CN104105362A - Black hole horizontal production line technological process and black hole groove structure - Google Patents

Black hole horizontal production line technological process and black hole groove structure Download PDF

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Publication number
CN104105362A
CN104105362A CN201410322778.4A CN201410322778A CN104105362A CN 104105362 A CN104105362 A CN 104105362A CN 201410322778 A CN201410322778 A CN 201410322778A CN 104105362 A CN104105362 A CN 104105362A
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CN
China
Prior art keywords
black hole
black
horizontal production
hole
flow process
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Pending
Application number
CN201410322778.4A
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Chinese (zh)
Inventor
宁金足
汪传林
郭瑞明
秦涛
潘陈华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Hualin Circuit Technology Co ltd
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Shenzhen Hualin Circuit Technology Co ltd
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Application filed by Shenzhen Hualin Circuit Technology Co ltd filed Critical Shenzhen Hualin Circuit Technology Co ltd
Priority to CN201410322778.4A priority Critical patent/CN104105362A/en
Publication of CN104105362A publication Critical patent/CN104105362A/en
Pending legal-status Critical Current

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Abstract

The invention provides a black hole horizontal production line technological process and a black hole groove structure. The technological process comprises the steps of cleaning, black hole 1, hole cleaning, black hole 2, micro-etching, anti-oxidation processing and discharging, wherein the black hole 1 further comprises ultrasonic immersion cleaning. According to the black hole horizontal production line technological process provided by the invention, ultrasonic immersion cleaning steps are added in black hole 1 and/or black hole 2 feeding, since micro jet flows and strong impact waves which are generated by an ultrasonic cavitation effect have strong seepage forces for Phi 0.15mm and Phi 0.2mm micro holes, and therefore, air bubbles in the holes can be sufficiently precipitated out, and solutions can flow through the holes and react with the walls of the holes, and thus, the problem of black hole fracture of a multi-layer board because of air bubbles can be solved, and intra-hole connection is excellent after copper plating is performed, and qualified rate can be greatly improved.

Description

Black hole horizontal production-line technique flow process and black hole slot structure
Technical field
The present invention relates to printed wiring board field, relate in particular to a kind of black hole horizontal production-line technique flow process and black hole slot structure.
Background technology
Black hole (BlackHole) horizontal production line belongs to the one of Direct Electroplating, be to make hole wall conductor in non-traditional chemical copper mode on the hole wall after boring, by the electrically suction-operated of suction and carbon mutually of physics, at the conductive carbon film of the careful graphite carbon black of hole wall absorption one deck, provide the base of follow-up plating kind core.
Existing, the technological process of BlackHole horizontal production line: as shown in table 1:
Table 1
At present, BlackHole horizontal production line is to adopt upper and lower water jet knife to embathe processing mode, whole hole slot has 4 pairs of water cuttves, black hole one groove to have 4 pairs of water cuttves, black hole two grooves to have 7 pairs of water cuttves, producing, (specification is more than thickness of slab 0.3mm, via φ 0.15mm and φ 0.2mm) when multi-layer sheet, because air in the aperture of aperture is extruded endless, remaining tiny bubble and pore lining are puted forth effort to be greater than its buoyancy and cannot be separated out, liquid medicine can not produce physical reactions with hole wall, cause in copper facing metapore and connect and disconnect, as shown in Figure 1.And because the mixing of soaker localized liquid medium is inhomogeneous, water jet knife jet flow is poor to micropore φ 0.15mm and φ 0.2mm penetration.
Summary of the invention
The object of the present invention is to provide a kind of black hole horizontal production-line technique flow process and black hole slot structure, to solve in the copper facing metapore being caused a little less than existing black hole horizontal production line liquid medicine penetration problems such as connecting disconnection.
The object of the invention is to be achieved through the following technical solutions.
A kind of black hole horizontal production-line technique flow process, comprises step, clean, black hole one, whole hole, black hole two, microetch, anti-oxidant, discharging; In one step of described black hole, also comprise that ultrasonic wave embathes step.
Further preferably, in two steps of described black hole, also comprise that ultrasonic wave embathes step.
Further preferably, described ultrasonic wave embathes step and specifically comprises: at black hole slot entering plate, place increases by a ultrasonic vibration plate, microjet, shock wave and the acoustic streaming effect of utilizing ultrasonic cavitation effect to be accompanied by ultrasonic cavitation generation cause that liquid flows macroscopical turbulence, make Bubble in hole, promote liquid medicine perforation to flow and react with hole wall.
Further preferably, described black hole slot tank liquor is mainly made up of meticulous graphite and carbon black powder, liquid dispersion medium, and described liquid dispersion medium is mainly made up of deionized water and surfactant.
Further preferably, in the step of described whole hole, whole hole slot tank liquor is weakly alkaline solution and contains faint complexing agent.
Further preferably, in described cleaning, cleaning slot tank liquor is weakly alkaline solution and contains faint complexing agent, and the one that described complexing agent is interfacial agent, gos deep into hole wall by the water delivery base of interfacial agent, dirt is taken out of to the effect that reaches clean; Its hydrophilic group is resin and glass to be adjusted into positively charged, adheres in order to the electronegative carbon colloid in black hole.
Further preferably, in described microetch step, microetch tank liquor penetrates gap between black carbon film and contacts copper face by spraying and springing up, and sting and bite after copper face, and micro-alligatoring copper face, increase follow-up copper facing adhesive force.
Further preferably, in described anti-oxidant step, utilize copper face passivation liquid medicine, extend copper face oxidization time.
A black hole slot structure in black hole horizontal production-line technique flow process as above, comprising: delivery roller, water jet knife, ultrasonic vibration plate, and printed wiring board advances by delivery roller, and water jet knife is carried out tank liquor jet flow; Described ultrasonic vibration plate is located at first lower water jet knife place of black hole slot entering plate.
Further preferably, the cuboid that the specification of described ultrasonic vibration plate is 60*20*9cm.
The present invention compared with prior art, beneficial effect is: black hole horizontal production-line technique flow process provided by the invention and black hole slot structure, by embathing step at black hole slot one and/or black hole slot two entering plate places increase ultrasonic waves, due to the microjet of ultrasonic cavitation effect generation and powerful shock wave, strong to micropore φ 0.15mm and φ 0.2mm penetration, fully allow Bubble in hole, liquid medicine can perforation be flowed to react with hole wall, solve the broken problem in hole, black hole that multi-layer sheet causes because of bubble, make to connect well in copper facing metapore, yield improves greatly.
Brief description of the drawings
Fig. 1 connects in copper facing metapore and disconnects schematic diagram in existing black hole horizontal production-line technique;
Fig. 2 is the black hole slot inner structure of one embodiment of the invention schematic diagram;
Fig. 3 is connection diagram in one embodiment of the invention copper facing metapore.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
The present invention is by increasing by a ultrasonic vibration plate at black hole slot one and/or black hole slot two entering plate places, utilize ultrasonic cavitation effect to be accompanied by the mechanical effect such as microjet, shock wave and acoustic streaming that ultrasonic cavitation produces and cause that liquid flows macroscopical turbulence, be conducive to material Transfer and be penetrated into the effect in different medium surface and space, fully allow Bubble in hole, liquid medicine can perforation be flowed and react with hole wall, solved multi-layer sheet because breaking problem in the hole, black hole that bubble causes.
As shown in Figure 2, in black hole slot (black hole slot one and/or black hole slot two), comprise: delivery roller 1, water jet knife 2, ultrasonic vibration plate 3, printed wiring board advances by delivery roller 1, and water jet knife 2 is carried out tank liquor jet flow.
Particularly, described ultrasonic vibration plate 3 is located at first lower water jet knife 2 places of black hole slot (black hole slot one and/or black hole slot two) entering plate.
Preferably, the cuboid that the specification of described ultrasonic vibration plate 3 is 60*20*9cm.
BlackHole horizontal production line of the present invention technological process: specifically as shown in table 2:
Table 2
The black hole one of above-mentioned technological process and black Kong Erzhong, further comprise ultrasonic wave and embathe step.
Particularly, above-mentioned ultrasonic wave embathes step, adopt the ultrasonic equipment (Jin Dihua of Shenzhen ultrasonic equipment, frequency generator 27-31KHZ, oscillating plate specification 60*20*9cm) utilize ultrasonic cavitation effect (when ul-trasonic irradiation is during in liquid medium, ultrasonic wave density interphase ground is propagated liquid is vibrated forward, cause that medium molecule vibrates centered by its equilbrium position) be accompanied by ultrasonic cavitation produce microjet, the mechanical effect such as shock wave and acoustic streaming causes that liquid flows macroscopical turbulence, be conducive to material Transfer and be penetrated into the effect in different medium surface and space, fully allow Bubble in hole, liquid medicine can perforation be flowed to react with hole wall, in its wiring board copper facing metapore, connect good, as shown in Figure 3.
In the present invention, compared with ultrasonic wave embathes and embathes with traditional Water-cutting type, liquid medium more evenly mixes; The microjet that ultrasonic cavitation effect produces and powerful shock wave are strong to micropore φ 0.15mm and φ 0.2mm penetration.
In sum, black hole horizontal production-line technique flow process provided by the invention and black hole slot structure, by embathing step at black hole slot one and/or black hole slot two entering plate places increase ultrasonic waves, due to the microjet of ultrasonic cavitation effect generation and powerful shock wave, strong to micropore φ 0.15mm and φ 0.2mm penetration, fully allow Bubble in hole, liquid medicine can perforation be flowed to react with hole wall, solve the broken problem in hole, black hole that multi-layer sheet causes because of bubble, make to connect well in copper facing metapore, yield improves greatly.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.

Claims (10)

1. a black hole horizontal production-line technique flow process, comprises step, clean, black hole one, whole hole, black hole two, microetch, anti-oxidant, discharging; It is characterized in that, in one step of described black hole, also comprise that ultrasonic wave embathes step.
2. black hole horizontal production-line technique flow process as claimed in claim 1, is characterized in that, in two steps of described black hole, also comprises that ultrasonic wave embathes step.
3. black hole horizontal production-line technique flow process as claimed in claim 1 or 2, it is characterized in that, described ultrasonic wave embathes step and specifically comprises: at black hole slot entering plate, place increases by a ultrasonic vibration plate, microjet, shock wave and the acoustic streaming effect of utilizing ultrasonic cavitation effect to be accompanied by ultrasonic cavitation generation cause that liquid flows macroscopical turbulence, make Bubble in hole, promote liquid medicine perforation to flow and react with hole wall.
4. black hole horizontal production-line technique flow process as claimed in claim 3, is characterized in that, described black hole slot tank liquor is mainly made up of meticulous graphite and carbon black powder, liquid dispersion medium, and described liquid dispersion medium is mainly made up of deionized water and surfactant.
5. black hole horizontal production-line technique flow process as claimed in claim 1, is characterized in that, in the step of described whole hole, whole hole slot tank liquor is weakly alkaline solution and contains faint complexing agent.
6. black hole horizontal production-line technique flow process as claimed in claim 1, it is characterized in that, in described cleaning, cleaning slot tank liquor is weakly alkaline solution and contains faint complexing agent, described complexing agent is the one of interfacial agent, water delivery base by interfacial agent gos deep into hole wall, dirt is taken out of to the effect that reaches clean; Its hydrophilic group is resin and glass to be adjusted into positively charged, adheres in order to the electronegative carbon colloid in black hole.
7. black hole horizontal production-line technique flow process as claimed in claim 4, it is characterized in that, in described microetch step, microetch tank liquor penetrates gap between black carbon film and contacts copper face by spraying and springing up, and stings and bites after copper face, and micro-alligatoring copper face, increase follow-up copper facing adhesive force.
8. black hole horizontal production-line technique flow process as claimed in claim 4, is characterized in that, utilizes copper face passivation liquid medicine in described anti-oxidant step, extends copper face oxidization time.
9. the black hole slot structure in black hole horizontal production-line technique flow process as claimed in claim 1, is characterized in that, comprising: delivery roller, water jet knife, ultrasonic vibration plate, and printed wiring board advances by delivery roller, and water jet knife is carried out tank liquor jet flow; Described ultrasonic vibration plate is located at first lower water jet knife place of black hole slot entering plate.
10. black hole slot structure as claimed in claim 9, is characterized in that the cuboid that the specification of described ultrasonic vibration plate is 60*20*9cm.
CN201410322778.4A 2014-07-08 2014-07-08 Black hole horizontal production line technological process and black hole groove structure Pending CN104105362A (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104540337A (en) * 2014-12-26 2015-04-22 淳华科技(昆山)有限公司 Copperization tank applied to horizontal copperization process of flexible printed circuit board
CN105132977A (en) * 2015-08-31 2015-12-09 广东东硕科技有限公司 Adjusting liquid used for circuit board manufacturing and preparation method thereof
CN106028654A (en) * 2016-06-21 2016-10-12 欣兴同泰科技(昆山)有限公司 Drilling method of flexible circuit board
CN106319603A (en) * 2016-08-29 2017-01-11 苏州铱诺化学材料有限公司 Formula of blackhole hole-leveling agent
CN106653141A (en) * 2016-11-18 2017-05-10 珠海特普力高精细化工有限公司 Making method and application method of water-soluble conductive nano silver carbon paste
CN110248476A (en) * 2019-06-12 2019-09-17 惠州市盈帆实业有限公司 A kind of circuit board and its preparation process based on the discontinuous mesh of tomography

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WO2013059985A1 (en) * 2011-10-25 2013-05-02 建业(惠州)电路版有限公司 Process for metallisation of holes in printed circuit board
CN103491727A (en) * 2013-09-29 2014-01-01 哈尔滨工业大学 Method using printed circuit board graphite oxide reduction method to carry out hole conductivity
CN204069527U (en) * 2014-07-08 2014-12-31 深圳华麟电路技术有限公司 Black holes groove structure in the technological process of black holes horizontal production line

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WO1997027142A1 (en) * 1996-01-29 1997-07-31 Electrochemicals Inc. Ultrasonic mixing of through hole treating compositions
WO2013059985A1 (en) * 2011-10-25 2013-05-02 建业(惠州)电路版有限公司 Process for metallisation of holes in printed circuit board
CN103491727A (en) * 2013-09-29 2014-01-01 哈尔滨工业大学 Method using printed circuit board graphite oxide reduction method to carry out hole conductivity
CN204069527U (en) * 2014-07-08 2014-12-31 深圳华麟电路技术有限公司 Black holes groove structure in the technological process of black holes horizontal production line

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104540337A (en) * 2014-12-26 2015-04-22 淳华科技(昆山)有限公司 Copperization tank applied to horizontal copperization process of flexible printed circuit board
CN104540337B (en) * 2014-12-26 2017-10-20 淳华科技(昆山)有限公司 Applied to the change copper groove in flexible printed wiring board complanation copper wiring
CN105132977A (en) * 2015-08-31 2015-12-09 广东东硕科技有限公司 Adjusting liquid used for circuit board manufacturing and preparation method thereof
CN105132977B (en) * 2015-08-31 2017-12-29 广东东硕科技有限公司 A kind of adjustment liquid for wiring board manufacture and preparation method thereof
CN106028654A (en) * 2016-06-21 2016-10-12 欣兴同泰科技(昆山)有限公司 Drilling method of flexible circuit board
CN106319603A (en) * 2016-08-29 2017-01-11 苏州铱诺化学材料有限公司 Formula of blackhole hole-leveling agent
CN106653141A (en) * 2016-11-18 2017-05-10 珠海特普力高精细化工有限公司 Making method and application method of water-soluble conductive nano silver carbon paste
CN106653141B (en) * 2016-11-18 2018-06-29 珠海特普力高精细化工有限公司 A kind of manufacture of water-soluble conducting nanometer silver carbon slurry and its application process
CN110248476A (en) * 2019-06-12 2019-09-17 惠州市盈帆实业有限公司 A kind of circuit board and its preparation process based on the discontinuous mesh of tomography

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