SG11201710300SA - Substrate holding device, film deposition device, and substrate holding method - Google Patents

Substrate holding device, film deposition device, and substrate holding method

Info

Publication number
SG11201710300SA
SG11201710300SA SG11201710300SA SG11201710300SA SG11201710300SA SG 11201710300S A SG11201710300S A SG 11201710300SA SG 11201710300S A SG11201710300S A SG 11201710300SA SG 11201710300S A SG11201710300S A SG 11201710300SA SG 11201710300S A SG11201710300S A SG 11201710300SA
Authority
SG
Singapore
Prior art keywords
substrate holding
film deposition
deposition device
holding method
holding device
Prior art date
Application number
SG11201710300SA
Inventor
Ayumi Oribe
Munemoto Hagiwara
Hirofumi Umemura
Noriaki Kasuya
Junichiro Koike
Kazuhiko Koizumi
Eiji Fujino
Original Assignee
Ulvac Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc filed Critical Ulvac Inc
Publication of SG11201710300SA publication Critical patent/SG11201710300SA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75733—Magnetic holding means
SG11201710300SA 2015-06-12 2016-06-07 Substrate holding device, film deposition device, and substrate holding method SG11201710300SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015119062 2015-06-12
PCT/JP2016/066899 WO2016199759A1 (en) 2015-06-12 2016-06-07 Substrate holding device, film forming apparatus and substrate holding method

Publications (1)

Publication Number Publication Date
SG11201710300SA true SG11201710300SA (en) 2018-01-30

Family

ID=57504783

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201710300SA SG11201710300SA (en) 2015-06-12 2016-06-07 Substrate holding device, film deposition device, and substrate holding method

Country Status (6)

Country Link
JP (1) JP6500103B2 (en)
KR (1) KR102091560B1 (en)
CN (1) CN107710397B (en)
SG (1) SG11201710300SA (en)
TW (1) TWI632639B (en)
WO (1) WO2016199759A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106978591B (en) * 2017-05-16 2019-07-02 昆山国显光电有限公司 Component and evaporated device is deposited
KR102107973B1 (en) * 2017-07-24 2020-05-07 어플라이드 머티어리얼스, 인코포레이티드 Apparatus and system for processing a substrate in a vacuum chamber, and method of aligning a substrate carrier with respect to a mask carrier
KR102010158B1 (en) * 2017-12-26 2019-08-12 캐논 톡키 가부시키가이샤 Film forming apparatus, film forming method and manufacturing method of organic el display apparatus using the same
CN110819937A (en) * 2018-08-14 2020-02-21 上海和辉光电有限公司 Mask plate moving jig
CN111188012A (en) * 2018-11-14 2020-05-22 广东聚华印刷显示技术有限公司 Evaporation device, preparation method of evaporation film, electroluminescent device and preparation method
JP7269000B2 (en) * 2018-12-26 2023-05-08 キヤノントッキ株式会社 Substrate mounting method, film forming method, film forming apparatus, and organic EL panel manufacturing system
CN109928210A (en) * 2019-04-04 2019-06-25 东莞市敏顺自动化科技有限公司 Multi-work piece automatic loading and unloading mechanism
KR20210011790A (en) * 2019-07-23 2021-02-02 캐논 톡키 가부시키가이샤 Alignment device, alignment method, film forming apparatus, and film forming method
JP7057335B2 (en) * 2019-10-29 2022-04-19 キヤノントッキ株式会社 Substrate holding device, substrate processing device, substrate holding method, film forming method, and manufacturing method of electronic device
JP7159238B2 (en) * 2020-03-13 2022-10-24 キヤノントッキ株式会社 Substrate carrier, deposition apparatus, and deposition method
KR102591418B1 (en) * 2020-09-04 2023-10-19 캐논 톡키 가부시키가이샤 Carrier, film forming apparatus, film forming method, and manufacturing method of electronic device
CN112853273B (en) * 2020-12-31 2022-12-16 南京深光科技有限公司 Flexible AMOLED mask plate surface coating equipment
JP2021073373A (en) * 2021-01-05 2021-05-13 キヤノントッキ株式会社 Substrate mounting method, substrate holding device, and method for producing electronic device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001332609A (en) * 2000-03-13 2001-11-30 Nikon Corp Apparatus for holding substrate and aligner
KR100838065B1 (en) * 2002-05-31 2008-06-16 삼성에스디아이 주식회사 Fixed device for thin film sputter and fixed method using the same
JP2004311656A (en) * 2003-04-04 2004-11-04 Nikon Corp Method and apparatus for holding and exposure device
JP2007123316A (en) * 2005-10-25 2007-05-17 Nikon Corp Stage device, aligner, and method of manufacturing device
JP2007119895A (en) * 2005-10-31 2007-05-17 Toshiba Matsushita Display Technology Co Ltd Vapor deposition device
JP2008060299A (en) * 2006-08-31 2008-03-13 Dainippon Screen Mfg Co Ltd Substrate treating device and method
WO2008139876A1 (en) * 2007-05-10 2008-11-20 Ulvac, Inc. Positioning device and film-forming device
JP5297046B2 (en) * 2008-01-16 2013-09-25 キヤノントッキ株式会社 Deposition equipment
JP2010118157A (en) 2008-11-11 2010-05-27 Ulvac Japan Ltd Method of manufacturing front panel
WO2012117509A1 (en) * 2011-02-28 2012-09-07 信越エンジニアリング株式会社 Thin plate-shaped workpiece adhesion and retention method, thin plate-shaped workpiece adhesion and retention device, and manufacturing system
JP2013247040A (en) 2012-05-29 2013-12-09 Hitachi High-Technologies Corp Organic el device manufacturing apparatus and organic el device manufacturing method
JP2015074826A (en) * 2013-10-11 2015-04-20 株式会社ブイ・テクノロジー Deposition mask, and manufacturing method thereof
JP2015088526A (en) * 2013-10-28 2015-05-07 株式会社堀甲製作所 Resin cover for metal storage box

Also Published As

Publication number Publication date
CN107710397A (en) 2018-02-16
JPWO2016199759A1 (en) 2018-01-25
KR102091560B1 (en) 2020-03-20
JP6500103B2 (en) 2019-04-10
TW201707128A (en) 2017-02-16
CN107710397B (en) 2021-02-19
KR20170122830A (en) 2017-11-06
TWI632639B (en) 2018-08-11
WO2016199759A1 (en) 2016-12-15

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