CN203618240U - Gasket for pressing stepped printed circuit board - Google Patents
Gasket for pressing stepped printed circuit board Download PDFInfo
- Publication number
- CN203618240U CN203618240U CN201320729987.1U CN201320729987U CN203618240U CN 203618240 U CN203618240 U CN 203618240U CN 201320729987 U CN201320729987 U CN 201320729987U CN 203618240 U CN203618240 U CN 203618240U
- Authority
- CN
- China
- Prior art keywords
- layer
- wiring board
- printed wiring
- circuit board
- adherent layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a gasket for pressing a stepped printed circuit board. The gasket comprises an anti-sticking layer and a hard layer. The anti-sticking layer is fixedly covered by the hard layer. The shapes of the hard layer and the anti-sticking layer are matched with that of the stepped groove of the stepped printed circuit board. According to the gasket for pressing the stepped printed circuit board, through coating the hard layer on the anti-sticking layer, a problem that the gasket can not be easily taken out after the gasket and a core plate are bound and pressed is effectively avoided, and the working efficiency is raised. The hard layer and the anti-sticking layer are fixedly connected, the sliding of the anti-sticking layer into an interlayer of the printed circuit board is avoided, the risk of the layer separation and scrap is avoided, the shapes of the hard layer and the anti-sticking layer are matched with that of the stepped groove of the stepped printed circuit board, the circuit board can be conveniently and rapidly placed into the stepped groove, and problems of partial pressure loss and stepped groove excavation in the pressing process of the printed circuit board is effectively avoided.
Description
Technical field
The utility model relates to staged printed wiring board manufacturing technology, particularly a kind of staged printed wiring board press fitting pad.
Background technology
Along with technical development and the multifunction demand of electronic product, for enhancing product performance, assembling product density, reduce small product size and quality, as the printed board of its carrier also towards the future development of densification, high integration.Show the fail safe of components and parts in order to strengthen area of dissipation and reinforcement, for meeting the demand of communication product high speed, high information quantity, staged printed board is used widely.Staged printed board, as shown in Figure 1, i.e. same printed board is containing at least two kinds of thicknesss of slab, and multiple thickness of slab can cause the problem such as local decompression and step trough depression in pressing process, therefore, staged printed board pressing process need be at step trough joint sheet.
Traditionally, the FR4 pad that the conventional pad of staged printed board pressing that uses the prepreg that do not flow is hard, but it easily causes FR4 pad and central layer bonding, is difficult for the problems such as taking-up after pressing.
Summary of the invention
Based on this, the utility model is to overcome the defect of prior art, and a kind of staged printed wiring board press fitting pad is provided, and can effectively avoid and central layer bonding, after pressing, easily takes out, and enhances productivity.
Its technical scheme is as follows:
A kind of staged printed wiring board press fitting pad, comprises adherent layer, hard layer, and described hard layer is fixedly covering on described adherent layer, and this hard layer mates with the step trough of staged printed wiring board with the shape of adherent layer.
Preferably, the thickness of described adherent layer is 10 μ m～50 μ m.
The difference of the degree of depth that preferably, the thickness of described hard layer is step trough and the thickness of adherent layer.
Preferably, described adherent layer is aluminium flake.
Preferably, described adherent layer is Copper Foil.
Preferably, the monolateral size of described adherent layer is than the few 0.10mm～0.30mm of the monolateral size of step trough.
Preferably, the monolateral size of described adherent layer is than the few 0.15mm of the monolateral size of step trough.
Preferably, described adherent layer and hard layer are provided with multiple location holes.
Advantage to aforementioned techniques scheme or principle describe below:
Above-mentioned staged printed wiring board press fitting pad, by covering one deck adherent layer on hard layer, can effectively avoid the problem of easily taking out after pad and central layer bonding, pressing, has improved production efficiency; And hard layer is fixedly connected with adherent layer, avoid adherent layer to slip into printed wiring board interlayer, the risk that causes laminated sheet layering to scrap, this hard layer mates with the step trough of staged printed wiring board with the shape of adherent layer, can put into quickly and easily step trough, effectively avoid the problems such as the local decompression of printed wiring board pressing process and step trough depression.
Accompanying drawing explanation
Fig. 1 is the generalized section of staged printed board;
Fig. 2 is that the staged printed wiring board press fitting pad described in the utility model embodiment is arranged on the generalized section in step trough;
Fig. 3 is that the staged printed wiring board press fitting pad described in the utility model embodiment is arranged on the vertical view in step trough;
Description of reference numerals:
100, adherent layer, 200, hard layer, 300, staged printed wiring board, 310, step trough, 320, central layer, 330, prepreg, 400, location hole.
Embodiment
Below in conjunction with accompanying drawing, embodiment of the present utility model is elaborated:
As shown in Figure 2, a kind of staged printed wiring board press fitting pad, comprise adherent layer 100, hard layer 200, described hard layer 200 is fixedly covering on described adherent layer 100, and this hard layer 200 mates with the shape of adherent layer 100 and the step trough 310 of staged printed wiring board 300.Staged printed wiring board press fitting pad described in the present embodiment, the problem that by covering one deck adherent layer on hard layer, can effectively avoid that pad and central layer 320 bond, easily take out after pressing, has improved production efficiency; And hard layer 200 is fixedly connected with adherent layer 100, avoid adherent layer 100 to slip into printed wiring board interlayer, the risk that causes laminated sheet layering to be scrapped, this hard layer 200 mates with the shape of adherent layer 100 and the step trough 310 of staged printed wiring board 300, can put into quickly and easily step trough 310, effectively avoid the problems such as the local decompression of printed wiring board 300 pressing processes and step trough depression.
The thickness of the adherent layer described in the present embodiment is 10 μ m～50 μ m.The thickness of described hard layer is the difference of the degree of depth of step trough 300 and the thickness of adherent layer.The thickness of pad is the same with the degree of depth of step trough 310 like this, and the upper surface of pad is concordant with the upper surface of staged printed wiring board 300, is convenient to the 300 pressing manufactures of staged printed wiring board.
As shown in Figure 3, the monolateral size of described adherent layer 100 is than the few 0.10mm～0.30mm of the monolateral size of step trough 310, and the monolateral size of preferred described adherent layer is than the few 0.15mm of the monolateral size of step trough.Can conveniently pad be put into like this to step trough 310, can make again the sidewall of pad and the sidewall of step trough keep optimal spacing, effectively avoid the problems such as the local decompression of printed wiring board 300 pressing processes and step trough depression.
As shown in Figure 3, the adherent layer 100 described in the present embodiment is provided with multiple location holes 400 with hard layer 200, for adherent layer 100 and hard layer 200 are positioned, improves the overall accuracy of manufacture of the staged printed wiring board press fitting pad described in the present embodiment.
The above embodiment has only expressed embodiment of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.
Claims (8)
1. a staged printed wiring board press fitting pad, is characterized in that, comprises adherent layer, hard layer, and described hard layer is fixedly covering on described adherent layer, and this hard layer mates with the step trough of staged printed wiring board with the shape of adherent layer.
2. staged printed wiring board press fitting pad according to claim 1, is characterized in that, the thickness of described adherent layer is 10 μ m～50 μ m.
3. staged printed wiring board press fitting pad according to claim 2, is characterized in that the difference of the degree of depth that the thickness of described hard layer is step trough and the thickness of adherent layer.
4. staged printed wiring board press fitting pad according to claim 3, is characterized in that, described adherent layer is aluminium flake.
5. staged printed wiring board press fitting pad according to claim 3, is characterized in that, described adherent layer is Copper Foil.
6. staged printed wiring board press fitting pad according to claim 1, is characterized in that, the monolateral size of described adherent layer is than the few 0.10mm～0.30mm of the monolateral size of step trough.
7. staged printed wiring board press fitting pad according to claim 1, is characterized in that, the monolateral size of described adherent layer is than the few 0.15mm of the monolateral size of step trough.
8. according to the staged printed wiring board press fitting pad described in claim 1～7 any one, it is characterized in that, described adherent layer and hard layer are provided with multiple location holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320729987.1U CN203618240U (en) | 2013-11-18 | 2013-11-18 | Gasket for pressing stepped printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320729987.1U CN203618240U (en) | 2013-11-18 | 2013-11-18 | Gasket for pressing stepped printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203618240U true CN203618240U (en) | 2014-05-28 |
Family
ID=50770854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320729987.1U Expired - Fee Related CN203618240U (en) | 2013-11-18 | 2013-11-18 | Gasket for pressing stepped printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203618240U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104507261A (en) * | 2014-12-18 | 2015-04-08 | 安徽四创电子股份有限公司 | Method for manufacturing microwave printed circuit board with step groove |
| CN105246275A (en) * | 2015-11-13 | 2016-01-13 | 中国电子科技集团公司第二十九研究所 | Multilayer microwave printed circuit board blind slot machining method and used spacers thereof |
| CN105338727A (en) * | 2015-10-22 | 2016-02-17 | 北大方正集团有限公司 | Preparation method for step trough of step circuit board, and step circuit board |
| CN108401384A (en) * | 2018-03-05 | 2018-08-14 | 生益电子股份有限公司 | A kind of production method and PCB of the stepped groove of PCB |
| CN112492767A (en) * | 2021-01-18 | 2021-03-12 | 四川英创力电子科技股份有限公司 | PCB (printed circuit board) with step groove and processing method thereof |
| CN112584629A (en) * | 2019-09-27 | 2021-03-30 | 深南电路股份有限公司 | Printed circuit board and manufacturing method thereof |
| CN112918053A (en) * | 2021-02-05 | 2021-06-08 | 河南环宇昌电子科技有限公司 | Cushion pad for silk-screen laminating process and use method thereof |
| CN113207236A (en) * | 2021-04-19 | 2021-08-03 | 珠海杰赛科技有限公司 | Method for manufacturing printed circuit board |
-
2013
- 2013-11-18 CN CN201320729987.1U patent/CN203618240U/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104507261A (en) * | 2014-12-18 | 2015-04-08 | 安徽四创电子股份有限公司 | Method for manufacturing microwave printed circuit board with step groove |
| CN104507261B (en) * | 2014-12-18 | 2017-10-27 | 安徽四创电子股份有限公司 | A kind of preparation method of the microwave printed board containing step groove |
| CN105338727A (en) * | 2015-10-22 | 2016-02-17 | 北大方正集团有限公司 | Preparation method for step trough of step circuit board, and step circuit board |
| CN105338727B (en) * | 2015-10-22 | 2018-05-25 | 北大方正集团有限公司 | The preparation method and stepped circuit board of the stepped groove of stepped circuit board |
| CN105246275A (en) * | 2015-11-13 | 2016-01-13 | 中国电子科技集团公司第二十九研究所 | Multilayer microwave printed circuit board blind slot machining method and used spacers thereof |
| CN108401384A (en) * | 2018-03-05 | 2018-08-14 | 生益电子股份有限公司 | A kind of production method and PCB of the stepped groove of PCB |
| CN112584629A (en) * | 2019-09-27 | 2021-03-30 | 深南电路股份有限公司 | Printed circuit board and manufacturing method thereof |
| CN112492767A (en) * | 2021-01-18 | 2021-03-12 | 四川英创力电子科技股份有限公司 | PCB (printed circuit board) with step groove and processing method thereof |
| CN112492767B (en) * | 2021-01-18 | 2021-04-20 | 四川英创力电子科技股份有限公司 | PCB (printed circuit board) with step groove and processing method thereof |
| CN112918053A (en) * | 2021-02-05 | 2021-06-08 | 河南环宇昌电子科技有限公司 | Cushion pad for silk-screen laminating process and use method thereof |
| CN113207236A (en) * | 2021-04-19 | 2021-08-03 | 珠海杰赛科技有限公司 | Method for manufacturing printed circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203618240U (en) | Gasket for pressing stepped printed circuit board | |
| CN203722926U (en) | PCB made of PTFE material | |
| CN103327756B (en) | There is multilayer circuit board of local mixing structure and preparation method thereof | |
| CN102686029A (en) | Method for manufacturing blind slot of circuit board | |
| CN105430922B (en) | A kind of production method of printed board metal inlaying base | |
| CN106852031B (en) | A kind of three layers of HDI plate and the mixed-compression board of aluminum substrate and preparation method thereof | |
| CN204031627U (en) | A kind of laminater of rigid-flex combined board | |
| CN103108485B (en) | Multilayer board and preparation method thereof | |
| CN102573339A (en) | Process for laminating printed circuit board (PCB) with buried/blind via structure | |
| CN104735924B (en) | Technique of uncapping for multi-step shape Rigid Flex | |
| CN104394653B (en) | A kind of preparation method of Multi-layer Al-based sandwich printed board | |
| CN104701443A (en) | LED substrate applicable to simple line COB package and method for preparing same | |
| CN102045948B (en) | Method for manufacturing PCB by laminating metal substrate with non-flow prepreg | |
| CN101888749A (en) | Process for laminating PCB with internal through-hole structure | |
| CN103648235B (en) | A kind of preparation method of aluminum base circuit board | |
| CN102523691A (en) | Process for forming aligned holes in single-layer flexible printed circuit (FPC) with conductors exposed from two surfaces | |
| CN204377257U (en) | The circuit board of the metal forming making of die-cut band glue | |
| CN102833968A (en) | Method for manufacturing three-dimensional workpiece | |
| CN103687314B (en) | A kind of manufacture method of novel aluminum base circuit board | |
| CN202918582U (en) | Rigid-flexible printed circuit board mixed pressing type laminated structure | |
| CN203618215U (en) | Plate structure for preventing warpage of ladder type printed circuit board | |
| CN105216400A (en) | High-thermal conductive metal base plate resin filler method, vacuum pressing-combining structure and metal substrate | |
| CN103987211A (en) | Efficient cooling aluminum substrate based on enlarged aluminum-based face and manufacturing method thereof | |
| CN103826390A (en) | Thick copper printed circuit board and manufacturing method thereof | |
| CN109152223A (en) | A kind of production method of Rigid Flex |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140528 Termination date: 20201118 |