WO2020237546A1 - 指纹识别装置和电子设备 - Google Patents

指纹识别装置和电子设备 Download PDF

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Publication number
WO2020237546A1
WO2020237546A1 PCT/CN2019/089123 CN2019089123W WO2020237546A1 WO 2020237546 A1 WO2020237546 A1 WO 2020237546A1 CN 2019089123 W CN2019089123 W CN 2019089123W WO 2020237546 A1 WO2020237546 A1 WO 2020237546A1
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WO
WIPO (PCT)
Prior art keywords
fingerprint
identification device
substrate
fingerprint identification
sensor chip
Prior art date
Application number
PCT/CN2019/089123
Other languages
English (en)
French (fr)
Inventor
刘凯
郭益平
Original Assignee
深圳市汇顶科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市汇顶科技股份有限公司 filed Critical 深圳市汇顶科技股份有限公司
Priority to CN202110608967.8A priority Critical patent/CN113343829B/zh
Priority to CN201980002381.8A priority patent/CN110770746B/zh
Priority to PCT/CN2019/089123 priority patent/WO2020237546A1/zh
Priority to EP19802026.5A priority patent/EP3770802B1/en
Priority to US16/693,242 priority patent/US11062117B2/en
Priority to CN202080001525.0A priority patent/CN111801685B/zh
Priority to CN202080001544.3A priority patent/CN111788576A/zh
Priority to CN202080001531.6A priority patent/CN111801686A/zh
Priority to CN202020430947.7U priority patent/CN211529177U/zh
Priority to CN202020431083.0U priority patent/CN212135453U/zh
Priority to PCT/CN2020/081872 priority patent/WO2020238382A1/zh
Priority to PCT/CN2020/081867 priority patent/WO2020238381A1/zh
Priority to PCT/CN2020/081873 priority patent/WO2020238383A1/zh
Priority to CN202020430897.2U priority patent/CN211529176U/zh
Priority to CN202020600850.6U priority patent/CN211529180U/zh
Publication of WO2020237546A1 publication Critical patent/WO2020237546A1/zh
Priority to US17/344,066 priority patent/US11663846B2/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1324—Sensors therefor by using geometrical optics, e.g. using prisms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Definitions

  • the embodiments of the present application relate to the field of electronics, and more specifically, to fingerprint identification devices and electronic equipment.
  • the under-screen fingerprint recognition solution refers to attaching the optical or ultrasonic fingerprint recognition module to the bottom of the light-emitting layer of the organic light-emitting diode (Organic Light-Emitting Diode, OLED) screen, that is, regardless of the optical fingerprint recognition module or the ultrasonic fingerprint recognition module
  • OLED Organic Light-Emitting Diode
  • the OLED screen is very costly and fragile, it is easy to damage the OLED screen when the fingerprint recognition module is directly attached to the OLED screen.
  • the fingerprint recognition module and the OLED screen are completely glued together, if the fingerprint recognition module is damaged, it is easy to damage the OLED screen when the fingerprint recognition module is removed.
  • the bonding process for directly bonding the fingerprint recognition module to the OLED screen is also complicated.
  • the embodiments of the present application provide a fingerprint identification device and an electronic device, which can not only reduce the cost and complexity of the electronic device, but also can effectively reduce the thickness of the fingerprint identification device.
  • a fingerprint identification device which is suitable for electronic equipment with a display screen, and the fingerprint identification device includes:
  • a substrate, the upper surface of the substrate is formed with a first groove extending downward, and at least a part of the fingerprint sensor chip is disposed in the first groove and is electrically connected to the substrate;
  • the fingerprint sensor chip is arranged under the display screen through the substrate, and the fingerprint sensor chip is used to receive fingerprint detection signals returned by the reflection or scattering of a human finger above the display screen, and based on all The fingerprint detection signal detects fingerprint information of the finger.
  • Arranging at least one part of the fingerprint sensor chip in the first groove can effectively reduce the thickness of the fingerprint identification device, and the fingerprint sensor chip is arranged on the display screen through the substrate.
  • the use of glue to fix the fingerprint sensor chip and the display screen can be avoided, thereby reducing the cost and complexity of the electronic device.
  • the substrate is fixed to the middle frame of the electronic device.
  • the size of the first groove is larger than the size of the fingerprint sensor chip, so that there is a space between the side wall of the fingerprint sensor chip and the side wall of the first groove for receiving The gap between gold wires, the gold wires being used to electrically connect the fingerprint sensor chip and the substrate.
  • the gap between the side wall of the fingerprint sensor chip and the side wall of the first groove it can not only be used to accommodate the gold wire, but also can be used to accommodate the protective glue of the gold wire, thereby ensuring all The conductivity of the gold wire and the performance of the fingerprint identification device.
  • the depth of the first groove includes the thickness of the cover film of the substrate and the thickness of the conductive layer located under the cover film.
  • the substrate includes at least two conductive layers.
  • the depth of the first groove includes a first conductive layer under the cover film, and the fingerprint sensor chip passes through a conductive via (for example, penetrates through the insulating layer under the first conductive layer).
  • the through hole of the layer is electrically connected to the second conductive layer under the insulating layer, thereby enabling the fingerprint sensor chip to be electrically connected to the substrate.
  • the fingerprint identification device further includes:
  • a bracket the bracket is arranged above the substrate around the fingerprint sensor chip;
  • the first foam layer the first foam layer is disposed above the support, the first foam layer is provided with an opening penetrating the first foam layer, and the fingerprint sensor chip passes through the first foam layer.
  • the opening of a foam layer receives the fingerprint detection signal returned by the reflection or scattering of the finger.
  • the lower surface of the bracket is connected above the substrate by a bracket fixing glue, and the upper surface of the bracket is connected to the first foam layer by a double-sided adhesive.
  • the bracket is a bracket formed by double-sided tape, and is used to connect the substrate and the first foam layer.
  • the side wall of the bracket close to the fingerprint sensor chip is aligned with the side wall of the first groove, so that there is a gold wire between the bracket and the fingerprint sensor chip.
  • the gold wire is used to electrically connect the fingerprint sensor chip and the substrate.
  • the gap between the fingerprint sensor chip and the bracket it can not only be used to accommodate the gold wire, but also can be used to accommodate the protective glue of the gold wire, thereby ensuring the conductivity and conductivity of the gold wire.
  • the performance of the fingerprint identification device is not only be used to accommodate the gold wire, but also can be used to accommodate the protective glue of the gold wire, thereby ensuring the conductivity and conductivity of the gold wire.
  • the thickness of the bracket is 0.05 mm to 0.1 mm.
  • the fingerprint sensor chip is fixed in the first groove by a fingerprint sensor chip fixing glue.
  • the upper surface of the substrate forms a gold finger of the substrate on one side of the first groove.
  • the upper surface of the gold finger of the substrate and the upper surface of the substrate form a first step, and the thickness of the first step includes the thickness of the conductive layer of the substrate under the cover layer .
  • the upper surface of the substrate has a second groove extending downward in the first area, and the upper surface of the substrate forms a second groove in the second area with the upper surface of the gold finger of the substrate.
  • the first area is the area where the gold finger of the substrate is close to the first groove
  • the second area is the area where the gold finger of the substrate is away from the first groove The area where the side is located.
  • the depth of the second groove includes the thickness of the cover layer of the substrate and the thickness of the conductive layer under the cover layer, and the thickness of the second step is the thickness of the cover layer of the substrate.
  • the fingerprint identification device further includes:
  • a flexible circuit board formed with gold fingers of the flexible circuit board
  • An anisotropic conductive adhesive film, and the gold fingers of the flexible circuit board are electrically connected to the gold fingers of the substrate through the anisotropic conductive adhesive film.
  • the electrical connection between the substrate and the flexible circuit board by golden fingers can not only ensure the insulation between the contact sheets, but also ensure the conductivity between the substrate and the flexible circuit board, especially the fingerprint sensor
  • the chip includes multiple chips
  • the multiple chips on the substrate can be quickly and electrically connected to the flexible circuit board through gold fingers, thereby reducing the complexity of installation and the complexity of disassembly.
  • the gold fingers of the substrate and the gold fingers of the flexible circuit board include a plurality of conductive contacts.
  • a conductive protection layer is provided on the plurality of conductive contacts.
  • the lower surface of the flexible circuit board is formed with a third groove extending upward in the third area, and the lower surface of the flexible circuit board is in the second area with the gold finger of the flexible circuit board.
  • a third step is formed on the lower surface of the flexible circuit board, the third area is the area where the golden finger of the flexible circuit board is located away from the first groove, and the second area is the golden finger of the flexible circuit board An area close to the side of the first groove.
  • the gold finger of the flexible circuit board is located at one end of the flexible circuit board.
  • the gold finger of the flexible circuit board is located in the middle of the flexible circuit board, one end of the flexible circuit board is formed with an opening penetrating the flexible circuit board, and the flexible circuit board The opening is aligned with the opening of the first groove, so that the fingerprint sensor chip is disposed in the opening of the flexible circuit board.
  • the side wall of the flexible circuit board close to the fingerprint sensor chip is aligned with the side wall of the first groove, so that there is a function between the flexible circuit board and the fingerprint sensor chip.
  • the gold wire is used to electrically connect the fingerprint sensor chip and the substrate.
  • the flexible circuit board and the fingerprint sensor chip Through the gap between the flexible circuit board and the fingerprint sensor chip, it can be used not only to accommodate the gold wire, but also to accommodate the protective glue of the gold wire, thereby ensuring the conductivity of the gold wire And the performance of the fingerprint identification device.
  • the substrate is a rigid board part of a rigid-flex board.
  • the depth of the first groove includes the thickness of the cover film of the substrate and the thickness of at least two conductive layers under the cover film.
  • the fingerprint identification device further includes:
  • the fingerprint sensor chip is electrically connected to the substrate through the gold wire;
  • the gold wire protective glue is used to encapsulate the gold wire.
  • the arc height or package height of the gold wire is less than 150um.
  • the fingerprint identification device further includes:
  • An optical path layer is disposed above the fingerprint sensor chip, and the optical path layer is used to transmit fingerprint detection signals returned by reflection or scattering of the finger to the fingerprint sensor chip.
  • the light path layer includes a microlens layer and a light blocking layer
  • the microlens layer has a microlens array formed by a plurality of microlenses
  • the light blocking layer has a plurality of microholes and is provided with Under the micro lens layer, and the micro holes correspond to the micro lenses one to one.
  • the optical path layer further includes a filter, which is arranged above the microlens layer or in the optical path between the microlens layer and the fingerprint sensor chip .
  • the fingerprint sensor chip includes a plurality of optical fingerprint sensor chips, and the plurality of optical fingerprint sensor chips are arranged side by side in the first groove to form an optical fingerprint sensor chip assembly.
  • the fingerprint identification device further includes:
  • the image processor is electrically connected to the substrate.
  • the fingerprint identification device further includes:
  • At least one capacitor the at least one capacitor is electrically connected to the substrate, and the at least one capacitor is used to optimize the fingerprint detection signal collected by the fingerprint sensor chip.
  • the fingerprint identification device further includes:
  • the connector is electrically connected to the substrate, and the connector is used for connection with an external device or other components of the electronic device.
  • the distance between the lower surface of the light-emitting layer of the display screen and the upper surface of the fingerprint sensor chip is less than 600um.
  • the thickness of the substrate ranges from 0.1 mm to 0.4 mm.
  • a second foam layer is provided below the display screen, the second foam layer is provided with an opening penetrating the second foam layer, and the fingerprint sensor chip is provided on the second foam layer Below the opening.
  • the middle frame of the electronic device is provided with a fourth groove, and at least a part of the substrate is provided in the fourth groove.
  • an electronic device including:
  • the fingerprint identification device is arranged below the display screen.
  • the fingerprint identification device is the fingerprint identification device described in the first aspect or any possible implementation of the first aspect, and its fingerprint collection area is at least partially located In the display area of the display screen.
  • the electronic device further includes:
  • the second foam layer, the second foam layer is arranged below the display screen, the second foam layer is provided with an opening penetrating the second foam layer, and the fingerprint sensor chip is arranged on Below the opening of the second foam layer.
  • the electronic device further includes:
  • the middle frame is provided with a fourth groove, and at least a part of the fingerprint identification device is arranged in the fourth groove.
  • the fingerprint identification device and the electronic device of the embodiments of the present application can not only reduce the cost and complexity of the electronic device, but also can effectively reduce the thickness of the fingerprint identification device.
  • Figure 1 is a schematic plan view of an electronic device to which this application can be applied.
  • Fig. 2 is a schematic side sectional view of the electronic device shown in Fig. 1.
  • Fig. 3 is a schematic structural diagram of an electronic device with a fingerprint identification module according to an embodiment of the present application.
  • 4 to 7 are schematic structural diagrams of a fingerprint identification module according to an embodiment of the present application.
  • portable or mobile computing devices such as smartphones, notebook computers, tablet computers, and gaming devices, as well as other electronic devices such as electronic databases, automobiles, and bank automated teller machines (ATM).
  • ATM bank automated teller machines
  • the embodiments of the present application are not limited thereto.
  • biometric recognition technology includes but is not limited to fingerprint recognition, palmprint recognition, iris recognition, face recognition, and living body recognition.
  • fingerprint recognition technology includes but is not limited to fingerprint recognition, palmprint recognition, iris recognition, face recognition, and living body recognition.
  • fingerprint recognition technology uses fingerprint recognition technology as an example.
  • the under-screen fingerprint recognition technology refers to the installation of the fingerprint recognition module below the display screen, so as to realize the fingerprint recognition operation in the display area of the display screen. There is no need to set a fingerprint collection area on the front of the electronic device except for the display area.
  • the fingerprint recognition module uses the light returned from the top surface of the display assembly of the electronic device to perform fingerprint sensing and other sensing operations. This returned light carries information about objects (such as fingers) that are in contact with or close to the top surface of the display assembly.
  • the fingerprint recognition module located under the display assembly collects and detects this returned light to realize fingerprint recognition under the screen.
  • the design of the fingerprint recognition module can be to realize the desired optical imaging by appropriately configuring the optical elements for collecting and detecting the returned light, so as to detect the fingerprint information of the finger.
  • in-display fingerprint recognition technology refers to the installation of fingerprint recognition modules or part of fingerprint recognition modules inside the display screen, so as to realize fingerprint recognition operations in the display area of the display screen without the need for electronic
  • the fingerprint collection area is set on the front of the device except the display area.
  • FIG. 1 and 2 show schematic diagrams of an electronic device 100 to which under-screen fingerprint recognition technology can be applied.
  • FIG. 1 is a front schematic diagram of the electronic device 100
  • FIG. 2 is a partial cross-sectional structure diagram of the electronic device 100 shown in FIG.
  • the electronic device 100 may include a display screen 120 and a fingerprint recognition module 140.
  • the display screen 120 may be a self-luminous display, which uses a self-luminous display unit as display pixels.
  • the display screen 120 may be an Organic Light-Emitting Diode (OLED) display screen or a Micro-LED (Micro-LED) display screen.
  • the display screen 120 may also be a liquid crystal display (LCD) or other passive light-emitting display, which is not limited in the embodiment of the present application.
  • the display screen 120 may also be specifically a touch display screen, which can not only perform screen display, but also detect a user's touch or pressing operation, thereby providing a user with a human-computer interaction interface.
  • the electronic device 100 may include a touch sensor, and the touch sensor may specifically be a touch panel (TP), which may be provided on the surface of the display screen 120, or may be partially integrated or The whole is integrated into the display screen 120 to form the touch display screen.
  • TP touch panel
  • the fingerprint recognition module 140 may be an optical fingerprint recognition module, such as an optical fingerprint sensor.
  • the fingerprint identification module 140 may include a sensor chip with an optical sensing array (hereinafter also referred to as an optical fingerprint sensor).
  • the optical sensing array includes multiple optical sensing units, and each optical sensing unit may specifically include a photodetector or a photoelectric sensor.
  • the fingerprint identification module 140 may include a photodetector array (or called a photodetector array, a photodetector array), which includes a plurality of photodetectors distributed in an array.
  • the fingerprint recognition module 140 may be arranged in a partial area below the display screen 120, so that the fingerprint collection area (or detection area) 130 of the fingerprint recognition module 140 is at least partially located on the display screen 120. ⁇ display area 102.
  • the fingerprint identification module 140 can also be arranged in other positions, such as the side of the display screen 120 or the non-transparent area of the edge of the electronic device 100.
  • the optical signal of at least part of the display area of the display screen 120 can be guided to the fingerprint recognition module 140 through the optical path design, so that the fingerprint collection area 130 is actually located in the display area of the display screen 120 .
  • the fingerprint recognition module 140 may include only one sensor chip. At this time, the fingerprint collection area 130 of the fingerprint recognition module 140 has a small area and a fixed position. Therefore, the user needs to input the fingerprint The finger is pressed to a specific position of the fingerprint collection area 130, otherwise the fingerprint recognition module 140 may not be able to collect the fingerprint image, resulting in poor user experience.
  • the fingerprint identification module 140 may specifically include a plurality of sensor chips; the plurality of sensor chips may be arranged side by side under the display screen 120 in a splicing manner, and the plurality of sensors The sensing area of the chip together constitutes the fingerprint collection area 130 of the fingerprint identification module 140.
  • the fingerprint collection area 130 of the fingerprint identification module 140 may include multiple sub-areas, and each sub-area corresponds to the sensing area of one of the sensor chips, so that the fingerprint collection area of the optical fingerprint module 130 130 can be extended to the main area of the lower half of the display screen, that is, to the area where the finger is habitually pressed, so as to realize the blind fingerprint input operation.
  • the fingerprint detection area 130 can also be extended to half of the display area or even the entire display area, thereby realizing half-screen or full-screen fingerprint detection.
  • the multiple sensor chips may be individually packaged sensor chips, or multiple chips (Die) packaged in the same chip package.
  • the multiple sensor chips can also be fabricated on different regions of the same chip by a semiconductor process.
  • the area or light sensing range of the optical sensing array of the fingerprint identification module 140 corresponds to the fingerprint collection area 130 of the fingerprint identification module 140.
  • the fingerprint collection area 130 of the fingerprint recognition module 140 may be equal to or not equal to the area or the light sensing range of the optical sensing array of the fingerprint recognition module 140, which is not specifically limited in the embodiment of the present application.
  • the fingerprint collection area 130 of the fingerprint identification module 140 can be designed to be substantially the same as the area of the sensing array of the fingerprint identification module 140.
  • the design of the light path for converging light or the design of the light path for reflecting light through a macro lens can make the fingerprint collection area 130 of the fingerprint recognition module 140 larger than the area of the fingerprint recognition module 140 sensing array.
  • the optical path design of the fingerprint identification module 140 is exemplified below.
  • the optical collimator may be specifically a collimator layer made on a semiconductor silicon wafer. , It has a plurality of collimating units or micro-holes.
  • the collimating unit may be specifically a small hole.
  • the reflected light reflected from the finger the light that is perpendicularly incident on the collimating unit can pass through and be
  • the sensor chip receives the light whose incident angle is too large and is attenuated by multiple reflections inside the collimating unit. Therefore, each sensor chip can basically only receive the reflected light reflected by the fingerprint pattern directly above it, which can effectively Improve the image resolution, thereby improving the fingerprint recognition effect.
  • a collimating unit may be configured for one optical sensing unit in the optical sensing array of each sensor chip, and the collimating unit may be attached to the corresponding optical sensing unit.
  • the multiple optical sensing units can also share one collimating unit, that is, the one collimating unit has an aperture large enough to cover the multiple optical sensing units. Since one collimating unit can correspond to multiple optical sensing units, the correspondence between the spatial period of the display screen 120 and the spatial period of the sensor chip is destroyed.
  • the spatial structure of the light-emitting display array of the display screen 120 and the optical sensing of the sensor chip is similar, which can effectively prevent the fingerprint identification module 140 from using the light signal passing through the display screen 120 to perform fingerprint imaging to generate moiré fringes, which effectively improves the fingerprint identification effect of the fingerprint identification module 140.
  • the optical lens may include an optical lens (Lens) layer, which has one or more lens units, such as one or more aspheric lenses.
  • the lens group is used to converge the reflected light reflected from the finger to the sensing array of the sensor chip below it, so that the sensing array can perform imaging based on the reflected light, thereby obtaining a fingerprint image of the finger.
  • the optical lens layer may also be formed with a pinhole or a micro-aperture in the optical path of the lens unit, for example, one or more light-shielding sheets may be formed in the light path of the lens unit, of which at least one light-shielding sheet A light-transmitting micro-hole may be formed in the optical axis or optical center area of the lens unit, and the light-transmitting micro-hole may be used as the aforementioned pinhole or micro-aperture.
  • the pinhole or micro-aperture diaphragm can cooperate with the optical lens layer and/or other optical film layers above the optical lens layer to expand the field of view of the fingerprint recognition module 140 to improve the fingerprint recognition module 140 Fingerprint imaging effect.
  • one optical lens can be configured for each sensor chip to perform fingerprint imaging, or multiple sensor chips can be configured with one optical lens to achieve light convergence and fingerprint imaging. Even when a sensor chip has two sensing arrays (Dual Array) or multiple sensing arrays (Multi-Array), the sensor chip can also be equipped with two or more optical lenses to cooperate with the two sensing arrays or Multiple sensing arrays perform optical imaging, thereby reducing the imaging distance and enhancing the imaging effect.
  • the micro-lens layer may have a micro-lens array formed by a plurality of micro-lenses, which may be obtained through a semiconductor growth process or other The process is formed above the sensing array of the sensor chip, and each microlens can correspond to one of the sensing units of the sensing array.
  • Other optical film layers may be formed between the microlens layer and the sensing unit, such as a dielectric layer or a passivation layer.
  • the microlens layer and the sensing unit may also include multiple The light-blocking layer of the micro-hole, wherein the micro-hole is formed between the corresponding micro-lens and the sensing unit, and the light-blocking layer can block the optical interference between the adjacent micro-lens and the sensing unit, and allow light to pass through all
  • the micro-lens is converged into the micro-hole and is transmitted to the sensing unit corresponding to the micro-lens through the micro-hole to perform optical fingerprint imaging.
  • an optical filter may be provided above the microlens layer or in the optical path between the microlens layer and the sensor chip (hereinafter also referred to as an optical fingerprint sensor).
  • the filter may be disposed above the microlens layer.
  • the filter may be connected to the microlens layer through a buffer layer, and the buffer layer may be a transparent medium layer. , Can be used to fill the surface of the micro lens layer,
  • the filter may be fixed above the microlens layer by a fixing device, for example, a sealant or other support is provided in the non-photosensitive area around the microlens layer to support and fix the filter.
  • a fixing device for example, a sealant or other support is provided in the non-photosensitive area around the microlens layer to support and fix the filter.
  • the filter may also be arranged in the optical path between the microlens layer and the sensor chip, for example, the filter may be arranged above the sensor chip, Specifically, the filter can be fixed above the sensor chip by a fixing device, for example, a sealant or other support is provided in the non-photosensitive area of the sensor chip to support and fix the filter. In an evaporation process or a sputtering process, coating is performed on the sensor chip to form the filter, that is, the filter is integrated with the sensor chip. It can be understood that the filter can also be coated on other optical film layers, which is not limited here.
  • a micro lens layer can be further provided under the collimator layer or the optical lens layer.
  • the collimator layer or the optical lens layer is used in combination with the micro lens layer, its specific laminated structure or optical path may need to be adjusted according to actual needs.
  • the fingerprint identification module 140 can be used to collect user fingerprint information (such as fingerprint image information).
  • the display screen 120 can adopt a display screen with a self-luminous display unit, such as an organic light-emitting diode (Organic Light-Emitting Diode, OLED) display or a micro-LED (Micro-LED) display Screen.
  • the fingerprint recognition module 140 can use the display unit (ie, the OLED light source) of the OLED display screen located in the fingerprint collection area 130 as the excitation light source for optical fingerprint detection.
  • the display screen 120 When a finger touches, presses, or approaches (for ease of description, collectively referred to as pressing in this application) in the fingerprint collection area 130, the display screen 120 emits a beam of light to the finger above the fingerprint collection area 130. The surface is reflected to form reflected light or is scattered inside the finger to form scattered light. In related patent applications, for ease of description, the above-mentioned reflected light and scattered light are collectively referred to as reflected light. Because the ridge and valley of the fingerprint have different light reflection capabilities, the reflected light from the fingerprint ridge and the fingerprint ridge have different light intensities. After the reflected light passes through the display screen 120, it is affected by the fingerprint.
  • the sensor chip in the identification module 140 receives and converts it into a corresponding electrical signal, that is, a fingerprint detection signal; fingerprint image data can be obtained based on the fingerprint detection signal, and fingerprint matching verification can be further performed, so that the electronic device 100 realizes the optical fingerprint recognition function.
  • the electronic device 100 adopting the above structure does not need to reserve a special space on the front of the fingerprint button (such as the Home button), so a full screen solution can be adopted. Therefore, the display area 102 of the display screen 120 can be substantially extended to the entire front surface of the electronic device 100.
  • the fingerprint identification module 140 may also use a built-in light source or an external light source to provide an optical signal for fingerprint detection and identification.
  • the fingerprint identification module 140 can be applied not only to self-luminous displays such as OLED displays, but also to non-self-luminous displays, such as liquid crystal displays or other passive light-emitting displays.
  • the optical fingerprint system of the electronic device 100 may also include an excitation light source for optical fingerprint detection.
  • the light source may specifically be an infrared light source or a light source of non-visible light of a specific wavelength, which may be arranged under the backlight module of the liquid crystal display or in the edge area under the protective cover of the electronic device 100, and the fingerprint recognition module 140 may
  • the liquid crystal panel or the protective cover is arranged under the edge area and guided by the light path so that the fingerprint detection light can reach the fingerprint identification module 140; or, the fingerprint identification module 140 can also be arranged under the backlight module, and
  • the backlight module is designed to allow the fingerprint detection light to pass through the liquid crystal panel and the backlight module and reach the fingerprint recognition module 140 by opening holes or other optical designs on the film layers such as the diffusion sheet, the brightness enhancement sheet, and the reflection sheet.
  • the fingerprint identification module 140 adopts a built-in light source or
  • the electronic device 100 may further include a protective cover 110.
  • the cover 110 may be specifically a transparent cover, such as a glass cover or a sapphire cover, which is located above the display screen 120 and covers the front of the electronic device 100, and the surface of the cover 110 may also be provided with a protective layer. Therefore, in the embodiment of the present application, the so-called finger pressing the display screen 120 may actually refer to the finger pressing the cover 110 above the display 120 or covering the surface of the protective layer of the cover 110.
  • a circuit board 150 such as a flexible printed circuit (FPC) (Flexible Printed Circuit, FPC), may also be provided under the fingerprint identification module 140.
  • FPC Flexible Printed Circuit
  • the fingerprint recognition module 140 can be soldered to the circuit board 150 through pads, and realize electrical interconnection and signal transmission with other peripheral circuits or other components of the electronic device 100 through the circuit board 150.
  • the fingerprint recognition module 140 can receive the control signal of the processing unit of the electronic device 100 through the circuit board 150, and can also output the fingerprint detection signal from the fingerprint recognition module 140 to the processing unit of the electronic device 100 through the circuit board 150. Control unit, etc.
  • Fig. 3 is a schematic structural diagram of an electronic device with a fingerprint identification device according to an embodiment of the present application.
  • the electronic device 200 may include a display screen 210, a second foam layer 220, a fingerprint identification device 230, a middle frame 240, a battery fixing glue 250 and a battery 260.
  • the display screen 210 may be the display screen shown in FIG. 1 and FIG. 2, and the related description can refer to the foregoing description about the display screen 120.
  • the fingerprint identification device 230 may be the fingerprint identification module shown in FIG. 1 and FIG. 2, and its related functions can refer to the related description of the fingerprint identification module 140 mentioned above, which is not repeated here.
  • the display screen 210 and the second foam layer 220 may also be collectively referred to as a display screen, and the display screen 210 may also be referred to as a light-emitting layer of the display screen. This is not specifically limited.
  • the upper surface of the middle frame 240 extends downward to form a fourth groove, that is, the middle frame 240 is provided with a fourth groove, and at least a part of the fingerprint identification device 230 is arranged in the In the groove of the middle frame 240.
  • the second foam layer 220 may be provided with an opening passing through the second foam layer 220, and at least a part of the fingerprint identification device 230 is provided in the opening of the second foam layer 220.
  • the lower surface of the fingerprint identification device 230 may be attached to the lower surface of the display screen 210, and the upper surface of the fingerprint identification device 230 may be attached to the bottom of the groove of the middle frame 240, and
  • the upper surface and the lower surface of the fingerprint identification device 230 may be attached to the lower surface of the display screen 210 and the bottom of the groove of the middle frame 240, respectively.
  • the display screen 210 is very costly and fragile, it is easy to damage the display screen 210 when the fingerprint identification module 230 is directly attached to the display screen 210.
  • the fingerprint identification module 230 and the display screen 210 are completely glued together, if the fingerprint identification module 230 is damaged, the display screen 210 is easily damaged when the fingerprint identification module 230 is removed.
  • the bonding process of directly bonding the fingerprint identification module 230 to the display screen 210 is also complicated. Due to the above problems, the cost and complexity of the electronic device 100 are greatly increased, and the maintainability is low.
  • the present application provides a fingerprint identification device, which can reduce the cost and complexity of the electronic device 200 and improve maintainability.
  • the fingerprint identification device 230 of the embodiment of the present application will be described in detail below in conjunction with FIGS. 4 to 7.
  • the fingerprint recognition device 230 may include a fingerprint sensor chip 233 and a substrate 231.
  • the upper surface of the substrate 231 extends downward to form a first groove 2311, and at least a part of the fingerprint sensor chip 233 is disposed in Inside the first groove 2311 and electrically connected to the substrate 231; for example, the lower surface of the fingerprint sensor chip 233 is fixedly connected to the bottom of the first groove 2311, and is electrically connected through the gold wire 235 Connected to the substrate 231.
  • the fingerprint sensor chip 233 is disposed under the display screen 210 through the substrate 231, and the fingerprint sensor chip 233 is used to receive fingerprint detection returned by the reflection or scattering of a human finger above the display screen 210. Signal, and detect fingerprint information of the finger based on the fingerprint detection signal.
  • the thickness of the fingerprint identification device 230 can be effectively reduced, and the fingerprint sensor chip 233 can be arranged through the substrate 231 Below the display screen 210, the use of glue to fix the fingerprint sensor chip 233 and the display screen 210 can be avoided, thereby reducing the cost and complexity of the electronic device 200.
  • the substrate 231 is fixed to the middle frame 240 of the electronic device.
  • the fingerprint sensor chip 233 may include multiple chips or one chip.
  • the fingerprint sensor chip 233 may include multiple optical fingerprint sensor chips, and the multiple optical fingerprint sensor chips are arranged side by side.
  • the first groove is spliced into an optical fingerprint sensor chip assembly.
  • the optical fingerprint sensor chip assembly can be used to obtain multiple fingerprint images at the same time, and the multiple fingerprint images can be used as one fingerprint image for fingerprint recognition after being spliced.
  • the fingerprint sensor chip 233 may be a sensor chip with an optical sensing array 2331 (hereinafter also referred to as an optical fingerprint sensor).
  • the optical sensing array 2331 may include multiple optical sensing units, and each optical sensing unit may specifically include a photodetector or a photoelectric sensor.
  • the fingerprint sensor chip 233 may include a photodetector array (or called a photodetector array or a photodetector array), which includes a plurality of photodetectors distributed in an array.
  • the size of the first groove 2311 may be larger than the size of the fingerprint sensor chip 233, so that there is a gap between the side wall of the fingerprint sensor chip 233 and the side wall of the first groove 2311 A gap for accommodating the gold wire 235, which is used to electrically connect the fingerprint sensor chip 233 and the substrate 231.
  • the size of the first groove 2311 is larger than the size of the fingerprint sensor chip 233, which can also reduce the installation complexity and disassembly complexity of the fingerprint sensor chip 233.
  • the depth of the first groove 2311 may include the thickness of the cover film of the substrate 231 and the thickness of the conductive layer located under the cover film.
  • the cover film of the substrate 231 may be an insulating layer for protecting and insulating the conductive layer under the cover film.
  • the conductive layer located under the cover film is the circuit layer or wiring layer of the substrate 231, and the fingerprint sensor chip 233 can be electrically connected to external devices through the circuit layer or wiring layer of the substrate.
  • the substrate 231 may include at least two conductive layers.
  • the depth of the first groove 2311 includes the first conductive layer under the cover film of the substrate 231, and the fingerprint sensor chip 233 can pass through Conductive vias (for example, vias that penetrate the insulating layer under the first conductive layer) are electrically connected to the second conductive layer under the insulating layer, thereby enabling the fingerprint sensor chip 233 to be electrically connected to all The substrate 231.
  • the fingerprint sensor chip 233 may be fixed in the first groove 2311 by the fingerprint sensor chip 233 fixing glue 232.
  • the fingerprint sensor chip 233 may also be fixedly connected to the side wall of the first groove 2311, or may be fixed in the first groove 2311 by other means, for example, the fingerprint sensor chip 233 may be fixed by a buckle or a screw.
  • the fingerprint sensor chip 233 is fixed in the first groove 2311, which is not specifically limited in this embodiment.
  • the bottom surface of the substrate 231 may also be provided with a double-sided tape 2313 to stick the substrate 239 on the bottom of the groove of the middle frame 240 of the electronic device 200.
  • the base plate 231 may also be fixedly connected to the side wall of the groove of the middle frame 240, or the base plate 231 may also be fixedly arranged on the middle frame 240 by other means (such as buckles or screws).
  • the embodiment of the application does not specifically limit this in the groove.
  • the upper surface of the substrate 231 may form the gold finger 2312 of the substrate 231 on one side of the first groove 2311.
  • the upper surface of the substrate 231 may form a convex structure of the conductive layer of the substrate 231 on one side of the first groove 2311 to form the gold finger 2312 of the substrate 231.
  • the present application does not limit the specific structure of the gold finger 2312 of the substrate 231.
  • the upper surface of the substrate 231 is formed with a second groove extending downward in the first area, and the upper surface of the substrate 231 is in the second area with the gold finger of the substrate 231.
  • a second step is formed on the upper surface, the first area is the area where the gold finger of the substrate 231 is located near the side of the first groove 2311, and the second area is the gold finger of the substrate 231 far away from the The area where one side of the first groove 2311 is located.
  • the depth of the second groove may include the thickness of the covering layer of the substrate 231 and the conductive layer under the covering layer, and the thickness of the first step is the thickness of the substrate 231 under the covering layer.
  • the thickness of the conductive layer of the substrate 231 is such that part of the conductive layer of the substrate 231 forms a convex structure with a convex surface upward, thereby forming the gold finger 2312 of the substrate 231.
  • the fingerprint identification device 230 may also include a flexible circuit board 239 and an anisotropic conductive adhesive film 241.
  • the flexible circuit board 239 is formed with gold fingers 2391 of the flexible circuit board 239; the gold fingers 2391 of the flexible circuit board 239 are electrically connected to the gold fingers of the substrate 231 through the anisotropic conductive adhesive film 241. Finger 2312.
  • the golden finger 2391 of the flexible circuit board 239 may be located at one end of the flexible circuit board 239. That is, one end of the flexible circuit board 239 may be electrically connected to one end of the substrate 231 by pressing the anisotropic conductive adhesive film 241.
  • Electrically connecting the substrate 231 and the flexible circuit board 239 through gold fingers can not only ensure the insulation between the contacts, but also ensure the conductivity between the substrate 231 and the flexible circuit board 239, especially When the fingerprint sensor chip 233 includes multiple chips, the multiple chips on the substrate 231 can be quickly and electrically connected to the flexible circuit board 239 through gold fingers, thereby reducing the complexity of installation and the complexity of disassembly.
  • the present application does not limit the specific structure of the golden finger 2391 of the flexible circuit board 239.
  • the lower surface of the flexible circuit board 239 may be formed with a third groove extending upward in the third area, and the lower surface of the flexible circuit board 239 may be in contact with the flexible circuit board in the second area.
  • the lower surface of the gold finger of the circuit board 239 forms a third step.
  • the third area is the area where the gold finger 2391 of the flexible circuit board 239 is located away from the first groove 2311.
  • the second area This is the area where the golden finger 2391 of the flexible circuit board 239 is located near the side of the first groove 2311.
  • the fingerprint identification device 230 may also include a protective glue 238 of an anisotropic conductive adhesive film 241, and the protective glue 238 may be located at both ends of the anisotropic conductive adhesive film 241 to protect the The anisotropic conductive adhesive film 241 further protects the gold fingers 2391 of the substrate 231 and the gold fingers 2391 of the flexible circuit board 239.
  • the fingerprint identification device 230 may also include a bracket 236 and a first foam layer 245, the first foam layer 245 is disposed above the bracket 236, the first foam layer 236 An opening penetrating the first foam layer 236 is provided, and the fingerprint sensor chip 233 can receive a fingerprint detection signal returned by the reflection or scattering of the finger through the opening of the first foam layer 245.
  • the first foam layer 245 may be the foam layer of the fingerprint identification device 230, or the foam layer of the electronic device 200 located between the display screen 210 and the middle frame 240.
  • the cotton layer is not specifically limited in this application.
  • the first foam layer 245 when the first foam layer 245 is the foam layer of the fingerprint identification device 230, the first foam layer 245 may directly contact the display screen 240, and further enable the The first foam layer 245 is in a compressed state; when the first foam layer 345 is the foam layer of the electronic device 200 between the display screen 210 and the middle frame 240, the fingerprint identification device 230 is described The lower surface of the second foam layer 220 directly attached to the bottom of the display screen 210.
  • bracket 236 can be formed of any material that can be used to fix the substrate 231 and the first foam layer 245.
  • the bracket 236 may be a bracket formed of double-sided tape.
  • the side wall of the bracket 236 close to the fingerprint sensor chip 233 can be aligned with the side wall of the first groove 2311, so that there is a function between the bracket 236 and the fingerprint sensor chip 233. To accommodate the gap of the gold wire 235.
  • the gap between the bracket 236 and the fingerprint sensor chip 233 can not only be used to accommodate the gold wire 235, but also can be used to accommodate the protective glue 237 of the gold wire, thereby ensuring that the gold wire 235
  • the conductivity and performance of the fingerprint identification device 230 may also be fixed under the display screen 210 through the flexible circuit board 239, so that the fingerprint sensor chip 233 is fixed under the display screen 210.
  • the fingerprint identification device may further include a gold wire protective glue 237, and the gold wire protective glue 237 is used to encapsulate and protect the gold wire 235.
  • the arc height or package height of the gold wire 235 is less than a certain threshold, for example, the arc height or package height of the gold wire is less than 150um.
  • the arc height or package height of the gold wire may be less than 70um.
  • the space used to accommodate the gold wire 235 may also be used to accommodate the gold wire protective glue 237.
  • the space for accommodating the gold wire protective glue 237 includes but is not limited to the gap formed between the side wall of the fingerprint sensor chip 233 and the side wall of the first groove 2311, the fingerprint sensor The gap formed between the chip 233 and the bracket 236, and the gap formed between the fingerprint sensor chip 233 and the first foam layer 245.
  • the fingerprint identification device 230 may further include an optical path layer 234 for transmitting the fingerprint detection signal returned by the reflection or scattering of the finger to the fingerprint sensor chip 233.
  • the optical path layer 234 is arranged above the fingerprint sensor chip 233 and can be used to implement the optical path design.
  • the optical path design of the fingerprint identification device 230 can refer to the optical path design of the fingerprint identification module 140, which will not be repeated here, and only the microlens layer is selected.
  • the optical path design is taken as an example.
  • the light path layer 234 includes a micro lens layer and a light blocking layer.
  • the micro lens layer may have a micro lens array formed by a plurality of micro lenses, and the light blocking layer has a plurality of micro lenses.
  • the optical path layer may further include other optical film layers.
  • other optical film layers such as a dielectric layer or a passivation layer, may be formed between the microlens layer and the fingerprint sensor chip 233.
  • the optical path layer 234 may further include a filter, and the filter is disposed above the microlens layer or in the optical path between the microlens layer and the sensor chip 233, specifically Refer to the foregoing content and will not be repeated here.
  • the optical filter is used to reduce undesired ambient light in fingerprint sensing, so as to improve the optical sensing of the fingerprint sensor chip 233 to the received light.
  • the filter can specifically be used to filter out light of a specific wavelength, for example, near-infrared light and part of red light. For example, human fingers absorb most of the energy of light with a wavelength below 580nm. If one or more optical filters or optical filter layers are designed to filter light with wavelengths from 580nm to infrared, it can greatly reduce the impact of ambient light on fingerprints. The influence of optical detection in induction.
  • the filter may include one or more optical filters, and the one or more optical filters may be configured as, for example, a band-pass filter to allow transmission of light emitted by the OLED screen while blocking infrared light in sunlight. And other light components.
  • the fingerprint identification device 230 is used outdoors, this kind of optical filtering can effectively reduce the background light caused by sunlight.
  • One or more optical filters may be implemented as, for example, an optical filter coating formed on one or more continuous interfaces, or may be implemented as one or more discrete interfaces. It should be understood that the optical filter can be fabricated on the surface of any optical film layer in the optical path layer 234, or along the optical path from the reflected light formed by finger reflection to the fingerprint sensor chip 233. The embodiment does not specifically limit this.
  • the light entrance surface of the filter may be provided with an optical inorganic coating or an organic blackened coating, so that the reflectance of the light entrance surface of the filter is lower than a first threshold, for example, 1%, so as to ensure that the The fingerprint sensor chip 233 can receive enough light signals to improve the fingerprint recognition effect.
  • a first threshold for example, 1%
  • the optical filter fixed on the upper surface of the fingerprint sensor chip 233 by a fixing device Take the optical filter fixed on the upper surface of the fingerprint sensor chip 233 by a fixing device as an example.
  • the filter and the fingerprint sensor chip 233 can be glued and fixed in the non-sensitivity area of the fingerprint sensor chip 233, and there is a gap between the filter and the photosensitive area of the fingerprint sensor chip 233.
  • the lower surface of the filter is fixed to the upper surface of the fingerprint sensor chip 233 by glue with a refractive index lower than a preset refractive index.
  • the preset refractive index includes but is not limited to 1.3.
  • a filter such as a white glass substrate or the like will not only avoid the Newton ring phenomenon, thereby improving the fingerprint recognition effect, but also effectively reduce the thickness of the fingerprint recognition device 230.
  • the fingerprint identification device may further include an image processor 244, and the image processor 244 is electrically connected to the substrate 231.
  • the image processor is disposed on the flexible circuit board 239 and is electrically connected to the substrate 231 through the flexible circuit board 239.
  • the image processor 244 may be a microprocessor (Micro Processing Unit, MCU) for receiving fingerprint detection signals (for example, fingerprint images) sent from the fingerprint sensor chip 233 through the flexible circuit board 239, and responding to the The fingerprint detection signal is simply processed.
  • MCU Micro Processing Unit
  • the fingerprint identification device may further include at least one capacitor 243, the at least one capacitor 243 is electrically connected to the substrate 231, the at least one capacitor 243 is used to optimize the fingerprint sensor chip 233 collection Fingerprint detection signal.
  • the at least one capacitor 243 is disposed on the flexible circuit board 239, and is electrically connected to the substrate 231 through the flexible circuit board 239, and then to the fingerprint sensor chip 233.
  • the at least one capacitor 243 can be used to optimize the fingerprint detection signal collected by the fingerprint sensor chip 233.
  • the at least one capacitor 243 is used to filter the fingerprint detection signal collected by the fingerprint sensor chip 233.
  • the fingerprint sensor chip 233 may correspond to one or more capacitors.
  • each of the fingerprint sensor chips 233 corresponds to one or more capacitors.
  • the fingerprint identification device may also be a connector 242 which is electrically connected to the substrate 231, for example, the connector 242 may be electrically connected to the substrate through the flexible circuit board 239 231.
  • the connector 242 may be used to connect with an external device or other components of the electronic device, so as to realize communication with the external device or other components of the electronic device.
  • the connector 242 may be used to connect the processor of the electronic device, so that the processor of the electronic device receives the fingerprint detection signal processed by the image processor 244, and based on the processed signal Fingerprint detection signal for fingerprint identification.
  • FIG. 4 is only an example of this application and should not be construed as a limitation to this application.
  • the fingerprint sensor chip 233 may be provided with a through silicon via (TSV) and/or a redistribution layer (RDL), and the TSV and/or RDL are used To guide the pins of the fingerprint sensor chip 233 from the upper surface to the lower surface.
  • TSV through silicon via
  • RDL redistribution layer
  • a wiring layer may be formed on the lower surface of the fingerprint sensor chip 233.
  • the wiring layer on the lower surface of the fingerprint sensor chip 233 can be electrically connected to the wiring layer in the first groove 2311 of the substrate 231 through a gold wire 235.
  • the outer wall of the fingerprint sensor chip 233 can be pasted Fitted on the sidewall of the first groove 2311, a gap for accommodating the gold wire 235 may be provided between the lower surface of the fingerprint sensor chip 233 and the bottom of the first groove 2311. Further, the fingerprint sensor chip 233 may also form a protective layer on the surface of the wiring layer to protect and insulate the fingerprint sensor chip 233.
  • the bracket 236 may be a bracket formed of a material with adhesive properties, for example, the bracket 236 may be a bracket formed of double-sided tape, but the embodiment of the present application is not limited thereto.
  • the bracket 236 may also be a bracket formed of a material that does not have adhesive properties.
  • the material of the bracket 236 includes but is not limited to metal, resin, glass fiber composite board, etc. In this case, the bracket 236 needs to be fixed to the Between the foam layer 245 and the substrate 231.
  • Fig. 5 is a modified structure of the fingerprint identification device shown in Fig. 4.
  • the bracket 236 can be used as an independent component, that is, in addition to the bracket 236, the fingerprint identification device 230 may also include a double-sided adhesive 247 and a bracket fixing glue 246, wherein the lower part of the bracket 236 The surface is connected above the substrate 231 by a bracket fixing glue 246, and the upper surface of the bracket 236 is connected to the first foam layer 245 by a double-sided adhesive 247.
  • the bracket 236 and the bracket fixing glue 246 may also be an integral structure, and the integral structure serves as a bracket.
  • the bracket may be a bracket formed by a single-sided adhesive.
  • the substrate 231 is connected, and the upper surface of the bracket is connected to the first foam layer 245 by a double-sided tape 247.
  • the golden finger 2391 of the flexible circuit board 239 may be located at one end of the flexible circuit board 239, but the embodiment of the present application is not limited thereto.
  • the golden finger 2391 of the flexible circuit board 239 is located in the middle position of the flexible circuit board 239, or the golden finger 2391 of the flexible circuit board 239 is close to the middle position of the flexible circuit board 239.
  • Fig. 6 is another modified structure of the fingerprint identification device shown in Fig. 4.
  • the golden finger of the flexible circuit board 239 is located in the middle position of the flexible circuit board 239, one end of the flexible circuit board 239 is formed with an opening penetrating the flexible circuit board 239, and the flexible circuit
  • the opening of the board 239 is aligned with the opening of the first groove 2311 so that the fingerprint sensor chip 233 is disposed in the opening of the flexible circuit board 239.
  • an opening is formed between one end 2392 of the flexible circuit board 239 and the golden finger 2391 of the flexible circuit board 239, and the opening of the flexible circuit board 239 is aligned with the opening of the first groove 2311,
  • the fingerprint sensor chip 233 is arranged in the opening of the flexible circuit board 239.
  • the flexible circuit board 239 may be fixed above the substrate 231 by an anisotropic conductive adhesive film 241.
  • the side wall of the flexible circuit board close to the fingerprint sensor chip 233 is aligned with the side wall of the first groove 2311, so that the flexible circuit board 239 and the fingerprint sensor chip 233 There is a gap for accommodating the gold wire 235 which is used to electrically connect the fingerprint sensor chip 233 and the substrate 231.
  • the gap between the flexible circuit board 239 and the fingerprint sensor chip 233 can not only be used to accommodate the gold wire 235, but also can be used to accommodate the protective glue 237 of the gold wire, thereby ensuring that the gold The conductivity of the wire 235 and the performance of the fingerprint identification device 230.
  • the substrate 231 and the flexible circuit board 239 may each have gold fingers, and then the substrate 231 is electrically connected to the flexible circuit by pressing an anisotropic conductive film (ACF).
  • ACF anisotropic conductive film
  • the circuit board 239 but the embodiment of the present application is not limited thereto.
  • the substrate 231 and the flexible circuit board 239 can be integrated, that is, the substrate 231 and the flexible circuit board 239 can only serve as two parts of one component.
  • Fig. 7 is another modified structure of the fingerprint identification device shown in Fig. 4.
  • the substrate 231 and the flexible circuit board 239 can be used as the rigid board part and the flexible board part of the rigid-flex board, that is, the first groove 2311 is provided on the rigid board of the rigid-flex board. Board part.
  • the upper surface of the rigid board portion may be fixedly connected to the lower surface of the first foam layer 245 through a bracket 236 (for example, a bracket formed of double-sided tape).
  • FIG. 4 to FIG. 7 are only examples of the present application, and should not be construed as limiting the present application.
  • the fingerprint identification device shown in FIG. 5 and FIG. 7 may be partially used in combination.
  • the flexible circuit board 239 and the substrate 231 in FIG. 5 may be replaced with the rigid-flex board in FIG. 7.
  • the application also provides an electronic device, which includes a display screen and the fingerprint identification device referred to above.
  • the fingerprint identification device is arranged below the display screen, and its fingerprint collection area is at least partially located on the display screen of the display screen. In the area.
  • the electronic device 200 may include a middle frame 240.
  • the middle frame 240 is used to support the display screen of the electronic device.
  • a fourth groove is formed on the upper surface of the middle frame 240 extending downward, that is, the middle frame 240 is provided with a fourth groove, and the groove of the middle frame 240 is used to accommodate the fingerprint identification device 230.
  • the electronic device may further include a second foam layer 220.
  • the second foam layer 220 is disposed under the display screen 210, and the second foam layer 220 is provided with an open window, and the fingerprint identification device 230 receives the output from the display screen 210 through the open window.
  • a light signal formed after reflection by a human finger, and the light signal is used for fingerprint identification.
  • the gap can be an air gap that is not filled with any auxiliary materials, which can ensure that the fingerprint sensor chip 223 does not touch the lower surface of the display when the display is pressed or the electronic device falls or collides. It will not affect the stability and performance of fingerprint recognition of the fingerprint sensor chip 223.
  • the display screen 210 may be an OLED organic light-emitting panel made of low temperature polysilicon (LTPS) technology, which has an ultra-thin thickness, light weight, and low power consumption, and can be used to provide clearer images.
  • LTPS low temperature polysilicon
  • the second foam layer 220 can also be used as a screen print layer or an embossing layer.
  • the screen print layer can have graphics and text, and the graphics and text can be used as logos such as trademark patterns.
  • the second foam layer 220 may be a black sheet layer or a printed layer for shielding light. In other embodiments, the second foam layer 220 may also be referred to as a cushion layer, a rear panel or a heat dissipation layer.
  • the display screen may be a soft screen or a hard screen.
  • the finger When a finger is placed above the bright OLED screen, the finger will reflect the light emitted by the OLED screen, and this reflected light will penetrate the OLED screen to the bottom of the OLED screen.
  • the optical path layer located under the OLED screen can be used to filter out the infrared signal components in the leaked light. Since the fingerprint is a diffuse reflector, the light signal formed by the reflection or diffusion of the finger will exist in all directions.
  • a microlens array can be provided under the OLED screen and between the fingerprint sensor chip, which can collect the light signals leaking from the top of the OLED screen.
  • the fingerprint sensor chip 223 performs imaging of a fingerprint image by receiving a light signal that filters out red light.
  • the light signals leaking from the top of the OLED screen include fingerprint signals and internal structure signals of the screen, and the internal structure signals of the screen will affect the imaging of the fingerprint image, for example, moiré fringes are generated when imaging the fingerprint image.
  • the distance between the fingerprint sensor chip 223 and the OLED screen (for example, the lower surface of the display screen 210) can be within a certain threshold (for example, 600um) Within, the imaging of the screen structure will be blurred, but the imaging of the fingerprint structure will not be affected. Since the smaller the distance between the fingerprint sensor chip 223 and the OLED screen, the better the fingerprint recognition performance. Therefore, under the premise of reliability and process capability, the gap between the fingerprint sensor chip 223 and the OLED screen can be minimized as much as possible. distance.
  • the disclosed system and device may be implemented in other ways.
  • the device embodiments described above are merely illustrative.
  • the division of the elements is only a logical function division, and there may be other divisions in actual implementation, for example, multiple elements or components may be combined or It can be integrated into another system, or some features can be ignored or not implemented.
  • the displayed or discussed mutual coupling or direct coupling or communication connection may be indirect coupling or communication connection through some interfaces, devices or elements, and may also be electrical, mechanical or other forms of connection.
  • the functional elements mentioned above may be integrated and arranged, or each element may exist separately and physically.
  • Each functional element can be implemented in the form of hardware or software functional unit. If implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer readable storage medium.
  • the technical solution of the present application is essentially or the part that contributes to the existing technology, or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a
  • the storage medium includes several instructions to enable a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present application.
  • the aforementioned storage media include: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), magnetic disk or optical disk and other media that can store program code .

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Abstract

提供了一种指纹识别装置和电子设备，所述指纹识别装置适用于具有显示屏的电子设备，所述指纹识别装置包括指纹传感器芯片和基板，所述基板的上表面向下延伸形成有第一凹槽，所述指纹传感器芯片的至少一部分设置在所述第一凹槽内，并电连接至所述基板。通过将所述指纹传感器芯片的至少一部分设置在所述第一凹槽内，不仅能够降低电子设备的成本和复杂度，而且能够有效降低所述指纹识别装置的厚度。

Description

指纹识别装置和电子设备 技术领域
本申请实施例涉及电子领域，并且更具体地，涉及指纹识别装置和电子设备。
背景技术
屏下指纹识别方案是指将光学或超声波指纹识别模组贴合在有机发光二极管(Organic Light-Emitting Diode，OLED)屏幕的发光层的底部，也就是不管光学指纹识别模组还是超声波指纹识别模组都需要和发光层的底部发光层紧密粘结在一起。
但是，由于OLED屏幕成本很高，且很脆弱，因此将指纹识别模组直接贴合至OLED屏幕时很容易弄坏OLED屏幕。此外，由于指纹识别模组和OLED屏幕完全粘在一起，如出现指纹识别模组损坏，在拆卸指纹识别模组时很容易损坏OLED屏幕。而且，将指纹识别模组直接贴合到OLED屏幕的贴合工艺也比较复杂。
由于以上问题，大大增加了电子设备的成本和复杂度，可维修性低。
此外，由于现有的指纹识别模组厚度过大，满足不了市场对超薄化的电子设备的需求。
发明内容
本申请实施例提供一种指纹识别装置和电子设备，不仅能够降低电子设备的成本和复杂度，而且能够有效降低所述指纹识别装置的厚度。
第一方面，提供了一种指纹识别装置，适用于具有显示屏的电子设备，所述指纹识别装置包括：
指纹传感器芯片；
基板，所述基板的上表面向下延伸形成有第一凹槽，所述指纹传感器芯片的至少一部分设置在所述第一凹槽内，并电连接至所述基板；
其中，所述指纹传感器芯片通过所述基板设置在所述显示屏的下方，所述指纹传感器芯片用于接收经由所述显示屏上方的人体手指反射或散射而返回的指纹检测信号，并基于所述指纹检测信号检测所述手指的指纹信息。
将所述指纹传感器芯片的至少一分部设置在所述第一凹槽内，能够有效降低所述指纹识别装置的厚度，并且通过所述基板将所述指纹传感器芯片设置在所述显示屏的下方，可以避免使用贴合胶固定连接所述指纹传感器芯片和所述显示屏，继而能够降低电子设备的成本和复杂度。例如将所述基板固定在所述电子设备的中框。
在一些可能实现的方式中，所述第一凹槽的尺寸大于所述指纹传感器芯片的尺寸，使得所述指纹传感器芯片的侧壁和所述第一凹槽的侧壁之间存在用于容纳金线的间隙，所述金线用于电连接所述指纹传感器芯片和所述基板。
通过所述指纹传感器芯片的侧壁和所述第一凹槽侧壁之间的间隙，不仅能够用于容纳所述金线，而且能够用于容纳所述金线的保护胶，进而保证了所述金线的导电性和所述指纹识别装置的性能。
在一些可能实现的方式中，所述第一凹槽的深度包括所述基板的覆盖膜的厚度和位于所述覆盖膜下方的导电层的厚度。
在一些可能实现的方式中，所述基板包括至少两层导电层。
在一些可能的实现方式中，所述第一凹槽的深度包括位于所述覆盖膜下方的第一导电层，所述指纹传感器芯片通过导电通孔(例如贯通所述第一导电层下方的绝缘层的通孔)电连接至所述绝缘层下方的第二导电层，由此，可以使得所述指纹传感器芯片能够电连接至所述基板。
在一些可能实现的方式中，所述指纹识别装置还包括：
支架，所述支架围绕所述指纹传感器芯片设置在所述基板的上方；
第一泡棉层，所述第一泡棉层设置在所述支架的上方，所述第一泡棉层设置有贯通所述第一泡棉层的开口，所述指纹传感器芯片通过所述第一泡棉层的开口接收经由所述手指反射或散射而返回的指纹检测信号。
在一些可能实现的方式中，所述支架的下表面通过支架固定胶连接至在所述基板的上方，所述支架上表面通过双面胶连接至所述第一泡棉层。
在一些可能实现的方式中，所述支架为双面胶形成的支架，用于连接所述基板和所述第一泡棉层。
在一些可能实现的方式中，所述支架的靠近所述指纹传感器芯片的侧壁对齐所述第一凹槽的侧壁，使得所述支架和所述指纹传感器芯片之间存在用于容纳金线的间隙，所述金线用于电连接所述指纹传感器芯片和所述基板。
通过所述指纹传感器芯片的和所述支架之间的间隙，不仅能够用于容纳 所述金线，而且能够用于容纳所述金线的保护胶，进而保证了所述金线的导电性和所述指纹识别装置的性能。
在一些可能实现的方式中，所述支架的厚度为0.05mm～0.1mm。
在一些可能实现的方式中，所述指纹传感器芯片通过指纹传感器芯片固定胶固定在所述第一凹槽内。
在一些可能实现的方式中，所述基板的上表面在所述第一凹槽的一侧形成所述基板的金手指。
在一些可能实现的方式中，所述基板的金手指的上表面与所述基板的上表面形成第一台阶，所述第一台阶的厚度包括所述基板的位于覆盖层下方的导电层的厚度。
在一些可能实现的方式中，所述基板的上表面在第一区域向下延伸形成有第二凹槽，所述基板的上表面在第二区域与所述基板的金手指的上表面形成第二台阶，所述第一区域为所述基板的金手指靠近所述第一凹槽的一侧所在的区域，所述第二区域为所述基板的金手指远离所述第一凹槽的一侧所在的区域。
在一些可能实现的方式中，所述第二凹槽的深度包括所述基板的覆盖层和位于所述覆盖层下方的导电层的厚度，所述第二台阶的厚度为所述基板的位于覆盖层下方的导电层的厚度。
在一些可能实现的方式中，所述指纹识别装置还包括：
柔性电路板，所述柔性电路板形成有所述柔性电路板的金手指；
各向异性导电胶膜，所述柔性电路板的金手指通过所述各向异性导电胶膜电连接至所述基板的金手指。
通过金手指电连接所述基板和所述柔性电路板，不仅能够保证触片之间的绝缘性，还能够保证所述基板和所述柔性电路板之间的导电性，特别是所述指纹传感器芯片包括多个芯片的情况下，可以通过金手指将所述基板上的多个芯片快速电连接至所述柔性电路板，进而能够降低安装复杂度以及拆卸复杂度。
在一些可能实现的方式中，所述基板的金手指和所述柔性电路板的金手指包括多个导电触片。
在一些可能实现的方式中，所述多个导电触片上设置有导电保护层。
在一些可能实现的方式中，所述柔性电路板的下表面在第三区域向上延 伸形成有第三凹槽，所述柔性电路板的下表面在第二区域与所述柔性电路板的金手指的下表面形成第三台阶，所述第三区域为所述柔性电路板的金手指远离所述第一凹槽的一侧所在的区域，所述第二区域为所述柔性电路板的金手指靠近所述第一凹槽的一侧所在的区域。
在一些可能实现的方式中，所述柔性电路板的金手指位于所述柔性电路板的一端。
在一些可能实现的方式中，所述柔性电路板的金手指位于所述柔性电路板的中间位置，所述柔性电路板的一端形成有贯通所述柔性电路板的开口，所述柔性电路板的开口对准所述第一凹槽的开口，使得所述指纹传感器芯片设置在所述柔性电路板的开口内。
在一些可能实现的方式中，所述柔性电路板的靠近所述指纹传感器芯片的侧壁对齐所述第一凹槽的侧壁，使得所述柔性电路板和所述指纹传感器芯片之间存在用于容纳金线的间隙，所述金线用于电连接所述指纹传感器芯片和所述基板。
通过所述柔性电路板和所述指纹传感器芯片之间的间隙，不仅能够用于容纳所述金线，而且能够用于容纳所述金线的保护胶，进而保证了所述金线的导电性和所述指纹识别装置的性能。
在一些可能实现的方式中，所述基板为软硬结合板的硬板部分。
在一些可能实现的方式中，所述第一凹槽的深度包括所述基板的覆盖膜的厚度和位于所述覆盖膜下方的至少两层导电层的厚度。
在一些可能实现的方式中，所述指纹识别装置还包括：
金线，所述指纹传感器芯片通过所述金线电连接至所述基板；
金线保护胶，所述金线保护胶用于封装所述金线。
在一些可能实现的方式中，所述金线的弧高或封装高度小于150um。
在一些可能实现的方式中，所述指纹识别装置还包括：
光路层，所述光路层设置在所述指纹传感器芯片的上方，所述光路层用于将经由所述手指反射或散射而返回的指纹检测信号传输至所述指纹传感器芯片。
在一些可能实现的方式中，所述光路层包括微透镜层和挡光层，所述微透镜层具有由多个微透镜形成的微透镜阵列，所述挡光层具有多个微孔并设置在所述微透镜层的下方，并且所述微孔与所述微透镜一一对应。
在一些可能的实现方式中，所述光路层还包括滤光片，所述滤光片设置在所述微透镜层上方或者设置在所述微透镜层和所述指纹传感器芯片之间的光路中。
在一些可能实现的方式中，所述指纹传感器芯片包括多个光学指纹传感器芯片，所述多个光学指纹传感器芯片并排设置在所述第一凹槽内，以拼接成一个光学指纹传感器芯片组件。
在一些可能实现的方式中，所述指纹识别装置还包括：
图像处理器，所述图像处理器电连接至所述基板。
在一些可能实现的方式中，所述指纹识别装置还包括：
至少一个电容器，所述至少一个电容器电连接至所述基板，所述至少一个电容器用于优化所述指纹传感器芯片采集的指纹检测信号。
在一些可能实现的方式中，所述指纹识别装置还包括：
连接器，所述连接器电连接至所述基板，所述连接器用于与外部装置或者所述电子设备的其它部件进行连接。
在一些可能实现的方式中，所述显示屏的发光层的下表面与所述指纹传感器芯片的上表面之间的距离小于600um。
在一些可能实现的方式中，所述基板的厚度的范围为0.1mm～0.4mm。
所述显示屏的下方设置有第二泡棉层，所述第二泡棉层设置有贯通所述第二泡棉层的开孔，所述指纹传感器芯片设置在所述第二泡棉层的开孔的下方。
在一些可能实现的方式中，所述电子设备的中框设置有第四凹槽，所述基板的至少一部分设置在所述第四凹槽内。
第二方面，提供了一种电子设备，包括：
显示屏；
指纹识别装置，设置在所述显示屏下方，所述指纹识别装置为第一方面或第一方面中的任一可能实现的方式中所述的指纹识别装置，且其指纹采集区域至少部分位于所述显示屏的显示区域之中。
在一些可能实现的方式中，所述电子设备还包括：
第二泡棉层，所述第二泡棉层设置在所述显示屏的下方，所述第二泡棉层设置有贯通所述第二泡棉层的开孔，所述指纹传感器芯片设置在所述第二泡棉层的开孔的下方。
在一些可能实现的方式中，所述电子设备还包括：
中框，所述中框设置有第四凹槽，所述指纹识别装置的至少一部分设置在所述第四凹槽内。
基于以上技术方案，本申请实施例的指纹识别装置和电子设备，不仅能够降低电子设备的成本和复杂度，而且能够有效降低所述指纹识别装置的厚度。
附图说明
图1是本申请可以适用的电子设备的平面示意图。
图2是图1所示的电子设备的侧剖面示意图。
图3本申请实施例的具有指纹识别模组的电子设备的示意性结构图。
图4至图7是本申请实施例的指纹识别模组的示意性结构图。
具体实施方式
下面将结合附图，对本申请实施例中的技术方案进行描述。
本申请实施例的技术方案可以应用于各种电子设备。
例如，智能手机、笔记本电脑、平板电脑、游戏设备等便携式或移动计算设备，以及电子数据库、汽车、银行自动柜员机(Automated Teller Machine，ATM)等其他电子设备。但本申请实施例对此并不限定。
本申请实施例的技术方案可以用于生物特征识别技术。其中，生物特征识别技术包括但不限于指纹识别、掌纹识别、虹膜识别、人脸识别以及活体识别等识别技术。为了便于说明，下文以指纹识别技术为例进行说明。
本申请实施例的技术方案可以用于屏下指纹识别技术和屏内指纹识别技术。
屏下指纹识别技术是指将指纹识别模组安装在显示屏下方，从而实现在显示屏的显示区域内进行指纹识别操作，不需要在电子设备正面除显示区域外的区域设置指纹采集区域。具体地，指纹识别模组使用从电子设备的显示组件的顶面返回的光来进行指纹感应和其他感应操作。这种返回的光携带与显示组件的顶面接触或者接近的物体(例如手指)的信息，位于显示组件下方的指纹识别模组通过采集和检测这种返回的光以实现屏下指纹识别。其中，指纹识别模组的设计可以为通过恰当地配置用于采集和检测返回的光的光 学元件来实现期望的光学成像，从而检测出所述手指的指纹信息。
相应的，屏内(In-display)指纹识别技术是指将指纹识别模组或者部分指纹识别模组安装在显示屏内部，从而实现在显示屏的显示区域内进行指纹识别操作，不需要在电子设备正面除显示区域外的区域设置指纹采集区域。
图1和图2示出了屏下指纹识别技术可以适用的电子设备100的示意图，其中图1为电子设备100的正面示意图，图2为图1所示的电子设备100的部分剖面结构示意图。
如图1和图2所示，电子设备100可以包括显示屏120和指纹识别模组140。
显示屏120可以为自发光显示屏，其采用具有自发光的显示单元作为显示像素。比如显示屏120可以为有机发光二极管(Organic Light-Emitting Diode，OLED)显示屏或者微型发光二极管(Micro-LED)显示屏。在其他可替代实施例中，显示屏120也可以为液晶显示屏(Liquid Crystal Display,LCD)或者其他被动发光显示屏，本申请实施例对此不做限制。
此外，显示屏120还可以具体为触控显示屏，其不仅可以进行画面显示，还可以检测用户的触摸或者按压操作，从而为用户提供一个人机交互界面。比如，在一种实施例中，电子设备100可以包括触摸传感器，所述触摸传感器可以具体为触控面板(Touch Panel,TP)，其可以设置在所述显示屏120表面，也可以部分集成或者整体集成到所述显示屏120内部，从而形成所述触控显示屏。
指纹识别模组140可以为光学指纹识别模组，比如包括光学指纹传感器。
具体来说，指纹识别模组140可以包括具有光学感应阵列的传感器芯片(后面也称为光学指纹传感器)。其中，光学感应阵列包括多个光学感应单元，每个光学感应单元可以具体包括光探测器或者光电传感器。或者说，指纹识别模组140可以包括光探测器(Photo detector)阵列(或称为光电探测器阵列、光电传感器阵列)，其包括多个呈阵列式分布的光探测器。
如图1所示，指纹识别模组140可以设置在所述显示屏120的下方的局部区域，从而使得指纹识别模组140的指纹采集区域(或检测区域)130至少部分位于所述显示屏120的显示区域102内。
当然，在其他可替代实施例中，指纹识别模组140也可以设置在其他位置，比如显示屏120的侧面或者电子设备100的边缘非透光区域。这种情况 下，可以通过光路设计将显示屏120的至少部分显示区域的光信号导引到指纹识别模组140，从而使得所述指纹采集区域130实际上位于所述显示屏120的显示区域内。
在本申请的一些实施例中，指纹识别模组140可以仅包括一个传感器芯片，此时指纹识别模组140的指纹采集区域130的面积较小且位置固定，因此用户在进行指纹输入时需要将手指按压到所述指纹采集区域130的特定位置，否则指纹识别模组140可能无法采集到指纹图像而造成用户体验不佳。
在本申请的另一些实施例中，指纹识别模组140可以具体包括多个传感器芯片；所述多个传感器芯片可以通过拼接方式并排设置在所述显示屏120的下方，且所述多个传感器芯片的感应区域共同构成所述指纹识别模组140的指纹采集区域130。也即是说，所述指纹识别模组140的指纹采集区域130可以包括多个子区域，每个子区域分别对应于其中一个传感器芯片的感应区域，从而将所述光学指纹模组130的指纹采集区域130可以扩展到所述显示屏的下半部分的主要区域，即扩展到手指惯常按压区域，从而实现盲按式指纹输入操作。可替代地，当所述传感器芯片数量足够时，所述指纹检测区域130还可以扩展到半个显示区域甚至整个显示区域，从而实现半屏或者全屏指纹检测。
应理解，本申请实施例对所述多个传感器芯片的具体形式不做限定。
例如，所述多个传感器芯片可以分别是独立封装的传感器芯片，也可以是封装在同一个芯片封装体内的多个芯片(Die)。
又例如，还可以通过半导体工艺在同一个芯片的不同区域上制作形成所述多个传感器芯片。
如图2所示，指纹识别模组140的光学感应阵列的所在区域或者光感应范围对应所述指纹识别模组140的指纹采集区域130。其中，指纹识别模组140的指纹采集区域130可以等于或不等于指纹识别模组140的光学感应阵列的所在区域的面积或者光感应范围，本申请实施例对此不做具体限定。
例如，通过光线准直的光路设计，指纹识别模组140的指纹采集区域130可以设计成与所述指纹识别模组140的感应阵列的面积基本一致。
又例如，通过微距镜头进行汇聚光线的光路设计或者反射光线的光路设计，可以使得所述指纹识别模组140的指纹采集区域130的面积大于所述指纹识别模组140感应阵列的面积。
下面对指纹识别模组140的光路设计进行示例性说明。
以指纹识别模组140的光路设计采用具有高深宽比的通孔阵列的光学准直器为例，所述光学准直器可以具体为在半导体硅片制作而成的准直器(Collimator)层，其具有多个准直单元或者微孔，所述准直单元可以具体为小孔，从手指反射回来的反射光中，垂直入射到所述准直单元的光线可以穿过并被其下方的传感器芯片接收，而入射角度过大的光线在所述准直单元内部经过多次反射被衰减掉，因此每一个传感器芯片基本只能接收到其正上方的指纹纹路反射回来的反射光，能够有效提高图像分辨率，进而提高指纹识别效果。
进一步地，当指纹识别模组140包括多个传感器芯片时，可以为每个传感器芯片的光学感应阵列中的一个光学感应单元配置一个准直单元，并贴合设置在其对应的光学感应单元的上方。当然，所述多个光学感应单元也可以共享一个准直单元，即所述一个准直单元具有足够大的孔径以覆盖多个光学感应单元。由于一个准直单元可以对应多个光学感应单元，破坏了显示屏120的空间周期和传感器芯片的空间周期的对应性，因此，即使显示屏120的发光显示阵列的空间结构和传感器芯片的光学感应阵列的空间结构类似，也能够有效避免指纹识别模组140利用经过显示屏120的光信号进行指纹成像生成莫尔条纹，有效提高了指纹识别模组140的指纹识别效果。
以指纹识别模组140的光路设计采用光学镜头的光路设计为例，所述光学镜头可以包括光学透镜(Lens)层，其具有一个或多个透镜单元，比如一个或多个非球面透镜组成的透镜组，其用于将从手指反射回来的反射光汇聚到其下方的传感器芯片的感应阵列，以使得所述感应阵列可以基于所述反射光进行成像，从而得到所述手指的指纹图像。
所述光学透镜层在所述透镜单元的光路中还可以形成有针孔或者微孔光阑，比如，在所述透镜单元的光路中可以形成有一个或者多个遮光片，其中至少一个遮光片可以在所述透镜单元的光轴或者光学中心区域形成有透光微孔，所述透光微孔可以作为上述针孔或者微孔光阑。所述针孔或者微孔光阑可以配合所述光学透镜层和/或所述光学透镜层上方的其他光学膜层，扩大指纹识别模组140的视场，以提高所述指纹识别模组140的指纹成像效果。
进一步地，当指纹识别模组140包括多个传感器芯片时，可以为每一个传感器芯片配置一个光学镜头进行指纹成像，或者为多个传感器芯片配置一 个光学镜头来实现光线汇聚和指纹成像。甚至于，当一个传感器芯片具有两个感应阵列(Dual Array)或多个感应阵列(Multi-Array)时，也可以为这个传感器芯片配置两个或多个光学镜头配合所述两个感应阵列或多个感应阵列进行光学成像，从而减小成像距离并增强成像效果。
以指纹识别模组140的光路设计采用微透镜(Micro-Lens)层的光路设计为例，所述微透镜层可以具有由多个微透镜形成的微透镜阵列，其可以通过半导体生长工艺或者其他工艺形成在所述传感器芯片的感应阵列上方，并且每一个微透镜可以分别对应于所述感应阵列的其中一个感应单元。所述微透镜层和所述感应单元之间还可以形成其他光学膜层，比如介质层或者钝化层，更具体地，所述微透镜层和所述感应单元之间还可以包括具有多个微孔的挡光层，其中所述微孔形成在其对应的微透镜和感应单元之间，所述挡光层可以阻挡相邻微透镜和感应单元之间的光学干扰，并使光线通过所述微透镜汇聚到所述微孔内部并经由所述微孔传输到所述微透镜对应的感应单元，以进行光学指纹成像。
可选地，所述微透镜层上方或者所述微透镜层和所述传感器芯片(后面也称为光学指纹传感器)之间的光路中还可以设置滤光片。
作为一种可选的实施例，所述滤光片可以设置于所述微透镜层上方，例如，所述滤光片可以通过缓冲层与微透镜层连接，所述缓冲层可以为透明介质层，可以用于填平所述微透镜层的表面，
或者所述滤光片可以通过固定装置固定到所述微透镜层的上方，例如在所述微透镜层四周的非感光区域设置框胶或者其它支撑件，以支撑并固定所述滤波片。
作为一种可选的实施例，所述滤光片还可以设置于所述微透镜层和所述传感器芯片之间的光路中，例如，所述滤光片可以设置在所述传感器芯片上方，具体的，所述滤光片可以通过固定装置固定到传感器芯片的上方，例如，在所述传感器芯片的非感光区域设置框胶或者其它支撑件，以支撑并固定所述滤波片，还可以采用蒸镀工艺或溅射工艺，在所述传感器芯片上进行镀膜，形成所述滤波片，即所述滤波片与所述传感器芯片集成为一体。可以理解的是，所述滤波片还可以为在其他光学膜层的镀膜，此处不做限定。
应当理解，上述光路引导结构的几种实现方案可以单独使用也可以结合使用，比如，可以在所述准直器层或者所述光学透镜层下方进一步设置微透 镜层。当然，在所述准直器层或者所述光学透镜层与所述微透镜层结合使用时，其具体叠层结构或者光路可能需要按照实际需要进行调整。
指纹识别模组140可以用于采集用户的指纹信息(比如指纹图像信息)。
以显示屏120采用OLED显示屏为例，显示屏120可以采用具有自发光显示单元的显示屏，比如有机发光二极管(Organic Light-Emitting Diode，OLED)显示屏或者微型发光二极管(Micro-LED)显示屏。指纹识别模组140可以利用OLED显示屏的位于指纹采集区域130的显示单元(即OLED光源)来作为光学指纹检测的激励光源。
当手指触摸、按压或者接近(为便于描述，在本申请中统称为按压)在指纹采集区域130时，显示屏120向指纹采集区域130上方的手指发出一束光，这一束光在手指的表面发生反射形成反射光或者经过手指的内部散射后而形成散射光，在相关专利申请中，为便于描述，上述反射光和散射光统称为反射光。由于指纹的嵴(ridge)与峪(vally)对于光的反射能力不同，因此，来自指纹嵴的反射光和来自指纹峪的发生过具有不同的光强，反射光经过显示屏120后，被指纹识别模组140中的传感器芯片所接收并转换为相应的电信号，即指纹检测信号；基于所述指纹检测信号便可以获得指纹图像数据，并且可以进一步进行指纹匹配验证，从而在所述电子设备100实现光学指纹识别功能。
由此可见，用户需要对电子设备100进行指纹解锁或者其他指纹验证的时候，只需要将手指按压在位于显示屏120的指纹采集区域130，便可以实现指纹特征的输入操作。由于指纹特征的采集可以在显示屏120的显示区域102的内部实现，采用上述结构的电子设备100无需其正面专门预留空间来设置指纹按键(比如Home键)，因而可以采用全面屏方案。因此，所述显示屏120的显示区域102可以基本扩展到所述电子设备100的整个正面。
当然，在其他替代方案中，指纹识别模组140也可以采用内置光源或者外置光源来提供用于进行指纹检测识别的光信号。在这种情况下，指纹识别模组140不仅可以适用于如OLED显示屏等自发光显示屏，还可以适用于非自发光显示屏，比如液晶显示屏或者其他的被动发光显示屏。
以应用在具有背光模组和液晶面板的液晶显示屏为例，为支持液晶显示屏的屏下指纹检测，电子设备100的光学指纹***还可以包括用于光学指纹检测的激励光源，所述激励光源可以具体为红外光源或者特定波长非可见光 的光源，其可以设置在所述液晶显示屏的背光模组下方或者设置在电子设备100的保护盖板下方的边缘区域，而指纹识别模组140可以设置液晶面板或者保护盖板的边缘区域下方并通过光路引导以使得指纹检测光可以到达所述指纹识别模组140；或者，指纹识别模组140也可以设置在所述背光模组下方，且所述背光模组通过对扩散片、增亮片、反射片等膜层进行开孔或者其他光学设计以允许指纹检测光穿过液晶面板和背光模组并到达指纹识别模组140。当采用所述指纹识别模组140采用内置光源或者外置光源来提供用于进行指纹检测的光信号时，其检测原理可以相同。
如图1所示，电子设备100还可以包括保护盖板110。
盖板110可以具体为透明盖板，比如玻璃盖板或者蓝宝石盖板，其位于显示屏120的上方并覆盖所述电子设备100的正面，且盖板110表面还可以设置有保护层。因此，本申请实施例中，所谓的手指按压显示屏120实际上可以是指手指按压在显示屏120上方的盖板110或者覆盖所述盖板110的保护层表面。
如图1所示，指纹识别模组140的下方还可以设置有电路板150，比如软性电路板(Flexible Printed Circuit，FPC)。
指纹识别模组140可以通过焊盘焊接到电路板150，并通过电路板150实现与其他***电路或者电子设备100的其他元件的电性互连和信号传输。比如，指纹识别模组140可以通过电路板150接收电子设备100的处理单元的控制信号，并且还可以通过电路板150将来自指纹识别模组140的指纹检测信号输出给电子设备100的处理单元或者控制单元等。
图3是本申请实施例的具有指纹识别装置的电子设备的示意性结构图。
如图3所示，所述电子设备200可以包括显示屏210、第二泡棉层220、指纹识别装置230、中框240、电池固定胶250和电池260。其中，所述显示屏可210以为图1和图2所示的显示屏，其相关说明可以参考可以参照前述关于显示屏120的描述。所述指纹识别装置230可以是图1和图2所示的指纹识别模组，其相关功能可以参照前述关于指纹识别模组140的相关描述，此处不再赘述。应理解，在其他可替代实施例中，所述显示屏210和所述第二泡棉层220也可以统称为显示屏幕，显示屏210也可以称为显示屏幕的发光层，本申请实施例对此不做具体限定。
请继续参见图3，所述中框240的上表面向下延伸形成有第四凹槽，即 所述中框240设置有第四凹槽，所述指纹识别装置230的至少一部分设置在所述中框240的凹槽内。进一步地，所述第二泡棉层220可以设置有贯通所述第二泡棉层220的开口，所述指纹识别装置230的至少一部分设置在所述第二泡棉层220的开口内。例如所述指纹识别装置230的下表面可以贴合在所述显示屏210的下表面，又例如所述指纹识别装置230的上表面可以贴合在所述中框240的凹槽的底部，又例如，所述指纹识别装置230的上表面和下表面可以分别贴合在所述显示屏210的下表面和所述中框240的凹槽的底部。
但是由于显示屏210成本很高，且很脆弱，因此将指纹识别模组230直接贴合至显示屏210时很容易弄坏显示屏210。此外，由于指纹识别模组230和显示屏210完全粘在一起，如出现指纹识别模组230损坏，在拆卸指纹识别模组230时很容易损坏显示屏210。并且，将指纹识别模组230直接贴合到显示屏210的贴合工艺也比较复杂。由于以上问题，大大增加了电子设备100的成本和复杂度，可维修性低。
本申请提供了一种指纹识别装置，能够降低电子设备200的成本和复杂度，提高了可维修性。
下面结合图4至图7详细说明本申请实施例的指纹识别装置230。
需要说明的是，为便于说明，在本申请实施例中，相同的附图标记用于表示相同的部件，并且为了简洁，在不同实施例中，省略对相同部件的详细说明。
请参见图4，所述指纹识别装置230可以包括指纹传感器芯片233和基板231，所述基板231的上表面向下延伸形成有第一凹槽2311，所述指纹传感器芯片233的至少一部分设置在所述第一凹槽2311内，并电连接至所述基板231；例如，所述指纹传感器芯片233的下表面固定连接在所述第一凹槽2311的底部，且通过所述金线235电连接至所述基板231。其中，所述指纹传感器芯片233通过所述基板231设置在所述显示屏210的下方，所述指纹传感器芯片233用于接收经由所述显示屏210上方的人体手指反射或散射而返回的指纹检测信号，并基于所述指纹检测信号检测所述手指的指纹信息。
通过将所述指纹传感器芯片233的至少一分部设置在所述第一凹槽2311内，能够有效降低所述指纹识别装置230的厚度，并且通过所述基板231将所述指纹传感器芯片233设置在所述显示屏210的下方，可以避免使 用贴合胶固定连接所述指纹传感器芯片233和所述显示屏210，继而能够降低电子设备200的成本和复杂度。例如将所述基板231固定在所述电子设备的中框240。
在一些实施例中，所述指纹传感器芯片233可以包括多个芯片也可以包括一个芯片，例如所述指纹传感器芯片233可以包括多个光学指纹传感器芯片，所述多个光学指纹传感器芯片并排设置在所述第一凹槽内，以拼接成一个光学指纹传感器芯片组件。所述光学指纹传感器芯片组件可以用于同时获取多张指纹图像，所述多张指纹图像拼接后可以作为一个指纹图像进行指纹识别。请继续参见图4，所述指纹传感器芯片233可以是具有光学感应阵列2331的传感器芯片(后面也称为光学指纹传感器)。其中，光学感应阵列2331可以包括多个光学感应单元，每个光学感应单元可以具体包括光探测器或者光电传感器。或者说，所述指纹传感器芯片233可以包括光探测器(Photo detector)阵列(或称为光电探测器阵列、光电传感器阵列)，其包括多个呈阵列式分布的光探测器。
请继续参见图4，所述第一凹槽2311的尺寸可以大于所述指纹传感器芯片233的尺寸，使得所述指纹传感器芯片233的侧壁和所述第一凹槽2311的侧壁之间存在用于容纳金线235的间隙，所述金线235用于电连接所述指纹传感器芯片233和所述基板231。此外，所述第一凹槽2311的尺寸大于所述指纹传感器芯片233的尺寸，也可以降低所述指纹传感器芯片233的安装复杂度和拆卸复杂度。
其中，所述第一凹槽2311的深度可以包括所述基板231的覆盖膜的厚度和位于所述覆盖膜下方的导电层的厚度。所述基板231的覆盖膜可以是绝缘层，用于保护和绝缘所述覆盖膜下方的导电层。位于所述覆盖膜下方的导电层为所述基板231的电路层或布线层，所述指纹传感器芯片233可以通过所述基板的电路层或布线层实现与外部器件的电连接。
例如，所述基板231可以包括至少两层导电层，此时，所述第一凹槽2311的深度包括位于所述基板231的覆盖膜下方的第一导电层，所述指纹传感器芯片233可以通过导电通孔(例如贯通所述第一导电层下方的绝缘层的通孔)电连接至所述绝缘层下方的第二导电层，由此，可以使得所述指纹传感器芯片233能够电连接至所述基板231。
请继续参见图4，所述指纹传感器芯片233可以通过指纹传感器芯片233 固定胶232固定在所述第一凹槽2311内。
应理解，所述指纹传感器芯片233也可以固定连接至所述第一凹槽2311的侧壁，也可以通过其它方式固定在所述第一凹槽2311内，例如可以通过卡扣或螺钉将所述指纹传感器芯片233固定在所述第一凹槽2311内，本实施例对此不做具体限定。
请参见继续参见图4，所述基板231的下表面还可以设置有双面胶2313，以便将所述基板239粘贴在所述电子设备200的中框240的凹槽的底部。
应理解，所述基板231也可以固定连接至所述中框240的凹槽的侧壁，或者，所述基板231也可以通过其它方式(例如卡扣或螺钉)固定设置在所述中框240的凹槽内，本申请实施例对此不做具体限定。
请继续参见图4，所述基板231的上表面可以在所述第一凹槽2311的一侧形成所述基板231的金手指2312。换句话说，所述基板231的上表面可以在所述第一凹槽2311的一侧形成所述基板231的导电层的凸出结构，以形成所述基板231的金手指2312。
应理解，本申请对所述基板231的金手指2312的具体结构不做限定。作为示例，如图4所示，所述基板231的上表面在第一区域向下延伸形成有第二凹槽，所述基板231的上表面在第二区域与所述基板231的金手指的上表面形成第二台阶，所述第一区域为所述基板231的金手指靠近所述第一凹槽2311的一侧所在的区域，所述第二区域为所述基板231的金手指远离所述第一凹槽2311的一侧所在的区域。进一步地，所述第二凹槽的深度可以包括所述基板231的覆盖层和位于所述覆盖层下方的导电层的厚度，所述第一台阶的厚度为所述基板231的位于覆盖层下方的导电层的厚度，使得所述基板231的部分导电层形成凸面向上的凸出结构，进而形成所述基板231的金手指2312。
请继续参见图4，所述指纹识别装置230还可以包括柔性电路板239和各向异性导电胶膜241。其中，所述柔性电路板239形成有所述柔性电路板239的金手指2391；所述柔性电路板239的金手指2391通过所述各向异性导电胶膜241电连接至所述基板231的金手指2312。
例如，所述柔性电路板239的金手指2391可以位于所述柔性电路板239的一端。即所述柔性电路板239的一端可以通过压合各向异性导电胶膜241的方式电连接至所述基板231的一端。
通过金手指电连接所述基板231和所述柔性电路板239，不仅能够保证触片之间的绝缘性，还能够保证所述基板231和所述柔性电路板239之间的导电性，特别是所述指纹传感器芯片233包括多个芯片的情况下，可以通过金手指将所述基板231上的多个芯片快速电连接至所述柔性电路板239，进而能够降低安装复杂度以及拆卸复杂度。
应理解，本申请对所述柔性电路板239的金手指2391的具体结构不做限定。作为示例，如图4所示，所述柔性电路板239的下表面可以在第三区域向上延伸形成有第三凹槽，所述柔性电路板239的下表面可以在第二区域与所述柔性电路板239的金手指的下表面形成第三台阶，所述第三区域为所述柔性电路板239的金手指2391远离所述第一凹槽2311的一侧所在的区域，所述第二区域为所述柔性电路板239的金手指2391靠近所述第一凹槽2311的一侧所在的区域。
请继续参见图4，所述指纹识别装置230还可以包括各向异性导电胶膜241的保护胶238，所述保护胶238可以位于所述各向异性导电胶膜241的两端，以保护所述各向异性导电胶膜241，进而保护所述基板231的金手指2391和所述柔性电路板239的金手指2391。
请继续参见图4，所述指纹识别装置230还可以包括支架236和第一泡棉层245，所述第一泡棉层245设置在所述支架236的上方，所述第一泡棉层236设置有贯通所述第一泡棉层236的开口，所述指纹传感器芯片233可以通过所述第一泡棉层245的开口接收经由所述手指反射或散射而返回的指纹检测信号。
结合图3来说，所述第一泡棉层245可以是所述指纹识别装置230的泡棉层，也可以是电子设备200的位于所述显示屏210和所述中框240之间的泡棉层，本申请对此不做具体限定。换句话说，所述第一泡棉层245是所述指纹识别装置230的泡棉层时，所述第一泡棉层245可以直接与所述显示屏240直接接触，进一步地可以使所述第一泡棉层245处于压缩状态；所述第一泡棉层345是电子设备200的位于所述显示屏210和所述中框240之间的泡棉层时，说明所述指纹识别装置230直接贴合在所述显示屏210的下方的第二泡棉层220的下表面。
应理解，所述支架236可以是任何能够用于固定连接所述基板231和所述第一泡棉层245的材料形成。例如，所述支架236可以是由双面胶形成的 支架。
请继续参见图4，所述支架236的靠近所述指纹传感器芯片233的侧壁可以对齐所述第一凹槽2311的侧壁，使得所述支架236和所述指纹传感器芯片233之间存在用于容纳所述金线235的间隙。
通过所述支架236和所述指纹传感器芯片233之间的间隙，不仅能够用于容纳所述金线235，而且能够用于容纳所述金线的保护胶237，进而保证了所述金线235的导电性和所述指纹识别装置230的性能。而且，所述基板231还可以通过所述柔性电路板239固定在所述显示屏210的下方，进而使得所述指纹传感器芯片233固定在所述显示屏210的下方。
请继续参见图4，所述指纹识别装置还可以包括金线保护胶237，所述金线保护胶237用于封装并保护所述金线235。可选地，所述金线235的弧高或封装高度小于某一阈值，例如所述金线的弧高或封装高度小于150um。例如所述金线的弧高或封装高度更具体可以小于70um。
需要说明的是，用于容纳所述金线235的空间也可以用于容纳所述金线保护胶237。
例如，如图4所示，用于容纳金线保护胶237的空间包括但不限于指纹传感器芯片233的侧壁和所述第一凹槽2311的侧壁之间形成的间隙、所述指纹传感器芯片233和所述支架236之间形成的间隙，以及所述指纹传感器芯片233和所述第一泡棉层245之间形成的间隙。
请继续参见图4，所述指纹识别装置230还可以包括光路层234，所述光路层234用于将经由所述手指反射或散射而返回的指纹检测信号传输至所述指纹传感器芯片233。所述光路层234设置于指纹传感器芯片233上方，可用于实现光路设计，指纹识别装置230的光路设计可以参照前述指纹识别模组140的光路设计，这里不再赘述，仅仅选取采用微透镜层的光路设计作为示例性说明。作为一种可选的实施例，所述光路层234包括微透镜层、挡光层，所述微透镜层可以具有由多个微透镜形成的微透镜阵列，所述挡光层具有多个微孔并设置在微透镜层的下方，并且所述微孔与所述微透镜一一对应，所述光学感应阵列2331的光学感应单元与所述微透镜一一对应。可选地，所述光路层还可以包括其他光学膜层，具体的所述微透镜层与所述指纹传感器芯片233之间还可以形成其他光学膜层，比如介质层或者钝化层。可选地，所述光路层234还可以包括滤波片，所述滤光片设置在所述微透镜层 上方或者设置在所述微透镜层和所述传感器芯片233之间的光路中，具体可参照前述内容，此处不再重复。
本申请实施例中，滤光片用于来减少指纹感应中的不期望的环境光，以提高所述指纹传感器芯片233对接收到的光的光学感应。滤光片具体可以用于过滤掉特定波长的光，例如，近红外光和部分的红光等。例如，人类手指吸收波长低于580nm的光的能量中的大部分，如果一个或多个光学过滤器或光学过滤层被设计为过滤波长从580nm至红外的光，则可以大大减少环境光对指纹感应中的光学检测的影响。
例如，所述滤光片可以包括一个或多个光学过滤器，一个或多个光学过滤器可以配置为例如带通过滤器，以允许OLED屏发射的光的传输，同时阻挡太阳光中的红外光等其他光组分。当在室外使用屏下所述指纹识别装置230时，这种光学过滤可以有效地减少由太阳光造成的背景光。一个或多个光学过滤器可以实现为例如光学过滤涂层，光学过滤涂层形成在一个或多个连续界面上，或可以实现为一个或多个离散的界面上。应理解，滤光片可以制作在所述光路层234中的任何光学膜层的表面上，或者沿着到经由手指反射形成的反射光至成所述指纹传感器芯片233的光学路径上，本申请实施例对此不做具体限定。
此外，所述滤光片的进光面可以设置有光学无机镀膜或有机黑化涂层，以使得滤光片的进光面的反射率低于第一阈值，例如1％，从而能够保证所述指纹传感器芯片233能够接收到足够的光信号，进而提升指纹识别效果。
以所述滤光片通过固定装置固定在指纹传感器芯片233的上表面为例。所述滤光片和所述指纹传感器芯片233可以在所述指纹传感器芯片233的非感光区域进行点胶固定，且所述滤光片和所述指纹传感器芯片233的感光区域之间存在间隙。或者所述滤光片的下表面通过折射率低于预设折射率的胶水固定在所述指纹传感器芯片233的上表面，例如，所述预设折射率包括但不限于1.3。
需要注意的是，滤光片通过光学胶填充贴合在指纹传感器芯片233的上表面时，若指纹传感器芯片233的上表面覆盖的胶厚不均匀，会存在牛顿环现象，从而影响指纹识别效果。
与所述滤光片通过固定装置固定到指纹传感器芯片233上方的实现方式相比，所述滤光片为在所述指纹传感器芯片233或者其他光学膜层上的镀膜 时，避免了采用蓝玻璃或白玻璃基材等滤光片，不仅会避免牛顿环现象，进而提高指纹识别效果，还能够有效减小所述指纹识别装置230的厚度。
请继续参见图4，所述指纹识别装置还可以包括图像处理器244，所述图像处理器244电连接至所述基板231。例如，所述图像处理器设置在所述柔性电路板239上，并通过所述柔性电路板239电连接至所述基板231。例如，图像处理器244可以为微处理器(Micro Processing Unit，MCU)，用于接收来自所述指纹传感器芯片233通过所述柔性电路板239发送的指纹检测信号(例如指纹图像)，并对所述指纹检测信号进行简单的处理。
请继续参见图4，所述指纹识别装置还可以包括至少一个电容器243，所述至少一个电容器243电连接至所述基板231，所述至少一个电容器243用于优化所述指纹传感器芯片233采集的指纹检测信号。例如，所述至少一个电容器243设置在所述柔性电路板239上，并通过所述柔性电路板239电连接至所述基板231，进而电连接至所述指纹传感器芯片233，所述至少一个电容器243可以用于优化所述指纹传感器芯片233采集的指纹检测信号。例如，所述至少一个电容器243用于对所述指纹传感器芯片233采集的指纹检测信号进行滤波处理。其中，所述指纹传感器芯片233可以对应一个或者多个电容器。例如，所述指纹传感器芯片233中的每个芯片对应一个或者多个电容器。
请继续参见图4，所述指纹识别装置还可以连接器242，所述连接器242电连接至所述基板231，例如所述连接器242可以通过所述柔性电路板239电连接至所述基板231。所述连接器242可以用于与外部装置或者所述电子设备的其它部件进行连接，进而实现与所述外部装置的通信或者所述电子设备的其它部件的通信。例如，所述连接器242可以用于连接所述电子设备的处理器，以便于所述电子设备的处理器接收经过所述图像处理器244处理过的指纹检测信号，并基于所述处理过的指纹检测信号进行指纹识别。
应理解，图4仅为本申请的一种示例，不应理解为对本申请的限制。
例如，在一些可替代实施例中，所述指纹传感器芯片233可以设置有硅通孔(Through Silicon Via，TSV)和/或重新布线层(Redistribution Layer，RDL)，所述TSV和/或RDL用于将所述指纹传感器芯片233的引脚从上表面引导至下表面。通过所述TSV和/或RDL，所述指纹传感器芯片233的下表面可以形成有布线层。所述指纹传感器芯片233的下表面的所述布线层通 过金线235可以电连接至所述基板231的第一凹槽2311内的布线层，此时，所述指纹传感器芯片233的外壁可以贴合在所述第一凹槽2311的侧壁，所述指纹传感器芯片233的下表面和所述第一凹槽2311的底部之间可以设置有用于容纳所述金线235的间隙。进一步地，所述指纹传感器芯片233还可以在所述布线层的表面形成保护层，用于保护以及绝缘所述指纹传感器芯片233。
应当理解，所述支架236可以是由具有粘贴性质的材料形成的支架，例如所述支架236可以由双面胶形成的支架，但本申请实施例不限于此。例如，所述支架236也可以是由不具有粘贴性质的材料形成的支架，例如所述支架236的材料包括但不限于金属、树脂、玻纤复合板等，此时需要将支架236固定在所述泡棉层245和所述基板231之间。
图5是图4所示的指纹识别装置的变形结构。
请参见图5，所述支架236可以作为独立部件，即所述指纹识别装置230除了包括所述支架236之外，还可以包括双面胶247和支架固定胶246，其中所述支架236的下表面通过支架固定胶246连接至在所述基板231的上方，所述支架236上表面通过双面胶247连接至所述第一泡棉层245。作为一种可选的实施例，所述支架236和所述支架固定胶246还可以为一体式结构，所述一体式结构作为支架，例如所述支架可以为单面胶形成的支架，用于连接所述基板231，所述支架的上表面通过双面胶247连接至所述第一泡棉层245。
应理解，所述柔性电路板239的金手指2391可以位于所述柔性电路板239的一端，但本申请实施例不限于此。例如，所述柔性电路板239的金手指2391位于所述柔性电路板239的中间位置，或所述柔性电路板239的金手指2391靠近所述柔性电路板239的中间位置。
图6是图4所示的指纹识别装置的另一变形结构。
请继续参见图6，所述柔性电路板239的金手指位于所述柔性电路板239的中间位置，所述柔性电路板239的一端形成有贯通所述柔性电路板239的开口，所述柔性电路板239的开口对准所述第一凹槽2311的开口，使得所述指纹传感器芯片233设置在所述柔性电路板239的开口内。换句话说，所述柔性电路板239的一端2392和所述柔性电路板239的金手指2391之间形成有开口，所述柔性电路板239的开口对准所述第一凹槽2311的开口，使 得所述指纹传感器芯片233设置在所述柔性电路板239的开口内。
这种情况下，在所述指纹传感器芯片233的周围区域，所述柔性电路板239可以通过各方异性导电胶膜241固定在所述基板231的上方。
请继续参见图6，所述柔性电路板的靠近所述指纹传感器芯片233的侧壁对齐所述第一凹槽2311的侧壁，使得所述柔性电路板239和所述指纹传感器芯片233之间存在用于容纳金线235的间隙，所述金线235用于电连接所述指纹传感器芯片233和所述基板231。
通过所述柔性电路板239和所述指纹传感器芯片233之间的间隙，不仅能够用于容纳所述金线235，而且能够用于容纳所述金线的保护胶237，进而保证了所述金线235的导电性和所述指纹识别装置230的性能。
应理解，所述基板231和所述柔性电路板239可以分别具有金手指，进而通过压合各方异性导电胶膜(Anisotropic Conductive Film，ACF)的方式使得所述基板231电连接至所述柔性电路板239，但本申请实施例不限于此。例如，可以集成设置所述基板231和所述柔性电路板239，即基板231和所述柔性电路板239仅可以作为一个部件的两个部分。
图7是图4所示的指纹识别装置的再一变形结构。
请继续参见图7，所述基板231和所述柔性电路板239可以作为软硬结合板的硬板部分和软板部分，即所述第一凹槽2311设置在所述软硬结合板的硬板部分。此时所述硬板部分的上表面可以通过支架236(例如由双面胶形成的支架)固定连接至所述第一泡棉层245的下表面。
应理解，图4至图7仅为本申请的示例，不应理解为对本申请的限制。
例如，以上结合附图详细描述了本申请的优选实施方式，但是，本申请并不限于上述实施方式中的具体细节，在本申请的技术构思范围内，可以对本申请的技术方案进行多种简单变型，这些简单变型均属于本申请的保护范围。例如，在上述具体实施方式中所描述的各个具体技术特征，在不矛盾的情况下，可以通过任何合适的方式进行组合，为了避免不必要的重复，本申请对各种可能的组合方式不再另行说明。又例如，本申请的各种不同的实施方式之间也可以进行任意组合，只要其不违背本申请的思想，其同样应当视为本申请所公开的内容。
举例来说，图5和图7所示的指纹识别装置可以部分结合使用，例如可以将图5中的柔性电路板239和基板231替换为图7的软硬结合板。
本申请还提供了一种电子设备，其包括显示屏和上文涉及的指纹识别装置，所述指纹识别装置设置在所述显示屏下方，且其指纹采集区域至少部分位于所述显示屏的显示区域之中。
结合图3来说，所述电子设备200可以包括中框240。所述中框240用于支撑所述电子设备的显示屏。所述中框240的上表面向下延伸形成有第四凹槽，即所述中框240设置有第四凹槽，所述中框240的凹槽用于容纳所述指纹识别装置230。
进一步地，所述电子设备还可以包括第二泡棉层220。所述第二泡棉层220设置于所述显示屏210的下方，所述第二泡棉层220设置有开窗，所述指纹识别装置230通过所述开窗接收所述显示屏210发出的经由人体手指反射后形成的光信号，所述光信号用于指纹识别。
其中，所述指纹识别装置230中的指纹传感器223与所述显示屏210的下表面之间存在间隙(例如第二泡棉层220的间隙)。其间隙可以是不填充任何辅助材料的空气间隙(air gap)，其可保证在当显示屏受到按压或者电子设备出现跌落或碰撞时均不会出现指纹传感器芯片223接触到显示屏的下表面，也不会影响指纹传感器芯片223的指纹识别的稳定性和性能。
显示屏210可以是采用低温多晶硅技术(Low Temperature Poly-silicon，LTPS)制成的OLED有机发光面板，其厚度超薄、重量轻、低耗电，可以用于提供较为清晰的影像。
第二泡棉层220还可以用作屏幕印刷(screen print)层或压花层，所述屏幕印刷层可以带有图文，所述图文可以用作商标图案等标识。所述第二泡棉层220可以是用于遮蔽光的黑色片状层或者印刷层。在其他实施例中，所述第二泡棉层220还可以称为缓冲(cushion)层、后面板或散热层。
以所述显示屏为OLED屏为例，所述显示屏可以是软屏也可以是硬屏。当手指放于亮屏的OLED屏上方，手指就会反射OLED屏发出的光，此反射光会穿透OLED屏直到OLED屏下方。位于OLED屏下方的光路层能够用于将漏光中的红外信号成分滤除。由于指纹是一个漫反射体，因此，经由手指反射或漫射形成的光信号在各方向都会存在。进一步地，可以在OLED屏下方和指纹传感器芯片之间设置的微透镜阵列(Micro lens Array)，能够收集OLED屏上方漏下来的光信号。由此，所述指纹传感器芯片223通过接收滤除红色光的光信号，进行指纹图像的成像。
需要注意的是，OLED屏上方漏下来的光信号包括指纹信号和屏内部结构信号，而屏内结构信号会对指纹图像的成像产生影响，例如，在进行指纹图像的成像时产生摩尔条纹。本实施例中，通过控制泡棉层222及各零件的厚度，可以使得所述指纹传感器芯片223和OLED屏(例如，所述显示屏210的下表面)的距离在某一阈值(例如600um)以内，进而使的屏结构的成像模糊，但指纹的结构的成像不受影响。由于所述指纹传感器芯片223和OLED屏之间的距离越小，指纹识别性能越好，因此在可靠性和制程能力允许的前提下，可以尽量缩小所述指纹传感器芯片223和OLED屏之间的距离。
应理解，本申请实施例中的具体的例子只是为了帮助本领域技术人员更好地理解本申请实施例，而非限制本申请实施例的范围。
应理解，在本申请实施例和所附权利要求书中使用的术语是仅仅出于描述特定实施例的目的，而非旨在限制本申请实施例。例如，在本申请实施例和所附权利要求书中所使用的单数形式的“一种”、“上述”和“所述”也旨在包括多数形式，除非上下文清楚地表示其他含义。
本领域普通技术人员可以意识到，结合本文中所公开的实施例描述的各示例的元件，能够以电子硬件、计算机软件或者二者的结合来实现，为了清楚地说明硬件和软件的可互换性，在上述说明中已经按照功能一般性地描述了各示例的组成及步骤。这些功能究竟以硬件还是软件方式来执行，取决于技术方案的特定应用和设计约束条件。专业技术人员可以对每个特定的应用来使用不同方法来实现所描述的功能，但是这种实现不应认为超出本申请的范围。
在本申请所提供的几个实施例中，应所述理解到，所揭露的***、装置，可以通过其它的方式实现。例如，以上所描述的装置实施例仅仅是示意性的，例如，所述元件的划分，仅仅为一种逻辑功能划分，实际实现时可以有另外的划分方式，例如多个元件或组件可以结合或者可以集成到另一个***，或一些特征可以忽略，或不执行。另外，所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口、装置或元件的间接耦合或通信连接，也可以是电的，机械的或其它的形式连接。
上文涉及的各功能元件可以集成设置，也可以是各个元件单独物理存在。各功能元件既可以采用硬件的形式实现，也可以采用软件功能单元的形式实现。如果以软件功能单元的形式实现并作为独立的产品销售或使用时，可以 存储在一个计算机可读取存储介质中。基于这样的理解，本申请的技术方案本质上或者说对现有技术做出贡献的部分，或者所述技术方案的全部或部分可以以软件产品的形式体现出来，所述计算机软件产品存储在一个存储介质中，包括若干指令用以使得一台计算机设备(可以是个人计算机，服务器，或者网络设备等)执行本申请各个实施例所述方法的全部或部分步骤。而前述的存储介质包括：U盘、移动硬盘、只读存储器(ROM，Read-Only Memory)、随机存取存储器(RAM，Random Access Memory)、磁碟或者光盘等各种可以存储程序代码的介质。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (36)

  1. 一种指纹识别装置，其特征在于，适用于具有显示屏的电子设备，所述指纹识别装置包括：
    指纹传感器芯片；
    基板，所述基板的上表面向下延伸形成有第一凹槽，所述指纹传感器芯片的至少一部分设置在所述第一凹槽内，并电连接至所述基板；
    其中，所述指纹传感器芯片通过所述基板设置在所述显示屏的下方，所述指纹传感器芯片用于接收经由所述显示屏上方的人体手指反射或散射而返回的指纹检测信号，并基于所述指纹检测信号检测所述手指的指纹信息。
  2. 根据权利要求1所述的指纹识别装置，其特征在于，所述第一凹槽的尺寸大于所述指纹传感器芯片的尺寸，使得所述指纹传感器芯片的侧壁和所述第一凹槽的侧壁之间存在用于容纳金线的间隙，所述金线用于电连接所述指纹传感器芯片和所述基板。
  3. 根据权利要求1或2所述的指纹识别装置，其特征在于，所述第一凹槽的深度包括所述基板的覆盖膜的厚度和位于所述覆盖膜下方的导电层的厚度。
  4. 根据权利要求1至3中任一项所述的指纹识别装置，其特征在于，所述指纹识别装置还包括：
    支架，所述支架围绕所述指纹传感器芯片设置在所述基板的上方；
    第一泡棉层，所述第一泡棉层设置在所述支架的上方，所述第一泡棉层设置有贯通所述第一泡棉层的开口，所述指纹传感器芯片通过所述第一泡棉层的开口接收经由所述手指反射或散射而返回的指纹检测信号。
  5. 根据权利要求4所述的指纹识别装置，其特征在于，所述支架的下表面通过支架固定胶连接至在所述基板的上方，所述支架上表面通过双面胶连接至所述第一泡棉层。
  6. 根据权利要求4所述的指纹识别装置，其特征在于，所述支架为双面胶形成的支架，用于连接所述基板和所述第一泡棉层。
  7. 根据权利要求4所述的指纹识别装置，其特征在于，所述支架的靠近所述指纹传感器芯片的侧壁对齐所述第一凹槽的侧壁，使得所述支架和所述指纹传感器芯片之间存在用于容纳金线的间隙，所述金线用于电连接所述指 纹传感器芯片和所述基板。
  8. 根据权利要求4所述的指纹识别装置，其特征在于，所述支架的厚度为0.05mm～0.1mm。
  9. 根据权利要求1至8中任一项所述的指纹识别装置，其特征在于，所述指纹传感器芯片通过指纹传感器芯片固定胶固定在所述第一凹槽内。
  10. 根据权利要求1至9中任一项所述的指纹识别装置，其特征在于，所述基板的上表面在所述第一凹槽的一侧形成所述基板的金手指。
  11. 根据权利要求10所述的指纹识别装置，其特征在于，所述基板的金手指的上表面与所述基板的上表面形成第一台阶，所述第一台阶的厚度包括所述基板的位于覆盖层下方的导电层的厚度。
  12. 根据权利要求10所述的指纹识别装置，其特征在于，所述基板的上表面在第一区域向下延伸形成有第二凹槽，所述基板的上表面在第二区域与所述基板的金手指的上表面形成第二台阶，所述第一区域为所述基板的金手指靠近所述第一凹槽的一侧所在的区域，所述第二区域为所述基板的金手指远离所述第一凹槽的一侧所在的区域。
  13. 根据权利要求12所述的指纹识别装置，其特征在于，所述第二凹槽的深度包括所述基板的覆盖层和位于所述覆盖层下方的导电层的厚度，所述第二台阶的厚度为所述基板的位于覆盖层下方的导电层的厚度。
  14. 根据权利要求10所述的指纹识别装置，其特征在于，所述指纹识别装置还包括：
    柔性电路板，所述柔性电路板形成有所述柔性电路板的金手指；
    各向异性导电胶膜，所述柔性电路板的金手指通过所述各向异性导电胶膜电连接至所述基板的金手指。
  15. 根据权利要求14所述的指纹识别装置，其特征在于，所述柔性电路板的下表面在第三区域向上延伸形成有第三凹槽，所述柔性电路板的下表面在第二区域与所述柔性电路板的金手指的下表面形成第三台阶，所述第三区域为所述柔性电路板的金手指远离所述第一凹槽的一侧所在的区域，所述第二区域为所述柔性电路板的金手指靠近所述第一凹槽的一侧所在的区域。
  16. 根据权利要求14或15所述的指纹识别装置，其特征在于，所述柔性电路板的金手指位于所述柔性电路板的一端。
  17. 根据权利要求14或15所述的指纹识别装置，其特征在于，所述柔 性电路板的金手指位于所述柔性电路板的中间位置，所述柔性电路板的一端形成有贯通所述柔性电路板的开口，所述柔性电路板的开口对准所述第一凹槽的开口，使得所述指纹传感器芯片设置在所述柔性电路板的开口内。
  18. 根据权利要求17所述的指纹识别装置，其特征在于，所述柔性电路板的靠近所述指纹传感器芯片的侧壁对齐所述第一凹槽的侧壁，使得所述柔性电路板和所述指纹传感器芯片之间存在用于容纳金线的间隙，所述金线用于电连接所述指纹传感器芯片和所述基板。
  19. 根据权利要求1至18中任一项所述的指纹识别装置，其特征在于，所述基板为软硬结合板的硬板部分。
  20. 根据权利要求19所述的指纹识别装置，其特征在于，所述第一凹槽的深度包括所述基板的覆盖膜的厚度和位于所述覆盖膜下方的至少两层导电层的厚度。
  21. 根据权利要求1至20中任一项所述的指纹识别装置，其特征在于，所述指纹识别装置还包括：
    金线，所述指纹传感器芯片通过所述金线电连接至所述基板；
    金线保护胶，所述金线保护胶用于封装所述金线。
  22. 根据权利要求21所述的指纹识别装置，其特征在于，所述金线的弧高或封装高度小于150um。
  23. 根据权利要求1至22中任一项所述的指纹识别装置，其特征在于，所述指纹识别装置还包括：
    光路层，所述光路层设置在所述指纹传感器芯片的上方，所述光路层用于将经由所述手指反射或散射而返回的指纹检测信号传输至所述指纹传感器芯片。
  24. 根据权利要求23所述的指纹识别装置，其特征在于，所述光路层包括微透镜层和挡光层，所述微透镜层具有由多个微透镜形成的微透镜阵列，所述挡光层具有多个微孔并设置在所述微透镜层的下方，并且所述微孔与所述微透镜一一对应。
  25. 根据权利要求24所述的指纹识别装置，其特征在于，所述光路层还包括滤光片，所述滤光片设置在所述微透镜层上方或者设置在所述微透镜层和所述指纹传感器芯片之间的光路中。
  26. 根据权利要求1至25中任一项所述的指纹识别装置，其特征在于， 所述指纹传感器芯片包括多个光学指纹传感器芯片，所述多个光学指纹传感器芯片并排设置在所述第一凹槽内，以拼接成一个光学指纹传感器芯片组件。
  27. 根据权利要求1至26中任一项所述的指纹识别装置，其特征在于，所述指纹识别装置还包括：
    图像处理器，所述图像处理器电连接至所述基板。
  28. 根据权利要求1至27中任一项所述的指纹识别装置，其特征在于，所述指纹识别装置还包括：
    至少一个电容器，所述至少一个电容器电连接至所述基板，所述至少一个电容器用于优化所述指纹传感器芯片采集的指纹检测信号。
  29. 根据权利要求1至28中任一项所述的指纹识别装置，其特征在于，所述指纹识别装置还包括：
    连接器，所述连接器电连接至所述基板，所述连接器用于与外部装置或者所述电子设备的其它部件进行连接。
  30. 根据权利要求1至29中任一项所述的指纹识别装置，其特征在于，所述显示屏的发光层的下表面与所述指纹传感器芯片的上表面之间的距离小于600um。
  31. 根据权利要求1至30中任一项所述的指纹识别装置，其特征在于，所述基板的厚度的范围为0.1mm～0.4mm。
  32. 根据权利要求1至31中任一项所述的指纹识别装置，所述显示屏的下方设置有第二泡棉层，所述第二泡棉层设置有贯通所述第二泡棉层的开孔，所述指纹传感器芯片设置在所述第二泡棉层的开孔的下方。
  33. 根据权利要求1至32中任一项所述的指纹识别装置，其特征在于，所述电子设备的中框设置有第四凹槽，所述基板的至少一部分设置在所述第四凹槽内。
  34. 一种电子设备，其特征在于，包括：
    显示屏；
    指纹识别装置，设置在所述显示屏下方，所述指纹识别装置为如权利要求1至33中任一项所述的指纹识别装置，且其指纹采集区域至少部分位于所述显示屏的显示区域之中。
  35. 根据权利要求34所述的电子设备，其特征在于，所述电子设备还包括：
    第二泡棉层，所述第二泡棉层设置在所述显示屏的下方，所述第二泡棉层设置有贯通所述第二泡棉层的开孔，所述指纹传感器芯片设置在所述第二泡棉层的开孔的下方。
  36. 根据权利要求34或35所述的电子设备，其特征在于，所述电子设备还包括：
    中框，所述中框设置有第四凹槽，所述指纹识别装置的至少一部分设置在所述第四凹槽内。
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CN208836251U (zh) * 2018-09-25 2019-05-07 深圳市汇顶科技股份有限公司 光学图像采集装置和电子设备
CN109716351A (zh) * 2018-12-13 2019-05-03 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备
CN109791611A (zh) * 2018-12-29 2019-05-21 深圳市汇顶科技股份有限公司 指纹识别装置和电子设备

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