁33、一个悬浮磁铁34。
该中央磁铁31安装在该转动轴18上,该中央磁铁31的上端是N极,下端是S极。
该上部磁铁32安装在该杯套支架2的底边22的下部,其上端是S极,下端是N极。
该下部磁铁33安装在该转动轴18外部,位于该上部磁铁32的下方,该下部磁铁33的上端是S极,下端是N极。
该悬浮磁铁34套设在该中央磁铁31和转动轴18外,且安装在上部磁铁32、下部磁铁33之间,但是并不与该中央磁铁31、转动轴18、上部磁铁32、下部磁铁33相接触。该悬浮磁铁34上端是N极,下端是S极。
该悬浮磁铁34的上端、该中央磁铁31的上端、该上部磁铁32的下端都是N极,并且该悬浮磁铁34的下端、该中央磁铁31的下端、该下部磁铁33的上端都是S极,由于同极相斥的原因,该悬浮磁铁34不与周围其它部件相接触,而是悬在空中,因此该悬浮磁铁34在旋转时几乎没有摩擦力。
该第二电机4包括一个旋转轴42。启动该第二电机4后,该旋转轴42转动。
该第二电机同步轮5安装在该旋转轴42的末端。
该磁悬浮轴承同步轮6套设在该悬浮磁铁34的外部。
该伞形齿轮7包括一个第一齿轮72、两个第二齿轮74。
该第一齿轮72安装在该悬浮磁铁34的外部且位于该磁悬浮轴承同步轮6的上方。
该两个第二齿轮74安装在该第一齿轮72的两端,该第一齿轮72可以通过伞齿轮传动方式带动该两个第二齿轮74旋转。
该三个同步轮皮带8中,其中第一个同步轮皮带8安装在该第二电机同步轮5和该磁悬浮轴承同步轮6之间。
该两个伞形齿轮同步轮9分别安装在该两个第二齿轮74上。
该四个轴承10分别安装在该杯套支架2上。其中两个轴承10连接在该两个伞形齿轮同步轮9上。
该两个混合杯套11分别安装在该另外两个轴承10的上端,因此该两个混合杯套11可旋转地安装在该杯套支架2上。
该两个杯套同步轮12分别安装在该另外两个轴承10的下端。
该另外两个同步轮皮带8分别安装在该两个伞形齿轮同步轮9和两个杯套同步轮12之间。
启动第一电机1,该转动轴18旋转,带动该杯套支架2同步转动,该两个混合杯套11随着该杯套支架2一起旋转,旋转的轴心是该转动轴18,该混合杯套11的此种转动称为“公转”。
启动第二电机4,该旋转轴42旋转,该第二电机同步轮5旋转后通过同步轮皮带8带动该磁悬浮轴承同步轮6旋转,从而带动该悬浮磁铁34和该第一齿轮72同步转动,该第一齿轮72带动该第二齿轮74转动。该第二齿轮74转动后,该两个伞形齿轮同步轮9同步转动,通过同步轮皮带8,带动该两个杯套同步轮12旋转,从而带动该两个混合杯套11转动,该混合杯套11此种转动称为“自转”。
制备实施例1
按照下表来称取组分
Figure GDA00003235127900091
Figure GDA00003235127900101
将其中固态的光固化树脂、热固型树脂、弹性体放入分散混合机中加热熔化,熔融温度是130-150℃,形成混合物;
将液态的光固化活性单体、增塑剂加入上述混合物中,温度不超过80℃;
将流平剂、抗氧剂、纳米绝缘粒子依次加入上述混合物中;
将导电微粒加入上述混合物中;
将光固化剂、潜伏性热固化剂、偶联剂加入上述混合物中,制得本发明光热双重固化型异方性导电胶。
用涂布机把上述导电胶涂布在塑料薄膜基材100上;
将上一步骤所得的半成品,通过紫外固化机,进行紫外光固化干燥成膜,形成的膜即是导电胶层200;
将一层保护膜300覆盖在该导电胶层200上,即可制得本发明光热双重固化型异方性导电膜。
本制备实施例制得的导电膜具有以下物化参数:
Figure GDA00003235127900111
制备实施例2
按照下表来称取组分
Figure GDA00003235127900112
将其中固态的光固化树脂、热固型树脂、弹性体放入分散混合机中加热熔化,熔融温度是130-150℃,形成混合物;
将液态的光固化活性单体、增塑剂加入上述混合物中,温度不超过80℃;
将流平剂、抗氧剂、纳米绝缘粒子依次加入上述混合物中;
将导电微粒加入上述混合物中;
将光固化剂、潜伏性热固化剂、偶联剂加入上述混合物中,制得本发明光热双重固化型异方性导电胶。
用涂布机把上述导电胶于80℃下,涂布在塑料薄膜基材100上;
将上一步骤所得的半成品,通过紫外固化机,进行紫外光固化干燥成膜,形成的膜即是导电胶层200;
将一层保护膜300覆盖在该导电胶层200上,即可制得本发明光热双重固化型异方性导电膜。
本制备实施例制得的导电膜具有以下物化参数:
Figure GDA00003235127900131
制备实施例3
按照下表来称取组分
Figure GDA00003235127900132
Figure GDA00003235127900141
#中国科学院化学研究所
将其中固态的光固化树脂、热固型树脂、弹性体放入分散混合机中加热熔化,熔融温度是130-150℃,形成混合物;
将液态的光固化活性单体、增塑剂加入上述混合物中,温度不超过80℃;
将流平剂、抗氧剂、纳米绝缘粒子依次加入上述混合物中;
将导电微粒加入上述混合物中;
将光固化剂、潜伏性热固化剂、偶联剂加入上述混合物中,制得本发明光热双重固化型异方性导电胶。
用涂布机把上述导电胶涂布在塑料薄膜基材100上;
将上一步骤所得的半成品,通过紫外固化机,进行紫外光固化干燥成膜,形成的膜即是导电胶层200;
将一层保护膜300覆盖在该导电胶层200上,即可制得本发明光热双重固化型异方性导电膜。
本制备实施例制得的导电膜具有以下物化参数:
Figure GDA00003235127900151

Claims (5)

1.一种光热双重固化型异方性导电膜的制备方法,其特征在于,其包括以下步骤:
步骤一:按照重量百分比称取光固化活性单体15.0-18.0%;光固化树脂4.5-12.5%;热固型树脂20.0-25.0%;弹性体5.0-10.0%;增塑剂3.0-6.0%;纳米绝缘粒子8.0-15.0%;导电微粒4.0-18.0%;光固化剂3.0-5.0%;潜伏性热固化剂12.0-16.0%;偶联剂0.5-1.0%;流平剂0.5-1.5%;抗氧剂0.5-1.0%;
步骤二:将其中固态的光固化树脂、热固型树脂、弹性体放入分散混合机中加热熔化,熔融温度是130-150℃,形成混合物;
步骤三:将液态的光固化活性单体、增塑剂加入上述混合物中,温度不超过80℃;
步骤四:将流平剂、抗氧剂、纳米绝缘粒子依次加入上述混合物中;
步骤五:将导电微粒加入上述混合物中;
步骤六:将光固化剂、潜伏性热固化剂、偶联剂加入上述混合物中,制得光热双重固化型异方性导电胶;
步骤七:用涂布机把上述导电胶涂布在一塑料薄膜基材上;
步骤八:将步骤七所得的半成品,通过紫外固化机,进行紫外光固化干燥成膜;
步骤九:将步骤八所得的半成品,经分条机粗切、精切、收卷得到ACF胶带成品;
上述光固化树脂是下列物质的其中一种:乙氧化双酚A二甲基丙烯酸酯;二缩三乙二醇二甲基丙烯酸酯;聚氨酯丙烯酸树脂;
上述热固型树脂是下列物质的其中一种:四酚基乙烷四缩水甘油醚环氧树脂;对氨基苯酚三缩水甘油基环氧树脂。
2.根据权利要求1所述的光热双重固化型异方性导电膜的制备方法,其特征在于,上述弹性体由下列一种或者多种物质的混合物组成:端环氧基丁腈橡胶、聚氨酸酯橡胶、液体端羟基丁腈橡胶、羟基丁腈橡胶、端羟基聚丁二烯、聚硫橡胶、丙烯酸橡胶。
3.根据权利要求1所述的光热双重固化型异方性导电膜的制备方法,其特征在于,上述纳米绝缘粒子由下列一种或者多种物质的混合物组成:纳米陶瓷粉、纳米SiO2、纳米TiO2、纳米碳酸钙。
4.根据权利要求1所述的光热双重固化型异方性导电膜的制备方法,其特征在于,上述流平剂由下列一种或者多种物质的混合物组成:聚二甲基硅氧烷,聚甲基苯基硅氧烷。
5.根据权利要求1所述的光热双重固化型异方性导电膜的制备方法,其特征在于,上述抗氧剂由下列一种或者多种物质的混合物组成:芳香胺类抗氧剂、受阻酚类抗氧剂、辅助抗氧剂。
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Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9725623B2 (en) 2012-10-09 2017-08-08 Avery Dennison Corporation Adhesives and related methods
CN103194166B (zh) * 2013-05-06 2014-05-07 哈尔滨工业大学 光热二重固化导电胶及其制备方法
US20170077056A1 (en) * 2014-02-04 2017-03-16 Dexerials Corporation Anisotropic conductive film and production method of the same
CN104342058B (zh) * 2014-10-25 2016-08-24 深圳飞世尔新材料股份有限公司 一种光固化异方性导电膜的制备方法
EP3253837B1 (en) 2015-02-05 2024-07-31 Avery Dennison Corporation Label assemblies for adverse environments
CN104673113B (zh) * 2015-03-05 2017-06-30 东华大学 一种光热双重固化各向异性导电胶膜及其制备方法
CN105273412B (zh) * 2015-10-18 2017-07-28 北京化工大学 一种防迁出橡胶增塑剂及其制备方法
CN105733469B (zh) * 2016-05-06 2017-10-17 金宝丽科技(苏州)有限公司 一种光固化的导电胶及其制备方法
CN106353940A (zh) * 2016-10-21 2017-01-25 芜湖赋兴光电有限公司 Acf胶制作工艺
US10526511B2 (en) 2016-12-22 2020-01-07 Avery Dennison Corporation Convertible pressure sensitive adhesives comprising urethane (meth)acrylate oligomers
CN109628049A (zh) * 2018-11-09 2019-04-16 深圳市华星光电技术有限公司 一种各向异性导电胶黏剂及其导电膜
CN109593501A (zh) * 2018-11-23 2019-04-09 惠科股份有限公司 粘合组合物、电子产品及其制备方法
CN110643318B (zh) * 2019-09-29 2021-11-16 国网江西省电力有限公司经济技术研究院 一种可光热双重固化的工程胶黏剂及其制备方法和应用
CN110982463A (zh) * 2019-10-30 2020-04-10 上海润势科技有限公司 一种导电胶以及太阳能电池
CN112837844B (zh) * 2021-03-01 2022-07-15 佛山市瑞纳新材科技有限公司 一种有双重固化性能的hjt低温固化银浆及其制备方法
CN113912824B (zh) * 2021-11-29 2023-11-21 广州市白云化工实业有限公司 改性环氧丙烯酸酯预聚体、光热双重固化导电胶及其制备方法
CN115011279B (zh) * 2022-06-21 2023-07-25 深圳田十科技有限公司 一种双重固化模式的导电胶膜材料及制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101600294A (zh) * 2005-05-11 2009-12-09 日立化成工业株式会社 各向异性导电薄膜及使用该薄膜的电路板
CN101724361A (zh) * 2008-12-30 2010-06-09 四川虹欧显示器件有限公司 各向异性导电胶和导电膜以及电连接方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3074867A (en) * 1959-12-22 1963-01-22 Exxon Research Engineering Co Irradiated petroleum resins
JPS556317B2 (zh) * 1973-06-20 1980-02-15
KR100342950B1 (ko) * 1997-11-11 2002-10-19 가부시키가이샤 닛폰 쇼쿠바이 경화성수지및수지조성물
EP1050201B1 (de) * 1998-01-24 2002-04-10 SCHOBER GmbH Werkzeug- und Maschinenbau Verfahren und vorrichtung zum rotativen schneiden von platinen und elektrischen leiterbahnen
US6524721B2 (en) * 2000-08-31 2003-02-25 Matsushita Electric Industrial Co., Ltd. Conductive adhesive and packaging structure using the same
JP2002302662A (ja) 2001-04-05 2002-10-18 Sekisui Chem Co Ltd 熱伝導性電気絶縁感圧接着剤
JP2005123025A (ja) 2003-10-16 2005-05-12 Bridgestone Corp 異方性導電フィルム
KR100622598B1 (ko) * 2004-12-08 2006-09-19 엘에스전선 주식회사 피티씨 특성을 갖는 이방 도전성 접착제
JP2007091959A (ja) * 2005-09-30 2007-04-12 Sumitomo Electric Ind Ltd 異方導電性接着剤
JP2007194122A (ja) * 2006-01-20 2007-08-02 Sumitomo Electric Ind Ltd 導電性ペーストおよびそれを用いた配線基板
KR100787727B1 (ko) * 2006-10-31 2007-12-24 제일모직주식회사 스티렌-아크릴로니트릴 공중합체를 이용한 고신뢰성 이방전도성 필름용 조성물
US8217096B2 (en) * 2007-06-14 2012-07-10 Sekisui Chemical Co., Ltd. Photocurable pressure-sensitive adhesive composition
CN102127386B (zh) * 2010-12-29 2013-11-20 东莞市新懿电子材料技术有限公司 光固化和热固化导电胶及制备方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101600294A (zh) * 2005-05-11 2009-12-09 日立化成工业株式会社 各向异性导电薄膜及使用该薄膜的电路板
CN101724361A (zh) * 2008-12-30 2010-06-09 四川虹欧显示器件有限公司 各向异性导电胶和导电膜以及电连接方法

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