WO2019102868A1 - 基板搬送装置、基板処理システム、基板処理方法及びコンピュータ記憶媒体 - Google Patents
基板搬送装置、基板処理システム、基板処理方法及びコンピュータ記憶媒体 Download PDFInfo
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- WO2019102868A1 WO2019102868A1 PCT/JP2018/041637 JP2018041637W WO2019102868A1 WO 2019102868 A1 WO2019102868 A1 WO 2019102868A1 JP 2018041637 W JP2018041637 W JP 2018041637W WO 2019102868 A1 WO2019102868 A1 WO 2019102868A1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
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- B24B37/30—Work carriers for single side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
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- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
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- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Definitions
- the present invention relates to a substrate transfer apparatus that holds and transfers one surface of a substrate by a substrate holding unit and delivers the other surface of the substrate, a substrate processing system including the substrate transfer apparatus, and a substrate processing method using the substrate processing system And computer storage media.
- the back surface of a wafer may be ground to thin the wafer with respect to a semiconductor wafer (hereinafter referred to as a wafer) on which devices such as a plurality of electronic circuits are formed on the surface. It has been done.
- the grinding apparatus is provided with a grinding unit for grinding the back surface of the wafer, a positioning mechanism (alignment mechanism) for positioning the center position of the wafer before grinding, and a cleaning mechanism for cleaning the ground wafer.
- the grinding unit grinds the wafer held by the chuck of the rotary table, and is arranged from the outer side to the upper side in plan view of the rotary table.
- the positioning mechanism and the cleaning mechanism are respectively disposed outside the rotary table in plan view.
- the grinding apparatus is provided with a wafer supply mechanism for transferring the wafer from the positioning mechanism to the chuck of the rotating table, and a wafer recovery mechanism (transfer means) for transferring the wafer from the chuck of the rotating table to the cleaning mechanism.
- the wafer recovery mechanism has a transfer pad for holding the wafer by suction and a swing arm for supporting the transfer pad.
- a buffer spring is provided between the transfer pad and the pivot arm, and the buffer spring biases the transfer pad away from the pivot arm to relieve an impact applied to the wafer from the transfer pad.
- the transfer pad is supported so as to be able to move upward relative to the pivot arm so as to avoid the application of strong pressure on the wafer in this manner.
- the present invention has been made in view of the above circumstances, and has as its object to appropriately transfer a substrate between a plurality of devices while appropriately delivering the substrate to a plurality of devices that perform substrate processing.
- One aspect of the present invention which solves the above-mentioned subject is a substrate conveyance device which holds and conveys one side of a substrate by a substrate holding part and delivers the other side of the substrate, wherein the substrate holding part is tiltable in side view And a fixing mechanism for fixing the tilting of the substrate holder in a side view.
- the substrate transfer apparatus since the substrate transfer apparatus has the tilting mechanism and the fixing mechanism, for example, when transferring the substrate, the substrate holding portion can be made tiltable by the tilting mechanism. During transport, the substrate holder can be fixed by the fixing mechanism. Therefore, substrate transfer and transfer can be properly performed on a plurality of devices.
- One aspect of the present invention is a substrate processing system for processing a substrate, which processes a first holding unit for holding a substrate and a processing surface of the substrate held by the first holding unit. Cleaning the non-processed surface opposite to the processing surface of the processing section and the substrate processed by the processing section and held by the second holding section, or cleaning the second holding section And the second holding unit, the second holding unit holds and transports the substrate, and the transfer position for delivering the substrate to the first holding unit and the cleaning unit relative to the cleaning unit
- One aspect of the present invention is a substrate processing method for processing a substrate, comprising: a first transfer step of transferring a substrate to a first holding unit by a transfer unit; A processing step of processing the processing surface of the substrate held in the first holding portion, a second conveyance step of conveying the substrate to the cleaning portion by the conveyance portion, and then the conveyance portion of the conveyance portion by the cleaning portion Cleaning the non-processed surface opposite to the processed surface of the substrate held by the second holding unit, or cleaning the second holding unit; And a fixing mechanism for fixing the tilting of the second holding unit in the side view, and in the first transporting step, the transporting unit includes the tilting mechanism.
- the second holding unit The has become tiltable by the tilting mechanism, in the cleaning process, when cleaning the non-processed surface or the second holding portions of the substrate, the second holding portion is fixed by the fixing mechanism.
- One aspect of the present invention is a readable computer storage medium storing a program operating on a computer of a control unit that controls the substrate processing system to cause the substrate processing system to execute the substrate processing method. It is.
- an object of the present invention is to properly transfer a substrate to a plurality of apparatuses for performing substrate processing, and to properly transport the substrate among the plurality of apparatuses.
- FIG. 2 is a perspective view showing an outline of the configuration of a transport unit 110. It is explanatory drawing which shows the wet environment area
- FIG. 1 is a plan view schematically showing the outline of the configuration of a substrate processing system 1.
- the X-axis direction, the Y-axis direction, and the Z-axis direction orthogonal to one another are defined, and the Z-axis positive direction is the vertically upward direction.
- the wafer W as a substrate is thinned.
- the wafer W is, for example, a semiconductor wafer such as a silicon wafer or a compound semiconductor wafer.
- a device (not shown) is formed on the surface (hereinafter referred to as a non-processed surface) of the wafer W, and a protective member such as a protective tape (not shown) for protecting the device is attached to the surface. It is attached.
- predetermined processing such as grinding is performed on the back surface (hereinafter referred to as a processed surface) of the wafer W, and the wafer is thinned.
- the substrate processing system 1 stores the wafer W before processing in the cassette C, and carries the plurality of wafers W into the substrate processing system 1 from the outside in cassette units from the outside, and the wafer W after processing in the cassette C And a processing apparatus 4 for processing and thinning the wafer W, and a post-processing wafer W.
- It has a configuration in which a post-processing device 5 for performing processing and a transfer station 6 for transferring the wafer W among the loading station 2, the processing device 4 and the post-processing device 5 are connected.
- the loading station 2, the transfer station 6, and the processing device 4 are arranged in this order in the Y-axis direction on the X-axis negative direction side.
- the unloading station 3 and the post-processing device 5 are arranged side by side in this order in the Y-axis direction on the X-axis positive direction side.
- a cassette mounting table 10 is provided at the loading station 2.
- a plurality of, for example, two cassettes C can be mounted on the cassette mounting table 10 in a row in the X-axis direction. That is, the cassette mounting table 10 is configured to be capable of holding a plurality of wafers W.
- the unloading station 3 also has the same configuration as the loading station 2.
- a cassette mounting table 20 is provided at the unloading station 3, and for example, two cassettes C can be mounted on the cassette mounting table 20 in a row in the X-axis direction. That is, the cassette mounting table 20 is configured to be capable of holding a plurality of wafers W.
- the loading station 2 and the unloading station 3 may be integrated into one loading and unloading station, and in such a case, the loading and unloading station is provided with a common cassette mounting table.
- processing such as grinding and cleaning is performed on the wafer W.
- the configuration of the processing device 4 will be described later.
- post-processing is performed on the wafer W processed by the processing apparatus 4.
- the post-processing for example, a mounting process of holding the wafer W on the dicing frame through the dicing tape, a peeling process of peeling the protective tape attached to the wafer W, and the like are performed.
- the post-processing apparatus 5 carries the post-processing and carries the wafer W held by the dicing frame to the cassette C of the unloading station 3.
- a known device is used for the mounting process and the peeling process performed by the post-processing device 5 respectively.
- the transfer station 6 is provided with a wafer transfer area 30.
- a wafer transfer apparatus 32 movable on the transfer path 31 extending in the X-axis direction is provided.
- the wafer transfer apparatus 32 has a transfer fork 33 and a transfer pad 34 as a wafer holding unit for holding the wafer W.
- the transfer fork 33 and the transfer pad 34 are respectively movable in the horizontal direction, the vertical direction, around the horizontal axis and around the vertical axis.
- the transport fork 33 is branched into two distal end portions 33a. Further, on the surface of the transfer fork 33, for example, three pads 33b are provided. Each pad 33 b is connected to a suction mechanism (not shown) for drawing a vacuum and suctions the wafer W. Thus, the transfer fork 33 sucks and holds the wafer W by the pad 33 b. The transfer fork 33 transfers the wafer W before grinding.
- the transfer pad 34 has a circular shape with a diameter longer than the diameter of the wafer W in a plan view.
- a plurality of suction ports are formed on the lower surface of the transfer pad 34, and each suction port is connected to a suction mechanism (not shown) for drawing a vacuum.
- the transfer pad 34 sucks and holds the entire processing surface of the wafer W.
- the transfer pad 34 transfers the wafer W after grinding, that is, the thinned wafer W.
- a control unit 40 is provided in the substrate processing system 1.
- the control unit 40 is, for example, a computer and has a program storage unit (not shown).
- the program storage unit stores a program for controlling the processing of the wafer W in the substrate processing system 1.
- the program storage unit also stores a program for realizing the below-described wafer processing in the substrate processing system 1 by controlling the operation of drive systems such as the above-described various processing apparatuses and transport apparatuses.
- the program is recorded on a computer readable storage medium H such as a computer readable hard disk (HD), a flexible disk (FD), a compact disc (CD), a magnet optical desk (MO), a memory card, etc. And may be installed in the control unit 40 from the storage medium H.
- the processing device 4 includes a turntable 100, a transport unit 110 as a transport unit, an alignment unit 120 as an alignment unit, a first cleaning unit 130 as a processing surface cleaning unit, and a cleaning unit.
- the rotary table 100 is configured to be rotatable by a rotation mechanism (not shown). On the rotating table 100, four chucks 101 as first holding units for holding the wafer W by suction are provided. The chucks 101 are arranged uniformly on the same circumference as the rotary table 100, that is, every 90 degrees. The four chucks 101 are movable to the delivery position A0 and the processing positions A1 to A3 by rotation of the rotary table 100.
- the delivery position A0 is a position on the X-axis positive direction side and the Y-axis negative direction side of the rotary table 100, and the third cleaning unit 150 is disposed.
- the second cleaning unit 140, the alignment unit 120, and the first cleaning unit 130 are arranged side by side on the Y-axis negative direction side of the delivery position A0. That is, the delivery position A0, the second cleaning unit 140, the alignment unit 120, and the first cleaning unit 130 are arranged side by side in the direction in which the wafer transfer apparatus 32 transfers the wafer W to the processing apparatus 4 (Y axis direction). Ru. Further, the alignment unit 120 and the first cleaning unit 130 are stacked and arranged in this order from above.
- the first processing position A1 is a position on the X-axis positive direction side and the Y-axis positive direction side of the rotary table 100, and the rough grinding unit 160 is disposed.
- the second processing position A2 is a position on the X axis negative direction side and the Y axis positive direction side of the rotary table 100, and the middle grinding unit 170 is disposed.
- the third processing position A3 is a position on the X axis negative direction side and the Y axis negative direction side of the rotary table 100, and the finish grinding unit 180 is disposed.
- the chuck 101 is held by a chuck base 102.
- the chuck 101 and the chuck base 102 are configured to be rotatable by a rotation mechanism (not shown).
- the transport unit 110 is an articulated robot including a plurality of, for example, three arms 111 to 113.
- a transfer pad 114 as a second holding unit (substrate holding unit) for holding the wafer W by suction is attached to the first arm 111 at the tip.
- the third arm 113 at the proximal end is attached to a vertical movement mechanism 115 for moving the arms 111 to 113 in the vertical direction.
- the transfer pad 114 has a circular shape with a diameter longer than the diameter of the wafer W in a plan view.
- a plurality of suction ports (not shown) are formed on the lower surface, and each suction port is connected to a suction mechanism (not shown) for drawing a vacuum.
- the transfer pad 114 sucks and holds the entire processing surface of the wafer W.
- the transfer pad 114 is supported by the tip of the first arm 111.
- a rotating portion 111a is built in the tip of the first arm 111, and the rotating portion 111a includes, for example, a motor.
- the transfer pad 114 is configured to be rotatable by the rotating portion 111a.
- the three arms 111 to 113 are connected by joints 112a and 113a, respectively. That is, the proximal end of the first arm 111 and the distal end of the second arm 112 are connected by a joint 112 a built in the distal end of the second arm 112.
- the joint unit 112 a includes, for example, a motor, and the first arm 111 is configured to be pivotable about the proximal end by the joint unit 112 a.
- the proximal end of the second arm 112 and the distal end of the third arm 113 are connected by a joint 113 a incorporated in the distal end of the third arm 113.
- the joint portion 113a also includes, for example, a motor, and the second arm 112 is configured to be pivotable around the proximal end portion by the joint portion 113a.
- the vertical movement mechanism 115 includes a guide 115 a extending in the vertical direction, and a base end of the third arm 113 is attached to the guide 115 a.
- a driving unit (not shown) including, for example, a motor and the like is incorporated in the vertical movement mechanism 115, and this driving unit vertically moves the third arm 113 (arms 111 to 113) along the guide 115a. It is configured to be movable.
- water is used when grinding the processing surface of the wafer W in the grinding units 160, 170 and 180 at the processing positions A1 to A3.
- the cleaning liquid is used when the third cleaning unit 150 roughly cleans the processing surface of the wafer W.
- the cleaning solution is used.
- the area using the water and the cleaning liquid is the wet environment area R1 (the shaded area in FIG. 7) containing moisture. In the wet environment region R1, shavings are also generated when the processing surface of the wafer W is ground by the grinding units 160, 170, and 180.
- the vertical movement mechanism 115 is preferably disposed in the dry environment area R2 (dotted area in FIG. 7) isolated from the wet environment area R1.
- the dry environment region R2 is a region on the Y axis negative direction side of the support 184 of the finish grinding unit 180 described later.
- the drive unit of the vertical movement mechanism 115 is not exposed to moisture or the like, and the drive unit can be appropriately operated.
- the guide 115a of the vertical movement mechanism 115 is open, a seal mechanism or the like for protecting the guide 115a, which is a sliding portion, becomes unnecessary, and the apparatus configuration can be simplified.
- the dry environment region R2 is on the side of the transfer station 6, access from the transfer station 6 is easy, and maintenance of the vertical movement mechanism 115 can be easily performed.
- the transfer unit 110 having such a configuration can transfer the wafer W to the delivery position A0, the alignment unit 120, the first cleaning unit 130, and the second cleaning unit 140.
- the alignment unit 120 adjusts the horizontal direction of the wafer W before the grinding process.
- the alignment unit 120 has a processing container 121, and a base 122, a spin chuck 123, and a detection unit 124 are provided inside the processing container 121.
- the spin chuck 123 holds the wafer W by suction and is configured to be rotatable by a rotation mechanism (not shown).
- the detection unit 124 may detect the position of the notch portion of the wafer W by, for example, imaging the outer peripheral portion of the wafer W, or the notch portion of the wafer W by irradiating the peripheral portion of the wafer W with laser light. The position of may be detected. Then, the detection unit 124 detects the position of the notch of the wafer W while rotating the wafer W held by the spin chuck 123, thereby adjusting the position of the notch and adjusting the horizontal direction of the wafer W. Do.
- the first cleaning unit 130 is disposed below the alignment unit 120, the first cleaning unit 130 includes the spin chuck 133 as described later, so that the spin chuck 133 is rotated at high speed during cleaning. Vibrate.
- the processing container 121 is preferably supported independently of the first cleaning unit 130 because the horizontal orientation of the wafer W can not be properly adjusted if vibrations are transmitted to the alignment unit 120.
- the supporting method of the processing container 121 is arbitrary, for example, the processing container 121 may be supported by a support member provided in the wet environment region R1, or may be supported by a casing (side wall) of the processing device 4. It may be suspended and supported from the ceiling surface of the processing device 4.
- the processing surface of the wafer W after the grinding processing is cleaned, more specifically, spin-cleaned.
- the first cleaning unit 130 has a rectangular support plate 131.
- the first arm 111 and the transport pad 114 of the transport unit 110 access the first cleaning unit 130 from the X-axis positive direction and the Y-axis positive direction. Therefore, the X-axis positive direction and the Y-axis positive direction of the support plate 131 are open.
- a shutter 132 is provided around the support plate 131.
- the upper and lower surfaces of the shutter 132 are open.
- the shutter 132 is vertically movable above and below the support plate 131 by an elevating mechanism (not shown).
- the shape of the shutter 132 in a plan view is not limited to the illustrated rectangular shape, and may be a shape covering the periphery of the support plate 131, for example, a circular shape.
- the shutter 132 When the shutter 132 is positioned above the support plate 131 as shown in FIGS. 9A and 10A, the shutter 132 is disposed with a slight gap from the bottom surface of the processing container 121 of the alignment unit 120. Be done. Due to this gap, it is possible to suppress transmission of vibration during the cleaning process in the first cleaning unit 130 to the alignment unit 120.
- a processing space K is formed by the support plate 131, the shutter 132, and the processing container 121.
- a skirt 121 a is provided on the bottom of the processing container 121 so as to cover the gap between the bottom of the processing container 121 and the shutter 132 outside the shutter 132. By the skirt 121a, the cleaning liquid is not scattered to the outside when the wafer W is cleaned.
- the processing space K is opened. Then, the wafer W is transferred to the processing space K by the transfer unit 110. Further, the transfer pad 34 of the wafer transfer apparatus 32 can access the opened processing space K from a direction different from the transfer unit 110, that is, the transfer station 6 side.
- a spin chuck 133 for holding and rotating the wafer W is provided.
- the spin chuck 133 adsorbs and holds the wafer W.
- a drive unit 134 including, for example, a motor is provided under the spin chuck 133.
- the spin chuck 133 can be rotated at a predetermined speed by the drive unit 134 and can be moved up and down.
- a cup 135 for receiving and recovering the liquid scattered or dropped from the wafer W is provided.
- the cleaning solution nozzle 136 supplies a cleaning solution, for example, pure water, to the processing surface of the wafer W.
- the cleaning solution nozzle 136 is configured to be movable in the horizontal direction and the vertical direction by the moving mechanism 137. Then, while rotating the wafer W held by the spin chuck 133, the cleaning liquid is supplied from the cleaning liquid nozzle 136 to the processed surface of the wafer W. Then, the supplied cleaning liquid diffuses on the processing surface of the wafer W, and the processing surface is cleaned.
- the second cleaning unit 140 cleans the non-processed surface of the wafer W after the grinding processing and held by the transfer pad 114 of the transfer unit 110 and cleans the transfer pad 114.
- the second cleaning unit 140 has a processing container 141, and a sponge cleaning tool 142 having a cleaning solution nozzle inside the processing container 141, an air nozzle 143, a stone cleaning tool 144 (grindstone), and a brush.
- a cleaning tool 145 is provided.
- the sponge cleaner 142, the air nozzle 143, the stone cleaner 144, and the brush cleaner 145 are each configured to be movable in the vertical direction by an elevating mechanism (not shown).
- the sponge cleaning tool 142 has, for example, a sponge extending longer than the diameter of the wafer W, and the sponge can be supplied with a cleaning solution, for example, pure water, and is attached to the non-processed surface, more specifically, the non-processed surface. Wash the protective tape.
- the air nozzle 143 jets air to the non-processed surface of the wafer W to dry the non-processed surface.
- the cleaning of the non-processed surface by the sponge and the cleaning liquid and the drying of the non-processed surface by air are performed while the wafer W is held by the transfer pad 114, and the transfer pad 114 (wafer W) is rotated by the rotating unit 111a. It will be. Thus, the entire non-processed surface of the wafer W is cleaned.
- Each of the stone cleaning tool 144 and the brush cleaning tool 145 extends, for example, longer than the diameter of the suction surface of the wafer W in the transfer pad 114 of the transfer unit 110, and contacts and cleans the suction surface.
- the cleaning of the transfer pad 114 by the stone cleaning tool 144 and the brush cleaning tool 145 is performed while rotating the transfer pad 114 by the rotating unit 111a. Thus, the entire surface of the transfer pad 114 is cleaned.
- the third cleaning unit 150 cleans the processing surface of the wafer W after the grinding process and the chuck 101.
- the third cleaning unit 150 has a cleaning solution nozzle 151, a stone cleaning tool 152 (grindstone), and a moving mechanism 153.
- the cleaning solution nozzle 151 and the stone cleaning tool 152 are respectively movable by the moving mechanism 153 in the horizontal direction and the vertical direction.
- the cleaning solution nozzle 151 supplies a cleaning solution, for example, pure water, to the processing surface of the wafer W. Then, while rotating the wafer W held by the chuck 101, the cleaning liquid is supplied from the cleaning liquid nozzle 151 to the processing surface of the wafer W. Then, the supplied cleaning liquid diffuses on the processing surface of the wafer W, and the processing surface is cleaned.
- a cleaning solution for example, pure water
- the stone cleaning tool 152 contacts and cleans the surface of the chuck 101.
- a cleaning solution such as pure water may be supplied to the surface of the chuck 101 from a nozzle (not shown).
- the rough grinding unit 160 roughly grinds the processing surface of the wafer W.
- the rough grinding unit 160 has an annular rough grinding wheel 161.
- the rough grinding wheel 161 is provided with a drive unit 163 via a spindle 162.
- the drive unit 163 incorporates, for example, a motor (not shown) to rotate the rough grinding stone 161 and to move it along the support column 164 in the vertical direction and the horizontal direction (X-axis direction). Then, while the wafer W held by the chuck 101 is in contact with part of the arc of the rough grinding wheel 161, the back surface of the wafer W is roughly ground by rotating the chuck 101 and the rough grinding wheel 161 respectively. .
- a grinding fluid for example, water, is supplied to the back surface of the wafer W.
- the back surface of the wafer W is middle ground.
- the configuration of the middle grinding unit 170 is substantially the same as the configuration of the rough grinding unit 160, and includes a middle grinding stone 171 spindle 172, a drive portion 173, and a support column 174.
- the particle size of the middle grinding wheel 171 is smaller than the particle size of the rough grinding wheel 161. Then, while the grinding fluid is supplied to the back surface of the wafer W held by the chuck 101, the chuck 101 and the middle grinding wheel 171 are rotated while the back surface is in contact with a part of the arc of the middle grinding wheel 171. Thereby grinding the back surface of the wafer W.
- the back surface of the wafer W is finish ground.
- the configuration of the finish grinding unit 180 is substantially the same as the configuration of the rough grinding unit 160 and the middle grinding unit 170, and has a finish grinding wheel 181 spindle 182, a drive portion 183, and a support 184.
- the particle size of the finish grinding wheel 181 is smaller than the particle size of the middle grinding wheel 171. Then, while the grinding fluid is supplied to the back surface of the wafer W held by the chuck 101, the chuck 101 and the finish grinding wheel 181 are rotated while the back surface is in contact with a part of the arc of the finish grinding wheel 181. Thereby grinding the back surface of the wafer W.
- a cassette C containing a plurality of wafers W is placed on the cassette mounting table 10 of the loading station 2.
- the wafer W is stored so that the surface of the wafer W to which the protective tape is attached is directed upward.
- the wafer W in the cassette C is taken out by the transfer fork 33 of the wafer transfer apparatus 32 and transferred to the processing apparatus 4.
- the front and back surfaces are reversed such that the processing surface of the wafer W is directed upward by the transfer fork 33.
- the wafer W transferred to the processing apparatus 4 is delivered to the spin chuck 123 of the alignment unit 120. Then, in the alignment unit 120, the horizontal direction of the wafer W is adjusted (step S1 in FIG. 12).
- the wafer W is transported by the transport unit 110 from the alignment unit 120 to the delivery position A0 and delivered to the chuck 101 at the delivery position A0. Thereafter, the rotary table 100 is rotated 90 degrees counterclockwise to move the chuck 101 to the first processing position A1. Then, the processing surface of the wafer W is roughly ground by the rough grinding unit 160 (Step S2 in FIG. 12).
- the chuck 101 is cleaned using the stone cleaning tool 152 of the third cleaning unit 150 (step T1 in FIG. 12). Cleaning of the chuck 101 is performed at an arbitrary timing up to step S2.
- the rotary table 100 is rotated 90 degrees counterclockwise to move the chuck 101 to the second processing position A2. Then, the back surface of the wafer W is ground by the middle grinding unit 170 (step S3 in FIG. 12).
- the rotary table 100 is rotated 90 degrees counterclockwise to move the chuck 101 to the third processing position A3. Then, the back surface of the wafer W is finish ground by the finish grinding unit 180 (step S4 in FIG. 12).
- step S5 cleaning is performed to remove dirt on the processing surface to a certain extent.
- the wafer W is transferred by the transfer unit 110 from the delivery position A0 to the second cleaning unit 140.
- the transfer pad 114 sucks and holds the processed surface of the wafer W on the entire surface.
- the non-processed surface of the wafer W is cleaned by the sponge cleaning tool 142 in a state where the wafer W is rotationally held by the transfer pad 114 (step S6 in FIG. 12).
- air is jetted from the air nozzle 143 to the non-processed surface, and the non-processed surface is dried.
- the transfer pad 114 of the transfer unit 110 is cleaned using the stone cleaning tool 144 and the brush cleaning tool 145 of the second cleaning unit 140. (Step T2 in FIG. 12). Cleaning of the transfer pad 114 by the stone cleaning tool 144 and the brush cleaning tool 145 is performed while rotating the transfer pad 114 by the rotating unit 111a. Further, the cleaning of the transfer pad 114 is performed at an arbitrary timing up to step S6.
- the wafer W is transferred by the transfer unit 110 from the second cleaning unit 140 to the first cleaning unit 130.
- the shutter 132 is positioned below the support plate 131, and the processing space K is opened.
- the shutter 132 is moved up and down to dispose the shutter 132 above the support plate 131, thereby forming the processing space K.
- the cleaning liquid is supplied from the cleaning liquid nozzle 136 to the processing surface of the wafer W, and the processing surface is finished and cleaned (Step S7 in FIG. 12).
- step S7 the processing surface of the wafer W is cleaned and dried to a desired degree of cleanliness. Then, when the finish cleaning and drying of the processed surface of the wafer W are finished, the shutter 132 is lowered to arrange the shutter 132 under the support plate 131, and the processing space K is opened.
- the wafer W is transferred by the wafer transfer apparatus 32 from the first cleaning unit 130 to the post-processing apparatus 5.
- the transfer pad 34 sucks and holds the processed surface of the wafer W on the entire surface.
- post-processing such as mounting processing for holding the wafer W on the dicing frame and peeling processing for peeling the protective tape attached to the wafer W is performed (Step S8 in FIG. 12).
- the transfer pad 114 of the transfer unit 110 is disposed above the second cleaning unit 140 which is a standby position. There is.
- the transport pad 114 is preferably disposed at a position higher than the chuck 101 (the delivery position A0 and the processing positions A1 to A3) of the rotary table 100.
- the processing surface of the wafer W is ground by the grinding units 160, 170, 180 in the above-described steps S2 to S4, shavings are generated, and the contaminated air containing the shavings flows from the chuck 101 side. Therefore, by disposing the transport pad 114 higher than the chuck 101 when the transport pad 114 stands by, contamination of the transport pad 114 by contaminated air can be suppressed.
- the transport unit 110 is an articulated robot including three arms 111 to 113, and the arms 111 to 113 can be moved independently.
- the transport pad 114 can access the delivery position A 0, the alignment unit 120, the first cleaning unit 130, and the second cleaning unit 140. Then, since the wafer W can be transported to the delivery position A0 and each unit 120, 130, and 140 by one transport unit 110 as described above, the freedom of movement of the transport unit 110 can be increased. Furthermore, since only one wafer W transfer means is used, the apparatus configuration of the processing apparatus 4 can be simplified. Therefore, wafer processing can be performed efficiently.
- the delivery position A0, the second cleaning unit 140, the alignment unit 120, and the first cleaning unit 130 are arranged side by side in the Y-axis direction, so the access range of the transport unit 110 is small. Thus, the wafer W can be efficiently transported.
- the alignment unit 120 and the first cleaning unit 130 are stacked in the processing apparatus 4, the footprint of the processing apparatus 4 can be reduced. As a result, the installation freedom of the processing apparatus 4 is improved. Further, by laminating the alignment unit 120 and the first cleaning unit 130 in this manner, maintenance of each of the units 120 and 130 can be easily performed.
- the alignment unit 120 and the first cleaning unit 130 are stacked in this order from the top, that is, the first cleaning unit 130 that performs liquid processing is provided in the lower layer of the alignment unit 120. In such a case, drainage in the first cleaning unit 130 can be easily performed from the lower portion of the first cleaning unit 130, and particles generated in the first cleaning unit 130 do not enter the alignment unit 120. .
- the stacking order of the alignment unit 120 and the first cleaning unit 130 is not limited to this.
- a series of processes can be continuously performed on a plurality of wafers W, and the throughput can be improved.
- the configuration of the substrate processing system 1 is not limited to the above embodiment.
- the alignment unit 120 and the first cleaning unit 130 are stacked, but may be arranged in the horizontal direction. However, from the viewpoint of reducing the footprint, it is preferable to stack them. Further, the first cleaning unit 130 may be provided outside the processing device 4, for example, between the processing device 4 and the post-processing device 5.
- the second cleaning unit 140 was arranged side by side in the horizontal direction with the alignment unit 120 and the first cleaning unit 130, but the second cleaning unit 140 is stacked on the alignment unit 120 and the first cleaning unit 130. May be provided.
- the transport pad 114 of the transport unit 110 always needs a standby position, arranging the second cleaning unit 140 at the standby position is efficient as a layout.
- the vertical movement mechanism 115 of the transport unit 110 is fixedly provided in the dry environment region R ⁇ b> 2, but may be movable in the Y-axis direction in FIG. 1, for example. In such a case, any one of the three arms 111 to 113 may be omitted.
- another wafer transfer apparatus may be provided, for example, between the processing apparatus 4 and the post-processing apparatus 5.
- the wafer transfer apparatus transfers, for example, the wafer W from the first cleaning unit 130 to the post-processing apparatus 5.
- the mounting process and the peeling process are performed in the post-processing apparatus 5, but a dicing process may be performed on the wafer W.
- the substrate processing system 1 may separately have a dicing apparatus that performs a dicing process. Such a dicing process may be performed before the grinding process in the processing apparatus 4 or may be performed after the grinding process.
- the substrate processing system 1 may omit the post-processing apparatus 5 and perform the mounting processing, the peeling processing, and the dicing processing outside the substrate processing system 1. In such a case, the wafer W ground by the processing apparatus 4 is transferred from the first cleaning unit 130 to the cassette mounting table 10 by the transfer pad 34 of the wafer transfer apparatus 32.
- the transport pad 114 of the transport unit 110 is configured to be switchable between the case of being tiltable in a side view and the case of fixing the tilt in the side view.
- the mechanism for making the transport pad 114 tiltable hereinafter, referred to as tilting mechanism
- fixing mechanism may have any configuration, but an example thereof will be described below.
- FIG. 14 is an explanatory view schematically showing the configuration of the tilting mechanism 200 of the transfer pad 114, in which (a) is a plan view and (b) is a side view.
- the tilting mechanism 200 has a support plate 201 and a biasing portion 202.
- the support plate 201 has a disk shape, and is provided concentrically with the transfer pad 114 above the transfer pad 114. Further, the support plate 201 is supported by the first arm 111.
- the biasing unit 202 biases the transport pad 114 in the separating direction with respect to the support plate 201.
- the biasing portions 202 are provided at a plurality of, for example, three locations on the same circumference of the support plate 201 at equal intervals.
- the transfer pad 114 is configured to be capable of tilting about the central axis C in the vertical direction by the three urging portions 202.
- the biasing portion 202 includes a bolt 203, a spring 204, and a case 205.
- the tip 203 a of the bolt 203 is fixed to the transfer pad 114.
- the bolt head 203 b of the bolt 203 is vertically movable on the upper surface side of the support plate 201.
- a spring 204 is provided on the outer peripheral surface of the bolt 203.
- the spring 204 is housed in the case 205.
- FIG. 16 is a side view schematically showing the configuration of the fixing mechanism 210 of the transfer pad 114.
- the fixing mechanism 210 is provided above each biasing portion 202.
- the fixing mechanism 210 has a lock member 211 and a cylinder 212.
- the lock member 211 extends vertically in the upper direction of the bolt 203.
- the cylinder 212 moves the lock member 211 in the vertical direction.
- the fixing mechanism 210 can fix the vertical movement of the transfer pad 114 by bringing the lock member 211 into contact with the bolt head 203 b of the bolt 203.
- the fixing mechanism 210 can move the transfer pad 114 up and down by disposing the lock member 211 at the upper side so as not to abut on the bolt 203.
- the lock member 211 of the fixing mechanism 210 is not in contact with the bolt 203 of the tilt mechanism 200, and the transport pad 114 is tilted by the function of the tilt mechanism 200. Is in a free state. Further, fixing the tilt of the transfer pad 114 means that the lock member 211 is in contact with the bolt 203 and the vertical movement of the transfer pad 114 is locked.
- the transfer pad 114 is made to tilt.
- the transfer pad 114 can be tilted along the inclination, and the wafer W can be properly received.
- the tilt of the transfer pad 114 is fixed. Thereby, it is possible to suppress irregular movement of the wafer W during transfer.
- the transport pad 114 is made tiltable. Thereby, even if the chuck 101 is not flat (horizontal) as shown in FIG. 17 for example, the transfer pad 114 can be tilted along the inclination, and the wafer W can be properly delivered.
- step S6 when cleaning the non-processed surface of the wafer W held by the transfer pad 114 in step S6, the tilt of the transfer pad 114 is fixed. Thereby, since the wafer W does not move up and down irregularly, the non-processed surface can be properly cleaned.
- the transfer pad 114 is cleaned using the stone cleaning tool 144 and the brush cleaning tool 145 of the second cleaning unit 140 in step T2.
- the tilt of the transfer pad 114 is fixed as shown in FIG. Thereby, since the conveyance pad 114 does not move up and down irregularly, the said conveyance pad 114 can be wash
- the tilt of the transfer pad 114 is fixed.
- the transport pad 114 is made to tilt.
- the transfer pad 114 can be tilted along the inclination, and the wafer W can be properly delivered.
- step S8 is performed, since it is processing which does not use conveyance unit 110, explanation is omitted.
- the transport pad 114 is made tiltable. Therefore, for example, even when the delivery side chuck is not flat (horizontal), the transfer pad 114 can be tilted along the inclination, and the wafer W can be properly delivered.
- the tilting of the transfer pad 114 is fixed when the wafer W is not transferred, for example, at the time of transfer of the wafer W, cleaning, or cleaning of the transfer pad 114, the transfer or cleaning can be appropriately performed. .
- wafer processing can be appropriately performed by switching the tilting and fixing of the transfer pad 114.
- the above substrate processing system 1 has a thickness measuring device (not shown) as a measuring unit that measures the thickness of the protective tape with respect to the wafer W held by the transfer pad 114 of the transfer unit 110. May be Although a thickness measuring device can use a well-known measuring device, for example, a spectroscopy interferometer can be used.
- the thickness of the tape itself may vary in the plane.
- the tension may be uneven, so the thickness of the protective tape may vary in the plane.
- grinding processing is performed in the state where the thickness of the tape is non-uniform as described above, the grinding becomes uniform within the wafer surface.
- the wafer W when the wafer W is transferred to the delivery position A0 by the transfer unit 110 after the horizontal direction of the wafer W is adjusted by the alignment unit 120 in step S1, for the wafer W held by the transfer pad 114, Measure the thickness of the protective tape with a thickness measuring device. Then, in the grinding process in steps S2 to S4, the method of contacting the grinding units 160, 170, 180 (grindstones 161, 171, 181) with the processing surface of the wafer W based on the measurement result of the thickness of the protective tape Adjust. Then, the wafer W can be ground and thinned to a uniform thickness in the wafer plane.
- the tilt of the transfer pad 114 is fixed. Thereby, the thickness of a protective tape can be measured appropriately.
- the protective tape not only the protective tape but also another protective member, for example, a coated protective agent, or a support substrate or the like attached to the surface of the wafer W (the surface on which the device is formed) It is applicable also when measuring the thickness of other protection members.
- the configuration of the tilting mechanism and the fixing mechanism of the transfer pad 114 is not limited to the above embodiment.
- the fixing mechanism 220 has a lock member 221 extending in the horizontal direction and a cylinder 222 for moving the lock member 221 in the horizontal direction.
- the fixing mechanism 220 can fix the vertical movement of the transfer pad 114 by bringing the lock member 221 into contact with the bolt 203.
- the fixing mechanism 220 can move the transfer pad 114 up and down by disposing the lock member 221 laterally so as not to abut on the bolt 203.
- the fixing mechanism 230 may have a rotatable lock member 231.
- the lock member 231 has three arms 231 a extending radially from the center, and each arm 231 a is provided to correspond to the bolt 203 of the tilting mechanism 200.
- the fixing mechanism 230 can fix the vertical movement of the transfer pad 114 by rotating the lock member 231 and bringing the arm 231 a into contact with the bolt 203.
- the fixing mechanism 230 can move the transfer pad 114 up and down by arranging the arm 231 a so as not to abut on the bolt 203.
- the transport unit 110 may have a mechanism 240 (hereinafter referred to as a combined mechanism 240) in which a tilting mechanism and a fixing mechanism are combined.
- the composite mechanism 240 has a support sphere 241 supporting the transfer pad 114 and an adsorber 242 adsorbing the support sphere 241 in a vacuum.
- a curved portion 242 a along the spherical shape of the support sphere 241 is formed on the lower surface of the adsorbing body 242.
- the support sphere 241 is configured to be rotatable along the curved portion 242a.
- the carrier pad 114 is configured to be capable of tilting about the central axis C in the vertical direction by the support spheres 241.
- a plurality of suction ports are formed in the bending portion 242a, and each suction port is connected to a suction mechanism (not shown) for vacuuming.
- the curved portion 242a of the adsorber 242 evacuates the support sphere 241 and holds it by suction. Thereby, the rotation of the support spheres 241 is fixed, and the tilt of the transfer pad 114 can be fixed.
- the support sphere 241 can freely rotate. Then, the carrier pad 114 can be tilted about the central axis C by rotating the support sphere 241 in this manner.
- the tilting mechanism 200 and the fixing mechanisms 210, 220, and 230 (the combined mechanism 240) according to the above embodiments are not limited to the transfer pad 114 of the transfer unit 110, and any application is possible as long as the wafer W is held by suction and transferred. it can.
- the tilting mechanism 200 and the fixing mechanisms 210, 220 and 230 (the combined mechanism 240) can be applied to the transfer pad 34 of the wafer transfer apparatus 32.
- the number of transfer means of the wafer W in the processing apparatus 4 is one, but two may be provided.
- the first transfer unit transfers the wafer W before the grinding process, and transfers the wafer W between the alignment unit 120 and the delivery position A0.
- the second transfer means transfers the wafer W after the grinding process, and transfers the wafer W between the delivery position A0, the first cleaning unit 130, and the second cleaning unit 140.
- the tilting mechanism 200 and the fixing mechanisms 210, 220, 230 (the combined mechanism 240) can be applied to the respective transport means.
- a protective tape is attached to the surface of the wafer W to protect the device, but the protective member of the device is not limited to this.
- a coated protective agent or a supporting substrate such as a supporting wafer or a glass substrate may be attached to the surface of the wafer, and even in such a case, one aspect of the present invention can be applied.
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Abstract
Description
本願は、2017年11月22日に日本国に出願された特願2017-224672号に基づき、優先権を主張し、その内容をここに援用する。
また、研削装置には、位置決め機構から回転テーブルのチャックにウェハを搬送するウェハ供給機構と、回転テーブルのチャックから洗浄機構にウェハを搬送するウェハ回収機構(搬送手段)とが設けられている。
ウェハ回収機構は、ウェハを吸着保持する搬送パッドと、搬送パッドを支持する旋回アームとを有している。搬送パッドと旋回アームの間には緩衝ばねが設けられ、緩衝ばねは、旋回アームに対して搬送パッドを離間方向に付勢しており、搬送パッドからウェハに加わる衝撃を緩和する。このようにウェハに強い押圧力が作用するのを避けるように、搬送パッドは旋回アームに対して上動可能に支持されている。
2 搬入ステーション
3 搬出ステーション
4 加工装置
5 後処理装置
6 搬送ステーション
10、20 カセット載置台
32 ウェハ搬送装置
33 搬送フォーク
34 搬送パッド
40 制御部
100 回転テーブル
101 チャック
110 搬送ユニット
111~113 アーム
111a 回転部
112a、113a 関節部
114 搬送パッド
115 鉛直移動機構
120 アライメントユニット
130 第1の洗浄ユニット
140 第2の洗浄ユニット
150 第3の洗浄ユニット
160 粗研削ユニット
170 中研削ユニット
180 仕上研削ユニット
200 傾動機構
210、220、230 固定機構
240 複合機構
A0 受渡位置
A1~A3 加工位置
R1 ウェット環境領域
R2 ドライ環境領域
W ウェハ
Claims (20)
- 基板保持部で基板の一面を保持して搬送し、基板の他面を受け渡す基板搬送装置であって、
前記基板保持部を側面視において傾動自在にする傾動機構と、
前記基板保持部の側面視における傾動を固定する固定機構と、を有する。 - 請求項1に記載の基板搬送装置において、
前記傾動機構は、前記基板保持部の鉛直方向の中心軸を中心に傾動させる。 - 基板を処理する基板処理システムであって、
基板を保持する第1の保持部と、
前記第1の保持部に保持された基板の加工面を加工する加工部と、
前記加工部で加工された基板であって第2の保持部に保持された基板の加工面と反対側の非加工面を洗浄し、又は前記第2の保持部を洗浄する洗浄部と、
前記第2の保持部を備え、当該第2の保持部で基板を保持して搬送し、且つ前記第1の保持部に基板を受け渡す受渡位置と前記洗浄部に対し、基板を搬送する搬送部と、を有し、
前記搬送部は、
前記第2の保持部を側面視において傾動自在にする傾動機構と、
前記第2の保持部の側面視における傾動を固定する固定機構と、を有する。 - 請求項3に記載の基板処理システムにおいて、
前記傾動機構は、前記第2の保持部の鉛直方向の中心軸を中心に傾動させる。 - 請求項3に記載の基板処理システムにおいて、
前記受渡位置において前記搬送部が前記第1の保持部に基板を受け渡す際、前記第2の保持部は前記傾動機構によって傾動自在になっており、
前記洗浄部において基板の非加工面又は前記第2の保持部を洗浄する際、前記第2の保持部は前記固定機構によって固定されている。 - 請求項5に記載の基板処理システムにおいて、
前記搬送部で基板を搬送する際、前記第2の保持部は前記固定機構によって固定されている。 - 請求項3に記載の基板処理システムにおいて、
前記搬送部は、複数のアームと、前記複数のアームを接続する複数の関節部とを有し、
前記複数のアームのうち先端のアームは、前記第2の保持部を支持し、
前記関節部は前記アームを移動させる。 - 請求項7に記載の基板処理システムにおいて、
前記搬送部は、前記先端のアームに設けられ、前記第2の保持部を回転させる回転部を有する。 - 請求項7に記載の基板処理システムにおいて、
前記搬送部は、前記複数のアームを鉛直方向に移動させる移動機構を有し、
前記移動機構は、前記加工部を支持する支持部を介して、前記加工部から隔離されて設けられている。 - 請求項3に記載の基板処理システムにおいて、
前記第1の保持部に保持される前の基板の水平方向の向きを調節するアライメント部を有し、
前記搬送部は、前記アライメント部に対し基板を搬送し、
前記搬送部が前記アライメント部から基板を受け取る際、前記第2の保持部は前記傾動機構によって傾動自在になっている。 - 請求項3に記載の基板処理システムにおいて、
前記加工部で加工された基板の加工面を洗浄する加工面洗浄部を有し、
前記搬送部は、前記加工面洗浄部に対し基板を搬送し、
前記搬送部が前記加工面洗浄部に基板を受け渡す際、前記第2の保持部は前記傾動機構によって傾動自在になっている。 - 請求項3に記載の基板処理システムにおいて、
基板の非加工面には、デバイスが形成されるとともに、当該非加工面に保護部材が設けられ、
前記第2の保持部に保持された基板の前記保護部材の厚みを計測する計測部を有し、
前記計測部において前記保護部材の厚みを計測する際、前記第2の保持部は前記固定機構によって固定されている。 - 請求項3に記載の基板処理システムにおいて、
前記第1の保持部を複数備え、前記受渡位置と前記加工部による加工が行われる加工位置との間で、複数の前記第1の保持部を回転させて移動させる回転テーブルを有する。 - 基板を処理する基板処理方法であって、
搬送部によって第1の保持部に基板を搬送する第1の搬送工程と、
その後、加工部によって、前記第1の保持部に保持された基板の加工面を加工する加工工程と、
その後、前記搬送部によって洗浄部に基板を搬送する第2の搬送工程と、
その後、前記洗浄部によって、前記搬送部の第2の保持部に保持された基板の加工面と反対側の非加工面を洗浄し、又は前記第2の保持部を洗浄する洗浄工程と、を有し、
前記搬送部は、
前記第2の保持部を側面視において傾動自在にする傾動機構と、
前記第2の保持部の側面視における傾動を固定する固定機構と、を有し、
前記第1の搬送工程において、前記搬送部が前記第1の保持部に基板を受け渡す際、前記第2の保持部は前記傾動機構によって傾動自在になっており、
前記洗浄工程において、基板の非加工面又は前記第2の保持部を洗浄する際、前記第2の保持部は前記固定機構によって固定されている。 - 請求項14に記載の基板処理方法において、
前記傾動機構は、前記第2の保持部の鉛直方向の中心軸を中心に傾動させる。 - 請求項14に記載の基板処理方法において、
前記第1の搬送工程と前記第2の搬送工程のそれぞれにおいて、前記搬送部で基板を搬送する際、前記第2の保持部は前記固定機構によって固定されている。 - 請求項14に記載の基板処理方法において、
前記第1の搬送工程の前に、アライメント部によって、基板の水平方向の向きを調節するアライメント工程を有し、
前記第1の搬送工程において、前記搬送部が前記アライメント部から基板を受け取る際、前記第2の保持部は前記傾動機構によって傾動自在になっている。 - 請求項14に記載の基板処理方法において、
前記洗浄工程後、前記搬送部によって加工面洗浄部に基板を搬送する第3の搬送工程と、
その後、前記加工面洗浄部によって基板の加工面を洗浄する加工面洗浄工程と、を有し、
前記第3の搬送工程において、前記搬送部が前記加工面洗浄部に基板を受け渡す際、前記第2の保持部は前記傾動機構によって傾動自在になっている。 - 請求項14に記載の基板処理方法において、
基板の非加工面には、デバイスが形成されるとともに、当該非加工面に保護部材が設けられ、
前記第1の搬送工程において、計測部によって、前記第2の保持部に保持された基板の前記保護部材の厚みを計測し、当該計測する際、前記第2の保持部は前記固定機構によって固定されている。 - 基板を処理する基板処理方法を基板処理システムによって実行させるように、当該基板処理システムを制御する制御部のコンピュータ上で動作するプログラムを格納した読み取り可能なコンピュータ記憶媒体であって、
前記基板処理方法は、
搬送部によって第1の保持部に基板を搬送する第1の搬送工程と、
その後、加工部によって、前記第1の保持部に保持された基板の加工面を加工する加工工程と、
その後、前記搬送部によって洗浄部に基板を搬送する第2の搬送工程と、
その後、前記洗浄部によって、前記搬送部の第2の保持部に保持された基板の加工面と反対側の非加工面を洗浄し、又は前記第2の保持部を洗浄する洗浄工程と、を有し、
前記搬送部は、
前記第2の保持部を側面視において傾動自在にする傾動機構と、
前記第2の保持部の側面視における傾動を固定する固定機構と、を有し、
前記第1の搬送工程において、前記搬送部が前記第1の保持部に基板を受け渡す際、前記第2の保持部は前記傾動機構によって傾動自在になっており、
前記洗浄工程において、基板の非加工面又は前記第2の保持部を洗浄する際、前記第2の保持部は前記固定機構によって固定されている。
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