CN101472393A - Stamping mold for flexible circuit board - Google Patents
Stamping mold for flexible circuit board Download PDFInfo
- Publication number
- CN101472393A CN101472393A CNA2007100329517A CN200710032951A CN101472393A CN 101472393 A CN101472393 A CN 101472393A CN A2007100329517 A CNA2007100329517 A CN A2007100329517A CN 200710032951 A CN200710032951 A CN 200710032951A CN 101472393 A CN101472393 A CN 101472393A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- membrane module
- die
- stamping mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a stamping mould of a flexible circuit board, which has the advantages that the operation is simple, the flexible circuit board is difficult to drop off and be damaged, and the working efficiency is high. The stamping mould comprises an upper mould component (1) and a lower mould component (2), wherein, the outline of a circuit board (21) is arranged on the upper surface of the lower mould component (2); the stamping mould further comprises a discharging board (3), which is positioned between the upper module component (1) and the lower module component (2); a die cutting positioning hole (31) of the circuit board is formed on the discharging board (3) and is sleeved at the periphery of the outline of the circuit board (21); the front part of the discharging board (3) is connected with the lower module component (2) through a connecting piece (4) in a rotary manner; and the rear part thereof extends out of the side of the lower module component (2). The invention can be widely applied to the field of the flexible circuit board.
Description
Technical field
The present invention relates to a kind of stamping mold for flexible circuit board.
Background technology
Flexible printed circuit board (Flexible Printed Circuit Board, be called for short FPC or flexible circuit board) be the printed circuit made from flexible insulating substrate, has the advantage that many rigid printed circuit boards do not possess, for example it can free bend, coiling, folding, can require to arrange arbitrarily according to space layout, and mobile arbitrarily and flexible, thereby reach integrated that the components and parts assembling is connected with lead at three dimensions.Utilize FPC can dwindle the volume of electronic product greatly, be suitable for the needs that electronic product develops to high density, miniaturization, highly reliable direction.Therefore, FPC has obtained using widely on field such as space flight, military affairs, mobile communication, laptop computer, computer peripheral equipment, PDA, digital camera or product.FPC also has good thermal diffusivity and solderability and is easy to advantages such as load, integrated cost be lower, and the design of soft or hard combination has also remedied flexible parent metal not enough slightly on the element bearing capacity to a certain extent.Flexible print circuit board has the branch of single face, two-sided and multi-layer sheet.The base material that is adopted is based on polyimide copper clad lamination, and this kind material thermal resistance height, dimensional stability are good, form final products with the coverlay that has mechanical protection and good electrical insulation property concurrently by compacting.Top layer and inner conductor two-sided, multilayer printed wiring board are realized being electrically connected of ectonexine circuit by metallization.
Die-cut being absolutely necessary a step in the production process of flexible circuit board, this production process are utilized diel and are undertaken by stamping machine.Structurally there is deficiency in existing diel, and troublesome poeration when causing flexible circuit board to be taken out in die-cut back drops easily and damages inefficiency.
Summary of the invention
Technical problem to be solved by this invention is to overcome the deficiencies in the prior art, provides a kind of simple to operate, flexible circuit board to be difficult for dropping and the stamping mold for flexible circuit board of damage, high efficiency.
The technical solution adopted in the present invention is: the present invention includes upper die component, following membrane module, the described upper surface of membrane module down is provided with the circuit board profile, described stamping mold for flexible circuit board also comprises reclaiming plate, described reclaiming plate is at described upper die component and described down between the membrane module, described reclaiming plate is provided with the die-cut location hole of circuit board, the die-cut location hole of described circuit board is enclosed within the periphery of described circuit board profile, the front portion of described reclaiming plate rotate with described down membrane module by connector is connected, side that the rear portion stretches out in described time membrane module.
Described upper die component comprises die shank, cope match-plate pattern, the upper mould fixed plate that has guide pillar, the patrix stripper that from up to down connects successively, described membrane module down comprises lower bolster, counterdie seat board, described circuit board profile is positioned at the upper surface of described lower bolster, and described lower bolster is that die is cut oralia.
Described connector is for connecting flexible glue or hinge.
Described stamping mold for flexible circuit board also comprises electromagnet, back-moving spring, and described electromagnet is positioned at described membrane module down and is connected with the lower surface of described reclaiming plate by described back-moving spring.
The invention has the beneficial effects as follows: owing to the present invention includes reclaiming plate, described reclaiming plate is at described upper die component and described down between the membrane module, described reclaiming plate is provided with the die-cut location hole of circuit board, the die-cut location hole of described circuit board is enclosed within the periphery of described circuit board profile, the front portion of described reclaiming plate rotates with described membrane module down by connector and is connected, the rear portion stretches out in the described side of membrane module down, when die-cut, described reclaiming plate is placed on the described membrane module down, to treat that then die-cut wiring board is placed on the described reclaiming plate, after die-cut, the rear portion of described reclaiming plate is upwards lifted, wiring board after die-cut just breaks away from from described membrane module down, avoided directly taking out the inconvenience of flexible circuit board with hand, make flexible circuit board not fragile, make that simultaneously the process of taking out flexible circuit board has shortened the operating time, so the present invention is simple to operate, flexible circuit board is difficult for dropping and damaging, high efficiency;
Because the present invention also comprises electromagnet, back-moving spring, can realize flicking the automation control of the process of described reclaiming plate by described electromagnet and described back-moving spring, so the present invention easily is automated control.
Description of drawings
Fig. 1 is a main TV structure schematic diagram of the present invention;
Fig. 2 is A-A section structure schematic diagram of Fig. 1;
Fig. 3 is the right TV structure schematic diagram of the embodiment of the invention one;
Fig. 4 is the right TV structure schematic diagram of the embodiment of the invention two.
Embodiment
Embodiment one:
As Fig. 1～shown in Figure 3, the present invention includes upper die component 1, following membrane module 2, reclaiming plate 3, the described upper surface of membrane module 2 down is provided with circuit board profile 21, described reclaiming plate 3 is at described upper die component 1 and described down between the membrane module 2, described reclaiming plate 3 is provided with the die-cut location hole 31 of circuit board, the die-cut location hole 31 of described circuit board is enclosed within the periphery of described circuit board profile 21, the front portion of described reclaiming plate 3 rotates with described membrane module 2 down by connector 4 and is connected, the rear portion stretches out in the described side of membrane module 2 down, described upper die component 1 comprises the die shank 11 that from up to down connects successively, cope match-plate pattern 12, the upper mould fixed plate 13 that has guide pillar 14, patrix stripper 15, described membrane module 2 down comprises lower bolster 22, counterdie seat board 23, described circuit board profile 21 is positioned at the upper surface of described lower bolster 22, described lower bolster 22 is cut oralia for die, described connector 4 is for connecting flexible glue, and certain described connector 4 also can be hinge.
When die-cut, described reclaiming plate 3 is placed on the described membrane module 2 down, to treat that then die-cut wiring board is placed on the described reclaiming plate 3, after die-cut, the rear portion of described reclaiming plate 3 is upwards lifted, wiring board after die-cut just breaks away from from described membrane module down 2, avoided directly taking out the inconvenience of flexible circuit board with hand, make flexible circuit board not fragile, the process of make taking out flexible circuit board has simultaneously shortened the operating time, so the present invention is simple to operate, flexible circuit board is difficult for dropping and damage, high efficiency.
Embodiment two:
As Fig. 1, Fig. 2, shown in Figure 4, the difference of present embodiment and embodiment one is: the described stamping mold for flexible circuit board of present embodiment also comprises electromagnet 5, back-moving spring 6, and described electromagnet 5 is positioned at described membrane module 2 down and is connected with the lower surface of described reclaiming plate 3 by described back-moving spring 6.Can realize flicking the automation control of the process of described reclaiming plate 3 by described electromagnet 5 and described back-moving spring 6, reduce artificial more.
The present invention can be widely used in the flexible circuit board field.
Claims (4)
1, a kind of stamping mold for flexible circuit board, comprise upper die component (1), following membrane module (2), the described upper surface of membrane module (2) down is provided with circuit board profile (21), it is characterized in that: described stamping mold for flexible circuit board also comprises reclaiming plate (3), described reclaiming plate (3) is positioned at described upper die component (1) and described down between the membrane module (2), described reclaiming plate (3) is provided with the die-cut location hole of circuit board (31), the die-cut location hole of described circuit board (31) is enclosed within the periphery of described circuit board profile (21), and the front portion of described reclaiming plate (3) rotates with described membrane module (2) down by connector (4) and is connected, the rear portion stretches out in the described side of membrane module (2) down.
2, stamping mold for flexible circuit board according to claim 1, it is characterized in that: described upper die component (1) comprises die shank (11), cope match-plate pattern (12), the upper mould fixed plate (13) that has guide pillar (14), the patrix stripper (15) that from up to down connects successively, described membrane module (2) down comprises lower bolster (22), counterdie seat board (23), described circuit board profile (21) is positioned at the upper surface of described lower bolster (22), and described lower bolster (22) is cut oralia for die.
3, stamping mold for flexible circuit board according to claim 1 is characterized in that: described connector (4) is for connecting flexible glue or hinge.
4, according to claim 1 or 2 or 3 described stamping mold for flexible circuit board, it is characterized in that: described stamping mold for flexible circuit board also comprises electromagnet (5), back-moving spring (6), and described electromagnet (5) is positioned at described membrane module (2) down and is connected by the lower surface of described back-moving spring (6) with described reclaiming plate (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100329517A CN101472393A (en) | 2007-12-27 | 2007-12-27 | Stamping mold for flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100329517A CN101472393A (en) | 2007-12-27 | 2007-12-27 | Stamping mold for flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101472393A true CN101472393A (en) | 2009-07-01 |
Family
ID=40829410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100329517A Pending CN101472393A (en) | 2007-12-27 | 2007-12-27 | Stamping mold for flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101472393A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101875078A (en) * | 2010-03-25 | 2010-11-03 | 昆山凯意工模具配套有限公司 | Circuit board stamping mould |
| CN101969745A (en) * | 2010-10-20 | 2011-02-09 | 厦门弘信电子科技有限公司 | Manufacturing method of flexible printed circuit board post-procedures |
| CN102672759A (en) * | 2012-05-10 | 2012-09-19 | 苏州市飞莱克斯电路电子有限公司 | Mould frame structure of punching mould for punching flexible circuit board |
| CN102672757A (en) * | 2012-05-10 | 2012-09-19 | 苏州市飞莱克斯电路电子有限公司 | Die frame structure of punching die for punching flexible circuit board |
| CN103273536A (en) * | 2013-05-17 | 2013-09-04 | 莆田市城厢区星华电子模具有限公司 | Upper die of circuit board punching die |
| CN103846967A (en) * | 2012-11-30 | 2014-06-11 | 富葵精密组件(深圳)有限公司 | Blanking die |
| CN105101674A (en) * | 2015-07-20 | 2015-11-25 | 惠州绿草电子科技有限公司 | Manufacturing method of stacked circuit board and stacked circuit board |
| CN109986635A (en) * | 2019-05-05 | 2019-07-09 | 苏州品汇精密电子有限公司 | Jig is made in a kind of film key of electronic product |
-
2007
- 2007-12-27 CN CNA2007100329517A patent/CN101472393A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101875078A (en) * | 2010-03-25 | 2010-11-03 | 昆山凯意工模具配套有限公司 | Circuit board stamping mould |
| CN101969745A (en) * | 2010-10-20 | 2011-02-09 | 厦门弘信电子科技有限公司 | Manufacturing method of flexible printed circuit board post-procedures |
| CN102672759A (en) * | 2012-05-10 | 2012-09-19 | 苏州市飞莱克斯电路电子有限公司 | Mould frame structure of punching mould for punching flexible circuit board |
| CN102672757A (en) * | 2012-05-10 | 2012-09-19 | 苏州市飞莱克斯电路电子有限公司 | Die frame structure of punching die for punching flexible circuit board |
| CN103846967A (en) * | 2012-11-30 | 2014-06-11 | 富葵精密组件(深圳)有限公司 | Blanking die |
| CN103846967B (en) * | 2012-11-30 | 2016-01-06 | 富葵精密组件(深圳)有限公司 | Blanking die |
| CN103273536A (en) * | 2013-05-17 | 2013-09-04 | 莆田市城厢区星华电子模具有限公司 | Upper die of circuit board punching die |
| CN103273536B (en) * | 2013-05-17 | 2015-12-23 | 莆田市城厢区星华电子模具有限公司 | The patrix of wiring board die cutting die |
| CN105101674A (en) * | 2015-07-20 | 2015-11-25 | 惠州绿草电子科技有限公司 | Manufacturing method of stacked circuit board and stacked circuit board |
| CN109986635A (en) * | 2019-05-05 | 2019-07-09 | 苏州品汇精密电子有限公司 | Jig is made in a kind of film key of electronic product |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101472393A (en) | Stamping mold for flexible circuit board | |
| CN101875078A (en) | Circuit board stamping mould | |
| CN101938883B (en) | Making method of single-side double contact flexible circuit board | |
| CN102548225A (en) | Manufacturing method for printed circuit board (PCB) | |
| CN1956624B (en) | Rigid-flexible printed circuit board and method for manufacturing the same | |
| CN103456643A (en) | Ic carrier plate and manufacturing method thereof | |
| CN103096642B (en) | A kind of manufacture method of flexible circuit board | |
| CN201676946U (en) | Punching die of circuit board | |
| CN104349570A (en) | Rigid-flexible-combined circuit board and manufacturing method thereof | |
| CN102006733B (en) | Manufacturing method for circuit board | |
| CN201157868Y (en) | Flexible circuit board stamping die | |
| JP2010016339A (en) | Module using multilayer flexible printed circuit board and method of manufacturing the same | |
| CN102316681B (en) | Circuit board and manufacturing method thereof | |
| CN101189922A (en) | Printed wiring board with a pin for mounting a component and an electronic device using it | |
| JP2006156534A (en) | Connecting structure between substrates in mobile equipment, and electronic circuit device using same | |
| KR100615074B1 (en) | Punching method of FPC with unconnected compound hard toolings | |
| CN102036498B (en) | Built-in assembly base plate structure and manufacture method thereof | |
| CN101462140A (en) | Knife model rack device for flexible circuit board | |
| CN201145732Y (en) | Returned material apparatus for flexible circuit board tester | |
| KR100646452B1 (en) | Blade mold of FPC | |
| CN2877189Y (en) | Fast press for flexible circuitboard | |
| CN2877190Y (en) | Pressing device for fast press of flexible circuitboard | |
| CN201146633Y (en) | Knife model frame apparatus for flexible circuit board | |
| CN101482595B (en) | Material returning apparatus for flexible circuit board tester | |
| CN202535640U (en) | Structure of flexible printed circuit in touch screen |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Open date: 20090701 |