WO2009060562A1 - ワイヤソー装置 - Google Patents

ワイヤソー装置 Download PDF

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Publication number
WO2009060562A1
WO2009060562A1 PCT/JP2008/002915 JP2008002915W WO2009060562A1 WO 2009060562 A1 WO2009060562 A1 WO 2009060562A1 JP 2008002915 W JP2008002915 W JP 2008002915W WO 2009060562 A1 WO2009060562 A1 WO 2009060562A1
Authority
WO
WIPO (PCT)
Prior art keywords
work
wire
cut
slurry
saw apparatus
Prior art date
Application number
PCT/JP2008/002915
Other languages
English (en)
French (fr)
Inventor
Koji Kitagawa
Original Assignee
Shin-Etsu Handotai Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin-Etsu Handotai Co., Ltd. filed Critical Shin-Etsu Handotai Co., Ltd.
Priority to DE112008002790.0T priority Critical patent/DE112008002790B4/de
Priority to US12/733,528 priority patent/US8434468B2/en
Publication of WO2009060562A1 publication Critical patent/WO2009060562A1/ja

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0633—Grinders for cutting-off using a cutting wire
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9292—Wire tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

　本発明は、複数の溝付きローラに巻掛けされ、軸方向に往復走行するワイヤと、スラリを供給するノズルと、ワークを保持しつつワイヤへ送るワーク送り機構を具備し、ノズルからワイヤにスラリを供給しつつ、ワークを往復走行するワイヤに押し当てて送り、ウエーハ状に切断するワイヤソー装置であって、ワーク送り機構のワーク保持部は、ワークに接着されている当て板とワークプレートを介してワークを保持するものであり、ワークのワイヤの切入り部から飛散するスラリを防ぐための板状またはブロック状のスラリ飛散防止部材が、ワーク保持部の下方かつワイヤがワークに切入る側と切出す側の両側に、ワイヤ列と直行方向に配設されたものであるワイヤソー装置を提供する。これにより、ワークのワイヤの切入り部から飛散するスラリを原因としてワークが蛇腹運動するのを抑制し、切断されるウエーハのＷａｒｐを改善することが可能なワイヤソー装置が提供される。
PCT/JP2008/002915 2007-11-08 2008-10-15 ワイヤソー装置 WO2009060562A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE112008002790.0T DE112008002790B4 (de) 2007-11-08 2008-10-15 Drahtsägevorrichtung
US12/733,528 US8434468B2 (en) 2007-11-08 2008-10-15 Wire saw apparatus

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007290834A JP5045378B2 (ja) 2007-11-08 2007-11-08 ワイヤソー装置
JP2007-290834 2007-11-08

Publications (1)

Publication Number Publication Date
WO2009060562A1 true WO2009060562A1 (ja) 2009-05-14

Family

ID=40625473

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/002915 WO2009060562A1 (ja) 2007-11-08 2008-10-15 ワイヤソー装置

Country Status (6)

Country Link
US (1) US8434468B2 (ja)
JP (1) JP5045378B2 (ja)
KR (1) KR101471849B1 (ja)
DE (1) DE112008002790B4 (ja)
TW (1) TWI390620B (ja)
WO (1) WO2009060562A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103950121A (zh) * 2014-04-16 2014-07-30 唐山晶玉科技有限公司 一种多线切割机专用挡砂装置
CN113561343A (zh) * 2021-07-12 2021-10-29 威科赛乐微电子股份有限公司 一种晶片多线切割晶体夹持装置及晶片切割方法

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5370006B2 (ja) 2009-08-31 2013-12-18 株式会社Ｓｕｍｃｏ ワイヤソー装置
JP5460226B2 (ja) * 2009-10-13 2014-04-02 京セラ株式会社 ワイヤーソー装置およびこれを用いた半導体基板の製造方法
KR101083481B1 (ko) * 2010-03-02 2011-11-16 주식회사 엘지실트론 비산차단 시스템 및 이를 포함하는 단결정 잉곳 절단장치
CN102398318B (zh) * 2010-09-17 2015-01-28 上海日进机床有限公司 蓝宝石硅棒的切割方法
KR101279681B1 (ko) 2010-09-29 2013-06-27 주식회사 엘지실트론 단결정 잉곳 절단장치
KR101185683B1 (ko) * 2011-02-23 2012-09-24 주식회사 엘지실트론 단결정 잉곳 절단장치
US20130144421A1 (en) * 2011-12-01 2013-06-06 Memc Electronic Materials, Spa Systems For Controlling Temperature Of Bearings In A Wire Saw
DE102012221904B4 (de) 2012-11-29 2018-05-30 Siltronic Ag Verfahren zur Wiederaufnahme des Drahtsägeprozesses eines Werkstückes nach einer unplanmäßigen Unterbrechung
CN105142867A (zh) 2013-04-24 2015-12-09 梅耶博格公司 线锯
KR101690246B1 (ko) 2015-01-26 2017-01-09 주식회사 엘지실트론 와이어 쏘잉 장치
JP6304118B2 (ja) 2015-05-01 2018-04-04 信越半導体株式会社 ワイヤソー装置
JP6402700B2 (ja) * 2015-10-20 2018-10-10 信越半導体株式会社 ワークの切断方法及びワイヤソー
JP6819619B2 (ja) * 2018-01-22 2021-01-27 信越半導体株式会社 ワーク切断方法及びワイヤソー
CN108789594B (zh) * 2018-07-31 2024-03-29 江苏美科太阳能科技股份有限公司 切片机内部水隔离装置
CN110962246B (zh) * 2018-09-28 2023-01-03 胜高股份有限公司 线锯装置
KR102149092B1 (ko) * 2019-01-14 2020-08-27 에스케이실트론 주식회사 와이어 쏘잉 장치
JP2022076168A (ja) * 2020-11-09 2022-05-19 株式会社アマダ 帯鋸盤，帯鋸刃の冷却方法，及び帯鋸盤によるワークの切断方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09193140A (ja) * 1996-01-12 1997-07-29 Mitsubishi Materials Corp ワイヤ式切断加工装置
JPH09262829A (ja) * 1996-03-28 1997-10-07 Shin Etsu Handotai Co Ltd ワイヤーソー装置
JP2004114249A (ja) * 2002-09-27 2004-04-15 Ishii Hyoki Corp ワイヤソーにおけるワイヤ断線検出装置
JP2007273711A (ja) * 2006-03-31 2007-10-18 Toyo Advanced Technologies Co Ltd ワイヤソー

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3656317B2 (ja) 1996-03-27 2005-06-08 信越半導体株式会社 ワイヤソーによるワーク切断方法及び装置
JP3278798B2 (ja) 1996-03-28 2002-04-30 株式会社スギノマシン 円加工装置
JPH1029212A (ja) * 1996-07-16 1998-02-03 Tokyo Seimitsu Co Ltd ワイヤソーのスラリ飛散防止カバー
JP3775044B2 (ja) * 1998-03-30 2006-05-17 株式会社デンソー ワイヤソー加工方法およびワイヤソー加工装置
JP2005276851A (ja) 2004-03-22 2005-10-06 Toshiba Ceramics Co Ltd ワイヤソー
JP2006305685A (ja) 2005-04-28 2006-11-09 Komatsu Electronic Metals Co Ltd ワイヤソー装置およびワイヤソー装置用のガイドバー並びにワイヤソー装置用のスラリ供給装置。

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09193140A (ja) * 1996-01-12 1997-07-29 Mitsubishi Materials Corp ワイヤ式切断加工装置
JPH09262829A (ja) * 1996-03-28 1997-10-07 Shin Etsu Handotai Co Ltd ワイヤーソー装置
JP2004114249A (ja) * 2002-09-27 2004-04-15 Ishii Hyoki Corp ワイヤソーにおけるワイヤ断線検出装置
JP2007273711A (ja) * 2006-03-31 2007-10-18 Toyo Advanced Technologies Co Ltd ワイヤソー

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103950121A (zh) * 2014-04-16 2014-07-30 唐山晶玉科技有限公司 一种多线切割机专用挡砂装置
CN103950121B (zh) * 2014-04-16 2016-01-20 唐山晶玉科技有限公司 一种多线切割机专用挡砂装置
CN113561343A (zh) * 2021-07-12 2021-10-29 威科赛乐微电子股份有限公司 一种晶片多线切割晶体夹持装置及晶片切割方法

Also Published As

Publication number Publication date
DE112008002790B4 (de) 2019-03-14
JP2009113173A (ja) 2009-05-28
US8434468B2 (en) 2013-05-07
TWI390620B (zh) 2013-03-21
DE112008002790T5 (de) 2010-11-04
TW200935507A (en) 2009-08-16
US20100206285A1 (en) 2010-08-19
KR101471849B1 (ko) 2014-12-11
JP5045378B2 (ja) 2012-10-10
KR20100085031A (ko) 2010-07-28

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