CN201499376U

CN201499376U - Interlayer conducting structure of PCB

Info

Publication number: CN201499376U
Application number: CN2009202335837U
Authority: CN
Inventors: 钟强; 许国祥; 郑方荣; 周吉; 刘兴才; 王明君; 金强; 王续光; 朱小飞
Original assignee: HANNSTAR BOARD TECHNOLOGY (JIANGYIN) Co Ltd
Current assignee: HANNSTAR BOARD TECHNOLOGY (JIANGYIN) Co Ltd
Priority date: 2009-07-24
Filing date: 2009-07-24
Publication date: 2010-06-02
Anticipated expiration: 2019-07-24

Abstract

The utility model relates to an interlayer conducting structure of a PCB, which comprises an inner layer circuit board (1), a perforated film (10) and a copper foil (4) etched with a copper convex block (9), wherein the inner layer circuit board (1), the perforated film (10) and the copper foil (4) etched with the copper convex block (9) are superposed together, and copper surface contact points (2) requiring interlayer conducting are convexly arranged on the surface of the inner layer circuit board (1). The interlayer conducting structure is characterized in that conductive paste (3) is printed on the surfaces of the copper surface contact points (2) and is tightly bonded with the copper convex block (9) of the copper foil (4). The structure has the advantages of low manufacturing cost, simple manufacture process, low sewage discharge amount, high yield of finished products, good reliability, etc.

Description

The structure of interlamination conduction of printed circuit boards

(1) technical field

The utility model relates to a kind of structure of obtaining the continuous conducting of each interlayer in printed circuit board (PCB).Belong to electronic technology field.

(2) background technology

Before the utility model was made, the interlayer conduction of printed circuit board (PCB) mainly was to do the hole by the mode of laser drill, passes through de-smear then, and the mode of chemical copper and electro-coppering is made and realized.The making flow process of whole printed circuit board (PCB) is longer, simultaneously because the limitation of electroplating process self can produce certain puzzlement to the making quality of printed circuit board (PCB), there is considerable influence in the yield of entire product, electroplates simultaneously and can produce a large amount of waste water.

(3) summary of the invention

The purpose of this utility model is to overcome above-mentioned deficiency, and a kind of fabrication cycle that can shorten printed circuit board (PCB) is provided, and can reduce discharged waste water, can promote simultaneously the structure of interlamination conduction of printed circuit boards of the yield of printed circuit board (PCB).

The purpose of this utility model so realizes: a kind of structure of interlamination conduction of printed circuit boards, comprise the film of internal layer circuit plate, boring and the Copper Foil of the protruding Block of etching copper, the Copper Foil of the film of described internal layer circuit plate, boring and the protruding Block of etching copper is superimposed together, described internal layer circuit plate surface is protruded and is provided with the copper face contact point that need do interlayer conduction, surface printing at described copper face contact point has conductive paste, and the Tong Tu Block of this conductive paste and described Copper Foil combines closely.

The structure of the utility model interlamination conduction of printed circuit boards, characteristics are that used thickness is that Copper Foil is made Tong Tu Block and printing conductive cream (as silver paste) on the copper face contact point of the circuit of having finished more than 3 ounces, and make the conductive paste can be under molten condition with Tong Tu Block combine closely (as snap-fastener), thereby realize the continuous conducting of each interlayer of printed circuit board (PCB), and the reliability that increases conducting place.

The beneficial effects of the utility model are:

The structure of the utility model interlamination conduction of printed circuit boards, it is low that this kind structure has cost of manufacture, and it is simple to make flow process, and quantity of wastewater effluent is low, finished product yield height, plurality of advantages that the reliability situation is good or the like.

(4) description of drawings

Fig. 1～11 are the manufacturing process schematic diagram of the structure of the utility model interlamination conduction of printed circuit boards.

Among the figure:

Internal layer circuit plate 1, copper face contact point 2, conductive paste 3, Copper Foil 4, dry film 5 and 6, dry film egative film 7 and 8, Tong Tu Block (Bump) 9, film 10, rivet 11.

(5) embodiment

The structure of the utility model interlamination conduction of printed circuit boards, comprise internal layer internal layer circuit plate 1, the film 10 of boring and the Copper Foil 4 of the protruding Block 9 of etching copper, the film 10 of described internal layer internal layer circuit plate 1, boring and the Copper Foil 4 of the protruding Block 9 of etching copper are superimposed together, described internal layer internal layer circuit plate 1 surface is protruded and is provided with the copper face contact point 2 that need do interlayer conduction, surface printing at described copper face contact point 2 has conductive paste 3, and this conductive paste 3 combines closely with the Tong Tu Block 9 of described Copper Foil 4.The manufacture method of the structure of the utility model interlamination conduction of printed circuit boards comprises following processing step:

Step 1, internal layer circuit plate printing conductive cream

(1) prepare one and finished the internal layer circuit plate 1 that internal layer circuit is made, as Fig. 1,

(2) finish internal layer circuit plate 1 that internal layer circuit makes and need make printing conductive cream (as silver paste) 3 on the copper face contact point (Pad) 2 of interlayer conduction described, as Fig. 2;

Bu Sudden two, etch copper Tu Block (Bump)

(1) preparing a thickness is 3 ounces (oz) above Copper Foil 4,

(2) carry out press mold in the upper and lower surface of described Copper Foil 4, press dry film 5 and 6, as Fig. 3,

(3) use two dry film egative films to carry out the dry film exposure, the part that the design of a slice dry film egative film 7 needs to do interlayer conduction is exposed exposure, and unwanted part covers; the design burn-out of another sheet dry film egative film 8 is not etched away with the protection copper face, as Fig. 4; Fig. 5

(4) dry film develops, and etching and striping etch the Tong Tu Block (Bump) 9 that needs, as Fig. 6;

Step 3, film boring

(1) prepare to make needed film 10, as Fig. 7,

(2) described film is holed, it is empty that the interconnected part of interlayer is revealed, as Fig. 8;

Step 4, pressing

(1) internal layer circuit plate, the film that finishes of boring and the Copper Foil of the protruding Block of etching copper (Bump) that will print conductive paste is superimposed together, and with rivet 11 riveteds, as Fig. 9, Figure 10,

(2) circuit board pressing that riveted is good, the turning part makes between complete layer, as Figure 11.

Claims

1. the structure of an interlamination conduction of printed circuit boards, comprise internal layer internal layer circuit plate (1), the film (10) of boring and the Copper Foil (4) of the protruding Block of etching copper (9), described internal layer internal layer circuit plate (1), the film (10) of boring and the Copper Foil (4) of the protruding Block of etching copper (9) are superimposed together, described internal layer internal layer circuit plate (1) surface is protruded and is provided with the copper face contact point (2) that need do interlayer conduction, it is characterized in that: the surface printing at described copper face contact point (2) has conductive paste (3), and this conductive paste (3) combines closely with the Tong Tu Block (9) of described Copper Foil (4).