WO2012117509A1 - Procédé d'adhérence et de maintien de pièce à travailler en forme de plaque mince, dispositif d'adhérence et de maintien de pièce à travailler en forme de plaque mince, et système de fabrication - Google Patents

Procédé d'adhérence et de maintien de pièce à travailler en forme de plaque mince, dispositif d'adhérence et de maintien de pièce à travailler en forme de plaque mince, et système de fabrication Download PDF

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Publication number
WO2012117509A1
WO2012117509A1 PCT/JP2011/054552 JP2011054552W WO2012117509A1 WO 2012117509 A1 WO2012117509 A1 WO 2012117509A1 JP 2011054552 W JP2011054552 W JP 2011054552W WO 2012117509 A1 WO2012117509 A1 WO 2012117509A1
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WO
WIPO (PCT)
Prior art keywords
thin plate
work
adhesive
adhesive surface
adhesion
Prior art date
Application number
PCT/JP2011/054552
Other languages
English (en)
Japanese (ja)
Inventor
道也 横田
Original Assignee
信越エンジニアリング株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 信越エンジニアリング株式会社 filed Critical 信越エンジニアリング株式会社
Priority to CN201180053944.XA priority Critical patent/CN103201201B/zh
Priority to PCT/JP2011/054552 priority patent/WO2012117509A1/fr
Priority to JP2011536229A priority patent/JP4857407B1/ja
Priority to KR1020127023721A priority patent/KR101791280B1/ko
Priority to TW101105906A priority patent/TWI466811B/zh
Publication of WO2012117509A1 publication Critical patent/WO2012117509A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/066—Transporting devices for sheet glass being suspended; Suspending devices, e.g. clamps, supporting tongs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates to a thin plate used for detachably holding a thin plate-like work such as a glass substrate in the process of manufacturing a flat panel display (FPD) such as an organic EL display (OLED) or a liquid crystal display (LCD).
  • a flat panel display such as an organic EL display (OLED) or a liquid crystal display (LCD).
  • FPD flat panel display
  • OLED organic EL display
  • LCD liquid crystal display
  • an organic EL display (OLED) or the like provided with a method for adhesively holding a workpiece, an adhesive holder for a thin plate work used to carry out the method, and an adhesive holder for the thin plate Manufacturing system used in
  • an organic film for forming an organic EL element is formed on the film formation region of the film formation substrate by superposing the film formation mask having an opening corresponding to the film formation region and the film formation substrate.
  • a manufacturing apparatus of an EL device a chamber, a deposition source provided at a bottom of the chamber to evaporate a film forming material, and a substrate holding unit which holds the film formation substrate in a substantially horizontal state so as to face the deposition source.
  • the substrate holding unit includes a support having a holding unit in a clamp shape on the outer edge side, and the magnets, the film-forming substrate, and the magnetic flux of the magnet sequentially stacked by the holding unit.
  • the film formation substrate is magnetically interposed between the magnet and the film forming mask. Hold by suction force Some (for example, see Patent Document 1).
  • a magnet unit provided with a substrate supporting surface and a magnet on which a surface on the opposite side to a film forming surface of a substrate to be processed is overlapped; And a deposition mask made of a magnetic material adsorbed by the magnet unit so as to sandwich the substrate to be processed between the substrate supporting surface and the substrate by the magnetic attraction force of the magnet.
  • each layer is formed on a large substrate (substrate to be processed) where a large number of element substrates can be taken (substrate to be processed) using a semiconductor process such as mask evaporation. It is cut into element substrates of the size.
  • a substrate used for an organic EL display or the like becomes larger, and one having a side exceeding 2000 mm has begun to be manufactured.
  • Such a large substrate is formed into a thin plate from a fragile material such as glass, and when supported using a grid-like support member, the central portion (non-supporting portion) of the large substrate surrounded by the support member is The substrate may be further deformed and broken if it is bent due to its own weight and sags, and if an external load is applied to the deformed unsupported portion. That is, it has been difficult to hold the large substrate flat without entirely supporting the large substrate from the lower side.
  • Patent Document 1 and Patent Document 2 described above it is conceivable to horizontally hold the large substrate without bending it partially.
  • the film formation mask is also increased with the increase in substrate size. Since one side is increased to 2000 mm or more, even if the magnet, the large substrate, and the peripheral portion of the film formation mask are held by the holding portion of the clamp form, the central portion (unsupported portion) of these laminates is bent by its own weight, Once hanging down to a position lower than the magnetic attraction area of the magnet, the unsupported portion can not be magnetically attracted by the magnet and returned to a planar shape.
  • the present invention has an object to address such a problem, and is an adhesive of a thin plate-like work which can be adhesively held without damaging the thin plate-like work to correct the self-weight deflection of the thin plate-like work.
  • To provide a holding method to provide an adhesive holding device for a thin plate-like work capable of holding the thin plate-like work in an adhesive manner without damaging the thin-plate-like work and correcting the self weight deflection of the thin plate-like work It is an object of the present invention to provide a manufacturing system which can be held in a flat state between a magnet surface and a processing mask by holding the adhesive without adhesion.
  • the adhesive holding method for a thin plate-like work comprises adhesion means for a non-supporting portion not supported by the support member in the thin plate-like work partially supported by the support member.
  • the adhesive surface is moved close to a direction crossing the thin plate-like work until a part of the adhesive surface contacts, and the contact area between the adhesive surface and the non-supporting area gradually increases with respect to the non-supporting area.
  • Move the adhesive means in the direction opposite to the approaching movement to a position where the adhesive surface is flush with the support portion supported by the support member in the thin plate-like work It is characterized by
  • the adhesive holding device for a thin plate-like work is provided so as to abut on a part of the thin plate-like work to support the thin plate-like work, and the support member does not abut on the thin plate-like work
  • An adhesive means having an adhesive surface opposed to the non-supporting part, which is provided reciprocably in the direction intersecting the thin plate-like work, and a reciprocation control means for controlling operation of the reciprocation of the adhesive surface with respect to the non-supporting part.
  • adhesion area increasing means for controlling operation of the adhesion means so that the adhesive face moves relative to the non-supporting part, and the reciprocation control means approaches the adhesive face toward the non-supporting part It is moved, and when a part of the adhesive surface comes in contact with the non-supporting part, the approaching movement of the adhesive surface is stopped, and the adhesive area increasing means stops the non-supporting part after stopping the approaching movement of the adhesive part.
  • the adhesive surface is moved so that the contact area between the adhesive surface and the non-supporting part gradually increases and the entire surface comes into contact, and the reciprocation control means comprises the entire adhesive surface and the non-supporting area. After the contact, the adhesive surface is moved in the direction opposite to the approaching movement to a position flush with the supporting portion supported by the supporting member in the thin plate-like work.
  • the adhesive holding device for the thin plate-like work has a processing mask made of a magnetic material provided so as to be capable of reciprocating in the direction intersecting the thin plate-like work, and a mask movement control means for controlling operation of the reciprocating movement of the processing mask relative to the working surface of the thin plate-like work.
  • the mask movement control means moves the processing mask to a magnetic attraction force area of the magnet surface after the contact between the substantially entire adhesive surface and the unsupported portion in conjunction with the reciprocation control means. It is characterized by
  • the adhesive holding method of a thin plate-like work having the above-mentioned features is an adhesive means for a thin plate-like work partially supported by a grid-like support member against an unsupported portion which is deformed downward by its own weight. Is moved in the direction intersecting the thin plate-like work to bring the non-supporting part into contact with a part of the adhesive surface of the adhesive means, and then the adhesive surface is made to the non-supporting area As the contact area gradually increases and moves so as to contact almost the entire surface, the adhesive surface gradually contacts with time lag according to the self weight deflection of the non-supporting part, and accordingly the external to the thin plate-like work Almost the entire adhesive surface is in contact with the unsupported area and held adhesively while holding the load very small, and then the adhesive means is coplanar with the support area supported by the support member in the thin plate work By moving the adhesive means in the direction opposite to the approach movement, the self-weight deflection of the non-supporting part is reduced, and the entire thin plate-like work is
  • the large-sized substrate is partially supported by the grid-like support member from the lower side, and the self-weight deflection of the unsupported portion is within a certain range. It can be suppressed internally and can be held flat.
  • the adhesive holding device for a thin plate-like work reciprocates, with a thin plate-like work partially supported by a grid-like support member, against a non-supporting portion deformed downward by its own weight.
  • the movement control means moves the adhesion means in the direction intersecting with the thin plate-like work to bring the non-supporting part into contact with a part of the adhesive surface of the adhesion means.
  • the large-sized substrate is partially supported by the grid-like support member from the lower side, and the self-weight deflection of the unsupported portion is within a certain range. It can be suppressed internally and can be held flat.
  • the magnet for moving the processing mask to the magnetic attraction force area of the magnet surface is moved by the mask movement control means after approximately the entire adhesive surface contacts the unsupported portion.
  • the thin plate workpiece is drawn to the magnet surface together with the processing mask by the magnetic attraction force of the surface, and the entire thin plate workpiece is held between the magnetic surface and the processing mask, so the thin plate workpiece is not damaged. It can be adhesively held and sandwiched between the magnet surface and the processing mask in a planar manner.
  • the substrate size of the thin plate-like work is enlarged to 2000 mm or more on a side
  • the large-sized substrate is partially supported by the grid-like support member from the lower side, and the self-weight deflection of the unsupported portion is within a certain range. It can be suppressed internally and can be held flat.
  • deformation or distortion does not occur in the mask pattern in the processing mask, so that accurate pattern formation can be performed by vapor deposition or the like, precision can be improved, and yield can be improved.
  • the substrate size is increased to 2000 mm or more compared to the conventional apparatus in which the substrate is sandwiched between the substrate support surface of the magnet unit and the vapor deposition mask by the magnetic attraction force of the magnet and then the whole is turned upside down. Since the entire large substrate can be held flat without being turned upside down, it is excellent in the feasibility.
  • BRIEF DESCRIPTION OF THE DRAWINGS It is a longitudinal cross-sectional front view which shows the outline of the adhesion holding apparatus of the thin-plate shaped workpiece which concerns on embodiment of this invention, (a) shows before adhesion, (b) shows the time of contact of an adhesion surface, (c) is adhesion It shows the holding time.
  • BRIEF DESCRIPTION OF THE DRAWINGS It is a longitudinal front view which shows the outline of the manufacturing system which concerns on embodiment of this invention, (a) shows before adhesion, (b) shows the time of contact of an adhesive surface, (c) shows the time of adhesion holding, (D) shows the approach movement of the processing mask, and (e) shows the magnetic attraction of the processing mask.
  • An adhesive holding apparatus A of a thin plate-like work used to carry out an adhesive holding method of a thin plate-like work according to an embodiment of the present invention is a part and part of a thin plate-like work W, as shown in FIGS.
  • a thin plate-like work provided with a support member 1 provided so as to abut on and supporting the thin plate-like work W, and an adhesive surface 2a facing the non-supporting portion W1 on the thin plate-like work W not contacting the support member 1;
  • An adhesive means 2 provided for reciprocating movement in a direction intersecting W, a reciprocation control means 3 for operationally controlling reciprocation of the adhesive surface 2a with respect to the surface of the unsupported portion W1, and a surface of the unsupported portion W1.
  • An adhesive area increasing means 4 for controlling the operation of the adhesive means 2 so as to move the adhesive surface 2a is provided as a main component.
  • the thin plate-like work W is, for example, a glass substrate used for an organic EL display, a liquid crystal display, etc., and has a drawback that it is easily broken by deformation since its thickness is relatively thin with respect to its surface area ing. Further, in the thin plate-like work W, for example, a film surface having a functional part (not shown) such as an organic EL element is formed on one surface to be bonded to each other in the manufacturing process of the organic EL display or liquid crystal display. .
  • the supporting member 1 is formed, for example, in a lattice shape or other similar shape so as to support only a part of the film surface (bonding surface) of the thin plate-like work W.
  • a lattice shape or other similar shape so as to support only a part of the film surface (bonding surface) of the thin plate-like work W.
  • FIGS. 1 and 2 as a specific example, when the support member 1 is formed in a lattice, two or more vertical frames 1a extending in the Y direction and two or more horizontal lines extending in the X direction
  • the frame 1 b is configured by framing in the same plane, and is disposed substantially horizontally.
  • the thin plate-like work W By placing the thin plate-like work W on the upper surface of the support member 1 so as not to contact the area requiring the post-processing (post-processing) such as the functional part on the film surface, only the area where the post-processing is unnecessary Partially abuts on the upper surface of the support member 1 and the entire thin plate-like work W is held.
  • post-processing post-processing
  • an area where post-processing is unnecessary after removing the functional part and the like is the support portion W2 supported by the support member 1, and an area where post-processing such as the functional part is necessary
  • the non-supporting portion W1 which is not supported by the support member 1 without being abutted, is bent downward by its own weight, and the central portion of the non-supporting portion W1 hangs down most.
  • the substrate is further deformed when an external load is applied to the unsupported portion W1 at a stretch, for example, by bringing the adhesive surface 2a of the adhesive means 2 into surface contact with the unsupported portion W1 bent and deformed by its own weight. May be damaged.
  • the pressure-sensitive adhesive material to be the pressure-sensitive adhesive surface 2a of the pressure-sensitive adhesive unit 2 described later contacts the surface of the thin plate-like work W
  • the pressure-sensitive adhesive material is deformed first, and the pressure is applied to the elastic material. And some adhesion develops.
  • the pressure-sensitive adhesive material is further pressed, the thin plate-like work W is deformed, and the repulsive force increases the adhesion.
  • this deformation exceeds a certain limit, the tension on the surface of the thin plate-like work W does not endure it and is broken. Therefore, if the pressure by the adhesive is stopped within this limit, the thin plate-like work W can be adhered without being broken.
  • the entire adhesive surface 2a which is not so large can be adhered. If the thin plate-like work W and the adhesive surface 2a are completely parallel and they can be in contact while keeping them completely parallel, it will not be necessary to stack the local contacts described above. That is, it should be possible to obtain the cohesion at once.
  • the adhesion surface 2a is brought into contact with the surface of the thin plate-like work W only at a local portion, and adhesion is first realized at the local contact portion, and this adhesion portion is used as a basis. Therefore, it is necessary to devise a method of gradually increasing the adhesive area of the adhesive surface 2a to the surface of the thin plate-like work W.
  • the lattice pitch of the support member 1 be configured to be adjustable to correspond to the size of the thin plate-like work W, and to adjust the distance between the vertical frames 1a and the distance between the horizontal frames 1b.
  • the thin plate-like work W when taking a large number of single-sized substrates (not shown) from one large substrate (not shown), three or more vertical frames 1a and three or more horizontal frames
  • the border portions of the respective substrates become support portions W2 supported by the support member 1
  • the film surface of each substrate is not in contact with the support member 1 and becomes an unsupported portion W 1 which is not supported by the support member 1.
  • FIGS. 1 (a) to 1 (c) the case where a large number of single-sized substrates are taken from a single large-sized substrate as the thin plate-like work W is shown partially enlarged.
  • the adhesive means 2 described later is disposed one by one so as to face the central portion of the unsupported portion W1. That is, the adhesive means 2 described later is disposed one by one so as to face the central portion of each unsupported portion W1 even for substrates of other single-piece sizes which are not shown.
  • a plurality of adhesive means 2 described later are disposed so as to face the unsupported portion W1 in one single-piece sized substrate, or a single single-piece sized substrate as a thin plate work W
  • the adhesive means described later is supported by the support member 1 in which the two vertical frames 1a and the two horizontal frames 1b are framed in a grid shape and the outer peripheral edge of the substrate is opposed to the nonsupporting portion W1 of the substrate. It is also possible to arrange two or more of two.
  • the supporting member 1 has a vertical frame 1a and a horizontal frame 1b, and a pressing vertical frame 1c and a horizontal frame 1d disposed so as to sandwich the thin plate-like work W. It is preferable to provide 1c and the horizontal frame 1d so as to be movable up and down with respect to the supporting vertical frame 1a and the horizontal frame 1b.
  • a magnetic attraction means such as a magnet or a magnetic body is provided, and the thin plate-like work W is vertically held by the magnetic attraction means and held immovably.
  • the adhesive means 2 comprises an adhesive chuck or the like provided with an adhesive surface 2a which is detachably attached to the unsupported portion W1 of the thin plate-like work W, the adhesive surface 2a is movably attached to the main body 2b, and the main body 2b is
  • the adhesive surface 2 a is provided so as to reciprocate in the Z direction intersecting (orthogonal) with the supporting direction of the thin plate-like work W by the support member 1 so that the adhesive surface 2 a faces the non-supporting portion W 1 of the thin plate-like work W.
  • the attachment structure of the adhesive surface 2a to the main body 2b is supported such that the adhesive surface 2a can perform a predetermined mechanical movement such as tiltable, swingable or vibrationable along the surface of the thin plate-like work W .
  • the adhesive surface 2a be supported so as to orbit or turn while being pressed against the surface of the thin plate-like work W.
  • the pressure-sensitive adhesive surface 2a is a pressure-sensitive adhesive sheet made of, for example, a pressure-sensitive adhesive material such as fluororubber, elastomer, butyl rubber, photosensitive resin, acrylic resin or silicone, and the surface is formed in an elastic surface.
  • the surface of the adhesive surface 2a may be configured to easily stick to the surface of the unsupported portion W1 by, for example, forming emboss processing, concave grooves or the like to facilitate elastic deformation as a whole. preferable.
  • the reciprocation of the adhesive surface 2a with respect to the surface of the unsupported portion W1 of the thin plate-like work W is operationally controlled by the reciprocation control means 3 to be described later. Furthermore, with respect to the main body 2b of the adhesive means 2, the adhesive surface 2a is applied to the surface of the non-supporting portion W1 of the thin plate-like work W by the adhesive area increasing means 4 described later. It is controlled so as to move, such as turning (turning) while hitting with a whistle.
  • the reciprocation control means 3 and the adhesion area increasing means 4 are, for example, means for operation control to change the grid pitch of the support member 1 and means for controlling the vertical movement of the pressing vertical frame 1c and horizontal frame 1d. And other operation control means are provided in a controller (not shown) described later.
  • the controller is electrically connected to a drive source (not shown) for reciprocating the main body 2b of the adhesive means 2, a drive source (not shown) for moving the adhesive surface 2a to the main body 2b of the adhesive means 2, etc.
  • the reciprocation control means 3 controls operation of the reciprocation drive source according to a program input and set in advance
  • the adhesion area increasing means 4 controls operation of the adhesion drive unit.
  • An example of the operation control of the reciprocation drive source by the reciprocation control means 3 includes, in its initial state, the support portion of the thin plate-like work W whose adhesive surface 2a is supported by the support member 1 It is waiting to be separated from or flush with the surface of W2.
  • the thin plate work W is moved closer to the unsupported portion W1, and when a part of the adhesive surface 2a contacts the unsupported portion W1, the main body 2b Stop the approaching movement of Thereafter, based on the movement completion signal output from the adhesion area increasing means 4, the main body 2b is moved to the position where the adhesion surface 2a is flush with the surface of the support portion W2 of the thin plate-like work W It is set to move in the reverse direction.
  • the reciprocating movement distance of the main body 2b by the driving source for reciprocating movement places the target thin plate-like work W on the supporting member 1 in advance, and the actual weight deflection amount of the non-supporting part W1 is actual side.
  • the approach movement distance of the main body 2b from the standby position of the adhesive surface 2a to the partial contact with the unsupported portion W1, and the adhesive surface 2a from the stop movement stop position of the adhesive surface 2a The reverse movement distance of the main body 2b to a position on the same plane as the surface is calculated, and these calculated values are set and input to the controller.
  • the adhesion surface 2a of the adhesion means 2 is opposed to the unsupported portion W1 of the thin plate-like work W at a predetermined angle. Let me wait. After that, when a part of the adhesive surface 2a comes into contact with the unsupported portion W1 by the approach movement of the main body 2b, the contact area with the surface of the unsupported portion W1 gradually increases with respect to the main body 2b. The movement of the adhesive surface 2a relative to the main body 2b is stopped when substantially the entire adhesive surface 2a comes in contact with the surface of the unsupported portion W1 while moving (turning) while being hit against the surface of the thin plate-like work W.
  • the movement of the adhesive surface 2a with respect to the surface of the non-supporting part W1 causes the adhesive surface 2a to make “rotational movement” only once or a plurality of times, or “rocks” several times depending on the operation content. It is possible to repeat “oscillation” continuously for a predetermined time.
  • the adhesion holding method of the thin plate-like work W is, as in the flow chart shown in FIG. 3, an approaching movement process of the adhesion means 2, an adhesion process of the adhesion surface 2 a and a reverse of the adhesion means 2. It includes a moving step and a peeling step of the adhesive surface 2a.
  • the approaching and moving process of the adhesive unit 2 is performed by the reciprocating control unit 3 from the standby position of the adhesive unit 2 separated from the thin plate-like work W supported by the support member 1.
  • the main body 2b of 2 is moved toward the non-supporting part W1 of the thin plate-like work W.
  • the adhesion surface 2a adhered to the surface of the unsupported portion W1 in contact with the surface is moved by the reciprocation control means 3 in the opposite direction to the approaching movement.
  • the reverse movement of the adhesive means 2 is stopped at a position where the adhesive surface 2a is on the same plane as the surface of the support portion W2 supported by the support member 1 in the thin plate-like work W.
  • the peeling process of the adhesive surface 2a forcibly pushes or peels off the adhesive surface 2a from the surface of the unsupported portion W1. Thereafter, the adhesive means 2 is returned to the standby position, and thereafter, it is programmed to repeat the above-described steps.
  • the adhesion holding method of the thin plate-like work W and the adhesion holding apparatus A of the thin plate-like work W according to the embodiment of the present invention, first, in the approaching and moving step of the adhesion means 2
  • the main body 2b of the adhesive unit 2 approaches and moves from the standby position toward the non-supporting portion W1 which is bent and deformed downward by its own weight in the work W.
  • the approaching movement of the adhesive means 2 is stopped.
  • the manufacturing system according to the embodiment of the present invention becomes the surface along the thin plate-like work adhesive holding device A and the thin plate-like work W described above.
  • a magnetic surface 5 provided to face the non-processed surface W3 a processing mask 6 made of a magnetic material provided to face the processed surface W4 to be the film surface along the thin plate-like work W, and a thin plate
  • a mask movement control means 7 is provided which controls the reciprocating movement of the processing mask 6 with respect to the processing surface (film surface) W4 of the workpiece W.
  • the magnet surface 5 is formed by embedding a permanent magnet or the like in a plate material having substantially the same size as the thin plate-like work W, or forming the whole plate material with a permanent magnet or the like, and the smooth magnetic surface portion 5a is a support member
  • the thin plate-like work W supported by 1 is arranged on the same plane as the non-processed surface W3 of the support portion W2. That is, the magnetic surface portion 5a of the magnet surface 5 is disposed on the same plane as the lower surfaces of the pressing vertical frame 1c and the horizontal frame 1d.
  • the processing mask 6 is, for example, a vapor deposition mask in which one or more openings (not shown) corresponding to vapor deposition patterns are formed on the film surface of the thin plate-like work W, and reciprocates in the Z direction It is freely provided, and the reciprocation of the thin plate-like work W with respect to the processing surface W4 is operated and controlled by the mask movement control means 7.
  • the mask movement control means 7 is provided in the controller together with the reciprocation control means 3 etc. and is also electrically connected to a drive source (not shown) for making the processing mask 6 reciprocate. According to the above, the operation control of the mask reciprocating drive source is performed.
  • the non-supporting portion W1 of the thin plate-like work W not supported by the support member 1 It is preferable to make the processing mask 6 stand by so as to be separated from the processing surface W4. As shown in FIGS. 2 (a) to 2 (c), the processed surface W4 of the unsupported portion W1 also in the approaching and moving process of the adhesive means 2 and the adhesive process of the adhesive surface 2a and the reverse moving process of the adhesive means 2 described above. It is preferable to make the processing mask 6 stand by so as to be separated from the As shown in FIG.
  • the processing mask 6 is moved in conjunction with the reciprocation control means 3 at the same time as the reverse movement process of the adhesion means 2 or after the reverse movement process of the adhesion means 2 is completed.
  • the processing mask 6 is set to move toward the processing surface W 4 of the thin plate-like work W so that the processing mask 6 enters the magnetic attraction force area of the magnet surface 5.
  • the adhesive surface 2a is moved back to a position on the thin plate-like work W on the same plane as the surface of the support portion W2 in the reverse movement step of the adhesive means 2.
  • the mask movement control means 7 makes the processing mask 6 a magnet surface after the contact of substantially the entire adhesion surface 2a of the adhesion means 2 with the surface of the unsupported portion W1.
  • the thin plate-like work W is attracted to the magnetic surface 5 together with the processing mask 6 by the magnetic attraction force of the magnetic surface 5, and the support site W2 on the smooth magnetic surface portion 5a of the magnetic surface 5
  • the non-machined surface W3 is in pressure contact
  • the surface of the processing mask 6 is in pressure contact with the processing surface W4 of the thin plate-like work W, and the entire thin plate-like work W is held between the magnet surface 5 and the processing mask 6 Ru.
  • the thin plate work W is held adhesively so that the non-supporting portion W1 is substantially flush with the supporting portion W2 without breakage, and is held in a planar shape between the magnetic surface portion 5a of the magnet surface 5 and the processing mask 6 can do.
  • deformation or distortion does not occur in the mask pattern in the processing mask 6, so that accurate pattern formation can be performed by vapor deposition or the like, precision can be improved, and yield can be improved.
  • the adhesive surface 2a is tiltably supported with respect to the main body 2b of the adhesive unit 2 as a specific example of the adhesive unit 2, and the adhesive area increasing unit 4
  • the adhesive surface 2a is moved while being pressed against the non-supporting portion W1 of the thin plate-like work W, and the adhesive surface 2a is peeled off from the non-supporting portion W1 of the thin plate-like work W in the main body 2b of the adhesive means 2
  • the peeling means 8 is integrally incorporated.
  • the main body 2b of the adhesion means 2 is formed in a disk shape or a rectangular plate shape, and the cylindrical body 2c is reciprocably inserted in the Z direction through a through hole opened at the center thereof.
  • a biasing member 2d such as a coil spring
  • An idler 2e is provided loosely at one end of the cylindrical body 2c, and an adhesive sheet to be the adhesive surface 2a is fixed to the tip of the idler 2e.
  • rubber may be inserted between the cylindrical body 2c and the idler 2e.
  • the supporting direction of the floating body 2e and the adhesive surface 2a with respect to the cylindrical body 2c is controlled by the adhesive area increasing means 4, and one of the adhesive surface 2a is inclined at a predetermined angle with respect to the non-supporting portion W1 of the thin plate work W
  • the adhesive material to be the adhesive surface 2a and the elastically deformable portion of the unsupported portion W1 are reciprocated while being pressed against the unsupported portion W1 with the adhesive surface 2a.
  • the contact area with the surface of the unsupported portion W1 is gradually increased.
  • a rod 4a is rotatably inserted as an adhesion driving portion into the inner peripheral hole of the cylindrical body 2c, and the inclined surface 4b formed at the tip of the rod 4a is an idler 2e.
  • the adhesive surface 2a is inclined at a predetermined angle ⁇ by contacting the base end of the rod with a predetermined pressure, and the adhesive surface 2a is rotated at a predetermined angle by rotating the inclined surface 4b of the rod 4a while maintaining the contact state. It is configured to rotate and move while being inclined at ⁇ .
  • the reciprocating motion control means 3 contacts the surface of the unsupported portion W1 of the thin plate-like work W without tilting the adhesive surface 2a of the adhesive means 2
  • the inclined surface 4b of the rod 4a is brought into contact with the proximal end of the floating body 2e by the adhesive area increasing means 4 so that a part of the adhesive surface 2a contacts the surface of the unsupported portion W1.
  • the pressure-sensitive adhesive surface 2a is wrinkled at the non-supporting region W1 within the range in which the pressure-sensitive adhesive material serving as the adhesive surface 2a and the non-supporting region W1 are elastically deformable. Operation control is performed to turn (turn) while inclining to hit.
  • the adhesive surface 2a is made to stand by in a state in which the adhesive surface 2a is inclined in advance, or the adhesive surface 2a is inclined during approaching movement, and a part of the adhesive surface 2a is on the surface of the unsupported portion W1. It is also possible to stop the approaching movement at the time of contact.
  • the peeling means 8 separates the adhesive surface 2a adhered to each other and the surface of the non-supporting portion W1 in the Z direction with a larger force than the adhesive force of the adhesive surface 2a.
  • a pusher 8a is provided so as to be movable toward the surface of the unsupported portion W1 or in the plane of the adhesive surface 2a or around the adhesive surface 2a, and is not supported by the protruding movement of the pusher 8a. It is preferable to forcibly push off the adhesive surface 2a from the surface of the part W1. In the example shown in FIG.
  • the pusher 8a is inserted into the through hole 2g opened at the center of the floating body 2e, and the operation is controlled so that the tip 8b protrudes from the adhesive surface 2a.
  • the tip 8b protrudes from the adhesive surface 2a.
  • the adhesive holding method of the thin plate-like work W and the adhesive holding apparatus A of the thin plate-like work W and the manufacturing system according to the embodiment of the present invention, a part of the adhesive surface 2a is pressed against the surface of the unsupported portion W1.
  • the adhesive surface increasing means 4 sets the adhesive surface 2a to the non-supporting region W1 within the elastically deformable range of the adhesive material to be the adhesive surface 2a and the non-supporting region W1. Since the cushioning action by the elastic member 2f causes the adhesive surface 2a to copy according to the reaction force of the posture of the unsupported portion W1 and the like, the adhesive surface 2a is partially not circumferentially moved in order to move around while turning with a brow.
  • the contact area between the adhesive surface 2a and the surface of the non-supporting portion W1 is gradually expanded as the surface of the support portion W1 approaches sequentially.
  • the adhesive surface 2a of the adhesive means 2 can be softly partially contacted with the elastically deformed unsupported portion W1 of the thin plate-like work W, and the entire adhesive surface 2a can be reliably in surface contact.
  • adhesion can be held flatly while preventing the thin plate-like work W from being completely cracked, and the operability is excellent.
  • the adhesive surface 2a is tiltably supported with respect to the main body 2b of the adhesive unit 2, and the adhesive surface increasing unit 4 applies the adhesive surface 2a to the unsupported portion W1 of the thin plate-like work W It is not limited to this, so that the inclination angle to the unsupported portion W1 gradually decreases from one end of the adhesive surface 2a to the other end instead of the rotational (rotation) movement of the adhesive surface 2a. Operation control may be performed to overturn.
  • the peeling means 8 for peeling off the adhesive surface 2a from the unsupported portion W1 of the thin plate-like work W is integrally incorporated into the main body 2b of the adhesive means 2, but the invention is not limited thereto. You may provide eight.
  • a Adhesive holding apparatus for thin plate-like workpiece 1 Support member 2 Adhesive means 2a Adhesive surface 2b Main body 3 Reciprocation control means 4 Adhesive area increasing means 5 Magnet surface 6 Processing mask 7 Mask movement control means W Thin plate W1 Unsupported part W2 Support area W3 Non-machined surface W4 Machined surface

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

La présente invention fait adhérer et maintient une pièce à travailler en forme de plaque mince et corrige toute courbure sous l'effet du poids de la pièce à travailler elle-même, sans endommager la pièce à travailler. Dans une pièce à travailler en forme de plaque mince (W) dont une partie est supportée par un élément de support en forme de treillis (1), un moyen d'adhérence (2) est déplacé de façon à s'approcher, dans une direction qui croise la pièce à travailler en forme de plaque mince (W), une partie non supportée (W1) qui s'est incurvée et qui s'est déformée vers le bas du fait du poids de la pièce à travailler elle-même, et une partie de la surface d'adhérence (2a) du moyen d'adhérence (2) est amenée en contact avec la partie non supportée (W1). Ensuite, la surface d'adhérence (2a) est déplacée de façon à augmenter graduellement la surface de contact entre la surface d'adhérence (2a) et la partie non supportée (W1). Par conséquent, la surface d'adhérence (2a) est graduellement amenée en contact, au cours d'une période de temps étagée et d'une manière partielle en fonction de la courbure de la partie non supportée (W1) sous le poids de la pièce à travailler elle-même, et, lorsque cela se produit, la charge externe sur la pièce à travailler en forme de plaque mince est réduite à un niveau extrêmement bas, et approximativement la totalité de la surface d'adhérence (2a) est amenée en contact avec la partie non supportée (W1), en adhérence avec celle-ci, et est maintenue contre celle-ci. Ensuite, le moyen d'adhérence (2) est déplacé dans la direction opposée à la direction d'approche mentionnée ci-dessus, jusqu'à une position dans laquelle la surface d'adhérence (2a) est dans le même plan qu'une partie supportée (W2) dans la pièce à travailler en forme de plaque mince, qui est supportée par un élément de support (1). Par conséquent, une courbure, sous le poids de la pièce à travailler elle-même, dans la partie non supportée (W1), est réduite, et la totalité de la pièce à travailler en forme de plaque mince adhère et est maintenue sous une forme plane.
PCT/JP2011/054552 2011-02-28 2011-02-28 Procédé d'adhérence et de maintien de pièce à travailler en forme de plaque mince, dispositif d'adhérence et de maintien de pièce à travailler en forme de plaque mince, et système de fabrication WO2012117509A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
CN201180053944.XA CN103201201B (zh) 2011-02-28 2011-02-28 薄板状工件的粘附保持方法和薄板状工件的粘附保持装置以及制造***
PCT/JP2011/054552 WO2012117509A1 (fr) 2011-02-28 2011-02-28 Procédé d'adhérence et de maintien de pièce à travailler en forme de plaque mince, dispositif d'adhérence et de maintien de pièce à travailler en forme de plaque mince, et système de fabrication
JP2011536229A JP4857407B1 (ja) 2011-02-28 2011-02-28 薄板状ワークの粘着保持方法及び薄板状ワークの粘着保持装置並びに製造システム
KR1020127023721A KR101791280B1 (ko) 2011-02-28 2011-02-28 박판 형상 워크의 점착 유지 방법 및 박판 형상 워크의 점착 유지 장치 및 제조 시스템
TW101105906A TWI466811B (zh) 2011-02-28 2012-02-22 Adhesive and holding method for sheet-like workpieces and adhesive holding device for sheet-like workpieces and manufacturing system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2011/054552 WO2012117509A1 (fr) 2011-02-28 2011-02-28 Procédé d'adhérence et de maintien de pièce à travailler en forme de plaque mince, dispositif d'adhérence et de maintien de pièce à travailler en forme de plaque mince, et système de fabrication

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WO2012117509A1 true WO2012117509A1 (fr) 2012-09-07

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JP (1) JP4857407B1 (fr)
KR (1) KR101791280B1 (fr)
CN (1) CN103201201B (fr)
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WO (1) WO2012117509A1 (fr)

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WO2018086698A1 (fr) * 2016-11-10 2018-05-17 Applied Materials, Inc. Agencement de retenue pour retenir un substrat, support comprenant l'agencement de retenue, système de traitement utilisant le support, et procédé de libération d'un substrat à partir d'un agencement de retenue
EP3772747A1 (fr) * 2019-08-05 2021-02-10 Trixell Outil de positionnement
JP2021072319A (ja) * 2019-10-29 2021-05-06 キヤノントッキ株式会社 基板保持ユニット、基板保持部材、基板保持装置、基板処理装置および電子デバイスの製造方法
JP2021075781A (ja) * 2019-11-04 2021-05-20 キヤノントッキ株式会社 成膜装置及び成膜方法

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CN103913902A (zh) * 2014-03-25 2014-07-09 京东方科技集团股份有限公司 一种掩膜板组装装置及组装方法
SG11201710300SA (en) * 2015-06-12 2018-01-30 Ulvac Inc Substrate holding device, film deposition device, and substrate holding method
WO2017038788A1 (fr) * 2015-09-01 2017-03-09 株式会社ニコン Dispositif de support d'article, dispositif d'exposition, procédé de fabrication d'un affichage à panneau plat, procédé de fabrication d'un dispositif, procédé de support d'un article, et procédé d'exposition
KR101978693B1 (ko) 2018-11-16 2019-05-15 주식회사 바이오에이엠 악취 억제를 위한 사료첨가제 및 이의 제조 방법
KR20200057581A (ko) 2019-02-14 2020-05-26 주식회사 바이오에이엠 악취 억제를 위한 사료첨가제 및 이의 제조 방법
CN110172673B (zh) * 2019-07-03 2021-01-26 京东方科技集团股份有限公司 蒸镀基板及蒸镀设备

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CN104183796A (zh) * 2013-05-27 2014-12-03 三星显示有限公司 基底移动单元、沉积装置和制造有机发光显示装置的方法
CN104183796B (zh) * 2013-05-27 2018-06-01 三星显示有限公司 基底移动单元、沉积装置和制造有机发光显示装置的方法
WO2018086698A1 (fr) * 2016-11-10 2018-05-17 Applied Materials, Inc. Agencement de retenue pour retenir un substrat, support comprenant l'agencement de retenue, système de traitement utilisant le support, et procédé de libération d'un substrat à partir d'un agencement de retenue
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EP3772747A1 (fr) * 2019-08-05 2021-02-10 Trixell Outil de positionnement
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JP2021072319A (ja) * 2019-10-29 2021-05-06 キヤノントッキ株式会社 基板保持ユニット、基板保持部材、基板保持装置、基板処理装置および電子デバイスの製造方法
JP7057334B2 (ja) 2019-10-29 2022-04-19 キヤノントッキ株式会社 基板保持ユニット、基板保持部材、基板保持装置、基板処理装置および電子デバイスの製造方法
JP2021075781A (ja) * 2019-11-04 2021-05-20 キヤノントッキ株式会社 成膜装置及び成膜方法

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CN103201201A (zh) 2013-07-10
TWI466811B (zh) 2015-01-01
JP4857407B1 (ja) 2012-01-18
KR101791280B1 (ko) 2017-10-27
TW201302585A (zh) 2013-01-16
JPWO2012117509A1 (ja) 2014-07-07
CN103201201B (zh) 2015-06-03
KR20130138652A (ko) 2013-12-19

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