CN107072037A - A kind of circuit board and a kind of net substrate - Google Patents
A kind of circuit board and a kind of net substrate Download PDFInfo
- Publication number
- CN107072037A CN107072037A CN201710152007.9A CN201710152007A CN107072037A CN 107072037 A CN107072037 A CN 107072037A CN 201710152007 A CN201710152007 A CN 201710152007A CN 107072037 A CN107072037 A CN 107072037A
- Authority
- CN
- China
- Prior art keywords
- net
- circuit board
- layer
- metal pattern
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 38
- 239000010410 layer Substances 0.000 claims abstract description 36
- 239000002184 metal Substances 0.000 claims abstract description 31
- 229910052751 metal Inorganic materials 0.000 claims abstract description 31
- 239000012790 adhesive layer Substances 0.000 claims abstract description 20
- 238000005520 cutting process Methods 0.000 claims abstract description 13
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 5
- 238000003825 pressing Methods 0.000 claims abstract description 3
- 238000004080 punching Methods 0.000 claims abstract description 3
- 238000009413 insulation Methods 0.000 claims abstract 2
- 238000003698 laser cutting Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 238000003801 milling Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 239000002356 single layer Substances 0.000 claims description 2
- 238000009941 weaving Methods 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 238000003486 chemical etching Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 238000013213 extrapolation Methods 0.000 abstract description 2
- 230000007613 environmental effect Effects 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention is on a kind of circuit board and a kind of net substrate.The circuit board includes：Metal pattern layer, is to cut out circuitous pattern in metallic film；Adhesive layer, for insulation gluing piece；Metal pattern layer and the adhesive layer pressing is bonded as one.The net substrate includes：Hollow out conductive layer, is that one spacing cutting adhesive layer of circuitous pattern extrapolation by the circuit board along the metal pattern layer is formed；Substrate web, is the woven wire or metallic plate punching net of high density braided.The circuit board avoids chemical etching technology, reduces cost environmental protection, the net substrate has good heat dissipation effect, lightweight, the flexible, advantage of low manufacture cost, can be used in the field of circuit boards that positional precision is less than 0.1mm.
Description
Technical field
The present invention relates to a kind of circuit board, the circuit board of chemical attack is not needed more particularly to and using net as substrate
Circuit board.
Background technology
Printed circuit board (PCB) is a kind of basic material of electronics industry, and its processing technology is complicated, and cost is high, especially there is chemistry
Corrosion, welding.Analyze its production technology, and consider existing milling machine cutting, punch press cutting, laser cutting precision
The precision of chemical attack is approached, so the existing production technology by core of chemical attack has fallen under suspicion.
CN201520963598.4 is it is proposed that a kind of printed circuit board (PCB) using net as substrate in the prior art, but it is made
Make the limitation that method does not jump out chemical attack PCB Production still, cause cost high, pollute environment.
As can be seen here, existing printed circuit board (PCB), it is clear that there is environmental pollution, the high defect of cost, and urgently entered
One step is improved.Therefore, the design people proposes a kind of circuit board of new structure, and a kind of new structure the electricity using net as substrate
Road plate, i.e. net substrate, the problem of solving high existing printed circuit board (PCB) cost, pollution environment, solve available circuit plate radiating effect
Not good the problem of.By constantly research, design, and after studying sample repeatedly and improving, the practical valency of really tool is created finally
The present invention of value.
The content of the invention
It is a primary object of the present invention to the problem of overcoming high existing printed circuit board (PCB) cost, pollution environment is solved simultaneously
Certainly the difficulty of CN201520963598.4 productions, and provides a kind of circuit board of new structure, and new structure using net as base
The printed circuit board (PCB) at bottom, is named as net substrate.
The object of the invention to solve the technical problems is realized using following technical scheme.According to present invention proposition
A kind of circuit board, it is characterised in that it includes：Metal pattern layer, is to cut out circuitous pattern in metallic film；Adhesive layer, be
Insulate gluing piece；And the metal pattern layer and adhesive layer pressing are bonded as one.
Further, the adhesive layer is several layers of prepreg or high temperature resistant glued membrane.
Further, the metal pattern layer can be by welding resistance, gold-plated, tin plating, organic guarantor weldering film（OSP）, punching processing.
Further, the cutting method of the metal pattern layer has milling machine cutting, punch press cutting, laser cutting.
Further, the metal pattern layer is the circuitous pattern or multi-disc metal that piece of metal film is cut out
Film cuts out circuitous pattern and combined.
A kind of net substrate proposed by the present invention, it is characterised in that it includes the circuit board described in any of the above-described claim.
A kind of net substrate proposed by the present invention, including：Substrate web and the hollow out closely bonded in the substrate web are conductive
Layer, it is characterised in that the hollow out conductive layer is that circuitous pattern of the circuit board along the metal pattern layer is extrapolated between one
Formed away from the adhesive layer is cut.
Further, the substrate web is metal net or Metal-Piercing net, and its mesh is square or rhombus, its weaving square
Formula is plain weave or tiltedly knitted or satin weave that its net type is plain weave net or seat type net or hooks flower net or stretching nets, and its number of plies netted is
Monolayer net or multiple-level stack net, its mesh density are the mesh of 5 mesh -60, and string diameter is 0.05 millimeter -1 millimeter.
Further, the thickness of the circuit board needs to be defined with the component that substrate web is directly contacted to facilitate to be welded, and one
As 0.1-0.3 millimeters.
Further, the adhesive layer had both been bonded the metal pattern layer, was also bonded the substrate web.
From above technical scheme, a kind of present invention-circuit board and a kind of net substrate at least have following advantages：It is described
Circuit board and net substrate avoid chemical etching technology, cost-effective, free from environmental pollution.The net substrate is inherited simultaneously
CN201520963598.4 heat-sinking capability is strong, light, it is soft the advantages of, while the adhesive layer had both been bonded the metal pattern layer,
Also the substrate web is bonded, the manufacture craft of the net substrate is greatly simplified.
Described above is only the general introduction of technical solution of the present invention, in order to better understand the technological means of the present invention,
And can be practiced according to the content of specification, below with presently preferred embodiments of the present invention and coordinate accompanying drawing describe in detail as after.
Brief description of the drawings
Fig. 1 is a kind of metal pattern layer top view schematic diagram of circuit board of first embodiment of the invention.
Fig. 2 is a kind of circuit board top view schematic diagram of first embodiment of the invention.
Fig. 3 is a kind of net substrate top view schematic diagram of second embodiment of the invention.
Fig. 4 is a kind of net substrate front view schematic diagram of second embodiment of the invention.
1st, the blank parts 4 after metal pattern layer 2, adhesive layer 3, adhesive layer hollow out, the gutter after metal pattern layer hollow out
Divide 5 substrate webs
Embodiment
If Fig. 1 is a kind of metal pattern layer top view schematic diagram for circuit board that the first embodiment of the present invention is proposed, gold
Belong to graph layer（1）The thick copper foils of 0.1mm are used, by cutting, middle square are cut off, metal pattern layer cutting is formed and engraves
Blank parts after sky（4）.Metal pattern layer as shown in Figure 1 is bonded in whole adhesive layer, sheet as shown in Figure 2 is formed
The circuit board proposed is invented, black is illustrated as adhesive layer（2）.
Again along metal pattern layer on the basis of circuit board as shown in Figure 2（1）Circuitous pattern extrapolate spacing cutting institute
Adhesive layer formation such as Fig. 3 figures are stated,（1）For metal pattern layer,（2）Black edge strip is illustrated as remaining adhesive layer after cutting, black
The width of color edge strip is exactly described " one spacing of extrapolation ", and this spacing is exactly to insulate spacing for 0.2 millimeter,（3）For gluing
Blank parts after layer hollow out.Figure as shown in Figure 3 is bonded in whole substrate web（5）On, form the present invention as shown in Figure 4
The net substrate of proposition.Substrate web in the present embodiment（5）Copper mesh is used, mesh density is 60 mesh, and string diameter is 0.1 millimeter,
Adhesive layer（3）0.1 millimeter of thickness.
It is described above, only it is two embodiments of the present invention, any formal limitation not is made to the present invention, it is any ripe
Professional and technical personnel is known, without departing from the scope of the present invention, is done when using the technology contents of the disclosure above
Go out a little change or be modified to the equivalent embodiment of equivalent variations, as long as being the content without departing from technical solution of the present invention, foundation
Any simple modification, equivalent variations and modification that the technical spirit of the present invention is made to above example, still fall within the present invention
In the range of technical scheme.
Claims (10)
1. a kind of circuit board, it is characterised in that it includes：Metal pattern layer, is to cut out circuitous pattern in metallic film；Gluing
Layer, for insulation gluing piece；And the metal pattern layer and adhesive layer pressing are bonded as one.
2. circuit board according to claim 1, it is characterised in that the adhesive layer is several layers of prepreg or high temperature resistant
Glued membrane.
3. circuit board according to claim 1, it is characterised in that the metal pattern layer can by welding resistance, it is gold-plated, tin plating,
Organic guarantor's weldering film, punching processing.
4. circuit board according to claim 1, it is characterised in that the cutting method of the metal pattern layer have milling machine cutting,
Punch press cutting, laser cutting.
5. circuit board according to claim 1, it is characterised in that the metal pattern layer is that piece of metal film is cut out
Circuitous pattern or multi-disc metallic film cut out circuitous pattern and combine.
6. a kind of net substrate, it is characterised in that it includes the circuit board described in any of the above-described claim.
7. net substrate according to claim 6, including：Substrate web and the hollow out closely bonded in the substrate web are conductive
Layer, it is characterised in that the hollow out conductive layer is that circuitous pattern of the circuit board along the metal pattern layer is extrapolated between one
Formed away from the adhesive layer is cut.
8. net substrate according to claim 6, it is characterised in that the substrate web is metal net or Metal-Piercing net,
Its mesh is square or rhombus, and its weaving manner is plain weave or tiltedly knitted or satin weave, its net type be plain weave net or seat type net or
Flower net or stretching nets are hooked, its number of plies netted is monolayer net or multiple-level stack net, its mesh density is the mesh of 5 mesh -60, and string diameter is 0.05
- 1 millimeter of millimeter.
9. net substrate according to claim 6, it is characterised in that the thickness of the circuit board is needed and base with facilitating to be welded
The component that spacer screen is directly contacted is defined, general 0.1-0.3 millimeters.
10. net substrate according to claim 6, it is characterised in that the adhesive layer had both been bonded the metal pattern layer,
It is bonded the substrate web.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710152007.9A CN107072037A (en) | 2017-03-15 | 2017-03-15 | A kind of circuit board and a kind of net substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710152007.9A CN107072037A (en) | 2017-03-15 | 2017-03-15 | A kind of circuit board and a kind of net substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107072037A true CN107072037A (en) | 2017-08-18 |
Family
ID=59620367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710152007.9A Pending CN107072037A (en) | 2017-03-15 | 2017-03-15 | A kind of circuit board and a kind of net substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107072037A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108288611A (en) * | 2017-12-29 | 2018-07-17 | 申宇慈 | A kind of conducting wire base material cylinder |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0322997A2 (en) * | 1987-12-31 | 1989-07-05 | Jungpoong Products Co., Ltd. | Process for making printed circuit boards |
| US6406988B1 (en) * | 1998-04-24 | 2002-06-18 | Amerasia International Technology, Inc. | Method of forming fine pitch interconnections employing magnetic masks |
| WO2004012487A1 (en) * | 2002-07-29 | 2004-02-05 | Matsushita Electric Works, Ltd. | Method of manufacturing printed wiring boards and substrate used for the method |
| JP2004063801A (en) * | 2002-07-29 | 2004-02-26 | Matsushita Electric Works Ltd | Method for manufacturing wiring board and the substrate for use in the manufacturing method |
| CN103262668A (en) * | 2010-11-19 | 2013-08-21 | 凸版印刷株式会社 | Metal foil pattern laminate, method for punching metal foil, circuit board, method for producing same, and solar cell module |
| CN105101674A (en) * | 2015-07-20 | 2015-11-25 | 惠州绿草电子科技有限公司 | Manufacturing method of stacked circuit board and stacked circuit board |
| CN105263259A (en) * | 2015-11-30 | 2016-01-20 | 靳丰泽 | Printed circuit board with net as substrate |
| CN207369408U (en) * | 2017-03-15 | 2018-05-15 | 西华大学 | A kind of circuit board and a kind of net substrate |
-
2017
- 2017-03-15 CN CN201710152007.9A patent/CN107072037A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0322997A2 (en) * | 1987-12-31 | 1989-07-05 | Jungpoong Products Co., Ltd. | Process for making printed circuit boards |
| US6406988B1 (en) * | 1998-04-24 | 2002-06-18 | Amerasia International Technology, Inc. | Method of forming fine pitch interconnections employing magnetic masks |
| WO2004012487A1 (en) * | 2002-07-29 | 2004-02-05 | Matsushita Electric Works, Ltd. | Method of manufacturing printed wiring boards and substrate used for the method |
| JP2004063801A (en) * | 2002-07-29 | 2004-02-26 | Matsushita Electric Works Ltd | Method for manufacturing wiring board and the substrate for use in the manufacturing method |
| CN103262668A (en) * | 2010-11-19 | 2013-08-21 | 凸版印刷株式会社 | Metal foil pattern laminate, method for punching metal foil, circuit board, method for producing same, and solar cell module |
| CN105101674A (en) * | 2015-07-20 | 2015-11-25 | 惠州绿草电子科技有限公司 | Manufacturing method of stacked circuit board and stacked circuit board |
| CN105263259A (en) * | 2015-11-30 | 2016-01-20 | 靳丰泽 | Printed circuit board with net as substrate |
| CN207369408U (en) * | 2017-03-15 | 2018-05-15 | 西华大学 | A kind of circuit board and a kind of net substrate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108288611A (en) * | 2017-12-29 | 2018-07-17 | 申宇慈 | A kind of conducting wire base material cylinder |
| CN108288611B (en) * | 2017-12-29 | 2020-10-16 | 申宇慈 | Lead substrate cylinder |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170818 |