JP7300539B2 - ウェハにガラス粉末を充填する装置 - Google Patents
ウェハにガラス粉末を充填する装置 Download PDFInfo
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- JP7300539B2 JP7300539B2 JP2022080381A JP2022080381A JP7300539B2 JP 7300539 B2 JP7300539 B2 JP 7300539B2 JP 2022080381 A JP2022080381 A JP 2022080381A JP 2022080381 A JP2022080381 A JP 2022080381A JP 7300539 B2 JP7300539 B2 JP 7300539B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G53/00—Conveying materials in bulk through troughs, pipes or tubes by floating the materials or by flow of gas, liquid or foam
- B65G53/04—Conveying materials in bulk pneumatically through pipes or tubes; Air slides
- B65G53/24—Gas suction systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Coating Apparatus (AREA)
- Formation Of Insulating Films (AREA)
Description
2 乾燥室
3 供給マニピュレータ
4 ウェハカセット
401 支持溝
5 材料供給装置
6 掻取装置
7 搬送ベルト
8 送出マニピュレータ
9 ガラス粉末撹拌装置
10 材料供給用支持装置
11 V字形ナイフ
12 掻取用支持装置
13 ウェハカセット昇降モータ
14 ウェハカセット昇降フレーム
15 ウェハカセットステー
16 供給用平行移動フレーム
17 マニピュレータ用平行移動レール
18 供給シリンダ
19 ウェハパレット
1901 退避口
20 送出用平行移動フレーム
21 送出シリンダ
22 センタリング昇降シリンダ
23 センタリングシリンダ
24 センタリングモジュール
25 材料供給ガントリ
26 材料供給用平行移動シリンダ
27 材料取得昇降シリンダ
28 材料取得シリンダ
29 材料取得管
2901 材料吸込部
30 材料吸込ロッド
31 材料供給用トレイ昇降シリンダ
32 材料供給用回転モータ
33 トレイ
3301 昇降部
34 撹拌シリンダ
35 材料溝
36 撹拌軸
37 撹拌リンク
38 撹拌ブロック
39 掻取ガントリ
40 掻取用平行移動シリンダ
41 スクレーパ昇降シリンダ
42 スクレーパホルダ
4201 取付長孔
43 スクレーパ
44 スクレーパ挟持板
45 取付ピン
46 突き当て板
47 掻取用回転モータ
48 掻取用トレイ昇降シリンダ
49 トレイ接続管
50 ドッキングスリーブ
51 伝動スリーブ
52 緩衝ばね。
Claims (7)
- 掻取用平行移動シリンダ(40)、スクレーパ昇降シリンダ(41)、掻取用平行移動フレーム、及び掻取用昇降フレームを含み、
前記掻取用平行移動シリンダ(40)は、掻取ガントリ(39)に取り付けられ、
前記掻取用平行移動シリンダ(40)のピストンロッドは、前記掻取用平行移動フレームに接続され、前記掻取用平行移動フレームを平行移動させるようにプッシュし、
前記スクレーパ昇降シリンダ(41)は、前記掻取用平行移動フレームに垂直方向に取り付けられ、
前記掻取用昇降フレームは、前記スクレーパ昇降シリンダ(41)に取り付けられ、かつ前記スクレーパ昇降シリンダ(41)に伴って同期昇降し、
スクレーパ(43)は、前記掻取用昇降フレームの下側に取り付けられることにより、ウェハ上の余剰なガラス粉末を掻き取り、
前記掻取ガントリ(39)にウェハの位置を検出するセンサが設けられており、前記センサがウェハ上の溝と前記スクレーパ(43)との相対的な位置を検出し、かつ掻取用回転モータ(47)によりウェハを回転させるように駆動することにより、ウェハの溝と前記スクレーパ(43)との夾角が45°となるウェハにガラス粉末を充填するための掻取装置。 - 掻取用トレイ昇降シリンダ(48)、掻取用回転モータ(47)及びトレイ(33)を含む掻取用支持装置(12)を有し、
前記掻取用トレイ昇降シリンダ(48)のピストンロッドは、上向きで、フレーム(1)に垂直方向に取り付けられ、
前記掻取用回転モータ(47)は、前記掻取用トレイ昇降シリンダ(48)の一側のフレーム(1)に取り付けられ、
前記掻取用トレイ昇降シリンダ(48)は、前記トレイ(33)の真下に設けられ、
前記掻取用トレイ昇降シリンダ(48)のピストンロッドは、トレイ接続管(49)を介して前記トレイ(33)に接続され、かつ前記トレイ(33)を昇降させるようにプッシュし、
前記トレイ接続管(49)は、前記掻取用トレイ昇降シリンダ(48)のピストンロッドに回転可能に接続され、
前記掻取用回転モータ(47)は、タイミングベルトを介して前記トレイ接続管(49)に接続されることにより、前記トレイ(33)の回転を実現させる請求項1に記載のウェハにガラス粉末を充填するための掻取装置。 - 前記トレイ(33)は、環状の固定部と、前記固定部と同軸に設けられる昇降部(3301)とを含み、
前記昇降部(3301)は、前記固定部内に設けられ、かつ前記固定部と組み合わせて完全な円盤を形成する請求項2に記載のウェハにガラス粉末を充填するための掻取装置。 - 前記トレイ接続管(49)の下部の外にドッキングスリーブ(50)が嵌設され、
前記ドッキングスリーブ(50)の内壁と前記トレイ接続管(49)の外壁は、間隔をおいて設けられ、
前記ドッキングスリーブ(50)の上下両端と前記トレイ接続管(49)との間に、いずれも密封リングが設けられていることにより、前記ドッキングスリーブ(50)と前記トレイ接続管(49)との間に負圧キャビティが形成され、前記トレイ接続管(49)に前記負圧キャビティと連通する貫通孔が設けられ、前記ドッキングスリーブ(50)に前記負圧キャビティと連通するドッキング孔が設けられている前記請求項2に記載のウェハにガラス粉末を充填するための掻取装置。 - 前記ドッキングスリーブ(50)の上下両側に前記ドッキングスリーブ(50)を制限するストップスリーブが設けられている前記請求項4に記載のウェハにガラス粉末を充填するための掻取装置。
- 前記トレイ接続管(49)の上部の外に伝動スリーブ(51)が嵌設され、
前記伝動スリーブ(51)は、前記トレイ接続管(49)と同軸に接続され、かつ同期回転を維持させ、
前記伝動スリーブ(51)は、タイミングプーリの取り付けに用いられ、
前記伝動スリーブ(51)は、前記トレイ接続管(49)と軸方向に摺動することができる前記請求項2に記載のウェハにガラス粉末を充填するための掻取装置。 - 前記トレイ(33)の上側に吸込溝が設けられ、
前記吸込溝は、負圧吸引装置が接続されている請求項2に記載のウェハにガラス粉末を充填するための掻取装置。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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CN201910117921.9 | 2019-02-15 | ||
CN201910117921.9A CN109712919B (zh) | 2019-02-15 | 2019-02-15 | 一种为晶圆填充玻璃粉的装置 |
PCT/CN2020/075300 WO2020164595A1 (zh) | 2019-02-15 | 2020-02-14 | 一种为晶圆填充玻璃粉的装置 |
JP2021547402A JP7076650B2 (ja) | 2019-02-15 | 2020-02-14 | ウェハにガラス粉末を充填する装置 |
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JP2021547402A Division JP7076650B2 (ja) | 2019-02-15 | 2020-02-14 | ウェハにガラス粉末を充填する装置 |
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JP2022116078A JP2022116078A (ja) | 2022-08-09 |
JP7300539B2 true JP7300539B2 (ja) | 2023-06-29 |
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JP2022080381A Active JP7300539B2 (ja) | 2019-02-15 | 2022-05-16 | ウェハにガラス粉末を充填する装置 |
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US (1) | US11972959B2 (ja) |
EP (1) | EP3926666B1 (ja) |
JP (2) | JP7076650B2 (ja) |
KR (1) | KR102551148B1 (ja) |
CN (1) | CN109712919B (ja) |
WO (1) | WO2020164595A1 (ja) |
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CN109712919B (zh) * | 2019-02-15 | 2024-05-28 | 山东才聚电子科技有限公司 | 一种为晶圆填充玻璃粉的装置 |
CN112592073A (zh) * | 2020-12-30 | 2021-04-02 | 惠州市宝斯特实业有限公司 | 一种用于玻璃的防霉粉涂刷设备 |
CN112864058B (zh) * | 2021-03-04 | 2022-09-23 | 山东才聚电子科技有限公司 | 一种晶圆玻璃粉擦粉装置 |
CN114446840B (zh) * | 2022-04-08 | 2022-07-01 | 四川上特科技有限公司 | 一种晶圆玻璃粉擦除装置 |
CN116525488B (zh) * | 2023-04-26 | 2024-05-14 | 华中科技大学 | 一种晶圆沟道的直写填充装置 |
CN117393480B (zh) * | 2023-10-16 | 2024-03-19 | 济南兰星电子有限公司 | 二极管芯片生产用玻璃浆自动擦拭装置 |
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CN208297875U (zh) * | 2018-04-26 | 2018-12-28 | 东莞市友辉光电科技有限公司 | 刮胶机上料自动定位*** |
CN108689172B (zh) * | 2018-08-08 | 2023-12-22 | 江西衡源智能装备股份有限公司 | 一种玻璃面板的自动上下料加工装置 |
CN109192688A (zh) * | 2018-09-03 | 2019-01-11 | 吴美珍 | 晶圆进出料装置和集成电路用晶圆贴标签设备 |
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CN109712919B (zh) * | 2019-02-15 | 2024-05-28 | 山东才聚电子科技有限公司 | 一种为晶圆填充玻璃粉的装置 |
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JP2006150233A (ja) | 2004-11-29 | 2006-06-15 | Tokyo Ohka Kogyo Co Ltd | 塗布装置、塗布方法および被膜形成装置 |
WO2018101031A1 (ja) | 2016-12-01 | 2018-06-07 | 住友精密工業株式会社 | 塗膜形成方法および塗膜形成装置 |
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JP7076650B2 (ja) | 2022-05-27 |
JP2022517437A (ja) | 2022-03-08 |
KR20210110694A (ko) | 2021-09-08 |
WO2020164595A1 (zh) | 2020-08-20 |
EP3926666A1 (en) | 2021-12-22 |
US20220013378A1 (en) | 2022-01-13 |
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US11972959B2 (en) | 2024-04-30 |
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