WO2020164595A1 - 一种为晶圆填充玻璃粉的装置 - Google Patents

一种为晶圆填充玻璃粉的装置 Download PDF

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Publication number
WO2020164595A1
WO2020164595A1 PCT/CN2020/075300 CN2020075300W WO2020164595A1 WO 2020164595 A1 WO2020164595 A1 WO 2020164595A1 CN 2020075300 W CN2020075300 W CN 2020075300W WO 2020164595 A1 WO2020164595 A1 WO 2020164595A1
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WO
WIPO (PCT)
Prior art keywords
scraper
glass powder
wafer
loading
reclaiming
Prior art date
Application number
PCT/CN2020/075300
Other languages
English (en)
French (fr)
Inventor
***
Original Assignee
山东才聚电子科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 山东才聚电子科技有限公司 filed Critical 山东才聚电子科技有限公司
Priority to EP20755131.8A priority Critical patent/EP3926666B1/en
Priority to KR1020217024730A priority patent/KR102551148B1/ko
Priority to JP2021547402A priority patent/JP7076650B2/ja
Priority to US17/429,339 priority patent/US11972959B2/en
Publication of WO2020164595A1 publication Critical patent/WO2020164595A1/zh
Priority to JP2022080381A priority patent/JP7300539B2/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G53/00—Conveying materials in bulk through troughs, pipes or tubes by floating the materials or by flow of gas, liquid or foam
    • B65G53/04—Conveying materials in bulk pneumatically through pipes or tubes; Air slides
    • B65G53/24—Gas suction systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Definitions

  • a device for filling wafers with glass powder belongs to the technical field of electronic component production equipment.
  • Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called wafer; it can be processed into various circuit component structures on silicon wafers, and become integrated with specific electrical functions. Circuit products. In the process of producing electronic components from wafers, glass powder needs to be coated on the wafer to ensure that a glass protective layer can be formed on the side of the chip after cutting.
  • the application of glass powder on wafers is mostly done manually.
  • the glass powder is manually mixed with water, and then the mixed glass powder is applied to the wafer.
  • the painting speed of this method is low, which affects the production speed of the product, the production cost of the product is high, and the quality of the glass powder painting depends on the labor ability of the workers, and the painting stability is poor, resulting in electronic components
  • the low pass rate of the product further increases the production cost of the product.
  • the technical problem to be solved by the present invention is to overcome the shortcomings of the prior art and provide a device capable of automatically coating wafers with glass powder and with stable coating quality for filling wafers with glass powder.
  • the device for filling glass powder for wafers is characterized in that it includes a supporting device for supporting the wafer, a feeding device and a scraping device, and the feeding device
  • the device and the scraping device are both arranged on the upper side of the supporting device, the lower side of the feeding device is equipped with a reclaiming part and drives the reclaiming part to move, and the lower side of the scraping device is installed with a scraper and drives the scraper to move.
  • the reclaiming part includes a reclaiming pipe, a suction rod, and a reclaiming cylinder.
  • One end of the suction rod extends into the reclaiming pipe, and the suction rod and the reclaiming pipe are slidably and sealedly connected.
  • the reclaiming cylinder Installed on the feeding device, the reclaiming cylinder is installed on the feeding device, the reclaiming cylinder is connected with the suction rod and drives the axial movement.
  • the reclaiming pipe is arranged vertically, the outer diameter of the lower end of the reclaiming pipe is smaller than the outer diameter of the middle part, and a suction part is formed at the lower end of the reclaiming pipe.
  • the feeding device includes a feeding translation device and a feeding lifting device, the feeding lifting device is installed on the feeding translation device, and the reclaiming part is provided on the feeding lifting device.
  • the scraper is installed on the scraping device through a scraper holder, the upper part of the scraper is slidably connected with the scraper holder, and a buffer spring is arranged between the scraper and the scraper holder.
  • a scraper clamp is fixed on the upper side of the scraper, the two ends of the scraper clamp are symmetrically provided with mounting pins, both sides of the scraper frame are provided with long installation holes that match the mounting pins on the corresponding side, and the upper part of the scraper clamp slides It is arranged in the scraper holder, and the buffer spring is arranged between the scraper clamp and the scraper holder.
  • both sides of the scraper clamping plate are spaced apart from the scraper frame.
  • one side of the scraper is provided with a V-shaped knife, the opening of the V-shaped knife is arranged upward, and the V-shaped knife is arranged perpendicular to the scraper.
  • the supporting device includes a feeding supporting device and a scraping supporting device
  • the feeding device is arranged on the upper side of the feeding supporting device
  • the scraping device is arranged on the lower side of the scraping supporting device.
  • the loading supporting device includes a tray and a loading rotating motor.
  • the tray is arranged horizontally.
  • the loading rotating motor is connected to the tray and drives it to rotate.
  • a plurality of suction grooves are provided on the upper side of the tray, and the suction grooves are connected with suction grooves. Negative pressure device.
  • the loading support device further includes a loading tray lifting cylinder
  • the tray includes an annular fixed portion and a lifting portion arranged coaxially with the fixed portion
  • the piston rod of the loading tray lifting cylinder is arranged on the lower side of the lifting portion
  • the piston rod of the lifting cylinder of the loading tray is connected with the lifting part and pushes it to lift.
  • the present invention has the following beneficial effects:
  • the loading device which is a device for filling glass powder on a wafer, evenly places the glass powder on the wafer through the reclaiming part, and the scraper device removes the excess glass powder on the wafer through a squeegee, thereby ensuring the wafer
  • the amount of glass powder on the surface is moderate to avoid the problem of excessive glass powder and complicated post-processing technology. It can also avoid the problem of uneven glass powder distribution.
  • the glass powder coating speed is fast, and the coating quality is stable, which improves The qualification rate of electronic components is reduced, and the production cost of the product is reduced.
  • the reclaiming cylinder drives the reclaiming rod to move axially, thereby sucking the glass powder into the reclaiming tube, and can transfer the glass powder in the reclaiming tube to the wafer evenly, which is convenient for reclaiming and the amount of reclaiming is easy Control and avoid too much glass powder.
  • the lower end of the reclaiming pipe is provided with a reclaiming part, which can not only absorb the glass powder conveniently, but also facilitate the accurate placement of the glass powder on the wafer.
  • the loading lifting device drives the suction part to lift, and the loading translation mechanism drives the loading lifting device to move, so as to facilitate the loading part to complete the action of transferring the glass powder to the wafer, and the action is flexible.
  • a buffer spring is arranged between the squeegee and the squeegee holder to ensure that the squeegee is directly attached to the wafer reliably, thereby ensuring that the excess glass powder on the wafer is scraped off, and it can also prevent the squeegee from damaging the wafer.
  • the buffer spring is arranged between the scraper clamp and the scraper frame, which makes the scraper easy to disassemble and assemble.
  • the installation pins at both ends of the scraper clamp match the installation long holes on the corresponding side to realize the guiding of the scraper.
  • Both sides of the squeegee clamp plate are spaced apart from the squeegee holder, so that the squeegee will form an acute angle with the wafer when scraping the glass powder on the wafer, avoiding the squeegee and the wafer from damaging the wafer perpendicularly, and ensuring that the excess glass is removed Powder scrape.
  • the V-shaped knife can cooperate with the scraper to remove the glued glass powder on the scraper, and the V-shaped knife can concentrate the removed glass powder in the middle, which facilitates the recycling and reuse of the removed glass powder and reduces the production cost.
  • the combination of the feeding supporting device and the feeding device realizes the uniform delivery of the glass powder to the wafer, and the scraping device and the scraping supporting device cooperate to scrape off the excess glass powder on the wafer , So that the work between the scraping device and the feeding device does not interfere with each other, and the work efficiency is improved.
  • the suction grooves can not only hold the wafer, but also ensure the flatness of the wafer, which is convenient for placing the glass powder on the wafer evenly.
  • the tray is connected with a loading rotation that drives its rotation. The motor can rotate the wafer so that the glass powder on the wafer is evenly distributed on the wafer under the action of centrifugal force.
  • the loading tray lifting cylinder is connected with the lifting part and pushes the lifting part to lift, which facilitates the picking and placement of wafers, and also facilitates the cooperation of the tray and the robot to realize the automatic transfer of wafers.
  • FIG. 1 is a perspective view of a device for filling glass powder with a wafer.
  • FIG. 2 is a schematic top view of a device for filling glass powder with a wafer.
  • FIG. 3 is a three-dimensional schematic diagram of the wafer cassette lifting device.
  • Figure 4 is a three-dimensional schematic diagram of the wafer cassette.
  • Figure 5 is a three-dimensional schematic diagram of a feeding manipulator and a discharging manipulator.
  • Figure 6 is a three-dimensional schematic diagram of the centering mechanism.
  • Figure 7 is a schematic front view of the feeding device.
  • Fig. 8 is a front sectional view of the mating of the reclaiming pipe and the suction rod.
  • Fig. 9 is a three-dimensional schematic diagram of a glass powder stirring device and a feeding supporting device.
  • Fig. 10 is a partial enlarged view of A in Fig. 9.
  • Figure 11 is a schematic front view of the scraping device.
  • Figure 12 is a three-dimensional schematic diagram of the scraper and the scraper holder.
  • Fig. 13 is a left side sectional view of the cooperation between the scraper and the scraper holder.
  • Figure 14 is a schematic diagram of the installation of the V-shaped knife.
  • Figure 15 is a three-dimensional schematic diagram of the scraper supporting device.
  • Figure 16 is a front sectional view of the tray connecting pipe.
  • FIGS 1-16 are the best embodiments of the present invention, and the present invention will be further described with reference to Figures 1-16.
  • a device for filling a wafer with glass powder including a supporting device for supporting the wafer, a loading device 5, and a scraping device 6.
  • the loading device 5 and the scraping device 6 are both arranged on the upper side of the supporting device ,
  • the lower side of the feeding device 5 is provided with a reclaimer and drives the reclaimer to move, and the lower side of the scraping device 6 is provided with a scraper 43 and drives the scraper 43 to move.
  • the loading device 5 which is a device for filling glass powder on a wafer, evenly places the glass powder on the wafer through the unloading part, and the scraper device 6 removes the excess glass powder on the wafer through a squeegee 43, thereby ensuring the crystal
  • the amount of glass powder on the circle is moderate to avoid the problem of excessive glass powder, which makes the later processing technology complicated, and can also avoid the problem of uneven glass powder distribution.
  • the glass powder coating speed is fast, and the coating quality is stable, which improves The pass rate of electronic components is improved, and the production cost of the product is reduced.
  • the feeding device 5 is installed on the upper side of the frame 1 through the feeding gantry 25
  • the scraping device 6 is installed on the upper side of the frame 1 through the scraping gantry 39
  • the feeding gantry The frame 25 and the scraper gantry 39 are arranged in parallel and spaced apart.
  • the supporting device includes a loading supporting device 10 and a scraping supporting device 12.
  • the loading supporting device 10 and the scraping supporting device 12 are both installed on the upper side of the frame 1, and the loading supporting device 10 is installed on the upper side.
  • the scraping supporting device 12 is arranged directly under the scraping device 6, thereby separating the work of the feeding device 5 and the scraping device 6 and avoiding the feeding device 5 and the scraping device 6 The work hinders each other and improves work efficiency.
  • the device for filling glass powder for wafers also includes a wafer cassette lifting device, a centering device, a glass powder stirring device 9, a conveyor belt 7, a feeding manipulator 3, a discharging manipulator 8 and a drying device installed on the rack 1.
  • the cassette lifting device and the conveyor belt 7 are symmetrically arranged on both sides of the frame 1.
  • the feeding gantry 25 and the scraping gantry 39 are arranged between the wafer cassette lifting device and the conveyor belt 7, and the wafer
  • the cassette lifting device is arranged close to the loading gantry 25, the centering device is provided between the wafer cassette lifting device and the loading gantry 25, the drying bin 2 is arranged outside the middle of the conveyor belt 7, and the drying bin 2
  • the upper side is provided with an air inlet pipe, so that hot air can be fed into the drying bin 2, and the wafers in the drying bin 2 can be dried by the hot air, and a heating plate can also be provided in the drying bin 2.
  • the feeding robot 3 is arranged on the side of the feeding gantry 25, and the discharging robot 8 is arranged on the side of the scraping gantry 39, thereby completing the wafer transfer action.
  • the glass powder stirring device 9 is arranged on one side of the loading supporting device 10 so as to facilitate the loading device 5 to transport the glass powder in the glass powder stirring device 9 to the wafer on the loading supporting device 10.
  • the lower side of the input end of the conveyor belt 7 is provided with a wafer lifting cylinder, the piston rod of the wafer lifting cylinder is arranged vertically upward, the upper side of the wafer lifting cylinder is provided with a wafer carrier, and the discharging robot 8 places the wafers On the wafer carrier, the wafer is placed on the conveyor belt 7 through the wafer lifting cylinder.
  • the centering device is used for wafer centering to ensure accurate glass frit feeding.
  • the feeding robot 3 is used to transfer the wafer between the wafer cassette, the centering device and the feeding support device 10, and the discharging robot 8 It is used to transfer wafers between the loading support device 10, the scraping support device 12 and the conveyor belt 7.
  • the feeding robot 3 and the discharging robot 8 work independently, which improves the work efficiency.
  • the cassette lifting device includes a cassette lifting frame 14 and a cassette lifting motor 13.
  • a vertical wafer cassette lifting rail is provided on the frame 1, and the cassette lifting frame 14 is slidably mounted on
  • a plurality of vertically arranged cassette support rods 15 are provided on the upper side of the wafer cassette lifting frame 14, and the upper side of the wafer cassette support rod 15 is provided with a cassette support plate.
  • the cassette 4 is detachably installed on the upper side of the cassette support plate, the cassette lifting frame 14 is arranged in the middle and lower part of the rack 1, and the cassette support rod 15 is slidably connected to the rack 1.
  • the output shaft of the cassette lifting motor 13 faces upwards and is arranged on the lower side of the cassette lifting frame 14.
  • a lifting screw is rotatably installed on the frame 1.
  • the lifting screw is arranged vertically, and the lifting screw and the cassette lifting motor 13
  • the output shaft of the wafer cassette is coaxially connected and keeps synchronous rotation.
  • the wafer cassette lifting frame 14 is provided with a lifting nut matching the lifting screw, so as to realize the lifting of the wafer cassette lifting frame 14 and facilitate the control of the lifting of the wafer cassette 4. Moreover, it is convenient to accurately control the lifting distance of the wafer cassette 4.
  • the wafer cassette 4 is a rectangular parallelepiped box with open front and rear sides. The distance between the left and right sides of the wafer cassette 4 gradually increases from back to front. A plurality of supporting grooves 401 are provided at intervals from bottom to top, and the corresponding supporting grooves 401 on both sides of the wafer cassette 4 cooperate to support the wafer.
  • the upper side of the frame 1 is provided with a manipulator translation guide rail 17, the manipulator translation guide rail 17 is perpendicular to the plane where the feeding gantry 25 is located, and the manipulator translation guide rail 17 is horizontally provided with two. Both the feeding manipulator 3 and the discharging manipulator 8 are slidably mounted on the translation guide rail 17 of the manipulator.
  • the feeding robot 3 includes a feeding translation frame 16, a feeding cylinder 18, and a wafer pallet 19.
  • the feeding translation frame 16 is slidably mounted on the robot translation guide rail 17, and the feeding translation frame 16 is connected with a feeding linear motor.
  • the linear motor is arranged on the lower side of the feeding translation frame 16, and the feeding linear motor is connected to the feeding translation frame 16 and drives it to translate.
  • the feeding cylinder 18 is installed on the upper side of the feeding translation frame 16, and the feeding cylinder 18
  • the piston rod is set toward one side of the wafer cassette 4, the piston rod of the feed cylinder 18 is perpendicular to the manipulator translation rail 17, and the wafer pallet 19 is installed on the piston rod of the feed cylinder 18 to realize the picking and placing of wafers. .
  • the discharging manipulator 8 includes a discharging translation frame 20, a discharging cylinder 21, and a wafer pallet 19.
  • the discharging translation frame 20 is slidably mounted on the manipulator translation guide rail 17, and the discharging translation frame 20 is connected with a discharging linear motor.
  • the linear motor is arranged on the lower side of the discharging translation frame 20.
  • the discharging linear motor is connected to the discharging translation frame 20 and drives it to translate.
  • the discharging cylinder 21 is installed on the upper side of the discharging translation frame 20, and the discharging cylinder 21
  • the piston rod is arranged toward one side of the conveyor belt 7, the piston rod of the discharging cylinder 21 is arranged perpendicular to the manipulator translation rail 17, and the wafer pallet 19 is installed on the piston rod of the discharging cylinder 21 to realize the picking and placing of wafers.
  • the discharging translation frame 20 is arranged on the side of the feeding translation frame 16 close to the conveyor belt 7.
  • the wafer pallet 19 is circular, and one side of the wafer pallet 19 is provided with a connecting part for connecting with the piston rod of the feed cylinder 18 or the piston rod of the discharge cylinder 21, and the upper side of the wafer pallet 19
  • a suction hole is provided, and a negative pressure suction device is connected to the suction hole to suck the wafer and prevent the wafer from being separated from the wafer pallet 19.
  • the negative pressure pumping device is a vacuum pump.
  • the side of the wafer pallet 19 away from the robot translation rail 17 is provided with a recessed recess 1901 in the middle, so as to facilitate pushing the wafer away from the wafer pallet 19 and also facilitate the wafer pallet 19 to suck the wafer.
  • the centering device includes a centering lift cylinder 22, a centering cylinder 23, and a centering die 24.
  • the centering lift cylinder 22 is installed on the frame 1, and the piston rod of the centering lift cylinder 22 faces upward.
  • the centering cylinder 23 is installed on the piston rod of the centering lifting cylinder 22, the centering cylinder 23 is installed vertically, and the centering die 24 is installed on the centering cylinder 23.
  • the centering die 24 includes two pairs arranged side by side. In the middle plate, the adjacent sides of the two pairs of middle plates are provided with an arc-shaped inner concave part with a middle concave.
  • the centering cylinder 23 is connected with the centering plates on both sides at the same time and pushes the two centering plates to move in opposite directions synchronously. In this way, the centering of the wafer is completed, and subsequent wafer processing is facilitated.
  • the centering cylinder 23 can be realized by using two cylinders, and the two cylinders are respectively connected to the centering plate on the corresponding side and push the centering plate to translate.
  • the feeding device 5 includes a feeding translation device and a feeding lifting device.
  • the feeding translation device is installed on the feeding gantry 25, and the feeding lifting device is slidably installed on the feeding gantry 25, The feeding translation device is connected with the feeding lifting device to push it to move along the feeding gantry 25, and the lower side of the feeding lifting device is provided with a reclaiming part.
  • the feeding lifting device includes a reclaiming lifting cylinder 27 and a feeding translation frame.
  • the upper side of the feeding gantry 25 is equipped with a feeding translation guide rail.
  • the feeding translation guide rail is perpendicular to the manipulator translation guide rail 17 and arranged horizontally.
  • the feeding translation rack slides Installed on the feeding translational guide, the feeding translational device is a feeding translational cylinder 26, the feeding translational cylinder 26 is arranged parallel to the feeding translational guide, the piston rod of the feeding translational cylinder 26 is connected with the feeding translational frame and pushes it to translate .
  • the piston rod of the reclaiming lifting cylinder 27 is vertically arranged downwards, the piston rod of the reclaiming lifting cylinder 27 is equipped with a reclaiming rack, and the reclaiming part is installed on the reclaiming rack, thereby realizing the mixing of the glass powder stirring device 9
  • the glass powder is transferred to the wafer on the upper side of the loading supporting device 10.
  • the reclaiming part includes a reclaiming cylinder 28, a reclaiming tube 29, and a suction rod 30.
  • the reclaiming cylinder 28 is installed on the reclaiming rack and moves up and down synchronously with the reclaiming rack.
  • the piston rod of the reclaiming cylinder 28 is set downwards to take the material.
  • the tube 29 is vertically installed on the reclaiming rack, the lower end of the suction rod 30 slides into the reclaiming tube 29, the suction rod 30 is connected to the inner wall of the reclaiming tube 29 in a sealed manner, and the upper end of the suction rod 30 is connected to the reclaiming tube.
  • the piston rod of the cylinder 28 is connected and moves synchronously with it, so that the glass powder can be sucked by the cooperation of the take-out tube 29 and the suction rod 30, and it is also convenient to transfer the glass powder to the wafer.
  • the outer diameter of the lower end of the reclaiming pipe 29 is smaller than the outer diameter of the middle part, so that a suction part 2901 is formed at the lower end of the reclaiming pipe 29, which facilitates the suction of the glass powder and facilitates the accurate transfer of the glass powder to the designated position of the wafer .
  • the glass powder stirring device 9 includes a stirring cylinder 34, a trough 35 and a stirring block 38.
  • the trough 35 is a semi-cylindrical concave in the middle, the trough 35 is horizontally arranged, and the trough 35 is installed on the upper side
  • the piston rod of the stirring cylinder 34 is connected with the stirring shaft 36 and pushes the stirring shaft 36 to reciprocate.
  • Both ends of the stirring shaft 36 are symmetrically provided with stirring connecting rods 37, the stirring connecting rod 37 is arranged in the trough 35, one end of the stirring connecting rod 37 is connected with the stirring shaft 36 and oscillating synchronously with the rotation of the stirring shaft 36, and the stirring block 38 is arranged At the bottom of the trough 35, the stirring block 38 is arranged between the two stirring connecting rods 37, and the two sides of the stirring block 38 are respectively fixedly connected with the corresponding stirring connecting rods 37, so that the glass powder is stirred by the stirring block 38. Since the glass powder is insoluble in water, the stirring block 38 stirs the glass powder at all times to prevent the glass powder from sinking to the bottom of the water, resulting in uneven mixing of the glass powder and water.
  • One side of the stirring block 38 is provided with a reclaiming port with a concave central part.
  • the reclaiming port of the stirring block 38 is just facing upwards to facilitate the taking pipe
  • the reclaiming action of 29 also facilitates the control of the amount of glass powder.
  • the feeding supporting device 10 includes a feeding tray lifting cylinder 31, a feeding rotating motor 32, and a tray 33.
  • the piston rod of the feeding tray lifting cylinder 31 is vertically installed on the frame 1 and the feeding rotating motor 32 is installed on the frame 1.
  • the stopper tube is a vertical cylinder, and the upper end of the stopper tube is open.
  • the diameter of is greater than the diameter of the tray 33, and the tray 33 is rotatably arranged in the blocking cylinder.
  • the loading tray lifting cylinder 31 is arranged directly below the tray 33.
  • the piston rod of the loading tray lifting cylinder 31 is connected to the tray 33 through the tray connecting pipe 49 and pushes the tray 33 up and down.
  • the tray connecting pipe 49 is connected to the loading tray lifting cylinder 31.
  • the piston rod is rotationally connected, and the loading rotating motor 32 is connected to the tray connecting pipe 49 through a timing belt, thereby realizing the rotation of the tray 33.
  • the centrifugal force can evenly distribute the glass powder on the entire wafer. Block the effect of glass powder.
  • the tray 33 includes an annular fixed part and a lifting part 3301 arranged coaxially with the fixed part.
  • the lifting part 3301 is arranged in the fixed part and forms a completed disc with the fixed part.
  • the piston rod of the feeding tray lifting cylinder 31 and the lifting part 3301 The part 3301 is connected and pushes it up and down, so as to cooperate with the wafer pallet 19 to realize the feeding and sending of wafers.
  • the upper side of the tray 33 is provided with a suction groove, the suction groove is provided on the upper side of the tray 33, and the suction groove is connected with a vacuum suction device, so that the wafer can be firmly sucked and the wafer can be smoothly unfolded.
  • the negative pressure pumping device is a vacuum pump.
  • the scraping device 6 includes a scraping translation cylinder 40, a scraper lifting cylinder 41, a scraping translation frame and a scraping lifting frame.
  • the upper side of the scraping gantry 39 is provided with a scraping translation rail and a scraping translation rail.
  • the scraping translation frame is slidably installed on the scraping translation rail
  • the scraping translation cylinder 40 is installed on the scraping gantry 39
  • the piston rod of the scraping translation cylinder 40 is connected to the scraping translation frame.
  • the scraper lifting cylinder 41 is vertically installed on the scraper translation frame, the piston rod of the scraper lifting cylinder 41 is set downwards, and the scraper lifting frame is installed on the scraper lifting cylinder 41 and moves up and down synchronously with the scraper lifting cylinder 41.
  • 43 is installed on the lower side of the scraper lifting frame to hang off the excess glass powder on the wafer.
  • the scraper 43 is installed on the scraper clamp 44, the scraper clamp 44 is installed on the scraper lifting frame through the scraper frame 42, and the scraper 43 is arranged perpendicular to the scraper translation rail.
  • the scraper holder 42 is in the shape of a rectangular parallelepiped box with an open lower side.
  • the upper side of the scraper clamp plate 44 extends into the scraper holder 42 and is slidably connected with the scraper holder 42.
  • the two ends of the scraper clamp plate 44 are symmetrically provided with mounting pins 45. Both sides are provided with long installation holes 4201 that are matched with the installation pins 45 on the corresponding side.
  • the long installation holes 4201 are arranged vertically to guide the lifting of the scraper clamp 44.
  • a buffer spring 52 is provided between the scraper clamp 44 and the scraper frame 42 , The buffer spring 52 is in a compressed state, and the buffer spring 52 is arranged in the squeegee frame 42 to ensure that the pressure of the squeegee 43 on the wafer is stable and avoid damage to the wafer.
  • Both sides of the scraper clamp plate 44 are spaced apart from the corresponding side of the scraper frame 42, and a baffle 46 is installed between one side of the scraper clamp plate 44 and the scraper frame 42.
  • the baffle 46 is fixedly connected to the scraper frame 42.
  • the scraper clamp plate 44 The upper side on the side close to the baffle 46 is a convex arc shape in the middle, which can ensure that the scraper 43 forms an acute angle with the wafer when scraping the glass powder, ensuring reliable scraping of the glass powder and avoiding damage to the wafer.
  • the lower end of the scraper frame 42 on one side where the baffle 46 is provided is lower than the other side, so as to avoid hindering the swing of the scraper 43.
  • one side of the scraper gantry 39 is provided with a V-shaped knife 11, the opening of the V-shaped knife 11 is set upwards, and the V-shaped knife is arranged perpendicular to the scraper 43, and the V-shaped knife 11 is set close to the scraper 43.
  • the scraping device 6 drives the scraper 43 to fit the V-shaped knife 11, and then drives the scraper 43 to rise.
  • the glass powder on the scraper 43 is scraped off by the V-shaped knife 11, and the scraped glass powder will gather in the middle of the V-shaped knife 11, which facilitates the collection of the scraped glass powder and realizes the recycling of excess glass powder. Save raw materials and reduce production costs.
  • the scraper supporting device 12 includes a scraper tray lifting cylinder 48, a scraper rotating motor 47, and a tray 33.
  • the piston rod of the scraper tray lifting cylinder 48 is vertically installed on the frame 1 with upwards.
  • the material rotating motor 47 is installed on the frame 1 on the side of the scraper tray lifting cylinder 48.
  • the scraper tray lifting cylinder 48 is arranged directly under the tray 33.
  • the piston rod of the scraper tray lifting cylinder 48 is connected to the tray through the tray connecting pipe 49. 33 is connected and pushes the tray 33 up and down.
  • the tray connecting pipe 49 is connected to the piston rod of the scraper tray lifting cylinder 48 to rotate.
  • the scraping rotating motor 47 is connected to the tray connecting pipe 49 through a timing belt, thereby realizing the rotation of the tray 33 and scraping.
  • the tray lifting cylinder 48 pushes the lifting part 3301 of the tray 33 up and down, so as to cooperate with the wafer pallet 19 to realize picking and placing of wafers.
  • the squeegee 39 is provided with a sensor for detecting the position of the wafer.
  • the sensor detects the relative position of the groove on the wafer and the squeegee 43, and the squeegee rotating motor 47 drives the wafer to rotate, thereby making the groove and the squeegee of the wafer
  • the included angle of 43 is 45° to prevent the scraper 43 from extending into the groove of the wafer, resulting in insufficient glass powder filling and affecting the pass rate of electronic components.
  • the upper end of the tray connecting pipe 49 is connected with the lifting part 3301, and the tray connecting pipe 49 is connected with the suction groove of the lifting part 3301, and the lower end of the tray connecting pipe 49 is closed.
  • the lower outer shell of the tray connecting pipe 49 is provided with a butting sleeve 50, the inner wall of the butting sleeve 50 is spaced from the outer wall of the tray connecting pipe 49, and a sealing ring is provided between the upper and lower ends of the butting sleeve 50 and the tray connecting pipe 49, thereby
  • a negative pressure cavity is formed between the docking sleeve 50 and the tray connecting tube 49, the tray connecting tube 49 is provided with a through hole communicating with the negative pressure cavity, and the docking sleeve 50 is provided with a docking hole communicating with the negative pressure cavity, thereby It is convenient to communicate with the negative pressure pumping device, and the docking sleeve 50 is rotatably connected with the tray connecting pipe 49.
  • the upper and lower sides of the docking sleeve 50 are provided with limit sleeves for limiting the docking sleeve 50, so as to avoid relative displacement between the docking sleeve 50 and the tray connecting pipe 49, and ensure reliable sealing between the docking sleeve 50 and the tray connecting pipe 49 .
  • the upper jacket of the tray connecting pipe 49 is provided with a transmission sleeve 51 which is coaxially connected with the tray connection pipe 49 and keeps synchronous rotation.
  • the transmission sleeve 51 is used for installing a timing belt wheel.
  • the transmission sleeve 51 and the tray connecting pipe 49 can slide axially.

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Abstract

一种为晶圆填充玻璃粉的装置，属于电子元件生产设备技术领域。其特征在于：包括用于承托晶圆的承托装置、上料装置（5）以及刮料装置（6），上料装置（5）和刮料装置（6）均设置在承托装置上侧，上料装置（5）的下侧安装有取料部并带动取料部移动，刮料装置（6）的下侧安装有刮刀（43）并带动刮刀（43）移动。本为晶圆填充玻璃粉的装置的上料装置通过取料部将玻璃粉均匀的放置在晶圆上，刮料装置通过刮刀将晶圆上多余的玻璃粉清除，保证晶圆上的玻璃粉的量适中，避免出现玻璃粉过多，使后期加工工艺复杂的问题，还能够避免玻璃粉分不均匀的问题，玻璃粉涂刷速度快，涂刷质量稳定，提高了电子元件的合格率，且降低了产品的生产成本。

Description

一种为晶圆填充玻璃粉的装置 技术领域
一种为晶圆填充玻璃粉的装置，属于电子元件生产设备技术领域。
 背景技术
晶圆是指硅半导体集成电路制作所用的硅晶片，由于其形状为圆形，故称为晶圆；在硅晶片上可加工制作成各种电路元件结构，而成为有特定电性功能的集成电路产品。在通过晶圆生产电子元件的过程中，需要在晶圆上涂刷玻璃粉，以保证在切割后能够在芯片的侧部形成玻璃保护层。
目前在晶圆上涂刷玻璃粉大多是通过人工进行的，人工将玻璃粉与水混合，然后将混合后的玻璃粉涂刷到晶圆上。但是这种方法涂刷的速度较低，从而影响了产品的生产速度，产品的生产成本高，而且玻璃粉涂刷的质量取决于工人的劳动能力，涂刷的稳定性较差，导致电子元件的合格率低，进一步提高了产品的生产成本。
 技术问题
本发明要解决的技术问题是：克服现有技术的不足，提供一种能够自动为晶圆涂刷玻璃粉，且涂刷质量稳定的为晶圆填充玻璃粉的装置。
 技术解决方案
本实用新型解决其技术问题所采用的技术方案是：该为晶圆填充玻璃粉的装置，其特征在于：包括用于承托晶圆的承托装置、上料装置以及刮料装置，上料装置和刮料装置均设置在承托装置上侧，上料装置的下侧安装有取料部并带动取料部移动，刮料装置的下侧安装有刮刀并带动刮刀移动。
优选的，所述的取料部包括取料管、吸料杆以及取料气缸，吸料杆的一端伸入取料管内，吸料杆与取料管之间滑动且密封连接，取料管安装在上料装置上，取料气缸安装在上料装置上，取料气缸与吸料杆相连并带动其轴向移动。
优选的，所述的取料管竖向设置，取料管下端的外径小于中部的外径，并在取料管下端形成吸料部。
优选的，所述的上料装置包括上料平移装置和上料升降装置，上料升降装置安装在上料平移装置上，取料部设置在上料升降装置上。
优选的，所述的刮刀通过刮刀架安装在刮料装置上，刮刀的上部与刮刀架滑动连接，刮刀与刮刀架之间设置有缓冲弹簧。
优选的，所述的刮刀上侧固定有刮刀夹板，刮刀夹板的两端对称设置有安装销，刮刀架的两侧设置有与对应侧的安装销相配合的安装长孔，刮刀夹板的上部滑动设置在刮刀架内，缓冲弹簧设置在刮刀夹板与刮刀架之间。
优选的，所述的刮刀夹板的两侧均与刮刀架间隔设置。
优选的，所述的刮刀的一侧设置有V形刀，V形刀的开口朝上设置，且V形刀与刮刀垂直设置。
优选的，所述的承托装置包括上料承托装置和刮料承托装置，上料装置设置在上料承托装置的上侧，刮料装置设置在刮料承托装置的下侧。
优选的，所述的上料承托装置包括托盘以及上料旋转电机，托盘水平设置，上料旋转电机与托盘相连并带动其转动，托盘上侧设置有多个吸取槽，吸取槽连接有抽负压装置。
优选的，所述的上料承托装置还包括上料托盘升降气缸，托盘包括环形的固定部以及与固定部同轴设置的升降部，上料托盘升降气缸的活塞杆设置在升降部下侧，上料托盘升降气缸的活塞杆与升降部相连并推动其升降。
 有益效果
与现有技术相比，本发明所具有的有益效果是：
1、本为晶圆填充玻璃粉的装置的上料装置通过取料部将玻璃粉均匀的放置在晶圆上，刮料装置通过刮刀将晶圆上多余的玻璃粉清除，从而能够保证晶圆上的玻璃粉的量适中，避免出现玻璃粉过多，使后期加工工艺复杂的问题，还能够避免玻璃粉分不均匀的问题，玻璃粉涂刷速度快，且涂刷的质量稳定，提高了电子元件的合格率，且降低了产品的生产成本。
2、取料气缸带动取料杆轴向移动，从而将玻璃粉吸取到取料管内，并能够将取料管内的玻璃粉均匀的转移至晶圆上，取料方便，且取料的量易于控制，避免涂刷的玻璃粉过多。
3、取料管下端设置有取料部，既能够方便吸取玻璃粉，又能够方便将玻璃粉准确的放置到晶圆上。
4、上料升降装置带动吸料部升降，上料平移机构带动上料升降装置平移，从而方便取料部完成将玻璃粉转运至晶圆上的动作，动作灵活。
5、刮刀与刮刀架之间设置有缓冲弹簧，能够保证刮刀与晶圆直接贴合可靠，进而保证将晶圆上的多余的玻璃粉刮净，还能够避免刮刀对晶圆造成损坏。
6、缓冲弹簧设置在刮刀夹板与刮刀架之间，使刮刀拆装方便，刮刀夹板两端的安装销与对应侧的安装长孔相配合，实现了对刮刀的导向。
7、刮刀夹板两侧均与刮刀架间隔设置，使刮刀在刮取晶圆上的玻璃粉时会与晶圆形成一个锐角，避免刮刀与晶圆垂直损坏晶圆，还能够保证将多余的玻璃粉刮净。
8、V形刀能够与刮刀相配合，将刮刀上粘结的玻璃粉清除，且V形刀能够将清除的玻璃粉集中到中部，方便清除的玻璃粉的回收再利用，降低了生产成本。
9、上料承托装置与上料装置相配合实现了将玻璃粉均匀的送至晶圆上，刮料装置与刮料承托装置相配合，实现了将晶圆上多余的玻璃粉刮除，使刮料装置与上料装置之间的工作互不妨碍，提高了工作效率。
10、托盘上设置有多个吸取槽，通过吸取槽既能吸牢晶圆，又能够保证晶圆平整，方便将玻璃粉均匀的放置到晶圆上，托盘连接有带动其转动的上料旋转电机，从而能够使晶圆转动，进而使晶圆上的玻璃粉在离心力的作用下均匀的分布在晶圆上。
11、上料托盘升降气缸与升降部相连并推动升降部升降，方便晶圆的取放，也方便了托盘与机械手相配合实现晶圆的自动转移。
 附图说明
图1为晶圆填充玻璃粉的装置的立体示意图。
图2为晶圆填充玻璃粉的装置的俯视示意图。
图3为晶圆匣升降装置的立体示意图。
图4为晶圆匣的立体示意图。
图5为进料机械手和出料机械手的立体示意图。
图6为对中机构的立体示意图。
图7为上料装置的主视示意图。
图8为取料管与吸料杆配合的主视剖视示意图。
图9为玻璃粉搅拌装置与上料承托装置的立体示意图。
图10为图9中A处的局部放大图。
图11为刮料装置的主视示意图。
图12为刮刀与刮刀架的立体示意图。
图13为刮刀与刮刀架配合的左视剖视示意图。
图14为V形刀的安装示意图。
图15为刮料承托装置的立体示意图。
图16为托盘连接管的主视剖视示意图。
图中：1、机架  2、烘干仓  3、进料机械手  4、晶圆匣  401、承托槽  5、上料装置  6、刮料装置  7、输送带  8、出料机械手  9、玻璃粉搅拌装置  10、上料承托装置  11、V形刀  12、刮料承托装置  13、晶圆匣升降电机  14、晶圆匣升降架  15、晶圆匣撑杆  16、进料平移架  17、机械手平移导轨  18、进料气缸  19、晶圆托板  1901、让位口  20、出料平移架  21、出料气缸  22、对中升降气缸  23、对中气缸  24、对中模  25、上料龙门架  26、上料平移气缸  27、取料升降气缸  28、取料气缸  29、取料管  2901、吸料部  30、吸料杆  31、上料托盘升降气缸  32、上料旋转电机  33、托盘  3301、升降部  34、搅拌气缸  35、料槽  36、搅拌轴  37、搅拌连杆  38、搅拌块  39、刮料龙门架  40、刮料平移气缸  41、刮刀升降气缸  42、刮刀架  4201、安装长孔  43、刮刀  44、刮刀夹板  45、安装销  46、挡板  47、刮料旋转电机  48、刮料托盘升降气缸  49、托盘连接管  50、对接套  51、传动套  52、缓冲弹簧。
 本发明的实施方式
图1~16是本发明的最佳实施例，下面结合附图1~16对本发明做进一步说明。
一种为晶圆填充玻璃粉的装置，包括用于承托晶圆的承托装置、上料装置5以及刮料装置6，上料装置5和刮料装置6均设置在承托装置上侧，上料装置5的下侧设置有取料部并带动取料部移动，刮料装置6的下侧安装有刮刀43并带动刮刀43移动。本为晶圆填充玻璃粉的装置的上料装置5通过取料部将玻璃粉均匀的放置在晶圆上，刮料装置6通过刮刀43将晶圆上多余的玻璃粉清除，从而能够保证晶圆上的玻璃粉的量适中，避免出现玻璃粉过多，使后期加工工艺复杂的问题，还能够避免玻璃粉分不均匀的问题，玻璃粉涂刷速度快，且涂刷的质量稳定，提高了电子元件的合格率，且降低了产品的生产成本。
下面结合具体实施例对本发明做进一步说明，然而熟悉本领域的人们应当了解，在这里结合附图给出的详细说明是为了更好的解释，本发明的结构必然超出了有限的这些实施例，而对于一些等同替换方案或常见手段，本文不再做详细叙述，但仍属于本申请的保护范围。
具体的：如图1~2所示：上料装置5通过上料龙门架25安装在机架1上侧，刮料装置6通过刮料龙门架39安装在机架1上侧，上料龙门架25和刮料龙门架39平行且间隔设置。承托装置包括上料承托装置10和刮料承托装置12，上料承托装置10和刮料承托装置12均安装在机架1上侧，且上料承托装置10设置在上料装置5的正下方，刮料承托装置12设置在刮料装置6的正下侧，从而将上料装置5和刮料装置6的工作分离开，避免上料装置5和刮料装置6的工作相互妨碍，提高了工作效率。
该为晶圆填充玻璃粉的装置还包括安装在机架1上的晶圆匣升降装置、对中装置、玻璃粉搅拌装置9、输送带7、进料机械手3、出料机械手8以及烘干仓2，晶圆匣升降装置和输送带7对称设置在机架1的两侧，上料龙门架25和刮料龙门架39设置在晶圆匣升降装置和输送带7之间，且晶圆匣升降装置靠近上料龙门架25设置，对中装置设置在晶圆匣升降装置与上料龙门架25之间，烘干仓2罩设在输送带7的中部外，且烘干仓2的上侧设置有进风管，从而能够向烘干仓2内送入热风，通过热风对烘干仓2内的晶圆烘干，还可以在烘干仓2内设置加热板。进料机械手3设置在上料龙门架25一侧，出料机械手8设置在刮料龙门架39的一侧，从而完成晶圆转移的动作。玻璃粉搅拌装置9设置在上料承托装置10的一侧，从而方便上料装置5将玻璃粉搅拌装置9内的玻璃粉输送至上料承托装置10上的晶圆上。
输送带7的输入端下侧设置有晶圆升降气缸，晶圆升降气缸的活塞杆朝上竖向设置，晶圆升降气缸的上侧设置有晶圆托架，出料机械手8将晶圆放置在晶圆托架上，并通过晶圆升降气缸将晶圆放置在输送带7上。
晶圆匣升降装置并排设置的两个，每个晶圆匣升降装置上侧均可拆卸的安装有晶圆匣4，晶圆设置在晶圆匣4内，两个晶圆匣升降装置交替工作，从而实现了连续的生产。对中装置用于晶圆的对中，保证玻璃粉上料精确，进料机械手3用于将晶圆在晶圆匣、对中装置和上料承托装置10之间转运，出料机械手8用于将晶圆在上料承托装置10、刮料承托装置12和输送带7之间转运，进料机械手3和出料机械手8独立工作，提高了工作效率。
如图3所示：晶圆匣升降装置包括晶圆匣升降架14以及晶圆匣升降电机13，机架1上设置有竖向的晶圆匣升降导轨，晶圆匣升降架14滑动安装在晶圆匣升降导轨上，晶圆匣升降架14的上侧设置有多根竖向设置的晶圆匣撑杆15，晶圆匣撑杆15的上侧设置有晶圆匣托板，晶圆匣4可拆卸的安装在晶圆匣托板上侧，晶圆匣升降架14设置在机架1的中下部，晶圆匣撑杆15与机架1滑动连接。晶圆匣升降电机13的输出轴朝上并设置在晶圆匣升降架14的下侧，机架1上转动安装有升降螺杆，升降螺杆竖向设置，且升降螺杆与晶圆匣升降电机13的输出轴同轴连接并保持同步转动，晶圆匣升降架14上设置有与升降螺杆相配合的升降螺母，从而实现了晶圆匣升降架14的升降，方便控制晶圆匣4的升降，而且方便精确控制晶圆匣4升降的距离。
如图4所示：晶圆匣4为前后两侧均敞口的长方体箱体，晶圆匣4的左右两侧的间距由后至前逐渐增大，晶圆匣4的两侧内壁上均由下至上间隔设置有多个承托槽401，晶圆匣4两侧相对应的承托槽401相配合承托晶圆。
如图5所示：机架1的上侧设置有机械手平移导轨17，机械手平移导轨17垂直于上料龙门架25所在的平面设置，且机械手平移导轨17水平设置有两根。进料机械手3和出料机械手8均滑动安装在机械手平移导轨17上。
进料机械手3包括进料平移架16、进料气缸18以及晶圆托板19，进料平移架16滑动安装在机械手平移导轨17上，进料平移架16连接有进料直线电机，进料直线电机设置在进料平移架16的下侧，进料直线电机与进料平移架16相连并带动其平移，进料气缸18安装在进料平移架16的上侧，且进料气缸18的活塞杆朝向晶圆匣4的一侧设置，进料气缸18的活塞杆与机械手平移导轨17垂直设置，晶圆托板19安装在进料气缸18的活塞杆上，从而实现晶圆的取放。
出料机械手8包括出料平移架20、出料气缸21以及晶圆托板19，出料平移架20滑动安装在机械手平移导轨17上，出料平移架20连接有出料直线电机，出料直线电机设置在出料平移架20的下侧，出料直线电机与出料平移架20相连并带动其平移，出料气缸21安装在出料平移架20的上侧，且出料气缸21的活塞杆朝向输送带7的一侧设置，出料气缸21的活塞杆与机械手平移导轨17垂直设置，晶圆托板19安装在出料气缸21的活塞杆上，从而实现晶圆的取放。出料平移架20设置在进料平移架16靠近输送带7的一侧。
晶圆托板19为圆形，且晶圆托板19的一侧设置有用于与进料气缸18的活塞杆或出料气缸21的活塞杆相连的连接部，晶圆托板19的上侧设置有吸取孔，吸取孔连接有抽负压装置，从而将晶圆吸住，避免晶圆脱离晶圆托板19。抽负压装置为真空泵。晶圆托板19远离机械手平移导轨17的一侧设置有中部内凹的让位口1901，从而方便将晶圆顶离晶圆托板19，也方便晶圆托板19吸取晶圆。
如图6所示：对中装置包括对中升降气缸22、对中气缸23以及对中模24，对中升降气缸22安装在机架1上，且对中升降气缸22的活塞杆朝上竖向设置，对中气缸23安装在对中升降气缸22的活塞杆上，对中气缸23竖向设置，对中模24安装在对中气缸23上，对中模24包括并排设置的两块对中板，两对中板相邻的一侧均设置有中部内凹的弧形内凹部，对中气缸23同时与两侧的对中板相连并推动两对中板同步向相反的方向移动，从而完成晶圆的对中，进而方便后续晶圆的处理。对中气缸23可以采用两个气缸来实现，两个气缸分别与对应侧的对中板相连并推动对中板平移。
如图7~8所示：上料装置5包括上料平移装置和上料升降装置，上料平移装置安装在上料龙门架25上，上料升降装置滑动安装在上料龙门架25上，上料平移装置与上料升降装置相连推动其沿上料龙门架25平移，上料升降装置的下侧设置有取料部。
上料升降装置包括取料升降气缸27和上料平移架，上料龙门架25的上侧安装有上料平移导轨，上料平移导轨垂直于机械手平移导轨17且水平设置，上料平移架滑动安装在上料平移导轨上，上料平移装置为上料平移气缸26，上料平移气缸26平行于上料平移导轨设置，上料平移气缸26的活塞杆与上料平移架相连并推动其平移。取料升降气缸27的活塞杆朝下竖向设置，取料升降气缸27的活塞杆上安装有取料架，取料部安装在取料架上，从而实现了将玻璃粉搅拌装置9内的玻璃粉转移至上料承托装置10上侧的晶圆上。
取料部包括取料气缸28、取料管29以及吸料杆30，取料气缸28安装在取料架上并随取料架同步升降，取料气缸28的活塞杆朝下设置，取料管29竖向安装在取料架上，吸料杆30的下端滑动伸入取料管29内，吸料杆30与取料管29内壁之间密封连接，吸料杆30的上端与取料气缸28的活塞杆相连并随其同步升降，从而通过取料管29与吸料杆30的配合吸取玻璃粉，也方便将玻璃粉转移到晶圆上。取料管29的下端的外径小于中部的外径，从而在取料管29的下端形成吸料部2901，即方便了吸取玻璃粉，又方便将玻璃粉准确的转移至晶圆的指定位置。
如图9~10所示：玻璃粉搅拌装置9包括搅拌气缸34、料槽35以及搅拌块38，料槽35为中部下凹的半圆柱状，料槽35水平设置，料槽35的上侧安装有搅拌轴36，搅拌轴36与料槽35同轴设置并与料槽35转动连接，搅拌气缸34的活塞杆与搅拌轴36相连并推动搅拌轴36往复转动。搅拌轴36的两端对称设置有搅拌连杆37，搅拌连杆37设置在料槽35内，搅拌连杆37一端与搅拌轴36相连并随搅拌轴36的转动而同步摆动，搅拌块38设置在料槽35底部，搅拌块38设置在两搅拌连杆37之间，且搅拌块38的两侧分别与对应侧的搅拌连杆37固定连接，从而通过搅拌块38对玻璃粉进行搅拌。由于玻璃粉不溶于水，因此搅拌块38时刻对玻璃粉搅拌，避免玻璃粉发生沉降至水的底部导致玻璃粉与水混合不均匀。
搅拌块38的一侧设置有中部内凹的取料口，当搅拌块38摆动至靠近上料承托装置10的一侧时，搅拌块38的取料口恰好朝上，从而方便取料管29的取料动作，也方便了控制玻璃粉的量。
上料承托装置10包括上料托盘升降气缸31、上料旋转电机32以及托盘33，上料托盘升降气缸31的活塞杆朝上竖向安装在机架1上，上料旋转电机32安装在上料托盘升降气缸31一侧的机架1上，机架1的上侧安装有挡料筒，挡料筒为竖向设置的圆筒，且挡料筒的上端敞口设置，挡料筒的直径大于托盘33的直径，托盘33转动设置在挡料筒内。上料托盘升降气缸31设置在托盘33的正下方，上料托盘升降气缸31的活塞杆通过托盘连接管49与托盘33相连并推动托盘33升降，托盘连接管49与上料托盘升降气缸31的活塞杆转动连接，上料旋转电机32通过同步带与托盘连接管49相连，从而实现了托盘33的转动，能够通过离心力的作用将使玻璃粉均匀分布到整个晶圆上，挡料筒起到阻挡玻璃粉的作用。
托盘33包括环形的固定部以及与固定部同轴设置的升降部3301，升降部3301设置在固定部内，并与固定部合围成一个完成的圆盘，上料托盘升降气缸31的活塞杆与升降部3301相连并推动其升降，从而与晶圆托板19相配合，实现晶圆的送入送出。托盘33的上侧设置有吸取槽，吸取槽设置在托盘33上侧，吸取槽连接有抽负压装置，从而能够将晶圆吸牢，还能够将保证晶圆平整的展开。抽负压装置为真空泵。
如图11所示：刮料装置6包括刮料平移气缸40、刮刀升降气缸41、刮料平移架以及刮料升降架，刮料龙门架39上侧设置有刮料平移导轨，刮料平移导轨平行于上料平移导轨设置，刮料平移架滑动安装在刮料平移导轨上，刮料平移气缸40安装在刮料龙门架39上，刮料平移气缸40的活塞杆与刮料平移架相连并推动其平移，刮刀升降气缸41竖向安装在刮料平移架上，刮刀升降气缸41的活塞杆朝下设置，刮料升降架安装在刮刀升降气缸41上并随刮刀升降气缸41同步升降，刮刀43安装在刮料升降架的下侧，从而将晶圆上多余的玻璃粉挂掉。
如图12~13所示：刮刀43安装在刮刀夹板44上，刮刀夹板44通过刮刀架42安装在刮料升降架上，刮刀43与刮料平移导轨垂直设置。刮刀架42为下侧敞口的长方体盒状，刮刀夹板44的上侧伸入刮刀架42内并与刮刀架42滑动连接，刮刀夹板44的两端对称设置有安装销45，刮刀架42的两侧设置有与对应侧的安装销45相配合的安装长孔4201，安装长孔4201竖向设置，从而对刮刀夹板44的升降导向，刮刀夹板44与刮刀架42之间设置有缓冲弹簧52，缓冲弹簧52处于压缩状态，且缓冲弹簧52设置在刮刀架42内，从而保证刮刀43对晶圆的压力稳定，避免损坏晶圆。
刮刀夹板44的两侧均与刮刀架42对应的一侧间隔设置，且刮刀夹板44的一侧与刮刀架42之间安装有挡板46，挡板46与刮刀架42固定连接，刮刀夹板44靠近挡板46一侧的上侧为中部外凸的弧形，从而能够在刮取玻璃粉时能够保证刮刀43与晶圆成锐角，保证刮取玻璃粉可靠，且避免损坏晶圆。刮刀架42设置挡板46的一侧的下端低于另一侧设置，从而避免对刮刀43的摆动造成妨碍。
如图14所示：刮料龙门架39的一侧设置有V形刀11，V形刀11的开口朝上设置，且V形刀与刮刀43垂直设置，V形刀11设置在刮刀43靠近挡板46的一侧，当刮刀43刮完玻璃粉时，刮刀43上会粘有玻璃粉，此时刮料装置6带动刮刀43与V形刀11相贴合，然后再带动刮刀43上升，从而通过V形刀11将刮刀43上的玻璃粉刮下，且刮下的玻璃粉会汇聚在V形刀11的中部，方便刮下的玻璃粉的收集，实现了多余玻璃粉的回收利用，节省了原料，降低了生产成本。
如图15所示：刮料承托装置12包括刮料托盘升降气缸48、刮料旋转电机47以及托盘33，刮料托盘升降气缸48的活塞杆朝上竖向安装在机架1上，刮料旋转电机47安装在刮料托盘升降气缸48一侧的机架1上，刮料托盘升降气缸48设置在托盘33的正下方，刮料托盘升降气缸48的活塞杆通过托盘连接管49与托盘33相连并推动托盘33升降，托盘连接管49与刮料托盘升降气缸48的活塞杆转动连接，刮料旋转电机47通过同步带与托盘连接管49相连，从而实现了托盘33的转动，刮料托盘升降气缸48推动托盘33的升降部3301升降，从而与晶圆托板19相配合实现取放晶圆。刮料龙门架39上设置有用于检测晶圆位置的传感器，传感器检测晶圆上的槽与刮刀43的相对位置，并通过刮料旋转电机47带动晶圆转动，从而使晶圆的槽与刮刀43的夹角为45°，避免刮刀43伸入晶圆的槽内，导致玻璃粉填充不足，影响电子元件的合格率。
如图16所示：托盘连接管49的上端与升降部3301相连，且托盘连接管49与升降部3301的吸取槽相连通，托盘连接管49的下端封闭设置。托盘连接管49的下部外套设有对接套50，对接套50的内壁与托盘连接管49的外壁间隔设置，且对接套50的上下两端与托盘连接管49之间均设置有密封圈，从而在对接套50与托盘连接管49之间形成负压腔，托盘连接管49上设置有与负压腔相连通的通孔，对接套50上设置有与负压腔相连通的对接孔，从而方便与抽负压装置相连通，对接套50与托盘连接管49转动连接。对接套50的上下两侧设置有用于对对接套50限位的限位套，从而避免对接套50与托盘连接管49之间发生相对位移，保证对接套50与托盘连接管49之间密封可靠。
托盘连接管49的上部外套设有传动套51，传动套51与托盘连接管49同轴连接并保持同步转动，传动套51用于安装同步带轮。传动套51与托盘连接管49可轴向滑动。
以上所述，仅是本发明的较佳实施例而已，并非是对本发明作其它形式的限制，任何熟悉本专业的技术人员可能利用上述揭示的技术内容加以变更或改型为等同变化的等效实施例。但是凡是未脱离本发明技术方案内容，依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与改型，仍属于本发明技术方案的保护范围。

Claims (11)

  1. 一种为晶圆填充玻璃粉的装置，其特征在于：包括用于承托晶圆的承托装置、上料装置（5）以及刮料装置（6），上料装置（5）和刮料装置（6）均设置在承托装置上侧，上料装置（5）的下侧安装有取料部并带动取料部移动，刮料装置（6）的下侧安装有刮刀（43）并带动刮刀（43）移动。
  2. 根据权利要求1所述的为晶圆填充玻璃粉的装置，其特征在于：所述的取料部包括取料管（29）、吸料杆（30）以及取料气缸（28），吸料杆（30）的一端伸入取料管（29）内，吸料杆（30）与取料管（29）之间滑动且密封连接，取料管（29）安装在上料装置（5）上，取料气缸（28）安装在上料装置（5）上，取料气缸（28）与吸料杆（30）相连并带动其轴向移动。
  3. 根据权利要求2所述的为晶圆填充玻璃粉的装置，其特征在于：所述的取料管（29）竖向设置，取料管（29）下端的外径小于中部的外径，并在取料管（29）下端形成吸料部（2901）。
  4. 根据权利要求1所述的为晶圆填充玻璃粉的装置，其特征在于：所述的上料装置（5）包括上料平移装置和上料升降装置，上料升降装置安装在上料平移装置上，取料部设置在上料升降装置上。
  5. 根据权利要求2所述的为晶圆填充玻璃粉的装置，其特征在于：所述的上料装置（5）包括上料平移装置和上料升降装置，上料升降装置安装在上料平移装置上，取料部设置在上料升降装置上。
  6. 根据权利要求1所述的为晶圆填充玻璃粉的装置，其特征在于：所述的刮刀（43）通过刮刀架（42）安装在刮料装置（6）上，刮刀（43）的上部与刮刀架（42）滑动连接，刮刀（43）与刮刀架（42）之间设置有缓冲弹簧（52）。
  7. 根据权利要求6所述的为晶圆填充玻璃粉的装置，其特征在于：所述的刮刀（43）上侧固定有刮刀夹板（44），刮刀夹板（44）的两端对称设置有安装销（45），刮刀架（42）的两侧设置有与对应侧的安装销（45）相配合的安装长孔（4201），刮刀夹板（44）的上部滑动设置在刮刀架（42）内，缓冲弹簧（52）设置在刮刀夹板（44）与刮刀架（42）之间。
  8. 根据权利要求7所述的为晶圆填充玻璃粉的装置，其特征在于：所述的刮刀夹板（44）的两侧均与刮刀架（42）间隔设置。
  9. 根据权利要求1所述的为晶圆填充玻璃粉的装置，其特征在于：所述的刮刀（43）的一侧设置有V形刀（11），V形刀（11）的开口朝上设置，且V形刀（11）与刮刀（43）垂直设置。
  10. 根据权利要求1所述的为晶圆填充玻璃粉的装置，其特征在于：所述的承托装置包括上料承托装置（10）和刮料承托装置（12），上料装置（5）设置在上料承托装置（10）的上侧，刮料装置（6）设置在刮料承托装置（12）的下侧。
  11. 根据权利要求10所述的为晶圆填充玻璃粉的装置，其特征在于：所述的上料承托装置（10）包括托盘（33）以及上料旋转电机（32），托盘（33）水平设置，上料旋转电机（32）与托盘（33）相连并带动其转动，托盘（33）上侧设置有多个吸取槽，吸取槽连接有抽负压装置。
PCT/CN2020/075300 2019-02-15 2020-02-14 一种为晶圆填充玻璃粉的装置 WO2020164595A1 (zh)

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