JP5421352B2 - Method and apparatus for manufacturing coated material - Google Patents
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- JP5421352B2 JP5421352B2 JP2011289725A JP2011289725A JP5421352B2 JP 5421352 B2 JP5421352 B2 JP 5421352B2 JP 2011289725 A JP2011289725 A JP 2011289725A JP 2011289725 A JP2011289725 A JP 2011289725A JP 5421352 B2 JP5421352 B2 JP 5421352B2
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/16—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
- B05B12/20—Masking elements, i.e. elements defining uncoated areas on an object to be coated
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/32—Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
- Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Description
本発明は、塗布物被塗布材の製造方法および製造装置、特に塗布物が被塗布材表面に塗布される対応箇所が貫通し、被塗布材表面に塗布されることを防止する対応箇所が非貫通してなるマスクパターンが形成された表面マスクで被塗布材表面を覆い、前記表面マスクを通じて噴射ノズルから前記塗布物を噴射し、塗布してなる塗布物被塗布材の製造方法および製造装置に関する。 The present invention relates to a manufacturing method and a manufacturing apparatus for a coated material to be coated, and in particular, a corresponding portion where the coated material is applied to the surface of the coated material is penetrated and the corresponding portion for preventing the coated material from being coated on the surface of the coated material is not present. The present invention relates to a manufacturing method and a manufacturing apparatus for a coated material to be coated, in which the surface of a material to be coated is covered with a surface mask formed with a penetrating mask pattern, the coating material is sprayed from a spray nozzle through the surface mask and applied. .
塗布物が被塗布材表面に塗布される対応箇所が貫通し、被塗布材表面に塗布されることを防止する対応箇所が非貫通してなるマスクパターンが形成された表面マスクで被塗布材表面を覆い、前記表面マスクを通じて噴射ノズルから前記塗布物を噴射し、塗布してなる塗布物被塗布材の製造方法が報告されている。 The surface of the material to be coated is a surface mask on which a mask pattern is formed in which the corresponding portion where the coated material is applied to the surface of the material to be coated is penetrated and the corresponding portion is prevented from being coated on the surface of the material to be coated. A method for producing a coated material to be coated, which is obtained by spraying the coated material from a spray nozzle through the surface mask and applying the coated material, has been reported.
例えば、塗布物被塗布材の製造方法として、有機EL素子の製造方法が挙げられる。ノズルから塗布材料を噴射し、マスクを用いて、有機機能層を所定の形状に形成する技術は、下記特許文献1の他、下記特許文献2、下記特許文献3などに開示されている。 For example, the manufacturing method of an organic electroluminescent element is mentioned as a manufacturing method of a coating material coating material. Techniques for injecting a coating material from a nozzle and forming an organic functional layer into a predetermined shape using a mask are disclosed in the following Patent Document 2, the following Patent Document 3, and the like in addition to the following Patent Document 1.
下記特許文献2では、有機化合物の分散粒子を含む組成物を不活性ガスで噴射させ、マスクの開口部を通過させることにより、所定の形状の有機機能層を形成する技術が開示される。 Patent Document 2 below discloses a technique for forming an organic functional layer having a predetermined shape by injecting a composition containing dispersed particles of an organic compound with an inert gas and passing the composition through an opening of a mask.
また、下記特許文献3には、真空雰囲気中で、高分子系EL材料を溶解した溶液をスプレー状に噴出する有機機能層の形成方法が開示される。同文献段落「0034」には画素塗り分けマスクを用いて赤色の発光層を形成した後、同マスクを所定量ずらし、順次、青色、緑色の発光層を形成する技術が記載される。 Patent Document 3 below discloses a method for forming an organic functional layer in which a solution in which a polymer EL material is dissolved is sprayed in a vacuum atmosphere. Paragraph “0034” of the same document describes a technique in which a red light emitting layer is formed using a pixel coating mask, and then the mask is shifted by a predetermined amount to sequentially form blue and green light emitting layers.
しかしながら、上記特許文献は、1枚の同一の基板上に、複数回、異なったマスク、もしくは異なったマスク位置で、マスクを置載して、有機機能層を異なったパターンで順次積層する技術である。また、上記の従来技術は、発光色、もしくは発光パターンが変わらない限りは、マスク交換を行わない。 However, the above-mentioned patent document is a technique in which a plurality of organic functional layers are sequentially stacked in different patterns by placing a mask on a single substrate multiple times at different masks or at different mask positions. is there. Further, the above-described conventional technique does not perform mask replacement unless the emission color or the emission pattern is changed.
上記特許文献は、マスクに付着した溶液の影響を考慮しておらず、マスク上に流動性を保ったまま付着する溶液が、マスクから基板などにこぼれ落ち、周囲を汚染することを防ぐことができなかった。よって、大量の基板を連続して成膜するのは困難であった。 The above-mentioned patent document does not consider the influence of the solution attached to the mask, and the solution attached to the mask while maintaining fluidity can be prevented from spilling from the mask onto the substrate and contaminating the surroundings. There wasn't. Therefore, it has been difficult to continuously form a large number of substrates.
本発明は、上記課題に鑑みてなされたものであり、より被塗布材表面の汚染を防止などした塗布物被塗布材の製造方法および製造装置を提供することを主な目的とする。 This invention is made | formed in view of the said subject, and makes it a main objective to provide the manufacturing method and manufacturing apparatus of the coating material coating material which prevented the contamination of the coating material surface more.
本発明は、塗布物が被塗布材表面に塗布される対応箇所が貫通し、被塗布材表面に塗布されることを防止する対応箇所が非貫通してなるマスクパターンが形成された表面マスクで被塗布材表面を覆い、前記表面マスクを通じて噴射ノズルから前記塗布物を噴射し、塗布してなる塗布物被塗布材の製造方法であって、第一の表面マスクを被塗布材表面に覆い、前記被塗布材表面へ塗布後、前記被塗布材表面の前記第一の表面マスクを外し、第二の表面マスクを覆うことで塗布してなることを含むことを特徴とする。 The present invention is a surface mask on which a mask pattern is formed in which a corresponding portion where a coating is applied to the surface of a material to be coated penetrates and a corresponding portion which prevents the coating from being applied to the surface of the material to be coated is non-penetrated. Covering the surface of the material to be coated, spraying the coating material from the spray nozzle through the surface mask, a method of manufacturing a material to be coated to be coated, covering the surface of the material to be coated, After application to the surface of the material to be coated, the first surface mask on the surface of the material to be coated is removed and applied by covering the second surface mask.
本発明は、塗布物が被塗布材表面に塗布される対応箇所が貫通し、被塗布材表面に塗布されることを防止する対応箇所が非貫通してなるマスクパターンが形成された表面マスクで被塗布材表面を覆い、前記表面マスクを通じて噴射ノズルから前記塗布物を噴射し、塗布してなる塗布物被塗布材の製造装置であって、第一の表面マスクを被塗布材表面に覆い、前記第被塗布材表面へ塗布後、前記被塗布材表面の前記第一の表面マスクを外し、第二の表面マスクを覆うことで塗布させることを含むことを特徴とする。 The present invention is a surface mask on which a mask pattern is formed in which a corresponding portion where a coating is applied to the surface of a material to be coated penetrates and a corresponding portion which prevents the coating from being applied to the surface of the material to be coated is non-penetrated. Covering the surface of the material to be coated, spraying the coating material from the spray nozzle through the surface mask, is a manufacturing apparatus of the material to be coated material coated, covering the surface of the material to be coated, After the application to the surface of the first material to be coated, the first surface mask on the surface of the material to be coated is removed and the second surface mask is covered to be applied.
以下、本発明の実施の形態を図面に基づいて説明する。なお、本実施形態については、本発明を実施するための一形態に過ぎず、本発明は本実施形態によって限定されるものではない。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, about this embodiment, it is only one form for implementing this invention, and this invention is not limited by this embodiment.
「有機EL素子の製造装置」
図1には塗布物が被塗布材表面に塗布される対応箇所が貫通し、被塗布材表面に塗布されることを防止する対応箇所が非貫通してなるマスクパターンが形成された表面マスクで被塗布材表面を覆い、前記表面マスクを通じて噴射ノズルから前記塗布物を噴射し、塗布してなる塗布物被塗布材の製造方法であって、第一の表面マスクを被塗布材表面に覆い、前記被塗布材表面へ塗布後、前記被塗布材表面の前記第一の表面マスクを外し、第二の表面マスクを覆うことで塗布してなる有機EL素子の製造装置が示される。
"Organic EL device manufacturing equipment"
FIG. 1 shows a surface mask formed with a mask pattern in which a corresponding portion where a coating is applied to the surface of a material to be coated penetrates and a corresponding portion which prevents the coating from being applied to the surface of a material to be coated is not penetrated. Covering the surface of the material to be coated, spraying the coating material from the spray nozzle through the surface mask, a method of manufacturing a material to be coated to be coated, covering the surface of the material to be coated, An apparatus for manufacturing an organic EL element is shown, which is applied by removing the first surface mask on the surface of the material to be coated and covering the second surface mask after coating on the surface of the material to be coated.
図1の有機EL素子の製造装置は、基板表面上に配置された表面マスク、表面マスク上に配置され、スプレー噴射して塗布するノズル、表面マスクを交換するマスク交換機構、交換用マスクが収納されるマスク収納部を含んでいる装置である。表面マスクには、塗布物が被塗布材表面に塗布される対応箇所が貫通して開口部が形成されている。基板上にはこの開口部を通じてのみノズルから噴射(噴出した溶液)が基板表面に塗布される。 The organic EL device manufacturing apparatus shown in FIG. 1 contains a surface mask disposed on the substrate surface, a nozzle that is disposed on the surface mask and sprayed and applied, a mask replacement mechanism that replaces the surface mask, and a replacement mask. It is the apparatus containing the mask accommodating part made. In the surface mask, corresponding portions where the coated material is applied to the surface of the material to be coated are penetrated to form openings. On the substrate, spray (solution ejected) from the nozzle is applied to the substrate surface only through the opening.
図1の装置は、以下の番号順に動作する。(1)基板を図示しない塗布ステージに導入する。(2)マスク交換機構により、マスクを位置合わせして、基板表面上に置載する。(3)ノズルから溶液を噴霧しスプレー塗布する。(4)マスク交換機構により、基板上から塗布に用いたマスクを除去する。(5)基板を塗布ステージから排出する。(6)(1)へ戻る。この工程(1)〜(5)を所定回数(1回でも良い)繰り返す。ここで、必要に応じ、マスクの汚れ状況をチェックしても良い。次に(7)マスク交換機構により、マスク収納部に収納される新たな別の同一形状のマスクを基板上に置載し、同様の工程により塗布する。 The apparatus of FIG. 1 operates in the following numerical order. (1) The substrate is introduced into a coating stage (not shown). (2) The mask is aligned by the mask exchange mechanism and placed on the substrate surface. (3) Spray the solution from the nozzle and spray. (4) The mask used for coating is removed from the substrate by the mask exchange mechanism. (5) The substrate is discharged from the coating stage. (6) Return to (1). These steps (1) to (5) are repeated a predetermined number of times (or once). Here, if necessary, the contamination status of the mask may be checked. Next, (7) a new mask having the same shape stored in the mask storage unit is placed on the substrate by the mask replacement mechanism, and is applied in the same process.
図1のように、本発明による有機ELの製造装置では、同一形状のマスクを、マスク収納部に収納し、それらを順次マスク交換機構を用いて、基板上に置載、塗布を行う。マスク収納部に収納するマスクは、少なくとも同一形状のマスクが1組あればよい。例えばパターンAのマスクを複数枚収納しても良いし、パターンAのマスクを複数枚、パターンBのマスクを複数枚収納するようにしても良い。
収納部から供給されるマスクは、塗布液で塗れていない状態のものとすると好適である。マスクの交換頻度は、1枚毎でも複数枚毎でも良い。また、本実施形態に係る製造装置を、ライン状に並べて、多層の有機EL素子を製造することが可能である。
As shown in FIG. 1, in the organic EL manufacturing apparatus according to the present invention, masks having the same shape are stored in a mask storage unit, and these are sequentially placed on a substrate and applied using a mask exchange mechanism. The mask stored in the mask storage section may be at least one set of masks having the same shape. For example, a plurality of masks of the pattern A may be stored, a plurality of masks of the pattern A, and a plurality of masks of the pattern B may be stored.
The mask supplied from the storage unit is preferably in a state where it is not coated with a coating solution. The replacement frequency of the mask may be every one or more than one. Moreover, it is possible to manufacture a multilayer organic EL element by arranging the manufacturing apparatuses according to the present embodiment in a line.
一般にスプレー法では、揮発性の高い成分を含むなどで溶液の乾燥速度が速すぎると、膜にムラが生じてしまう。そこで、スプレーに用いる溶液の乾燥速度を遅くして、霧状になった溶液が基板に到達する時点でも乾かずに流動性を保つようにするのが望ましい。そうすることにより、溶液が基板上に到達した後、レベリングし、膜ムラの少ない均一な膜が得られやすい。 In general, in the spray method, if the solution drying rate is too high, for example, a highly volatile component is included, unevenness occurs in the film. Therefore, it is desirable to slow down the drying speed of the solution used for spraying so that the fluidity is maintained without drying even when the atomized solution reaches the substrate. By doing so, the solution is leveled after reaching the substrate, and a uniform film with little film unevenness is easily obtained.
よって、溶液に用いる溶媒は乾燥速度があまり早いものは好ましくない。霧状になった液滴の大きさ、塗布雰囲気、ノズルと基板間の距離、等により一概には言えないが、用いる溶液を構成する少なくとも1つの溶媒は揮発性が低いことが望ましく、具体的には溶媒の沸点を、少なくとも100℃、好適なのは150℃、最も好適なのは200℃とするのが望ましい。 Therefore, it is not preferable that the solvent used in the solution has a very fast drying rate. Although it cannot be unequivocally stated depending on the size of the mist droplets, the coating atmosphere, the distance between the nozzle and the substrate, etc., it is desirable that at least one solvent constituting the solution to be used has low volatility. In this case, it is desirable that the boiling point of the solvent is at least 100 ° C, preferably 150 ° C, and most preferably 200 ° C.
上記(3)の工程でスプレー塗布する際、マスクにも溶液が付着するが、溶液の乾燥速度が遅い場合は、溶液はマスク上で流動性を保ったままである。本発明では、マスク上で流動性を保ったままの溶液がマスクから落下する前にマスクを交換するため、マスク上に付着し、流動性を保った溶液が、マスクから基板へ落下し、基板を汚染することがない。 When spray coating is performed in the step (3) above, the solution also adheres to the mask. However, when the drying speed of the solution is slow, the solution remains fluid on the mask. In the present invention, the mask is exchanged before the solution that maintains fluidity on the mask falls from the mask, so that the solution that adheres on the mask and maintains fluidity falls from the mask to the substrate, Will not pollute.
「有機EL素子」
図2に図1の製造装置により製造された有機EL素子の構造を示す。有機EL素子は、発光機能層が主に有機物からなり、陽極からホール(正孔)が、陰極から電子が注入され、発光層で再結合し発光する。有機EL素子の有機機能層は通常、ホール注入層/ホール輸送層/発光層/電子輸送層/電子注入層など、それぞれの機能を持つ複数の層からなる。これら各々の有機機能層は通常、有機物からなり、更に、低分子の有機物からなる場合、高分子の有機物からなる場合がある。低分子の有機物からなる有機機能層は一般に蒸着法等のドライプロセス(真空プロセス)によって、高分子の有機物からなる有機機能層は一般にスピンコート法、ブレードコート法、ディップ法、スプレー法そして印刷法等のウエットプロセスによって、それぞれ形成されるのが一般的である。
"Organic EL device"
FIG. 2 shows the structure of the organic EL element manufactured by the manufacturing apparatus of FIG. In the organic EL element, the light emitting functional layer is mainly made of an organic material, and holes (holes) are injected from the anode and electrons are injected from the cathode, and recombine in the light emitting layer to emit light. The organic functional layer of the organic EL element is usually composed of a plurality of layers having respective functions such as a hole injection layer / hole transport layer / light emitting layer / electron transport layer / electron injection layer. Each of these organic functional layers is usually made of an organic material, and may be made of a high molecular weight organic material when it is made of a low molecular weight organic material. Organic functional layers composed of low molecular weight organic materials are generally processed by a dry process (vacuum process) such as vapor deposition. Organic functional layers composed of high molecular weight organic materials are generally processed by spin coating, blade coating, dipping, spraying, and printing. In general, they are formed by a wet process such as the above.
有機溶媒に可溶な有機物からなる有機機能層の例が、例えば、特開2003−7461に示されている。特開2003−7461、6頁「0023」〜「0024」には、有機機能層に用いる高分子材料として、PEDOT、ポリアニリン、ポリパラフェニレンビニレン誘導体、ポリチオフェン誘導体、ポリパラフェニレン誘導体、ポリアルキルフェニレン、ポリアセチレン誘導体、などが挙げられている。更に特開2003−7461、7頁「0031」によると、これらの高分子材料は、トルエン、ベンゼン、クロロベンゼン、ジクロロベンゼン、クロロホルム、テトラリン、キシレン、アニソール、ジクロロメタン、γブチロラクトン、ブチルセルソルブ、シクロヘキサン、NMP(N−メチル−2−ピロリドン)、ジメチルスルホキシド、シクロヘキサノン、ジオキサンまたは、THF(テトラヒドロフラン)等の溶媒から選ばれた1種または複数種、に前駆体を溶解し、スピンコート法で成膜される。 An example of an organic functional layer made of an organic substance that is soluble in an organic solvent is disclosed in, for example, JP-A-2003-7461. JP-A-2003-7461, “0023” to “0024” on page 6, include PEDOT, polyaniline, polyparaphenylene vinylene derivatives, polythiophene derivatives, polyparaphenylene derivatives, polyalkylphenylenes, as polymer materials used for the organic functional layer. And polyacetylene derivatives. Furthermore, according to JP-A-2003-7461, page 7, “0031”, these polymer materials are toluene, benzene, chlorobenzene, dichlorobenzene, chloroform, tetralin, xylene, anisole, dichloromethane, γ-butyrolactone, butyl cellosolve, cyclohexane, A precursor is dissolved in one or more selected from solvents such as NMP (N-methyl-2-pyrrolidone), dimethyl sulfoxide, cyclohexanone, dioxane, or THF (tetrahydrofuran), and a film is formed by spin coating. The
これら有機機能層は、既知のあらゆる成膜法を用いて形成することができる。特に可溶な有機物からなる有機機能層は、ウエットプロセスによって形成する事ができる。ウエットプロセスで形成する場合は、通常、材料を溶媒に溶解した塗布液を用いる。溶媒としては、前述の溶媒の他、PGME(propyleneglycol monomethyl ether)、PGMEA(propyleneglycol monomethyl ether acetate)、乳酸エチル、DMAc(N.N−dimethylacetamide)、MEK(methyl ethyl ketone)、MIBK(methyl isobutyl ketone)、IPA(iso propyl alcohol)、エタノール等、既知の溶剤を用いる事ができる。 These organic functional layers can be formed using any known film forming method. In particular, an organic functional layer made of a soluble organic material can be formed by a wet process. When forming by a wet process, a coating solution in which a material is dissolved in a solvent is usually used. As the solvent, in addition to the above-mentioned solvents, PGME (propyleneglycol monoethyl ether), PGMEA (propyleneglycol monoethyl ether), ethyl lactate, DMAc (N.N-dimethylacetide), MEK (mekyl ether), MEK (l. Known solvents such as IPA (isopropyl alcohol) and ethanol can be used.
以上のように、従来の有機EL素子やそれを用いた表示パネルでは、有機機能層をウエットプロセスで形成することができる。 As described above, in a conventional organic EL element and a display panel using the same, an organic functional layer can be formed by a wet process.
ウエットプロセスのうち、特に簡便に成膜できる方法として、例えばスプレー法がある。スプレー法は、例えば特開2001−297876の図1に開示される通り、ノズルから溶液を霧状にして基板に吹き付けて成膜する方法である。一般に、有機機能層は所定の形状にパターニングする必要があるが、例えば、特開2001−297876の図2の様な方法を用いることができる。特開2001−297876の図2の方法では、同文献「0028」に記載されるように、赤、緑、青色の発光パターンに合わせたマスクや、それに限らず、発光色、発光形状による複数のマスクを交換して成膜できる技術が開示される。この方法では、発光形状の異なったマスクをマスク板収納室に備え、マスク板交換ロボットにより、適宜、パターンの違うマスクを交換することにより、様々なパターン表示が可能な有機EL素子を作製することが可能とされる。 Among the wet processes, there is a spray method, for example, as a method that can be particularly easily formed into a film. The spray method is a method of forming a film by spraying a solution from a nozzle onto a substrate as disclosed in, for example, FIG. 1 of JP-A-2001-297876. In general, the organic functional layer needs to be patterned into a predetermined shape. For example, a method as shown in FIG. 2 of JP-A-2001-297876 can be used. In the method of FIG. 2 of Japanese Patent Laid-Open No. 2001-297876, as described in the same document “0028”, a plurality of masks according to red, green, and blue light emission patterns, and a plurality of light emission colors and light emission shapes are used. A technique capable of forming a film by exchanging a mask is disclosed. In this method, an organic EL element capable of displaying various patterns is prepared by providing masks with different light emission shapes in a mask plate storage chamber and appropriately exchanging masks with different patterns by a mask plate exchange robot. Is possible.
上記で示されるように本実施形態では、マスクから溶液がこぼれ落ちる前に、新しいマスクを供給して、スプレー成膜するので、そのような汚染が生じない。また、多くのマスクをマスク収納室にストックしておけば、連続して数多くの基板に成膜することができる。 As shown above, in this embodiment, before the solution spills from the mask, a new mask is supplied and spray film formation is performed, so that such contamination does not occur. In addition, if a large number of masks are stocked in the mask storage chamber, films can be continuously formed on a large number of substrates.
本発明で用いるマスクは、塗布液に溶解しない素材を用いるのが好ましい。例えば、ステンレス、ポリイミドフィルム、などが好適である。 The mask used in the present invention is preferably made of a material that does not dissolve in the coating solution. For example, stainless steel and polyimide film are suitable.
マスク交換のタイミングは、所定の枚数毎でも良いが、マスク上の溶液を観察することにより、マスクからの溶液の落下の危険性などを予めコンピュータに備えられたデータなどから予測し、危険度が高まったと判断した際に、マスクを交換することもできる。マスクからの溶液落下の危険性は、例えば、コンピュータを用いた画像認識、反射率測定等を用いて以下のようにできる。 The timing for replacing the mask may be every predetermined number of times, but by observing the solution on the mask, the risk of dropping the solution from the mask is predicted from the data provided in the computer in advance, and the degree of risk is When it is determined that the mask has increased, the mask can be replaced. The risk of dropping the solution from the mask can be as follows using, for example, image recognition using a computer, reflectance measurement, and the like.
マスク上に溜まった溶液の面積/マスク表面の面積の比を計測し、ある一定以上の値となったら交換する。 The ratio of the area of the solution accumulated on the mask / the area of the mask surface is measured, and is exchanged when a certain value or more is reached.
マスクが光反射性の場合、マスクに光を当て反射率を計測。一般にマスク上に溜まった溶液が多いほど反射率は低くなるため、反射率がある一定値以下になったらマスクを交換する。 If the mask is light-reflective, apply light to the mask and measure the reflectance. In general, the more solution accumulated on the mask, the lower the reflectance. Therefore, when the reflectance falls below a certain value, the mask is replaced.
マスクの熱膨張の影響を少なくするため、マスク収納部は一定の温度に保ち、マスクの温度を一定にすることが望ましい。好適には、塗布雰囲気と同じ温度に保つのがよい。 In order to reduce the influence of the thermal expansion of the mask, it is desirable to keep the mask housing part at a constant temperature and to keep the mask temperature constant. Preferably, the temperature is kept at the same temperature as the coating atmosphere.
ただし、マスクのパターンが粗く、マスクの熱膨張の影響が無視できるときは、マスク収納部の温度を高温にすることも可能である。この場合、塗布時に、マスクの温度を塗布雰囲気温度よりも高温にすることができ、マスクに付着した塗布液の乾燥速度を高めることができる、という効果がある。 However, when the mask pattern is rough and the influence of the thermal expansion of the mask can be ignored, the temperature of the mask housing portion can be increased. In this case, there is an effect that the temperature of the mask can be set higher than the temperature of the coating atmosphere at the time of coating, and the drying rate of the coating solution attached to the mask can be increased.
次に、本実施形態の変形例について説明する。 Next, a modification of this embodiment will be described.
「使用中、もしくは、使用済のマスクの収納部を備える」
図3の有機EL素子の製造装置は、基板表面上に配置された表面マスク、表面マスク上に配置され、スプレー噴射して塗布するノズル、表面マスクを交換するマスク交換機構、交換用マスクが収納されるマスク収納部、さらには塗布済みマスク収納部を含んでいる装置である。表面マスクには、塗布物が被塗布材表面に塗布される対応箇所が貫通して開口部が形成されている。基板上にはこの開口部を通じてのみノズルから噴射(噴出した溶液)が基板表面に塗布される。
"Equipped with a storage section for used or used masks"
The organic EL device manufacturing apparatus shown in FIG. 3 stores a surface mask disposed on the surface of the substrate, a nozzle that is disposed on the surface mask and applied by spraying, a mask replacement mechanism that replaces the surface mask, and a replacement mask. The apparatus includes a mask storage portion to be applied, and a coated mask storage portion. In the surface mask, corresponding portions where the coated material is applied to the surface of the material to be coated are penetrated to form openings. On the substrate, spray (solution ejected) from the nozzle is applied to the substrate surface only through the opening.
図3の装置では、何枚か塗布を行っている最中のマスク、もしくは使用済のマスクを収納するマスク収納部、を有している。 The apparatus shown in FIG. 3 includes a mask that is in the process of being applied several times, or a mask storage unit that stores a used mask.
一度塗布を行って塗布液が付着したマスクをマスク収納部に戻すと、他のマスクを汚染する可能性があるが、一度使用したマスクを収納する場所を別に設ければ、そのような恐れがなく好適である。 Once applied and the mask with the coating liquid attached is returned to the mask storage section, it may contaminate other masks. However, if a separate place for storing the mask once used is provided, there is such a risk. It is preferable.
「マスクの乾燥機構を備える」
図4の有機EL素子の製造装置は、基板表面上に配置された表面マスク、表面マスク上に配置され、スプレー噴射して塗布するノズル、表面マスクを交換するマスク交換機構、交換用マスクが収納されるマスク収納部、さらには塗布済みマスクを乾燥させる乾燥部を含んでいる装置である。表面マスクには、塗布物が被塗布材表面に塗布される対応箇所が貫通して開口部が形成されている。基板上にはこの開口部を通じてのみノズルから噴射(噴出した溶液)が基板表面に塗布される。
"Equipped with a mask drying mechanism"
The organic EL device manufacturing apparatus shown in FIG. 4 stores a surface mask disposed on the substrate surface, a nozzle that is disposed on the surface mask and sprayed and applied, a mask replacement mechanism that replaces the surface mask, and a replacement mask. The apparatus includes a mask storage unit to be applied, and a drying unit for drying the coated mask. In the surface mask, corresponding portions where the coated material is applied to the surface of the material to be coated are penetrated to form openings. On the substrate, spray (solution ejected) from the nozzle is applied to the substrate surface only through the opening.
図4のように、一度使用したマスクを乾燥させる機構を有していても良い。乾燥したマスクは再使用可能となるため、マスク収納室に再度収納される。マスクの乾燥機構としては、気流をマスクに当てて乾燥させるエアナイフ、ホットプレートや赤外線ヒーターや温風によりマスクを加熱して乾燥する加熱機構、などを用いることができる。 As shown in FIG. 4, it may have a mechanism for drying a mask once used. Since the dried mask can be reused, it is stored again in the mask storage chamber. As a drying mechanism for the mask, an air knife that applies airflow to the mask for drying, a hot plate, an infrared heater, a heating mechanism that heats the mask with hot air, or the like can be used.
マスクを加熱して乾燥する場合は、マスクの熱膨張の影響を防止するために、常温に戻す冷却機構を更に備えていることが望ましい。 When the mask is heated and dried, it is desirable to further include a cooling mechanism for returning to normal temperature in order to prevent the influence of thermal expansion of the mask.
ただし、マスクのパターンが粗く、マスクの熱膨張の影響が無視できるときは、マスクを加熱乾燥した後に、冷却を行わないことも可能である。この場合、塗布時に、マスクの温度を塗布雰囲気温度よりも高温にすることができ、マスクに付着した塗布液の乾燥速度を高めることができる、という効果がある。 However, when the mask pattern is rough and the influence of the thermal expansion of the mask can be ignored, it is possible not to perform cooling after the mask is heated and dried. In this case, there is an effect that the temperature of the mask can be set higher than the temperature of the coating atmosphere at the time of coating, and the drying rate of the coating solution attached to the mask can be increased.
マスクの乾燥時間が十分短ければ、マスクの収納室を省略し、図5のような構造とすることも可能である。マスクを再使用することができ、必要なマスクの枚数を減らすことができる。 If the mask drying time is sufficiently short, the mask storage chamber can be omitted and the structure shown in FIG. 5 can be used. Masks can be reused and the number of required masks can be reduced.
「マスクの洗浄機構を備える」
図6の有機EL素子の製造装置は、基板表面上に配置された表面マスク、表面マスク上に配置され、スプレー噴射して塗布するノズル、表面マスクを交換するマスク交換機構、交換用マスクが収納されるマスク収納部、さらには塗布済みマスクを洗浄させる洗浄部を含んでいる装置である。表面マスクには、塗布物が被塗布材表面に塗布される対応箇所が貫通して開口部が形成されている。基板上にはこの開口部を通じてのみノズルから噴射(噴出した溶液)が基板表面に塗布される。
"Equipped with a mask cleaning mechanism"
The organic EL device manufacturing apparatus shown in FIG. 6 contains a surface mask disposed on the surface of the substrate, a nozzle that is disposed on the surface mask and applied by spraying, a mask replacement mechanism that replaces the surface mask, and a replacement mask. The apparatus includes a mask storing unit to be cleaned, and a cleaning unit for cleaning the coated mask. In the surface mask, corresponding portions where the coated material is applied to the surface of the material to be coated are penetrated to form openings. On the substrate, spray (solution ejected) from the nozzle is applied to the substrate surface only through the opening.
図6のように、一度使用したマスクを洗浄させる機構を有していても良い。乾燥したマスクは再使用可能となるため、マスク収納室に再度収納される。マスクの洗浄機構としては、塗布液を溶解する溶液に浸漬後乾燥させる機構、また、その浸漬時に超音波洗浄を行うもの、ブラシにより洗浄後乾燥させる機構を備えたもの、塗布液を一旦加熱・乾燥した後UV/03やプラズマなどの乾式洗浄により洗浄する機構、等を用いることができる。マスクを再使用することができ、必要なマスクの枚数を減らすことができる。 As shown in FIG. 6, it may have a mechanism for cleaning a mask once used. Since the dried mask can be reused, it is stored again in the mask storage chamber. As a mask cleaning mechanism, a mechanism for immersing in a solution that dissolves the coating solution and drying it, a device that performs ultrasonic cleaning at the time of immersing, a mechanism that includes a mechanism for cleaning and drying with a brush, After drying, a mechanism for cleaning by dry cleaning such as UV / 03 or plasma can be used. Masks can be reused and the number of required masks can be reduced.
マスクの洗浄時間が十分短ければ、マスクの収納室を省略し、図7のような構造とすることも可能である。マスクを再使用することができ、必要なマスクの枚数を減らすことができる。 If the mask cleaning time is sufficiently short, the mask storage chamber can be omitted and the structure shown in FIG. Masks can be reused and the number of required masks can be reduced.
さらに、本実施形態では、前記マスクパターンは第一の前記表面マスクと第二の表面マスクとで略同一のマスクパターンとすると好適であるがこれに限られない。第一の前記表面マスクと第二の表面マスクとで別個のマスクパターンとしてもよい。 Further, in the present embodiment, the mask pattern is preferably the same mask pattern for the first surface mask and the second surface mask, but is not limited thereto. Separate mask patterns may be used for the first surface mask and the second surface mask.
本実施形態では、コンピュータシステムを用いることなどにより、前記第一の表面マスク表面を画像データまたは反射率データで解析し、前記解析した解析データから、予め記憶されていた第二の表面マスクに取り替える状態を判定する判定記憶データと比較し、前記画像解析した解析データが前記判定記憶データと比較して、前記第一の表面マスクを外し、前記第二の表面マスクを覆う時期であると判断された場合に前記被塗布材表面に前記第二の表面マスクを覆うと好適であるが、これに限られない。 In this embodiment, the first surface mask surface is analyzed with image data or reflectance data by using a computer system or the like, and the previously analyzed second surface mask is replaced from the analyzed data. It is determined that it is time to remove the first surface mask and cover the second surface mask by comparing the analysis data obtained by image analysis with the determination storage data in comparison with the determination storage data for determining the state. In this case, it is preferable to cover the second surface mask on the surface of the material to be coated, but the present invention is not limited to this.
本実施形態では、前記外された第一の表面マスクを再利用可能な状態とし、前記第二の表面マスクとすると好適であるが、これに限られない。前記再利用可能な状態とは、前記外された第一の表面マスク表面が乾燥される状態であると好適であるが、これに限られない。前記再利用可能な状態とは、前記第一の表面マスク表面が洗浄される状態であると好適であるが、これに限られない。前記乾燥は、第一の表面マスク表面の加熱または気流を吹きつけることによると好適であるが、これに限られない。前記乾燥後に、第一の表面マスク表面をUV/03またはプラズマなどの乾式洗浄によりクリーニングすると好適であるが、これに限られない。前記再利用可能な状態とは、前記外された第一の表面マスク表面が洗浄後、乾燥される状態であると好適であるが、これに限られない。前記第一の表面マスクは、毎塗布ごとに外されると好適であるが、これに限られない。前記被塗布材が半導体基板、有機トランジスタ基板、有機EL素子構成層のうち少なくとも一つであると好適であるが、これに限られない。前記有機EL素子構成層は、基板、陽極、有機機能層の各層、陰極、基板側の保護バリア膜、封止膜のうち少なくとも1層であると好適であるが、これに限られない。前記塗布物が揮発性の低い成分を含む(乾燥しにくい)と好適であるが、これに限られない。前記第二の表面マスクが準備用収納部(例えば、図1等のマスク収納部)に収容されて準備されると好適であるが、これに限られない。前記外された第一の表面マスクが保管用収納部(例えば、図3の塗布済マスク収納部)に収容されて保管されると好適であるが、これに限られない。 In the present embodiment, it is preferable that the removed first surface mask be in a reusable state and used as the second surface mask. However, the present invention is not limited to this. The reusable state is preferably a state in which the removed first surface mask surface is dried, but is not limited thereto. The reusable state is preferably a state in which the surface of the first surface mask is cleaned, but is not limited thereto. The drying is preferably performed by heating the first surface mask surface or blowing an air flow, but is not limited thereto. After the drying, the surface of the first surface mask is preferably cleaned by dry cleaning such as UV / 03 or plasma, but is not limited thereto. The reusable state is preferably a state in which the removed first surface mask surface is dried after being cleaned, but is not limited thereto. The first surface mask is preferably removed at every application, but is not limited thereto. The material to be coated is preferably at least one of a semiconductor substrate, an organic transistor substrate, and an organic EL element constituent layer, but is not limited thereto. The organic EL element constituent layer is preferably at least one layer among the substrate, the anode, each layer of the organic functional layer, the cathode, the protective barrier film on the substrate side, and the sealing film, but is not limited thereto. Although it is preferable that the coated material contains a component having low volatility (it is difficult to dry), the present invention is not limited to this. The second surface mask is preferably prepared by being accommodated in a preparation accommodating portion (for example, the mask accommodating portion in FIG. 1 or the like), but is not limited thereto. The removed first surface mask is preferably stored and stored in a storage unit (for example, the coated mask storage unit in FIG. 3), but is not limited thereto.
Claims (2)
第一の表面マスクで被塗布材表面を覆い、前記被塗布材表面への塗布後、
前記被塗布材表面の前記第一の表面マスクを外し、第二の表面マスクで覆うことで塗布してなり、
前記外された第一の表面マスクを再利用可能な状態とし、前記第二の表面マスクとし、
かつ、
前記第一の表面マスク表面を画像データまたは反射率データで解析し、
前記解析した解析データから、予め記憶されていた第二の表面マスクに取り替える状態を判定する判定記憶データと比較し、
前記画像解析した解析データが前記判定記憶データと比較して、前記第一の表面マスクを外し、前記第二の表面マスクで覆う時期であると判断された場合に前記被塗布材表面を前記第二の表面マスクで覆う塗布物被塗布材の製造方法。 A surface mask on which a mask pattern is formed in which a corresponding portion where a coated material is applied to the surface of the material to be coated penetrates and a corresponding portion which prevents the coated material from being coated on the surface of the material to be coated is formed. The surface of the material to be coated is covered with a surface mask by being placed on the surface, and the coating material is sprayed from the spray nozzle through the surface mask and applied.
Cover the surface of the material to be coated with the first surface mask , and after coating on the surface of the material to be coated,
Remove the first surface mask of the object to be coated material surface, it is applied by covering the second surface mask,
Making the removed first surface mask reusable, the second surface mask ,
And,
Analyzing the first surface mask surface with image data or reflectance data;
From the analyzed analysis data, compared with determination storage data for determining a state to replace the second surface mask stored in advance,
When the analysis data obtained by the image analysis is compared with the determination storage data, it is determined that it is time to remove the first surface mask and cover with the second surface mask. The manufacturing method of the coating material coating material covered with a 2nd surface mask .
第一の表面マスクで被塗布材表面を覆い、前記被塗布材表面へ塗布後、Cover the surface of the material to be coated with the first surface mask, and apply to the surface of the material to be coated.
前記被塗布材表面の前記第一の表面マスクを外し、第二の表面マスクで覆うことで塗布させてなり、The first surface mask on the surface of the material to be coated is removed and covered by a second surface mask.
前記外された第一の表面マスクを再利用可能な状態とし、前記第二の表面マスクとし、Making the removed first surface mask reusable, the second surface mask,
かつ、And,
前記第一の表面マスク表面を画像データまたは反射率データで解析し、Analyzing the first surface mask surface with image data or reflectance data;
前記解析した解析データから、予め記憶されていた第二の表面マスクに取り替える状態を判定する判定記憶データと比較し、From the analyzed analysis data, compared with determination storage data for determining a state to replace the second surface mask stored in advance,
前記画像解析した解析データが前記判定記憶データと比較して、前記第一の表面マスクを外し、前記第二の表面マスクで覆う時期であると判断された場合に前記被塗布材表面を前記第二の表面マスクで覆う塗布物被塗布材の製造装置。When the analysis data obtained by the image analysis is compared with the determination storage data, it is determined that it is time to remove the first surface mask and cover with the second surface mask. A device for manufacturing a material to be coated covered with a second surface mask.
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