WO2020238383A1 - 指纹检测装置和电子设备 - Google Patents

指纹检测装置和电子设备 Download PDF

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Publication number
WO2020238383A1
WO2020238383A1 PCT/CN2020/081873 CN2020081873W WO2020238383A1 WO 2020238383 A1 WO2020238383 A1 WO 2020238383A1 CN 2020081873 W CN2020081873 W CN 2020081873W WO 2020238383 A1 WO2020238383 A1 WO 2020238383A1
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WO
WIPO (PCT)
Prior art keywords
layer
detection device
fingerprint detection
sensor chip
fingerprint
Prior art date
Application number
PCT/CN2020/081873
Other languages
English (en)
French (fr)
Inventor
王景
刘凯
刘相英
Original Assignee
深圳市汇顶科技股份有限公司
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Priority to CN202080001544.3A priority Critical patent/CN111788576A/zh
Publication of WO2020238383A1 publication Critical patent/WO2020238383A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1324—Sensors therefor by using geometrical optics, e.g. using prisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Definitions

  • the embodiments of the present application relate to the field of fingerprint identification, and more specifically, to fingerprint detection devices and electronic equipment.
  • the under-screen fingerprint recognition solution refers to attaching the optical or ultrasonic fingerprint recognition module to the bottom of the display panel (ie, the light-emitting layer) of the organic light-emitting diode (OLED) screen of the electronic device, that is, regardless of the optical fingerprint Both the identification module and the ultrasonic fingerprint identification module need to be tightly bonded to the bottom of the light-emitting layer.
  • the OLED screen may include a transparent cover plate, a display panel, and a rear panel from top to bottom.
  • the rear panel may include a buffer layer and a copper layer (used as a heat dissipation layer or a radiation prevention layer).
  • a buffer layer and a copper layer used as a heat dissipation layer or a radiation prevention layer.
  • the fingerprint identification module considering the large volume of the fingerprint identification module and the opacity of the rear panel, it is necessary to provide an opening that penetrates the buffer layer and the copper layer on the display screen , And the fingerprint identification module is installed on the lower surface of the display panel in the opening by pasting.
  • the fingerprint identification module sticking the fingerprint identification module to the lower surface of the display panel will make the installation process and disassembly process of the fingerprint identification module too complicated, and reduce the maintainability of the fingerprint identification module.
  • the display screen is pressed or the electronic device falls or collides, since the fingerprint detection device is directly pasted on the display panel, the display panel and the fingerprint detection device will be squeezed. This affects the performance of the display panel and the fingerprint detection device.
  • the display panel is easily damaged, thereby reducing the yield of electronic equipment.
  • a fingerprint detection device and electronic equipment are provided, which can ensure the performance of the fingerprint identification module and the display screen and improve the maintainability of the fingerprint identification module.
  • a fingerprint detection device which is suitable for electronic equipment with a display screen.
  • the display screen includes a transparent cover, a display panel, a buffer layer, and a copper layer from top to bottom, and the display screen is provided with A window penetrating the buffer layer and the copper layer;
  • the fingerprint detection device includes:
  • optical path layer and a first sensor chip, the optical path layer being arranged above the first sensor chip;
  • the first sensor chip is fixedly and electrically connected to the substrate
  • the fixing structure is provided on the upper surface of the substrate and located on the side of the first sensor chip, and the fixing structure passes through the first pressure
  • the sensitive adhesive is fixed to the surrounding area of the window on the lower surface of the copper layer, so that the first sensor chip is aligned with the window setting, and the first sensor chip is used for receiving through the window
  • a fingerprint detection signal returned via a human finger above the display screen and guided by the optical path layer, and the fingerprint detection signal is used to detect fingerprint information of the finger.
  • the optical path layer is directly arranged on the upper surface of the first sensor chip, and the lower surface of the first sensor chip is fixed on the substrate by the first fixing glue, which can avoid carrying the optical path alone.
  • the layer and the first sensor chip are provided with a casing, which reduces the size (for example, thickness) of the fingerprint detection device.
  • the optical path layer is directly arranged on the upper surface of the first sensor chip, and the lower surface of the first sensor chip is fixed on the substrate by the first fixing glue, so that the components are closely matched in the thickness direction (that is, the components Close fit in the thickness direction without leaving a gap), based on the current thickness of the middle frame, even if the buffer layer and copper layer in the display screen are retained, the bottom of the fingerprint detection device can be A gap is reserved between the batteries of the device, which is sufficient to set the fingerprint detection device between the display screen and the battery 370.
  • the original internal structure can also improve the utilization of the internal space of the electronic device.
  • the volume of the battery can be increased, and the space saved can be used to accommodate the increased volume of the battery. Accordingly, the service life and user experience of the electronic device can be increased without increasing the volume of the electronic device.
  • the fingerprint detection device is pasted to the copper layer of the display screen through the first pressure-sensitive adhesive using the fixing structure of the substrate, compared to directly pasting the fingerprint detection device to the display
  • the display panel (ie, the OLED layer) of the screen can not only avoid the performance of the display screen after the fingerprint detection device is attached to the display screen, but also can reduce the difficulty of installing the fingerprint detection device. Therefore, the installation complexity of the fingerprint detection device can be reduced and the yield of the electronic device can be improved.
  • sticking the fingerprint detection device to the copper layer of the display screen can also prevent damage to the display screen during the process of disassembling the fingerprint detection device. Accordingly, the disassembly complexity of the fingerprint detection device can be reduced and Improve the yield of the electronic device.
  • the display panel can be avoided Squeezing with the fingerprint detection device affects the performance of the display panel and the fingerprint detection device.
  • the fingerprint detection device by sticking the fingerprint detection device to the copper layer of the display screen, compared to directly sticking the fingerprint detection device to the display panel of the display screen, it can also avoid the oversize of the window.
  • the visibility of the user when viewing the fingerprint detection device from the front of the display screen can be reduced, thereby beautifying the appearance of the electronic device.
  • an ultraviolet curing adhesive is provided on the outside of the fixing structure and the first pressure-sensitive adhesive to fix the fingerprint detection device relative to the display screen.
  • the substrate includes a first covering layer, a first conductive layer, a substrate layer, a second conductive layer, and a second covering layer in order from top to bottom.
  • the area extends downward and penetrates the first covering layer and the first conductive layer to form a first groove, and the upper surface of the substrate extends downward and penetrates the second area connected to the first area.
  • the first covering layer to form a pad of the substrate;
  • the fingerprint detection device further includes:
  • the first fixing glue and the first gold wire are The first fixing glue and the first gold wire;
  • the lower surface of the first sensor chip is fixed in the first groove by the first fixing glue, and the first sensor chip is connected to the pad of the substrate by the first gold wire.
  • a substrate pad for electrically connecting the first sensor chip is formed, which can be used to electrically connect the first sensor chip and the first sensor chip.
  • the first gold wire of the substrate provides an accommodating space, and accordingly, the occupied space of the first gold wire above the substrate is reduced, thereby reducing the thickness of the fingerprint detection device.
  • the tight fit between the various layers in the thickness direction ensures that the thickness of the fingerprint detection device is reduced to the greatest extent.
  • the optical path layer is directly arranged on the upper surface of the first sensor chip, the image collection field of view of the fingerprint detection device is only affected by the area of the optical path layer and the corresponding area of the first sensor chip, Based on this, the area of the optical path layer and the area of the corresponding first sensor chip can be reasonably designed according to actual needs to meet the needs of different users and different customers (for example, the needs of large-area image acquisition field of view).
  • the technical solution of the present application can not only reduce the thickness of the fingerprint detection device, but also ensure a sufficiently large image collection field of view.
  • the gap between the side wall of the first sensor chip and the side wall of the first groove can be used not only as a dimensional tolerance of the first sensor chip and/or as a dimensional tolerance of the first groove , Can also be used as the mounting tolerance of the first sensor chip, and accordingly, the yield of the fingerprint detection device can be improved.
  • the fingerprint detection device further includes:
  • the second sensor chip, the second fixing glue and the second gold wire are connected
  • the upper surface of the substrate extends downward in a third area connected to the second area and penetrates the first covering layer and the first conductive layer to form a second groove, and the second sensor
  • the chip is fixed in the second groove by a second fixing glue, and the second sensor chip is connected to the pad of the substrate by the second gold wire, so that the second sensor chip is connected to the The first sensor chip, and the second sensor chip is used to cooperate with the first sensor chip to perform under-screen fingerprint recognition.
  • the processing tasks of the first sensor chip can be shared, which is equivalent to replacing a fully functional and thicker sensor chip with a first sensor chip and a thinner sensor chip arranged in parallel.
  • the second sensor chip correspondingly, can reduce the thickness of the fingerprint detection device without affecting the fingerprint recognition performance.
  • the gap between the side wall of the second sensor chip and the side wall of the second groove may not only be used as the dimensional tolerance of the second sensor chip and/or as the dimensional tolerance of the second groove , Can also be used as the installation tolerance of the second sensor chip, and accordingly, the yield of the fingerprint detection device can be improved.
  • the fixed structure includes:
  • the gold wire protective glue is used to encapsulate the first gold wire, and the bracket is arranged on the upper surface of the first cover film and located outside the first sensor chip.
  • the width of the gap formed by the first sensor chip and the bracket is greater than the width of the gap formed between the sidewall of the first sensor chip and the sidewall of the first groove
  • the outer side of the bracket extends a predetermined distance in a direction approaching the first sensor chip relative to the outer side of the first cover film.
  • the stability of the electrical connection between the substrate and the first sensor chip can be guaranteed, and accordingly, the performance of the fingerprint detection device can be guaranteed.
  • the gap formed by the first sensor chip and the bracket can be used not only as a dimensional tolerance of the bracket, but also as an installation tolerance of the bracket, and accordingly, the yield rate of the fingerprint detection device can be improved.
  • the preset distance can be used not only as a dimensional tolerance of the bracket, but also as an installation tolerance of the bracket, and accordingly, can improve the yield of the fingerprint detection device.
  • the thickness of the gold wire protective glue is less than or equal to the sum of the thickness of the optical path layer, the thickness of the first sensor chip, and the thickness of the first fixing glue.
  • the stent is a polyethylene terephthalate PET glue layer; or the stent is fixed on the upper surface of the first cover film by a stent fixing glue and is located on the first cover film. The outside of the sensor chip.
  • the fixed structure further includes:
  • the optical path layer includes a lens layer and an optical path guiding layer
  • the microlens is used to converge the optical signal returned via the human finger above the display screen to the optical path guiding layer, and the optical path guiding layer condenses the The light signal condensed by the microlens is guided to the first sensor chip, the light shielding layer extends from above the support to the light path guiding layer, and a gap is formed between the light shielding layer and the microlens layer, The light shielding layer is used to shield light signals incident from other positions than the incident surface of the first sensor chip.
  • the light shielding layer is structured to extend from above the support to above the light path guide layer, which not only can effectively shield the light signal incident from the non-incident surface of the first sensor chip, but also can protect the light as much as possible.
  • the light shielding layer is tightly fixed to the optical path layer, and accordingly, the thickness of the fingerprint detection device can be reduced as much as possible.
  • the light-shielding layer is configured to extend from above the support to the light path guide layer, which can avoid reducing the image capture area of the fingerprint detection device due to the light-shielding layer covering the lens layer.
  • the light shielding layer is a shielding glue layer, and the arc height position of the first gold wire is covered by the shielding glue layer.
  • Designing the arc height position of the first gold wire to be covered by the blocking adhesive layer can not only effectively block the light signal incident from the non-incident surface of the first sensor chip, but also can use the first gold wire
  • the gold wire protective glue supports the shielding glue layer, and accordingly, the stability of the fingerprint detection device can be improved.
  • the gold wire protective glue of the first gold wire is used to support the light shielding layer.
  • the fingerprint detection device further includes:
  • the first double-sided adhesive layer, the film material layer and the second double-sided adhesive layer are The first double-sided adhesive layer, the film material layer and the second double-sided adhesive layer;
  • the first double-sided adhesive layer is arranged above the light-shielding layer
  • the film material layer is arranged above the first double-sided adhesive layer
  • the second double-sided adhesive layer is arranged on the film Above the material layer.
  • the fingerprint detection device further includes:
  • a flexible circuit board formed with gold fingers of the flexible circuit board
  • An anisotropic conductive adhesive film, and the gold fingers of the flexible circuit board are electrically connected to the gold fingers of the substrate through the anisotropic conductive adhesive film.
  • the gold fingers of the flexible circuit board are pressed to the gold fingers of the substrate, which is equivalent to that the fingerprint detection device can be equipped with flexible circuit boards of different specifications, so that the The fingerprint detection device is more versatile, and accordingly, it can meet the needs of different users or customers.
  • the overall thickness of the fingerprint detection device is 0.15-0.6 mm.
  • an electronic device including:
  • the fingerprint detection device is arranged below the display screen, the fingerprint detection device is the fingerprint detection device described in the first aspect or any one of the possible implementations of the first aspect, and the fingerprint collection area is at least partially located In the display area of the display screen.
  • the electronic device further includes a middle frame, a third groove is formed on the upper surface of the middle frame extending downward, and the fingerprint detection device extends into the third groove.
  • Figure 1 is a schematic plan view of an electronic device to which this application can be applied.
  • Fig. 2 is a schematic side sectional view of the electronic device shown in Fig. 1.
  • 3 to 6 are schematic structural diagrams of a fingerprint identification device according to an embodiment of the present application.
  • FIG. 7 and 8 are schematic structural diagrams of electronic equipment including a fingerprint identification device according to an embodiment of the present application.
  • the technical solutions of the embodiments of the present application can be applied to various electronic devices.
  • portable or mobile computing devices such as smartphones, notebook computers, tablet computers, and gaming devices, as well as other electronic devices such as electronic databases, automobiles, and bank automated teller machines (ATM).
  • ATM bank automated teller machines
  • the embodiments of the present application are not limited thereto.
  • biometric recognition technology includes but is not limited to fingerprint recognition, palmprint recognition, iris recognition, face recognition, and living body recognition.
  • fingerprint recognition technology includes but is not limited to fingerprint recognition, palmprint recognition, iris recognition, face recognition, and living body recognition.
  • fingerprint recognition technology uses fingerprint recognition technology as an example.
  • the under-screen fingerprint recognition technology refers to the installation of the fingerprint detection device under the display screen, so as to realize the fingerprint recognition operation in the display area of the display screen, and there is no need to set a fingerprint collection area on the front of the electronic device except for the display area.
  • the fingerprint detection device uses the light returned from the top surface of the display assembly of the electronic device to perform fingerprint sensing and other sensing operations. This returned light carries information about objects (such as fingers) that are in contact with or close to the top surface of the display assembly.
  • the fingerprint detection device located under the display assembly collects and detects this returned light to realize fingerprint recognition under the screen.
  • the fingerprint detection device can be designed to realize the desired optical imaging by appropriately configuring optical elements for collecting and detecting the returned light, so as to detect the fingerprint information of the finger.
  • FIG. 1 and 2 show schematic diagrams of an electronic device 100 to which under-screen fingerprint recognition technology can be applied.
  • FIG. 1 is a front schematic diagram of the electronic device 100
  • FIG. 2 is a partial cross-sectional structure diagram of the electronic device 100 shown in FIG.
  • the electronic device 100 may include a display screen 120 and a fingerprint detection device 130.
  • the display screen 120 may be a self-luminous display, which uses a self-luminous display unit as display pixels.
  • the display screen 120 may be an Organic Light-Emitting Diode (OLED) display screen or a Micro-LED (Micro-LED) display screen.
  • OLED Organic Light-Emitting Diode
  • Micro-LED Micro-LED
  • the display screen 120 may also be specifically a touch display screen, which can not only perform screen display, but also detect a user's touch or pressing operation, thereby providing a user with a human-computer interaction interface.
  • the electronic device 100 may include a touch sensor, and the touch sensor may specifically be a touch panel (TP), which may be provided on the surface of the display screen 120, or may be partially integrated or The whole is integrated into the display screen 120 to form the touch display screen.
  • TP touch panel
  • the fingerprint detection device 130 may be an optical fingerprint detection device.
  • the fingerprint detection device 130 may include a sensor chip (also referred to as a fingerprint sensor) having an optical sensor array.
  • the optical sensing array includes multiple optical sensing units, and each optical sensing unit may specifically include a photodetector or a photoelectric sensor.
  • the fingerprint detection device 130 may include a photodetector array (or called a photodetector array, a photodetector array), which includes a plurality of photodetectors distributed in an array.
  • the fingerprint detection device 130 may be arranged in a partial area below the display screen 120, so that the fingerprint collection area (or detection area) 103 of the fingerprint detection device 130 is at least partially located on the display screen 120. Within area 102.
  • the area or light sensing range of the optical sensing array of the fingerprint detection device 130 corresponds to the fingerprint collection area 103 of the fingerprint detection device 130.
  • the fingerprint collection area 103 of the fingerprint detection device 130 may be equal to or not equal to the area or light sensing range of the optical sensing array of the fingerprint detection device 130, which is not specifically limited in the embodiment of the present application.
  • the fingerprint collection area 103 of the fingerprint detection device 130 can be designed to be substantially the same as the area of the sensing array of the fingerprint detection device 130.
  • the design of the light path for converging light or the design of the light path for reflecting light through a macro lens can make the fingerprint collection area 103 of the fingerprint detection device 130 larger than the area of the fingerprint detection device 130 sensing array.
  • the optical path design of the fingerprint detection device 130 is exemplified below.
  • the optical collimator may specifically be a collimator (Collimator) layer fabricated on a semiconductor silicon wafer, It has a plurality of collimating units or micro-holes.
  • the collimating unit may be specifically a small hole.
  • the reflected light reflected from the finger the light that is perpendicularly incident on the collimating unit can pass through and be passed by the sensor below it.
  • the light received by the chip and the incident angle is too large is attenuated by multiple reflections inside the collimating unit. Therefore, the sensor chip can basically only receive the reflected light reflected by the fingerprint pattern directly above it, which can effectively improve Image resolution, thereby improving the fingerprint recognition effect.
  • the lens layer may have a micro lens array formed by a plurality of micro lenses, which may be formed by a semiconductor growth process or other processes. Above the sensing array of the sensor chip, and each microlens may correspond to one or more sensing units of the sensing array.
  • Other optical film layers may be formed between the lens layer and the sensing unit, such as a dielectric layer or a passivation layer. More specifically, a barrier with micro holes may also be formed between the lens layer and the sensing unit.
  • the light-blocking layer can block the optical interference between adjacent sensing units, and make the light converge to the said micro-lens
  • the inside of the microhole is transmitted to the sensing unit corresponding to the microlens through the microhole to perform optical fingerprint imaging.
  • a lens layer can be further provided under the collimator layer or the optical lens layer.
  • the collimator layer or the optical lens layer is used in combination with the lens layer, its specific laminated structure or optical path may need to be adjusted according to actual needs.
  • the fingerprint detection device 130 may be used to collect user fingerprint information (such as fingerprint image information).
  • the display screen 120 can adopt a display screen with a self-luminous display unit, such as an organic light-emitting diode (Organic Light-Emitting Diode, OLED) display or a micro-LED (Micro-LED) display Screen.
  • the fingerprint detection device 130 can use the display unit (ie, the OLED light source) of the OLED display screen located in the fingerprint collection area 103 as an excitation light source for optical fingerprint detection.
  • the display screen 120 When a finger touches, presses, or approaches (for ease of description, collectively referred to as pressing in this application) in the fingerprint collection area 103, the display screen 120 emits a beam of light to the finger above the fingerprint collection area 103. The surface is reflected to form reflected light or is scattered inside the finger to form scattered light. In related patent applications, for ease of description, the above-mentioned reflected light and scattered light are collectively referred to as reflected light. Since the ridge and valley of the fingerprint have different light reflection capabilities, the reflected light from the fingerprint ridge and the fingerprint ridge have different light intensities.
  • the sensor chip in the detection device 130 receives and converts it into a corresponding electrical signal, that is, a fingerprint detection signal; fingerprint image data can be obtained based on the fingerprint detection signal, and fingerprint matching verification can be further performed, so that the electronic device 100 Realize the optical fingerprint recognition function.
  • the fingerprint detection device 130 may also use a built-in light source or an external light source to provide an optical signal for fingerprint detection and identification.
  • the electronic device 100 may further include a protective cover 110.
  • the cover 110 may be specifically a transparent cover, such as a glass cover or a sapphire cover, which is located above the display screen 120 and covers the front of the electronic device 100, and the surface of the cover 110 may also be provided with a protective layer. Therefore, in the embodiment of the present application, the so-called finger pressing the display screen 120 may actually refer to the finger pressing the cover 110 above the display 120 or covering the surface of the protective layer of the cover 110.
  • a circuit board 140 such as a flexible printed circuit (FPC) may also be provided under the fingerprint detection device 130.
  • FPC flexible printed circuit
  • the fingerprint detection device 130 may be electrically connected to the circuit board 140, and realize electrical interconnection and signal transmission with other peripheral circuits or other components of the electronic device 100 through the circuit board 140.
  • the fingerprint detection device 130 can receive the control signal of the processing unit of the electronic device 100 through the circuit board 140, and can also output the fingerprint detection signal from the fingerprint detection device 130 to the processing unit or control unit of the electronic device 100 through the circuit board 140 Wait.
  • FIG. 3 is a schematic structural diagram of a fingerprint detection device 200 including a sensor chip according to an embodiment of the present application.
  • the fingerprint detection device 200 is suitable for electronic equipment with a display screen.
  • the fingerprint detection apparatus 200 may be applicable to the electronic device 100 shown in FIG. 1 or FIG. 2.
  • the fingerprint detection device 200 includes a substrate 210, an optical path layer 220, a first sensor chip 230, a first fixing glue 240 and a first gold wire 250.
  • the substrate 210 includes a first cover layer 212, a first conductive layer 211 layer 212, a base layer 213, a second conductive layer 214, and a second cover layer 215 in order from top to bottom.
  • the upper surface of the substrate 210 Extend downward in the first area and penetrate through the first covering layer 212 and the first conductive layer 211 to form a first groove.
  • the upper surface of the substrate 210 is in the second area connected to the first area. It extends downward and penetrates the first covering layer 212 to form the pad 2111 of the substrate 210.
  • the substrate 210 may include conductive layers other than the first conductive layer 211 and the second conductive layer 214.
  • the first conductive layer 211 or the second conductive layer 214 may be a copper layer or a copper foil layer.
  • the first covering layer 212 or the second covering layer 213 may be an insulating layer (for example, a resin layer).
  • the optical path layer 220 is disposed above the first sensor chip 230, and the lower surface of the first sensor chip 230 is fixed in the first groove by the first fixing glue 240, and the first sensor chip 230
  • the first sensor chip 230 is connected to the pad 2111 of the substrate 210 through the first gold wire 250, and the first sensor chip 230 is used to receive the fingerprint returned via the human finger above the display screen and guided by the optical path layer 220
  • a detection signal, the fingerprint detection signal is used to detect fingerprint information of the finger.
  • the lower surface of the first sensor chip 230 is pasted in the first groove by the first fixing glue 240, so that at least a part of the first sensor chip 230 is disposed in the first groove and passes through
  • the first gold wire 250 is electrically connected to the substrate 210; wherein, the first sensor chip 230 can be disposed under the display screen of the electronic device through the substrate 210.
  • the first sensor chip 230 is used for receiving The fingerprint detection signal returned by the human finger above the display screen is reflected or scattered, and fingerprint information of the finger is detected based on the fingerprint detection signal to perform fingerprint registration or identification.
  • the first sensor chip 230 may include multiple chips or one chip.
  • the first sensor chip 230 may include multiple optical fingerprint sensor chips, and the multiple optical fingerprint sensor chips are arranged side by side.
  • the first groove is spliced into an optical fingerprint sensor chip assembly.
  • the optical fingerprint sensor chip assembly can be used to obtain multiple fingerprint images at the same time, and the multiple fingerprint images can be used as one fingerprint image for fingerprint registration or identification after being spliced.
  • the optical path layer 220 is directly arranged on the upper surface of the first sensor chip 230, and the lower surface of the first sensor chip 230 is fixed on the substrate 210 by the first fixing glue 240, which can avoid separate
  • a housing is provided to carry the optical path layer 220 and the first sensor chip 230, which reduces the size (for example, the thickness) of the fingerprint detection device 200.
  • the first groove can reduce the thickness of the fingerprint detection device 200.
  • a pad of the substrate 210 for electrically connecting the first sensor chip 230 is formed, which can be used for electrically connecting the first sensor chip 230.
  • the sensor chip 230 and the first gold wire 250 of the substrate 210 provide accommodating space.
  • the space occupied by the first gold wire 250 above the substrate 210 is reduced, thereby reducing the fingerprint detection device 200 thickness.
  • the tight fit between the various layers in the thickness direction ensures that the thickness of the fingerprint detection device 200 is reduced to the greatest extent.
  • the optical path layer 220 is directly arranged on the upper surface of the first sensor chip 230, the image collection field of view of the fingerprint detection device 200 is only affected by the area of the optical path layer 220 and the corresponding first sensor chip 230. Based on this, the area of the optical path layer 220 and the area of the corresponding first sensor chip 230 can be reasonably designed according to actual needs to meet the needs of different users and different customers (such as the needs of large-area image acquisition field of view) ).
  • the technical solution of the present application can not only reduce the thickness of the fingerprint detection device 200, but also can ensure a sufficiently large image acquisition field of view.
  • the gap d1 between the sidewall of the first sensor chip 230 and the sidewall of the first groove can not only be used as the dimensional tolerance of the first sensor chip 230 and/or as the first groove
  • the dimensional tolerance can also be used as the installation tolerance of the first sensor chip 230, and accordingly, the yield rate of the fingerprint detection device 200 can be improved.
  • the dimensional tolerance may be the absolute value of the difference between the maximum allowable limit size minus the minimum limit size, or the dimensional tolerance may be the difference between the allowable upper deviation and the lower deviation.
  • Limit deviation limit size-basic size
  • upper deviation maximum limit size-basic size
  • lower deviation minimum limit size-basic size.
  • the dimensional tolerance of the first sensor chip 230 may be an allowable amount of variation in the process of cutting the first sensor chip 230. In the case of the same basic size, the smaller the dimensional tolerance, the higher the dimensional accuracy.
  • the mounting tolerance of the first sensor chip 230 may refer to the allowable offset distance between the first limit mounting position and the second limit mounting position, and the first limit mounting position may be the closest allowed
  • the installation position of the first side wall of the first groove, the second limit installation position may be the allowable installation position closest to the second side wall of the first groove, and the first side wall The second side wall is opposite to the side wall.
  • the width of the gap d1 between the sidewall of the first sensor chip 230 and the sidewall of the first groove is 100-300um. For example, 200um.
  • the width of the gap d1 between the side wall of the first sensor chip 230 and the side wall of the first groove may also be other values, or fall within a range of other preset values. There is no specific restriction on this.
  • the width of the gap d1 between the sidewall of the first sensor chip 230 and the sidewall of the first groove may also be 100um or 250um.
  • the sidewall of the first sensor chip 230 and The width of the gap d1 between the side walls of the first groove may also be within 100um to 400un.
  • this application does not specifically limit the thickness of each component or layer in the fingerprint detection device 200, as long as the structural relationship between the various components or layers adopts the design solution of this application, and is closely matched
  • the method to control the thickness of the fingerprint detection device falls within the protection scope of this application.
  • the thickness of the first covering layer 212 and the thickness of the second covering layer are both 10-30um, for example 20um; the thickness of the first conductive layer 211 and the thickness of the second conductive layer are both 10-20um, such as 13um; the thickness of the substrate is 40-80um, such as 64um; the thickness of the first sensor chip 230 is 50-150um, such as 60um; the thickness of the optical path layer 220 is 10-30um, For example, 21um; the maximum arc height d6 of the first gold wire 250 is 30-60um, such as 40um; the thickness of the first fixing glue 240 is 10-30um, such as 15um.
  • the thickness of, the thickness of the first fixing glue 240, or the maximum arc height d6 of the first gold wire 250 may also be other values or within a predetermined value range, which is not specifically limited in this application.
  • the fingerprint detection device 200 may further include a bracket 251 and a gold wire protective glue 252; wherein the gold wire protective glue 252 is used to encapsulate the first gold Line 250, the bracket 251 is arranged on the upper surface of the first covering layer 212 and located outside the first sensor chip 230.
  • the bracket 251 is fixed on the upper surface of the first covering layer 212 by a bracket fixing glue 253 and is located outside the first sensor chip 230.
  • the material of the bracket 251 includes but is not limited to metal, resin, glass fiber composite board, glue layer, and the like.
  • the bracket 251 is a polyethylene glycol terephthalate (PET) glue layer.
  • the bracket 251 may be a bracket formed of foam material.
  • the bracket fixing glue may be a double-sided glue.
  • the bracket 251 may be disposed above the substrate 210 and located on the outer side or the surrounding area of the first groove and the pad 2111 of the substrate 210 (used to electrically connect the first sensor chip 230) .
  • the width of the gap d2 formed by the first sensor chip 230 and the bracket 251 is greater than or equal to the sidewall of the first sensor chip 230 and the first sensor chip 230.
  • the width of the gap d1 formed between the side walls of a groove, the outer side of the bracket 251 relative to the outer side of the first covering layer 212 extends a predetermined distance d3 in a direction approaching the first sensor chip 230.
  • the width of the gap d2 formed by the first sensor chip 230 and the bracket 251 is 100-400um, such as 270um
  • the preset distance d3 is 100-400um, such as 200um.
  • the thickness of the bracket 251 is 40-100um, such as 50um or 80um.
  • the gap d2 formed by the first sensor chip 230 and the bracket 251, the preset distance d3, or the thickness of the bracket 251 may be other specific values, or may Within the range of other preset values.
  • the thickness of the bracket 251 may also be 80um.
  • the stability of the electrical connection between the substrate 210 and the first sensor chip 230 can be ensured, and accordingly, the performance of the fingerprint detection device 200 can be guaranteed.
  • the gap d2 formed by the first sensor chip 230 and the bracket 251 can be used not only as a dimensional tolerance of the bracket 251, but also as an installation tolerance of the bracket 251. Accordingly, the fingerprint detection device can be improved 200's yield.
  • the preset distance d3 can be used not only as a dimensional tolerance of the bracket 251, but also as an installation tolerance of the bracket 251, and accordingly, the yield rate of the fingerprint detection device 200 can be improved.
  • the thickness of the gold wire protective glue 252 is less than or equal to the sum of the thickness of the optical path layer 220, the thickness of the first sensor chip 230, and the thickness of the first fixing glue 240 .
  • the thickness of the gold wire protective glue 252 is equal to the thickness of the light path guiding layer 222 in the light path layer 220, the thickness of the first sensor chip 230, and the thickness of the first fixing glue 240 Sum.
  • the thickness of the gold wire protective glue 252 is configured to be less than or equal to the sum of the thickness of the optical path layer 220, the thickness of the first sensor chip 230, and the thickness of the first fixing glue 240, which can be used in effective packaging. While the first gold wire 250 is described, the thickness of the fingerprint detection device 200 is reduced as much as possible.
  • bracket 251 other parameters can also be designed for the preparation and installation of the bracket 251.
  • the width of the gap d4 between the brackets 251 is larger than that of the pad 2111 (used to electrically connect the first sensor chip 230) of the first sensor chip 230 away from the substrate 210 and the bracket 251.
  • the gap d2 between the brackets is to reserve enough space for the bracket fixing glue 252.
  • the width of the gap d4 between the side of the pad 2111 of the first sensor chip 230 close to the substrate 210 and the bracket 251 may be 1300 um or other values.
  • the fingerprint detection device 200 further includes a light shielding layer 260.
  • the light path layer 220 includes a lens layer 221 and a light path guide layer 222, and the lens layer 221 is used to converge the light signal returned via the human finger above the display screen to the light path guide layer 222, and the light path
  • the guide layer 222 guides the light signal condensed by the lens layer 221 to the first sensor chip 230
  • the light shielding layer 260 extends from above the bracket 251 to the light path guide layer 222
  • the light shielding layer 260 A gap d5 is formed between the lens layer 221 and the lens layer 221, and the light shielding layer 260 is used for shielding light signals incident from other positions than the incident surface of the first sensor chip 230.
  • the thickness of the light shielding layer 260 is 10-30um, for example 20um.
  • the thickness of the light-shielding layer 260 can also be other specific values or within a range of other preset values, which is not specifically limited in this application.
  • the light shielding layer 260 is configured to extend from above the support 251 to above the light path guiding layer 222, which can not only effectively shield the light signal incident from the non-incident surface of the first sensor chip 230, but also It is possible to tightly fix the light shielding layer 260 to the optical path layer 220, and accordingly, the thickness of the fingerprint detection device 200 can be reduced as much as possible.
  • the light-shielding layer 260 is configured to extend from above the holder 251 to above the light path guide layer 222, which can avoid reducing the size of the fingerprint detection device due to the light-shielding layer 260 covering the lens layer 221 Image capture area.
  • the light shielding layer 260 is a shielding glue layer, and the arc height position of the first gold wire 250 is covered by the shielding glue layer.
  • Designing the arc height position of the first gold wire 250 to be covered by the blocking adhesive layer not only can effectively block the light signal incident from the non-incident surface of the first sensor chip 230, but also can use the A gold wire protective glue of a gold wire 250 supports the shielding glue layer, and accordingly, the stability of the fingerprint detection device 200 can be improved.
  • a filter can also be used to replace the light shielding layer 260.
  • the optical filter is used to reduce the undesired ambient light in fingerprint sensing, so as to improve the optical sensing of the first sensor chip 230 to the received light.
  • the filter can specifically be used to filter out light of a specific wavelength, for example, near-infrared light and part of red light. For example, a human finger absorbs most of the energy of light with a wavelength below 580nm. Based on this, the filter can be designed to filter light with a wavelength from 580nm to infrared to reduce the impact of ambient light on optical detection in fingerprint sensing. influences.
  • the optical filter may include one or more optical filters, and the one or more optical filters may be configured as, for example, a band-pass filter to allow the transmission of light emitted by the OLED screen while blocking the sun. Other light components such as infrared light in light.
  • One or more optical filters may be implemented as, for example, an optical filter coating formed on one or more continuous interfaces, or may be implemented as one or more discrete interfaces.
  • the filter may be a coating directly designed on the lens layer to avoid Newton rings in the fingerprint image acquired by the first sensor chip 230.
  • the light entrance surface of the filter can be provided with an optical inorganic coating or an organic blackened coating, so that the reflectance of the light entrance surface of the filter is lower than a first threshold, such as 1%, Thereby, it can be ensured that the first sensor chip 230 can receive enough light signals, thereby improving the fingerprint recognition effect.
  • a first threshold such as 1%
  • the gold wire protective glue 252 of the first gold wire 250 is used to support the light shielding layer 260.
  • the thickness of the gold wire protective glue 252 is equal to the sum of the thickness of the light path guiding layer 222 in the light path layer 220, the thickness of the first sensor chip 230, and the thickness of the first fixing glue 240, so that The gold wire protective glue 250 supports the light shielding layer 260.
  • the fingerprint detection device 200 further includes a first double-sided adhesive layer 271, a film layer 272, and a second double-sided adhesive layer 273; wherein, the first The double-sided adhesive layer 271 is arranged above the light-shielding layer 260, the film layer 272 is arranged above the first double-sided adhesive layer 271, and the second double-sided adhesive layer 273 is arranged on the film material. Above layer 272.
  • the fingerprint detection device 200 Before installing the fingerprint detection device 200, by setting the first double-sided adhesive layer 271, the film layer 272 and the second double-sided adhesive layer 273, the fingerprint can be effectively prevented from being damaged during transportation.
  • the optical path layer 220 in the detection device 200 is not limited to the first double-sided adhesive layer 271, the film layer 272 and the second double-sided adhesive layer 273, the fingerprint can be effectively prevented from being damaged during transportation.
  • the optical path layer 220 in the detection device 200 Before installing the fingerprint detection device 200, by setting the first double-sided adhesive layer 271, the film layer 272 and the second double-sided adhesive layer 273, the fingerprint can be effectively prevented from being damaged during transportation.
  • the optical path layer 220 in the detection device 200 Before installing the fingerprint detection device 200, by setting the first double-sided adhesive layer 271, the film layer 272 and the second double-sided adhesive layer 273, the fingerprint can be effectively prevented from being damaged during transportation.
  • FIG. 4 is a schematic structural diagram of a modified structure of the fingerprint detection device 200 shown in FIG. 3.
  • the fingerprint detection device 200 may further include a second sensor chip 280, a second fixing glue 281 and a second gold wire 282.
  • the upper surface of the substrate 210 extends downward in the third area connected to the second area and penetrates the first covering layer 212 and the first conductive layer 211 to form a second groove
  • the second sensor chip 280 is fixed in the second groove by a second fixing glue 281, and the second sensor chip 280 is connected to the pad 2111 of the substrate 210 by the second gold wire 282, so that the The second sensor chip 280 is connected to the first sensor chip 230, and the second sensor chip 280 is used to cooperate with the first sensor chip 230 to perform under-screen fingerprint recognition.
  • the third area and the first area are respectively located on two sides of the second area.
  • the processing tasks of the first sensor chip 230 can be shared, which is equivalent to replacing a fully functional and thicker sensor chip with a thinner first sensor arranged in parallel
  • the chip 230 and the second sensor chip 280 correspondingly, can reduce the thickness of the fingerprint detection device 200 without affecting the fingerprint recognition performance.
  • the width of the gap d7 between the sidewall of the second sensor chip 280 and the sidewall of the second groove is 100-300um, for example 200um.
  • the thickness of the second sensor chip 280 is 50-150um, such as 60um
  • the maximum arc height of the second gold wire 282 is 30-60um, such as 40um
  • the thickness of the second fixing glue 281 is 10-30um, for example 15um.
  • the maximum arc height of 282 or the thickness of the second fixing glue 281 may also be other specific values or within a range of other preset values, which is not specifically limited in the embodiment of the present application.
  • the gap between the sidewall of the second sensor chip 280 and the sidewall of the second groove can not only serve as the dimensional tolerance of the second sensor chip 280 and/or serve as the size tolerance of the second groove
  • the dimensional tolerance can also be used as the installation tolerance of the second sensor chip 280, and accordingly, the yield rate of the fingerprint detection device 200 can be improved.
  • the fingerprint detection device 200 when installed in an electronic device, it can be connected to the main board of the electronic device through an additional flexible circuit board.
  • the substrate 210 may also include a gold finger 2122 of the substrate 210.
  • the gold finger 2122 of the substrate 210 is used to connect to a flexible circuit board. Accordingly, the substrate 210 passes through the flexible circuit The board is connected to the main board of the electronic device.
  • FIG. 6 is a schematic structural diagram of a fingerprint detection device 200 provided with a flexible circuit board according to an embodiment of the present application.
  • the fingerprint detection device 200 may further include a flexible circuit board 290 and (Anisotropic Conductive Film, ACF) 292, and the flexible circuit board 290 is formed with the flexible circuit
  • ACF Advanced Conductive Film
  • the gold finger 291 of the flexible circuit board 290 can be pressed to the gold finger 2122 of the substrate 210, which is equivalent to that the fingerprint detection device 200 can be configured with different specifications
  • the flexible circuit board makes the fingerprint detection device 200 more versatile, and accordingly, can meet the needs of different users or customers.
  • the fingerprint detection device 200 may further include a protective glue 293 including an anisotropic conductive adhesive film 292, and the protective glue 293 may be located on the anisotropic conductive adhesive film 292. Both ends of the adhesive film 292 are used to protect the anisotropic conductive adhesive film 292, and further protect the golden fingers 291 of the flexible circuit board 290 and the golden fingers 2122 of the substrate 210. As shown in FIG. 6, in some embodiments of the present application, the fingerprint detection device 200 may further include an image processor 296, and the image processor 296 is provided at one end of the flexible circuit board 290.
  • the image processor 296 may be a microprocessor (Micro Processing Unit, MCU) for receiving fingerprint detection signals (for example, fingerprint images) sent from the first sensor chip 230 through the flexible circuit board 290, and correcting The fingerprint detection signal is simply processed.
  • MCU Micro Processing Unit
  • the fingerprint detection device 200 may further include at least one capacitor 295 provided at one end of the flexible circuit board 290, and the at least one capacitor 295 is used for optimization ( For example, filter processing) the fingerprint detection signal collected by the first sensor chip 230.
  • each chip in the first sensor chip 230 corresponds to one or more capacitors. As shown in FIG.
  • the fingerprint detection device 200 may further include a connector 294 provided at one end of the flexible circuit board 290, and the connector 294 may be used to communicate with an external device. Or other components of the electronic device (such as a main board) are connected to realize communication with the external device or communication with other components of the electronic device.
  • the connector 294 may be used to connect the processor of the electronic device, so that the processor of the electronic device receives the fingerprint detection signal processed by the image processor 296, and based on the processed fingerprint detection signal Fingerprint detection signal for fingerprint identification.
  • FIGS. 3 to 6 are only examples of embodiments of the present application, and should not be construed as limiting the present application.
  • the lens layer 221 is used as a device for condensing optical signals in the optical path layer 220.
  • the lens layer 221 may also use an optical collimator.
  • the optical collimator refer to the related description of the optical path design of the fingerprint detection device 130 in the foregoing content.
  • the lens layer 221 may have a micro lens array formed by a plurality of micro lenses
  • the light path guiding layer 222 may be a light blocking layer
  • the light blocking layer has a plurality of micro holes and is disposed on the micro lens layer 221
  • the micro holes correspond to the micro lenses one-to-one
  • one or more optical sensing units in the first sensor chip 230 correspond to one micro lens in the lens layer 221.
  • the optical path layer 220 may also include other optical film layers, such as a dielectric layer or a passivation layer.
  • the fingerprint detection device 200 of the embodiment of the present application is described above with reference to FIGS. 3 to 6, and the electronic equipment installed with the fingerprint detection device 200 is described below.
  • FIG. 7 is a schematic structural diagram of an electronic device 300 installed with the fingerprint detection device 200 shown in FIG. 4 according to an embodiment of the present application.
  • the electronic device 300 includes a display screen, a middle frame 360 located below the display screen, a battery 370 located below the middle frame, and a battery easy pull glue 380 located below the battery.
  • the display screen includes a transparent cover 310, a display panel 320, a cushion layer 330, and a copper layer 340 from top to bottom.
  • the display screen is provided with an opening penetrating the buffer layer 330 and the copper layer 340. window.
  • the buffer layer 330 may be provided with a first window 331 penetrating through the buffer layer 330
  • the copper layer 340 may be provided with a second window 341 penetrating the copper layer 340.
  • the display screen may be an OLED organic light-emitting panel made of low temperature polysilicon (LTPS) technology, which has ultra-thin thickness, light weight, low power consumption, and can be used to provide clearer image.
  • LTPS low temperature polysilicon
  • the middle frame 360 can be used to carry or support various devices or components in the electronic device 300.
  • the devices or components include, but are not limited to, batteries, cameras, antennas, motherboards, and the display screen.
  • the buffer layer 330 may also be referred to as a screen print layer or an embossing layer.
  • the screen print layer may have graphics and text, and the graphics and text can be used as logos such as trademark patterns.
  • the buffer layer 330 may be a black flake layer or a printed layer for shielding light.
  • the buffer layer 330 may be a layer structure formed of foam material.
  • the copper layer 340 may also be called a heat dissipation layer (used to reduce the temperature of the display screen) or a radiation prevention layer.
  • the buffer layer 330 and the copper layer 340 may be combined into the rear panel of the display screen, or the copper layer 340 is referred to as the rear panel of the display screen.
  • the specific function and structure of the fingerprint detection device 200 can be understood with reference to the reference signs in FIG. 4.
  • the fingerprint detection device 200 includes a substrate 210, an optical path layer 220, a first sensor chip 230, a first fixing glue 240, and a first gold wire 250.
  • the substrate 210 includes a first covering layer 212, a first conductive layer 211 layer 212, a base layer 213, a second conductive layer 214, and a second covering layer 215 in order from top to bottom.
  • the optical path layer 220 includes a lens layer 221 and an optical path guiding layer 222 thereunder.
  • the fingerprint detection device 200 may further include a bracket 251 and a gold wire protective glue 252.
  • the fingerprint detection device 200 may further include a light shielding layer 260.
  • the fingerprint detection device 200 may further include a second sensor chip 280, a second fixing glue 281, and a second gold wire 282.
  • the fixing structure includes at least one of the bracket layer 251, the bracket fixing glue 253, and the light shielding layer 260.
  • the fixing structure is disposed on the upper surface of the substrate 210 and located on the side of the first sensor chip 230, as shown in FIG.
  • the fixing structure is made of a first pressure-sensitive adhesive (PSA) 391 is fixed to the surrounding area of the openings (that is, the first opening 331 and the second opening 341) of the lower surface of the copper layer 340, so that the first sensor chip 230 is aligned
  • PSA pressure-sensitive adhesive
  • the first sensor chip is used to receive, through the window, a fingerprint detection signal returned via a human finger above the display screen and guided by the optical path layer, and the fingerprint detection signal is used to detect Fingerprint information of the finger.
  • the display screen may be a soft screen or a hard screen.
  • the finger When a finger is placed above the bright OLED screen, the finger will reflect the light emitted by the OLED screen, and this reflected light will penetrate the OLED screen to the bottom of the OLED screen.
  • the optical path layer located under the OLED screen can be used to filter out the infrared signal components in the leaked light. Since the fingerprint is a diffuse reflector, the light signal formed by the reflection or diffusion of the finger will exist in all directions.
  • the fingerprint detection device 200 collects the light signal leaking from the upper side of the OLED screen, and performs imaging of the fingerprint image based on the received light signal.
  • the optical path layer 220 is directly arranged on the upper surface of the first sensor chip 230, and the lower surface of the first sensor chip 230 is fixed on the substrate 210 by the first fixing glue 240, which can avoid separate
  • a housing is provided to carry the optical path layer 220 and the first sensor chip 230, which reduces the size (for example, the thickness) of the fingerprint detection device 200.
  • the first PSA 391 utilizes the fixing structure of the substrate 210 to paste the fingerprint detection device 200 to the copper layer 340 of the display screen, compared to directly bonding the fingerprint detection device 200 to the copper layer 340 of the display screen.
  • the display panel (ie, OLED layer) of the display screen can not only prevent the fingerprint detection device 200 from being attached to the display screen and affect the performance of the display screen, but also can reduce the cost of installing the fingerprint detection device 200.
  • the degree of difficulty correspondingly, can reduce the installation complexity of the fingerprint detection device 200 and improve the yield of the electronic device 300.
  • pasting the fingerprint detection device 200 to the copper layer 340 of the display screen can also prevent damage to the display screen during the process of disassembling the fingerprint detection device 200.
  • the fingerprint detection device 200 can be reduced in size. Disassembly complexity is improved and the yield rate of the electronic device 300 is improved.
  • the buffer layer 330 and the copper layer 340 between the display panel 320 and the fingerprint detection device 200 can be avoided. The display panel 320 and the fingerprint detection device 200 are squeezed to affect the performance of the display panel 320 and the fingerprint detection device 200.
  • sticking the fingerprint detection device 200 to the copper layer 340 of the display screen can avoid the opening of the window compared to directly sticking the fingerprint detection device 200 to the display panel 320 of the display screen.
  • the size of is too large, correspondingly, the visibility of the fingerprint detection device 200 when the user views the fingerprint detection device 200 from the front of the display screen can be reduced, and further, the appearance of the electronic device 300 can be beautified.
  • an ultraviolet (UV) curing glue 392 is provided on the outside of the fixing structure and the first PSA 391 to fix the fingerprint relative to the display screen.
  • Detection device 200 In some embodiments of the present application, an ultraviolet (UV) curing glue 392 is provided on the outside of the fixing structure and the first PSA 391 to fix the fingerprint relative to the display screen. Detection device 200.
  • UV ultraviolet
  • the UV curing adhesive 392 can not only fix the fingerprint detection device 200 relative to the display screen, but also utilize the characteristics of the UV curing adhesive 392 to reduce the difficulty of installing the fingerprint detection device 200.
  • FIG. 7 is only an example of pasting the fingerprint detection device 200 to the display screen of an electronic device, and should not be construed as a limitation of the present application.
  • the middle frame 380 has a third window formed under the fingerprint detection device 200.
  • the fingerprint detection device 200 is attached to the copper layer 340 of the display screen in a hanging manner. For example, there is a gap between the fingerprint detection device 200 and the display screen.
  • a third groove is formed extending downward on the upper surface of the middle frame, and the bottom of the fingerprint detection device 200 contacts the middle frame.
  • the fingerprint detection device 200 is still attached to the copper layer 340 of the display screen by hanging, but there is no gap between the fingerprint detection device 200 and the display screen.
  • the third groove is only used to provide a receiving position for the fingerprint detection device 200, and is not used to fix the fingerprint detection device 200.
  • the thickness of the substrate 212 and the thickness of the second covering layer are both 20um
  • the thickness of the first conductive layer 211 and the thickness of the second conductive layer are both 13um
  • the thickness of the substrate The thickness is 64 um.
  • the thickness of the fingerprint detection device 200 at AA, BB, and CC will be illustrated below with reference to FIG. 3.
  • the thickness of the fingerprint detection device 200 at the A-A position is 193 um
  • the thickness at the B-B position is 232 um
  • the thickness at the C-C position is 200 um. It is equivalent that the maximum thickness of the fingerprint detection device 200 is 232um, and the minimum thickness is 193um.
  • the fingerprint detection device 200 is designed with a layered structure so that the components are tightly fitted in the thickness direction (that is, the components are tightly fitted in the thickness direction without leaving a gap). Based on the thickness of the current middle frame, even Keeping the buffer layer 330 and the copper layer 340 in the display screen can also leave a gap of at least about 200um between the bottom of the fingerprint detection device 200 and the battery 370, which is enough to place the fingerprint detection device 200 in all areas. Between the display screen and the battery 370.
  • the original internal structure of the electronic device 300 can also improve the utilization of the internal space of the electronic device 300.
  • the volume of the battery 370 can be increased, and the saved space can be used to accommodate the increased volume of the battery 370. Accordingly, the electronic device 300 can be added without increasing the volume of the electronic device 300. The longevity and user experience.
  • the solution of installing the fingerprint detection module 200 on the copper layer 340 of the display screen is described above in conjunction with FIG. 7, but the embodiment of the present application is not limited to this.
  • the fingerprint detection device 200 can also be used to be installed and fixed on the middle frame 380.
  • FIG. 8 is another schematic structural diagram of an electronic device 300 installed with the fingerprint detection device 200 shown in FIG. 4 according to an embodiment of the present application.
  • the specific function and structure of the fingerprint detection device 200 can be understood with reference to the reference signs in FIG. 4, and the function and structure of each component in the electronic device 300 can be understood with reference to FIG. 7. In order to avoid repetition, it will not be repeated here. It will be repeated.
  • the upper surface of the middle frame 380 extends downward to form a third groove, and the bottom of the fingerprint detection device 200 is arranged in the third groove through a second PSA 393.
  • the third groove is only used to provide a accommodating position for the fingerprint detection device 200, and is also used to fix the fingerprint detection device 200.
  • the gap formed therebetween can be used as a dimensional tolerance or installation tolerance of the fingerprint detection device 200, and can also be used as a dimensional tolerance of the third groove.
  • the buffer layer 330 may be provided with a first opening 331 penetrating through the buffer layer 330, and the copper layer 340 may be provided with penetrating through the copper layer 340.
  • the size of the second opening 341 of the first opening 331 is smaller than the size of the second opening 341, so that the buffer layer 220 and the fingerprint detection device 200 form a buffer space.
  • the buffer space may be provided with a buffer material 396, and the buffer material 396 includes but is not limited to foam.
  • the upper surface of the fingerprint detection device 200 abuts against the buffer layer 330 through the buffer material 396, and the buffer material 396 can not only be used to prevent the fingerprint detection device 200 from touching the display screen. Influencing the detection performance of the fingerprint detection device 200 can also be sealed from dust, so as to ensure the detection performance of the fingerprint detection device 200 and increase the service life of the fingerprint detection device 200.
  • the buffer material 396 can also reduce the visibility of the fingerprint detection device 200 when the user views the fingerprint detection device 200 from the front of the display screen, thereby beautifying the appearance of the electronic device 300.
  • the internal space of the electronic device 300 can be reasonably utilized, thereby reducing the thickness of the electronic device and improving user experience.
  • FIG. 7 and FIG. 8 are only examples of the present application, and should not be construed as limiting the present application.
  • the fingerprint detection device may also be attached to the display screen and the middle frame at the same time.
  • the fingerprint detection device 300 may also be glued and fixed to the side surface of the groove of the middle frame 380.
  • the disclosed system, device, and method may be implemented in other ways.
  • the device embodiments described above are only illustrative.
  • the division of the units is only a logical function division, and there may be other divisions in actual implementation, for example, multiple units or components can be combined or It can be integrated into another system, or some features can be ignored or not implemented.
  • the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or units, and may be in electrical, mechanical or other forms.
  • the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the objectives of the solutions of the embodiments.
  • each unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units may be integrated into one unit.
  • the function is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer readable storage medium.
  • the technical solution of this application essentially or the part that contributes to the existing technology or the part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including Several instructions are used to make a computer device (which may be a personal computer, a server, or a network device, etc.) execute all or part of the steps of the methods described in the various embodiments of the present application.
  • the aforementioned storage media include: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disk or optical disk and other media that can store program code .

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Abstract

提供一种指纹检测装置和电子设备，其适用于具有显示屏的电子设备，所述显示屏由上至下依次包括透明盖板、显示面板、缓冲层和铜层，所述显示屏设置有贯通所述缓冲层和所述铜层的开窗；所述装置包括：光路层和第一传感器芯片，所述光路层设置在所述第一传感器芯片的上方；基板、固定结构以及第一压敏胶；所述第一传感器芯片固定电连接至所述基板，所述固定结构设置在所述基板的上表面且位于所述第一传感器芯片的侧部，所述固定结构通过所述第一压敏胶固定至所述铜层的下表面的所述开窗的周围区域，以使得所述第一传感器芯片对准所述开窗设置。本申请能够保证所述指纹识别模组和所述显示屏的性能的基础上提升指纹识别模组的可维修性。

Description

指纹检测装置和电子设备 技术领域
本申请实施例涉及指纹识别领域，并且更具体地，涉及指纹检测装置和电子设备。
背景技术
屏下指纹识别方案是指将光学或超声波指纹识别模组贴合在电子设备的有机发光二极管(Organic Light-Emitting Diode，OLED)屏幕的显示面板(即发光层)的底部，也就是不管光学指纹识别模组还是超声波指纹识别模组都需要和发光层的底部紧密粘结在一起。
具体地，所述OLED屏幕可以由上至下依次可包括透明盖板、显示面板以及后面板，所述后面板可以包括缓冲层和铜层(用作散热层或防辐射层)，在安装所述指纹识别模组的过程中，考虑到指纹识别模组的体积较大以及所述后面板的不透光性，需要在所述显示屏上设置贯通所述缓冲层和所述铜层的开口，并将所述指纹识别模组通过粘贴的方式安装在所述开口内的所述显示面板的下表面。
但是，将所述指纹识别模组粘贴至所述显示面板的下表面，会使得所述指纹识别模组的安装工艺和拆卸工艺过于复杂，降低了所述指纹识别模组的可维修性。此外，当所述显示屏受到按压或者所述电子设备出现跌落或碰撞时，由于所述指纹检测装置直接粘贴在所述显示面板上，会导致所述显示面板和所述指纹检测装置发生挤压而影响所述显示面板和所述指纹检测装置的性能。另外，在安装拆卸所述指纹识别模组的过程中，容易损坏所述显示面板，进而降低了电子设备的良率。
因此，本领域急需一种能够保证所述指纹识别模组和所述显示屏的性能的基础上提升指纹识别模组的可维修性的方案。
发明内容
提供一种指纹检测装置和电子设备，能够保证所述指纹识别模组和所述显示屏的性能的基础上提升指纹识别模组的可维修性。
第一方面，提供了一种指纹检测装置，适用于具有显示屏的电子设备， 所述显示屏由上至下依次包括透明盖板、显示面板、缓冲层和铜层，所述显示屏设置有贯通所述缓冲层和所述铜层的开窗；
所述指纹检测装置包括：
光路层和第一传感器芯片，所述光路层设置在所述第一传感器芯片的上方；
基板、固定结构以及第一压敏胶；
其中，所述第一传感器芯片固定电连接至所述基板，所述固定结构设置在所述基板的上表面且位于所述第一传感器芯片的侧部，所述固定结构通过所述第一压敏胶固定至所述铜层的下表面的所述开窗的周围区域，以使得所述第一传感器芯片对准所述开窗设置，所述第一传感器芯片用于通过所述开窗接收经由所述显示屏上方的人体手指返回的并通过所述光路层引导的指纹检测信号，所述指纹检测信号用于检测所述手指的指纹信息。
针对所述指纹检测装置，光路层直接设置在第一传感器芯片的上表面，所述第一传感器芯片的下表面通过所述第一固定胶固定在基板上，能够避免单独为携带有所述光路层以及所述第一传感器芯片设置外壳，降低了所述指纹检测装置的尺寸(例如厚度)。
此外，光路层直接设置在第一传感器芯片的上表面，所述第一传感器芯片的下表面通过所述第一固定胶固定在基板上，使得各部件在厚度方向上紧密配合配合(即各部件在厚度方向上紧密配合配合不预留间隙)，基于目前所述中框的厚度，即使保留所述显示屏中的缓冲层和铜层，也可以使得所述指纹检测装置的底部与所述电子设备的电池之间预留有间隙，足以将所述指纹检测装置设置在所述显示屏和所述电池370之间。
相应的，相对于将所述指纹识别装置设置在所述电池之外的其它位置，将所述指纹检测装置设置在所述显示屏和所述电池之间，不仅不需要调整所述电子设备的原有内部结构，还能够提升所述电子设备的内部空间的利用率。例如，可以增大电池的体积，并将节省出来的空间用来容纳增大体积后的电池，相应的，能够在不增加电子设备体积的情况下增加所述电子设备的使用寿命和用户体验。
另外，通过所述第一压敏胶利用所述基板的固定结构，将所述指纹检测装置粘贴至所述显示屏的铜层，相较于将所述指纹检测装置直接贴合至所述显示屏的显示面板(即OLED层)，不仅能够避免将所述指纹检测装置贴合 至所述显示屏后影响所述显示屏的性能，还能够降低安装所述指纹检测装置的困难程度，相应的，能够降低所述指纹检测装置的安装复杂度并提升所述电子设备的良率。此外，将所述指纹检测装置粘贴至所述显示屏的铜层，还能够避免在拆卸所述指纹检测装置的过程中损坏显示屏，相应的，能够降低所述指纹检测装置的拆卸复杂度并提升所述电子设备的良率。另外，当所述显示屏受到按压或者所述电子设备出现跌落或碰撞时，由于所述显示面板和所述指纹检测装置之间存在所述缓冲层和所述铜层，能够避免所述显示面板和所述指纹检测装置发生挤压而影响所述显示面板和所述指纹检测装置的性能。
最后，通过将所述指纹检测装置粘贴至所述显示屏的铜层，相较于将所述指纹检测装置直接贴合至所述显示屏的显示面板，还能够避免所述开窗的尺寸过大，相应的，能够降低用户从所述显示屏的正面观看所述指纹检测装置时的可视程度，进而能够美化电子设备的外观。
在一些可能的实现方式中，所述固定结构和所述第一压敏胶的外侧设置有紫外固化胶，以相对所述显示屏固定所述指纹检测装置。
在一些可能的实现方式中，所述基板由上至下依次包括第一覆盖层、第一导电层、基材层、第二导电层以及第二覆盖层，所述基板的上表面在第一区域向下延伸并贯通所述第一覆盖层和所述第一导电层以形成第一凹槽，所述基板的上表面在与所述第一区域相连的第二区域向下延伸并贯通所述第一覆盖层以形成所述基板的焊盘；
所述指纹检测装置还包括：
第一固定胶以及第一金线；
其中，所述第一传感器芯片的下表面通过所述第一固定胶固定至所述第一凹槽内，所述第一传感器芯片通过所述第一金线连接至所述基板的焊盘。
通过去除所述基板在所述第一区域处的第一覆盖层和所述第一导电层，形成用于容纳所述第一固定胶和所述第一传感器芯片的第一凹槽，能够降低所述指纹检测装置的厚度。
其次，通过去除所述基板的所述第二区域处的第一覆盖层，形成用于电连接所述第一传感器芯片的基板焊盘，能够为用于电连接所述第一传感器芯片和所述基板的所述第一金线提供容纳空间，相应的，降低了所述第一金线在所述基板上方的占用空间，进而能够降低所述指纹检测装置的厚度。
再次，在厚度方向上通过各个层之间的紧密配合，保证最大程度的降低所述指纹检测装置的厚度。
最后，由于所述光路层直接设置在所述第一传感器芯片的上表面，所述指纹检测装置的图像采集视场仅受到所述光路层的面积以及对应的第一传感器芯片的面积的影响，基于此，可以根据实际需求合理设计光路层的面积及其对应的第一传感器芯片的面积，以满足不同用户以及不同客户的需求(例如大面积图像采集视场的需求)。
综上所述，本申请的技术方案不仅能够降低所述指纹检测装置的厚度，还能够保证具有足够大的图像采集视场。
在一些可能的实现方式中，所述第一传感器芯片的侧壁和所述第一凹槽的侧壁之间存在间隙。
通过在所述第一传感器芯片的侧壁和所述第一凹槽的侧壁之间设计一定的间隙，即使所述第一传感器芯片的制备产品的尺寸与所述第一传感器芯片设计尺寸之间存在差异，或者即使所述第一凹槽的实际尺寸和所述第一凹槽的设计尺寸之间存在差异，也不影响所述将所述第一传感器芯片安装在所述第一凹槽内。
换言之，所述第一传感器芯片的侧壁和所述第一凹槽的侧壁之间的间隙不仅可以作为所述第一传感器芯片的尺寸公差和/或作为所述第一凹槽的尺寸公差，也可以作为所述第一传感器芯片的安装公差，相应的，能够提升所述指纹检测装置的良率。
在一些可能的实现方式中，所述指纹检测装置还包括：
第二传感器芯片、第二固定胶以及第二金线；
其中，所述基板的上表面在与所述第二区域相连的第三区域向下延伸并贯通所述第一覆盖层和所述第一导电层以形成第二凹槽，所述第二传感器芯片通过第二固定胶固定在所述第二凹槽内，所述第二传感器芯片通过所述第二金线连接至所述基板的焊盘，以使得所述第二传感器芯片连接至所述第一传感器芯片，所述第二传感器芯片用于配合所述第一传感器芯片进行屏下指纹识别。
通过设置的所述第二传感器芯片，可以分担所述第一传感器芯片的处理任务，相当于，将功能完整的且较厚的一个传感器芯片替换为并列设置的厚度较薄的第一传感器芯片和第二传感器芯片，相应的，能够在不影响指纹识 别性能的基础上降低所述指纹检测装置的厚度。
在一些可能的实现方式中，所述第二传感器芯片的侧壁和所述第二凹槽的侧壁之间存在间隙。
通过在所述第二传感器芯片的侧壁和所述第二凹槽的侧壁之间设计一定的间隙，即使所述第二传感器芯片的制备产品的尺寸与所述第二传感器芯片的设计尺寸之间存在差异，或者即使所述第二凹槽的实际尺寸和所述第二凹槽的设计尺寸之间存在差异，也不影响所述将所述第二传感器芯片安装在所述第二凹槽内。
换言之，所述第二传感器芯片的侧壁和所述第二凹槽的侧壁之间的间隙不仅可以作为所述第二传感器芯片的尺寸公差和/或作为所述第二凹槽的尺寸公差，也可以作为所述第二传感器芯片的安装公差，相应的，能够提升所述指纹检测装置的良率。
在一些可能的实现方式中，所述固定结构包括：
支架和金线保护胶；
其中，所述金线保护胶用于封装所述第一金线，所述支架设置在所述第一覆盖膜的上表面并位于所述第一传感器芯片的外侧。
在一些可能的实现方式中，所述第一传感器芯片和所述支架形成的间隙的宽度大于所述第一传感器芯片的侧壁和所述第一凹槽的侧壁之间形成的间隙的宽度，所述支架的外侧相对所述第一覆盖膜的外侧向靠近所述第一传感器芯片的方向延伸预设距离。
通过所述金线保护胶，能够保证所述基板和所述第一传感器芯片之间的电连接的稳定性，相应的，能够保证所述指纹检测装置的性能。
此外，所述第一传感器芯片和所述支架形成的间隙不仅可以作为所述支架的尺寸公差，也可以作为所述支架的安装公差，相应的，能够提升所述指纹检测装置的良率。类似地，所述预设距离不仅可以作为所述支架的尺寸公差，也可以作为所述支架的安装公差，相应的，能够提升所述指纹检测装置的良率。
在一些可能的实现方式中，所述金线保护胶的厚度小于或等于所述光路层的厚度、所述第一传感器芯片的厚度以及所述第一固定胶的厚度之和。
在一些可能的实现方式中，所述支架为聚对苯二甲酸乙二醇酯PET胶层；或所述支架通过支架固定胶固定在所述第一覆盖膜的上表面并位于所述 第一传感器芯片的外侧。
在一些可能的实现方式中，所述固定结构还包括：
遮光层；
其中，所述光路层包括透镜层和光路引导层，所述微透镜用于将经由所述显示屏上方的人体手指返回的光信号会聚至所述光路引导层，所述光路引导层将所述微透镜会聚的光信号引导至所述第一传感器芯片，所述遮光层从所述支架的上方延伸至所述光路引导层上方，所述遮光层和所述微透镜层之间形成有间隙，所述遮光层用于遮挡从所述第一传感器芯片的入射面之外的其它位置入射的光信号。
将所述遮光层构造为从所述支架的上方延伸至所述光路引导层的上方，不仅能够有效遮挡从所述第一传感器芯片的非入射面入射的光信号，还能够尽可能的将所述遮光层紧密固定至所述光路层，相应的，能够尽可能的降低所述指纹检测装置的厚度。
此外，将所述遮光层构造为从所述支架的上方延伸至所述光路引导层的上方，能够避免由于所述遮光层覆盖所述透镜层而缩小所述指纹检测装置的图像采集区域。
在一些可能的实现方式中，所述遮光层为遮挡胶层，所述第一金线的弧高位置被所述遮挡胶层覆盖。
将所述第一金线的弧高位置设计被所述遮挡胶层覆盖，不仅能够有效遮挡从所述第一传感器芯片的非入射面入射的光信号，还能够利用所述第一金线的金线保护胶支撑所述遮挡胶层，相应的，能够提升所述指纹检测装置的稳定性。
在一些可能的实现方式中，所述第一金线的金线保护胶用于支撑所述遮光层。
在一些可能的实现方式中，所述指纹检测装置还包括：
第一双面胶层、膜材层和第二双面胶层；
其中，所述第一双面胶层设置在所述遮光层的上方，所述膜材层设置在所述第一双面胶层的上方，所述第二双面胶层设置在所述膜材层的上方。
在一些可能的实现方式中，所述指纹检测装置还包括：
柔性电路板，所述柔性电路板形成有所述柔性电路板的金手指；
各向异性导电胶膜，所述柔性电路板的金手指通过所述各向异性导电胶 膜电连接至所述基板的金手指。
通过所述各向异性导电胶膜，将所述柔性电路板的金手指压合至所述基板的金手指，相当于，可以为所述指纹检测装置配置不同规格的柔性电路板，使得所述指纹检测装置更具有通用性，相应的，能够满足不同用户或客户的需求。
在一些可能的实现方式中，所述指纹检测装置的整体厚度为0.15-0.6mm。
第二方面，提供了一种电子设备，包括：
显示屏；
指纹检测装置，设置在所述显示屏下方，所述指纹检测装置为第一方面或第一方面中任一种可能的实现方式中所述的指纹检测装置，且其指纹采集区域至少部分位于所述显示屏的显示区域之中。
在一些可能的实现方式中，所述电子设备还包括中框，所述中框的上表面向下延伸形成有第三凹槽，所述指纹检测装置延伸至所述第三凹槽内。
附图说明
图1是本申请可以适用的电子设备的平面示意图。
图2是图1所示的电子设备的侧剖面示意图。
图3至图6是本申请实施例的指纹识别装置的示意性结构图。
图7和图8是本申请实施例的包括指纹识别装置的电子设备的示意性结构图。
具体实施方式
下面将结合附图，对本申请实施例中的技术方案进行描述。
本申请实施例的技术方案可以应用于各种电子设备。例如，智能手机、笔记本电脑、平板电脑、游戏设备等便携式或移动计算设备，以及电子数据库、汽车、银行自动柜员机(Automated Teller Machine，ATM)等其他电子设备。但本申请实施例对此并不限定。
本申请实施例的技术方案可以用于生物特征识别技术。其中，生物特征识别技术包括但不限于指纹识别、掌纹识别、虹膜识别、人脸识别以及活体识别等识别技术。为了便于说明，下文以指纹识别技术为例进行说明。
本申请实施例的技术方案可以用于屏下指纹识别技术。
屏下指纹识别技术是指将指纹检测装置安装在显示屏下方，从而实现在显示屏的显示区域内进行指纹识别操作，不需要在电子设备正面除显示区域外的区域设置指纹采集区域。具体地，指纹检测装置使用从电子设备的显示组件的顶面返回的光来进行指纹感应和其他感应操作。这种返回的光携带与显示组件的顶面接触或者接近的物体(例如手指)的信息，位于显示组件下方的指纹检测装置通过采集和检测这种返回的光以实现屏下指纹识别。其中，指纹检测装置的设计可以为通过恰当地配置用于采集和检测返回的光的光学元件来实现期望的光学成像，从而检测出所述手指的指纹信息。
图1和图2示出了屏下指纹识别技术可以适用的电子设备100的示意图，其中图1为电子设备100的正面示意图，图2为图1所示的电子设备100的部分剖面结构示意图。
如图2所示，电子设备100可以包括显示屏120和指纹检测装置130。
显示屏120可以为自发光显示屏，其采用具有自发光的显示单元作为显示像素。比如显示屏120可以为有机发光二极管(Organic Light-Emitting Diode，OLED)显示屏或者微型发光二极管(Micro-LED)显示屏。
此外，显示屏120还可以具体为触控显示屏，其不仅可以进行画面显示，还可以检测用户的触摸或者按压操作，从而为用户提供一个人机交互界面。比如，在一种实施例中，电子设备100可以包括触摸传感器，所述触摸传感器可以具体为触控面板(Touch Panel，TP)，其可以设置在所述显示屏120表面，也可以部分集成或者整体集成到所述显示屏120内部，从而形成所述触控显示屏。
指纹检测装置130可以为光学指纹检测装置。
具体来说，指纹检测装置130(也称为指纹识别模组或指纹检测模组)可以包括具有光学感应阵列的传感器芯片(也可称为指纹传感器)。其中，光学感应阵列包括多个光学感应单元，每个光学感应单元可以具体包括光探测器或者光电传感器。或者说，指纹检测装置130可以包括光探测器(Photo detector)阵列(或称为光电探测器阵列、光电传感器阵列)，其包括多个呈阵列式分布的光探测器。
如图1所示，指纹检测装置130可以设置在所述显示屏120的下方的局部区域，从而使得指纹检测装置130的指纹采集区域(或检测区域)103至 少部分位于所述显示屏120的显示区域102内。
如图2所示，指纹检测装置130的光学感应阵列的所在区域或者光感应范围对应所述指纹检测装置130的指纹采集区域103。其中，指纹检测装置130的指纹采集区域103可以等于或不等于指纹检测装置130的光学感应阵列的所在区域的面积或者光感应范围，本申请实施例对此不做具体限定。
例如，通过光线准直的光路设计，指纹检测装置130的指纹采集区域103可以设计成与所述指纹检测装置130的感应阵列的面积基本一致。
又例如，通过微距镜头进行汇聚光线的光路设计或者反射光线的光路设计，可以使得所述指纹检测装置130的指纹采集区域103的面积大于所述指纹检测装置130感应阵列的面积。
下面对指纹检测装置130的光路设计进行示例性说明。
以指纹检测装置130的光路设计采用具有高深宽比的通孔阵列的光学准直器为例，所述光学准直器可以具体为在半导体硅片制作而成的准直器(Collimator)层，其具有多个准直单元或者微孔，所述准直单元可以具体为小孔，从手指反射回来的反射光中，垂直入射到所述准直单元的光线可以穿过并被其下方的传感器芯片接收，而入射角度过大的光线在所述准直单元内部经过多次反射被衰减掉，因此所述传感器芯片基本只能接收到其正上方的指纹纹路反射回来的反射光，能够有效提高图像分辨率，进而提高指纹识别效果。
以指纹检测装置130的光路设计采用透镜(Micro-Lens)层的光路设计为例，所述透镜层可以具有由多个微透镜形成的微透镜阵列，其可以通过半导体生长工艺或者其他工艺形成在所述传感器芯片的感应阵列上方，并且每一个微透镜可以分别对应于所述感应阵列的其中一个或多个感应单元。所述透镜层和所述感应单元之间还可以形成其他光学膜层，比如介质层或者钝化层，更具体地，所述透镜层和所述感应单元之间还可以包括具有微孔的挡光层，其中所述微孔形成在其对应的微透镜和感应单元之间，所述挡光层可以阻挡相邻感应单元之间的光学干扰，并使光线通过所述微透镜汇聚到所述微孔内部并经由所述微孔传输到所述微透镜对应的感应单元，以进行光学指纹成像。
需要说明的是，上述光路引导结构的几种实现方案可以单独使用也可以结合使用，比如，可以在所述准直器层或者所述光学透镜层下方进一步设置 透镜层。当然，在所述准直器层或者所述光学透镜层与所述透镜层结合使用时，其具体叠层结构或者光路可能需要按照实际需要进行调整。
指纹检测装置130可以用于采集用户的指纹信息(比如指纹图像信息)。
以显示屏120采用OLED显示屏为例，显示屏120可以采用具有自发光显示单元的显示屏，比如有机发光二极管(Organic Light-Emitting Diode，OLED)显示屏或者微型发光二极管(Micro-LED)显示屏。指纹检测装置130可以利用OLED显示屏的位于指纹采集区域103的显示单元(即OLED光源)来作为光学指纹检测的激励光源。
当手指触摸、按压或者接近(为便于描述，在本申请中统称为按压)在指纹采集区域103时，显示屏120向指纹采集区域103上方的手指发出一束光，这一束光在手指的表面发生反射形成反射光或者经过手指的内部散射后而形成散射光，在相关专利申请中，为便于描述，上述反射光和散射光统称为反射光。由于指纹的嵴(ridge)与峪(vally)对于光的反射能力不同，因此，来自指纹嵴的反射光和来自指纹峪的发生过具有不同的光强，反射光经过显示屏120后，被指纹检测装置130中的传感器芯片所接收并转换为相应的电信号，即指纹检测信号；基于所述指纹检测信号便可以获得指纹图像数据，并且可以进一步进行指纹匹配验证，从而在所述电子设备100实现光学指纹识别功能。
由此可见，用户需要对电子设备100进行指纹解锁或者其他指纹验证的时候，只需要将手指按压在位于显示屏120的指纹采集区域103，便可以实现指纹特征的输入操作。
当然，指纹检测装置130也可以采用内置光源或者外置光源来提供用于进行指纹检测识别的光信号。
如图1所示，电子设备100还可以包括保护盖板110。
盖板110可以具体为透明盖板，比如玻璃盖板或者蓝宝石盖板，其位于显示屏120的上方并覆盖所述电子设备100的正面，且盖板110表面还可以设置有保护层。因此，本申请实施例中，所谓的手指按压显示屏120实际上可以是指手指按压在显示屏120上方的盖板110或者覆盖所述盖板110的保护层表面。
如图1所示，指纹检测装置130的下方还可以设置有电路板140，比如软性电路板(Flexible Printed Circuit，FPC)。
指纹检测装置130可以电连接到电路板140，并通过电路板140实现与其他***电路或者电子设备100的其他元件的电性互连和信号传输。比如，指纹检测装置130可以通过电路板140接收电子设备100的处理单元的控制信号，并且还可以通过电路板140将来自指纹检测装置130的指纹检测信号输出给电子设备100的处理单元或者控制单元等。
图3是本申请实施例的包括一个传感器芯片的指纹检测装置200的示意性结构图。所述指纹检测装置200适用于具有显示屏的电子设备。例如所述指纹检测装置200可以适用于如图1或图2所示的电子设备100。
需要说明的是，为便于说明，在本申请实施例中，相同的附图标记用于表示相同的部件，并且为了简洁，在不同实施例中，省略对相同部件的详细说明。
如图3所示，所述指纹检测装置200包括基板210、光路层220、第一传感器芯片230、第一固定胶240以及第一金线250。
其中，所述基板210由上至下依次包括第一覆盖层212、第一导电层211层212、基材层213、第二导电层214以及第二覆盖层215，所述基板210的上表面在第一区域向下延伸并贯通所述第一覆盖层212和所述第一导电层211以形成第一凹槽，所述基板210的上表面在与所述第一区域相连的第二区域向下延伸并贯通所述第一覆盖层212以形成所述基板210的焊盘2111。可选地，在其他可替代实施例中，所述基板210可以包括除所述第一导电层211和所述第二导电层214之外的导电层。可选地，所述第一导电层211或所述第二导电层214可以是铜层或铜箔层。可选地，所述第一覆盖层212或所述第二覆盖层213可以是绝缘层(例如树脂层)。
光路层220设置在所述第一传感器芯片230的上方，所述第一传感器芯片230的下表面通过所述第一固定胶240固定至所述第一凹槽内，所述第一传感器芯片230通过所述第一金线250连接至所述基板210的焊盘2111，所述第一传感器芯片230用于接收经由所述显示屏上方的人体手指返回的并通过所述光路层220引导的指纹检测信号，所述指纹检测信号用于检测所述手指的指纹信息。
换言之，所述第一传感器芯片230下表面通过第一固定胶240粘贴在所述第一凹槽内，使得所述第一传感器芯片230的至少一部分设置在所述第一凹槽内，并通过所述第一金线250电连接至所述基板210；其中，所述第一 传感器芯片230可以通过所述基板210设置在电子设备的显示屏的下方所述第一传感器芯片230用于接收经由所述显示屏上方的人体手指反射或散射而返回的指纹检测信号，并基于所述指纹检测信号检测所述手指的指纹信息，以进行指纹注册或识别。
应理解，所述第一传感器芯片230可以包括多个芯片也可以包括一个芯片，例如所述第一传感器芯片230可以包括多个光学指纹传感器芯片，所述多个光学指纹传感器芯片并排设置在所述第一凹槽内，以拼接成一个光学指纹传感器芯片组件。所述光学指纹传感器芯片组件可以用于同时获取多张指纹图像，所述多张指纹图像拼接后可以作为一个指纹图像进行指纹注册或识别。
针对所述指纹检测装置200，光路层220直接设置在第一传感器芯片230的上表面，所述第一传感器芯片230的下表面通过所述第一固定胶240固定在基板210上，能够避免单独为携带有所述光路层220以及所述第一传感器芯片230设置外壳，降低了所述指纹检测装置200的尺寸(例如厚度)。
此外，通过去除所述基板210在所述第一区域处的第一覆盖层212和所述第一导电层211，形成用于容纳所述第一固定胶240和所述第一传感器芯片230的第一凹槽，能够降低所述指纹检测装置200的厚度。
其次，通过去除所述基板210的所述第二区域处的第一覆盖层212，形成用于电连接所述第一传感器芯片230的基板210焊盘，能够为用于电连接所述第一传感器芯片230和所述基板210的所述第一金线250提供容纳空间，相应的，降低了所述第一金线250在所述基板210上方的占用空间，进而能够降低所述指纹检测装置200的厚度。
再次，在厚度方向上通过各个层之间的紧密配合，保证最大程度的降低所述指纹检测装置200的厚度。
最后，由于所述光路层220直接设置在所述第一传感器芯片230的上表面，所述指纹检测装置200的图像采集视场仅受到所述光路层220的面积以及对应的第一传感器芯片230的面积的影响，基于此，可以根据实际需求合理设计光路层220的面积及其对应的第一传感器芯片230的面积，以满足不同用户以及不同客户的需求(例如大面积图像采集视场的需求)。
综上所述，本申请的技术方案不仅能够降低所述指纹检测装置200的厚度，还能够保证具有足够大的图像采集视场。
如图3所示，在本申请的一些实施例中，所述第一传感器芯片230的侧壁和所述第一凹槽的侧壁之间存在间隙d1。
通过在所述第一传感器芯片230的侧壁和所述第一凹槽的侧壁之间设计一定的间隙d1，即使所述第一传感器芯片230的制备产品的尺寸与所述第一传感器芯片230设计尺寸之间存在差异，或者即使所述第一凹槽的实际尺寸和所述第一凹槽的设计尺寸之间存在差异，也不影响所述将所述第一传感器芯片230安装在所述第一凹槽内。
换言之，所述第一传感器芯片230的侧壁和所述第一凹槽的侧壁之间的间隙d1不仅可以作为所述第一传感器芯片230的尺寸公差和/或作为所述第一凹槽的尺寸公差，也可以作为所述第一传感器芯片230的安装公差，相应的，能够提升所述指纹检测装置200的良率。所述尺寸公差可以是允许的最大极限尺寸减最小极限尺寸之差的绝对值的大小，或所述尺寸公差可以是允许的上偏差减下偏差之差大小。极限偏差＝极限尺寸-基本尺寸，上偏差＝最大极限尺寸-基本尺寸，下偏差＝最小极限尺寸-基本尺寸。所述第一传感器芯片230的尺寸公差可以是在切削加工所述第一传感器芯片230的过程中允许的变动量。在基本尺寸相同的情况下，尺寸公差愈小，则尺寸精度愈高。类似地，所述第一传感器芯片230的安装公差可以指允许的第一极限安装位置与第二极限安装位置之间的偏移距离，所述第一极限安装位置可以是允许的最靠近所述第一凹槽的第一侧壁的安装位置，所述第二极限安装位置可以是允许的最靠近所述第一凹槽的第二侧壁的安装位置，所述第一侧壁为与所述第二侧壁相对的侧壁。
例如，所述第一传感器芯片230的侧壁和所述第一凹槽的侧壁之间的间隙d1的宽度为100-300um。例如200um。当然可替代地，所述第一传感器芯片230的侧壁和所述第一凹槽的侧壁之间的间隙d1的宽度也可以为其他数值，或者属于一个其他预设数值范围内，本申请对此不做具体限定。例如，所述第一传感器芯片230的侧壁和所述第一凹槽的侧壁之间的间隙d1的宽度也可以是100um或250um，再如，所述第一传感器芯片230的侧壁和所述第一凹槽的侧壁之间的间隙d1的宽度还可以在100um～400un内。
需要说明的是，本申请对所述指纹检测装置200中各个部件或层的厚度不做具体限定，只要所述各个部件或层之间的结构关系采用本申请的设计方案，且通过紧密配合的方式控制指纹检测装置的厚度，其均属于本申请保护 的范围。
作为示例，所述第一覆盖层212的厚度和所述第二覆盖层的厚度均为10-30um，例如20um；所述第一导电层211的厚度和所述第二导电层的厚度均为10-20um，例如13um；所述基材的厚度为40-80um，例如64um；所述第一传感器芯片230的厚度为50-150um，例如60um；所述光路层220的厚度为10-30um，例如21um；所述第一金线250的最大弧高d6为30-60um，例如40um；所述第一固定胶240的厚度为10-30um，例如15um。
当然，所述第一覆盖层212的厚度、第一导电层211的厚度、基材层213的厚度、第二导电层214的厚度、第二覆盖层215的厚度、所述第一传感器芯片230的厚度、所述第一固定胶240的厚度、或所述第一金线250的最大弧高d6也可以是其它数值或在一个其他预设数值范围内，本申请对此不做具体限定。
如图3所示，在本申请的一些实施例中，所述指纹检测装置200还可包括支架251和金线保护胶252；其中，所述金线保护胶252用于封装所述第一金线250，所述支架251设置在所述第一覆盖层212的上表面并位于所述第一传感器芯片230的外侧。可选地，所述支架251通过支架固定胶253固定在所述第一覆盖层212的上表面并位于所述第一传感器芯片230的外侧。例如，所述支架251的材料包括但不限于金属、树脂、玻纤复合板以及胶层等。例如，所述支架251为聚对苯二甲酸乙二醇酯(polyethylene glycol terephthalate，PET)胶层。再如，所述支架251可以是由泡棉材料形成的支架。可选地，所述支架固定胶可以为双面胶。
换言之，所述支架251可以设置在所述基板210的上方且位于所述第一凹槽和所述基板210的焊盘2111(用于电连接所述第一传感器芯片230)的外侧或周围区域。
如图3所示，在本申请的一些实施例中，所述第一传感器芯片230和所述支架251形成的间隙d2的宽度大于或等于所述第一传感器芯片230的侧壁和所述第一凹槽的侧壁之间形成的间隙d1的宽度，所述支架251的外侧相对所述第一覆盖层212的外侧向靠近所述第一传感器芯片230的方向延伸预设距离d3。作为示例，所述第一传感器芯片230和所述支架251形成的间隙d2的宽度为100-400um，例如270um，所述预设距离d3为100-400um，例如200um。可选地，所述支架251的厚度为40-100um，例如50um或80um。
当然，在其他可替代实施例中，所述第一传感器芯片230和所述支架251形成的间隙d2、所述预设距离d3或所述支架251的厚度可以为其他具体数值，也可以在一个其他预设数值范围内。例如，所述支架251的厚度还可以是80um。
通过所述金线保护胶252，能够保证所述基板210和所述第一传感器芯片230之间的电连接的稳定性，相应的，能够保证所述指纹检测装置200的性能。
此外，所述第一传感器芯片230和所述支架251形成的间隙d2不仅可以作为所述支架251的尺寸公差，也可以作为所述支架251的安装公差，相应的，能够提升所述指纹检测装置200的良率。类似地，所述预设距离d3不仅可以作为所述支架251的尺寸公差，也可以作为所述支架251的安装公差，相应的，能够提升所述指纹检测装置200的良率。
在本申请的一些实施例中，所述金线保护胶252的厚度小于或等于所述光路层220的厚度、所述第一传感器芯片230的厚度以及所述第一固定胶240的厚度之和。例如，如图3所示，所述金线保护胶252的厚度等于所述光路层220中光路引导层222的厚度、所述第一传感器芯片230的厚度以及所述第一固定胶240的厚度之和。
将所述金线保护胶252的厚度构造为小于或等于所述光路层220的厚度、所述第一传感器芯片230的厚度以及所述第一固定胶240的厚度之和，能够在有效封装所述第一金线250的同时尽可能的降低所述指纹检测装置200的厚度。
当然，针对所述支架251，还可以设计出其它参数，用来直到所述支架251的制备以及安装。例如，如图3所示，在本申请的一些实施例中，所述第一传感器芯片230的靠近所述基板210的焊盘2111(用于电连接所述第一传感器芯片230)一侧和所述支架251之间的间隙d4的宽度大于所述第一传感器芯片230的背离所述基板210的焊盘2111(用于电连接所述第一传感器芯片230)一侧和所述支架251之间的间隙d2，以为所述支架固定胶252预留足够的容纳空间。可选地，所述第一传感器芯片230的靠近所述基板210的焊盘2111一侧和所述支架251之间的间隙d4的宽度可以是1300um或其他数值。
如图3所示，在本申请的一些实施例中，所述指纹检测装置200还包括 遮光层260。
其中，所述光路层220包括透镜层221和光路引导层222，所述透镜层221用于将经由所述显示屏上方的人体手指返回的光信号会聚至所述光路引导层222，所述光路引导层222将所述透镜层221会聚的光信号引导至所述第一传感器芯片230，所述遮光层260从所述支架251的上方延伸至所述光路引导层222上方，所述遮光层260和所述透镜层221之间形成有间隙d5，所述遮光层260用于遮挡从所述第一传感器芯片230的入射面之外的其它位置入射的光信号。可选地，所述遮光层260的厚度为10-30um，例如20um。当然，所述遮光层260的厚度也可以为其它具体数值或在一个其他预设数值范围内，本申请对此不做具体限定。
将所述遮光层260构造为从所述支架251的上方延伸至所述光路引导层222的上方，不仅能够有效遮挡从所述第一传感器芯片230的非入射面入射的光信号，还能够尽可能的将所述遮光层260紧密固定至所述光路层220，相应的，能够尽可能的降低所述指纹检测装置200的厚度。
此外，将所述遮光层260构造为从所述支架251的上方延伸至所述光路引导层222的上方，能够避免由于所述遮光层260覆盖所述透镜层221而缩小所述指纹检测装置的图像采集区域。
如图3所示，在本申请的一些实施例中，所述遮光层260为遮挡胶层，所述第一金线250的弧高位置被所述遮挡胶层覆盖。
将所述第一金线250的弧高位置设计为被所述遮挡胶层覆盖，不仅能够能够有效遮挡从所述第一传感器芯片230的非入射面入射的光信号，还能够利用所述第一金线250的金线保护胶支撑所述遮挡胶层，相应的，能够提升所述指纹检测装置200的稳定性。
当然，在其他可替代实施例中，也可以利用滤光片替代所述遮光层260。其中，滤光片用于来减少指纹感应中的不期望的环境光，以提高所述第一传感器芯片230对接收到的光的光学感应。滤光片具体可以用于过滤掉特定波长的光，例如，近红外光和部分的红光等。例如，人类手指吸收波长低于580nm的光的能量中的大部分，基于此，所述滤光片可以设计为过滤波长从580nm至红外的光，以减少环境光对指纹感应中的光学检测的影响。在具体实现中，所述滤光片可以包括一个或多个光学过滤器，所述一个或多个光学过滤器可以配置为例如带通过滤器，以允许OLED屏发射的光的传输，同时 阻挡太阳光中的红外光等其他光组分。一个或多个光学过滤器可以实现为例如光学过滤涂层，光学过滤涂层形成在一个或多个连续界面上，或可以实现为一个或多个离散的界面上。例如，所述滤光片可以是直接设计在所述透镜层上的涂层，以避免所述第一传感器芯片230获取的指纹图像中出现牛顿环。可选地，此外，所述滤光片的进光面可以设置有光学无机镀膜或有机黑化涂层，以使得滤光片的进光面的反射率低于第一阈值，例如1％，从而能够保证所述第一传感器芯片230能够接收到足够的光信号，进而提升指纹识别效果。
如图3所示，在本申请的一些实施例中，所述第一金线250的金线保护胶252用于支撑所述遮光层260。
换言之，所述金线保护胶252的厚度等于所述光路层220的中的光路引导层222的厚度、所述第一传感器芯片230的厚度以及所述第一固定胶240的厚度之和，使得所述金线保护胶250支撑所述遮光层260。
如图3所示，在本申请的一些实施例中，所述指纹检测装置200还包括第一双面胶层271、膜材层272和第二双面胶层273；其中，所述第一双面胶层271设置在所述遮光层260的上方，所述膜材层272设置在所述第一双面胶层271的上方，所述第二双面胶层273设置在所述膜材层272的上方。
在安装所述指纹检测装置200之前，通过设置所述第一双面胶层271、所述膜材层272和所述第二双面胶层273，能够有效防止在运输过程中损坏所述指纹检测装置200中的光路层220。
图4是图3所示的指纹检测装置200的变形结构的示意性结构图。
如图4所示，所述指纹检测装置200还可包括第二传感器芯片280、第二固定胶281以及第二金线282。
其中，所述基板210的上表面在与所述第二区域相连的第三区域向下延伸并贯通所述第一覆盖层212和所述第一导电层211以形成第二凹槽，所述第二传感器芯片280通过第二固定胶281固定在所述第二凹槽内，所述第二传感器芯片280通过所述第二金线282连接至所述基板210的焊盘2111，以使得所述第二传感器芯片280连接至所述第一传感器芯片230，所述第二传感器芯片280用于配合所述第一传感器芯片230进行屏下指纹识别。可选地，所述第三区域与所述第一区域分别位于所述第二区域的两侧。
通过设置的所述第二传感器芯片280，可以分担所述第一传感器芯片230 的处理任务，相当于，将功能完整的且较厚的一个传感器芯片替换为并列设置的厚度较薄的第一传感器芯片230和第二传感器芯片280，相应的，能够在不影响指纹识别性能的基础上降低所述指纹检测装置200的厚度。
在本申请的一些实施例中，所述第二传感器芯片280的侧壁和所述第二凹槽的侧壁之间存在间隙d7。可选地，所述第二传感器芯片280的侧壁和所述第二凹槽的侧壁之间的间隙d7的宽度为100-300um，例如200um。可选地，所述第二传感器芯片280的厚度为50-150um，例如60um，所述第二金线282的最大弧高为30-60um，例如40um，所述第二固定胶281的厚度为10-30um，例如15um。当然，可替代地，所述第二传感器芯片280的侧壁和所述第二凹槽的侧壁之间的间隙d7的宽度、所述第二传感器芯片280的厚度、所述第二金线282的最大弧高、或所述第二固定胶281的厚度也可以为其它具体数值或在一个其他预设数值范围内，本申请实施例对此不做具体限定。
通过在所述第二传感器芯片280的侧壁和所述第二凹槽的侧壁之间设计一定的间隙d7，即使所述第二传感器芯片280的制备产品的尺寸与所述第二传感器芯片280的设计尺寸之间存在差异，或者即使所述第二凹槽的实际尺寸和所述第二凹槽的设计尺寸之间存在差异，也不影响所述将所述第二传感器芯片280安装在所述第二凹槽内。
换言之，所述第二传感器芯片280的侧壁和所述第二凹槽的侧壁之间的间隙不仅可以作为所述第二传感器芯片280的尺寸公差和/或作为所述第二凹槽的尺寸公差，也可以作为所述第二传感器芯片280的安装公差，相应的，能够提升所述指纹检测装置200的良率。
需要说明的是，所述指纹检测装置200安装至电子设备时，可以通过额外的柔性电路板连接至所述电子设备的主板上。例如，如图5所示，所述基板210还可以包括基板210的金手指2122，所述基板210的金手指2122用于连接至柔性电路板，相应的，所述基板210通过所述柔性电路板连接至电子设备的主板。
图6是本申请实施例的设置有柔性电路板的指纹检测装置200的示意性结构图。
如图6所示，在本申请的一些实施例中，所述指纹检测装置200还可包括柔性电路板290和(Anisotropic Conductive Film，ACF)292，所述柔性电 路板290形成有所述柔性电路板290的金手指291；所述柔性电路板290的金手指291通过所述各向异性导电胶膜292电连接至所述基板210的金手指2122。
通过所述各向异性导电胶膜292，能够将所述柔性电路板290的金手指291压合至所述基板210的金手指2122，相当于，可以为所述指纹检测装置200配置不同规格的柔性电路板，使得所述指纹检测装置200更具有通用性，相应的，能够满足不同用户或客户的需求。
如图6所示，在本申请的一些实施例中，所述指纹检测装置200还可包括包括各向异性导电胶膜292的保护胶293，所述保护胶293可以位于所述各向异性导电胶膜292的两端，以保护所述各向异性导电胶膜292，进而保护所述柔性电路板290的金手指291和所述基板210的金手指2122。如图6所示，在本申请的一些实施例中，所述指纹检测装置200还可以包括图像处理器296，所述图像处理器296设置在所述柔性电路板290的一端。例如，图像处理器296可以为微处理器(Micro Processing Unit，MCU)，用于接收来自所述第一传感器芯片230通过所述柔性电路板290发送的指纹检测信号(例如指纹图像)，并对所述指纹检测信号进行简单的处理。如图6所示，在本申请的一些实施例中，所述指纹检测装置200还可以包括设置在所述柔性电路板290的一端的至少一个电容器295，所述至少一个电容器295用于优化(例如滤波处理)所述第一传感器芯片230采集的指纹检测信号。可选地，所述第一传感器芯片230中的每个芯片对应一个或者多个电容器。如图6所示，在本申请的一些实施例中，所述指纹检测装置200还可以包括设置在所述柔性电路板290的一端的连接器294，所述连接器294可以用于与外部装置或者所述电子设备的其它部件(例如主板)进行连接，进而实现与所述外部装置的通信或者所述电子设备的其它部件的通信。例如，所述连接器294可以用于连接所述电子设备的处理器，以便于所述电子设备的处理器接收经过所述图像处理器296处理过的指纹检测信号，并基于所述处理过的指纹检测信号进行指纹识别。
应当理解，图3至图6仅为本申请实施例的示例，不应理解为对本申请的限制。
例如，在图3和图4中，以透镜层221作为光路层220中用于会聚光信号的器件，可替代地，所述透镜层221也可以利用光学准直器。所述光学准 直器的相关描述可以参照前述内容中对所述指纹检测装置130的光路设计的相关描述。
再如，所述透镜层221可以具有由多个微透镜形成的微透镜阵列，所述光路引导层222可以为挡光层，所述挡光层具有多个微孔并设置在微透镜层221的下方，并且所述微孔与所述微透镜一一对应，所述第一传感器芯片230中的一个或多个光学感应单元对应所述透镜层221中的一个微透镜。可选地，所述光路层220还可以包括其他光学膜层，比如介质层或者钝化层。
上文结合图3至图6对本申请实施例的指纹检测装置200进行了介绍，下面对安装有所述指纹检测装置200的电子设备进行说明。
图7是本申请实施例的安装有图4所示的指纹检测装置200的电子设备300的示意性结构图。
如图7所示，所述电子设备300包括显示屏、位于所述显示屏下方的中框360、位于所述中框下方的电池370以及位于所述电池下方的电池易拉胶380，其中，所述显示屏由上至下依次包括透明盖板310、显示面板320、缓冲(cushion)层330和铜层340，所述显示屏设置有贯通所述缓冲层330和所述铜层340的开窗。换言之，所述缓冲层330可以设置有贯通所述缓冲层330的第一开窗331，所述铜层340可以设置有贯通所述铜层340的第二开窗341。可选地，所述显示屏可以是采用低温多晶硅技术(Low Temperature Poly-silicon，LTPS)制成的OLED有机发光面板，其厚度超薄、重量轻、低耗电，可以用于提供较为清晰的影像。所述中框360可以用于承载或支撑所述电子设备300中的各个器件或部件。所述器件或部件包括但不限于电池、摄像头、天线、主板以及所述显示屏。
缓冲层330也可以称为屏幕印刷(screen print)层或压花层，所述屏幕印刷层可以带有图文，所述图文可以用作商标图案等标识。所述缓冲层330可以是用于遮蔽光的黑色片状层或者印刷层。例如，所述缓冲层330可以是由泡棉材料形成层结构。铜层340也可以称为散热层(用作降低所述显示屏的温度)或者防辐射层。所述缓冲层330和所述铜层340可以合成为所述显示屏的后面板，或者所述铜层340称为所述显示屏的后面板。
其中，可以参考图4的附图标记理解所述指纹检测装置200的具体功能和结构。
换言之，所述指纹检测装置200包括基板210、光路层220、第一传感 器芯片230、第一固定胶240以及第一金线250。其中，所述基板210由上至下依次包括第一覆盖层212、第一导电层211层212、基材层213、第二导电层214以及第二覆盖层215。可选地，所述光路层220包括透镜层221以及其下方的光路引导层222。可选地，所述指纹检测装置200还可以包括支架251和金线保护胶252。所述指纹检测装置200还可以包括遮光层260。可选地，所述指纹检测装置200还可以包括第二传感器芯片280、第二固定胶281以及第二金线282。
基于上述结构，此处重点针对所述指纹检测装置200的安装方案进行详细说明。需要强调的是，由于所述支架层251、支架固定胶253和所述遮光层260均作为可选层，为便于从安装的角度描述所述指纹检测装置，下文引入一个中间概念(即固定结构)，所述固定结构包括所述支架层251、支架固定胶253和所述遮光层260中的至少一项。所述固定结构设置在所述基板210的上表面且位于所述第一传感器芯片230的侧部，如图7所示，所述固定结构通过第一压敏胶(pressure-sensitive adhesive，PSA)391固定至所述铜层340的下表面的所述开窗(即所述第一开窗331和所述第二开窗341)的周围区域，以使得所述第一传感器芯片230对准所述开窗设置，所述第一传感器芯片用于通过所述开窗接收经由所述显示屏上方的人体手指返回的并通过所述光路层引导的指纹检测信号，所述指纹检测信号用于检测所述手指的指纹信息。
以所述显示屏为OLED屏为例，所述显示屏可以是软屏也可以是硬屏。当手指放于亮屏的OLED屏上方，手指就会反射OLED屏发出的光，此反射光会穿透OLED屏直到OLED屏下方。位于OLED屏下方的光路层能够用于将漏光中的红外信号成分滤除。由于指纹是一个漫反射体，因此，经由手指反射或漫射形成的光信号在各方向都会存在。所述指纹检测装置200收集OLED屏上方漏下来的光信号，并基于接收到的光信号进行指纹图像的成像。
针对所述指纹检测装置200，光路层220直接设置在第一传感器芯片230的上表面，所述第一传感器芯片230的下表面通过所述第一固定胶240固定在基板210上，能够避免单独为携带有所述光路层220以及所述第一传感器芯片230设置外壳，降低了所述指纹检测装置200的尺寸(例如厚度)。
此外，通过所述第一PSA 391利用所述基板210的固定结构，将所述指 纹检测装置200粘贴至所述显示屏的铜层340，相较于将所述指纹检测装置200直接贴合至所述显示屏的显示面板(即OLED层)，不仅能够避免将所述指纹检测装置200贴合至所述显示屏后影响所述显示屏的性能，还能够降低安装所述指纹检测装置200的困难程度，相应的，能够降低所述指纹检测装置200的安装复杂度并提升所述电子设备300的良率。此外，将所述指纹检测装置200粘贴至所述显示屏的铜层340，还能够避免在拆卸所述指纹检测装置200的过程中损坏显示屏，相应的，能够降低所述指纹检测装置200的拆卸复杂度并提升所述电子设备300的良率。另外，当所述显示屏受到按压或者所述电子设备出现跌落或碰撞时，由于所述显示面板320和所述指纹检测装置200之间存在所述缓冲层330和所述铜层340，能够避免所述显示面板320和所述指纹检测装置200发生挤压而影响所述显示面板320和所述指纹检测装置200的性能。
另外，将所述指纹检测装置200粘贴至所述显示屏的铜层340，相较于将所述指纹检测装置200直接贴合至所述显示屏的显示面板320，还能够避免所述开窗的尺寸过大，相应的，能够降低用户从所述显示屏的正面观看所述指纹检测装置200时的可视程度，进而，能够美化所述电子设备300的外观。
如图6所示，在本申请的一些实施例中，所述固定结构和所述第一PSA 391的外侧设置有紫外(ultraviolet，UV)固化胶392，以相对所述显示屏固定所述指纹检测装置200。
通过所述UV固化胶392不仅可以将所述指纹检测装置200相对所述显示屏固定，还可以利用所述UV固化胶392的特性，降低安装所述指纹检测装置200的困难程度。
应理解，图7仅为将指纹检测装置200粘贴至电子设备的显示屏的示例，不应理解为对本申请的限制。
例如，在图7中，所述中框380在所述指纹检测装置200的下方形成有第三开窗。换言之，所述指纹检测装置200通过悬挂的方式贴合至所述显示屏的铜层340。例如，所述指纹检测装置200和所述显示屏之间存在间隙。但上述方案仅为一种实现方式，在另一种实现方式中，所述中框的上表面向下延伸形成有第三凹槽，所述指纹检测装置200的底部接触所述中框。换言之，所述指纹检测装置200还是通过悬挂的方式贴合至所述显示屏的铜层 340，但所述指纹检测装置200和所述显示屏之间不存在间隙。换言之，所述第三凹槽仅用于为所述指纹检测装置200提供容纳位置，而不用于固定所述指纹检测装置200。
假设所述第一覆盖层212的厚度和所述第二覆盖层的厚度均为20um，所述第一导电层211的厚度和所述第二导电层的厚度均为13um，所述基材的厚度为64um，下面结合图3，示例性说明所述指纹检测装置200分别在A-A、B-B、C-C处的厚度。
表1
Figure PCTCN2020081873-appb-000001
由表1可知，所述指纹检测装置200在A-A位置处的厚度为193um，在B-B位置处的厚度为232um，以及在C-C位置处的厚度为200um。相当于所述指纹检测装置200的最大厚度为232um，最小厚度为193um。
换言之，通过层叠结构设计所述指纹检测装置200，使得各部件在厚度方向上紧密配合配合(即各部件在厚度方向上紧密配合配合不预留间隙)，基于目前所述中框的厚度，即使保留所述显示屏中的缓冲层330和铜层340，也可以使得所述指纹检测装置200的底部与电池370之间预留至少200um左右的间隙，足以将所述指纹检测装置200设置在所述显示屏和所述电池370之间。
相应的，相对于将所述指纹识别装置200设置在所述电池370之外的其它位置，将所述指纹检测装置200设置在所述显示屏和所述电池370之间，不仅不需要调整所述电子设备300的原有内部结构，还能够提升所述电子设备300的内部空间的利用率。例如，可以增大电池370的体积，并将节省出来的空间用来容纳增大体积后的电池370，相应的，能够在不增加所述电子 设备300的体积的情况下增加所述电子设备300的使用寿命和用户体验。
上文结合图7对将指纹检测模组200安装在显示屏的铜层340的方案进行了说明，但本申请实施例不限于此。例如，在其他可替代实施例中，所述指纹检测装置200还可以用于安装并固定在所述中框380上。
图8是本申请实施例的安装有图4所示的指纹检测装置200的电子设备300的另一示意性结构图。其中，可以参考图4的附图标记理解所述指纹检测装置200的具体功能和结构，以及参考图7理解所述电子设备300中各个部件的功能和结构，为避免重复，此处不再对其进行赘述。
如图8所示，所述中框380的上表面向下延伸形成有第三凹槽，所述指纹检测装置200的底部通过第二PSA 393设置在所述第三凹槽内。换言之，所述第三凹槽仅用于为所述指纹检测装置200提供容纳位置，还用于固定所述指纹检测装置200。
如图8所示，在本申请的一些实施例中，所述指纹检测装置200和所述第三凹槽的侧壁之间存在间隙，所述指纹检测装置和所述第三凹槽的侧之间形成的间隙可以用作所述指纹检测装置200的尺寸公差或安装公差，还可以用作所述第三凹槽的尺寸公差。
如图8所示，在本申请的一些实施例中，所述缓冲层330可以设置有贯通所述缓冲层330的第一开窗331，所述铜层340可以设置有贯通所述铜层340的第二开窗341，其中，所述第一开窗331的尺寸小于所述第二开窗341的尺寸，使得所述缓冲层220和所述指纹检测装置200形成缓冲空间。可选地，如图8所示，所述缓冲空间可以设置有缓冲材料396，所述缓冲材料396包括但不限于泡棉。换言之，所述指纹检测装置200的上表面通过所述缓冲材料396抵靠至所述缓冲层330，所述缓冲材料396不仅可以用于避免由于所述指纹检测装置200触碰到所述显示屏而影响所述指纹检测装置200的检测性能，还能够密封绝尘，以保证所述指纹检测装置200的检测性能并提高所述指纹检测装置200的使用寿命。此外，通过所述缓冲材料396还可以降低用户从所述显示屏的正面观看所述指纹检测装置200时的可视程度，进而能够美化所述电子设备300的外观。另外，通过将所述缓冲材料396设置在所述缓冲空间内，能够合理利用电子设备300的内部空间，进而降低所述电子设备的厚度，提高用户体验。
应理解，图7和图8仅为本申请的示例，不应理解为对本申请的限制。
例如，在其他可替代实施例中，所述指纹检测装置还可以同时粘贴至所述显示屏和所述中框。再如，为最大程度利用电子设备的内部空间，所述指纹检测装置300还可以粘贴固定至所述中框380的凹槽的侧面。
需要说明的是，以上结合附图详细描述了本申请的优选实施方式，但是，本申请并不限于上述实施方式中的具体细节，在本申请的技术构思范围内，可以对本申请的技术方案进行多种简单变型，这些简单变型均属于本申请的保护范围。例如，在上述具体实施方式中所描述的各个具体技术特征，在不矛盾的情况下，可以通过任何合适的方式进行组合，为了避免不必要的重复，本申请对各种可能的组合方式不再另行说明。又例如，本申请的各种不同的实施方式之间也可以进行任意组合，只要其不违背本申请的思想，其同样应当视为本申请所公开的内容。
本领域普通技术人员可以意识到，结合本文中所公开的实施例描述的各示例的单元及算法步骤，能够以电子硬件、或者计算机软件和电子硬件的结合来实现。这些功能究竟以硬件还是软件方式来执行，取决于技术方案的特定应用和设计约束条件。专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能，但是这种实现不应认为超出本申请的范围。
所属领域的技术人员可以清楚地了解到，为描述的方便和简洁，上述描述的***、装置和单元的具体工作过程，可以参考前述方法实施例中的对应过程，在此不再赘述。
在本申请所提供的几个实施例中，应该理解到，所揭露的***、装置和方法，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，所述单元的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个单元或组件可以结合或者可以集成到另一个***，或一些特征可以忽略，或不执行。另一点，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口，装置或单元的间接耦合或通信连接，可以是电性，机械或其它的形式。
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的，作为单元显示的部件可以是或者也可以不是物理单元，即可以位于一个地方，或者也可以分布到多个网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例方案的目的。
另外，在本申请各个实施例中的各功能单元可以集成在一个处理单元 中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个单元中。
所述功能如果以软件功能单元的形式实现并作为独立的产品销售或使用时，可以存储在一个计算机可读取存储介质中。基于这样的理解，本申请的技术方案本质上或者说对现有技术做出贡献的部分或者该技术方案的部分可以以软件产品的形式体现出来，该计算机软件产品存储在一个存储介质中，包括若干指令用以使得一台计算机设备(可以是个人计算机，服务器，或者网络设备等)执行本申请各个实施例所述方法的全部或部分步骤。而前述的存储介质包括：U盘、移动硬盘、只读存储器(ROM，Read-Only Memory)、随机存取存储器(RAM，Random Access Memory)、磁碟或者光盘等各种可以存储程序代码的介质。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应所述以权利要求的保护范围为准。

Claims (18)

  1. 一种指纹检测装置，其特征在于，适用于具有显示屏的电子设备，所述显示屏由上至下依次包括透明盖板、显示面板、缓冲层和铜层，所述显示屏设置有贯通所述缓冲层和所述铜层的开窗；
    所述指纹检测装置包括：
    光路层和第一传感器芯片，所述光路层设置在所述第一传感器芯片的上方；
    基板、固定结构以及第一压敏胶；
    其中，所述第一传感器芯片固定电连接至所述基板，所述固定结构设置在所述基板的上表面且位于所述第一传感器芯片的侧部，所述固定结构通过所述第一压敏胶固定至所述铜层的下表面的所述开窗的周围区域，以使得所述第一传感器芯片对准所述开窗设置，所述第一传感器芯片用于通过所述开窗接收经由所述显示屏上方的人体手指返回的并通过所述光路层引导的指纹检测信号，所述指纹检测信号用于检测所述手指的指纹信息。
  2. 根据权利要求1所述的指纹检测装置，其特征在于，所述固定结构和所述第一压敏胶的外侧设置有紫外固化胶，以相对所述显示屏固定所述指纹检测装置。
  3. 根据权利要求1或2所述的指纹检测装置，其特征在于，所述基板由上至下依次包括第一覆盖层、第一导电层、基材层、第二导电层以及第二覆盖层，所述基板的上表面在第一区域向下延伸并贯通所述第一覆盖层和所述第一导电层以形成第一凹槽，所述基板的上表面在与所述第一区域相连的第二区域向下延伸并贯通所述第一覆盖层以形成所述基板的焊盘；
    所述指纹检测装置还包括：
    第一固定胶以及第一金线；
    其中，所述第一传感器芯片的下表面通过所述第一固定胶固定至所述第一凹槽内，所述第一传感器芯片通过所述第一金线连接至所述基板的焊盘。
  4. 根据权利要求3所述的指纹检测装置，其特征在于，所述第一传感器芯片的侧壁和所述第一凹槽的侧壁之间存在间隙。
  5. 根据权利要求3所述的指纹检测装置，其特征在于，所述指纹检测装置还包括：
    第二传感器芯片、第二固定胶以及第二金线；
    其中，所述基板的上表面在与所述第二区域相连的第三区域向下延伸并贯通所述第一覆盖层和所述第一导电层以形成第二凹槽，所述第二传感器芯片通过第二固定胶固定在所述第二凹槽内，所述第二传感器芯片通过所述第二金线连接至所述基板的焊盘，以使得所述第二传感器芯片连接至所述第一传感器芯片，所述第二传感器芯片用于配合所述第一传感器芯片进行屏下指纹识别。
  6. 根据权利要求5所述的指纹检测装置，其特征在于，所述第二传感器芯片的侧壁和所述第二凹槽的侧壁之间存在间隙。
  7. 根据权利要求3所述的指纹检测装置，其特征在于，所述固定结构包括：
    支架和金线保护胶；
    其中，所述金线保护胶用于封装所述第一金线，所述支架设置在所述第一覆盖膜的上表面并位于所述第一传感器芯片的外侧。
  8. 根据权利要求7所述的指纹检测装置，其特征在于，所述第一传感器芯片和所述支架形成的间隙的宽度大于所述第一传感器芯片的侧壁和所述第一凹槽的侧壁之间形成的间隙的宽度，所述支架的外侧相对所述第一覆盖膜的外侧向靠近所述第一传感器芯片的方向延伸预设距离。
  9. 根据权利要求7所述的指纹检测装置，其特征在于，所述金线保护胶的厚度小于或等于所述光路层的厚度、所述第一传感器芯片的厚度以及所述第一固定胶的厚度之和，所述金线保护胶包裹所述第一金线，所述金线保护胶用于防止所述第一传感器芯片的焊盘发生腐蚀。
  10. 根据权利要求7所述的指纹检测装置，其特征在于，所述支架为聚对苯二甲酸乙二醇酯胶层；或所述支架通过支架固定胶固定在所述第一覆盖膜的上表面并位于所述第一传感器芯片的外侧。
  11. 根据权利要求7所述的指纹检测装置，其特征在于，所述固定结构还包括：
    遮光层；
    其中，所述光路层包括透镜层和光路引导层，所述微透镜用于将经由所述显示屏上方的人体手指返回的光信号会聚至所述光路引导层，所述光路引导层将所述微透镜会聚的光信号引导至所述第一传感器芯片，所述遮光层从 所述支架的上方延伸至所述光路引导层上方，所述遮光层和所述微透镜层之间形成有间隙，所述遮光层用于遮挡从所述第一传感器芯片的入射面之外的其它位置入射的光信号。
  12. 根据权利要求11所述的指纹检测装置，其特征在于，所述遮光层为遮挡胶层，所述第一金线的弧高位置被遮光胶层覆盖。
  13. 根据权利要求11所述的指纹检测装置，其特征在于，所述第一金线的金线保护胶用于支撑所述遮光层。
  14. 根据权利要求11所述的指纹检测装置，其特征在于，所述指纹检测装置还包括：
    第一双面胶层、膜材层和第二双面胶层；
    其中，所述第一双面胶层设置在所述遮光层的上方，所述膜材层设置在所述第一双面胶层的上方，所述第二双面胶层设置在所述膜材层的上方。
  15. 根据权利要求1或2所述的指纹检测装置，其特征在于，所述指纹检测装置还包括：
    柔性电路板，所述柔性电路板形成有所述柔性电路板的金手指；
    各向异性导电胶膜，所述柔性电路板的金手指通过所述各向异性导电胶膜电连接至所述基板的金手指。
  16. 根据权利要求或2所述的指纹检测装置，其特征在于，所述指纹检测装置的整体厚度为0.15-0.6mm。
  17. 一种电子设备，其特征在于，包括：
    显示屏；
    指纹检测装置，设置在所述显示屏下方，所述指纹检测装置为如权利要求1至16中任一项所述的指纹检测装置，且其指纹采集区域至少部分位于所述显示屏的显示区域之中。
  18. 根据权利要求17所述的电子设备，其特征在于，所述电子设备还包括中框，所述中框的上表面向下延伸形成有第三凹槽，所述指纹检测装置延伸至所述第三凹槽内。
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Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11310402B2 (en) * 2015-08-25 2022-04-19 Gingy Technology Inc. Image capturing device and fingerprint image capturing device
KR102445512B1 (ko) * 2018-03-30 2022-09-21 삼성디스플레이 주식회사 지문 센서 패키지 및 이를 포함하는 표시 장치
CN111788576A (zh) * 2019-05-29 2020-10-16 深圳市汇顶科技股份有限公司 指纹检测装置和电子设备
EP3770802B1 (en) * 2019-05-29 2023-11-15 Shenzhen Goodix Technology Co., Ltd. Fingerprint recognition device and electronic device
CN111801685B (zh) * 2019-05-29 2024-06-04 深圳市汇顶科技股份有限公司 指纹检测装置和电子设备
CN111801686A (zh) * 2019-05-29 2020-10-20 深圳市汇顶科技股份有限公司 指纹检测装置和电子设备
CN112434272B (zh) * 2019-08-26 2022-12-20 英业达科技有限公司 电子装置
CN110971804B (zh) * 2019-12-19 2022-05-10 京东方科技集团股份有限公司 一种光场信息采集结构、显示装置及其控制方法
KR20210086143A (ko) * 2019-12-31 2021-07-08 엘지디스플레이 주식회사 터치 디스플레이 장치
WO2021210710A1 (ko) * 2020-04-17 2021-10-21 엘지전자 주식회사 이동 단말기
JP2022535172A (ja) * 2020-04-28 2022-08-05 北京小米移動軟件有限公司南京分公司 端末装置
WO2021248496A1 (zh) * 2020-06-12 2021-12-16 深圳市汇顶科技股份有限公司 指纹检测装置和电子设备
CN116997905A (zh) * 2021-03-23 2023-11-03 指纹卡安娜卡敦知识产权有限公司 指纹传感器模块和用于制造指纹传感器模块的方法
US20220345604A1 (en) * 2021-04-27 2022-10-27 Apple Inc. Camera integration for portable electronic devices

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170236017A1 (en) * 2014-08-08 2017-08-17 3M Innovative Properties Company Automated examination and processing of biometric data
CN207637122U (zh) * 2017-11-30 2018-07-20 维沃移动通信有限公司 一种具有指纹识别功能的移动终端
CN109716351A (zh) * 2018-12-13 2019-05-03 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
CN109791611A (zh) * 2018-12-29 2019-05-21 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
CN110770746A (zh) * 2019-05-29 2020-02-07 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备

Family Cites Families (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0758234B2 (ja) * 1992-04-16 1995-06-21 株式会社エニックス 半導体マトリクス型微細面圧分布センサ
US20040252867A1 (en) * 2000-01-05 2004-12-16 Je-Hsiung Lan Biometric sensor
JP3766034B2 (ja) * 2002-02-20 2006-04-12 富士通株式会社 指紋センサ装置及びその製造方法
US20060102974A1 (en) * 2004-11-12 2006-05-18 Chen Neng C Contact image capturing structure
US8243426B2 (en) * 2008-12-31 2012-08-14 Apple Inc. Reducing optical effects in a display
CN101478858B (zh) * 2009-01-21 2010-11-10 友达光电股份有限公司 电路板结构与其制造方法及液晶显示器
TW201103128A (en) * 2009-07-03 2011-01-16 Creative Sensor Inc Image sensor and the method for package of the same
US9030440B2 (en) * 2012-05-18 2015-05-12 Apple Inc. Capacitive sensor packaging
CN104517862B (zh) * 2013-09-29 2018-11-02 深南电路有限公司 一种指纹传感器封装方法和结构
TWI534962B (zh) * 2013-12-09 2016-05-21 茂丞科技股份有限公司 具有外觀隱藏的耦合電極之近接式感測器及其製造方法
US20150189204A1 (en) * 2013-12-27 2015-07-02 Optiz, Inc. Semiconductor Device On Cover Substrate And Method Of Making Same
CN105260043A (zh) * 2014-06-13 2016-01-20 宸鸿科技(厦门)有限公司 具有指纹识别功能的触控面板
CN104051366B (zh) * 2014-07-01 2017-06-20 苏州晶方半导体科技股份有限公司 指纹识别芯片封装结构和封装方法
US9666730B2 (en) * 2014-08-18 2017-05-30 Optiz, Inc. Wire bond sensor package
CN104156712A (zh) * 2014-08-26 2014-11-19 南昌欧菲生物识别技术有限公司 一种指纹识别检测组件及电子设备
CN104201116B (zh) * 2014-09-12 2018-04-20 苏州晶方半导体科技股份有限公司 指纹识别芯片封装方法和封装结构
US9576177B2 (en) * 2014-12-11 2017-02-21 Fingerprint Cards Ab Fingerprint sensing device
CN204808340U (zh) * 2015-03-06 2015-11-25 南昌欧菲生物识别技术有限公司 指纹识别装置、触摸屏及电子设备
CN104851813A (zh) * 2015-05-19 2015-08-19 苏州晶方半导体科技股份有限公司 指纹识别芯片的封装结构及封装方法
CN104851853A (zh) * 2015-05-19 2015-08-19 苏州晶方半导体科技股份有限公司 指纹识别芯片的封装结构及封装方法
CN106470527B (zh) * 2015-08-21 2018-12-14 旭景科技股份有限公司 用于形成增强型指纹辨识模块的印刷电路板结构
TWM523147U (zh) * 2015-09-10 2016-06-01 Metrics Technology Co Ltd J 指紋感測單元及指紋感測模組
CN106601629B (zh) * 2015-10-15 2018-11-30 力成科技股份有限公司 保护片服贴于芯片感应面的芯片封装构造
CN105678255B (zh) * 2016-01-04 2019-01-08 京东方科技集团股份有限公司 一种光学式指纹识别显示屏及显示装置
US10366272B2 (en) * 2016-04-19 2019-07-30 Samsung Electronics Co. Ltd Electronic device supporting fingerprint verification and method for operating the same
WO2018014629A1 (en) * 2016-07-18 2018-01-25 Shenzhen GOODIX Technology Co., Ltd. Optical fingerprint sensor with force sensing capability
KR20180042919A (ko) * 2016-10-19 2018-04-27 삼성전자주식회사 무선 충전 구조를 구비한 전자 장치
CN106971984A (zh) * 2016-11-23 2017-07-21 创智能科技股份有限公司 指纹感测辨识封装结构
EP3444747A4 (en) * 2017-06-13 2019-08-14 Shenzhen Goodix Technology Co., Ltd. MODULE FOR OPTICAL BIOLOGICAL DETECTION, DISPLAY DEVICE AND ELECTRONIC EQUIPMENT
WO2018227514A1 (zh) * 2017-06-16 2018-12-20 深圳市汇顶科技股份有限公司 指纹图像处理方法、光学指纹辨识***及电子装置
CN109117696A (zh) * 2017-06-26 2019-01-01 南昌欧菲生物识别技术有限公司 指纹模组及设有该指纹模组的电子设备
TWI642158B (zh) * 2017-07-21 2018-11-21 致伸科技股份有限公司 指紋感測晶片封裝結構
TWI627720B (zh) * 2017-08-25 2018-06-21 致伸科技股份有限公司 指紋感測晶片封裝結構
CN109508607A (zh) * 2017-09-15 2019-03-22 南昌欧菲生物识别技术有限公司 光学指纹识别组件和电子装置
CN107563348A (zh) * 2017-09-15 2018-01-09 南昌欧菲生物识别技术有限公司 光学指纹识别组件和电子装置
WO2019061535A1 (zh) * 2017-09-30 2019-04-04 深圳市汇顶科技股份有限公司 指纹识别的方法、装置和终端设备
CN207690104U (zh) * 2017-10-13 2018-08-03 南昌欧菲生物识别技术有限公司 指纹识别模组及设有该指纹识别模组的电子设备
CN207833534U (zh) * 2017-11-09 2018-09-07 深圳市汇顶科技股份有限公司 光学模组及终端设备
CN109074477B (zh) * 2017-11-09 2021-09-10 深圳市汇顶科技股份有限公司 光学模组及其加工方法、及终端设备
CN108323207B (zh) * 2018-02-06 2021-02-26 深圳市汇顶科技股份有限公司 屏下生物特征识别装置、生物特征识别组件和终端设备
CN207867178U (zh) * 2018-03-08 2018-09-14 深圳秋田微电子股份有限公司 一种框贴显示隔离结构及其显示模组
CN108416319A (zh) * 2018-03-23 2018-08-17 京东方科技集团股份有限公司 指纹识别模组及其制备方法、显示面板以及显示装置
CN109075141B (zh) * 2018-07-26 2020-02-07 深圳市汇顶科技股份有限公司 芯片封装结构、方法和终端设备
CN208836251U (zh) * 2018-09-25 2019-05-07 深圳市汇顶科技股份有限公司 光学图像采集装置和电子设备
CN208908034U (zh) * 2018-11-12 2019-05-28 南昌欧菲生物识别技术有限公司 光学指纹模组和电子装置
CN109643377A (zh) * 2018-11-19 2019-04-16 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
CN109522848A (zh) * 2018-11-20 2019-03-26 维沃移动通信有限公司 一种指纹模组、指纹模组的控制方法及终端
EP3786834B1 (en) * 2018-12-13 2022-12-07 Shenzhen Goodix Technology Co., Ltd. Fingerprint recognition device and electronic apparatus
CN109791610B (zh) * 2018-12-29 2021-04-27 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
CN111860452B (zh) * 2019-02-02 2022-03-04 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
WO2020186523A1 (zh) * 2019-03-21 2020-09-24 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
CN110309705B (zh) * 2019-04-30 2022-04-19 厦门天马微电子有限公司 显示面板和显示装置
CN210864764U (zh) * 2019-05-29 2020-06-26 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
CN113035795B (zh) * 2019-06-14 2022-11-08 深圳市汇顶科技股份有限公司 芯片封装结构和电子设备
EP3780095A1 (en) * 2019-06-14 2021-02-17 Shenzhen Goodix Technology Co., Ltd. Chip encapsulation structure and electronic device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170236017A1 (en) * 2014-08-08 2017-08-17 3M Innovative Properties Company Automated examination and processing of biometric data
CN207637122U (zh) * 2017-11-30 2018-07-20 维沃移动通信有限公司 一种具有指纹识别功能的移动终端
CN109716351A (zh) * 2018-12-13 2019-05-03 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
CN109791611A (zh) * 2018-12-29 2019-05-21 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
CN110770746A (zh) * 2019-05-29 2020-02-07 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备

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