WO2014187063A1 - 芯片的绑定设备和方法 - Google Patents
芯片的绑定设备和方法 Download PDFInfo
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- WO2014187063A1 WO2014187063A1 PCT/CN2013/085114 CN2013085114W WO2014187063A1 WO 2014187063 A1 WO2014187063 A1 WO 2014187063A1 CN 2013085114 W CN2013085114 W CN 2013085114W WO 2014187063 A1 WO2014187063 A1 WO 2014187063A1
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- 238000000034 method Methods 0.000 title claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 82
- 239000011521 glass Substances 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
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- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
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- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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Definitions
- Embodiments of the present invention relate to a bonding apparatus and method for a chip. Background technique
- the current small-size liquid crystal display products basically use the chip bonding process of COG (Chip On Glas s) to drive the liquid crystal display panel. Specifically, after forming a bump on the chip, the substrate is directly connected to the lead of the liquid crystal display.
- COG Chip On Glas s
- the high temperature indenter first contacts the chip, and the heat is conducted to the anisotropic conductive paste and the substrate through the chip.
- the temperature difference between the substrate and the platform is large, which causes a difference in the expansion size between the two.
- the anisotropic conductive paste is cured, the relative position between the chip and the substrate is fixed.
- the main pressure is over, the chip and the substrate are cooled down, and the size of the chip shrinks is larger than that of the substrate, so that the two ends of the chip generate a large stress on the substrate, which causes warpage of the chip and the substrate.
- the warpage of the chip and the substrate may cause chip peeling, chip breakage, and display effects such as uneven brightness.
- Embodiments of the present invention provide a bonding apparatus and method for a chip, which can greatly improve the warpage problem of the chip and the substrate after binding.
- a first aspect of the present invention provides a bonding apparatus for a chip, comprising: a base and a ram, wherein a side of the base for carrying the substrate has a first curvature that is recessed downward, and the ram is in contact with the chip a side having a second curvature that is downwardly convex, having the first curvature and having the first The indenter of the second arc matches.
- the first radians and the second radians have equal radii of curvature.
- the angle between the tangential direction of the edge of the first arc and the horizontal plane is 0.5° to 1.5.
- the binding device is used for COG chip binding.
- a second aspect of the present invention provides a chip bonding process method, including:
- Anisotropic conductive paste is coated on the substrate, and the chip is placed on the anisotropic conductive paste and pre-fixed;
- the chip is bonded to the substrate using a ram having a downwardly convex second curvature; wherein the pedestal having a first curvature matches the ram having a second curvature.
- the first radians and the second radians have equal radii of curvature.
- the angle between the tangential direction of the edge of the first arc and the horizontal plane is 0.5° to 1.5.
- the anisotropic conductive paste is applied to two adjacent edge sides of the substrate.
- binding the chip to the substrate includes:
- the temperature of the indenter is from 150 ° C to 170 ° C.
- the substrate is a glass substrate.
- the binding method is a COG chip binding method.
- FIG. 1 is a schematic structural diagram of a binding device of a chip according to an embodiment of the present invention
- 2 is a schematic diagram of the use of a binding device for a chip in an embodiment of the present invention
- FIG. 3 is a schematic diagram showing deformation of a chip and a substrate during a main pressing process according to an embodiment of the present invention
- FIG. 5 is a schematic diagram of the test results in the embodiment of the present invention
- FIG. 6 is a schematic flowchart diagram of a method for binding a chip according to an embodiment of the present invention.
- the embodiment of the present invention provides a binding device for a chip.
- the binding device of the chip includes a base 1 and a ram 2, and one side of the base 1 for carrying the substrate has a downward recess.
- the first arc, the side of the indenter 2 in contact with the chip has a second curvature that is convex downward, and the base 1 having the first curvature matches the indenter 2 having the second curvature.
- the base 1 has a first curvature that is recessed downward, the radius of curvature of the first curvature is ri
- the indenter 2 has a second curvature that is convex downward, the second curvature
- the radius of curvature is r 2 .
- the base 1 and the indenter 2 are matched as shown in FIG. Since the substrate 3 and the chip 4 have a certain elasticity, especially the chip 4 has a certain ductility, when the base 1 and the indenter 2 perform a main pressing process, the substrate 3 and the chip 4 have a certain downward curved curvature. As shown in Figure 3. After the chip 4 and the substrate 3 are cooled In the process, since the size of the shrinkage of the chip 4 is larger than that of the substrate, the substrate 3 and the chip 4 which are originally bent downward are deformed toward the center of the arc during cooling, and the chip 4 and the substrate 3 become flat after the cooling is completed. , As shown in Figure 4.
- the embodiment of the present invention greatly reduces the stress between the chip 4 and the substrate 3, prevents the chip 4 and the substrate 3 from being warped, and further prevents the chip 4 from being peeled off, the chip 4 from being broken, and the display effect from being uneven.
- the anisotropic conductive paste 5 mainly comprises two parts of a resin adhesive and conductive particles.
- the resin adhesive is mainly used to bind the chip 4 to the substrate 3, fix the relative positions of the electrodes between the chip 4 and the substrate 3, and provide a pressing force to maintain the electrode. Contact area with conductive particles.
- the size and shape of one side of the base 1 for carrying the substrate 3 substantially corresponds to the size and shape of the substrate 3.
- the size of one side of the base 1 for carrying the substrate 3 is substantially equal to or slightly larger than the size of the substrate 3.
- the edge of the base 1 is substantially aligned with the edge of the substrate 3.
- the radii of curvature of the first radii and the second radians should be equal, that is, for example, to prevent the chip 4 or the substrate 3 during the main pressing process.
- An adverse effect such as a fracture occurs, and the angle between the tangential direction of the edge of the first curvature and the horizontal plane is generally 0.5 to 1.5.
- the angle between the tangential direction of the edge of the first arc and the horizontal plane should be determined depending on the size of the substrate.
- the table below shows the effect of the values of ruthenium on several common sized substrates on the substrate.
- L3 L3 L2 L2 L1 L0 L1 L2 L3 rupture L0 ⁇ L3 in the above table indicates the severity of the problem caused by the substrate.
- the L0 defect is the lightest, L0 to L3 are sequentially increased, and L3 is the heaviest.
- each size of the substrate has a most suitable angle ⁇ .
- the substrate 3 and the chip 4 of this size are bonded by the base 1 and the indenter 2 having the arc corresponding to the most suitable angle.
- the flatness test was performed on the cooled substrate 3 and the chip 2, that is, the degree of warpage of the bonded chip 2 was tested.
- the degree of warpage is measured by continuously testing the height of the surface to be measured in the bonded chip using a non-contact probe to obtain a continuous curve, and then taking the height difference between the highest point and the lowest point of the curve to indicate the degree of warpage.
- the greater the height difference the greater the degree of warpage of the chip 2; conversely, the smaller the height difference, the smaller the degree of warpage of the chip 2.
- the substrate 3 and the chip 2 are approximately horizontal, and the highest point and the lowest point are obtained.
- the difference between the points is only 0.01 mm (see the dotted line in Fig. 5); the reverse side test (that is, the chip 2 is located below the substrate 3, and the non-contact probe is measured through the substrate from above) between the highest point and the lowest point.
- the difference is 0.15mm (see solid line in Figure 5).
- the bonding device of the chip provided by the embodiment of the invention greatly reduces the stress on the substrate 3 at both ends of the chip 4, and can effectively prevent the chip and the substrate from being bent.
- the base of the chip-bonded device has a first curvature that is recessed downward
- the indenter has a second curvature that is convex downward
- the base has the first curvature
- the base and the indenter have a certain downward curved curvature during the process of pressing the chip and the substrate to bond the chip to the substrate.
- the chip and the substrate since the chip shrinks in size larger than the substrate, the downwardly bent substrate and the chip are deformed toward the center of the arc during cooling.
- the chip and substrate become flat after cooling
- the stress between the chip and the substrate is greatly reduced, and the chip and the substrate are prevented from warping, thereby preventing the occurrence of adverse effects such as chip glass, chip breakage, and display unevenness.
- the embodiment of the present invention further provides a binding method of a chip of a binding device using the foregoing chip. Specifically, as shown in FIG. 6, the method includes:
- Step S101 disposing a substrate on a base having a first curvature that is recessed downward;
- step S102 coating an anisotropic conductive paste on the substrate, placing a chip on the anisotropic conductive paste, and performing Pre-fixed;
- Step S103 Binding the chip to the substrate by using an indenter having a second curvature downwardly convex
- the base having a first curvature matches the one having a second curvature.
- the radii of curvature of the first radii and the second radians are equal.
- the angle between the tangential direction of the edge of the first curvature and the horizontal plane is 0.5° to 1.5°.
- the anisotropic conductive paste 5 is applied to the two adjacent edge sides of the substrate 3.
- the anisotropic conductive paste 5 needs to have a temperature of 150 ° C to 170 ° C to melt the resin adhesive inside and bond it. Therefore, in step S103, the temperature of the indenter 2 is preferably 150 ° C to 170 ° C. In other embodiments of the invention, the temperature of the indenter 2 should be selected based on the applicable temperature of the anisotropic conductive paste 5.
- the substrate 3 is a glass substrate.
- the substrate 3 may also be a transparent material such as plastic.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US14/387,804 US20160254246A1 (en) | 2013-05-21 | 2013-10-12 | Apparatus and method for bonding chips |
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CN201310189801.2 | 2013-05-21 | ||
CN2013101898012A CN103295937A (zh) | 2013-05-21 | 2013-05-21 | 芯片的绑定设备和方法 |
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CN109597254A (zh) * | 2019-01-08 | 2019-04-09 | 深圳市华星光电半导体显示技术有限公司 | 芯片绑定区域的结构及显示面板 |
CN110544655B (zh) * | 2019-09-03 | 2021-09-14 | 云谷(固安)科技有限公司 | 绑定装置及绑定方法 |
CN110730611B (zh) * | 2019-09-30 | 2020-12-08 | 云谷(固安)科技有限公司 | 曲面显示屏绑定装置及曲面显示屏绑定方法 |
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