JPS556805A - Method of producing semiconductor - Google Patents

Method of producing semiconductor

Info

Publication number
JPS556805A
JPS556805A JP7801078A JP7801078A JPS556805A JP S556805 A JPS556805 A JP S556805A JP 7801078 A JP7801078 A JP 7801078A JP 7801078 A JP7801078 A JP 7801078A JP S556805 A JPS556805 A JP S556805A
Authority
JP
Japan
Prior art keywords
glass layer
groove
layer
substrate
baking
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7801078A
Other languages
Japanese (ja)
Inventor
Nobutami Oka
Masafumi Miyagawa
Tsuneo Atsumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7801078A priority Critical patent/JPS556805A/en
Publication of JPS556805A publication Critical patent/JPS556805A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3178—Coating or filling in grooves made in the semiconductor body

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

PURPOSE: To form a protective layer with a good junction surface by thickly applying a viscous glass liquid to a substrate having a dicing groove with the junction surface partially exposed to form a layer, which is filled into the groove again as a glass layer in the secondary baking after the solvent is evaporated away thereform in the primary baking.
CONSTITUTION: A dicing groove 2 with the PN junction surface 3 partially exposed is provided on the main surface of a substrate. A paste-like viscous glass liquid 15 is dropped on the surface of the substrate in the amount 2 to 3 times as large as previously done. With the movement of a doctor blade, a viscous glass layer is packed into the groove and then, the primary baking is conducted for several minutes at 100 to 500°C to form a powdered glass layer 35 after the solvent in the viscous glass liquid is evaporated away. subsequently, with the movement of a doctor blade 4', the powdered glass layer 45 is rolled and the secondary baking is conducted at about 700°C to form a glass layer 55. The capacity of the glass layer can be reduced to 50 to 70% through the primary heating and to 70 to 80% from that following the primary heating. In this manner, the clearance of the groove can be filled accurately.
COPYRIGHT: (C)1980,JPO&Japio
JP7801078A 1978-06-29 1978-06-29 Method of producing semiconductor Pending JPS556805A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7801078A JPS556805A (en) 1978-06-29 1978-06-29 Method of producing semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7801078A JPS556805A (en) 1978-06-29 1978-06-29 Method of producing semiconductor

Publications (1)

Publication Number Publication Date
JPS556805A true JPS556805A (en) 1980-01-18

Family

ID=13649809

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7801078A Pending JPS556805A (en) 1978-06-29 1978-06-29 Method of producing semiconductor

Country Status (1)

Country Link
JP (1) JPS556805A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5330871A (en) * 1990-11-29 1994-07-19 Canon Kabushiki Kaisha Toner for developing electrostatic image
US5364720A (en) * 1992-10-15 1994-11-15 Canon Kabushiki Kaisha Magnetic developer for developing electrostatic images
EP0686882A1 (en) 1994-05-13 1995-12-13 Canon Kabushiki Kaisha Toner for developing electrostatic images, process cartridge, and image forming method
US5972553A (en) * 1995-10-30 1999-10-26 Canon Kabushiki Kaisha Toner for developing electrostatic image, process-cartridge and image forming method
US6002895A (en) * 1994-05-13 1999-12-14 Canon Kabushiki Kaisha Process cartridge
US6808852B2 (en) 2001-09-06 2004-10-26 Canon Kabushiki Kaisha Toner and heat-fixing method
JP2011192662A (en) * 2010-03-03 2011-09-29 Napura:Kk Substrate for electronic device and electronic device
US8415784B2 (en) 2009-06-02 2013-04-09 Napra Co., Ltd. Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing method
KR20210110694A (en) * 2019-02-15 2021-09-08 산둥 차이쥐 일렉트로닉 테크놀로지 컴퍼니 리미티드 Glass powder filling equipment into wafers

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5500318A (en) * 1990-11-29 1996-03-19 Canon Kabushiki Kaisha Toner for developing electrostatic image and fixing method
US5330871A (en) * 1990-11-29 1994-07-19 Canon Kabushiki Kaisha Toner for developing electrostatic image
US5364720A (en) * 1992-10-15 1994-11-15 Canon Kabushiki Kaisha Magnetic developer for developing electrostatic images
US6002895A (en) * 1994-05-13 1999-12-14 Canon Kabushiki Kaisha Process cartridge
US5736288A (en) * 1994-05-13 1998-04-07 Canon Kabushiki Kaisha Toner for developing electrostatic images, process cartridge, and image forming method
EP0686882A1 (en) 1994-05-13 1995-12-13 Canon Kabushiki Kaisha Toner for developing electrostatic images, process cartridge, and image forming method
US5972553A (en) * 1995-10-30 1999-10-26 Canon Kabushiki Kaisha Toner for developing electrostatic image, process-cartridge and image forming method
US6808852B2 (en) 2001-09-06 2004-10-26 Canon Kabushiki Kaisha Toner and heat-fixing method
US8415784B2 (en) 2009-06-02 2013-04-09 Napra Co., Ltd. Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing method
US8759211B2 (en) 2009-06-02 2014-06-24 Napra Co., Ltd. Electronic device, conductive composition, metal filling apparatus, and electronic device manufacturing method
JP2011192662A (en) * 2010-03-03 2011-09-29 Napura:Kk Substrate for electronic device and electronic device
KR20210110694A (en) * 2019-02-15 2021-09-08 산둥 차이쥐 일렉트로닉 테크놀로지 컴퍼니 리미티드 Glass powder filling equipment into wafers
JP2022517437A (en) * 2019-02-15 2022-03-08 シャンドン ツァイジュー エレクトロニック テクノロジー カンパニー リミテッド Equipment for filling wafers with glass powder
JP2022116078A (en) * 2019-02-15 2022-08-09 シャンドン ツァイジュー エレクトロニック テクノロジー カンパニー リミテッド Apparatus for filling wafer with glass powder

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