WO2013059985A1 - Process for metallisation of holes in printed circuit board - Google Patents

Process for metallisation of holes in printed circuit board Download PDF

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Publication number
WO2013059985A1
WO2013059985A1 PCT/CN2011/081235 CN2011081235W WO2013059985A1 WO 2013059985 A1 WO2013059985 A1 WO 2013059985A1 CN 2011081235 W CN2011081235 W CN 2011081235W WO 2013059985 A1 WO2013059985 A1 WO 2013059985A1
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WO
WIPO (PCT)
Prior art keywords
seconds
treatment
water washing
circuit board
printed circuit
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PCT/CN2011/081235
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French (fr)
Chinese (zh)
Inventor
黄锡金
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建业（惠州）电路版有限公司
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Application filed by 建业（惠州）电路版有限公司 filed Critical 建业（惠州）电路版有限公司
Priority to CN201180053540.0A priority Critical patent/CN103222351B/en
Priority to PCT/CN2011/081235 priority patent/WO2013059985A1/en
Publication of WO2013059985A1 publication Critical patent/WO2013059985A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Definitions

  • the present invention relates to the field of circuit boards, and more particularly to a method for metallization of printed circuit board holes.
  • Electroless copper plating is a method of depositing copper on the surface of an insulating material without applying an electric current, which is an autocatalytic oxidation-reduction reaction.
  • metal catalytic particles such as palladium ions
  • electroless copper plating solution copper ions are reduced and deposited on the catalytic layer on the surface of the material to become a new copper crystal nucleus, and a new copper nucleus. It has become a continually new catalytic layer.
  • a layer of copper is deposited on the surface of the material.
  • the thickness of the copper When the thickness of the copper reaches a certain thickness (backlight level 8 or higher), the thickness of the copper is increased by electroplating copper to achieve the electrical conductivity requirement.
  • the electroless copper plating process is the main process for metallization of circuit board holes, but it requires the use of harmful substances such as furfural, palladium, and ruthenium, and palladium metal exists between the substrate copper and electroplated copper of the electroless copper plating process. Layering, affecting connections.
  • a method of metallizing a printed circuit board hole comprising sequentially processing the drilled printed circuit board in the following steps:
  • Grinding plate treatment grinding the surface of the printed circuit board to roughen and clean the surface of the board, and then performing the first water washing to remove impurities remaining on the surface of the board and the wall;
  • the small and medium molecular resin on the surface of the hole wall of the printed circuit board is subjected to a bulking treatment to dissolve the chain of the small and medium molecular resin and to loosen the pore wall, and then subjected to a second water washing to remove the surface and
  • the remaining impurities and residual liquid in the pore wall are subjected to desmear treatment to partially remove the bulky resin molecules on the pore walls, form a honeycomb structure on the surface of the pore wall, and finally perform a third water washing. Remove the remaining impurities and residual liquid from the surface of the board and the wall;
  • Neutralization treatment Except the impurity ions adsorbed on the pore wall after removing the slag treatment, and performing the fourth water washing to remove impurities and residual liquid remaining on the surface of the plate and the pore wall, and finally drying;
  • Micro-etching and degreasing Firstly, the first micro-etching treatment is performed on the board surface to clean the board surface, and then the fifth water washing is performed to remove the remaining impurities and residual liquid on the board surface and the hole wall, and then the board surface and the hole wall Degreasing treatment to remove non-polar molecular impurities remaining on the surface of the plate and the pore wall, and finally performing a sixth water washing to remove impurities and residual liquid remaining on the surface of the plate and the pore wall;
  • the first black hole treatment of the printed circuit board is to pre-adsorb a layer of carbon black conductive layer on the surface of the hole wall, and then dry the hole to adjust the charge of the resin molecules on the surface of the hole wall to facilitate further adsorption.
  • the carbon black molecule is then subjected to a seventh water washing to remove the remaining impurities and residual liquid on the surface of the plate and the pore wall, and then subjected to a second blackening treatment to continue to adsorb carbon black molecules on the surface of the pore wall to form a carbon black conductive layer, and finally dried. ;
  • Micro-etching a second micro-etching treatment on the black-pore printed circuit board to remove the carbon black molecules adsorbed by the metal conductive layer, and then performing an eighth water washing to remove impurities and residual liquid remaining on the surface of the board and the pore walls;
  • the printed circuit board is subjected to a rubbing treatment and a ninth water washing to remove impurities and residual liquid remaining on the surface of the board and the hole, and then the anti-oxidation treatment is performed on the metal conductive layer portion of the printed circuit board. ;
  • Electroplated copper The anti-oxidation printed circuit board is subjected to a tenth water washing to remove remaining impurities and residual liquid on the surface of the board and the pores, and after drying, electroplating copper treatment is performed to electroplat the copper metal layer on the carbon black layer of the pore walls.
  • the first water washing comprises the following steps: pressurizing water washing with a water pressure of 2.0-3.0 bar for 9-11 seconds, ultrasonic immersion for 9-11 seconds, water pressure of 1.0-2.0 bar, punching and washing 9- 11 seconds, 9-11 seconds of high pressure water washing with a water pressure of 9 bar, 5-6 seconds of pressurized water washing with a water pressure of 2.0-3.0 bar and 5-6 seconds of washing with water.
  • the leavening agent used in the bulking process is a 10 g/L sodium hydroxide solution, dissolved
  • the liquid temperature was 72-78 ° C and the treatment time was 120 seconds.
  • the second water washing comprises the following steps: washing for 9-11 seconds, water pressure of 1.0-2.0 bar, washing for 27-33 seconds, and washing with water for 9-11 seconds.
  • the solution component used in the desmear process is a 60 g/L permanganic acid clock and 40 g/L sodium hydroxide, the solution temperature is 84-90 ° C, and the treatment time is 180 seconds.
  • the process of recovering the water washing liquid and performing sewage washing is further included.
  • the third water washing is a water washing of 1.0-2.0 bar for 9-11 seconds.
  • the neutralization process comprises the following steps: pre-neutralization treatment with a temperature of 25-30 ° C and a concentration of 90 g / L for 12-16 seconds; water knife washing for 9-11 seconds; water pressure of 1.0 -2.0 bar perforated water for 9-11 seconds; and treated with sulfuric acid at a concentration of 35-45 ° C and a concentration of 90 g/L for 40-50 seconds.
  • the fourth water washing comprises the following steps: water knife washing 9-11 seconds, water knife washing 9-11 seconds, water knife washing 9-11 seconds, overflow water washing 9-11 seconds, and water washing 9- 11 seconds.
  • the first micro-individual treatment is performed by using a sodium sulphate sodium having a temperature of 32-38 ° C, a composition of 75 g/L, and a stone containing acid having a mass fraction of 10% for 25 seconds. ;
  • the second maintenance treatment was carried out using a sodium monosulfate having a composition of 75 ° C and a composition of 75 g/L of sodium persulfate and a sulfuric acid having a mass fraction of 10% for 40 to 48 seconds.
  • the fifth water washing comprises the following steps: pressurizing water washing with a water pressure of 2.0-3.0 bar for 9-11 seconds, ultrasonic immersion for 9-11 seconds, water pressure of 1.0-2.0 bar, punching and washing 9- 11 seconds and a water pressure of 2.0-3.0 bar of pressurized water for 9-11 seconds.
  • the degreasing treatment is carried out using a degreaser having a temperature of 50-60 ° C, a composition of 30 g / L of sodium carbonate, 60 g / L of trisodium phosphate and 50 g / L of sodium hydroxide for 60 seconds. .
  • the sixth water washing and the seventh water washing are repeated for four times of overflow washing for 9-11 seconds.
  • the first blackening treatment is a use temperature of 32-38 ° C, carbon black mass concentration Treated for 2-second black hole solution for 60 seconds;
  • the second blackening treatment was carried out using a black hole liquid having a temperature of 32 to 38 ° C and a carbon black mass concentration of 2 to 3% for 92 seconds.
  • the whole pore treatment is carried out using a solution of hydroxyethylethylenediamine having a temperature of 32 to 38 ° C and a mass concentration of 40 to 45% for 60 seconds.
  • the eighth water washing is repeated three times of overflow washing for 9-11 seconds.
  • the ninth water washing is repeated two times of overflow water washing for 9-11 seconds.
  • the antioxidant treatment is treatment with an antioxidant solution using a component having a mass fraction of 1% 2-hexylbenzimidazole, a mass fraction of 0.2% lead acetate, and a mass fraction of 0.04% ammonia water at room temperature. 16-20 seconds.
  • the tenth water washing comprises three times of repeated overflow washing for 9-11 seconds and water washing for 9-11 seconds.
  • the first water washing is designed after the grinding plate, and the effect of cleaning the hole wall is better; and the desmear process is designed after the first water washing, including the bulking treatment, the second
  • the secondary washing and degreasing process can remove the glue remaining on the hole wall after drilling and enhance the adhesion of the black hole; before the black hole is added, the micro-etching and degreasing steps are added to clean the surface of the circuit board. After two times of black hole, the micro-etching treatment and anti-oxidation treatment are performed, and the surface of the circuit board is cleaned again to ensure that the copper plating in the subsequent process is firm and does not fall off the film.
  • the copper on the black hole process substrate is reliably connected to the electroplated copper, there is no copper connection delamination problem, the reliability is good, and the black hole process does not have impurities on the surface of the substrate, and the connection quality is good.
  • the black hole process does not use furfural or heavy metals, and it is basically free from pollution to the environment.
  • Figure 1 is a photo comparison of the hole metallization by the black hole method and the hole metallization by the electroless copper plating process, wherein the upper and lower two photos are hole metallization by the electroless copper plating process, right side The upper and lower photographs are hole metallization by the black hole method. ⁇ detailed description ⁇
  • the drilled printed circuit board is sequentially processed as follows: a grinding plate treatment, a first water washing, a bulking treatment, a second water washing, a desmear, and a third water washing neutralization.
  • a grinding plate treatment Treatment of the fourth water washing and drying, the first micro-etching treatment, the fifth water washing and degreasing treatment, the sixth water washing, the first black hole treatment, the drying, the whole hole treatment, the seventh water washing, the second black hole treatment, the drying, the second micro
  • Real boat craft spare parts can be clips 1 ⁇
  • Degreaser 84-90 180 - Sodium hydroxide: 40 g / liter
  • Trisodium phosphate 60
  • the grinding plate processing process can achieve the purpose of removing oxides, oil stains, fingerprints and other dirt on the surface of the board by pickling, mechanical grinding, water washing, drying, etc., by roughening and cleaning the board surface. Enhance the adhesion of the board.
  • the rubbing treatment is performed by means of mechanical rubbing.
  • the bulking treatment and the desmear process can dissolve the chain of the resin on the wall of the small and medium-molecule softening pores, and then loosen it, and then remove the slag by using a corresponding degreasing agent such as KMn0 4 solution, and simultaneously Forming a honeycomb-like surface combined with electroplated copper facilitates the subsequent process.
  • a corresponding degreasing agent such as KMn0 4 solution
  • Neutralization treatment reduces Mn 7+ , Mn 6+ and Mn 4+ remaining on the surface of the sheet to soluble Mn 2+ , which is removed from the surface or the pores to prevent residual pores, resulting in pore breakage or poor adhesion of the plating plating. .
  • Micro-etching treatment and degreasing are added before the black hole treatment, which can clean the surface of the circuit board. After two black holes, it will be micro-etched and anti-oxidation, and the surface of the circuit board will be cleaned again to ensure the copper plating is firm in the post-process. Will drop the film.
  • the black hole treatment process is to place the drilled printed circuit board in the black hole liquid, dip the fine carbon black powder on the hole wall of the printed circuit board to form a conductive layer, and then perform copper plating by subsequent copper plating treatment.
  • the sterilizing treatment of the tap water to be used in the present embodiment it is preferred to sterilize the tap water with ultraviolet rays to obtain pure water.
  • Ultraviolet light is the spectrum of electromagnetic waves between visible light and X-rays.
  • the UV spectrum from 200 nm to 400 nm has a strong bactericidal effect with a peak at 265 nm. In this wavelength range, the ultraviolet rays break through the cell membrane, destroy the intracellular DNA and destroy other molecules in the cell, so that the microorganism can no longer replicate and multiply, and finally achieve disinfection.
  • the ultraviolet light is divided into four bands: vacuum ultraviolet: 40-200 nm, ultraviolet c: 200-280 ⁇ , ultraviolet b: 280-315 ⁇ , ultraviolet a: 315-400 ⁇ .
  • UV disinfection is accomplished by the absorption of UV light by deoxyribonucleic acid in the microorganisms.
  • the maximum absorption values are ultraviolet light at wavelengths of 200 nm and 265 nm and wavelengths of 200 nm, respectively, which are mainly absorbed by ribose and phosphate of central deoxyribonucleic acid.
  • Ultraviolet light with a wavelength of 265 nm is mainly absorbed by adenine, guanine, cytosine and thymine (uracil in ribonucleic acid) in nucleic acids.
  • thymine dimers the most common bacteria, after absorbing ultraviolet radiation is that these dimers and other actinic products can prevent the replication and reproduction of DNA, thereby killing cells.
  • ultraviolet light can cause photochemical reactions of proteins, enzymes and other molecules in cells.
  • the absorption peak of the protein is about 280 nm, whereas the peptide in the protein absorbs ultraviolet rays below 240 nm.
  • Ultraviolet light is also destructive to other unsaturated biomolecules such as coenzymes, hormones and electronic supports.
  • the effect of ultraviolet light on molecules is not only on deoxyribonucleic acid and ribonucleic acid, but also on some micro-organisms such as fungi, protozoa and algae. Although ultraviolet light cannot pierce these larger microorganisms as it does with deoxyribonucleic acid, it can still achieve germicidal effects by destroying other molecules.
  • UV disinfection is a completely pollution-free technology that does not pose a hazard to humans, animals, aquatic organisms, and products, and does not produce harmful by-products during the sterilization process.
  • this technology is extremely effective against all microorganisms, including the tiny Cryptosporidium that is extremely immune to chlorine.
  • the UV disinfection system has an ultraviolet tube and a quartz sleeve.
  • This UV lamp is fixed in a quartz sleeve and the entire sleeve is then fixed into a cylindrical stainless steel reaction chamber.
  • This design is such that the water to be treated begins to be processed while entering the reactor from one end, and the entire sterilization process will accompany the flow of water to the other end of the reactor.
  • the method for metallizing a printed circuit board hole of the present embodiment first places a printed circuit board into a black hole
  • the liquid metallization process is carried out in the liquid according to the above process flow, and then the corresponding parameters are adjusted according to the relevant equipment in the process flow, so that the production process of the printed circuit board hole metallization and the matching equipment form a An effective and accurate system. It ensures that the fine carbon black can be fully adsorbed on the surface of the non-conductor hole wall to form a uniform and fine and firmly bonded conductive layer, which guarantees the smooth progress of the subsequent electroplating process. At the same time, in the production of black holes, the syrup will generate a large amount of exhaust gas.
  • the present embodiment is provided with a condensing recovery device which does not allow the exhaust gas to condense and return to the black hole medicine tank, and is a method for preventing deterioration of the black hole liquid. Accurate parameters also save energy and make the environment more environmentally friendly.
  • the printed wiring board manufactured by the present embodiment was tested, and the adhesion of the black holes was good.
  • the method of the present embodiment has significant advantages, such as the comparison of the items in Table 2 of Table 2.
  • the equipment investment of the black hole production line is 50% of the horizontal copper electroplating production line.
  • Cost of use The chemical solution used in the black hole production line is less than the potion used in the electroless copper production line.
  • the black hole line chemical dosage is 4-10mIJm 2
  • the chemical copper plating line chemical dosage is 2 5-30mL/m 2 .
  • the copper on the black hole process substrate is reliably connected to the electroplated copper, and there is no copper connection delamination problem.
  • the electroless copper plating process has a palladium metal between the substrate copper and the copper plating, and the connection reliability is not as good as the black hole process.
  • the black hole process does not have impurities on the surface of the substrate.
  • the electroless copper plating process has impurities on the surface due to subsequent plating, and there is delamination between the electroless copper plating layer and the electroplated copper layer, which affects the connection quality, as shown in FIG. .
  • Black hole process analysis project is 50% less than electroless copper plating process, black hole process analysis project
  • the black hole process solution does not need to be activated, and can be directly produced.
  • the electroless copper plating solution needs to be used as a false plate to activate the chemical bath liquid, which causes the loss of the medicine water and affects the production efficiency.
  • the solution life of the black hole process is longer than that of the electroless copper plating process.
  • the black hole solution can be used for one year, and the tank is washed once every six months.
  • the electroless copper plating solution is used for 3 months, and the tank needs to be washed once a week.
  • the flow time of the black hole process is one quarter of the electroless copper plating process, during the black hole process
  • the 8 minutes are 12 minutes and the electroless copper plating process takes 50 minutes.
  • the black hole process does not use formaldehyde, no heavy metals are used, and the chemical copper plating process uses formaldehyde.
  • the first water washing is designed after the grinding plate, and the effect of cleaning the hole wall is better; and the desmear process is designed after the first water washing, including the bulking treatment, the second
  • the secondary washing and degreasing process can remove the glue left on the hole wall after drilling, and enhance the adhesion of the black hole; before the black hole, the micro-separation and degreasing are added to make the surface of the circuit board clean. After two black holes, it will be micro-etched, anti-oxidation, and clean the surface of the circuit board again, ensuring that the copper plating in the subsequent process is firm and will not drop the film.
  • the copper on the black hole process substrate is reliably connected to the electroplated copper, there is no copper connection delamination problem, the reliability is good, and the black hole process does not have impurities on the surface of the substrate, and the connection quality is good. In addition, the black hole process does not use furfural or heavy metals, and it has no pollution to the environment.
  • the detailed description is not to be construed as limiting the scope of the invention. It should be noted that a number of variations and modifications may be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of the invention should be determined by the appended claims.

Abstract

Provided is a process for metallisation of holes in a printed circuit board. A drilled printed circuit board is subjected to the following steps of treatment in succession: a board grinding treatment, a first water washing, an expanding treatment, a second water washing, removal of glue residues, a third water washing, neutralization, a fourth water washing, drying, a first micro-etching treatment, a fifth water washing, de-oiling, a sixth water washing, a first hole blackening, drying, hole conditioning, a seventh water washing, a second hole blackening, drying, a second micro-etching treatment, an eighth water washing, a board grinding treatment, a ninth water washing, an anti-oxidation treatment, a tenth water washing, drying and electroplating of copper. In the hole blackening process, the copper on the substrate is reliably connected to the electroplated copper without the problem of delamination of copper connections and has good reliability. Moreover the hole blackening process produces no impurity on the surface of the substrate, leading to good connection quality. In addition, in the hole blackening process, no formic acid or heavy metal is used, causing substantially no pollution to the environment.

Description

印刷电路板孔金属化的方法  Method for metallization of printed circuit board holes
【技术领域】  [Technical Field]
本发明涉及电路板领域， 尤其涉及一种印刷电路板孔金属化的方法。  The present invention relates to the field of circuit boards, and more particularly to a method for metallization of printed circuit board holes.
【背景技术】 【Background technique】
传统的印刷电路板孔金属化的方法是采用化学镀铜。 化学镀铜是一种 不用外加电流， 在绝缘材料表面沉积铜的方法， 其是一种自身催化的氧化 还原反应。 首先在绝缘材料表面吸附金属催化粒子， 如钯离子， 然后， 在 化学镀铜溶液中， 铜离子被还原， 沉积在材料表面的催化层上， 成为新生 的铜晶核， 不断新生的铜晶核又成为不断新生的催化层， 经过自身催化， 材料表面沉积一层铜。 当铜的厚度到达一定厚度（背光 8级以上）后， 再 通过电镀铜来增加铜的厚度， 达到导电的要求。 化学镀铜工艺是电路板孔 金属化生产的主要工艺， 但其需要使用曱醛、 钯、 鳌合物等有害物质， 且 化学镀铜工艺的基材铜和电镀铜之间存在钯金属， 容易分层， 影响连接。  The traditional method of metallization of printed circuit board holes is to use electroless copper plating. Electroless copper plating is a method of depositing copper on the surface of an insulating material without applying an electric current, which is an autocatalytic oxidation-reduction reaction. First, metal catalytic particles, such as palladium ions, are adsorbed on the surface of the insulating material. Then, in the electroless copper plating solution, copper ions are reduced and deposited on the catalytic layer on the surface of the material to become a new copper crystal nucleus, and a new copper nucleus. It has become a continually new catalytic layer. After self-catalysis, a layer of copper is deposited on the surface of the material. When the thickness of the copper reaches a certain thickness (backlight level 8 or higher), the thickness of the copper is increased by electroplating copper to achieve the electrical conductivity requirement. The electroless copper plating process is the main process for metallization of circuit board holes, but it requires the use of harmful substances such as furfural, palladium, and ruthenium, and palladium metal exists between the substrate copper and electroplated copper of the electroless copper plating process. Layering, affecting connections.
【发明内容】 [Summary of the Invention]
基于此， 有必要提供一种能有效减少有毒物质使用且基材铜与电镀铜 之间连接较好的印刷电路板孔金属化的方法。  Based on this, it is necessary to provide a method for effectively reducing the metallization of printed circuit board holes using toxic substances and having a good connection between the substrate copper and the electroplated copper.
一种印刷电路板孔金属化的方法， 包括将钻孔后的印刷电路板依次进 行如下步骤处理：  A method of metallizing a printed circuit board hole, comprising sequentially processing the drilled printed circuit board in the following steps:
磨板处理： 对所述印刷电路板板面进行磨板处理以粗化、 清洁板面， 而后进行第一次水洗以除去板面和孔壁剩余的杂质；  Grinding plate treatment: grinding the surface of the printed circuit board to roughen and clean the surface of the board, and then performing the first water washing to remove impurities remaining on the surface of the board and the wall;
膨松及除胶渣： 对印刷电路板孔壁表面的中小分子树脂进行膨松处理 以溶解中小分子树脂的链结并将所述孔壁膨松， 然后进行第二次水洗以除 去板面和孔壁剩余的杂质和残留液， 再进行除胶渣处理以部分去除孔壁上 膨松的树脂分子， 在所述孔壁表面形成蜂巢状结构， 最后进行第三次水洗 除去板面和孔壁剩余的杂质和残留液； Loose and degreased: The small and medium molecular resin on the surface of the hole wall of the printed circuit board is subjected to a bulking treatment to dissolve the chain of the small and medium molecular resin and to loosen the pore wall, and then subjected to a second water washing to remove the surface and The remaining impurities and residual liquid in the pore wall are subjected to desmear treatment to partially remove the bulky resin molecules on the pore walls, form a honeycomb structure on the surface of the pore wall, and finally perform a third water washing. Remove the remaining impurities and residual liquid from the surface of the board and the wall;
中和处理： 除去除胶渣处理后吸附在孔壁的杂质离子， 并进行第四次 水洗除去板面和孔壁剩余的杂质和残留液， 最后进行干燥；  Neutralization treatment: Except the impurity ions adsorbed on the pore wall after removing the slag treatment, and performing the fourth water washing to remove impurities and residual liquid remaining on the surface of the plate and the pore wall, and finally drying;
微蚀及除油： 首先对板面进行第一次微蚀处理以清洁板面， 然后进行 第五次水洗除去板面和孔壁剩余的杂质和残留液， 再对所述板面及孔壁进 行除油处理以除去板面和孔壁残留的非极性分子杂质， 最后进行第六次水 洗除去板面和孔壁剩余的杂质和残留液；  Micro-etching and degreasing: Firstly, the first micro-etching treatment is performed on the board surface to clean the board surface, and then the fifth water washing is performed to remove the remaining impurities and residual liquid on the board surface and the hole wall, and then the board surface and the hole wall Degreasing treatment to remove non-polar molecular impurities remaining on the surface of the plate and the pore wall, and finally performing a sixth water washing to remove impurities and residual liquid remaining on the surface of the plate and the pore wall;
黑孔化： 首先对印刷电路板进行第一次黑孔化处理使孔壁表面预吸附 一层碳黑导电层， 干燥后进行整孔处理以调整孔壁表面树脂分子所带电荷 以利于进一步吸附碳黑分子， 然后进行第七次水洗除去板面和孔壁剩余的 杂质和残留液， 再进行第二次黑孔化处理使孔壁表面继续吸附碳黑分子以 形成碳黑导电层， 最后干燥；  Black hole: First, the first black hole treatment of the printed circuit board is to pre-adsorb a layer of carbon black conductive layer on the surface of the hole wall, and then dry the hole to adjust the charge of the resin molecules on the surface of the hole wall to facilitate further adsorption. The carbon black molecule is then subjected to a seventh water washing to remove the remaining impurities and residual liquid on the surface of the plate and the pore wall, and then subjected to a second blackening treatment to continue to adsorb carbon black molecules on the surface of the pore wall to form a carbon black conductive layer, and finally dried. ;
微蚀： 对黑孔化的印刷电路板进行第二次微蚀处理以清除金属导电层 吸附的碳黑分子， 然后进行第八次水洗除去板面和孔壁剩余的杂质和残留 液；  Micro-etching: a second micro-etching treatment on the black-pore printed circuit board to remove the carbon black molecules adsorbed by the metal conductive layer, and then performing an eighth water washing to remove impurities and residual liquid remaining on the surface of the board and the pore walls;
磨板及抗氧化： 首先对所述印刷电路板进行磨板处理及第九次水洗以 除去板面和孔壁剩余的杂质和残留液， 然后对印刷电路板的金属导电层部 分进行抗氧化处理；  Grinding plate and anti-oxidation: Firstly, the printed circuit board is subjected to a rubbing treatment and a ninth water washing to remove impurities and residual liquid remaining on the surface of the board and the hole, and then the anti-oxidation treatment is performed on the metal conductive layer portion of the printed circuit board. ;
电镀铜： 对抗氧化处理后的印刷电路板进行第十次水洗除去板面和孔 壁剩余的杂质和残留液， 干燥后进行电镀铜处理以在孔壁的碳黑层上电镀 铜金属层。  Electroplated copper: The anti-oxidation printed circuit board is subjected to a tenth water washing to remove remaining impurities and residual liquid on the surface of the board and the pores, and after drying, electroplating copper treatment is performed to electroplat the copper metal layer on the carbon black layer of the pore walls.
优选的，所述第一次水洗依次包括如下步骤： 水压为 2.0-3.0 bar的加压 水洗 9-11秒、 超声波浸洗 9-11秒、 水压为 1.0-2.0 bar沖孔水洗 9-11秒、 水 压为 9 bar的高压水洗 9-11秒、 水压为 2.0-3.0 bar的加压水洗 5-6秒及清水 洗 5-6秒。  Preferably, the first water washing comprises the following steps: pressurizing water washing with a water pressure of 2.0-3.0 bar for 9-11 seconds, ultrasonic immersion for 9-11 seconds, water pressure of 1.0-2.0 bar, punching and washing 9- 11 seconds, 9-11 seconds of high pressure water washing with a water pressure of 9 bar, 5-6 seconds of pressurized water washing with a water pressure of 2.0-3.0 bar and 5-6 seconds of washing with water.
优选的，所述膨松处理过程使用的膨松剂为 10g/L的氢氧化钠溶液，溶 液温度为 72-78 °C , 处理时间为 120秒。 Preferably, the leavening agent used in the bulking process is a 10 g/L sodium hydroxide solution, dissolved The liquid temperature was 72-78 ° C and the treatment time was 120 seconds.
优选的， 所述第二次水洗依次包括如下步骤： 止水洗 9-11秒、 水压为 1.0-2.0 bar沖孔水洗 27-33秒、 及清水洗 9-11秒。  Preferably, the second water washing comprises the following steps: washing for 9-11 seconds, water pressure of 1.0-2.0 bar, washing for 27-33 seconds, and washing with water for 9-11 seconds.
优选的， 所述除胶渣过程使用的溶液组分为 60g/L的高锰酸钟和 40g/L 的氢氧化钠， 溶液温度为 84-90 °C , 处理时间为 180秒。  Preferably, the solution component used in the desmear process is a 60 g/L permanganic acid clock and 40 g/L sodium hydroxide, the solution temperature is 84-90 ° C, and the treatment time is 180 seconds.
优选的， 进行所述第三次水洗前还包括回收水洗液并进行沖污水的过 程。  Preferably, before the third water washing, the process of recovering the water washing liquid and performing sewage washing is further included.
优选的， 所述第三次水洗是水压为 1.0-2.0 bar沖孔水洗 9-11秒。  Preferably, the third water washing is a water washing of 1.0-2.0 bar for 9-11 seconds.
优选的， 所述中和处理依次包括如下步骤： 使用温度为 25-30°C、 浓度 为 90g/L的硫酸预中和处理 12-16秒； 水刀洗 9-11秒； 水压为 1.0-2.0 bar 沖孔水洗 9-11秒； 以及使用温度为 35-45 °C , 浓度为 90g/L的硫酸中和处理 40-50秒。  Preferably, the neutralization process comprises the following steps: pre-neutralization treatment with a temperature of 25-30 ° C and a concentration of 90 g / L for 12-16 seconds; water knife washing for 9-11 seconds; water pressure of 1.0 -2.0 bar perforated water for 9-11 seconds; and treated with sulfuric acid at a concentration of 35-45 ° C and a concentration of 90 g/L for 40-50 seconds.
优选的， 所述第四次水洗依次包括如下步骤： 水刀洗 9-11秒、 水刀洗 9-11秒、 水刀洗 9-11秒、 溢流水洗 9-11秒及清水洗 9-11秒。  Preferably, the fourth water washing comprises the following steps: water knife washing 9-11 seconds, water knife washing 9-11 seconds, water knife washing 9-11 seconds, overflow water washing 9-11 seconds, and water washing 9- 11 seconds.
优选的， 所述第一次微独处理是使用温度为 32-38°C、 组分为 75g/L的 过石 A酸钠和质量分数为 10%的石充酸的 £蚀液处理 25秒；  Preferably, the first micro-individual treatment is performed by using a sodium sulphate sodium having a temperature of 32-38 ° C, a composition of 75 g/L, and a stone containing acid having a mass fraction of 10% for 25 seconds. ;
所述第二次维持处理是使用温度为 40°C、 组分为 75g/L的过硫酸钠和 质量分数为 10%的硫酸的微独液处理 40-48秒。  The second maintenance treatment was carried out using a sodium monosulfate having a composition of 75 ° C and a composition of 75 g/L of sodium persulfate and a sulfuric acid having a mass fraction of 10% for 40 to 48 seconds.
优选的，所述第五次水洗依次包括如下步骤： 水压为 2.0-3.0 bar的加压 水洗 9-11秒、超声波浸洗 9-11秒、 水压为 1.0-2.0 bar沖孔水洗 9-11秒及水 压为 2.0-3.0bar的加压水洗 9-11秒。  Preferably, the fifth water washing comprises the following steps: pressurizing water washing with a water pressure of 2.0-3.0 bar for 9-11 seconds, ultrasonic immersion for 9-11 seconds, water pressure of 1.0-2.0 bar, punching and washing 9- 11 seconds and a water pressure of 2.0-3.0 bar of pressurized water for 9-11 seconds.
优选的，所述除油处理是使用温度为 50-60°C、组分为 30g/L的碳酸钠、 60g/L的磷酸三钠和 50g/L的氢氧化钠的除油液处理 60秒。  Preferably, the degreasing treatment is carried out using a degreaser having a temperature of 50-60 ° C, a composition of 30 g / L of sodium carbonate, 60 g / L of trisodium phosphate and 50 g / L of sodium hydroxide for 60 seconds. .
优选的， 所述第六次水洗及所述第七次水洗为重复进行四次溢流水洗 9-11秒。  Preferably, the sixth water washing and the seventh water washing are repeated for four times of overflow washing for 9-11 seconds.
优选的， 所述第一次黑孔化处理为使用温度为 32-38°C , 碳黑质量浓度 为 2-3%的黑孔液处理 60秒； Preferably, the first blackening treatment is a use temperature of 32-38 ° C, carbon black mass concentration Treated for 2-second black hole solution for 60 seconds;
所述第二次黑孔化处理为使用温度为 32-38°C , 碳黑质量浓度为 2-3% 的黑孔液处理 92秒。  The second blackening treatment was carried out using a black hole liquid having a temperature of 32 to 38 ° C and a carbon black mass concentration of 2 to 3% for 92 seconds.
优选的， 整孔处理为使用温度为 32-38°C、 质量浓度为 40-45%的羟乙 基乙二胺溶液处理 60秒。  Preferably, the whole pore treatment is carried out using a solution of hydroxyethylethylenediamine having a temperature of 32 to 38 ° C and a mass concentration of 40 to 45% for 60 seconds.
优选的， 所述第八次水洗为重复进行三次溢流水洗 9-11秒。  Preferably, the eighth water washing is repeated three times of overflow washing for 9-11 seconds.
优选的， 所述第九次水洗为重复进行两次溢流水洗 9-11秒。  Preferably, the ninth water washing is repeated two times of overflow water washing for 9-11 seconds.
优选的， 所述抗氧化处理为在室温下使用组分为质量分数为 1%的 2- 已基苯骈咪唑、 质量分数为 0.2%的醋酸铅和质量分数为 0.04%的氨水的抗 氧化液处理 16-20秒。  Preferably, the antioxidant treatment is treatment with an antioxidant solution using a component having a mass fraction of 1% 2-hexylbenzimidazole, a mass fraction of 0.2% lead acetate, and a mass fraction of 0.04% ammonia water at room temperature. 16-20 seconds.
优选的， 所述第十次水洗依次包括重复三次的溢流水洗 9-11秒及清水 洗 9-11秒。  Preferably, the tenth water washing comprises three times of repeated overflow washing for 9-11 seconds and water washing for 9-11 seconds.
上述印刷电路板孔金属化的方法过程中， 磨板之后设计第一次水洗， 清洗孔壁的效果较好； 并且在第一次水洗之后设计了除胶渣工序， 包括膨 松处理、 第二次水洗及除胶渣过程， 其能够除掉钻孔后留在孔壁的胶渍， 增强黑孔的附着力； 在黑孔化之前加入了微蚀处理和除油步骤， 使线路板 表面洁净， 经过两次黑孔化之后再进行微蚀处理和抗氧化处理， 再次使线 路板表面洁净， 保障后续工序电镀铜牢固， 不会掉膜。 黑孔工艺基材上的 铜与电镀铜连接可靠， 不存在铜连接分层问题， 可靠性好， 且黑孔工艺在 基材表面不会有杂质， 连接质量较好。 此外， 黑孔工艺没有用到曱醛、 重 金属， 对环境基本无污染。  In the above method for metallizing the printed circuit board, the first water washing is designed after the grinding plate, and the effect of cleaning the hole wall is better; and the desmear process is designed after the first water washing, including the bulking treatment, the second The secondary washing and degreasing process can remove the glue remaining on the hole wall after drilling and enhance the adhesion of the black hole; before the black hole is added, the micro-etching and degreasing steps are added to clean the surface of the circuit board. After two times of black hole, the micro-etching treatment and anti-oxidation treatment are performed, and the surface of the circuit board is cleaned again to ensure that the copper plating in the subsequent process is firm and does not fall off the film. The copper on the black hole process substrate is reliably connected to the electroplated copper, there is no copper connection delamination problem, the reliability is good, and the black hole process does not have impurities on the surface of the substrate, and the connection quality is good. In addition, the black hole process does not use furfural or heavy metals, and it is basically free from pollution to the environment.
【附图说明】 [Description of the Drawings]
图 1 为利用黑孔化方法进行的孔金属化与利用化学镀铜工艺进行的孔 金属化的照片比较， 其中， 左侧上下两幅照片为利用化学镀铜工艺进行的 孔金属化， 右侧上下两幅照片为利用黑孔化方法进行的孔金属化。 【具体实施方式】 Figure 1 is a photo comparison of the hole metallization by the black hole method and the hole metallization by the electroless copper plating process, wherein the upper and lower two photos are hole metallization by the electroless copper plating process, right side The upper and lower photographs are hole metallization by the black hole method. 【detailed description】
下面主要结合附图及具体实施例对印刷电路板孔金属化的方法作进一 步详细的说明。  The method of metallizing the hole of the printed circuit board will be further described in detail below mainly with reference to the accompanying drawings and specific embodiments.
一实施方式的印刷电路板孔金属化的方法， 将钻孔后的印刷电路板依 次进行如下步骤处理： 磨板处理 第一次水洗 膨松处理 第二次水 洗 除胶渣 第三次水洗 中和处理 第四次水洗 干燥 第一 次微蚀处理 第五次水洗 除油处理 第六次水洗 第一次黑孔化处 理 干燥 整孔处理 第七次水洗 第二次黑孔化处理 干燥 第 二次微独处理 第八次水洗 磨板处理 第九次水洗 抗氧化处理 第十次水洗 干燥及电镀铜处理。  In a method for metallizing a printed circuit board hole according to an embodiment, the drilled printed circuit board is sequentially processed as follows: a grinding plate treatment, a first water washing, a bulking treatment, a second water washing, a desmear, and a third water washing neutralization. Treatment of the fourth water washing and drying, the first micro-etching treatment, the fifth water washing and degreasing treatment, the sixth water washing, the first black hole treatment, the drying, the whole hole treatment, the seventh water washing, the second black hole treatment, the drying, the second micro The eighth treatment of the eighth washing and grinding plate treatment, the ninth washing and anti-oxidation treatment, the tenth washing and drying and electroplating copper treatment.
真 各舟工艺备件可表夹 1 ·  Real boat craft spare parts can be clips 1 ·
表 1 处理时间  Table 1 Processing time
步骤 溶液组分 温度（。C ) 备注  Step Solution Composition Temperature (.C) Remarks
(秒） 磨; ^反处理 至 320#+500#磨刷 加压水洗 至 9-11 2.0-3.0 bar 超声波浸洗 至 9-11 第一次 冲孔水洗 至 9-11 1.0-2.0 bar 水洗 高压水洗 至 18-22 9 bar 加压水洗 至 9-11 2.0-3.0 bar 清水洗 至 9-11 常压 检查 氢氧化钠： 10  (Second) Grinding; ^Reverse treatment to 320#+500# Grinding brush Pressurized water wash to 9-11 2.0-3.0 bar Ultrasonic dipping to 9-11 First punching water wash to 9-11 1.0-2.0 bar Washing high pressure Wash to 18-22 9 bar Pressurized water wash to 9-11 2.0-3.0 bar Wash water to 9-11 Atmospheric pressure Check sodium hydroxide: 10
膨松 72-78 120 - 克 /升 止水洗 至 an 9-11 常压 冲孔水洗 至 im. 9-11 1.0-2.0 bar 第二次 Bulk 72-78 120 - g / liter Wash water until an 9-11 atmospheric pressure punching water wash to im. 9-11 1.0-2.0 bar second time
冲孔水洗 至 im. 9-11 1.0-2.0 bar 水洗  Punching water wash to im. 9-11 1.0-2.0 bar Wash
冲孔水洗 至 im 9-11 1.0-2.0 bar 清水洗 至皿 9-11 常压 高锰酸钾： 60 克 /升  Punching water wash to im 9-11 1.0-2.0 bar Wash water to the dish 9-11 Atmospheric pressure Potassium permanganate: 60 g / liter
除胶渣 84-90 180 - 氢氧化钠： 40 克 /升  Degreaser 84-90 180 - Sodium hydroxide: 40 g / liter
回收水洗 冲污水  Recycling water washing
第三次水 Third water
冲孔水洗 至 9-11 1.0-2.0 bar 洗 石巟酸： 90克 /  Punching water wash to 9-11 1.0-2.0 bar Washing sulphuric acid: 90 g /
预中和 25-30 12-16 - 升  Pre-neutral 25-30 12-16 - liter
水刀洗 至 mi 9-11 常压 中和处理  Water knife wash to mi 9-11 atmospheric pressure neutralization treatment
冲孔水洗 至皿 9-11 1.0-2.0 bar  Punching water to the dish 9-11 1.0-2.0 bar
4酸： 90克 / 4 acid: 90 g /
中和 35-45 40-50 - 升  Neutral 35-45 40-50 - liter
水刀洗 至 /jm 9-11 常压 水刀洗 至 9-11 常压 第四次水  Water knife wash to /jm 9-11 Normal pressure Water knife wash to 9-11 Atmospheric pressure Fourth water
水刀洗 至 /jm. 9-11 常压 洗  Water knife wash to /jm. 9-11 atmospheric pressure wash
溢流水洗 '-曰 9-11 常压 清水洗 ,-曰 9-11 常压 强风吹干 45-55 30 Overflow water wash '-曰9-11 Atmospheric pressure water wash, -曰9-11 Atmospheric pressure Strong wind blow dry 45-55 30
过硫酸钠： 75 第一次微蚀处理 克 /升 32-38 25 - 硫酸： 10wt% 加压水洗 至 9-11 2.0-3.0 bar 超声波浸  Sodium persulfate: 75 First micro-etching treatment gram / liter 32-38 25 - Sulfuric acid: 10wt% Pressurized water wash to 9-11 2.0-3.0 bar Ultrasonic dip
第五次水 ^至έ* 9-11 常压 洗 The fifth time water ^ to έ * 9-11 atmospheric pressure wash
洗  Wash
冲孔水洗 9-11 1.0-2.0 bar 加压水洗 9-11 2.0-3.0 bar 碳酸钠： 30克 / 升  Punching water wash 9-11 1.0-2.0 bar Pressurized water wash 9-11 2.0-3.0 bar Sodium carbonate: 30 g / l
磷酸三钠： 60  Trisodium phosphate: 60
除油 50-60 60 - 克 /升  Degreasing 50-60 60 - g / l
氢氧化钠： 50 克 /升 溢流水洗 ^έ* 9-11 常压 第六次水 溢流水洗 ^έ* 9-11 常压 洗 溢流水洗 至 9-11 常压 溢流水洗 至 9-11 常压 第一次黑孔化处理 碳黑： 2-3wt% 32-38 60 干燥 75-85 50-60秒 检查 至 羟乙基乙二胺  Sodium hydroxide: 50 g / l overflow water washing ^ έ * 9-11 Atmospheric pressure sixth water overflow washing ^ έ * 9-11 Atmospheric pressure wash overflow water wash to 9-11 Atmospheric pressure overflow water wash to 9- 11 Atmospheric first black hole treatment carbon black: 2-3wt% 32-38 60 dry 75-85 50-60 seconds check to hydroxyethyl ethylenediamine
整孔处理 32-38 60  Whole hole treatment 32-38 60
40-45wt% 溢流水洗 至 an 9-11 常压 第七次水 溢流水洗 至 im. 9-11 常压 洗 溢流水洗 至 im. 9-11 常压 溢流水洗 至 an 9-11 常压 第二次黑孔化处理 碳黑： 2-3wt% 32-38 92 干燥 75-85 50-60秒 检查 过硫酸钠： 75 40-45wt% Overflow water wash to an 9-11 atmospheric pressure seventh water overflow wash to im. 9-11 atmospheric pressure wash overflow water wash to im. 9-11 atmospheric pressure overflow water wash to an 9-11 atmospheric pressure second time Black hole treatment carbon black: 2-3wt% 32-38 92 dry 75-85 50-60 seconds check sodium persulfate: 75
第二次微蚀处理 克 /升 40 40-48 - 硫酸： 10wt% 溢流水洗 至'-曰  Second micro-etching treatment gram / liter 40 40-48 - sulfuric acid: 10wt% overflow water wash to '-曰
/jm 9-11 常压 第八次水  /jm 9-11 atmospheric pressure eighth water
溢流水洗 至 9-11 常压 洗  Overflow wash to 9-11 atmospheric pressure wash
溢流水洗 至 /no. 9-11 常压 磨板 800#磨刷 第九次水 溢流水洗 至 /no. 9-11 常压 洗 溢流水洗 至 /no. 9-11 常压  Overflow wash to /no. 9-11 Atmospheric pressure Grinding plate 800# Grinding Ninth water Overflow wash to /no. 9-11 Atmospheric pressure Wash Overflow wash to /no. 9-11 Atmospheric pressure
2-已基苯骈咪 11坐： lwt% 抗氧化 醋酸铅： 至 16-20 - 0.2wt% , 氨水： 0.04wt% 溢流水洗 至 9-11 常压 第十次水 2-hexyl benzopyrene 1 1 sitting: lwt% lead acetate: 16-20 - 0.2wt%, ammonia: 0.04wt% overflow wash to 9-11 atmospheric tenth water
溢流水洗 '-曰 9-11 常压 洗  Overflow wash '-曰 9-11 atmospheric pressure wash
溢流水洗 ,-曰 9-11 常压 清水洗 至 9-11 常压1 干燥 75-85 50-60秒Overflow water wash, -曰9-11 atmospheric pressure Wash with water until 9-11 Atmospheric pressure 1 Dry 75-85 50-60 seconds
2 电镀铜 2 electroplated copper
其中， 磨板处理过程可以通过酸洗、 机械磨刷、 水洗、 烘干等一系列 作用， 达到去除板面氧化物、 油污、 手指印及其它污物的目的， 通过粗化、 清洁板面以增强板面的附着力。 本实施方式通过机械磨刷的方式进行磨板 处理。  Among them, the grinding plate processing process can achieve the purpose of removing oxides, oil stains, fingerprints and other dirt on the surface of the board by pickling, mechanical grinding, water washing, drying, etc., by roughening and cleaning the board surface. Enhance the adhesion of the board. In the present embodiment, the rubbing treatment is performed by means of mechanical rubbing.
膨松处理和除胶渣可以溶解中小分子软化孔壁上的树脂的链结， 将其 膨松， 然后利用相应的除胶渣剂， 如 KMn04溶液等对胶渣进行氧化处理而 去除， 同时形成与电镀铜结合之蜂巢状表面， 有利于后续工序的进行。 The bulking treatment and the desmear process can dissolve the chain of the resin on the wall of the small and medium-molecule softening pores, and then loosen it, and then remove the slag by using a corresponding degreasing agent such as KMn0 4 solution, and simultaneously Forming a honeycomb-like surface combined with electroplated copper facilitates the subsequent process.
中和处理是将板面残留的 Mn7+、 Mn6+及 Mn4+还原为可溶性的 Mn2+, 自板面或孔中去除， 防止残留于孔壁， 导致孔破或电镀镀层附着不良。 Neutralization treatment reduces Mn 7+ , Mn 6+ and Mn 4+ remaining on the surface of the sheet to soluble Mn 2+ , which is removed from the surface or the pores to prevent residual pores, resulting in pore breakage or poor adhesion of the plating plating. .
在黑孔化处理之前加入了微蚀处理和除油， 可以使线路板表面洁净， 经过两次黑孔之后再微蚀， 抗氧化， 再次使线路板表面洁净， 保障后工序 电镀铜牢固， 不会掉膜。  Micro-etching treatment and degreasing are added before the black hole treatment, which can clean the surface of the circuit board. After two black holes, it will be micro-etched and anti-oxidation, and the surface of the circuit board will be cleaned again to ensure the copper plating is firm in the post-process. Will drop the film.
黑孔化处理过程是将钻孔印刷电路板置于黑孔液中， 将精细的碳黑粉 末浸涂在印刷电路板的孔壁上形成导电层， 然后通过后续的电镀铜处理进 行铜电镀。  The black hole treatment process is to place the drilled printed circuit board in the black hole liquid, dip the fine carbon black powder on the hole wall of the printed circuit board to form a conductive layer, and then perform copper plating by subsequent copper plating treatment.
本实施方式对使用的自来水进行的杀菌处理， 优选的采用紫外线对自 来水杀菌， 得到纯水。  In the sterilizing treatment of the tap water to be used in the present embodiment, it is preferred to sterilize the tap water with ultraviolet rays to obtain pure water.
紫外线是介于可视光线和 X射线之间的电磁波频谱。 200nm至 400nm 的紫外光谱有很强的杀菌效力， 其峰值在 265nm。 在这个波长范围内的紫 外线通过刺穿细胞膜， 破坏细胞内脱氧核糖核酸和破坏细胞内的其它分子， 使微生物不能再复制和繁殖， 而最终达到消毒作用。  Ultraviolet light is the spectrum of electromagnetic waves between visible light and X-rays. The UV spectrum from 200 nm to 400 nm has a strong bactericidal effect with a peak at 265 nm. In this wavelength range, the ultraviolet rays break through the cell membrane, destroy the intracellular DNA and destroy other molecules in the cell, so that the microorganism can no longer replicate and multiply, and finally achieve disinfection.
依照波长范围， 紫外线分为 4个波段： 真空紫外线： 40-200nm、 紫外 线 c: 200-280匪、 紫外线 b: 280-315匪、 紫外线 a: 315-400匪。 紫外线消毒作用是通过微生物体内的脱氧核糖核酸吸收紫外光线来完 成。 最大吸收值分别是在波长 200nm和 265nm, 波长为 200nm的紫外光， 主要是被中枢脱氧核糖核酸的核糖和磷酸盐所吸收。 而波长为 265nm的紫 外线主要被核酸中的腺嘌呤， 鸟嘌呤， 胞核嘧啶和胸腺嘧啶（核糖核酸中 的尿嘧啶）所吸收。 在吸收紫外线辐射以后， 胸腺嘧啶二聚物是最为常见 菌的原理就是， 这些二聚物和另外一些光化产品可以阻止脱氧核糖核酸的 复制和再繁殖， 从而达到杀死细胞的目的。 According to the wavelength range, the ultraviolet light is divided into four bands: vacuum ultraviolet: 40-200 nm, ultraviolet c: 200-280 匪, ultraviolet b: 280-315 匪, ultraviolet a: 315-400 匪. UV disinfection is accomplished by the absorption of UV light by deoxyribonucleic acid in the microorganisms. The maximum absorption values are ultraviolet light at wavelengths of 200 nm and 265 nm and wavelengths of 200 nm, respectively, which are mainly absorbed by ribose and phosphate of central deoxyribonucleic acid. Ultraviolet light with a wavelength of 265 nm is mainly absorbed by adenine, guanine, cytosine and thymine (uracil in ribonucleic acid) in nucleic acids. The principle of thymine dimers, the most common bacteria, after absorbing ultraviolet radiation is that these dimers and other actinic products can prevent the replication and reproduction of DNA, thereby killing cells.
另外对于脱氧核糖核酸和核糖核酸， 紫外线能够引起细胞内的蛋白质、 酶和其它分子的光化学反应。 蛋白质的吸收峰值大约在 280nm左右， 然而 在蛋白质中的缩氨酸根则吸收 240nm以下的紫外线。 紫外线也对其它的不 饱和生物分子有杀伤力， 例如： 辅酶、 荷尔蒙和电子负载体。 当然， 紫外 线对分子的影响， 不仅仅作用于脱氧核糖核酸和核糖核酸， 其对一些的微 生物也有显着的作用， 例如真菌类、 原生动物和藻类。 虽然紫外线不能像 作用于脱氧核糖核酸一样， 刺穿这些较大的微生物， 但是其还是能用破坏 其它分子的方法达到杀菌效果。  In addition, for deoxyribonucleic acid and ribonucleic acid, ultraviolet light can cause photochemical reactions of proteins, enzymes and other molecules in cells. The absorption peak of the protein is about 280 nm, whereas the peptide in the protein absorbs ultraviolet rays below 240 nm. Ultraviolet light is also destructive to other unsaturated biomolecules such as coenzymes, hormones and electronic supports. Of course, the effect of ultraviolet light on molecules is not only on deoxyribonucleic acid and ribonucleic acid, but also on some micro-organisms such as fungi, protozoa and algae. Although ultraviolet light cannot pierce these larger microorganisms as it does with deoxyribonucleic acid, it can still achieve germicidal effects by destroying other molecules.
这个方法与传统化学方法相比较， 此方法较为有优势。 紫外线消毒是 一种完全无公害技术， 对人类、 动物、 水生物以及产品均不产生危害， 而 且不会在消毒过程中产生有害副产品。 在消毒杀菌的永久性方面， 此项技 术对所有的微生物均有极高的效力， 其中也包括对氯极有免疫力的微小隐 孢子虫。  This method is more advantageous than traditional chemical methods. UV disinfection is a completely pollution-free technology that does not pose a hazard to humans, animals, aquatic organisms, and products, and does not produce harmful by-products during the sterilization process. In terms of the permanence of sterilization, this technology is extremely effective against all microorganisms, including the tiny Cryptosporidium that is extremely immune to chlorine.
紫外线消毒***内有一个紫外线灯管和一个石英套管。 这个紫外线灯 管被固定在石英套管里， 然后整个套管将被固定到一个柱状不锈钢反应室 内。 这样的设计是为了让待处理水在从一端进入反应器的同时开始被处理， 而整个消毒过程将伴随水流流至反应器的另一端。  The UV disinfection system has an ultraviolet tube and a quartz sleeve. This UV lamp is fixed in a quartz sleeve and the entire sleeve is then fixed into a cylindrical stainless steel reaction chamber. This design is such that the water to be treated begins to be processed while entering the reactor from one end, and the entire sterilization process will accompany the flow of water to the other end of the reactor.
本实施方式的印刷电路板孔金属化的方法首先将印刷电路板放入黑孔 液中按上述工艺流程进行孔金属化处理， 然后再在该工艺流程中按各相关 的设备调较相应的各个参数， 从而使印刷电路板孔金属化的前后生产工艺 和相配套的设备形成一个有效而精确的***。 确保了精细的碳黑能充分被 吸附在非导体的孔壁表面， 形成均匀细致而结合牢固的导电层， 为后续电 镀制程顺利进行提供了保证。 同时， 进行黑孔生产时， 药水会产生大量废 气， 在停产时， 废气冷凝， 流回到黑孔药水缸中， 各种废气混合在一起， 因此冷凝水中有很多杂物， 造成黑孔药水变质， 本实施方式设有冷凝回收 装置， 该装置不允许废气冷凝回流到黑孔药水缸中， 是一种防止黑孔液变 质的方法。 精准的各类参数也使生产工艺中节省了能源， 更利环保。 The method for metallizing a printed circuit board hole of the present embodiment first places a printed circuit board into a black hole The liquid metallization process is carried out in the liquid according to the above process flow, and then the corresponding parameters are adjusted according to the relevant equipment in the process flow, so that the production process of the printed circuit board hole metallization and the matching equipment form a An effective and accurate system. It ensures that the fine carbon black can be fully adsorbed on the surface of the non-conductor hole wall to form a uniform and fine and firmly bonded conductive layer, which guarantees the smooth progress of the subsequent electroplating process. At the same time, in the production of black holes, the syrup will generate a large amount of exhaust gas. When the production is stopped, the exhaust gas condenses and flows back into the black hole medicine tank. The various exhaust gases are mixed together, so there is a lot of impurities in the condensed water, causing the black hole syrup to deteriorate. The present embodiment is provided with a condensing recovery device which does not allow the exhaust gas to condense and return to the black hole medicine tank, and is a method for preventing deterioration of the black hole liquid. Accurate parameters also save energy and make the environment more environmentally friendly.
本实施方式所制造出来的印刷线路板经过测试， 黑孔附着力 4艮好。 相 比较传统的化学镀铜工艺， 本实施方式的方法具有显着的优点， 如表 2所 表 2 号 项目 对比结果 黑孔生产线的设备投资是化学镀铜水平生产线的 50% , The printed wiring board manufactured by the present embodiment was tested, and the adhesion of the black holes was good. Compared with the traditional electroless copper plating process, the method of the present embodiment has significant advantages, such as the comparison of the items in Table 2 of Table 2. The equipment investment of the black hole production line is 50% of the horizontal copper electroplating production line.
1 (月产能 30万尺的水平线）。 1 (horizontal line with a monthly capacity of 300,000 feet).
使用成本 黑孔生产线使用的化学药水比化学镀铜生产线使用的药水减少  Cost of use The chemical solution used in the black hole production line is less than the potion used in the electroless copper production line.
75% , 黑孔线化学药品用量为 4-10mIJm2, 化学镀铜线化学药品用 量为 25-30mL/m2。 75%, the black hole line chemical dosage is 4-10mIJm 2 , and the chemical copper plating line chemical dosage is 2 5-30mL/m 2 .
黑孔工艺基材上的铜与电镀铜连接可靠， 不存在铜连接分层问题， 化学镀铜工艺因为基材铜和镀铜之间有钯金属存在， 连接可靠性不 如黑孔工艺。  The copper on the black hole process substrate is reliably connected to the electroplated copper, and there is no copper connection delamination problem. The electroless copper plating process has a palladium metal between the substrate copper and the copper plating, and the connection reliability is not as good as the black hole process.
工艺品质  Process quality
黑孔工艺在基材表面不会有杂质， 化学镀铜工艺由于后续电镀的原 因， 表面上有杂质， 化学镀铜层与电镀铜层之间有分层， 影响连接 质量， 如图 1所示。  The black hole process does not have impurities on the surface of the substrate. The electroless copper plating process has impurities on the surface due to subsequent plating, and there is delamination between the electroless copper plating layer and the electroplated copper layer, which affects the connection quality, as shown in FIG. .
黑孔工艺的分析项目比化学镀铜工艺减少 50% , 黑孔工艺分析项目 Black hole process analysis project is 50% less than electroless copper plating process, black hole process analysis project
5 有 6项， 化学镀铜工艺分析项目有 13项。 There are 6 items in the project, and there are 13 items in the electroless copper plating process analysis.
生产难易程度  Production difficulty
黑孔工艺溶液不需要活化， 可以直接生产， 化学镀铜溶液需要做假 板激活化学槽液， 造成药水损耗， 影响生产效率。 黑孔工艺的溶液使用寿命比化学镀铜工艺长，黑孔药水可使用 1年， 每半年洗一次槽， 化学镀铜药水使用 3个月， 每周需要洗一次槽。 黑孔工艺的流程时间是化学镀铜工艺的四分之一， 黑孔工艺流程时The black hole process solution does not need to be activated, and can be directly produced. The electroless copper plating solution needs to be used as a false plate to activate the chemical bath liquid, which causes the loss of the medicine water and affects the production efficiency. The solution life of the black hole process is longer than that of the electroless copper plating process. The black hole solution can be used for one year, and the tank is washed once every six months. The electroless copper plating solution is used for 3 months, and the tank needs to be washed once a week. The flow time of the black hole process is one quarter of the electroless copper plating process, during the black hole process
8 间为 12分钟， 化学镀铜工艺流程时间为 50分钟。 The 8 minutes are 12 minutes and the electroless copper plating process takes 50 minutes.
黑孔工艺没有用到甲醛， 没有用到重金属，化学镀铜工艺用到甲醛， The black hole process does not use formaldehyde, no heavy metals are used, and the chemical copper plating process uses formaldehyde.
9 9
对环境的影响 钯， 鳌合物等有害物质。 Environmental impact Palladium, chelates and other harmful substances.
0 黑孔工艺产生的废水量只有化学镀铜工工艺的 20% ,对环境影响小。 0 The amount of wastewater generated by the black hole process is only 20% of that of the electroless copper plating process, and has little impact on the environment.
上述印刷电路板孔金属化的方法过程中， 磨板之后设计第一次水洗， 清洗孔壁的效果较好； 并且在第一次水洗之后设计了除胶渣工序， 包括膨 松处理、 第二次水洗及除胶渣过程， 其能够除掉钻孔后留在孔壁的胶渍， 增强黑孔的附着力；在黑孔化之前加入了微独和除油，使线路板表面洁净， 经过两次黑孔之后再微蚀， 抗氧化， 再次使线路板表面洁净， 保障后续工 序电镀铜牢固， 不会掉膜。 黑孔工艺基材上的铜与电镀铜连接可靠， 不存 在铜连接分层问题， 可靠性好， 且黑孔工艺在基材表面不会有杂质， 连接 质量较好。 此外， 黑孔工艺没有用到曱醛、 重金属， 对环境基本无污染。 详细， 但并不能因此而理解为对本发明专利范围的限制。 应当指出的是， 对于本领域的普通技术人员来说， 在不脱离本发明构思的前提下， 还可以 做出若干变形和改进， 这些都属于本发明的保护范围。 因此， 本发明专利 的保护范围应以所附权利要求为准。  In the above method for metallizing the printed circuit board, the first water washing is designed after the grinding plate, and the effect of cleaning the hole wall is better; and the desmear process is designed after the first water washing, including the bulking treatment, the second The secondary washing and degreasing process can remove the glue left on the hole wall after drilling, and enhance the adhesion of the black hole; before the black hole, the micro-separation and degreasing are added to make the surface of the circuit board clean. After two black holes, it will be micro-etched, anti-oxidation, and clean the surface of the circuit board again, ensuring that the copper plating in the subsequent process is firm and will not drop the film. The copper on the black hole process substrate is reliably connected to the electroplated copper, there is no copper connection delamination problem, the reliability is good, and the black hole process does not have impurities on the surface of the substrate, and the connection quality is good. In addition, the black hole process does not use furfural or heavy metals, and it has no pollution to the environment. The detailed description is not to be construed as limiting the scope of the invention. It should be noted that a number of variations and modifications may be made by those skilled in the art without departing from the spirit and scope of the invention. Therefore, the scope of the invention should be determined by the appended claims.

Claims

权利要求书 Claim
1、 一种印刷电路板孔金属化的方法， 其特征在于， 包括将钻孔后的印 刷电路板依次进行如下步骤处理： A method for metallizing a printed circuit board hole, comprising: performing the following steps in sequence on the printed circuit board after drilling:
磨板处理： 对所述印刷电路板板面进行磨板处理以粗化、 清洁板面， 而后进行第一次水洗以除去板面和孔壁剩余的杂质；  Grinding plate treatment: grinding the surface of the printed circuit board to roughen and clean the surface of the board, and then performing the first water washing to remove impurities remaining on the surface of the board and the wall;
膨松及除胶渣： 对印刷电路板孔壁表面的中小分子树脂进行膨松处理 以溶解中小分子树脂的链结并将所述孔壁膨松， 然后进行第二次水洗以除 去板面和孔壁剩余的杂质和残留液， 再进行除胶渣处理以部分去除孔壁上 膨松的树脂分子， 在所述孔壁表面形成蜂巢状结构， 最后进行第三次水洗 除去板面和孔壁剩余的杂质和残留液；  Loose and degreased: The small and medium molecular resin on the surface of the hole wall of the printed circuit board is subjected to a bulking treatment to dissolve the chain of the small and medium molecular resin and to loosen the pore wall, and then subjected to a second water washing to remove the surface and The remaining impurities and residual liquid in the pore wall are subjected to desmear treatment to partially remove the bulky resin molecules on the pore walls, forming a honeycomb structure on the surface of the pore wall, and finally performing a third water washing to remove the surface and the pore walls. Residual impurities and residual liquid;
中和处理： 除去除胶渣处理后吸附在孔壁的杂质离子， 并进行第四次 水洗除去板面和孔壁剩余的杂质和残留液， 最后进行干燥；  Neutralization treatment: Except the impurity ions adsorbed on the pore wall after removing the slag treatment, and performing the fourth water washing to remove impurities and residual liquid remaining on the surface of the plate and the pore wall, and finally drying;
微蚀及除油： 首先对板面进行第一次微蚀处理以清洁板面， 然后进行 第五次水洗除去板面和孔壁剩余的杂质和残留液， 再对所述板面及孔壁进 行除油处理以除去板面和孔壁残留的非极性分子杂质， 最后进行第六次水 洗除去板面和孔壁剩余的杂质和残留液；  Micro-etching and degreasing: Firstly, the first micro-etching treatment is performed on the board surface to clean the board surface, and then the fifth water washing is performed to remove the remaining impurities and residual liquid on the board surface and the hole wall, and then the board surface and the hole wall Degreasing treatment to remove non-polar molecular impurities remaining on the surface of the plate and the pore wall, and finally performing a sixth water washing to remove impurities and residual liquid remaining on the surface of the plate and the pore wall;
黑孔化： 首先对印刷电路板进行第一次黑孔化处理使孔壁表面预吸附 一层碳黑导电层， 干燥后进行整孔处理以调整孔壁表面树脂分子所带电荷 以利于进一步吸附碳黑分子， 然后进行第七次水洗除去板面和孔壁剩余的 杂质和残留液， 再进行第二次黑孔化处理使孔壁表面继续吸附碳黑分子以 形成碳黑导电层， 最后干燥；  Black hole: First, the first black hole treatment of the printed circuit board is to pre-adsorb a layer of carbon black conductive layer on the surface of the hole wall, and then dry the hole to adjust the charge of the resin molecules on the surface of the hole wall to facilitate further adsorption. The carbon black molecule is then subjected to a seventh water washing to remove the remaining impurities and residual liquid on the surface of the plate and the pore wall, and then subjected to a second blackening treatment to continue to adsorb carbon black molecules on the surface of the pore wall to form a carbon black conductive layer, and finally dried. ;
微蚀： 对黑孔化的印刷电路板进行第二次微蚀处理以清除金属导电层 吸附的碳黑分子， 然后进行第八次水洗除去板面和孔壁剩余的杂质和残留 液；  Micro-etching: a second micro-etching treatment on the black-pore printed circuit board to remove the carbon black molecules adsorbed by the metal conductive layer, and then performing an eighth water washing to remove impurities and residual liquid remaining on the surface of the board and the pore walls;
磨板及抗氧化： 首先对所述印刷电路板进行磨板处理及第九次水洗以 除去板面和孔壁剩余的杂质和残留液， 然后对印刷电路板的金属导电层部 分进行抗氧化处理； Grinding plate and oxidation resistance: Firstly, the printed circuit board is subjected to a rubbing treatment and a ninth water washing to remove impurities and residual liquid remaining on the surface of the board and the hole, and then to the metal conductive layer of the printed circuit board. Perform anti-oxidation treatment;
电镀铜： 对抗氧化处理后的印刷电路板进行第十次水洗除去板面和孔 壁剩余的杂质和残留液， 干燥后进行电镀铜处理以在孔壁的碳黑层上电镀 铜金属层。  Electroplated copper: The anti-oxidation printed circuit board is subjected to a tenth water washing to remove remaining impurities and residual liquid on the surface of the board and the pores, and after drying, electroplating copper treatment is performed to electroplat the copper metal layer on the carbon black layer of the pore walls.
2、 如权利要求 1所述的印刷电路板孔金属化的方法， 其特征在于， 所 述第一次水洗依次包括如下步骤： 水压为 2.0-3.0 bar的加压水洗 9-11秒、 超声波浸洗 9-11秒、 水压为 1.0-2.0 bar沖孔水洗 9-11秒、 水压为 9 bar的 高压水洗 9-11秒、 水压为 2.0-3.0 bar的加压水洗 5-6秒及清水洗 5-6秒。  2. The method of metallizing a printed circuit board according to claim 1, wherein the first water washing comprises the following steps: water pressure is 2.0-3.0 bar pressurized water washing for 9-11 seconds, ultrasonic Dipping for 9-11 seconds, water pressure of 1.0-2.0 bar, washing for 9-11 seconds, water pressure of 9 bar for 9-11 seconds, water pressure of 2.0-3.0 bar for 5-6 seconds Wash with water for 5-6 seconds.
3、 如权利要求 1所述的印刷电路板孔金属化的方法， 其特征在于， 所 述膨松处理过程使用的膨松剂为 10g/L 的氢氧化钠溶液， 溶液温度为 72-78 °C , 处理时间为 120秒。  3. The method for metallizing a printed circuit board according to claim 1, wherein the leavening agent used in the bulking process is a 10 g/L sodium hydroxide solution, and the solution temperature is 72-78 °. C, processing time is 120 seconds.
4、 如权利要求 1所述的印刷电路板孔金属化的方法， 其特征在于， 所 述第二次水洗依次包括如下步骤： 止水洗 9-11秒、 水压为 1.0-2.0 bar沖孔 水洗 27-33秒、 及清水洗 9-11秒。  4. The method according to claim 1, wherein the second water washing comprises the following steps: washing for 9-11 seconds, water pressure of 1.0-2.0 bar, punching and washing. 27-33 seconds, and wash with water for 9-11 seconds.
5、 如权利要求 1所述的印刷电路板孔金属化的方法， 其特征在于， 所 述除胶渣过程使用的溶液组分为 60g/L的高锰酸钟和 40g/L的氢氧化钠，溶 液温度为 84-90 °C , 处理时间为 180秒。  5. The method of metallizing a printed circuit board according to claim 1, wherein the solution component used in the desmear process is a 60 g/L permanganic acid clock and 40 g/L sodium hydroxide. The solution temperature was 84-90 ° C and the treatment time was 180 seconds.
6、 如权利要求 1所述的印刷电路板孔金属化的方法， 其特征在于， 进 行所述第三次水洗前还包括回收水洗液并进行沖污水的过程。  6. The method of metallizing a printed circuit board according to claim 1, further comprising the step of recovering the water washing liquid and flushing the water before performing the third water washing.
7、 如权利要求 1所述的印刷电路板孔金属化的方法， 其特征在于， 所 述第三次水洗是水压为 1.0-2.0 bar沖孔水洗 9-11秒。  7. The method of metallization of a printed circuit board according to claim 1, wherein said third water washing is performed by punching water at a water pressure of 1.0 to 2.0 bar for 9-11 seconds.
8、 如权利要求 1所述的印刷电路板孔金属化的方法， 其特征在于， 所 述中和处理依次包括如下步骤： 使用温度为 25-30°C、 浓度为 90g/L的硫酸 预中和处理 12-16秒；水刀洗 9-11秒；水压为 1.0-2.0 bar沖孔水洗 9-11秒； 以及使用温度为 35-45°C , 浓度为 90g/L的石 A酸中和处理 40-50秒。  8. The method of metallizing a printed circuit board according to claim 1, wherein the neutralization process comprises the following steps in sequence: using a sulfuric acid pre-concentration having a temperature of 25-30 ° C and a concentration of 90 g/L. And treatment for 12-16 seconds; water knife wash for 9-11 seconds; water pressure for 1.0-2.0 bar punching for 9-11 seconds; and use of temperature of 35-45 ° C, concentration of 90g / L of stone A acid And processing 40-50 seconds.
9、 如权利要求 1所述的印刷电路板孔金属化的方法， 其特征在于， 所 述第四次水洗依次包括如下步骤： 水刀洗 9-11秒、 水刀洗 9-11秒、 水刀洗 9- 11秒、 溢流水洗 9- 11秒及清水洗 9- 11秒。 9. The method of metallization of a printed circuit board hole according to claim 1, wherein The fourth water washing step comprises the following steps: water knife washing for 9-11 seconds, water knife washing for 9-11 seconds, water knife washing for 9-11 seconds, overflow washing for 9-11 seconds, and water washing for 9-11 seconds.
10、 如权利要求 1 所述的印刷电路板孔金属化的方法， 其特征在于， 所述第一次微蚀处理是使用温度为 32-38°C、 组分为 75g/L的过硫酸钠和质 量分数为 10%的石充酸的 £蚀液处理 25秒；  10. The method of metallizing a printed circuit board according to claim 1, wherein the first microetching treatment is using sodium persulfate having a composition of 75-38 ° C and a composition of 75 g/L. And treatment with a mass fraction of 10% of stone-charged etchant for 25 seconds;
所述第二次维持处理是使用温度为 40°C、 组分为 75g/L的过硫酸钠和 质量分数为 10%的硫酸的微独液处理 40-48秒。  The second maintenance treatment was carried out using a sodium monosulfate having a composition of 75 ° C and a composition of 75 g/L of sodium persulfate and a sulfuric acid having a mass fraction of 10% for 40 to 48 seconds.
11、 如权利要求 1 所述的印刷电路板孔金属化的方法， 其特征在于， 所述第五次水洗依次包括如下步骤：水压为 2.0-3.0 bar的加压水洗 9-11秒、 超声波浸洗 9-11秒、水压为 1.0-2.0 bar沖孔水洗 9-11秒及水压为 2.0-3. Obar 的加压水洗 9-11秒。  11. The method of claim 1, wherein the fifth water washing comprises the following steps: pressurizing water with a water pressure of 2.0-3.0 bar for 9-11 seconds, ultrasonic wave. Dip for 9-11 seconds, water pressure of 1.0-2.0 bar for 9-11 seconds, water pressure of 2.0-3. Obar for 9-11 seconds.
12、 如权利要求 1 所述的印刷电路板孔金属化的方法， 其特征在于， 所述除油处理是使用温度为 50-60 °C、 组分为 30g/L的碳酸钠、 60g/L的磷 酸三钠和 50g/L的氢氧化钠的除油液处理 60秒。  12. The method for metallizing a printed circuit board according to claim 1, wherein the degreasing treatment is using sodium carbonate at a temperature of 50-60 ° C and a composition of 30 g/L, 60 g/L. The degreased solution of trisodium phosphate and 50 g/L of sodium hydroxide was treated for 60 seconds.
13、 如权利要求 1 所述的印刷电路板孔金属化的方法， 其特征在于， 所述第六次水洗及所述第七次水洗为重复进行四次溢流水洗 9-11秒。  13. The method of metallizing a printed circuit board according to claim 1, wherein the sixth water washing and the seventh water washing are repeated for four times of overflow washing for 9-11 seconds.
14、 如权利要求 1 所述的印刷电路板孔金属化的方法， 其特征在于， 所述第一次黑孔化处理为使用温度为 32-38°C , 碳黑质量浓度为 2-3%的黑 孔液处理 60秒；  The method for metallizing a printed circuit board according to claim 1, wherein the first blackening treatment is performed at a temperature of 32-38 ° C and a carbon black mass concentration of 2-3%. Black hole treatment for 60 seconds;
所述第二次黑孔化处理为使用温度为 32-38°C , 碳黑质量浓度为 2-3% 的黑孔液处理 92秒。  The second blackening treatment was carried out using a black hole liquid having a temperature of 32 to 38 ° C and a carbon black mass concentration of 2 to 3% for 92 seconds.
15、 如权利要求 1 所述的印刷电路板孔金属化的方法， 其特征在于， 整孔处理为使用温度为 32-38°C、 质量浓度为 40-45%的羟乙基乙二胺溶液 处理 60秒。  15. The method of metallizing a printed circuit board according to claim 1, wherein the whole hole is treated with a hydroxyethylethylenediamine solution having a temperature of 32 to 38 ° C and a mass concentration of 40 to 45%. Processing for 60 seconds.
16、 如权利要求 1 所述的印刷电路板孔金属化的方法， 其特征在于， 所述第八次水洗为重复进行三次溢流水洗 9-11秒。 16. The method of metallization of a printed circuit board according to claim 1, wherein the eighth water washing is repeated three times of overflow washing for 9-11 seconds.
17、 如权利要求 1 所述的印刷电路板孔金属化的方法， 其特征在于， 所述第九次水洗为重复进行两次溢流水洗 9-11秒。 17. The method of metallizing a printed circuit board according to claim 1, wherein the ninth water washing is repeated for two times of overflow washing for 9-11 seconds.
18、 如权利要求 1 所述的印刷电路板孔金属化的方法， 其特征在于， 所述抗氧化处理为在室温下使用组分为质量分数为 1%的 2-已基苯骈咪唑、 质量分数为 0.2%的醋酸铅和质量分数为 0.04%的氨水的抗氧化液处理 16-20 秒。  18. The method of claim 1, wherein the anti-oxidation treatment is performed using a component having a mass fraction of 1% of 2-hexylbenzimidazole at room temperature, quality. The antioxidant solution with a fraction of 0.2% lead acetate and a mass fraction of 0.04% ammonia is treated for 16-20 seconds.
19、 如权利要求 1 所述的印刷电路板孔金属化的方法， 其特征在于， 所述第十次水洗依次包括重复三次的溢流水洗 9-11秒及清水洗 9-11秒。  19. The method of metallizing a printed circuit board according to claim 1, wherein the tenth water washing comprises, in order, three times of repeated overflow washing for 9-11 seconds and water washing for 9-11 seconds.
PCT/CN2011/081235 2011-10-25 2011-10-25 Process for metallisation of holes in printed circuit board WO2013059985A1 (en)

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