WO2006085457A1 - Process and equipment for the production of coated members and surface mask - Google Patents

Process and equipment for the production of coated members and surface mask Download PDF

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Publication number
WO2006085457A1
WO2006085457A1 PCT/JP2006/301628 JP2006301628W WO2006085457A1 WO 2006085457 A1 WO2006085457 A1 WO 2006085457A1 JP 2006301628 W JP2006301628 W JP 2006301628W WO 2006085457 A1 WO2006085457 A1 WO 2006085457A1
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WIPO (PCT)
Prior art keywords
coated
manufacturing
mask
gap
coating material
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PCT/JP2006/301628
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French (fr)
Japanese (ja)
Inventor
Kenichi Nagayama
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Pioneer Corporation
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Publication date
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Publication of WO2006085457A1 publication Critical patent/WO2006085457A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/16—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
    • B05B12/20—Masking elements, i.e. elements defining uncoated areas on an object to be coated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing

Definitions

  • the present invention relates to a method and apparatus for manufacturing a coated material to be coated, a surface mask, in particular, a corresponding portion where the coated material is coated on the surface of the coated material, and is applied to the surface of the coated material. Cover the surface of the material to be coated with a surface mask on which a mask pattern in which corresponding portions to be prevented from penetrating are formed, spray the coating material from the spray nozzle through the surface mask, and apply the coating material.
  • the present invention relates to a coating material manufacturing method and manufacturing apparatus, and a surface mask. Background art
  • a method for producing a coated material to be coated is reported which covers the surface of the coated material, sprays the coated material from the spray nozzle through the surface mask, and coats it! Speak.
  • Patent Document 2 For example, as a method for manufacturing a material to be coated, a technique for forming an organic functional layer into a predetermined shape using a mask and using a mask is described in Patent Document 2, below. It is also disclosed in Patent Document 3 below.
  • Patent Document 2 there is a technique for forming an organic functional layer having a predetermined shape by injecting a composition containing dispersed particles of an organic compound with an inert gas and passing through an opening of a mask. Disclosed.
  • Patent Document 3 discloses a method for forming an organic functional layer in which a solution in which a polymer EL material is dissolved is sprayed in a vacuum atmosphere.
  • Paragraph “0034” of the same document describes a technique in which a red light emitting layer is formed using a pixel coating mask, and then the blue and green light emitting layers are sequentially formed by shifting the mask by a predetermined amount.
  • Patent Document 1 Japanese Patent Laid-Open No. 2001-297876
  • Patent Document 2 Japanese Patent Laid-Open No. 2002-343566
  • Patent Document 3 Japanese Patent Laid-Open No. 2003-257631
  • the droplet force that has come into consideration does not consider the intrusion between the mask and the substrate.
  • the coating is applied close to each other, as shown in Fig. 7 of this application, the liquid incident between the mask and the substrate penetrates between the mask and the substrate due to the capillary phenomenon, and the pattern accuracy of the organic functional layer deteriorates. was there. In particular, this problem became prominent when a coating solution that was difficult to dry was used to form a good film.
  • the present invention has been made in view of the above problems, and it is a main object of the present invention to provide a manufacturing method and manufacturing apparatus for a coated material to which a coated material is applied with higher accuracy, and a surface mask. Target.
  • a mask pattern is formed in which a corresponding portion where the coated material is applied to the surface of the material to be coated penetrates and a corresponding portion which prevents the coated material from being applied to the surface of the material to be coated is not penetrated.
  • the surface of the material to be coated is covered with a surface mask, and the coated material is sprayed from the spray nozzle through the surface mask and applied to the surface of the material to be coated.
  • a gap having a thickness larger than the diameter of the droplet of the sprayed coating is formed by separating the back of the mask, and after the gap is formed, the coating is sprayed and applied.
  • a mask pattern is formed in which a corresponding portion where a coated material is applied to the surface of a material to be coated penetrates and a corresponding portion which prevents the coated material from being applied to the surface of the material to be coated is not penetrated.
  • the surface of the material to be coated is covered with a surface mask, and the coated material is sprayed from the spray nozzle through the surface mask and applied.
  • a gap having a thickness larger than the diameter of the droplet of the sprayed coating is formed by separating the back of the mask, and after the gap is formed, the coating is sprayed and applied.
  • the present invention is used in a method for producing a coating material surface coating material that covers and coats a surface of a material to be coated, and sprays and coats a coating material such as a spray nozzle, and the coating material is the material to be coated. Corresponding parts that are applied to the surface penetrate, and corresponding parts that prevent it from being applied to the surface of the material to be coated do not penetrate.
  • FIG. 1 is a diagram schematically illustrating an apparatus for manufacturing a material to be coated in the present embodiment.
  • FIG. 2 is a cross-sectional view of an organic EL element in the present embodiment.
  • FIG. 3 is a diagram schematically illustrating an apparatus for manufacturing a material to be coated in the present embodiment.
  • FIG. 4 is a diagram schematically illustrating an apparatus for manufacturing a material to be coated in the present embodiment.
  • FIG. 5 is a diagram schematically illustrating an apparatus for manufacturing a material to be coated in the present embodiment.
  • FIG. 6 is a diagram schematically illustrating an apparatus for manufacturing a material to be coated in the present embodiment.
  • FIG. 7 is a diagram schematically illustrating an apparatus for manufacturing a material to be coated in the prior art.
  • Fig. 1 shows a surface mask with a mask pattern in which the corresponding part where the applied material is applied to the surface of the material to be applied penetrates and the corresponding part which prevents the applied material from being applied to the surface of the material to be applied is not penetrated.
  • the surface of the material to be coated is covered with 1 mm, and the coated material is sprayed from the spray nozzle through the surface mask and applied, and the surface mask is applied from the surface of the material to be coated.
  • An organic EL device that forms a gap having a thickness larger than the diameter of the droplet of the sprayed coating material by spraying the coating material and sprays the coating material after forming the gap.
  • the manufacturing equipment is shown. [0014] The organic EL device manufacturing apparatus of FIG.
  • a surface mask disposed on the substrate surface, a nozzle disposed on the surface mask, a nozzle for spray application, and a solution for supplying a coating liquid to the application nozzle.
  • a feeding device In the surface mask, an opening is formed through a corresponding portion where the coated material is applied to the surface of the material to be coated. Only on the substrate, the spray (droplet ejected) from the nozzle is applied to the substrate surface as a solution applied to the substrate only through the opening.
  • the thickness of the gap between the mask and the substrate is set to a distance equal to or larger than the diameter of the droplets crushed into a mist by the nozzle.
  • the gap g ⁇ droplet diameter a.
  • the gap is formed so that the gap between the mask and the substrate is larger than the diameter of the droplet.
  • the solvent used in the solution has a very high drying rate. Although it cannot be unequivocally stated due to the size of the mist-like droplets, the coating atmosphere, the distance between the nozzle and the substrate, etc., it is preferable that at least one solvent constituting the solution to be used has low volatility.
  • the boiling point should be at least 100 ° C, preferably 150 ° C, and most preferably 200 ° C.
  • the mask used in the present invention is preferably made of a material that does not dissolve in the coating solution.
  • a metal such as stainless steel or a resin such as polyimide is suitable.
  • the gap between the mask and the substrate may be at least larger than the size of the droplet immediately before reaching the substrate. If the gap is too large, it is not preferable because the pattern is blurred by droplets incident obliquely on the mask.
  • the size of the gap is preferably 1Z10 or less of the dimension of the mask opening or lmm or less, most preferably lZlOO or less of the dimension of the mask opening. Or 0.1mm or less is desirable.
  • the size of the droplet can be measured, for example, using laser light. Since it is often difficult to measure the size of a droplet just before it reaches the substrate, it is possible to use the size of the droplet just after it ejects from the nozzle. This is because the droplets ejected from the nozzle force are dried and become small before reaching the substrate, but they do not become large.
  • the size of the droplet immediately after ejecting from the nozzle cannot be generally stated depending on the type of solution and spray conditions, but is generally 1 to: LOOO / zm. If the size of the droplet immediately after ejecting the nozzle is too small, the droplet will dry and lose fluidity when it reaches the substrate, resulting in insufficient leveling and a uniform film cannot be formed. On the other hand, if the size of the droplet immediately after ejecting the nozzle is too large, a large gap between the mask and the substrate must be taken.
  • the size of the droplet immediately after ejecting the nozzle is preferably 10 to: LOO / zm.
  • the size of a droplet has a distribution close to a normal distribution with a certain width at a certain size. In that case, it is desirable to make the gap larger than the largest observed droplet. However, the gap may be larger than the average of the droplet size distribution + 3 ⁇ .
  • the distance between the mask and the substrate is detected by a sensor, and the mask is moved up and down by a gap adjusting mechanism so that the gap is within the scope of the present invention.
  • the gap sensor between the mask and the substrate may be arbitrary, but for example, an optical sensor that is often used for measuring the gap between the photomask and the substrate in a photoresist exposure apparatus may be used.
  • the mask is moved up and down to adjust the gap.
  • the substrate may be moved up and down, or both the mask and the substrate may be powered.
  • the gap between the mask and the substrate is equal to or greater than the diameter of the droplet, the droplets that come in contact with the mask back surface and both sides of the substrate surface are prevented from entering between the mask and the substrate due to capillary action. it can.
  • Fig. 2 shows the structure of the organic EL device manufactured by the manufacturing equipment shown in Fig. 1.
  • the light emitting functional layer is mainly made of organic material, holes are injected from the anode, electrons are injected from the cathode, and recombined in the light emitting layer to emit light.
  • the organic functional layer of an organic EL device usually consists of multiple layers with each function, such as hole injection layer, Z hole transport layer, Z light-emitting layer, Z electron transport layer, and Z electron injection layer.
  • Each of these organic functional layers is usually made of an organic material, and may be made of a high molecular weight organic material when it is made of a low molecular weight organic material.
  • Organic functional layers made of low molecular organic materials are generally produced by a dry process (vacuum process) such as vapor deposition, while organic functional layers made of high molecular organic materials are generally produced by spin coating, blade coating, dipping, In general, they are formed by wet processes such as spraying and printing.
  • vacuum process vacuum process
  • organic functional layers made of high molecular organic materials are generally produced by spin coating, blade coating, dipping, In general, they are formed by wet processes such as spraying and printing.
  • An example of an organic functional layer made of an organic substance soluble in an organic solvent is disclosed in, for example, JP-A-2003-74611. JP 2003-7461, pp. 0023 to “0024” on page 6, PEDOT, polyarine, polyparaphenylene-biylene derivatives, polythiophene derivatives, polyparaphenylene derivatives, poly Examples include alkylphenolene and polyacetylene derivatives.
  • these polymer materials are toluene, benzene, black benzene, dichlorobenzene, black form, tetralin, xylene, anisole, dichloromethane, y butyrolatathone,
  • the precursor is dissolved in one or more selected from solvents such as butyralsolvol, cyclohexane, NMP (N-methyl 2-pyrrolidone), dimethyl sulfoxide, cyclohexanone, dioxane or THF (tetrahydrofuran). And it forms into a film by a spin coat method.
  • organic functional layers can be formed using any known film forming method.
  • an organic functional layer that also has soluble organic strength can be formed by a wet process.
  • a coating solution in which a material is dissolved in a solvent is usually used.
  • PGME propyleneglycol monomethyl ether
  • PGME A propyleneglycol monomethyl ether acetate
  • ⁇ L acid ethynole DMAc (NN-dimethyla cetamide)
  • MEK methyl ethyl ketone
  • MIBK methyl isobutyl ketone
  • I PA iso pr
  • solvents such as opyl alcohol
  • ethanol can be used.
  • the organic functional layer can be formed by a wet process.
  • the spray method is a method of forming a film by spraying a nozzle force solution in the form of a mist, for example, as disclosed in FIG. 1 of JP-A-2001-297876.
  • the organic functional layer needs to be patterned into a predetermined shape.
  • a method as shown in FIG. 2 of JP-A-2001-297876 can be used.
  • 2001-297876 as described in “002 8” of the same document, it is not limited to a mask matched to a red, green, and blue light emission pattern, and is not limited to this.
  • a technique capable of forming a film by exchanging a plurality of masks is disclosed. In this method, masks with different light emission shapes are provided in the mask plate storage chamber, and the mask plate exchange robot replaces the masks with different patterns as appropriate to produce organic EL elements that can display various patterns. It is possible.
  • the conventional technique pays no attention to the gap between the mask and the substrate, whereas in the present invention, the gap between the mask and the substrate is sprayed. Actively and precisely control the diameter of the droplets atomized by.
  • the organic EL manufacturing apparatus may be provided with a spacer inserted between a mask and a substrate.
  • a spacer inserted between a mask and a substrate.
  • it is sufficient to prepare multiple types of spacers with different thicknesses. Since only the spacer is inserted, the mechanism is simple and the cost of the device can be reduced.
  • the organic EL manufacturing apparatus may be provided with an apparatus for observing droplets.
  • the size of the droplet changes due to the replacement of the droplet or the change of the spray conditions. Therefore, if there is a device for observing droplets, the mask-substrate gap can be determined quickly. [0037] By observing the droplet in real time and measuring the diameter of the droplet, and controlling the gap adjustment mechanism so that the gap between the mask and the substrate can be minimized, the pattern accuracy is further improved. Application can be performed. Since the gap can be controlled to the minimum necessary in real time, the organic functional layer can be formed with good pattern accuracy.
  • the mask in FIG. 4 has a protrusion (support) that protrudes larger than the diameter of the droplet.
  • the convex portion may be at any position.
  • it may be formed on a part of the mask shielding portion.
  • a conventional spray mask has a simple flat plate shape.
  • the spray mask according to the present invention has a convex portion. This eliminates the need for the gap adjusting mechanism in the coating apparatus.
  • the thickness of the gap is preferably 1Z10 or less of the shortest opening diameter of the penetrating portion, but is not limited thereto.
  • the thickness of the gap is preferably 1Z100 or less, which is the shortest opening diameter of the penetrating portion, but is not limited thereto.
  • the thickness of the gap is preferably 1 mm or less, but is not limited thereto.
  • the thickness of the gap is preferably 0.1 mm or less, but is not limited thereto.
  • the present invention it is preferable to use the substantially maximum value of the diameter of the droplet as the value of the diameter of the droplet, but the present invention is not limited to this.
  • the value of the droplet diameter is preferably the average value of the droplet diameters + 3 ⁇ , but is not limited thereto.
  • the present invention is not limited to this.
  • the material to be coated is preferably at least one of a semiconductor substrate, an organic transistor substrate, and an organic EL device constituent layer, but is not limited thereto.
  • the organic EL device component layer is preferably at least one of the substrate, anode, organic functional layer, cathode, protective barrier film on the substrate side, and sealing film, but is not limited thereto. It is preferable that the coating material contains a low-volatile solvent component (it is difficult to dry! / ⁇ ), but is not limited to this.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The invention provides a process for the production of members coated with higher accuracy, equipment for the production thereof, and a surface mask. A process for the production of a coated member which comprises covering a surface of a substrate with a surface mask having a mask pattern composed of through areas corresponding to the portions of the substrate surface to be coated and non-through areas corresponding to the portions thereof not to be coated and spouting a coating material from a nozzle toward the substrate through the mask, wherein the mask is set in such a way that the back of the mask is apart from the surface of the substrate to thereby form a gap larger than the diameter of spouted droplets of the coating material, followed by the spouting.

Description

明 細 書  Specification
塗布物被塗布材の製造方法および製造装置、表面マスク  Method and apparatus for manufacturing coated material, surface mask
技術分野  Technical field
[0001] 本発明は、塗布物被塗布材の製造方法および製造装置、表面マスク、特に塗布物 が被塗布材表面に塗布される対応箇所が貫通し、被塗布材表面に塗布されることを 防止する対応箇所が非貫通してなるマスクパターンが形成された表面マスクで被塗 布材表面を覆い、前記表面マスクを通じて噴射ノズルカゝら前記塗布物を噴射し、塗 布してなる塗布物被塗布材の製造方法および製造装置、表面マスクに関する。 背景技術  [0001] The present invention relates to a method and apparatus for manufacturing a coated material to be coated, a surface mask, in particular, a corresponding portion where the coated material is coated on the surface of the coated material, and is applied to the surface of the coated material. Cover the surface of the material to be coated with a surface mask on which a mask pattern in which corresponding portions to be prevented from penetrating are formed, spray the coating material from the spray nozzle through the surface mask, and apply the coating material. The present invention relates to a coating material manufacturing method and manufacturing apparatus, and a surface mask. Background art
[0002] 塗布物が被塗布材表面に塗布される対応箇所が貫通し、被塗布材表面に塗布さ れることを防止する対応箇所が非貫通してなるマスクパターンが形成された表面マス クで被塗布材表面を覆 ヽ、前記表面マスクを通じて噴射ノズルから前記塗布物を噴 射し、塗布してなる塗布物被塗布材の製造方法が報告されて！ヽる。  A surface mask on which a mask pattern is formed in which a corresponding portion where a coated material is applied to the surface of a material to be coated penetrates and a corresponding portion which prevents the coated material from being applied to the surface of the material to be coated is not penetrated. A method for producing a coated material to be coated is reported which covers the surface of the coated material, sprays the coated material from the spray nozzle through the surface mask, and coats it! Speak.
[0003] 例えば、塗布物被塗布材の製造方法としてノズルから噴射し、マスクを用いて、有 機機能層を所定の形状に形成する技術は、下記特許文献 1の他、下記特許文献 2、 下記特許文献 3などにも開示される。  [0003] For example, as a method for manufacturing a material to be coated, a technique for forming an organic functional layer into a predetermined shape using a mask and using a mask is described in Patent Document 2, below. It is also disclosed in Patent Document 3 below.
[0004] 下記特許文献 2では、有機化合物の分散粒子を含む組成物を不活性ガスで噴射さ せ、マスクの開口部を通過させることにより、所定の形状の有機機能層を形成する技 術が開示される。  [0004] In Patent Document 2 below, there is a technique for forming an organic functional layer having a predetermined shape by injecting a composition containing dispersed particles of an organic compound with an inert gas and passing through an opening of a mask. Disclosed.
[0005] また、下記特許文献 3には、真空雰囲気中で、高分子系 EL材料を溶解した溶液を スプレー状に噴出する有機機能層の形成方法が開示される。同文献段落「0034」に は画素塗り分けマスクを用いて赤色の発光層を形成した後、同マスクを所定量ずらし 、順次、青色、緑色の発光層を形成する技術が記載される。  [0005] Further, Patent Document 3 below discloses a method for forming an organic functional layer in which a solution in which a polymer EL material is dissolved is sprayed in a vacuum atmosphere. Paragraph “0034” of the same document describes a technique in which a red light emitting layer is formed using a pixel coating mask, and then the blue and green light emitting layers are sequentially formed by shifting the mask by a predetermined amount.
特許文献 1：特開 2001— 297876号公報  Patent Document 1: Japanese Patent Laid-Open No. 2001-297876
特許文献 2：特開 2002— 343566号公報  Patent Document 2: Japanese Patent Laid-Open No. 2002-343566
特許文献 3：特開 2003 - 257631号公報  Patent Document 3: Japanese Patent Laid-Open No. 2003-257631
発明の開示 発明が解決しょうとする課題 Disclosure of the invention Problems to be solved by the invention
[0006] し力しながら、従来の技術では、飛来した液滴力 マスク一基板間に浸入することを 考慮しておらず、例えば上記特許文献 2の図 2に示されるように、マスクと基板を近接 させて塗布を行った場合、本願図 7のように、マスク一基板間に入射した液が毛管現 象によって、マスク—基板間に浸入し、有機機能層のパターンの精度が悪くなる問題 があった。特に、良好な膜を形成するために乾きにくい塗布液を使用した場合、この 問題は顕著となった。  [0006] However, in the conventional technology, the droplet force that has come into consideration does not consider the intrusion between the mask and the substrate. For example, as shown in FIG. When the coating is applied close to each other, as shown in Fig. 7 of this application, the liquid incident between the mask and the substrate penetrates between the mask and the substrate due to the capillary phenomenon, and the pattern accuracy of the organic functional layer deteriorates. was there. In particular, this problem became prominent when a coating solution that was difficult to dry was used to form a good film.
[0007] 本発明は、上記課題に鑑みてなされたものであり、より高精度に塗布物が塗布され た塗布物被塗布材の製造方法および製造装置、表面マスクを提供することを主な目 的とする。  [0007] The present invention has been made in view of the above problems, and it is a main object of the present invention to provide a manufacturing method and manufacturing apparatus for a coated material to which a coated material is applied with higher accuracy, and a surface mask. Target.
課題を解決するための手段  Means for solving the problem
[0008] 本発明は、塗布物が被塗布材表面に塗布される対応箇所が貫通し、被塗布材表 面に塗布されることを防止する対応箇所が非貫通してなるマスクパターンが形成され た表面マスクで被塗布材表面を覆 ヽ、前記表面マスクを通じて噴射ノズルから前記 塗布物を噴射し、塗布してなる塗布物表面塗布材の製造方法であって、前記被塗布 材表面力 前記表面マスクの背面との間を離すことで、前記噴射される塗布物の液 滴の直径よりも大きな厚さのギャップを形成し、前記ギャップの形成後、前記塗布物 を噴射し、塗布することを特徴とする。  [0008] According to the present invention, a mask pattern is formed in which a corresponding portion where the coated material is applied to the surface of the material to be coated penetrates and a corresponding portion which prevents the coated material from being applied to the surface of the material to be coated is not penetrated. The surface of the material to be coated is covered with a surface mask, and the coated material is sprayed from the spray nozzle through the surface mask and applied to the surface of the material to be coated. A gap having a thickness larger than the diameter of the droplet of the sprayed coating is formed by separating the back of the mask, and after the gap is formed, the coating is sprayed and applied. Features.
[0009] 本発明は、塗布物が被塗布材表面に塗布される対応箇所が貫通し、被塗布材表 面に塗布されることを防止する対応箇所が非貫通してなるマスクパターンが形成され た表面マスクで被塗布材表面を覆 ヽ、前記表面マスクを通じて噴射ノズルから前記 塗布物を噴射し、塗布してなる塗布物表面塗布材の製造装置であって、前記被塗布 材表面力 前記表面マスクの背面との間を離すことで、前記噴射される塗布物の液 滴の直径よりも大きな厚さのギャップを形成し、前記ギャップの形成後、前記塗布物 を噴射し、塗布することを特徴とする。  [0009] According to the present invention, a mask pattern is formed in which a corresponding portion where a coated material is applied to the surface of a material to be coated penetrates and a corresponding portion which prevents the coated material from being applied to the surface of the material to be coated is not penetrated. The surface of the material to be coated is covered with a surface mask, and the coated material is sprayed from the spray nozzle through the surface mask and applied. A gap having a thickness larger than the diameter of the droplet of the sprayed coating is formed by separating the back of the mask, and after the gap is formed, the coating is sprayed and applied. Features.
[0010] 本発明は、被塗布材表面を覆 ヽ、噴射ノズルカゝら塗布物を噴射し、塗布してなる塗 布物表面塗布材の製造方法に用いられ、前記塗布物が前記被塗布材表面に塗布さ れる対応箇所が貫通し、被塗布材表面に塗布されることを防止する対応箇所が非貫 通してなるマスクパターンが形成された表面マスクであって、前記被塗布材表面と前 記表面マスクの背面との間に、前記噴射される塗布物の液滴の直径よりも大きな厚さ のギャップを形成するように支持する支持体が設けられたことを特徴とする。 [0010] The present invention is used in a method for producing a coating material surface coating material that covers and coats a surface of a material to be coated, and sprays and coats a coating material such as a spray nozzle, and the coating material is the material to be coated. Corresponding parts that are applied to the surface penetrate, and corresponding parts that prevent it from being applied to the surface of the material to be coated do not penetrate. A surface mask having a mask pattern formed therethrough, and a gap having a thickness larger than a diameter of a droplet of the sprayed application material between the surface of the material to be coated and the back surface of the surface mask. It is characterized in that a support body is provided so as to support the formation.
図面の簡単な説明  Brief Description of Drawings
[0011] [図 1]本実施形態における塗布物被塗布材の製造装置を模式的に説明する図であ る。  FIG. 1 is a diagram schematically illustrating an apparatus for manufacturing a material to be coated in the present embodiment.
[図 2]本実施形態における有機 EL素子の断面図である。  FIG. 2 is a cross-sectional view of an organic EL element in the present embodiment.
[図 3]本実施形態における塗布物被塗布材の製造装置を模式的に説明する図であ る。  FIG. 3 is a diagram schematically illustrating an apparatus for manufacturing a material to be coated in the present embodiment.
[図 4]本実施形態における塗布物被塗布材の製造装置を模式的に説明する図であ る。  FIG. 4 is a diagram schematically illustrating an apparatus for manufacturing a material to be coated in the present embodiment.
[図 5]本実施形態における塗布物被塗布材の製造装置を模式的に説明する図であ る。  FIG. 5 is a diagram schematically illustrating an apparatus for manufacturing a material to be coated in the present embodiment.
[図 6]本実施形態における塗布物被塗布材の製造装置を模式的に説明する図であ る。  FIG. 6 is a diagram schematically illustrating an apparatus for manufacturing a material to be coated in the present embodiment.
[図 7]従来技術における塗布物被塗布材の製造装置を模式的に説明する図である。 発明を実施するための最良の形態  FIG. 7 is a diagram schematically illustrating an apparatus for manufacturing a material to be coated in the prior art. BEST MODE FOR CARRYING OUT THE INVENTION
[0012] 以下、本発明の実施の形態を図面に基づいて説明する。なお、本実施形態につい ては、本発明を実施するための一形態に過ぎず、本発明は本実施形態によって限定 されるものではない。  Hereinafter, embodiments of the present invention will be described with reference to the drawings. The present embodiment is only one form for carrying out the present invention, and the present invention is not limited to the present embodiment.
[0013] 「有機 EL素子の製造装置」  [0013] "Organic EL device manufacturing equipment"
図 1には、塗布物が被塗布材表面に塗布される対応箇所が貫通し、被塗布材表面 に塗布されることを防止する対応箇所が非貫通してなるマスクパターンが形成された 表面マスクで被塗布材表面を覆 1ヽ、前記表面マスクを通じて噴射ノズルから前記塗 布物を噴射し、塗布してなる塗布物表面塗布材の製造方法であって、前記被塗布材 表面から前記表面マスクの背面との間を離すことで、前記噴射される塗布物の液滴 の直径よりも大きな厚さのギャップを形成し、前記ギャップの形成後、前記塗布物を 噴射し、塗布する有機 EL素子の製造装置が示される。 [0014] 図 1の有機 EL素子の製造装置は、基板表面上に配置された表面マスク、表面マス ク上に配置され、スプレー噴射して塗布するノズル、塗布するノズルに塗布液を供給 する溶液供給装置を含むものである。表面マスクには、塗布物が被塗布材表面に塗 布される対応箇所が貫通して開口部が形成されている。基板上にはこの開口部を通 じてのみノズルから噴射（噴出した液滴）が基板に塗布された溶液として基板表面に 塗布される。 Fig. 1 shows a surface mask with a mask pattern in which the corresponding part where the applied material is applied to the surface of the material to be applied penetrates and the corresponding part which prevents the applied material from being applied to the surface of the material to be applied is not penetrated. The surface of the material to be coated is covered with 1 mm, and the coated material is sprayed from the spray nozzle through the surface mask and applied, and the surface mask is applied from the surface of the material to be coated. An organic EL device that forms a gap having a thickness larger than the diameter of the droplet of the sprayed coating material by spraying the coating material and sprays the coating material after forming the gap. The manufacturing equipment is shown. [0014] The organic EL device manufacturing apparatus of FIG. 1 includes a surface mask disposed on the substrate surface, a nozzle disposed on the surface mask, a nozzle for spray application, and a solution for supplying a coating liquid to the application nozzle. Including a feeding device. In the surface mask, an opening is formed through a corresponding portion where the coated material is applied to the surface of the material to be coated. Only on the substrate, the spray (droplet ejected) from the nozzle is applied to the substrate surface as a solution applied to the substrate only through the opening.
[0015] 図 1のように、マスクを用いてスプレー塗布をする際、マスクと基板間のギャップの厚 さを、ノズルによって霧状に粉砕された液滴の直径以上の距離とする。つまり、図 1に おいて、ギャップ g≥液滴直径 a、となるようにする。  As shown in FIG. 1, when spray coating is performed using a mask, the thickness of the gap between the mask and the substrate is set to a distance equal to or larger than the diameter of the droplets crushed into a mist by the nozzle. In other words, in Fig. 1, the gap g≥droplet diameter a.
その方法は、例えば、図 3のように、マスク一基板間の一般的なギャップを制御する 機構を設ける力、または、図 4のように、パターンを形成するマスクの遮蔽部からスプ レーの液滴の直径以上突出する凸部を有するように構成してマスクと基板間のギヤッ プの厚さを液滴の直径よりも大きな厚さのギャップを形成する。  For example, as shown in FIG. 3, a force for providing a mechanism for controlling a general gap between a mask and a substrate, or a spray liquid from a mask shielding portion for forming a pattern as shown in FIG. The gap is formed so that the gap between the mask and the substrate is larger than the diameter of the droplet.
[0016] 一般にスプレー法では、溶液の乾燥速度が速すぎると、膜にムラが生じてしまう。そ こで、スプレーに用いる溶液の乾燥速度を遅くして、霧状になった溶液が基板に到達 する時点でも乾かずに流動性を保つようにするのが望ましい。そうすることにより、溶 液が基板上に到達した後、レべリングし、膜ムラの少ない均一な膜が得られやすい。  [0016] In general, in the spray method, if the drying speed of the solution is too high, unevenness occurs in the film. Therefore, it is desirable to slow down the drying speed of the solution used for spraying so that the mist-like solution remains fluid even when it reaches the substrate. By doing so, after the solution reaches the substrate, it is leveled, and a uniform film with little film unevenness is easily obtained.
[0017] よって、溶液に用いる溶媒は乾燥速度があまり早いものは好ましくない。霧状になつ た液滴の大きさ、塗布雰囲気、ノズルと基板間の距離、等により一概には言えないが 、用いる溶液を構成する少なくとも 1つの溶媒の揮発性が低いことが好ましぐ具体的 にその沸点を、少なくとも 100°C、好適なのは 150°C、最も好適なのは 200°Cとする のが望ましい。  Therefore, it is not preferable that the solvent used in the solution has a very high drying rate. Although it cannot be unequivocally stated due to the size of the mist-like droplets, the coating atmosphere, the distance between the nozzle and the substrate, etc., it is preferable that at least one solvent constituting the solution to be used has low volatility. In particular, the boiling point should be at least 100 ° C, preferably 150 ° C, and most preferably 200 ° C.
[0018] 本発明で用いるマスクは、塗布液に溶解しない素材を用いるのが好ましい。例えば 、ステンレスなどの金属、ポリイミドなどの榭脂が好適である。  [0018] The mask used in the present invention is preferably made of a material that does not dissolve in the coating solution. For example, a metal such as stainless steel or a resin such as polyimide is suitable.
[0019] マスク一基板間のギャップは、少なくとも基板に到達する直前の液滴の大きさ以上 であればよい。ギャップが大きすぎると、マスクに斜めに入射した液滴によってパター ンがぼけてしまい好ましくない。ギャップの大きさは、好ましくはマスク開口部の寸法 の 1Z10以下もしくは lmm以下、最も好ましくはマスク開口部の寸法の lZlOO以下 もしくは 0. 1mm以下とすることが望ましい。 [0019] The gap between the mask and the substrate may be at least larger than the size of the droplet immediately before reaching the substrate. If the gap is too large, it is not preferable because the pattern is blurred by droplets incident obliquely on the mask. The size of the gap is preferably 1Z10 or less of the dimension of the mask opening or lmm or less, most preferably lZlOO or less of the dimension of the mask opening. Or 0.1mm or less is desirable.
[0020] 液滴の大きさは、例えば、レーザー光を用いて測定することができる。基板に到達 する直前の液滴の大きさを測定するのは困難な場合が多いため、代わりに、ノズルか ら飛び出した直後の液滴の大きさを用いても差し支えな 、。ノズル力 飛び出した液 滴は、基板に到達するまでに乾燥し小さくなることはあっても、大きくなることはないか らである。 [0020] The size of the droplet can be measured, for example, using laser light. Since it is often difficult to measure the size of a droplet just before it reaches the substrate, it is possible to use the size of the droplet just after it ejects from the nozzle. This is because the droplets ejected from the nozzle force are dried and become small before reaching the substrate, but they do not become large.
[0021] ノズルを飛び出した直後の液滴の大きさは、溶液の種類やスプレー条件によりー概 には言えないが、一般に、 1〜： LOOO /z mである。ノズルを飛び出した直後の液滴の 大きさは、小さすぎると液滴が基板に到達する時点で乾いて流動性を失ってしまい、 レべリングが不十分となり、均一な膜が形成できなくなる。一方、ノズルを飛び出した 直後の液滴の大きさが、大きすぎると、マスク一基板間のギャップを大きく取らなくて はならない。ノズルを飛び出した直後の液滴の大きさは、好ましくは 10〜： LOO /z mと するのが望ましい。  [0021] The size of the droplet immediately after ejecting from the nozzle cannot be generally stated depending on the type of solution and spray conditions, but is generally 1 to: LOOO / zm. If the size of the droplet immediately after ejecting the nozzle is too small, the droplet will dry and lose fluidity when it reaches the substrate, resulting in insufficient leveling and a uniform film cannot be formed. On the other hand, if the size of the droplet immediately after ejecting the nozzle is too large, a large gap between the mask and the substrate must be taken. The size of the droplet immediately after ejecting the nozzle is preferably 10 to: LOO / zm.
[0022] 一般に、液滴の大きさは、一定の大きさではなぐある幅を持って正規分布に近い 分布を持つ。その際は、観測された液滴のうち最も大きいものを基準に、ギャップをそ れ以上にするのが望ましい。ただし、液滴大きさの分布の、平均値 + 3 σの値を基準 として、ギャップをそれ以上にすることでも差し支えない。  [0022] Generally, the size of a droplet has a distribution close to a normal distribution with a certain width at a certain size. In that case, it is desirable to make the gap larger than the largest observed droplet. However, the gap may be larger than the average of the droplet size distribution + 3σ.
[0023] マスク―基板間のギャップを調整する方法は、任意で構わな!/、。 [0023] Any method may be used to adjust the gap between the mask and the substrate!
[0024] 例えば、図 3のようにマスクを保持し、上下に移動することのできる機構を設けること 力 Sできる。図示していないが、マスク一基板間の距離をセンサーで感知し、ギャップ が本発明の範囲になるよう、ギャップ調整機構によってマスクを上下する。マスク一基 板間のギャップセンサーは任意でよいが、例えば、フォトレジストの露光装置でフォト マスク一基板間のギャップ測定によく用いられる、光学式のセンサなどを利用しても 良い。 For example, as shown in FIG. 3, it is possible to provide a mechanism S that can hold the mask and move up and down. Although not shown, the distance between the mask and the substrate is detected by a sensor, and the mask is moved up and down by a gap adjusting mechanism so that the gap is within the scope of the present invention. The gap sensor between the mask and the substrate may be arbitrary, but for example, an optical sensor that is often used for measuring the gap between the photomask and the substrate in a photoresist exposure apparatus may be used.
[0025] 図 3では、マスクを上下しギャップの調整を行った力 基板を上下しても、マスクと基 板の両方を動力してもよい。  [0025] In FIG. 3, the mask is moved up and down to adjust the gap. The substrate may be moved up and down, or both the mask and the substrate may be powered.
[0026] マスク一基板間のギャップを、液滴の直径以上としたので、飛来した液滴がマスク 裏面と基板表面の両側に接触し、毛管現象でマスク一基板間に浸入することを防止 できる。 [0026] Since the gap between the mask and the substrate is equal to or greater than the diameter of the droplet, the droplets that come in contact with the mask back surface and both sides of the substrate surface are prevented from entering between the mask and the substrate due to capillary action. it can.
[0027] 「有機 EL素子」  [0027] "Organic EL device"
図 2に図 1の製造装置により製造された有機 EL素子の構造を示す。有機 EL素子 は、発光機能層が主に有機物力 なり、陽極からホール (正孔）が、陰極から電子が 注入され、発光層で再結合し発光する。有機 EL素子の有機機能層は通常、ホール 注入層 Zホール輸送層 Z発光層 Z電子輸送層 Z電子注入層など、それぞれの機 能を持つ複数の層からなる。これら各々の有機機能層は通常、有機物からなり、更に 、低分子の有機物からなる場合、高分子の有機物からなる場合がある。低分子の有 機物からなる有機機能層は一般に蒸着法等のドライプロセス (真空プロセス）によつ て、高分子の有機物力 なる有機機能層は一般にスピンコート法、ブレードコート法、 ディップ法、スプレー法そして印刷法等のウエットプロセスによって、それぞれ形成さ れるのが一般的である。  Fig. 2 shows the structure of the organic EL device manufactured by the manufacturing equipment shown in Fig. 1. In an organic EL element, the light emitting functional layer is mainly made of organic material, holes are injected from the anode, electrons are injected from the cathode, and recombined in the light emitting layer to emit light. The organic functional layer of an organic EL device usually consists of multiple layers with each function, such as hole injection layer, Z hole transport layer, Z light-emitting layer, Z electron transport layer, and Z electron injection layer. Each of these organic functional layers is usually made of an organic material, and may be made of a high molecular weight organic material when it is made of a low molecular weight organic material. Organic functional layers made of low molecular organic materials are generally produced by a dry process (vacuum process) such as vapor deposition, while organic functional layers made of high molecular organic materials are generally produced by spin coating, blade coating, dipping, In general, they are formed by wet processes such as spraying and printing.
[0028] 有機溶媒に可溶な有機物カゝらなる有機機能層の例が、例えば、特開 2003— 746 11に示されている。特開 2003— 7461、 6頁「0023」〜「0024」には、有機機會層に 用いる高分子材料として、 PEDOT、ポリア-リン、ポリパラフエ-レンビ-レン誘導体 、ポリチォフェン誘導体、ポリパラフエ-レン誘導体、ポリアルキルフエ-レン、ポリア セチレン誘導体、などが挙げられている。更に特開 2003— 7461、 7頁「0031」によ ると、これらの高分子材料は、トルエン、ベンゼン、クロ口ベンゼン、ジクロロベンゼン、 クロ口ホルム、テトラリン、キシレン、ァニソール、ジクロロメタン、 yブチロラタトン、ブチ ルセルソルブ、シクロへキサン、 NMP (N—メチル 2—ピロリドン）、ジメチルスルホ キシド、シクロへキサノン、ジォキサンまたは、 THF (テトラヒドロフラン)等の溶媒から 選ばれた 1種または複数種、に前駆体を溶解し、スピンコート法で成膜される。 [0028] An example of an organic functional layer made of an organic substance soluble in an organic solvent is disclosed in, for example, JP-A-2003-74611. JP 2003-7461, pp. 0023 to “0024” on page 6, PEDOT, polyarine, polyparaphenylene-biylene derivatives, polythiophene derivatives, polyparaphenylene derivatives, poly Examples include alkylphenolene and polyacetylene derivatives. Further, according to JP-A-2003-7461, page 7, “0031”, these polymer materials are toluene, benzene, black benzene, dichlorobenzene, black form, tetralin, xylene, anisole, dichloromethane, y butyrolatathone, The precursor is dissolved in one or more selected from solvents such as butyralsolvol, cyclohexane, NMP (N-methyl 2-pyrrolidone), dimethyl sulfoxide, cyclohexanone, dioxane or THF (tetrahydrofuran). And it forms into a film by a spin coat method.
[0029] これら有機機能層は、既知のあらゆる成膜法を用いて形成することができる。特に 可溶な有機物力もなる有機機能層は、ウエットプロセスによって形成する事ができる。 ウエットプロセスで形成する場合は、通常、材料を溶媒に溶解した塗布液を用いる。 溶媒としては、前述の溶媒の他、 PGME (propyleneglycol monomethyl ether)、 PGME A propyleneglycol monomethyl ether acetateリ、孚 L酸ェチノレ、 DMAc (N.N— dimethyla cetamide)、 MEK (methyl ethyl ketone)、 MIBK (methyl isobutyl ketone)、 I PA (iso pr opyl alcohol)、エタノール等、既知の溶剤を用いる事ができる。 [0029] These organic functional layers can be formed using any known film forming method. In particular, an organic functional layer that also has soluble organic strength can be formed by a wet process. When forming by a wet process, a coating solution in which a material is dissolved in a solvent is usually used. As the solvent, in addition to the above-mentioned solvents, PGME (propyleneglycol monomethyl ether), PGME A propyleneglycol monomethyl ether acetate, 孚 L acid ethynole, DMAc (NN-dimethyla cetamide), MEK (methyl ethyl ketone), MIBK (methyl isobutyl ketone) ), I PA (iso pr Known solvents such as opyl alcohol) and ethanol can be used.
[0030] 以上のように、従来の有機 EL素子やそれを用いた表示パネルでは、有機機能層を ウエットプロセスで形成することがでさる。 [0030] As described above, in a conventional organic EL element and a display panel using the same, the organic functional layer can be formed by a wet process.
[0031] ウエットプロセスのうち、特に簡便に成膜できる方法として、例えばスプレー法がある 。スプレー法は、例えば特開 2001— 297876の図 1に開示される通り、ノズル力 溶 液を霧状にして基板に吹き付けて成膜する方法である。一般に、有機機能層は所定 の形状にパターユングする必要がある力 例えば、特開 2001— 297876の図 2の様 な方法を用いることができる。特開 2001— 297876の図 2の方法では、同文献「002 8」に記載されるように、赤、緑、青色の発光パターンに合わせたマスクや、それに限 らず、発光色、発光形状による複数のマスクを交換して成膜できる技術が開示される 。この方法では、発光形状の異なったマスクをマスク板収納室に備え、マスク板交換 ロボットにより、適宜、パターンの違うマスクを交換することにより、様々なパターン表 示が可能な有機 EL素子を作製することが可能とされる。  [0031] Among the wet processes, there is a spray method, for example, as a method capable of forming a film in a particularly simple manner. The spray method is a method of forming a film by spraying a nozzle force solution in the form of a mist, for example, as disclosed in FIG. 1 of JP-A-2001-297876. In general, the organic functional layer needs to be patterned into a predetermined shape. For example, a method as shown in FIG. 2 of JP-A-2001-297876 can be used. In the method of FIG. 2 of Japanese Patent Laid-Open No. 2001-297876, as described in “002 8” of the same document, it is not limited to a mask matched to a red, green, and blue light emission pattern, and is not limited to this. A technique capable of forming a film by exchanging a plurality of masks is disclosed. In this method, masks with different light emission shapes are provided in the mask plate storage chamber, and the mask plate exchange robot replaces the masks with different patterns as appropriate to produce organic EL elements that can display various patterns. It is possible.
[0032] 上記で示されるように本実施形態では、従来技術では、マスク一基板間のギャップ について、全く注意を払っていないのに対し、本発明では、マスク—基板間のギヤッ プを、スプレーによって霧化された液滴の直径以上となるよう、積極的かつ精密に制 御する。  [0032] As shown above, in the present embodiment, the conventional technique pays no attention to the gap between the mask and the substrate, whereas in the present invention, the gap between the mask and the substrate is sprayed. Actively and precisely control the diameter of the droplets atomized by.
[0033] 次に、本実施形態の変形例について説明する。  Next, a modification of the present embodiment will be described.
[0034] 「他のギャップ調整機構」 [0034] "Other gap adjustment mechanism"
図 5のように、本発明による有機 EL製造装置に、マスク一基板間に挿入するスぺー サーを具備していても良い。ギャップの調整は、厚さの異なる複数種のスぺーサーを 用意しておけばよい。スぺーサーを挿入するだけなので、機構が単純であり、装置の コストを安くできる。  As shown in FIG. 5, the organic EL manufacturing apparatus according to the present invention may be provided with a spacer inserted between a mask and a substrate. To adjust the gap, it is sufficient to prepare multiple types of spacers with different thicknesses. Since only the spacer is inserted, the mechanism is simple and the cost of the device can be reduced.
[0035] 「液滴観察装置」 [0035] "Droplet observation device"
図 6のように、本発明による有機 EL製造装置に、液滴を観察する装置を具備しても 良い。  As shown in FIG. 6, the organic EL manufacturing apparatus according to the present invention may be provided with an apparatus for observing droplets.
[0036] 液滴の入れ替えや、スプレー条件の変更により、液滴の大きさが変わってしまう。よ つて、液滴を観察する装置があれば、マスク—基板間のギャップを迅速に決定できる [0037] リアルタイムで液滴を観察し液滴の直径を測定、測定した結果に応じて、マスク 基板間のギャップを最も小さくできるよう、ギャップ調整機構により制御することにより、 更に、パターン精度の高い塗布を行うことができる。ギャップをリアルタイムに必要最 小限に制御できるので、パターン精度良く有機機能層を形成できる。 [0036] The size of the droplet changes due to the replacement of the droplet or the change of the spray conditions. Therefore, if there is a device for observing droplets, the mask-substrate gap can be determined quickly. [0037] By observing the droplet in real time and measuring the diameter of the droplet, and controlling the gap adjustment mechanism so that the gap between the mask and the substrate can be minimized, the pattern accuracy is further improved. Application can be performed. Since the gap can be controlled to the minimum necessary in real time, the organic functional layer can be formed with good pattern accuracy.
[0038] 「スプレー用マスクの改良」  [0038] "Improved spray mask"
図 4のように、マスク側にギャップの調整機能を具備させることもできる。図 4のマスク は、液滴の直径よりも大きく突出する凸部 (支持体)を有している。凸部は基板に突き 当たるように形成すれば、どの位置にあっても良い。例えば、図のように、マスクの遮 蔽部の一部に形成しても良い。従来のスプレー用マスクは、単純な平板形状である。 それに対し、本発明によるスプレー用マスクは凸部を有している。それにより、塗布装 置にギャップの調整機構を具備する必要がなくなる。  As shown in FIG. 4, it is possible to provide a gap adjusting function on the mask side. The mask in FIG. 4 has a protrusion (support) that protrudes larger than the diameter of the droplet. As long as the convex portion is formed so as to abut against the substrate, it may be at any position. For example, as shown in the figure, it may be formed on a part of the mask shielding portion. A conventional spray mask has a simple flat plate shape. On the other hand, the spray mask according to the present invention has a convex portion. This eliminates the need for the gap adjusting mechanism in the coating apparatus.
[0039] 前記ギャップの厚さを、前記貫通した部分の最も短い開口径の 1Z10以下とすると 好適であるがこれに限られな 、。  [0039] The thickness of the gap is preferably 1Z10 or less of the shortest opening diameter of the penetrating portion, but is not limited thereto.
[0040] また、本実施形態では、前記ギャップの厚さを、前記貫通した部分の最も短い開口 径の 1Z100以下とすると好適であるがこれに限られない。前記ギャップの厚さを、 1 mm以下とすると好適であるがこれに限られない。前記ギャップの厚さを、 0. 1mm以 下とすると好適であるがこれに限られな 、。  [0040] In the present embodiment, the thickness of the gap is preferably 1Z100 or less, which is the shortest opening diameter of the penetrating portion, but is not limited thereto. The thickness of the gap is preferably 1 mm or less, but is not limited thereto. The thickness of the gap is preferably 0.1 mm or less, but is not limited thereto.
[0041] 本実施形態では、前記液滴の直径の値として、前記液滴の直径の略最大値を用い ると好適であるがこれに限られない。前記液滴の直径の値として、前記液滴の直径の 平均値 + 3 σの値を用いると好適であるがこれに限られない。前記液滴の直径を測 定し、測定結果に基づき前記ギャップの厚さを調整すると好適であるがこれに限られ ない。  In the present embodiment, it is preferable to use the substantially maximum value of the diameter of the droplet as the value of the diameter of the droplet, but the present invention is not limited to this. The value of the droplet diameter is preferably the average value of the droplet diameters + 3σ, but is not limited thereto. Although it is preferable to measure the diameter of the droplet and adjust the thickness of the gap based on the measurement result, the present invention is not limited to this.
[0042] 本実施形態では、前記被塗布材が半導体基板、有機トランジスタ基板、有機 EL素 子構成層のうち少なくとも一つであると好適であるがこれに限られない。前記有機 EL 素子構成層は、基板、陽極、有機機能層の各層、陰極、基板側の保護バリア膜、封 止膜のうち少なくとも 1層であると好適であるがこれに限られない。前記塗布物が揮発 性の低!ヽ溶媒成分を含む（乾燥しにく!/ヽ）と好適であるがこれに限られな!/、。  In the present embodiment, the material to be coated is preferably at least one of a semiconductor substrate, an organic transistor substrate, and an organic EL device constituent layer, but is not limited thereto. The organic EL device component layer is preferably at least one of the substrate, anode, organic functional layer, cathode, protective barrier film on the substrate side, and sealing film, but is not limited thereto. It is preferable that the coating material contains a low-volatile solvent component (it is difficult to dry! / ヽ), but is not limited to this.

Claims

請求の範囲 The scope of the claims
[1] 塗布物が被塗布材表面に塗布される対応箇所が貫通し、被塗布材表面に塗布さ れることを防止する対応箇所が非貫通してなるマスクパターンが形成された表面マス クで被塗布材表面を覆 ヽ、前記表面マスクを通じて噴射ノズルから前記塗布物を噴 射し、塗布してなる塗布物表面塗布材の製造方法であって、  [1] A surface mask on which a mask pattern is formed in which a corresponding portion where the coated material is applied to the surface of the material to be coated penetrates and a corresponding portion which prevents the coated material from being applied to the surface of the material to be coated is not penetrated. A method of manufacturing a coating material surface coating material, covering a surface of a coating material, spraying the coating material from a spray nozzle through the surface mask, and applying the coating material,
前記被塗布材表面から前記表面マスクの背面との間を離すことで、前記噴射される 塗布物の液滴の直径よりも大きな厚さのギャップを形成し、  By separating between the surface of the material to be coated and the back surface of the surface mask, a gap having a thickness larger than the diameter of the droplet of the sprayed coating is formed,
前記ギャップの形成後、前記塗布物を噴射し、塗布する塗布物表面塗布材の製造 方法。  A method for producing a coating material surface coating material, wherein the coating material is sprayed and applied after the gap is formed.
[2] 請求項 1に記載の塗布物被塗布材の製造方法であって、  [2] A method for producing a coated material to be coated according to claim 1,
前記ギャップの厚さを、前記貫通した開口部の最も短い開口径の lZio以下とする 塗布物表面塗布材の製造方法。  The manufacturing method of the coating material surface coating material which makes thickness of the said gap below lZio of the shortest opening diameter of the said through-opening part.
[3] 請求項 2に記載の塗布物被塗布材の製造方法であって、  [3] A method for producing a coated material according to claim 2,
前記ギャップの厚さを、前記貫通した開口部の最も短い開口径の 1Z100以下とす る塗布物表面塗布材の製造方法。  A method for producing a coating material surface coating material, wherein the thickness of the gap is 1Z100 or less of the shortest opening diameter of the through-opening.
[4] 請求項 1から 3の 、ずれ力 1つに記載の塗布物被塗布材の製造方法であって、 前記ギャップの厚さを、 1mm以下とする塗布物表面塗布材の製造方法。 [4] The method for producing a coated material to be coated according to any one of claims 1 to 3, wherein the gap has a thickness of 1 mm or less.
[5] 請求項 1から 4の 、ずれ力 1つに記載の塗布物被塗布材の製造方法であって、 前記ギャップの厚さを、 0. 1mm以下とする塗布物表面塗布材の製造方法。 [5] The method for producing a coated material according to any one of claims 1 to 4, wherein the gap has a thickness of 0.1 mm or less. .
[6] 請求項 1から 5の 、ずれ力 1つに記載の塗布物被塗布材の製造方法であって、 前記液滴の直径の値として、前記液滴の直径の略最大値を用いる塗布物表面塗 布材の製造方法。 [6] The method for producing a material to be coated according to claim 1, wherein the displacement force is one, wherein the substantially maximum value of the diameter of the droplet is used as the value of the diameter of the droplet. Manufacturing method of material surface coating material.
[7] 請求項 1から 5のいずれ力 1つに記載の塗布物被塗布材の製造方法であって、 前記液滴の直径の値として、前記液滴の直径の平均値 + 3 σの値を用いる塗布物 表面塗布材の製造方法。  [7] The method for producing a coated material according to any one of claims 1 to 5, wherein the value of the diameter of the droplets is a value of an average value of the droplet diameters + 3σ. A method for producing a surface coating material.
[8] 請求項 1から 7の 、ずれ力 1つに記載の塗布物被塗布材の製造方法であって、 前記液滴の直径を測定し、測定結果に基づき前記ギャップの厚さを調整する塗布 物被塗布材の製造方法。 [8] The method for manufacturing a material to be coated according to claim 1, wherein the displacement force is measured by measuring the diameter of the droplet and adjusting the thickness of the gap based on the measurement result. Method for producing coated material.
[9] 請求項 1から 8の 、ずれ力 1つに記載の塗布物被塗布材の製造方法であって、 前記被塗布材が半導体基板、有機トランジスタ基板、有機 EL素子構成層のうち少 なくとも一つである塗布物被塗布材の製造方法。 [9] The method for manufacturing a coated material to be coated according to one of claims 1 to 8, wherein the coated material is at least one of a semiconductor substrate, an organic transistor substrate, and an organic EL element constituent layer. The manufacturing method of the material to be coated is one.
[10] 請求項 9に記載の塗布物被塗布材の製造方法であって、 [10] A method for producing a coated material according to claim 9,
前記有機 EL素子構成層は、基板、陽極、有機機能層の各層、陰極、基板側の保 護バリア膜、封止膜のうち少なくとも 1層である塗布物被塗布材の製造方法。  The organic EL element constituent layer is a method for producing a coated material to be coated, which is at least one layer of a substrate, an anode, organic functional layers, a cathode, a protective barrier film on the substrate side, and a sealing film.
[11] 請求項 1から 10のいずれ力 1つに記載の塗布物被塗布材の製造方法であって、 前記塗布物が揮発性の低い溶媒成分を含む塗布物被塗布材の製造方法。 [11] The method for producing a coated material to be coated according to any one of claims 1 to 10, wherein the coated material includes a solvent component having low volatility.
[12] 請求項 1から 11のいずれ力 1つに記載の塗布物被塗布材の製造方法であって、 前記被塗布材表面上の前記表面マスクについて、前記ギャップを形成するように支 持する塗布物被塗布材の製造方法。 [12] The method for producing a coated material to be coated according to any one of claims 1 to 11, wherein the surface mask on the surface of the coated material is supported so as to form the gap. Manufacturing method of coated material.
[13] 請求項 12に記載の塗布物被塗布材の製造方法であって、 [13] A method for producing a coated material to be coated according to claim 12,
前記支持は、前記表面マスクの背面に設けられた凸部が前記被塗布材表面と接す ることで支持される塗布物被塗布材の製造方法。  The said support is a manufacturing method of the coating material coating material supported by the convex part provided in the back surface of the said surface mask contacting the said coating material surface.
[14] 請求項 1から 13のいずれ力 1つに記載の塗布物被塗布材の製造方法であって、 前記ギャップは、その厚さが調整可能な塗布物被塗布材の製造方法。 [14] The method for manufacturing a coated material according to any one of [1] to [13], wherein the gap has an adjustable thickness.
[15] 塗布物が被塗布材表面に塗布される対応箇所が貫通し、被塗布材表面に塗布さ れることを防止する対応箇所が非貫通してなるマスクパターンが形成された表面マス クで被塗布材表面を覆 ヽ、前記表面マスクを通じて噴射ノズルから前記塗布物を噴 射し、塗布してなる塗布物表面塗布材の製造装置であって、 [15] A surface mask on which a mask pattern is formed in which a corresponding portion where the coated material is applied to the surface of the material to be coated penetrates and a corresponding portion which prevents the coated material from being applied to the surface of the material to be coated is not penetrated. An apparatus for manufacturing a coating material surface coating material, covering a surface of a coating material, spraying the coating material from a spray nozzle through the surface mask, and applying the coating material.
前記被塗布材表面から前記表面マスクの背面との間を離すことで、前記噴射される 塗布物の液滴の直径よりも大きな厚さのギャップを形成し、  By separating between the surface of the material to be coated and the back surface of the surface mask, a gap having a thickness larger than the diameter of the droplet of the sprayed coating is formed,
前記ギャップの形成後、前記塗布物を噴射し、塗布する塗布物表面塗布材の製造 装置。  An apparatus for manufacturing a coating material surface coating material, which sprays and coats the coating material after forming the gap.
[16] 請求項 15に記載の塗布物被塗布材の製造装置であって、  [16] The apparatus for manufacturing a material to be coated according to claim 15,
前記ギャップの厚さを、前記貫通した開口部の最も短い開口径の 1Z10以下とする 塗布物表面塗布材の製造装置。  The apparatus for manufacturing a coated material surface coating material, wherein the gap has a thickness of 1Z10 or less, which is the shortest opening diameter of the through opening.
[17] 請求項 16に記載の塗布物被塗布材の製造装置であって、 前記ギャップの厚さを、前記貫通した開口部の最も短い開口径の lZioo以下とす る塗布物表面塗布材の製造装置。 [17] The apparatus for manufacturing a coated material according to claim 16, An apparatus for manufacturing a coating material surface coating material, wherein the gap has a thickness equal to or less than lZioo of the shortest opening diameter of the through opening.
[18] 請求項 15から 17のいずれか 1つに記載の塗布物被塗布材の製造装置であって、 前記ギャップの厚さを、 1mm以下とする塗布物表面塗布材の製造装置。  [18] The apparatus for manufacturing a coated material to be coated according to any one of [15] to [17], wherein the gap has a thickness of 1 mm or less.
[19] 請求項 15から 18のいずれか 1つに記載の塗布物被塗布材の製造装置であって、 前記ギャップの厚さを、 0. 1mm以下とする塗布物表面塗布材の製造装置。  [19] The apparatus for manufacturing a coated material to be coated according to any one of [15] to [18], wherein the gap has a thickness of 0.1 mm or less.
[20] 請求項 15から 19のいずれか 1つに記載の塗布物被塗布材の製造装置であって、 前記液滴の直径の値として、前記液滴の直径の略最大値を用いる塗布物表面塗 布材の製造装置。  [20] The apparatus for manufacturing a coated material to be coated according to any one of claims 15 to 19, wherein a substantially maximum value of the diameter of the droplet is used as the value of the diameter of the droplet. Manufacturing equipment for surface coating materials.
[21] 請求項 15から 19のいずれか 1つに記載の塗布物被塗布材の製造装置であって、 前記液滴の直径の値として、前記液滴の直径の平均値 + 3 σの値を用いる塗布物 表面塗布材の製造装置。  [21] The apparatus for manufacturing a material to be coated according to any one of claims 15 to 19, wherein the value of the diameter of the droplets is a value of an average value of the droplets + 3σ. Coating material using a surface coating material manufacturing device.
[22] 請求項 15から 21のいずれか 1つに記載の塗布物被塗布材の製造装置であって、 前記液滴の直径を測定し、測定結果に基づき前記ギャップの厚さを調整する塗布 物被塗布材の製造装置。 [22] The apparatus for manufacturing a material to be coated according to any one of claims 15 to 21, wherein the diameter of the droplet is measured and the thickness of the gap is adjusted based on the measurement result. Equipment for manufacturing object coating materials.
[23] 請求項 15から 22のいずれか 1つに記載の塗布物被塗布材の製造装置であって、 前記被塗布材が半導体基板、有機トランジスタ基板、有機 EL素子構成層のうち少 なくとも一つである塗布物被塗布材の製造装置。 [23] The apparatus for manufacturing a coated material to be coated according to any one of claims 15 to 22, wherein the coated material is at least one of a semiconductor substrate, an organic transistor substrate, and an organic EL element constituent layer. An apparatus for manufacturing a coated material to be coated.
[24] 請求項 23に記載の塗布物被塗布材の製造装置であって、 [24] The device for manufacturing a coated material according to claim 23,
前記有機 EL素子構成層は、基板、陽極、有機機能層の各層、陰極、基板側の保 護バリア膜、封止膜のうち少なくとも 1層である塗布物被塗布材の製造装置。  The organic EL device component layer is a manufacturing apparatus for a coated material to be coated, which is at least one of a substrate, an anode, organic functional layers, a cathode, a protective barrier film on the substrate side, and a sealing film.
[25] 請求項 15から 24のいずれか 1つに記載の塗布物被塗布材の製造装置であって、 前記塗布物が揮発性の低い溶媒成分を含む塗布物被塗布材の製造装置。 [25] The apparatus for manufacturing a coated material to be coated according to any one of claims 15 to 24, wherein the coated material includes a solvent component having low volatility.
[26] 請求項 15から 25のいずれか 1つに記載の塗布物被塗布材の製造装置であって、 前記被塗布材表面上の前記表面マスクについて、前記ギャップを形成するように支 持する塗布物被塗布材の製造装置。 [26] The apparatus for manufacturing a coated material to be coated according to any one of claims 15 to 25, wherein the surface mask on the surface of the coated material is supported so as to form the gap. Manufacturing equipment for coated material.
[27] 請求項 26に記載の塗布物被塗布材の製造装置であって、 [27] The apparatus for manufacturing a coated material according to claim 26,
前記支持は、前記表面マスクの背面に設けられた凸部が前記被塗布材表面と接す ることで支持される塗布物被塗布材の製造装置。 The support is such that a convex portion provided on the back surface of the surface mask contacts the surface of the material to be coated. The manufacturing apparatus of the coating material to be coated supported by this.
[28] 請求項 15から 27のいずれか 1つに記載の塗布物被塗布材の製造装置であって、 前記ギャップは、その厚さが調整可能な塗布物被塗布材の製造装置。  [28] The apparatus for manufacturing an application material to be coated according to any one of [15] to [27], wherein the gap has an adjustable thickness.
[29] 被塗布材表面を覆 ヽ、噴射ノズルカゝら塗布物を噴射し、塗布してなる塗布物表面 塗布材の製造方法に用いられ、前記塗布物が前記被塗布材表面に塗布される対応 箇所が貫通し、被塗布材表面に塗布されることを防止する対応箇所が非貫通してな るマスクパターンが形成された表面マスクであって、  [29] The surface of the material to be coated is covered, sprayed and sprayed on the surface of the material to be coated, and applied to the surface of the material to be coated. A surface mask on which a mask pattern is formed in which a corresponding portion is prevented from penetrating and applied to the surface of a material to be coated.
前記被塗布材表面と前記表面マスクの背面との間に、前記噴射される塗布物の液 滴の直径よりも大きな厚さのギャップを形成するように支持する支持体が設けられた 表面マスク。  A surface mask provided with a support that supports a gap having a thickness larger than a diameter of a droplet of the sprayed applied material between the surface of the material to be coated and the back surface of the surface mask.
[30] 請求項 29に記載の表面マスクであって、  [30] The surface mask according to claim 29,
前記支持体は、前記表面マスクの背面に設けられた凸部である表面マスク。  The said support is a surface mask which is a convex part provided in the back surface of the said surface mask.
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