JP4385895B2 - ボンディング装置 - Google Patents
ボンディング装置 Download PDFInfo
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- JP4385895B2 JP4385895B2 JP2004246223A JP2004246223A JP4385895B2 JP 4385895 B2 JP4385895 B2 JP 4385895B2 JP 2004246223 A JP2004246223 A JP 2004246223A JP 2004246223 A JP2004246223 A JP 2004246223A JP 4385895 B2 JP4385895 B2 JP 4385895B2
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- liquid crystal
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- thermocompression bonding
- crystal display
- bonding apparatus
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the bonding head
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Description
図1は、本発明の一実施形態としての熱圧着式ボンディング装置によって液晶表示素子にLSIチップをCOGボンディングする工程を示す斜視図で、図2(a)はその熱圧着工程における圧着状態を示す模式的側断面図、図2(b)は熱圧着を終え放置冷却されて得られた液晶表示パネルを示す模式的断面図である。
例えば、図1に示す実施形態において、図5に示すように、熱圧着ツール20の押圧ヘッド部21を基体部22に対し着脱自在に分割してもよい。この場合、ヒータ23は基体部22に埋設することが好ましい。これにより、図3に示す実施形態等と同様に、製造すべき液晶表示パネルの機種変更に柔軟に対応可能となる。
2、3 ガラス基板
4 前偏光板
5 引き出し配線
6 半導体チップ
7 異方性導電接着材
10、40、60 ステージ
11 本体支持部
12 圧着支持部
12a、41a 支持面
20、30、50 熱圧着ツール
21 押圧ヘッド部
21a 押圧面
22 基体部
23、33 ヒータ
31、51 当接部材
32 ツール本体
41、61 支持部材
42 ステージ本体
Claims (3)
- 回路基板表面の所定位置に回路素子を熱硬化性の導電接着部材を介して搭載するボンディング装置であって、
前記回路基板の少なくとも前記回路素子が搭載される領域を支持する支持面が、湾曲した凸面をなすステージと、
加熱手段を有し、前記ステージに支持された回路基板上に載置された前記回路素子を加熱しつつ加圧するために当接させる押圧面が、前記ステージの支持面の曲率に対応した曲率で湾曲した凹面をなす蒸圧着ツールとを、備えることを特徴とするボンディング装置。 - 前記熱圧着ツールは、前記押圧面を有する当接部材と、該当接部材を着脱自在に保持すると共に前記回路素子に接離させる基体部とから、なることを特徴とする請求項1に記載のボンディング装置。
- 前記熱圧着ツールの押圧面と前記ステージの支持面とは、それぞれ、実質的に同心円の円周面をなしている請求項1または請求項2に記載のボンディング装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004246223A JP4385895B2 (ja) | 2004-08-26 | 2004-08-26 | ボンディング装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004246223A JP4385895B2 (ja) | 2004-08-26 | 2004-08-26 | ボンディング装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009178493A Division JP4983872B2 (ja) | 2009-07-31 | 2009-07-31 | ボンディング装置およびそれを用いたボンディング方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006066566A JP2006066566A (ja) | 2006-03-09 |
JP4385895B2 true JP4385895B2 (ja) | 2009-12-16 |
Family
ID=36112779
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2004246223A Expired - Fee Related JP4385895B2 (ja) | 2004-08-26 | 2004-08-26 | ボンディング装置 |
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JP (1) | JP4385895B2 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008177350A (ja) * | 2007-01-18 | 2008-07-31 | Fujitsu Ltd | 電子装置の製造方法および製造装置 |
JP5029026B2 (ja) * | 2007-01-18 | 2012-09-19 | 富士通株式会社 | 電子装置の製造方法 |
JP2008263160A (ja) * | 2007-03-20 | 2008-10-30 | Hitachi Chem Co Ltd | 基板と半導体素子の接合方法及び接合体 |
JP2008294396A (ja) * | 2007-04-23 | 2008-12-04 | Hitachi Chem Co Ltd | 接続方法、接続装置及び接続方法を用いて得られる接続構造体 |
JP4959527B2 (ja) * | 2007-11-30 | 2012-06-27 | リンテック株式会社 | 半導体装置の製造方法 |
JP2010067922A (ja) * | 2008-09-12 | 2010-03-25 | Sony Chemical & Information Device Corp | 熱圧着装置及び電気部品の実装方法 |
CN103295937A (zh) * | 2013-05-21 | 2013-09-11 | 北京京东方光电科技有限公司 | 芯片的绑定设备和方法 |
CN104701223B (zh) * | 2015-03-24 | 2018-02-13 | 京东方科技集团股份有限公司 | 一种芯片压合设备 |
CN107588925A (zh) * | 2017-08-31 | 2018-01-16 | 昆山国显光电有限公司 | 一种治具 |
JP7079639B2 (ja) * | 2018-03-29 | 2022-06-02 | 株式会社ジャパンディスプレイ | 圧着装置及び表示装置の製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02119152A (ja) * | 1988-10-28 | 1990-05-07 | Oki Electric Ind Co Ltd | 半導体装置のボンディング方法及びそのための製造装置 |
JP3097410B2 (ja) * | 1993-08-30 | 2000-10-10 | 松下電器産業株式会社 | 電子部品の熱圧着装置 |
JP2000150580A (ja) * | 1998-11-09 | 2000-05-30 | Matsushita Electric Ind Co Ltd | 半導体素子実装装置および半導体素子実装方法 |
JP2000150584A (ja) * | 1998-11-13 | 2000-05-30 | Matsushita Electric Ind Co Ltd | 半導体素子実装装置 |
JP2004071608A (ja) * | 2002-08-01 | 2004-03-04 | Matsushita Electric Ind Co Ltd | 半導体装置の製造装置 |
JP2004145129A (ja) * | 2002-10-25 | 2004-05-20 | Advanced Display Inc | 表示装置およびその製造方法ならびに表示装置の製造装置 |
-
2004
- 2004-08-26 JP JP2004246223A patent/JP4385895B2/ja not_active Expired - Fee Related
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