CN111615266A

CN111615266A - Method for manufacturing semi-finished plate material for circuit board, and method for manufacturing metal-base circuit board

Info

Publication number: CN111615266A
Application number: CN202010080777.9A
Authority: CN
Inventors: 瓦林朋弘
Original assignee: Japan Clockwork Co ltd
Current assignee: Japan Clockwork Co ltd
Priority date: 2019-02-26
Filing date: 2020-02-05
Publication date: 2020-09-01

Abstract

The invention provides a method for manufacturing a semi-finished plate material for a circuit board, a semi-finished plate material for a circuit board and a method for manufacturing a metal base circuit board, which can correspond to a circuit pattern even if a floating island shape part exists in the circuit pattern, can improve the processing speed even if the circuit pattern with the thickness corresponding to the large current increase, can also improve the correspondence to the requirement of reducing the cost, and can be stored in a stock with good precision like the circuit pattern in the state. The method comprises a punching step (S1) for punching a circuit pattern (3) having a circuit independent part (3a) from a material plate and a recovery step (S2) for returning the punched circuit independent part (3a) from the punching position and recovering the punched circuit independent part (3a) to a blank (S) to form a circuit board semi-product plate material (W1) in a flat plate shape, wherein the circuit board semi-product plate material (W1) maintaining the circuit pattern can be stocked, and thus the circuit board semi-product plate material can be stocked with excellent position accuracy as the circuit pattern.

Description

Method for manufacturing semi-finished plate material for circuit board, and method for manufacturing metal-base circuit board

Technical Field

The present invention relates to a method for manufacturing a semi-finished plate material for a current substrate for a metal base circuit board having a circuit pattern on a flat-plate-shaped or heat-dissipating metal substrate with an insulating layer interposed therebetween, a semi-finished plate material for a circuit substrate, and a method for manufacturing a metal base circuit board.

Background

In recent years, demand for large current in power equipment has been increasing, and demand for cost reduction of semiconductors has also been increasing. That is, the demand for development of a metal base circuit board that can handle a large current at a low cost is increasing.

A conventional metal base circuit board includes a board described in patent document 1. In this metal base circuit board, an uncured insulating layer is coated on a metal substrate, a circuit pattern is bonded to the insulating layer, and the insulating layer is cured by heating while applying pressure to the circuit pattern.

However, there is a problem that the circuit pattern is deviated when the circuit pattern is pressed.

In contrast to this problem, there is a method of forming the circuit pattern 103 of the metal base circuit board 100 shown in fig. 13 using the half-product 101 of fig. 14. The half product 101 of fig. 14 is formed by, for example, etching processing or the like. The semi-product 101 of the circuit pattern supports the circuit pattern 103 on a frame 107 via positioning pins 105.

Then, the semi-product 101 of the current pattern 103 is stuck to an uncured insulating layer applied to the metal substrate, and the insulating layer is cured by heat treatment performed simultaneously with the pressurization. Thereafter, block 107 is removed, etc.

Therefore, there is an advantage that the problem of the deviation of the circuit pattern 103 can be improved by the leg 105 and the frame 107 existing at the time of pressing.

However, since the circuit pattern 103A of the metal base circuit board 100A shown in fig. 15 has the floating island-shaped portion 109, there is a problem that the floating island-shaped portion 109 cannot be supported on the frame 107 by the legs 105 as in the case of the semi-finished product 101A shown in fig. 16.

In the case of such a conventional manufacturing method, the speed of etching processing or the like is reduced in a thick copper pattern corresponding to a demand for a large current exceeding 0.5mm, and the frame 107 and the leg 105 are unnecessary as the circuit pattern 103, so that there is a limit to cost reduction.

On the other hand, as a manufacturing method capable of suppressing the deviation of the pattern without using a frame, there is a method described in patent document 2.

The method comprises the steps of punching a metal strip into a half-punched state and forming a convex portion in the shape of a circuit conductor component, coating an insulating film on the convex portion, and separating the convex portion coated with the insulating film from the metal strip.

Therefore, if the convex portion in the shape of the circuit conductor member is formed at the position where the metal strip is punched into the half-punched state and has the desired circuit pattern, the convex portion to be the circuit conductor member is connected to other unnecessary portions in this state, and therefore the convex portion to be each circuit conductor member can be held at the desired position.

In this state, the insulating film is applied to the surface of the convex portion, and then the convex portion is separated from the metal strip, and the insulating film is applied to the other surface of the convex portion, whereby the circuit conductor member can be arranged on the insulating film as a circuit pattern.

However, when the circuit conductor member is stored as it is, the circuit conductor member cannot be stored with good positional accuracy as in the case of a circuit pattern due to deformation of the insulating film or the like, and therefore there is a limit to cost reduction.

Documents of the prior art

Patent document 1: WO2016/125650A1

Patent document 2: japanese laid-open patent publication No. 8-138463

The problem to be solved is that it cannot cope with a circuit pattern having a floating island shape portion, the processing speed is slow in a circuit pattern having a thickness corresponding to a demand for increasing the current, there is a limit to the demand for cost reduction, and the circuit conductor member cannot be stocked with good positional accuracy like a circuit pattern due to deformation of an insulating film or the like when stocked as it is, and therefore there is a limit to the demand for cost reduction.

Disclosure of Invention

The present invention aims to respond to a circuit pattern having a floating island shape, to increase the processing speed of a circuit pattern having a thickness corresponding to a large current, to meet a cost reduction demand, and to meet a cost reduction demand by accurately stocking the circuit pattern.

In order to achieve the above object, a method for manufacturing a circuit board blank according to the present invention includes a punching step of punching a circuit pattern having a circuit independent portion from a material sheet, and a recovering step of returning the punched circuit independent portion from a punching position thereof to a blank circuit board blank and forming the blank circuit board blank into a flat plate shape.

The method for manufacturing a circuit board blank according to the present invention includes a half-blanking step of blanking a circuit pattern having a circuit independent portion from a material sheet into a half-blanked state, and a recovery step of recovering the half-blanked circuit independent portion together with a blank material to produce a circuit board blank.

A circuit board blank has a circuit independent portion positioned in correspondence with a circuit pattern, and is in the form of a flat plate positioned with the circuit independent portion fitted into a blank material.

Further, the circuit board blank according to the present invention is a plate-like blank material in which the circuit independent portion is positioned in a half die-cut state.

The method for manufacturing a metal base circuit board according to the present invention includes a separation and transfer step of pushing out the circuit independent portion from a blank of the circuit board semi-product plate material, transferring the insulating layer on the metal board, and forming a circuit pattern.

The effects of the present invention are as follows.

According to the present invention, since the stock of the circuit board blank maintaining the positional accuracy of the circuit pattern can be made, the manufacturing flow in the die cutting process of the circuit pattern can be shortened without being affected by the continuous production line, the work rate in the continuous production line can be improved, and the demand for cost reduction can be met.

The stock management of the circuit substrate semi-finished plate material can be performed, and the stable production can be realized.

By pushing out the circuit pattern using the produced circuit board blank, the individual circuit portions can be transferred from the pushed-out positions to the insulating layer on the metal substrate, and the circuit pattern can be handled even if the floating island-shaped portions are present in the circuit pattern.

Even a thick circuit pattern corresponding to a demand for a large current can be processed at a high speed, and the cost can be reduced.

The deviation of the circuit pattern can be suppressed, and the short circuit of the current can be prevented.

Drawings

Fig. 1 is a schematic plan view of a metal base circuit board (embodiment one).

Fig. 2 is a schematic cross-sectional view of a metal base circuit board (embodiment one).

Fig. 3 is a schematic sectional view of a press machine (embodiment one).

Fig. 4 shows a process for producing a circuit board blank. Fig. 4(a) is a schematic cross-sectional explanatory view of a state in which a material plate to be a material is disposed on a press apparatus. Fig. 4(B) is a schematic cross-sectional explanatory view of the half-blanking step. FIG. 4(C) is a schematic sectional explanatory view of the recovery step. Fig. 4D is a schematic cross-sectional explanatory view of a circuit board blank taken out from a press apparatus (first embodiment).

Fig. 5 shows a main part of a manufacturing process of a circuit board blank. Fig. 5(a) is an explanatory view of the half blanking step. FIG. 5B is a diagram illustrating the recovery step (example I).

Fig. 6 shows a semi-finished plate for a circuit board. Fig. 6(a) is a plan view of a circuit board blank. Fig. 6B is a cross-sectional view of a half-product plate for a circuit board (embodiment i).

Fig. 7 is a schematic sectional explanatory view showing a manufacturing process of a circuit board blank, a separation and transfer process, and a heat bonding process.

Fig. 8 is a diagram illustrating a main part of a manufacturing process of a metal base circuit board, and is an explanatory view of a separation transfer process (first embodiment).

Fig. 9 is a plan view of a metal base circuit board having circuit patterns with different heights (example two).

Fig. 10 is a cross-sectional view of a metal base circuit board having circuit patterns with different heights (example two).

Fig. 11 shows a process for producing a circuit board blank. Fig. 11(a) is a schematic cross-sectional explanatory view of a state in which a material plate to be a material is disposed on a press apparatus. Fig. 11(B) is a schematic sectional explanatory view of the half-blanking step. FIG. 11C is a schematic sectional explanatory view of a recovery step (example III).

Fig. 12 shows a circuit board blank. Fig. 12(a) is a plan view of a circuit board blank. Fig. 12(B) is a cross-sectional view of a circuit board blank (example three).

Fig. 13 is a plan view of a metal base circuit board (conventional example).

Fig. 14 is a plan view of a metal base circuit board provided with a circuit pattern having no floating island-shaped portion (conventional example).

Fig. 15 is a plan view of a metal base circuit board provided with a circuit pattern having a floating island-shaped portion (conventional example).

Fig. 16 is a plan view of a circuit pattern showing a state in which the floating island-shaped portion cannot be supported on the frame.

1. 1A-metal base circuit board, 3A-circuit pattern, 3A, 3 b-circuit independent part, 5A-metal substrate, 7-insulating layer, S1-half die cutting process (die cutting process), S2-recovery process, S3-separation transfer process, S4-heat bonding process, S-blanking, W-copper plate material (material plate), W1-circuit board semi-product plate material.

Detailed Description

The following objects are achieved as follows: even if the circuit pattern has a floating island shape portion, the processing speed can be improved even if the circuit pattern is thick according to the requirement of large current, the cost can be reduced, and the position precision can be stored as the circuit pattern.

The method for manufacturing a circuit board blank according to the present embodiment includes a punching step of collectively punching a circuit pattern having a plurality of circuit independent portions with respect to a material plate by a vertical punching method in a cutting process, and a collecting step of returning the plurality of punched circuit independent portions from the punching positions thereof and collectively collecting the circuit pattern into a flat circuit board blank.

The punching step is a half-punching step of punching the circuit patterns collectively into a half-punched state, and the recovery step returns the plurality of circuit independent portions punched into the half-punched state from the punching positions thereof by flat pressing and recovers collectively into the blank.

The half-punching step sets a press-in amount of the half-punching, and the recovery step cuts or partially integrates the outer periphery of the independent circuit portion from or with the blank material by setting the press-in amount.

In the recovery step, when the outer periphery of the circuit independent portion is cut off from the blank material, the circuit independent portion is formed into a cross-sectional shape that remains fitted to the blank material, and recesses are formed in a circumferential shape on both upper and lower surfaces of the circuit independent portion.

The circuit board blank according to the present embodiment has a plurality of circuit independent portions positioned corresponding to circuit patterns, and is a flat plate in which the plurality of circuit independent portions are fitted into the blank material of the circuit board blank and positioned.

The periphery of the circuit independent part is separated from the blanking or partially integrated with the blanking.

The blank material and the space between the independent circuit portions are in a cross-sectional shape that is still fitted in the blank material when the outer periphery of the independent circuit portion is cut away from the blank material, and the independent circuit portion has recesses in a circumferential shape on both upper and lower surfaces of the independent circuit portion.

The method of manufacturing a metal base circuit board according to the present embodiment includes a separation and transfer step of pushing out the plurality of circuit independent portions from the blank material, collectively transferring the circuit independent portions to an insulating layer on a metal board, and forming a circuit pattern.

A method for manufacturing a circuit board blank according to another embodiment includes a half-blanking step of blanking a circuit pattern having an independent circuit portion from a material sheet into a half-blanked state, and a recovery step of recovering the independent circuit portion in the half-blanked state together with a blank material to obtain the circuit board blank.

The circuit board blank according to another embodiment is a circuit board blank having circuit independent portions positioned in correspondence with circuit patterns, and is a plate-like blank in which the circuit independent portions are positioned in a half die-cut state.

[ example one ]

[ Metal base Circuit Board ]

Fig. 1 is a schematic plan view of a metal base circuit board. Fig. 2 is a schematic cross-sectional view of a metal base circuit board using a flat-plate-shaped metal substrate.

The metal base circuit board 1 of fig. 1 and 2 includes a circuit pattern 3 having a thickness corresponding to a demand for a large current. The metal base circuit board 1 includes a circuit pattern 3 on a flat metal substrate 5 via an insulating layer 7.

The circuit pattern 3 is formed of, for example, copper, and is formed of a copper material for a circuit having a thick copper pattern with a thickness exceeding 0.5 mm. The thickness of the circuit pattern 3 can be selected variously, and the thickness may be less than 0.5 mm.

The circuit pattern 3 includes a plurality of electrically independent circuit independent portions 3 a. The plurality of circuit independent portions 3a are formed in accordance with the required characteristics of the circuit pattern 3.

The insulating layer 7 functions as an adhesive for adhering the circuit pattern 3 and the metal substrate 5 to each other, in addition to electrically insulating the circuit pattern 3 and the metal substrate 5. Therefore, a resin is generally used for the insulating layer 7. In addition, since the insulating layer 7 requires high heat resistance against high heat generation of the elements mounted on the circuit pattern 3 and high thermal conductivity for transmitting the generated heat to the metal substrate 5, the insulating layer 7 preferably further contains an inorganic filler.

As the base resin of the insulating layer 7, for example, one or a mixture of two or more of the following resins is used: epoxy resins such as bisphenol a type epoxy resin, bisphenol F type epoxy resin, and triazine type epoxy resin; cyanate ester resins such as bisphenol E type cyanate ester resin, bisphenol a type cyanate ester resin, and phenol type cyanate ester resin.

The inorganic filler contained in the insulating layer 7 is preferably a material having excellent electrical insulation and high thermal conductivity, for example, alumina, silica, aluminum nitride, boron nitride, silicon nitride, magnesium oxide, or the like, and one or two or more selected from these materials are preferably used.

The filling ratio of the inorganic filler in the insulating layer 7 can be appropriately set according to the kind of the inorganic filler. For example, the volume of the matrix resin contained in the insulating layer 7 is preferably 85% by volume or less, and more preferably 30 to 85% by volume.

The insulating layer 7 may contain, for example, a coupling agent, a dispersant, and the like in addition to the base resin and the inorganic filler.

As the insulating layer 7, an insulating plate in a semi-cured state can be used.

The metal substrate 5 is made of, for example, a single metal or an alloy. As a material of the metal substrate 5, for example, aluminum, iron, copper, an aluminum alloy, or stainless steel can be used. The metal substrate 5 may contain a nonmetal such as carbon. For example, the metal substrate 5 may contain aluminum combined with carbon. In addition, the metal substrate 5 may have a single-layer configuration or a multi-layer configuration.

The metal substrate 5 has high thermal conductivity. For example, the copper material has a thickness of 370 to 400 W.m^-1k^-1Has a thermal conductivity of 190 to 220 W.m in the aluminum material^-1k^-1Has a thermal conductivity of 60 to 80 W.m in the iron material^-1k^-1Thermal conductivity of (2).

The metal substrate 5 may or may not have flexibility. The thickness of the metal substrate 5 is, for example, in the range of 0.2 to 5 mm.

The metal base circuit board 1 may be a metal base circuit board using a heat-dissipating metal substrate.

[ production method ]

Fig. 3 is a schematic cross-sectional view of the press device. Fig. 4 shows a process for producing a circuit board blank. Fig. 4(a) is a schematic cross-sectional explanatory view of a state in which a material plate as a material is disposed in a press apparatus. Fig. 4(B) is a schematic cross-sectional explanatory view of the half-blanking step. FIG. 4(C) is a schematic sectional explanatory view of the recovery step. Fig. 4(D) is a schematic cross-sectional explanatory view of the circuit board blank before it is taken out of the press apparatus.

The method for manufacturing a semi-finished plate material for a circuit board according to the embodiment of the present invention includes a semi-blanking step S1 and a recovery step S2 as blanking steps.

The punching step is a step of punching the circuit pattern 3 having the plurality of independent circuit portions 3a collectively with respect to the material sheet.

In the embodiment, the punching process is a half-punching process S1 for punching the circuit patterns 3 into a half-punched state collectively.

The collecting step S2 is a step of returning the plurality of punched independent circuit parts 3a from the punching positions and collectively collecting the plurality of punched independent circuit parts to the blank S to form a flat circuit board blank W1. Wherein the blanking is typically the portion remaining as a result of die cutting of the article relative to the sheet of material. The blank material S in the embodiment refers to a portion that does not become the independent circuit portion 3a with respect to the material sheet. That is, the circuit board blank W1 described later has both a form in which the outer periphery of the circuit independent portion 3a is cut from the blank S and fitted thereto and a form in which the outer periphery is partially joined to the blank S and fitted thereto. The blank S also indicates a portion that does not become the independent circuit portion 3a other than the portion that becomes the independent circuit portion 3a of the circuit board blank W1. In a separation and transfer step S3 described later, the circuit independent portion 3a is separated and remains as a blank material S in a portion that does not become the circuit independent portion 3 a.

In the embodiment, the collecting step S2 returns the plurality of circuit independent portions 3a punched in the half-punched state from the punching positions by the horizontal pushing and collectively collects the circuit independent portions to the blank S.

(punching apparatus)

As shown in fig. 3, the press apparatus 9 includes an upper die 11 and a lower die 13 as metal dies.

The upper die 11 is attached to a not-shown pressurizing mechanism side, and can generate pressurizing force by hydraulic pressure such as hydraulic pressure or by lowering by mechanical pressing.

The upper die 11 mounts a punch plate 17 on the upper die set 15. Various stampings 19a are supported on the punching plate 17. The pressing member 19a is provided corresponding to the circuit independent portion 3a (fig. 1) of the circuit pattern 3. A regulating plate 21 is disposed on the tip end side of the pressing member 19 a. The regulating plate 21 includes a regulating unit 23 and a sub-guide not shown. Therefore, the regulating plate 21 is disposed so as to be movable in the retreat direction toward the punching plate 17 while being guided by the sub-guide. This retreat movement is performed against the urging force generated by the coil spring, the air spring, the hydraulic device, the air pressure device, or the like of the restricting unit 23.

The lower die 13 includes a die plate 25 and an ejector 27 shown in fig. 4 in a lower die plate set 24.

The lower die set 24 is fixed to a substrate not shown. The lower die plate set 24 and the upper die plate set 15 are coupled by guide posts 28.

The die plate 25 is supported by a substrate, not shown, and includes a die 25a corresponding to the punch 19 a. The die plate 25 is provided with guide pins (not shown) for fitting guide holes of the material plates.

The ejector 27 is supported on the substrate side so as to be able to be lifted. The ejector 27 includes an ejector pin 27a fitted to the die 25 a.

The ejector 27 has the upper ends of the ejector pins 27a flush with the upper surface of the die plate 25. A gap is maintained between the ejector 27 and the lower die set 24 to enable half die cutting of the sheet of material. A coil spring 30 for back pressure is provided between the substrate side and the ejector 27.

Before half blanking of the material sheet, the ejector 27 is supported on the substrate side by the coil spring 30, and the upper end of the ejector pin 27a is set on the upper surface of the die plate 25.

The substrate side is provided with a hydraulic device, an air pressure device, and the like for pushing up and driving the ejector 27 after half blanking of the material plate.

(half die cutting Process)

As shown in fig. 3 and 4, the half-blanking step S1 is a step of blanking the circuit patterns 3 having the plurality of independent circuit portions 3a collectively from a steel plate material W as a material plate into a half-blanked state.

As shown in fig. 4(a), a flat rectangular copper plate W is fed between the upper die 11 and the lower die 13 as a material plate. For example, when the left-right direction in fig. 4(a) is an X direction and a paper surface straight direction orthogonal to the X direction is a Y direction, the copper plate material W is carried in from the X direction by the carrying jig. The copper plate W can be carried in from the Y direction, and the copper plate W can be continuously supplied as a continuous material between the upper die 11 and the lower die 13.

A guide hole, which will be described later, is formed in advance in the copper plate W. The outer shape of the copper plate material W has positional accuracy with respect to the guide hole. Therefore, the positional relationship between the outer shape of the copper plate material W and the circuit pattern 3 can be ensured with reference to the guide hole.

As shown in fig. 4(B), in the half-blanking step S1, the upper die 11 is lowered, and the regulating plate 21 is brought into elastic contact with the copper plate material W. Next, the pressing member 19a is further lowered, and the portions of the copper plate W corresponding to the plurality of circuit independent portions 3a of the circuit pattern 3 are half-blanked while receiving the biasing force of the coil springs 30 passing through the ejector pins 27 a. By half-punching while receiving the counter pressure, it is possible to prevent deterioration in flatness in the plurality of circuit independent portions 3a as punched products.

A part of the portion corresponding to the plurality of independent circuit portions 3a enters the die 25a in the plate thickness direction, and the blank S remains between the regulating plate 21 and the die plate 25.

(recovering step)

As shown in fig. 4(C), in the recovery step S2, after the half blanking of the copper plate material W, the ejector 27 is pushed out toward the pressing piece 19a by a hydraulic device, an air pressure device, or the like to a position where it is driven to the same plane.

The portions corresponding to the plurality of circuit independent portions 3a punched out in the half-punched state are returned from the punching positions to the blank S by the flat pushing in the recovery step S2, and the flat plate-like circuit board blank W1 is completed.

Thereafter, as shown in fig. 4(D), the upper mold 11 is raised, and the circuit board blank W1 can be taken out by the conveying jig. The circuit board blank W1 taken out of the press apparatus 9 can be cut and stored from the continuous line for completion of the metal base circuit board 1.

The horizontal pushing after the half blanking of the copper plate material W can be performed by another pressing apparatus including upper and lower dies for performing the pressing in a flat plane.

(Main part of half-punching step and recovery step)

Fig. 5 shows a main part of a manufacturing process of a circuit board blank. Fig. 5(a) is an explanatory view of the half blanking step. FIG. 5(B) is an explanatory view of the recovery step.

In fig. 5(a), the stamping 19a, which half-punches the copper plate material W, has a slightly larger diameter than the die 25a with a negative clearance.

In the half-blanking step S1, the punch 19a is pressed into the die 25 a. In the half blanking step S1, the press-fitting amount is set. The press-fit amount is desirably set in a range of 60 to 90% of the copper plate material W.

As shown in fig. 5(B), in the recovery step S2, when the plurality of independent circuit portions 3a punched out in the half-punched state are returned from the punching positions by the flat pushing, the outer periphery of the independent circuit portions 3a is separated from the blank material S or partially integrated with the blank material S in the flat plate-shaped semi-product sheet material W1 for circuit boards.

In fig. 5(B), the outer periphery of the independent circuit portion 3a is coupled to the blank S in the portion B.

In the case where the thickness of the individual circuit portion 3a (the copper plate material W) exceeds 0.5mm, the outer periphery of the individual circuit portion 3a may be cut from the blank material S in the collecting step S2.

In this case, a cross-sectional shape for maintaining the fitting of the circuit independent portion 3a to the blank material S is formed between the blank material S and the circuit independent portion 3a, and recesses are formed circumferentially on both upper and lower surfaces of the circuit independent portion 3 a.

The setting of whether or not to separate the individual circuit portion 3a from the blank material S, and the setting of the cross-sectional shape suitable for maintaining the fitting of the individual circuit portion 3a to the blank material S in the case of separation, can be controlled by the pushing amount in the half blanking process in the half blanking step S1. When the thickness of the independent circuit portion 3a is 0.5mm or more, the independent circuit portion 3a is easily fitted to the blank S, and the press-fitting amount is desirably set in the range of 60 to 90% of the thickness. Even when the thickness of the independent circuit portion 3a (copper plate material W) is less than 0.5mm or exceeds 0.5mm, if the independent circuit portion 3a cannot maintain the fit with the blank material S and is detached, it is desirable to set the press-in amount of the half blanking process to be small, for example, in the range of 40 to 80% of the plate thickness and set so as not to be separated at all. If the pressing amount is reduced, the circuit independent part is difficult to separate from the blanking S during the horizontal pushing.

The cross-sectional shape in the case of cutting off is, for example, a radially uneven shape obtained by an up-down punching method. The cross-sectional shape can be controlled by the depth of the half blanking process, and the engagement of the circuit independent portion 3a with the blank material S when fitted is maintained by setting the cross-sectional shape.

(semi-finished sheet for Circuit Board)

Fig. 6 shows a semi-finished plate for a circuit board. Fig. 6(a) is a plan view of a circuit board blank. Fig. 6(B) is a sectional view of the intermediate plate for circuit board.

As shown in fig. 6, the circuit board blank W1 has a plurality of circuit independent portions 3a positioned corresponding to the circuit patterns 3, and is in the form of a flat plate.

That is, the portions corresponding to the plurality of circuit independent portions 3a are returned to the half-blanking position in the blank S, and the plurality of circuit independent portions 3a are fitted into the blank S and positioned, and are flat plate-like as a whole, and substantially in the shape of the original copper plate material. The blank S includes, for example, two guide holes n formed in advance before the half-blanking process. The number and position of the guide holes n can be arbitrarily selected.

The outer periphery of the circuit independent portion 3a of the circuit board blank W1 is cut from the blank S or is partially integrated with the blank S. The circuit independent portion 3a as the circuit pattern 3 does not have a floating island shape portion, but may be a circuit pattern having a floating island shape portion in the circuit independent portion 3 a.

The cut material S and the independent circuit portion 3a are configured to maintain a cross-sectional shape of the independent circuit portion 3a fitted to the cut material S when the outer periphery of the independent circuit portion 3a is cut off from the cut material S. The cross-sectional shape is formed as described above.

(separation transfer step and Heat-bonding step)

As shown in the left side of fig. 7, in the separation transfer step S3, the plurality of independent circuit portions 3a are pushed out from the blank S and collectively transferred to the insulating layer 7 on the metal substrate 5 to form a circuit pattern.

The press apparatus 9A used in the separation transfer step S3 is configured to push out the circuit independent portion 3a of the circuit board blank W1 positioned and supported on the die plate 31 by the punch 33a for the separation transfer step.

The pushing out by the punch 33a is performed in a state where the circuit board blank W1 is reversed. That is, the separating and transferring step S3 of fig. 7 is performed so that the side pushed out in the half-blanking step, that is, the lower side of the circuit board blank W1 of fig. 4(D) faces upward, and the individual circuit portion 3a is separated from the blank material S.

The die 31a and the stamp 33a of the die plate 31 are arranged corresponding to the circuit pattern 3. The die 31a is formed to have a diameter slightly larger than that of the die 25a for half blanking. The punch 33a is formed to have a diameter slightly smaller than that of the punch 19a for half blanking.

In the separation and transfer step S3, the circuit board blank W1 is carried in from the Y direction by a carrying jig, for example. By this carrying in, the guide holes n of the blank S are fitted to the guide holes (not shown) of the die plate 31, and the circuit board blank W1 is positioned with respect to the die plate 31. Thus, the circuit independent portion 3a of the circuit board blank W1 is accurately positioned on the die plate 31.

On the lower side of the die plate 31, the metal substrate 5 provided with the insulating layer 7 is disposed on the lower plate by a conveying jig.

At this position, the punch 33a is lowered, and the circuit independent portion 3a is pushed out from the blank S into the die 31 a. At the same time, the lower plate is raised, and the gap between the die plate 31 and the insulating layer 7 is set to about half the thickness of the circuit independent portion 3 a. Along with the setting of the gap, the punch 33a further descends to transfer the circuit pattern 3 onto the insulating layer 7 of the metal substrate 5.

At this time, by setting the gap between the die plate 31 and the insulating layer 7, half of the thickness of the independent circuit portion 3a can be accommodated inside the die 31a during the transfer operation. This allows the circuit independent portion 3a to be transferred to the insulating layer 7 while maintaining the positional accuracy. In addition, the setting of the gap is free as long as the gap can be shifted while maintaining the positional accuracy.

In order to prevent the transferred individual circuit portion 3a from being peeled off, the die plate 31 is lifted up with the punch 33a pushing out the individual circuit portion 3a, and the individual circuit portion 3a is completely pushed out from the die plate 31. Thereafter, the punch 33a rises and is separated from the circuit independent portion 3 a. It is desirable to incorporate a stopper inside the pressing member 33 to prevent the pressing member from coming into close contact with the circuit independent portion 3 a.

As shown in the right part of fig. 7, in the heat bonding step S4, heat treatment is performed. In this heating step, as described above, the metal substrate 5 with the circuit pattern 3 transferred on the insulating layer 7 is put into a heating furnace by a transfer jig and subjected to a heating treatment.

The circuit pattern 3 formed on the metal substrate 5 side in this way can maintain the relative position of each circuit independent portion 3a in the original state, and can obtain an accurate circuit pattern 3 without deviation from the original plan.

(main part of separation transfer step)

Fig. 8 is a diagram illustrating a main part of a manufacturing process of the metal base circuit board, and is an explanatory view of a separation transfer process.

When the circuit independent portion 3a receives the pushing force by the pressing member, the blank S and the circuit independent portion 3a are easily separated from each other and pushed out toward the metal substrate side.

The circuit independent portion 3a thus pushed out has a circumferential recess formed in the edge portions of the upper and lower surfaces, as in the C portion, and the flatness of the entire circuit surface is maintained.

[ Effect of the example ]

According to the embodiment of the present invention, the half blanking step S1 of collectively blanking the circuit pattern 3 having the plurality of circuit independent portions 3a into a half-blanked state with respect to the copper plate material W and the recovery step S2 of returning the plurality of circuit independent portions 3a blanked into the half-blanked state from the blanking positions by flat pressing and collectively recovering the plurality of circuit independent portions 3a into the circuit board blank material W1 formed into a flat plate shape by blanking S are provided.

Therefore, the circuit board blank W1 for circuit boards that maintains the circuit pattern 3 can be stocked, and development into planned production activities can contribute to stable production.

The circuit pattern 3 is collectively pushed out by using the manufactured circuit board blank W1, and the individual circuit portions 3a can be collectively transferred from the push-out positions to the insulating layer 7 on the metal substrate 5, and the floating island-shaped portions can be handled even if they exist in the circuit pattern 3.

Even if the circuit pattern 3 has a thickness exceeding 0.5mm, for example, which meets a demand for a large current, the processing speed can be increased, and the cost reduction can be coped with.

The half blanking step S1 sets the press-in amount of the half blanking, and the recovery step S2 separates the outer periphery of the independent circuit portion 3a from the blank material S or partially integrates the outer periphery with the blank material S by setting the press-in amount.

Therefore, the following selection can be made: in the case of the circuit pattern 3 having a thickness exceeding 0.5mm, for example, the outer periphery of the circuit independent portion 3a is cut off from the blank S; in the case of the circuit pattern 3 having a thickness of less than 0.5mm, the outer periphery of the circuit independent portion 3a is locally integrated with the blank S.

In the collecting step S2, when the outer periphery of the individual circuit portion 3a is cut off from the blank material S, the individual circuit portion 3a has a cross-sectional shape that maintains the fitting with the blank material S, and a circumferential recess is formed in the upper and lower surfaces of the individual circuit portion 3 a.

The cross-sectional shape is a combination of a shape in which the punched hole formed on the side of the material drop S slightly protrudes toward the inner peripheral side at the middle portion of the thickness and a shape in which the peripheral-shaped recesses are formed at the corners of the upper and lower surfaces of the independent circuit portion 3a, and engagement can be performed when the independent circuit portion 3a is fitted to the material drop S.

The setting of whether or not to separate the independent circuit portion 3a from the blank material S, and the setting of the cross-sectional shape suitable for maintaining the fitting of the independent circuit portion 3a to the blank material S in the case of separation, can be controlled by the pushing amount of the half blanking process in the half blanking step S1. When the thickness of the independent circuit portion 3a is 0.5mm or more, the independent circuit portion 3a is easily fitted to the blank S, and the press-fitting amount is desirably set in the range of 60 to 90% of the thickness. Even when the thickness of the circuit independent portion 3a (copper plate material W) is less than 0.5mm or exceeds 0.5mm, if the circuit independent portion 3a cannot maintain the engagement with the blank S and is detached, the press-in amount of the half blanking process is reduced, and it is desirable that the press-in amount is set in a range of 40 to 80% of the plate thickness, for example, so that the separation is not caused at all. If the pressing amount is reduced, the circuit independent part is difficult to separate from the blanking S during the horizontal pushing.

The cross-sectional shape in the case of cutting off is, for example, a radially uneven shape obtained by an up-down punching method. The cross-sectional shape can be controlled by the depth of the half blanking process, and the cross-sectional shape is set to maintain the engagement of the independent circuit portion 3a when fitted to the blank material S.

Therefore, even when the outer periphery of the individual circuit portions 3a is cut off from the blank material S, the individual circuit portions 3a can be reliably collected together in the blank material S and the circuit pattern 3 can be reliably maintained.

The circuit board blank W1 has a plurality of circuit independent portions 3a positioned corresponding to the circuit patterns 3, and the plurality of circuit independent portions 3a are positioned in a flat plate shape by being fitted into the blank S.

Therefore, when the circuit board blank W1 is stocked, the scrap can be managed, and the management can be performed efficiently. Further, since the integrated plate shape is used, handling at the time of carrying in and carrying out is also easy.

The outer periphery of the circuit independent portion 3a of the circuit board blank W1 is cut from the blank S or partially integrated with the blank.

Therefore, the following semi-finished sheet material W1 for circuit boards can be selected: for example, in the case of the circuit pattern 3 having a thickness exceeding 0.5mm, the circuit board blank W1 in which the outer periphery of the circuit independent portion 3a is cut from the blank S; in the case of the circuit pattern 3 having a thickness of less than 0.5mm, the outer periphery of the circuit independent portion 3a is locally integrated with the blank S.

When the outer periphery of the independent circuit portion 3a is cut away from the blank S between the blank S of the circuit board blank W1 and the independent circuit portion 3a, the independent circuit portion 3a has a cross-sectional shape that is still fitted in the blank S.

Therefore, even when the outer periphery of the individual circuit portions 3a is cut off from the blank S, the individual circuit portions 3a are collectively collected into the blank S, and the circuit board blank W1 capable of reliably maintaining the circuit pattern 3 is obtained.

The method of manufacturing a metal base circuit board according to the present embodiment includes a separation and transfer step S3 of pushing out the plurality of circuit independent portions 3a from the blank S, collectively transferring the circuit independent portions to the insulating layer 7 on the metal substrate 5, and forming the circuit pattern 3.

Therefore, the circuit pattern 3 of the metal base circuit board 1 can be prevented from being deviated, and short-circuiting of current can be prevented.

[ example two ]

Fig. 9 to 10 show a second embodiment of the present invention. Fig. 9 is a plan view of a metal base circuit board having circuit patterns with different heights. Fig. 10 is a cross-sectional view of a metal base circuit board having circuit patterns with different heights.

The second embodiment relates to a method for manufacturing a metal base circuit board having a circuit pattern including circuit independent portions having different heights.

The height of the circuit independent portion 3b of the circuit pattern 3A of the metal base circuit board 1A of fig. 9 is higher than that of the other circuit independent portions 3A.

In this case, the circuit board blank is formed into two types of circuit

independent portions

3a and 3b in the same manner as described above. Therefore, the positional accuracy of the circuit pattern refers to both the positional accuracy of the independent circuit portions 3a and the positional accuracy of the independent circuit portion 3b with respect to one of the two types of semi-finished circuit board materials for circuit boards, the other of the independent circuit portions 3 a.

In manufacturing the metal base circuit board 1A, the separation and transfer step is performed using two types of circuit board semi-finished plate materials in the order of the low-height independent circuit portion 3a and the high-height independent circuit portion 3 b.

Therefore, the same operation and effect as those of the first embodiment can be obtained also in the second embodiment.

Further, a plurality of independent circuit portions 3b may be provided, and the number of types of heights may be increased.

In a method for manufacturing a metal base circuit board using a plurality of types of circuit board semi-finished plate materials, even a circuit independent part with uniform height can be applied to the change of the pattern of a floating island shape part and the like.

[ third example ]

Fig. 11 and 12 show a third embodiment of the present invention. Fig. 11 shows a process for producing a circuit board blank. Fig. 11(a) is a schematic cross-sectional explanatory view of a state in which a material plate as a material is disposed on a press apparatus. Fig. 11(B) is a schematic sectional explanatory view of the half-blanking step. Fig. 12 shows a circuit board blank. Fig. 12(a) is a plan view of a circuit board blank. Fig. 12(B) is a sectional view of the circuit board blank.

In the third embodiment, the circuit board blank is formed in a plate shape in which the circuit independent portion 3a is positioned in the blank S in a half die-cut state. Therefore, the method for manufacturing the circuit board blank according to the third embodiment does not require a flat pushing process in the recovery step. Here, the general meaning of the blanking is as described above. As described above, the blank material S in the third embodiment is a portion that does not become the independent circuit portion 3a with respect to the material sheet. That is, the plate-shaped circuit board blank W1 described later also refers to a portion that does not serve as the independent circuit portion 3a other than the portion of the independent circuit portion 3a protruding from the blank plate by half-punching. The portion that does not become the independent circuit portion 3a is the same as described above, and is separated from the independent circuit portion 3a and remains as the blanking S in the separation and transfer step S3 described later.

(half die cutting Process)

In the case of using the press apparatus of fig. 3 in common, as shown in fig. 3 and 11, in the half-blanking step S1 of the third embodiment, the circuit patterns 3 having the plurality of circuit independent portions 3a are blanked collectively from the copper plate W as the material plate in the same manner as in the first embodiment.

As shown in fig. 11(a), a flat rectangular copper plate W is fed between the upper die 11 and the lower die 13 as a material plate. This supply is the same as in the case of fig. 4(a) of the first embodiment, for example.

Guide holes, which will be described later, are formed in the copper plate W in the same manner as in the first embodiment.

As shown in fig. 11(B), in the half-blanking step S1, the upper die 11 is lowered, and the portions of the copper plate W corresponding to the plurality of circuit independent portions 3a of the circuit pattern 3 are half-blanked while being subjected to the opposing pressure of the coil spring 30, as in the first embodiment.

A part of the portion corresponding to the plurality of independent circuit portions 3a enters the die 25a in the plate thickness direction, and the blank S remains between the regulating plate 21 and the die plate 25. The press-in amount for the half blanking is set in a range of 60 to 90% of the plate thickness.

(recovering step)

As shown in fig. 11(C), in the recovery step S2, after half blanking of the copper plate W, the upper die 11 is raised, and then the ejector 27 is driven to be raised. In this driving, a portion corresponding to the independent circuit portion 3a partially entering the die 25a is pushed out of the die 25 a. In this pushing out, the circuit independent portion 3a is raised above the die plate 25 together with the blanking S. In this raising, the independent circuit portion 3a and the blank material S can be raised further upward as long as the independent circuit portion 3a is separated from the die 25 a.

The plate-like circuit board blank W1 can be carried out by the above-described pushing out in the recovery step S2. The circuit board blank W1 has the individual circuit portions 3a positioned on the blank S in a half-die-cut state.

Thereafter, the circuit board blank W1 is taken out by the conveying jig, so that the circuit board blank W1 can be cut and stored from the continuous line in which the metal base circuit boards 1 are completed.

(semi-finished sheet for Circuit Board)

Fig. 12 shows a circuit board blank. Fig. 12(a) is a plan view of a circuit board blank. Fig. 12(B) is a sectional view of the circuit board blank.

As shown in fig. 12, the circuit board blank W1 is a plate-like blank S in which a plurality of circuit independent portions 3a are positioned in a half die-cut state in correspondence with the circuit patterns 3. In this case, unlike the first embodiment, the plurality of circuit independent portions 3a partially protrude in the half blanking direction from the surface of the blank S. A recess is circumferentially formed in a corner of the independent circuit portion 3a in a projecting direction with respect to the blanking material S.

That is, the portions corresponding to the plurality of independent circuit portions 3a are positioned at the half blanking position with respect to the blank S to have a plate shape, and have a slight uneven shape with respect to the original shape of the copper plate material. The blank S includes, for example, two guide holes n formed in advance before the half-blanking process, as in the first embodiment. The number and position of the guide holes n can be arbitrarily selected.

The circuit board blank W1 is in a state where the outer periphery of the circuit independent portion 3a is partially and integrally joined to the blank S. The circuit independent portion 3a serving as the circuit pattern 3 does not have a floating island shape portion, but may be a circuit pattern having a floating island shape portion on the circuit independent portion 3 a.

(separation transfer step and Heat-bonding step)

The separation transfer step S3 is performed in the same manner as in the left drawing of fig. 7. In the separation and transfer step S3, the circuit board blank W1 of fig. 12 is used to push out the plurality of circuit independent portions 3a from the blank S and transfer the circuit independent portions to the insulating layer 7 on the metal substrate 5 to form the circuit pattern 3.

The pushing out by the punch 33a is performed in a state where the circuit board blank W1 is reversed. That is, the separation and transfer step S3 of fig. 7 is performed so that the protruding side pushed out in the half-blanking step, that is, the upper side of the circuit board blank W1 of fig. 11(C) faces upward, and the individual circuit portion 3a is separated from the blank material S.

In the separation and transfer step S3, the circuit board blank W1 is carried in, for example, from the Y direction by the carrying jig in the same manner as in the first embodiment, and the circuit board blank W1 is positioned with respect to the die plate 31.

As in the first embodiment, the metal substrate 5 is disposed below the die plate 31, the punch 33a is lowered, and the circuit independent portion 3a is pushed out from the blank S into the die 31 a. At the same time, the lower plate is raised, and the gap between the die plate 31 and the insulating layer 7 is set to about half the thickness of the circuit independent portion 3 a. Along with the setting of the gap, the punch 33a further descends, and the circuit pattern 3 is transferred onto the insulating layer 7 of the metal substrate 5.

At this time, by setting the gap between the die plate 31 and the insulating layer 7, the circuit independent portion 3a can be transferred to the insulating layer 7 while maintaining the positional accuracy, as in the first embodiment.

In the heat bonding step S4, the heat treatment is performed in the same manner as in the first embodiment, as in the right part of fig. 7.

Even in the third embodiment, the relative position of each circuit independent portion 3a is maintained in the original state of the circuit pattern 3 formed on the metal substrate 5 side, and a correct circuit pattern 3 without deviation from the design can be obtained.

(main part of separation transfer step)

The semi-finished circuit board material W1 according to the third embodiment receives a force of pushing the individual circuit portions 3a out of the protruding sides of the individual circuit portions 3a with respect to the blank S by the pressing member. Therefore, the blank S and the independent circuit portion 3a are easily separated from each other and pushed out to the metal substrate side in the same manner as in the case of the horizontal pushing in the first embodiment.

Even in the independent circuit portion 3a of the third embodiment thus proposed, as in the portion of fig. 8C of the first embodiment, the recesses are formed circumferentially at the corners of the upper and lower surfaces, and the flatness of the entire circuit surface is maintained.

Therefore, in the third embodiment, the same operational effects as those of the method for manufacturing the circuit board blank, and the method for manufacturing the metal base circuit board of the first embodiment can be obtained. In addition, in the third embodiment, since the flat pushing in the recovering step S2 can be omitted, the semi-finished plate material W1 for circuit board can be manufactured more easily by shortening the pressing step and simplifying the cleaning step.

The half-product sheet material W1 for a circuit board having the height of the third embodiment can be applied to the method for manufacturing a metal base circuit board of the second embodiment.

Claims

1. A method for manufacturing a semi-finished plate for a circuit board,

the disclosed device is provided with:

a die-cutting step of die-cutting a circuit pattern having a circuit independent portion on a material sheet; and

and a recovery step of returning the punched independent circuit part from the punching position to the blank to obtain a flat plate-like semi-finished circuit board material.

2. The method for manufacturing a semifinished sheet for circuit substrates according to claim 1,

the punching step is a half-punching step of punching the circuit pattern into a half-punched state,

in the recovery step, the circuit independent part punched in the half-punched state is returned from the punching position by horizontal pushing and recovered to the blank.

3. The method for manufacturing a semifinished sheet for circuit substrates according to claim 2,

the half-blanking process sets a negative clearance and a half-blanking press-in amount,

the recovery step is to cut the outer periphery of the circuit independent portion from the blank material or to partially integrate the circuit independent portion with the blank material by setting the press-in amount.

4. The method for manufacturing a semifinished sheet for circuit substrates according to claim 3,

in the recovery step, when the outer periphery of the circuit independent portion is cut off from the blank material, the circuit independent portion is still fitted in the cross-sectional shape of the blank material, and circumferential recesses are formed in both upper and lower surfaces of the circuit independent portion.

5. A method for manufacturing a semi-finished plate for a circuit board,

the disclosed device is provided with:

a punching step of punching a circuit pattern having a circuit independent portion on a material plate into a half-punched state; and

and a recovery step of recovering the blank material together with the semi-punched independent circuit part to form a semi-finished circuit board material.

6. A semi-finished plate material for a circuit board having independent circuit portions positioned in correspondence with the circuit patterns, characterized in that,

the circuit independent part is embedded with the blanking material and positioned in a flat plate shape.

7. The intermediate plate for a circuit substrate according to claim 6,

the outer periphery of the circuit independent part is separated from the blanking part or partially integrated with the blanking part.

8. The intermediate plate for a circuit substrate according to claim 7,

when the outer periphery of the circuit independent portion is cut off from the blank material, the blank material and the circuit independent portion have a cross-sectional shape in which the circuit independent portion is still fitted in the blank material, and the circuit independent portion has recesses in a circumferential shape on both upper and lower surfaces thereof.

9. A semi-finished plate material for a circuit board, which has independent circuit parts positioned in correspondence with circuit patterns, characterized in that,

the circuit independent part is positioned on the plate of the blanking material in a half punching state.

10. The semifinished sheet for circuit substrates according to any one of claims 6 to 9,

the thickness of the circuit pattern exceeds 0.5 mm.

11. A method for manufacturing a metal base circuit board using the semi-finished plate material for a circuit board according to any one of claims 6 to 10,

the circuit independent part is pushed out from the blank material and transferred to an insulating layer on a metal substrate to form a circuit pattern.