CN110446345A - A kind of resin ground method - Google Patents
A kind of resin ground method Download PDFInfo
- Publication number
- CN110446345A CN110446345A CN201910616788.1A CN201910616788A CN110446345A CN 110446345 A CN110446345 A CN 110446345A CN 201910616788 A CN201910616788 A CN 201910616788A CN 110446345 A CN110446345 A CN 110446345A
- Authority
- CN
- China
- Prior art keywords
- grinding
- wiring board
- washed
- axis
- nonwoven fabric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0766—Rinsing, e.g. after cleaning or polishing a conductive pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
Abstract
A kind of resin ground method, including put plate, bulk, first time dirt removal water, first time water knife are washed, de-smear, second of dirt removal water, second of water knife are washed, neutralized, third time water knife is washed, high wind drying, grinding, cleaning, drying, receive plate.The present invention is using speed 1.5m/min into plate speed, wiring board successively passes through the high machining ceramic brush grinding of an axis, four axis height cut the grinding of winding type nonwoven fabric brush roll, the high machining ceramic brush grinding of four axis, two axis height cut the grinding of winding type nonwoven fabric brush roll and the high machining ceramic brush grinding of two axis, the grinding combined method of the emanant nonwoven fabric brush grinding of two axis and the cutting winding type nonwoven fabric brush grinding of two axis height, grinding can once reach production effect, it can be reduced the production time, promote production capacity standard, copper face uniformity after resin ground can be promoted, it is able to satisfy different type aperture simultaneous grinding, macropore breakage risk can be reduced.
Description
Technical field
The present invention relates to wiring board processing technique field, in particular to a kind of resin ground method.
Background technique
With the complication of design of electronic products, in order to save PCB surface space, improve the reliable of wiring board welding
Property, more and more route panel products used the design method of hole surface production copper PAD.The wiring board of this kind of design is produced
Product need to need to be filled up in the via hole for crossing hole surface production copper PAD with resin, then pass through grinding using filling holes with resin mode
Remove hole edge overflow Excess resin, keep aperture resin equal with substrate surface, make plate face it is smooth, it is clean, without residue glue.
At present in resin ground technical aspect, using 8 axis Plate grinders, the high cutting nonwoven fabric brush rod of 6 axis (400 mesh) and 2 axis
The combination of (600 mesh) polishing type nonwoven fabric brush rod is ground；This lapping mode First Pass Yield is low, needs to grind 2-3 times
Production effect can be reached, production efficiency is low, and plate face copper thickness uniformity is poor after grinding, and macropore is be easy to cause to gall, and causes to scrap.
Summary of the invention
The technical problem to be solved by the present invention is to overcome drawbacks described above of the existing technology, provide one kind and be suitable for
Different type resin ground product can shorten production time and cost, promote face copper uniformity, promote grinding effect, reduce report
Useless resin ground method.
The technical solution adopted by the present invention to solve the technical problems is a kind of resin ground method, comprising the following steps:
It puts plate: wiring board to be ground is placed on inclined automatic plate putting machine, it will be to by inclined automatic plate putting machine
Wiring board is ground to be sent into except glue cylinder；
It is bulk: to be handled using leavening agent, softening is except the resin in glue cylinder on wiring board；
First time dirt removal water: the foreign matter and oxide in the wiring board plate face through bulk processing are removed；
First time water knife is washed: the chemical agent in the wiring board plate face through first time dirt removal water and hole is removed；
De-smear: the wiring board washed through first time water knife, MnO4 are handled using the strong oxidizing property of high manganese ion
Ion will make it dissolve by the epoxy resin oxidation on bulk hole wall, under the strong alkaline condition of sodium hydroxide in removing
In glue groove and it is decomposed into small molecule organic salt；
Second of dirt removal water: the wiring board through de-smear is removed, to remove cull and glue residue in plate face；
Second of water knife is washed: the chemical agent in the wiring board plate face through second of dirt removal water and hole is removed；
It neutralizes: remaining manganese dioxide, sexavalence manganese and septivalency manganese on the wiring board hole wall washed through second of water knife is restored
For soluble divalent manganesetion；
Third time water knife is washed: being carried out third time water knife to neutralized wiring board and is washed, removes remaining height in plate face and hole
Potassium manganate, process tank liquor is not contaminated after protection；
High wind drying: the water stain of the PCB surface washed through third time water knife is dried up；
Grinding: linear velocity 1.5m/min, wiring board successively pass through an axis height and cut the grinding of 600 mesh ceramics brushes, four axis height
Cut the grinding of 600 mesh nonwoven fabric brush roll of winding type, four axis height cut the grinding of 600 mesh ceramics brushes, two axis height cut 600 mesh of winding type
It is high that the grinding of nonwoven fabric brush roll and two axis height cut the grinding of 600 mesh ceramics brushes, the emanant 600 mesh nonwoven fabric brush grinding of two axis and two axis
The grinding of 600 mesh nonwoven fabric brush of winding type is cut, to remove copper face Excess resin, while keeping copper thick uniformly；
Cleaning: rinse on ground wiring board with the residue in hole；
Drying: using the cleaned wiring board of 80 ± 5 ° of hot blast drying, removal plate face and steam in hole；
Receive plate: inclined automatic plate putting machine receives plate automatically.
Preferably, the fermentation steps include bulk one and bulk two, and described bulk one is sprayed using BH-BB1/4-SS10W
Mouth core improves wiring board in the wetability for removing glue cylinder, and described bulk two keep hole wall residue glue bulk using the similar principle that mixes, and are convenient for
Remove residue glue.
Preferably, the first time water knife washes step and uses UCE-242 nozzle core repeated washing three times.
Preferably, the de-smear step uses BH-BB1/4-SS10W nozzle core, O32SST idler wheel, the dilute row of UCE-607
Idler wheel piece repeats de-smear step three times.
Preferably, second of the water knife washes step and uses UCE-242 nozzle core repeated washing three times.
Preferably, the third time water knife washes step and uses UCE-242 nozzle core repeated washing three times.
Preferably, the cleaning step includes pressurization washing, ultrasonic wave embathes, HF is washed and clear water is washed, the pressure (hydraulic) water
It washes and is washed using 40 ± 5MPa, to rinse residue in plate face and hole, the ultrasonic wave is embathed using ultrasonic wave in a liquid
Cavitation, acceleration effect and direct flow effect directly, indirectly act on liquid and dirt, disperse crud layer, cream
Change, remove and reach cleaning purpose, the HF washing is embathed with ultrasonic wave to be completed in a slot, and the clear water is washed using clear water
On irrigation lines plate with the residue in hole.
Compared with prior art, the beneficial effects of the present invention are:
The grinding of 600 mesh ceramics brushes, the grinding of four axis height cutting 600 mesh nonwoven fabric brush roll of winding type, four are cut using an axis height
Axis height cuts the grinding of 600 mesh ceramics brushes, cutting 600 mesh nonwoven fabric brush roll of the winding type grinding of two axis height and two axis height and cuts 600 mesh
The grinding of ceramics brush, the emanant 600 mesh nonwoven fabric brush grinding of two axis and cutting 600 mesh nonwoven fabric brush of the winding type grinding of two axis height are ground
Sawing combination method, grinding can once reach production effect, can be reduced the production time, promote production capacity standard, can promote resin
Copper face uniformity after grinding is able to satisfy different type aperture simultaneous grinding, can reduce macropore breakage risk.
Detailed description of the invention
Attached drawing be for provide it is of the invention further understand, and part of specification is constituted, with following specific reality
It applies mode to be used to explain the present invention together, but should not be construed as limiting the invention.
Fig. 1 is the flow chart of a wherein embodiment of the invention.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with the specific embodiment of the invention and
Technical solution of the present invention is clearly and completely described in corresponding attached drawing.Obviously, described embodiment is only of the invention
A part of the embodiment, instead of all the embodiments.
Below in conjunction with attached drawing, the technical solution of embodiment that the present invention will be described in detail offer.
Referring to Fig. 1, the present embodiment the following steps are included:
It puts plate: wiring board to be ground is placed on inclined automatic plate putting machine, it will be to by inclined automatic plate putting machine
Wiring board is ground to be sent into except glue cylinder；
It is bulk: to be handled using leavening agent, softening is except the resin in glue cylinder on wiring board；
First time dirt removal water: the foreign matter and oxide in the wiring board plate face through bulk processing are removed；
First time water knife is washed: the chemical agent in the wiring board plate face through first time dirt removal water and hole is removed；
De-smear: the wiring board washed through first time water knife, MnO4 are handled using the strong oxidizing property of high manganese ion
Ion will make it dissolve by the epoxy resin oxidation on bulk hole wall, under the strong alkaline condition of sodium hydroxide in removing
In glue groove and it is decomposed into small molecule organic salt；
Second of dirt removal water: the wiring board through de-smear is removed, to remove cull and glue residue in plate face；
Second of water knife is washed: the chemical agent in the wiring board plate face through second of dirt removal water and hole is removed；
It neutralizes: remaining manganese dioxide, sexavalence manganese and septivalency manganese on the wiring board hole wall washed through second of water knife is restored
For soluble divalent manganesetion；
Third time water knife is washed: being carried out third time water knife to neutralized wiring board and is washed, removes remaining height in plate face and hole
Potassium manganate, process tank liquor is not contaminated after protection；
High wind drying: the water stain of the PCB surface washed through third time water knife is dried up；
Grinding: linear velocity 1.5m/min, wiring board successively pass through an axis height and cut the grinding of 600 mesh ceramics brushes, four axis height
Cut the grinding of 600 mesh nonwoven fabric brush roll of winding type, four axis height cut the grinding of 600 mesh ceramics brushes, two axis height cut 600 mesh of winding type
It is high that the grinding of nonwoven fabric brush roll and two axis height cut the grinding of 600 mesh ceramics brushes, the emanant 600 mesh nonwoven fabric brush grinding of two axis and two axis
The grinding of 600 mesh nonwoven fabric brush of winding type is cut, to remove copper face Excess resin, while keeping copper thick uniformly；
Cleaning: rinse on ground wiring board with the residue in hole；
Drying: using the cleaned wiring board of 80 ± 5 ° of hot blast drying, removal plate face and steam in hole；
Receive plate: inclined automatic plate putting machine receives plate automatically.
The fermentation steps include bulk one and bulk two, and described bulk one is improved using BH-BB1/4-SS10W nozzle core
For wiring board in the wetability for removing glue cylinder, described bulk two keep hole wall residue glue bulk using the similar principle that mixes, convenient for removal residue glue.
The first time water knife washes step and uses UCE-242 nozzle core repeated washing three times.
The de-smear step uses BH-BB1/4-SS10W nozzle core, O32SST idler wheel, the dilute row's idler wheel piece of UCE-607,
Repeat de-smear step three times.
Second of the water knife washes step and uses UCE-242 nozzle core repeated washing three times.
The third time water knife washes step and uses UCE-242 nozzle core repeated washing three times.
The cleaning step includes pressurization washing, ultrasonic wave embathes, HF is washed and clear water is washed, and the pressurization washing uses 40
± 5MPa washing, to rinse residue in plate face and hole, the ultrasonic wave embathe using ultrasonic wave cavitation in a liquid,
Acceleration effect and direct flow effect to liquid and dirt directly, indirectly effect, make crud layer by dispersion, emulsification, removing and
Reach cleaning purpose, the HF washing is embathed with ultrasonic wave to be completed in a slot, and the clear water is washed using clear water irrigation lines
On plate with the residue in hole.
The above examples are only used to illustrate the technical scheme of the present invention, rather than its limitations；Although with reference to the foregoing embodiments
Invention is explained in detail, those skilled in the art should understand that: it still can be to aforementioned each implementation
Technical solution documented by example is modified or equivalent replacement of some of the technical features；And these modification or
Replacement, the spirit and scope for technical solution of various embodiments of the present invention that it does not separate the essence of the corresponding technical solution.
Claims (8)
1. a kind of resin ground method, which comprises the following steps:
It puts plate: wiring board to be ground is placed on inclined automatic plate putting machine, it will be to be ground by inclined automatic plate putting machine
Wiring board, which is sent into, removes glue cylinder；
It is bulk: to be handled using leavening agent, softening is except the resin in glue cylinder on wiring board；
First time dirt removal water: the foreign matter and oxide in the wiring board plate face through bulk processing are removed；
First time water knife is washed: the chemical agent in the wiring board plate face through first time dirt removal water and hole is removed；
De-smear: the wiring board washed through first time water knife, high manganese ion are handled using the strong oxidizing property of high manganese ion
It will be made it dissolve under the strong alkaline condition of sodium hydroxide in except glue groove by the epoxy resin oxidation on bulk hole wall
In and be decomposed into small molecule organic salt；
Second of dirt removal water: the wiring board through de-smear is removed, to remove cull and glue residue in plate face；
Second of water knife is washed: the chemical agent in the wiring board plate face through second of dirt removal water and hole is removed；
Neutralize: remaining manganese dioxide, sexavalence manganese and septivalency manganese on the wiring board hole wall washed through second of water knife are reduced to can
The divalent manganesetion of dissolubility；
Third time water knife is washed: being carried out third time water knife to neutralized wiring board and is washed, removes remaining permanganic acid in plate face and hole
Potassium, process tank liquor is not contaminated after protection；
High wind drying: the water stain of the PCB surface washed through third time water knife is dried up；
Grinding: the wiring board dried up through high wind successively passes through the high machining ceramic brush grinding of an axis, four axis height cutting winding type is not knitted
The grinding of cloth brush roll, the high machining ceramic brush grinding of four axis, the cutting winding type nonwoven fabric brush roll grinding of two axis height and two axis height cutting pottery
The grinding of porcelain brush, the emanant nonwoven fabric brush grinding of two axis and the cutting winding type nonwoven fabric brush grinding of two axis height, it is extra to remove copper face
Resin, while keeping copper thick uniformly；
Cleaning: rinse on ground wiring board with the residue in hole；
Drying: using the cleaned wiring board of 80 ± 5 ° of hot blast drying, removal plate face and steam in hole；
Receive plate: inclined automatic plate putting machine receives plate automatically.
2. resin ground method according to claim 1, which is characterized in that the fermentation steps include bulk one and bulk
Two, described bulk one improves wiring board in the wetability for removing glue cylinder using nozzle core, and described bulk two utilize the similar principle that mixes
Keep hole wall residue glue bulk, convenient for removal residue glue.
3. resin ground method according to claim 1, which is characterized in that the first time water knife washes step using nozzle core
Repeated washing is three times.
4. resin ground method according to claim 1, which is characterized in that the de-smear step using nozzle core, idler wheel,
Dilute row's idler wheel piece repeats de-smear step three times.
5. resin ground method according to claim 1, which is characterized in that second of the water knife washes step using nozzle core
Repeated washing is three times.
6. resin ground method according to claim 1, which is characterized in that the third time water knife washes step using nozzle core
Repeated washing is three times.
7. resin ground method according to claim 1, which is characterized in that the cleaning step includes pressurization washing, ultrasound
Wave embathes, HF is washed and clear water is washed, and the pressurization washing is washed using 40 ± 5MPa, to rinse residue in plate face and hole, institute
State ultrasonic wave embathe it is straight to liquid and dirt using ultrasonic wave cavitation, acceleration effect and direct flow effect in a liquid
Connect, indirectly act on, make crud layer by dispersion, emulsification, removing and reach cleaning purpose, HF washing is embathed with ultrasonic wave
Completed in one slot, the clear water wash using on clear water irrigation lines plate with the residue in hole.
8. resin ground method according to claim 1, which is characterized in that the linear velocity of shown grinding steps is 1.5m/
Min, wiring board successively passes through the grinding of an axis height 600 mesh ceramics brushes of cutting, four axis height cutting 600 mesh nonwoven fabric brush roll of winding type is ground
Mill, four axis height cut the grinding of 600 mesh ceramics brushes, cutting 600 mesh nonwoven fabric brush roll of the winding type grinding of two axis height and the cutting of two axis height
The grinding of 600 mesh ceramics brushes, the emanant 600 mesh nonwoven fabric brush grinding of two axis and two axis height cutting 600 mesh nonwoven fabric brush of winding type are ground
Mill to remove copper face Excess resin, while keeping copper thick uniformly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910616788.1A CN110446345B (en) | 2019-07-09 | 2019-07-09 | Resin grinding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910616788.1A CN110446345B (en) | 2019-07-09 | 2019-07-09 | Resin grinding method |
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| Publication Number | Publication Date |
|---|---|
| CN110446345A true CN110446345A (en) | 2019-11-12 |
| CN110446345B CN110446345B (en) | 2022-08-19 |
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|---|---|---|---|
| CN201910616788.1A Active CN110446345B (en) | 2019-07-09 | 2019-07-09 | Resin grinding method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114302563A (en) * | 2021-12-28 | 2022-04-08 | 龙南骏亚柔性智能科技有限公司 | Production method applied to grinding of ultrathin circuit board |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013059985A1 (en) * | 2011-10-25 | 2013-05-02 | 建业（惠州）电路版有限公司 | Process for metallisation of holes in printed circuit board |
| CN203279356U (en) * | 2013-04-03 | 2013-11-06 | 常州安泰诺特种印制板有限公司 | Novel brush roll assembly for printed board |
| CN103732009A (en) * | 2013-12-24 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | Resin hole plugging method for hole in circuit board disc and manufacturing method for hole in disc |
| CN105101643A (en) * | 2015-07-17 | 2015-11-25 | 昆山旭发电子有限公司 | Resin hole-plugging process |
| CN105898994A (en) * | 2016-05-09 | 2016-08-24 | 广州美维电子有限公司 | Boring method for PCB (Printed Circuit Board) |
| CN108235579A (en) * | 2018-01-08 | 2018-06-29 | 昆山首源电子科技有限公司 | 5G communication high frequency signal plate slide-changing resistor performance boost techniques |
| CN109968166A (en) * | 2019-03-19 | 2019-07-05 | 广州兴森快捷电路科技有限公司 | The grinding method and grinding device of circuit board plug socket resin |
-
2019
- 2019-07-09 CN CN201910616788.1A patent/CN110446345B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013059985A1 (en) * | 2011-10-25 | 2013-05-02 | 建业（惠州）电路版有限公司 | Process for metallisation of holes in printed circuit board |
| CN103222351A (en) * | 2011-10-25 | 2013-07-24 | 建业（惠州）电路版有限公司 | Method for metallisation of holes in printed circuit board |
| CN203279356U (en) * | 2013-04-03 | 2013-11-06 | 常州安泰诺特种印制板有限公司 | Novel brush roll assembly for printed board |
| CN103732009A (en) * | 2013-12-24 | 2014-04-16 | 广州兴森快捷电路科技有限公司 | Resin hole plugging method for hole in circuit board disc and manufacturing method for hole in disc |
| CN105101643A (en) * | 2015-07-17 | 2015-11-25 | 昆山旭发电子有限公司 | Resin hole-plugging process |
| CN105898994A (en) * | 2016-05-09 | 2016-08-24 | 广州美维电子有限公司 | Boring method for PCB (Printed Circuit Board) |
| CN108235579A (en) * | 2018-01-08 | 2018-06-29 | 昆山首源电子科技有限公司 | 5G communication high frequency signal plate slide-changing resistor performance boost techniques |
| CN109968166A (en) * | 2019-03-19 | 2019-07-05 | 广州兴森快捷电路科技有限公司 | The grinding method and grinding device of circuit board plug socket resin |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114302563A (en) * | 2021-12-28 | 2022-04-08 | 龙南骏亚柔性智能科技有限公司 | Production method applied to grinding of ultrathin circuit board |
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| Publication number | Publication date |
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| CN110446345B (en) | 2022-08-19 |
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