CN106211568A - A kind of extra thin copper foil material - Google Patents
A kind of extra thin copper foil material Download PDFInfo
- Publication number
- CN106211568A CN106211568A CN201610833975.1A CN201610833975A CN106211568A CN 106211568 A CN106211568 A CN 106211568A CN 201610833975 A CN201610833975 A CN 201610833975A CN 106211568 A CN106211568 A CN 106211568A
- Authority
- CN
- China
- Prior art keywords
- copper
- copper foil
- making programme
- layers
- extra thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 91
- 239000011889 copper foil Substances 0.000 title claims abstract description 50
- 239000000463 material Substances 0.000 title claims description 21
- 229910052802 copper Inorganic materials 0.000 claims abstract description 40
- 239000010949 copper Substances 0.000 claims abstract description 40
- 238000000034 method Methods 0.000 claims abstract description 16
- 239000011347 resin Substances 0.000 claims abstract description 15
- 229920005989 resin Polymers 0.000 claims abstract description 15
- 238000002360 preparation method Methods 0.000 claims abstract description 4
- 239000007787 solid Substances 0.000 claims abstract description 3
- 238000003475 lamination Methods 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 9
- 230000008021 deposition Effects 0.000 claims 2
- 238000011536 re-plating Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 8
- 239000002390 adhesive tape Substances 0.000 description 4
- 238000010030 laminating Methods 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 241000784732 Lycaena phlaeas Species 0.000 description 1
- 238000002679 ablation Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention uses conductive layer based on chemistry layers of copper, it is achieved that the ultrathin of Copper Foil.The present invention uses the method that semi-solid preparation resin coordinates with chemistry layers of copper vacuum and low temperature, high temperature, it is achieved that the practicality of technique, it is ensured that chemical copper and the strong bonded of resin.
Description
Technical field
The present invention relates to PCB material and manufacture field, be specifically related to circuit board plant and use the material of self, device fabrication
Go out the Copper Foil less than 9um thickness and method.
Background technology
Extra thin copper foil is that wiring board makes superfine circuit (less than or equal to 2mil/2mil live width and spacing), laser drill institute
Stock, use extra thin copper foil the most easily uses addition process make superfine circuit, employing extra thin copper foil the most easily realize
Laser direct ablation layers of copper.
Directly use the extra thin copper foil that supplier provides, owing to Copper Foil is the thinnest, will be easy to when lamination produce wrinkle
And scuffing；And if employing has the composite copper foil of carrying Copper Foil, usually one side carrying Copper Foil, between extra thin copper foil and carrying foil
Need to increase binding agent, high cost and the high price of Copper Foil supplier can be limited by.
Using common Copper Foil to carry out reduction processing, the Copper Foil generally using 18um carries out being thinned to below 9um, can cause thickness
The problems such as degree is not easily controlled, and Copper Foil roughness is very big, and the loss of copper is big.
Without extra thin copper foil, directly in the method for insulating substrate chemical copper deposited above, have the surface of insulating substrate
Manage relatively difficult problem, easily occur that the adhesive force deficiency of chemical copper and base material occurs layering to bubble.
Circuit board plant, can not only be with HDI plate if able to use existing material and equipment making to go out extra thin copper foil
Manufacture combines, and need not window position, hole, can accomplish superfine circuit, but also can reduce Material Cost, arbitrarily control
The thickness of Copper Foil processed, reduction material preparatory period.
Summary of the invention
It is an object of the invention to provide a kind of can be at the own material of wiring board station-service: prepreg (PP), Copper Foil, aluminum
Sheet, copper ball, and own equipment: electroless copper plating line, electroplating assembly line, laminating machine produce the method for extra thin copper foil.
The present invention uses chemistry layers of copper as substrate, the thinnest thickness only having 0.2um-0.4um of chemical layers of copper, electricity thereon
The layers of copper of one layer of 0-9um of plating.
The present invention is using the prepreg (PP) of respective thickness as intermediate layer, and two sides is respectively put the Copper Foil of a 18um and carried out low
Temperature lamination, laminating temperature is less than 130 DEG C.
The purpose of low temperature lamination is to allow prepreg remain at B scalariform state before plating, carries out after being beneficial to heavy copper
High temperature is laminated, and strengthens the adhesion of chemistry layers of copper and insulating barrier.
Use the method for chemical etching needing the place making figure to etch away whole Copper Foil after low temperature lamination, then enter
Row electroless copper plating, chemical layers of copper now covers on PP resin bed.
Directly carrying out high temperature lamination after electroless copper plating, to allow chemistry layers of copper be embedded in PP resin, PP resin is converted by B rank
For C b stage resin b layer, form insulating barrier.
Being covered with the copper-clad plate of chemistry layers of copper above, or electroplating thickness is the layers of copper of 1-9um, forms ultra-thin copper and covers copper
Plate, is used directly to as commodity selling to PCB processing factory.
This extra thin copper foil material can also be made in producing the production procedure of HDI plate and superfine circuit by PCB processing factory
With.
If making one side extra thin copper foil, only doing low temperature lamination, keeping resin in B scalariform state, then just to make attached tree
Fat Copper Foil (RCC).
Accompanying drawing explanation
Accompanying drawing 1 is the sectional view of extra thin copper foil material.
Accompanying drawing 2 is the plane graph of extra thin copper foil material.
Detailed description of the invention
Detailed description of the invention 1: extra thin copper foil copper-clad plate
Step A, the mode of production being first according to normal common double face copper are equally combined, size 610mm*510mm, in
Between with use one 2116, resin content 53%, thickness 0.123mm, the Copper Foil of a 18um is respectively put on two sides.
Step B, combination of the above material together is carried out vacuum lamination, laminating temperature 110 DEG C, lamination times 60 points
Clock, pressure 35kg/cm2。
With adhesive tape, the Copper Foil on plate surrounding two sides being sealed after step C, lamination, tape width is 15mm, covers not having adhesive tape
The Copper Foil of lid etches away.
Step D, tear adhesive tape off, this plate is directly carried out electroless copper plating, not de-smear.
Step E, plate is put in vacuum laminator and uses General Parameters to be laminated, make chemistry layers of copper tight with resin bed
Close combination, resin is cured as C rank simultaneously.
Step F, on this plate, electroplate the layers of copper of one layer of 1-9um, or need not electroplate, complete the system of extra thin copper foil material
Make.
Detailed description of the invention 2: manufacture attached resin Copper Foil (RCC)
Step A, overlapping, scantling 610mm*510mm, the Copper Foil of three 18um and two 2116 prepregs stack,
Outermost Copper Foil hair side is towards prepreg.
Step B, combination of the above material together is carried out vacuum lamination, laminating temperature 110 DEG C, lamination times 60 points
Clock, pressure 35kg/cm2。
With adhesive tape, the Copper Foil on plate surrounding two sides being sealed after step C, lamination, tape width is 15mm, covers not having adhesive tape
The Copper Foil of lid etches away.
Step D, tear adhesive tape off, this plate is directly carried out electroless copper plating, not de-smear.
Step E, on this plate, electroplate the layers of copper of one layer of 1-9um, or need not electroplate.
Step F, this plate is torn from centre, remove in the middle of the Copper Foil of a layer, become 2 attached resin Copper Foils.
Detailed description of the invention 3: be used in the making of laminated plates
According to the method for detailed description of the invention 2, in step E, the copper of 1-3um in plating, is manufactured into attached resin Copper Foil.
This attached resin Copper Foil according to the mode vacuum pressing-combining of common RCC on the plate treating lamination.
Directly carry out laser drill and blind hole sink copper plating, due to copper the thinnest and also uniformly, it is not necessary to laser hole is carried out
Window or half erosion copper is thinning.
Detailed description of the invention 4: the superfine circuit of addition process makes
According to the method for detailed description of the invention 1, step F step is made without plating, produces only chemical layers of copper
Copper-clad plate.
Carrying out figure transfer with the dry film of 40um thickness in above copper-clad plate, form negative-appearing image circuit, live width/gap is
50um/5um。
The above copper-clad plate with dry film figure is carried out electro-coppering, and powering at the chemical copper face not having dry film to cover plates
The layers of copper of one layer of 30um.
The sodium hydroxide using 3% is decorporated dry film, and this plate is carried out microetch, removes chemistry layers of copper, is finally completed superfine circuit
Making, live width 48um.
The present invention uses conductive layer based on chemistry layers of copper, it is achieved that the ultrathin of Copper Foil.
The present invention uses the method that semi-solid preparation resin coordinates with chemistry layers of copper vacuum and low temperature, high temperature, it is achieved that the reality of technique
By property, it is ensured that chemical copper and the strong bonded of resin.
The present invention is the description to a kind of extra thin copper foil material and preparation method thereof, can carry out high-leveled and difficult according to the present invention
The manufacture of wiring board；Manufacturing field at wiring board, the present invention will change in specific embodiment and range of application,
So this specification content should not be construed as limitation of the present invention.
Claims (8)
1. an extra thin copper foil material, its feature Making programme is: prepreg is forced together with Copper Foil cryosphere, etches away
The Copper Foil of mid portion, then deposition chemistry layers of copper, finally allow chemistry layers of copper and resin strong bonded with high-temperature vacuum lamination
Method forms extra thin copper foil material, can one layer of thin copper of re-plating thereon.
Making programme the most according to claim 1, it is characterised in that it is Celsius that the condition of low temperature lamination is that temperature is less than 130
Degree.
Making programme the most according to claim 1, it is characterised in that etch away the Copper Foil in the middle of material, reserved materials surrounding
Copper Foil.
Making programme the most according to claim 1, it is characterised in that semi-solid preparation material surface deposition chemistry layers of copper time not
Need de-smear.
Making programme the most according to claim 1, it is characterised in that use high-temperature vacuum lamination to allow chemistry layers of copper and tree
Fat strong bonded.
Making programme the most according to claim 1, it is characterised in that this extra thin copper foil material surface one layer of 1-9um of plating
Layers of copper.
Making programme the most according to claim 1, it is characterised in that use this flow process to make attached resin Copper Foil (RCC).
Making programme the most according to claim 1, it is characterised in that this flow process cooperates with wiring board manufacturing process, system
Make superfine circuit and laminated plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610833975.1A CN106211568A (en) | 2016-09-20 | 2016-09-20 | A kind of extra thin copper foil material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610833975.1A CN106211568A (en) | 2016-09-20 | 2016-09-20 | A kind of extra thin copper foil material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106211568A true CN106211568A (en) | 2016-12-07 |
Family
ID=58068072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610833975.1A Pending CN106211568A (en) | 2016-09-20 | 2016-09-20 | A kind of extra thin copper foil material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106211568A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108055791A (en) * | 2017-12-12 | 2018-05-18 | 四会富士电子科技有限公司 | A kind of method for improving extra thin copper foil adhesive force |
| CN109587961A (en) * | 2018-12-01 | 2019-04-05 | 四会富仕电子科技股份有限公司 | A kind of method that copper is thinned in outer layer |
| CN113386416A (en) * | 2021-07-08 | 2021-09-14 | 江西柔顺科技有限公司 | Heat-conducting double-sided copper-clad plate and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102883533A (en) * | 2012-09-17 | 2013-01-16 | 东莞康源电子有限公司 | Method for manufacturing ultrathin copper-clad laminate |
| CN104185377A (en) * | 2014-08-21 | 2014-12-03 | 深圳崇达多层线路板有限公司 | Fine-line PCB manufacturing method |
-
2016
- 2016-09-20 CN CN201610833975.1A patent/CN106211568A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102883533A (en) * | 2012-09-17 | 2013-01-16 | 东莞康源电子有限公司 | Method for manufacturing ultrathin copper-clad laminate |
| CN104185377A (en) * | 2014-08-21 | 2014-12-03 | 深圳崇达多层线路板有限公司 | Fine-line PCB manufacturing method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108055791A (en) * | 2017-12-12 | 2018-05-18 | 四会富士电子科技有限公司 | A kind of method for improving extra thin copper foil adhesive force |
| CN109587961A (en) * | 2018-12-01 | 2019-04-05 | 四会富仕电子科技股份有限公司 | A kind of method that copper is thinned in outer layer |
| CN113386416A (en) * | 2021-07-08 | 2021-09-14 | 江西柔顺科技有限公司 | Heat-conducting double-sided copper-clad plate and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103997862B (en) | Method for manufacturing low-stress low-warping-degree ultrathin odd-layer coreless plate | |
| CN103052264B (en) | Pressing method for sandwich aluminum-base printed circuit board | |
| CN202310279U (en) | Graphical printed board at bottom of dual-step ladder groove | |
| JP2016033967A5 (en) | ||
| CN104244616A (en) | Manufacturing method for thin coreless substrate | |
| CN102686029A (en) | Method for manufacturing blind slot of circuit board | |
| CN102340933B (en) | Manufacturing method of circuit board | |
| CN106211568A (en) | A kind of extra thin copper foil material | |
| TW201433221A (en) | Peelable copper foil-clad substrate, and method for manufacturing circuit board | |
| TW201501582A (en) | Build-up material for use in printed-circuit board and applications thereof, printed-circuit board having inner buried elements | |
| TW201605612A (en) | Liquid crystal polymer film attached with metal foils and its manufacturing method, multi-layer printed wiring board and its manufacturing method | |
| CN104394653A (en) | Manufacture method of multi-layer aluminum base sandwich printed circuit board | |
| CN207911147U (en) | A kind of pcb board | |
| JP2015026654A5 (en) | Copper foil with carrier, method for producing copper-clad laminate and method for producing printed wiring board | |
| CN103826390A (en) | Thick copper printed circuit board and manufacturing method thereof | |
| JP2013239677A5 (en) | Wiring board manufacturing method, wiring board manufacturing structure | |
| CN106211641A (en) | A kind of high reliability laminated plates | |
| CN104902684B (en) | A kind of step groove circuit board and its processing method | |
| CN105916291A (en) | Method for manufacturing high-density interconnected printed circuit board | |
| TW201215508A (en) | Manufacturing method of substrate and structure capable of simplifying its manufacturing process | |
| TWI819335B (en) | Circuit board and method for manufacturing the same | |
| CN103717016A (en) | Layered prevention technology of multilayer high-frequency electrosilvering circuit board | |
| CN203368904U (en) | Multi-layer PCB plate structure | |
| WO2014109357A1 (en) | Method for producing wiring board and laminate with supporting material | |
| CN205291774U (en) | High thermal conductive metal substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 526236 Sihui Electronics Industry Base No. 3, Xiamen Town, Fourth Meeting, Zhaoqing City, Guangdong Province Applicant after: SIHUI FUJI ELECTRONICS TECHNOLOGY Co.,Ltd. Address before: 526236 West Crow Queen, Longwan Village, Xiamen Town, Sihui City, Zhaoqing City, Guangdong Province Applicant before: Sihui Fuji Electronics Technology Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20161207 |
|
| WD01 | Invention patent application deemed withdrawn after publication |