CN109508607A - 光学指纹识别组件和电子装置 - Google Patents
光学指纹识别组件和电子装置 Download PDFInfo
- Publication number
- CN109508607A CN109508607A CN201710850419.XA CN201710850419A CN109508607A CN 109508607 A CN109508607 A CN 109508607A CN 201710850419 A CN201710850419 A CN 201710850419A CN 109508607 A CN109508607 A CN 109508607A
- Authority
- CN
- China
- Prior art keywords
- optical
- finger print
- layer
- recognizer component
- optical finger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710850419.XA CN109508607A (zh) | 2017-09-15 | 2017-09-15 | 光学指纹识别组件和电子装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201710850419.XA CN109508607A (zh) | 2017-09-15 | 2017-09-15 | 光学指纹识别组件和电子装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN109508607A true CN109508607A (zh) | 2019-03-22 |
Family
ID=65745291
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201710850419.XA Withdrawn CN109508607A (zh) | 2017-09-15 | 2017-09-15 | 光学指纹识别组件和电子装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109508607A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110738939A (zh) * | 2019-10-31 | 2020-01-31 | 维沃移动通信有限公司 | 电子设备 |
WO2020237546A1 (zh) * | 2019-05-29 | 2020-12-03 | 深圳市汇顶科技股份有限公司 | 指纹识别装置和电子设备 |
-
2017
- 2017-09-15 CN CN201710850419.XA patent/CN109508607A/zh not_active Withdrawn
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020237546A1 (zh) * | 2019-05-29 | 2020-12-03 | 深圳市汇顶科技股份有限公司 | 指纹识别装置和电子设备 |
US11062117B2 (en) | 2019-05-29 | 2021-07-13 | Shenzhen GOODIX Technology Co., Ltd. | Fingerprint identification apparatus and electronic device |
US11663846B2 (en) | 2019-05-29 | 2023-05-30 | Shenzhen GOODIX Technology Co., Ltd. | Fingerprint identification apparatus and electronic device |
CN110738939A (zh) * | 2019-10-31 | 2020-01-31 | 维沃移动通信有限公司 | 电子设备 |
CN110738939B (zh) * | 2019-10-31 | 2021-10-15 | 维沃移动通信有限公司 | 电子设备 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Applicant after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330013 No.698 Tianxiang Avenue, high tech Zone, Nanchang City, Jiangxi Province Applicant before: OFilm Microelectronics Technology Co.,Ltd. |
|
CB02 | Change of applicant information | ||
WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190322 |
|
WW01 | Invention patent application withdrawn after publication |