WO2017012233A1 - Method for manufacturing stacked circuit board, and stacked circuit board - Google Patents

Method for manufacturing stacked circuit board, and stacked circuit board Download PDF

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Publication number
WO2017012233A1
WO2017012233A1 PCT/CN2015/095576 CN2015095576W WO2017012233A1 WO 2017012233 A1 WO2017012233 A1 WO 2017012233A1 CN 2015095576 W CN2015095576 W CN 2015095576W WO 2017012233 A1 WO2017012233 A1 WO 2017012233A1
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Prior art keywords
circuit board
stamping
adhesive
manufacturing
substrate
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PCT/CN2015/095576
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French (fr)
Chinese (zh)
Inventor
李新明
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惠州绿草电子科技有限公司
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Publication of WO2017012233A1 publication Critical patent/WO2017012233A1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the present invention relates to the field of circuit board manufacturing technology, and in particular to a method for manufacturing a stacked circuit board and a stacked circuit board.
  • the circuit board manufacturing method mainly includes a subtractive method, a semi-additive method, and a full additive method.
  • the conventional lithography etching method belongs to the subtractive method.
  • the entire copper foil is covered on the substrate, and the lithographic etching method is used to etch away the unnecessary copper foil. Therefore, there are high material consumption and many production processes. Disadvantages such as large waste liquid discharge and heavy environmental pressure.
  • the semi-additive method uses an electroplating process, which reduces the consumption of the etching solution compared to the photolithography etching method, but still has environmental pollution, uneven wiring of the pattern plating, difficulty in controlling the process parameters, high requirements on the substrate, and a flexible board. Problems such as manufacturing difficulties.
  • the full additive method specifically refers to a process of manufacturing a PCB by using a catalytic substrate.
  • the full addition method does not require etching of the copper foil, and the process is simple, and the double panel can be directly manufactured, but the full additive method requires a special catalytic substrate and is costly. Line performance and reliability need to be improved.
  • the invention provides a superimposed circuit board manufacturing method and a superimposed circuit board, which solves the technical problem that the circuit board has good line performance, high reliability, low manufacturing cost, high manufacturing efficiency and environmental protection.
  • An aspect of the present invention provides a method of manufacturing a stacked circuit board, including:
  • Cutting step cutting the substrate according to the set shape and size
  • Printing step printing the adhesive onto the substrate to form an insulating layer
  • Bonding step bonding a mechanically formed conductive layer to a corresponding insulating layer on the substrate to form an adhesive structure
  • Press-bonding step pressing the bonded structure to form a circuit board.
  • the conductive layer is formed by stamping, and the stamping step is: stamping the metal sheet into a conductive layer of a shape, a pattern and a size by a stamping die.
  • the metal sheet between the stamping upper mold and the stamping lower mold is punched into a conductive layer of a shape, a pattern and a size by a stamping upper mold and a stamping lower mold of the stamping die. At least one punch punching the bottom of the upper die is engaged with at least one die of the stamping die.
  • the adhesive used in the printing step is a thermal conductive adhesive or an insulating adhesive.
  • Another aspect of the present invention provides a stacked circuit board comprising a substrate on which an adhesive is printed as an insulating layer, and the adhesive is bonded and pressed with a mechanically formed conductive layer.
  • the conductive wire layer is stamped from a thin metal plate by a stamping die.
  • the stamping die includes a stamping upper die and a punching die, and the stamping die is provided with at least one punch at the bottom, and the stamping die is provided with a die matched with the punch.
  • the adhesive is a thermal conductive adhesive or an insulating adhesive.
  • the method for manufacturing a superposed circuit board of the present invention is an all-mechanical processing method, which does not require non-environmental processes such as electroplating and etching, and does not use chemicals, and is more environmentally friendly;
  • the superposed circuit board manufactured by using the superposed circuit board manufacturing method of the present invention has excellent line performance and high reliability.
  • FIG. 1 is a schematic view showing a method of manufacturing a superposed circuit board of the present invention
  • FIG. 2 is a schematic view showing an implementation process of a method for manufacturing a stacked circuit board of the present invention
  • FIG. 3 is a schematic structural view of a stacked circuit board of the present invention.
  • the embodiment provides a method for manufacturing a stacked circuit board, including:
  • Cutting step cutting the substrate 1 according to the set shape and size
  • Printing step the adhesive is printed onto the substrate 1 by a wire mesh screen printing method to form an insulating layer 2;
  • Stamping step the metal thin plate 31 is punched into a conductive layer 3 of a set shape, pattern and size by a stamping die 4; the conductive layer 3 can also be prepared by other mechanical means.
  • Bonding step bonding the conductive layer 3 to the corresponding insulating layer on the substrate to form an adhesive structure
  • Press-bonding step press-bonding the bonded structure to form a circuit board.
  • the substrate 1 may be an aluminum substrate, a fiberglass board (FR4), a paper substrate, a CEM-1 board, or the like.
  • the graphic printing method is adopted, and the adhesive is a thermal conductive adhesive or an insulating adhesive.
  • the metal thin plate 31 located between the press upper mold 41 and the press lower mold 42 is punched into a set shape by the press upper mold 41 of the press die 4 and the press lower mold 42.
  • the pattern and size of the conductive wire 3, the at least one punch 411 at the bottom of the stamping die 41 is engaged with the at least one die 421 of the stamping die 42. The greater the number of punches 411, the higher the efficiency of stamping.
  • the metal thin plate 31 may be a copper foil or the like.
  • the fabricated circuit board needs to be tested. If there is no problem with the technical parameters such as thermal conductivity, peel strength and withstand voltage of the circuit board after inspection, it can be packaged and shipped.
  • the method of manufacturing a superposed circuit board of the present invention is suitable for manufacturing a circuit board having a simple circuit and a large amount of use, and the circuit board produced by the present invention can be widely used for various LED products.
  • the embodiment further provides a superimposed circuit board including a substrate 1 on which an adhesive is printed as an insulating layer 2, and the insulating layer 2 is bonded and laminated with conductive
  • the wiring layer 3 is formed by stamping a thin metal plate 31 through a stamping die 4.
  • the conductive layer 3 can also be prepared by other mechanical means.
  • the substrate 1 may be an aluminum substrate, a fiberglass board (FR4), a paper substrate, a CEM-1 board, or the like.
  • the adhesive is a thermal conductive adhesive or an insulating adhesive.
  • the stamping die 4 includes a stamping upper die 41 and a stamping lower die 42, the stamping At least one punch 411 is provided at the bottom of the upper mold 41, and the stamping lower mold 42 is provided with a concave die 421 that cooperates with the punch 411.
  • the metal thin plate 31 may be a conductive material such as copper foil.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

A method for manufacturing a stacked circuit board comprises: a cutting step: tailoring a substrate (1) according to a set shape and size; a printing step: printing an adhesive on the substrate (1) to form an insulation layer (2); a bonding step: bonding a conductive wire layer (3) manufactured in a mechanical manner to the insulation layer corresponding to the substrate, so as to form a bonding structure; and a lamination step: laminating the bonding structure to manufacture a circuit board. A stacked circuit board. The adhesive is printed on the substrate (1) as the insulation layer (2); and the conductive wire layer (3) is bonded and laminated on the insulation layer, the conductive wire layer being formed by stamping a metal sheet by means of a stamping die (4). In the method for manufacturing a stacked circuit board, the stamped conductive wire layer is bonded and laminated on a base material having strong adhesiveness and heat dissipation performance, so as to manufacture a circuit board, and accordingly the processing is convenient and the manufacturing efficiency is high, etching is not needed, and no chemical medicine is used, and the manufacturing method and the stacked circuit board are environmentally-friendlier; the manufacturing cost is reduced, and the stacked circuit board has good performance and high reliability.

Description

一种叠加式电路板制造方法及叠加式电路板Superimposed circuit board manufacturing method and superimposed circuit board 技术领域Technical field
本发明涉及电路板制造技术领域，具体涉及一种叠加式电路板制造方法及叠加式电路板。The present invention relates to the field of circuit board manufacturing technology, and in particular to a method for manufacturing a stacked circuit board and a stacked circuit board.
背景技术Background technique
目前，电路板制造方法主要包括减成法、半加成法、全加成法。传统的光刻腐蚀法即属于减成法，首先将整张铜箔覆盖在基板上，采用光刻腐蚀法，再将不需要的铜箔腐蚀掉，因此，存在材料消耗高、生产工序多、废液排放大、环保压力重等缺点。半加成法使用电镀工艺，相较于光刻腐蚀法减少了刻蚀液的消耗，但仍具有环境污染、图形电镀得到线路不均匀、工艺参数控制困难、对基板要求较高、挠性板制造困难等问题。全加成法特指使用催化性基板加成制造PCB的工艺，全加成法不需要腐蚀铜箔，工艺简单，可以直接制造双面板，不过全加成法由于需要特制催化性基板而成本高、线路性能与可靠性有待提高。At present, the circuit board manufacturing method mainly includes a subtractive method, a semi-additive method, and a full additive method. The conventional lithography etching method belongs to the subtractive method. First, the entire copper foil is covered on the substrate, and the lithographic etching method is used to etch away the unnecessary copper foil. Therefore, there are high material consumption and many production processes. Disadvantages such as large waste liquid discharge and heavy environmental pressure. The semi-additive method uses an electroplating process, which reduces the consumption of the etching solution compared to the photolithography etching method, but still has environmental pollution, uneven wiring of the pattern plating, difficulty in controlling the process parameters, high requirements on the substrate, and a flexible board. Problems such as manufacturing difficulties. The full additive method specifically refers to a process of manufacturing a PCB by using a catalytic substrate. The full addition method does not require etching of the copper foil, and the process is simple, and the double panel can be directly manufactured, but the full additive method requires a special catalytic substrate and is costly. Line performance and reliability need to be improved.
现有技术中，还有采取激光和铣刀切割去除不需要的铜制出线路的方法，该方法效率太低，无法大批量生产。In the prior art, there is also a method of removing unnecessary copper lead lines by laser and milling cutters, which is too inefficient to be mass-produced.
因此，需研究一种线路性能佳、可靠性高、制造成本低、制造效率高又环保的电路板制造方法，以适用于生产线路简单用量大的电路板。Therefore, it is necessary to study a circuit board manufacturing method with good line performance, high reliability, low manufacturing cost, high manufacturing efficiency and environmental protection, which is suitable for a circuit board with a simple and large production line.
发明内容Summary of the invention
本发明提供一种叠加式电路板制造方法及叠加式电路板，解决了使电路板的线路性能佳、可靠性高、制造成本低、制造效率高又环保的技术问题。The invention provides a superimposed circuit board manufacturing method and a superimposed circuit board, which solves the technical problem that the circuit board has good line performance, high reliability, low manufacturing cost, high manufacturing efficiency and environmental protection.
本发明为解决上述问题所采用的技术方案为：The technical solution adopted by the present invention to solve the above problems is as follows:
本发明一方面提供一种叠加式电路板制造方法，包括：An aspect of the present invention provides a method of manufacturing a stacked circuit board, including:
开料步骤：将基板按设定形状与尺寸裁剪；Cutting step: cutting the substrate according to the set shape and size;
印刷步骤：将粘胶印刷到基板上形成绝缘层；Printing step: printing the adhesive onto the substrate to form an insulating layer;
粘合步骤：将通过机械方式制成的导电线层粘合到基板上对应的绝缘层上，形成粘合结构； Bonding step: bonding a mechanically formed conductive layer to a corresponding insulating layer on the substrate to form an adhesive structure;
压合步骤：将所述粘合结构进行压合，制成电路板。Press-bonding step: pressing the bonded structure to form a circuit board.
进一步地，所述导电线层通过冲压方式制成，冲压步骤为：通过冲压模具将金属薄板冲压为设定形状、图案与尺寸的导电线层。Further, the conductive layer is formed by stamping, and the stamping step is: stamping the metal sheet into a conductive layer of a shape, a pattern and a size by a stamping die.
更进一步地，在所述冲压步骤中，通过冲压模具的冲压上模、冲压下模将位于冲压上模与冲压下模之间的金属薄板冲压为设定形状、图案与尺寸的导电线层，冲压上模底部的至少一个冲头与冲压下模至少一个凹模相配合。Further, in the stamping step, the metal sheet between the stamping upper mold and the stamping lower mold is punched into a conductive layer of a shape, a pattern and a size by a stamping upper mold and a stamping lower mold of the stamping die. At least one punch punching the bottom of the upper die is engaged with at least one die of the stamping die.
进一步地，在所述印刷步骤中使用的粘胶为导热胶或绝缘胶。Further, the adhesive used in the printing step is a thermal conductive adhesive or an insulating adhesive.
本发明另一方面提供一种叠加式电路板，包括基板，在所述基板上印刷有粘胶作为绝缘层，所述粘胶上粘合并压合有通过机械方式制成的导电线层。Another aspect of the present invention provides a stacked circuit board comprising a substrate on which an adhesive is printed as an insulating layer, and the adhesive is bonded and pressed with a mechanically formed conductive layer.
进一步地，所述导电线层由金属薄板通过冲压模具冲压而成。Further, the conductive wire layer is stamped from a thin metal plate by a stamping die.
更进一步地，所述冲压模具包括冲压上模和冲压下模，所述冲压上模底部设有至少一个冲头，冲压下模设有与所述冲头配合的凹模。Further, the stamping die includes a stamping upper die and a punching die, and the stamping die is provided with at least one punch at the bottom, and the stamping die is provided with a die matched with the punch.
进一步地，粘胶为导热胶或绝缘胶。Further, the adhesive is a thermal conductive adhesive or an insulating adhesive.
本发明的有益效果在于：The beneficial effects of the invention are:
(1)本发明的叠加式电路板制造方法将铜箔冲压成所需的导电线后，将导电线粘合并压合至有强力胶粘性及散热性能的基材上来制造电路板，加工方便、制造效率高；(1) The method for manufacturing a superposed circuit board of the present invention, after punching a copper foil into a desired conductive wire, bonding the conductive wire and pressing it to a substrate having strong adhesiveness and heat dissipation properties to manufacture a circuit board, and processing Convenient and efficient in manufacturing;
(2)本发明的叠加式电路板制造方法为全机械式加工方法，无需电镀、蚀刻等非环保工序，不使用化学药品，更环保；(2) The method for manufacturing a superposed circuit board of the present invention is an all-mechanical processing method, which does not require non-environmental processes such as electroplating and etching, and does not use chemicals, and is more environmentally friendly;
(3)本发明的叠加式电路板制造方法制造成本降低30％，节约制造能源消耗；(3) The manufacturing method of the superposed circuit board manufacturing method of the present invention is reduced by 30%, and manufacturing energy consumption is saved;
(4)使用本发明的叠加式电路板制造方法制造的叠加式电路板线路性能佳、可靠性高。(4) The superposed circuit board manufactured by using the superposed circuit board manufacturing method of the present invention has excellent line performance and high reliability.
附图说明DRAWINGS
图1是本发明的叠加式电路板制造方法的示意图；1 is a schematic view showing a method of manufacturing a superposed circuit board of the present invention;
图2是本发明的叠加式电路板制造方法的实施过程示意图；2 is a schematic view showing an implementation process of a method for manufacturing a stacked circuit board of the present invention;
图3是本发明的叠加式电路板的结构示意图。 3 is a schematic structural view of a stacked circuit board of the present invention.
具体实施方式detailed description
下面结合附图具体阐明本发明的实施方式，附图仅供参考和说明使用，不构成对本发明专利保护范围的限制。The embodiments of the present invention are exemplified in the following with reference to the accompanying drawings, which are for the purpose of illustration and description.
如图1、2所示，本实施例提供一种叠加式电路板制造方法，包括：As shown in FIG. 1 and FIG. 2, the embodiment provides a method for manufacturing a stacked circuit board, including:
开料步骤：将基板1按设定形状与尺寸裁剪；Cutting step: cutting the substrate 1 according to the set shape and size;
印刷步骤：将粘胶通过钢网丝印方法印刷到基板1上，形成绝缘层2；Printing step: the adhesive is printed onto the substrate 1 by a wire mesh screen printing method to form an insulating layer 2;
冲压步骤：通过冲压模具4将金属薄板31冲压为设定形状、图案与尺寸的导电线层3；导电线层3还可以采用其他机械方式制备。Stamping step: the metal thin plate 31 is punched into a conductive layer 3 of a set shape, pattern and size by a stamping die 4; the conductive layer 3 can also be prepared by other mechanical means.
粘合步骤：将导电线层3粘合到基板上对应的绝缘层上，形成粘合结构；Bonding step: bonding the conductive layer 3 to the corresponding insulating layer on the substrate to form an adhesive structure;
压合步骤：将所述粘合结构进行压合固化，制成电路板。Press-bonding step: press-bonding the bonded structure to form a circuit board.
在本实施例中，所述基板1可为铝基板、玻璃纤维板(FR4)、纸基板或CEM-1板等。In this embodiment, the substrate 1 may be an aluminum substrate, a fiberglass board (FR4), a paper substrate, a CEM-1 board, or the like.
在本实施例中，在所述印刷步骤中，采用图形印刷法，粘胶为导热胶或绝缘胶等。In the embodiment, in the printing step, the graphic printing method is adopted, and the adhesive is a thermal conductive adhesive or an insulating adhesive.
在本实施例中，在所述冲压步骤中，通过冲压模具4的冲压上模41、冲压下模42将位于冲压上模41与冲压下模42之间的金属薄板31冲压为设定形状、图案与尺寸的导电线3，冲压上模41底部的至少一个冲头411与冲压下模42至少一个凹模421相配合。冲头411的数量越多，冲压的效率越高。In the present embodiment, in the press step, the metal thin plate 31 located between the press upper mold 41 and the press lower mold 42 is punched into a set shape by the press upper mold 41 of the press die 4 and the press lower mold 42. The pattern and size of the conductive wire 3, the at least one punch 411 at the bottom of the stamping die 41 is engaged with the at least one die 421 of the stamping die 42. The greater the number of punches 411, the higher the efficiency of stamping.
在本实施例中，所述金属薄板31可为铜箔等。In the embodiment, the metal thin plate 31 may be a copper foil or the like.
制成的电路板需进行检测，如检测后电路板的导热系数、剥离强度、耐电压等技术参数无问题后，即可包装入库出货。The fabricated circuit board needs to be tested. If there is no problem with the technical parameters such as thermal conductivity, peel strength and withstand voltage of the circuit board after inspection, it can be packaged and shipped.
本发明的叠加式电路板制造方法适用于制造线路简单且用量大的电路板，如本发明制成的电路板可广泛用于各种LED产品。The method of manufacturing a superposed circuit board of the present invention is suitable for manufacturing a circuit board having a simple circuit and a large amount of use, and the circuit board produced by the present invention can be widely used for various LED products.
如图3所示，本实施例还提供一种叠加式电路板，包括基板1，在所述基板1上印刷有粘胶作为绝缘层2，所述绝缘层2上粘合并压合有导电线层3，所述导电线层3由金属薄板31通过冲压模具4冲压而成。导电线层3还可以采用其他机械方式制备。As shown in FIG. 3, the embodiment further provides a superimposed circuit board including a substrate 1 on which an adhesive is printed as an insulating layer 2, and the insulating layer 2 is bonded and laminated with conductive The wiring layer 3 is formed by stamping a thin metal plate 31 through a stamping die 4. The conductive layer 3 can also be prepared by other mechanical means.
在本实施例中，所述基板1可为铝基板、玻璃纤维板(FR4)、纸基板或CEM-1板等。In this embodiment, the substrate 1 may be an aluminum substrate, a fiberglass board (FR4), a paper substrate, a CEM-1 board, or the like.
在本实施例中，粘胶为导热胶或绝缘胶等。In this embodiment, the adhesive is a thermal conductive adhesive or an insulating adhesive.
在本实施例中，所述冲压模具4包括冲压上模41和冲压下模42，所述冲压 上模41底部设有至少一个冲头411，冲压下模42设有与所述冲头411配合的凹模421。In the present embodiment, the stamping die 4 includes a stamping upper die 41 and a stamping lower die 42, the stamping At least one punch 411 is provided at the bottom of the upper mold 41, and the stamping lower mold 42 is provided with a concave die 421 that cooperates with the punch 411.
在本实施例中，所述金属薄板31可为铜箔等导电材料。In the embodiment, the metal thin plate 31 may be a conductive material such as copper foil.
上述实施例为本发明较佳的实施方式，但本发明的实施方式并不受上述实施例的限制，其他的任何未背离本发明的精神实质与原理下所作的改变、修饰、替代、组合、简化，均应为等效的置换方式，都包含在本发明的保护范围之内。 The above embodiments are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and combinations thereof may be made without departing from the spirit and scope of the invention. Simplifications should all be equivalent replacements and are included in the scope of the present invention.

Claims (8)

  1. 一种叠加式电路板制造方法，包括：A method of manufacturing a stacked circuit board, comprising:
    开料步骤：将基板按设定形状与尺寸裁剪；Cutting step: cutting the substrate according to the set shape and size;
    其特征在于，还包括：It is characterized by:
    印刷步骤：将粘胶印刷到基板上形成绝缘层；Printing step: printing the adhesive onto the substrate to form an insulating layer;
    粘合步骤：将通过机械方式制成的导电线层粘合到基板上对应的绝缘层上，形成粘合结构；Bonding step: bonding a mechanically formed conductive layer to a corresponding insulating layer on the substrate to form an adhesive structure;
    压合步骤：将所述粘合结构进行压合，制成电路板。Press-bonding step: pressing the bonded structure to form a circuit board.
  2. 根据权利要求1所述的叠加式电路板制造方法，其特征在于：The method of manufacturing a stacked circuit board according to claim 1, wherein:
    所述导电线层通过冲压方式制成，冲压步骤为：通过冲压模具将金属薄板冲压为设定形状、图案与尺寸的导电线层。The conductive wire layer is formed by stamping, and the stamping step is: stamping the metal thin plate into a conductive layer of a shape, a pattern and a size by a stamping die.
  3. 根据权利要求2所述的叠加式电路板制造方法，其特征在于：The method of manufacturing a stacked circuit board according to claim 2, wherein:
    在所述冲压步骤中，通过冲压模具的冲压上模、冲压下模将位于冲压上模与冲压下模之间的金属薄板冲压为设定形状、图案与尺寸的导电线层，冲压上模底部的至少一个冲头与冲压下模至少一个凹模相配合。In the stamping step, the metal sheet between the stamping upper mold and the stamping lower mold is punched into a conductive layer layer of a set shape, a pattern and a size by a stamping upper mold and a stamping lower mold of the stamping die, and punching the bottom of the upper mold At least one of the punches cooperates with at least one die of the stamping die.
  4. 根据权利要求1所述的叠加式电路板制造方法，其特征在于：The method of manufacturing a stacked circuit board according to claim 1, wherein:
    在所述印刷步骤中使用的粘胶为导热胶或绝缘胶。The adhesive used in the printing step is a thermal conductive adhesive or an insulating adhesive.
  5. 一种叠加式电路板，包括基板，其特征在于：在所述基板上印刷有粘胶作为绝缘层，所述粘胶上粘合并压合有通过机械方式制成的导电线层。A superimposed circuit board comprising a substrate, characterized in that an adhesive is printed on the substrate as an insulating layer, and the adhesive layer is bonded and pressed with a mechanically formed conductive layer.
  6. 根据权利要求5所述的叠加式电路板，其特征在于：所述导电线层由金属薄板通过冲压模具冲压而成。The stacked circuit board according to claim 5, wherein the conductive wire layer is stamped from a thin metal plate by a stamping die.
  7. 根据权利要求6所述的叠加式电路板，其特征在于：所述冲压模具包括冲压上模和冲压下模，所述冲压上模底部设有至少一个冲头，冲压下模设有与所述冲头配合的凹模。The stacked circuit board according to claim 6, wherein the stamping die comprises a stamping upper die and a stamping die, the stamping die is provided with at least one punch at the bottom, and the stamping die is provided with The die of the punch fits.
  8. 根据权利要求5所述的叠加式电路板，其特征在于：粘胶为导热胶或绝缘胶。 The stacked circuit board according to claim 5, wherein the adhesive is a thermal conductive adhesive or an insulating adhesive.
PCT/CN2015/095576 2015-07-20 2015-11-25 Method for manufacturing stacked circuit board, and stacked circuit board WO2017012233A1 (en)

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