JP2006218460A - Method and apparatus for producing coating material-coated material - Google Patents
Method and apparatus for producing coating material-coated material Download PDFInfo
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Abstract
Description
本発明は、塗布物被塗布材の製造方法および製造装置、特に塗布物が被塗布材表面に塗布される対応箇所が貫通し、被塗布材表面に塗布されることを防止する対応箇所が非貫通してなるマスクパターンが形成された表面マスクで被塗布材表面を覆い、前記表面マスクを通じて噴射ノズルから前記塗布物を噴射し、塗布してなる塗布物被塗布材の製造方法および製造装置に関する。 The present invention relates to a manufacturing method and a manufacturing apparatus for a coated material to be coated, and in particular, a corresponding portion where the coated material is applied to the surface of the coated material is penetrated and a corresponding portion for preventing the coated material from being coated on the surface of the coated material The present invention relates to a manufacturing method and a manufacturing apparatus for a coated material to be coated, in which the surface of a material to be coated is covered with a surface mask formed with a penetrating mask pattern, the coating material is sprayed from a spray nozzle through the surface mask and applied. .
塗布物が被塗布材表面に塗布される対応箇所が貫通し、被塗布材表面に塗布されることを防止する対応箇所が非貫通してなるマスクパターンが形成された表面マスクで被塗布材表面を覆い、前記表面マスクを通じて噴射ノズルから前記塗布物を噴射し、塗布してなる塗布物被塗布材の製造方法が報告されている。 The surface of the material to be coated is a surface mask on which a mask pattern is formed in which the corresponding portion where the coated material is applied to the surface of the material to be coated is penetrated and the corresponding portion is prevented from being coated on the surface of the material to be coated. A method for producing a coated material to be coated, which is obtained by spraying the coated material from a spray nozzle through the surface mask and applying the coated material, has been reported.
例えば、塗布物被塗布材の製造方法として、ノズルから噴射し、マスクを用いて、有機機能層を所定の形状に形成する技術は、下記特許文献１の他、下記特許文献２、下記特許文献３などにも開示される。 For example, as a manufacturing method of a material to be coated, a technique for forming an organic functional layer into a predetermined shape by spraying from a nozzle and using a mask is described in Patent Document 2, Patent Document 2, and Patent Document 2 below. 3 and the like.
下記特許文献２では、有機化合物の分散粒子を含む組成物を不活性ガスで噴射させ、マスクの開口部を通過させることにより、所定の形状の有機機能層を形成する技術が開示される。 Patent Document 2 below discloses a technique for forming an organic functional layer having a predetermined shape by injecting a composition containing dispersed particles of an organic compound with an inert gas and passing the composition through an opening of a mask.
また、下記特許文献３には、真空雰囲気中で、高分子系EL材料を溶解した溶液をスプレー上に噴出する有機機能層の形成方法が開示される。同文献段落「0034」には画素塗り分けマスクを用いて赤色の発光層を形成した後、同マスクを所定量ずらし、順次、青色、緑色の発光層を形成する技術が記載される。
しかしながら、上記特許文献は、１枚の同一の基板上に、複数回、異なったマスク、もしくは異なったマスク位置で、マスクを置載して、有機機能層を異なったパターンで順次積層する技術である。また、上記の従来技術は、発光色、もしくは発光パターンが変わらない限りは、マスク交換を行わない。 However, the above-mentioned patent document is a technique in which a plurality of organic functional layers are sequentially stacked in different patterns by placing a mask on a single substrate multiple times at different masks or at different mask positions. is there. Further, the above-described conventional technique does not perform mask replacement unless the emission color or the emission pattern is changed.
上記特許文献は、マスクに付着した溶液の影響を考慮しておらず、マスク上に流動性を保ったまま付着する溶液が、マスクから基板などにこぼれ落ち、周囲を汚染することを防ぐことができなかった。よって、大量の基板を連続して成膜するのは困難であった。 The above-mentioned patent document does not consider the influence of the solution attached to the mask, and the solution attached to the mask while maintaining fluidity can be prevented from spilling from the mask onto the substrate and contaminating the surroundings. There wasn't. Therefore, it has been difficult to continuously form a large number of substrates.
本発明は、上記課題に鑑みてなされたものであり、より被塗布材表面の汚染を防止などした塗布物被塗布材の製造方法および製造装置を提供することを主な目的とする。 This invention is made | formed in view of the said subject, and makes it a main objective to provide the manufacturing method and manufacturing apparatus of the coating material coating material which prevented the contamination of the coating material surface more.
本発明は、塗布物が被塗布材表面に塗布される対応箇所が貫通し、被塗布材表面に塗布されることを防止する対応箇所が非貫通してなるマスクパターンが形成された表面マスクで被塗布材表面を覆い、前記表面マスクを通じて噴射ノズルから前記塗布物を噴射し、塗布してなる塗布物表面塗布材の製造方法であって、前記塗布物の塗布時における前記表面マスクの表面温度を、塗布雰囲気よりも高温とすることを特徴とする。 The present invention is a surface mask on which a mask pattern is formed in which a corresponding portion where a coating is applied to the surface of a material to be coated penetrates and a corresponding portion which prevents the coating from being applied to the surface of the material to be coated is non-penetrated. A method for producing a coating material surface coating material that covers a surface of a material to be coated, sprays the coating material from a spray nozzle through the surface mask, and coats the coating material, the surface temperature of the surface mask at the time of coating the coating material Is characterized by having a temperature higher than that of the coating atmosphere.
本発明は、塗布物が被塗布材表面に塗布される対応箇所が貫通し、被塗布材表面に塗布されることを防止する対応箇所が非貫通してなるマスクパターンが形成された表面マスクで被塗布材表面を覆い、前記表面マスクを通じて噴射ノズルから前記塗布物を噴射し、塗布してなる塗布物表面塗布材の製造装置であって、前記塗布物の塗布時における前記表面マスクの表面温度を、塗布雰囲気よりも高温とすることを特徴とする。 The present invention is a surface mask on which a mask pattern is formed in which a corresponding portion where a coating is applied to the surface of a material to be coated penetrates and a corresponding portion which prevents the coating from being applied to the surface of the material to be coated is non-penetrated. An apparatus for manufacturing a coating material surface coating material that covers a surface of a material to be coated, sprays the coating material from a spray nozzle through the surface mask, and coats the coating material, the surface temperature of the surface mask at the time of coating the coating material Is characterized by having a temperature higher than that of the coating atmosphere.
以下、本発明の実施の形態を図面に基づいて説明する。なお、本実施形態については、本発明を実施するための一形態に過ぎず、本発明は本実施形態によって限定されるものではない。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, about this embodiment, it is only one form for implementing this invention, and this invention is not limited by this embodiment.
「有機ＥＬ素子の製造装置」
図１には塗布物が被塗布材表面に塗布される対応箇所が貫通し、被塗布材表面に塗布されることを防止する対応箇所が非貫通してなるマスクパターンが形成された表面マスクで被塗布材表面を覆い、前記表面マスクを通じて噴射ノズルから前記塗布物を噴射し、塗布してなり、前記塗布物の塗布時における前記表面マスクの表面温度を、塗布雰囲気よりも高温とする有機ＥＬ素子の製造装置が示される。
"Organic EL device manufacturing equipment"
FIG. 1 shows a surface mask formed with a mask pattern in which a corresponding portion where a coating is applied to the surface of a material to be coated penetrates and a corresponding portion which prevents the coating from being applied to the surface of the material to be coated is non-penetrated. An organic EL that covers the surface of the material to be coated, sprays and applies the coating material from the spray nozzle through the surface mask, and sets the surface temperature of the surface mask during coating of the coating material to be higher than the coating atmosphere. A device manufacturing apparatus is shown.
図１の有機ＥＬ素子の製造装置は、基板表面上に配置された表面マスク、表面マスク上に配置され、ノズルに塗布液を供給する溶液供給装置を含んでいる装置である。表面マスクには、塗布物が被塗布材表面に塗布される対応箇所が貫通して開口部が形成されている。基板上にはこの開口部を通じてのみノズルから噴射（噴出した溶液）が基板表面に塗布される。 The organic EL device manufacturing apparatus of FIG. 1 is an apparatus including a surface mask disposed on a substrate surface, a solution supply device disposed on the surface mask, and supplying a coating liquid to a nozzle. In the surface mask, corresponding portions where the coated material is applied to the surface of the material to be coated are penetrated to form openings. On the substrate, spray (solution ejected) from the nozzle is applied to the substrate surface only through the opening.
図１の装置には、表面マスク表面を加熱する機構としてヒータを表面マスク表面に接触して設ける。このヒータを加熱することでマスクを用いてスプレー塗布をする際、マスクを基板表面など塗布雰囲気の温度よりも高温にする。 In the apparatus of FIG. 1, a heater is provided in contact with the surface mask surface as a mechanism for heating the surface mask surface. When spray coating is performed using the mask by heating the heater, the mask is set to a temperature higher than the temperature of the coating atmosphere such as the substrate surface.
図１の装置は、以下の順番で動作する。（１）ヒータによりマスクを加熱する。（２）基板を図示しない塗布ステージに導入、マスクの開口部との関係に留意し位置合わせして、載置する。（３）ノズルから噴出した溶液をスプレー塗布する。（４）基板を排出する。以降（２）〜（４）の繰り返しを行う。 The apparatus of FIG. 1 operates in the following order. (1) The mask is heated with a heater. (2) The substrate is introduced into a coating stage (not shown), placed in consideration of the relationship with the opening of the mask, and positioned. (3) Spray application of the solution ejected from the nozzle. (4) The substrate is discharged. Thereafter, (2) to (4) are repeated.
一般にスプレー法では、溶液の乾燥速度が速すぎると、膜にムラが生じてしまう。そこで、スプレーに用いる溶液の乾燥速度を遅くして、霧状になった溶液が基板に到達する時点でも乾かずに流動性を保つようにするのが望ましい。そうすることにより、溶液が基板上に到達した後、レベリングし、膜ムラの少ない均一な膜が得られやすい。 In general, in the spray method, if the drying speed of the solution is too high, the film becomes uneven. Therefore, it is desirable to slow down the drying speed of the solution used for spraying so that the fluidity is maintained without drying even when the atomized solution reaches the substrate. By doing so, the solution is leveled after reaching the substrate, and a uniform film with little film unevenness is easily obtained.
よって、溶液に用いる溶媒は乾燥速度があまり早いものは好ましくない。霧状になった液滴の大きさ、塗布雰囲気、ノズルと基板間の距離、等により一概には言えないが、用いる溶液を構成する少なくとも１つの溶媒は揮発性の低いことが好ましく、具体的にはその沸点を、少なくとも１００℃、好適なのは１５０℃、最も好適なのは２００℃とするのが望ましい。 Therefore, it is not preferable that the solvent used in the solution has a very fast drying rate. Although it cannot be generally stated due to the size of the mist droplets, the coating atmosphere, the distance between the nozzle and the substrate, etc., it is preferable that at least one solvent constituting the solution to be used is low in volatility. The boiling point is preferably at least 100 ° C., preferably 150 ° C., and most preferably 200 ° C.
スプレー塗布する際、マスクにも溶液が付着するが、溶液の乾燥速度が遅い場合は、溶液はマスク上で流動性を保ったままである。本発明による製造方法、もしくは本発明による製造装置では、マスクの温度が塗布雰囲気よりも高温であるので、マスク上に付着した溶液が早く乾燥する。よって、マスク上に付着し、流動性を保った溶液が、マスクから基板へ落下し、基板を汚染することが少なくなる。 When spray coating, the solution also adheres to the mask, but if the solution drying rate is slow, the solution remains fluid on the mask. In the manufacturing method according to the present invention or the manufacturing apparatus according to the present invention, since the temperature of the mask is higher than the coating atmosphere, the solution attached on the mask dries quickly. Therefore, a solution that adheres to the mask and maintains fluidity is less likely to fall from the mask to the substrate and contaminate the substrate.
本発明で用いるマスクは、塗布液に溶解しない素材を用いるのが好ましい。特に、熱膨張係数が小さいものが望ましい。例えば、ステンレスなどの金属製が好適である。 The mask used in the present invention is preferably made of a material that does not dissolve in the coating solution. In particular, those having a small thermal expansion coefficient are desirable. For example, a metal such as stainless steel is suitable.
マスクの温度は、低すぎると溶液の乾燥速度を十分に早めることができないため、少なくとも塗布雰囲気の温度＋１０℃、好ましくは＋２０℃、最も好ましくは＋３０℃、以上の温度が望ましい。一方、マスクの温度が高すぎると、マスクの膨張が大きくなり、精度の高いパターニングが困難になるので、少なくとも１５０℃、好ましくは１００℃、最も好ましくは８０℃以下とすることが好ましい。ただし、マスクの温度を、塗布液の固形分の沸点や昇華温度よりも高めると、マスクに付着した前記固形分が再蒸発、再付着し周囲を汚染するので、その温度よりは低温にするのが望ましい。なお、マスクの設定温度での寸法を考慮し、マスクを設計すべきことは言うまでもない。また、マスクを加熱すると、マスクが膨張し、マスクが撓んでしまうので、マスクは張力をかけた状態で保持することが望ましい。 If the temperature of the mask is too low, the drying rate of the solution cannot be sufficiently increased. Therefore, the temperature of the coating atmosphere is preferably + 10 ° C., preferably + 20 ° C., most preferably + 30 ° C. or higher. On the other hand, if the temperature of the mask is too high, the expansion of the mask becomes large, and high-precision patterning becomes difficult. Therefore, the temperature is preferably at least 150 ° C., preferably 100 ° C., and most preferably 80 ° C. or less. However, if the temperature of the mask is raised above the boiling point or sublimation temperature of the solid content of the coating solution, the solid content attached to the mask will re-evaporate and re-adhere and contaminate the surroundings. Is desirable. Needless to say, the mask should be designed in consideration of the dimensions of the mask at the set temperature. Further, when the mask is heated, the mask expands and the mask bends. Therefore, it is desirable to hold the mask in a tensioned state.
マスクの加熱方法は、任意の方法で構わないが、図１のように、マスクにヒータを接触させて、直接加熱することが望ましい。赤外線ヒータを用いる等、非接触で加熱すると、基板も一緒に加熱してしまうため、注意が必要である。基板を加熱することは問題ないが、マスクと同一の熱源で加熱すると、基板温度を一定に制御するのが困難となる。基板を加熱する場合は、マスクの加熱源とは別に加熱手段を設けることが好ましい。 The mask may be heated by any method, but it is desirable to directly heat the mask by bringing a heater into contact with it as shown in FIG. Care must be taken because heating the substrate without contact, such as using an infrared heater, also heats the substrate. There is no problem in heating the substrate, but if the substrate is heated with the same heat source as the mask, it becomes difficult to control the substrate temperature to be constant. When heating the substrate, it is preferable to provide a heating means separately from the heating source of the mask.
マスクの加熱源により、基板が加熱されるのを防ぐためには、マスクの材質に熱伝導率の良いものを選べばよい。少なくとも、基板よりも熱伝導率が高い材質をマスクに用いるのが望ましい。 In order to prevent the substrate from being heated by the heating source of the mask, a material having good thermal conductivity may be selected as the mask material. It is desirable to use at least a material having higher thermal conductivity than the substrate for the mask.
マスクを均一かつ一定に加熱するために、ヒータを適当なパターン配置で設けたり、熱電対を適宜設置しマスクの温度を測定したりなどして、温度調整を行うのが好ましいのは言うまでもない。 Needless to say, in order to heat the mask uniformly and uniformly, it is preferable to adjust the temperature by providing a heater in an appropriate pattern arrangement, or by appropriately installing a thermocouple and measuring the temperature of the mask.
「有機ＥＬ素子」
図２に図１の製造装置により製造された有機ＥＬ素子の構造を示す。有機ＥＬ素子は、発光機能層が主に有機物からなり、陽極からホールが、陰極から電子が注入され、発光層で再結合し発光する。有機ＥＬ素子の有機機能層は通常、ホール注入層／ホール輸送層／発光層／電子輸送層／電子注入層など、それぞれの機能を持つ複数の層からなる。これら各々の有機機能層は通常、有機物からなり、更に、低分子の有機物からなる場合、高分子の有機物からなる場合がある。低分子の有機物からなる有機機能層は一般に蒸着法等のドライプロセス（真空プロセス）によって、高分子の有機物からなる有機機能層は一般にスピンコート法、ブレードコート法、ディップ法、スプレー法そして印刷法等のウエットプロセスによって、それぞれ形成されるのが一般的である。
"Organic EL device"
FIG. 2 shows the structure of the organic EL element manufactured by the manufacturing apparatus of FIG. In the organic EL element, the light emitting functional layer is mainly composed of an organic substance, holes are injected from the anode, and electrons are injected from the cathode, and recombine in the light emitting layer to emit light. The organic functional layer of the organic EL element is usually composed of a plurality of layers having respective functions such as a hole injection layer / hole transport layer / light emitting layer / electron transport layer / electron injection layer. Each of these organic functional layers is usually made of an organic material, and may be made of a high molecular weight organic material when it is made of a low molecular weight organic material. Organic functional layers composed of low molecular weight organic materials are generally processed by a dry process (vacuum process) such as vapor deposition. Organic functional layers composed of high molecular weight organic materials are generally processed by spin coating, blade coating, dipping, spraying, and printing. In general, they are formed by a wet process such as the above.
有機溶媒に可溶な有機物からなる有機機能層の例が、例えば、特開２００３−７４６１に示されている。特開２００３−７４６１、６頁「００２３」〜「００２４」には、有機機能層に用いる高分子材料として、ＰＥＤＯＴ、ポリアニリン、ポリパラフェニレンビニレン誘導体、ポリチオフェン誘導体、ポリパラフェニレン誘導体、ポリアルキルフェニレン、ポリアセチレン誘導体、などが挙げられている。更に特開２００３−７４６１、７頁「００３１」によると、これらの高分子材料は、トルエン、ベンゼン、クロロベンゼン、ジクロロベンゼン、クロロホルム、テトラリン、キシレン、アニソール、ジクロロメタン、γブチロラクトン、ブチルセルソルブ、シクロヘキサン、ＮＭＰ（Ｎ−メチル−２−ピロリドン）、ジメチルスルホキシド、シクロヘキサノン、ジオキサンまたは、ＴＨＦ （テトラヒドロフラン）等の溶媒から選ばれた１種または複数種、に前駆体を溶解し、スピンコート法で成膜される。 An example of an organic functional layer made of an organic substance that is soluble in an organic solvent is disclosed in, for example, JP-A-2003-7461. JP-A-2003-7461, “0023” to “0024” on page 6, include PEDOT, polyaniline, polyparaphenylene vinylene derivatives, polythiophene derivatives, polyparaphenylene derivatives, polyalkylphenylenes, as polymer materials used for the organic functional layer. And polyacetylene derivatives. Furthermore, according to JP-A-2003-7461, page 7, “0031”, these polymer materials are toluene, benzene, chlorobenzene, dichlorobenzene, chloroform, tetralin, xylene, anisole, dichloromethane, γ-butyrolactone, butyl cellosolve, cyclohexane, A precursor is dissolved in one or more selected from solvents such as NMP (N-methyl-2-pyrrolidone), dimethyl sulfoxide, cyclohexanone, dioxane, or THF (tetrahydrofuran), and a film is formed by spin coating. The
これら有機機能層は、既知のあらゆる成膜法を用いて形成することができる。特に可溶な有機物からなる有機機能層は、ウエットプロセスによって形成する事ができる。ウエットプロセスで形成する場合は、通常、材料を溶媒に溶解した塗布液を用いる。溶媒としては、前述の溶媒の他、PGME（propyleneglycol monomethyl ether）、PGMEA（propyleneglycol monomethyl ether acetate）、乳酸エチル、DMAc（N.N-dimethylacetamide）、MEK（methyl ethyl ketone）、MIBK（methyl isobutyl ketone）、IPA（iso propyl alcohol）、エタノール等、既知の溶剤を用いる事ができる。 These organic functional layers can be formed using any known film forming method. In particular, an organic functional layer made of a soluble organic material can be formed by a wet process. When forming by a wet process, a coating solution in which a material is dissolved in a solvent is usually used. As the solvent, in addition to the above-mentioned solvents, PGME (propyleneglycol monomethyl ether), PGMEA (propyleneglycol monomethyl ether acetate), ethyl lactate, DMAc (NN-dimethylacetamide), MEK (methyl ethyl ketone), MIBK (methyl isobutyl ketone), IPA Known solvents such as (iso propyl alcohol) and ethanol can be used.
以上のように、従来の有機EL素子やそれを用いた表示パネルでは、有機機能層をウエットプロセスで形成することができる。 As described above, in a conventional organic EL element and a display panel using the same, an organic functional layer can be formed by a wet process.
ウエットプロセスのうち、特に簡便に成膜できる方法として、例えばスプレー法がある。スプレー法は、例えば特開２００１−２９７８７６の図１に開示される通り、ノズルから溶液を霧状にして基板に吹き付けて成膜する方法である。一般に、有機機能層は所定の形状にパターニングする必要があるが、例えば、特開２００１−２９７８７６の図２の様な方法を用いることができる。特開２００１−２９７８７６の図２の方法では、同文献「００２８」に記載されるように、赤、緑、青色の発光パターンに合わせたマスクや、それに限らず、発光色、発光形状による複数のマスクを交換して成膜できる技術が開示される。この方法では、発光形状の異なったマスクをマスク板収納室に備え、マスク板交換ロボットにより、適宜、パターンの違うマスクを交換することにより、様々なパターン表示が可能な有機ＥＬ素子を作製することが可能とされる。 Among the wet processes, there is a spray method, for example, as a method that can be particularly easily formed into a film. The spray method is a method of forming a film by spraying a solution from a nozzle onto a substrate as disclosed in, for example, FIG. 1 of JP-A-2001-297876. In general, the organic functional layer needs to be patterned into a predetermined shape. For example, a method as shown in FIG. 2 of JP-A-2001-297876 can be used. In the method of FIG. 2 of Japanese Patent Laid-Open No. 2001-297876, as described in the same document “0028”, there are a plurality of masks that match red, green, and blue light emission patterns, and a plurality of light emission colors and light emission shapes. A technique capable of forming a film by exchanging a mask is disclosed. In this method, an organic EL element capable of displaying various patterns is prepared by providing masks with different light emission shapes in a mask plate storage chamber and appropriately exchanging masks with different patterns by a mask plate exchange robot. Is possible.
従来技術では、マスクに付着した溶液の影響を全く考慮しておらず、マスク上に流動性を保ったまま付着する溶液が、マスクから基板などにこぼれ落ち、周囲を汚染してしまう問題があった。さらに、塗布枚数が増えるほど、マスク上に滞留する溶液の量が多くなり、大量の基板を連続して成膜するのは困難であったが本実施形態ではそのような課題をより解決している。すなわち、本実施形態では、良好な膜を形成するために乾きにくい塗布液を使用した場合でも、マスクに付着した溶液が乾きやすく、マスク上から落下しにくい。よって、基板を汚染することが少ない。また、マスクを固定したまま、基板を順次取り替えることで、複数の基板を、マスクを交換することなく、連続して塗布できる。 In the prior art, the effect of the solution attached to the mask is not considered at all, and the solution that adheres to the mask while maintaining fluidity spills from the mask onto the substrate and contaminates the surroundings. . Furthermore, as the number of coatings increases, the amount of the solution staying on the mask increases, and it was difficult to continuously form a large number of substrates, but this embodiment further solves such a problem. Yes. That is, in this embodiment, even when a coating solution that does not easily dry is used to form a good film, the solution attached to the mask is easy to dry and does not easily fall from the mask. Therefore, the substrate is hardly contaminated. In addition, by sequentially replacing the substrates while the mask is fixed, a plurality of substrates can be applied continuously without changing the mask.
次に、本実施形態の変形例について説明する。例えば、非接触の加熱方法が挙げられる。図３に示すように、赤外線ヒータを離れた位置に設け、非接触の加熱方法でマスクを加熱することも可能である。この場合、基板を同時に加熱してしまう問題があることは前述した通りだが、ヒータの制御を以下のように順番で動作させることで解決すると好適である。（１）ヒータをＯＮして加熱する。（２）規定のマスクの表面温度に達したらヒータをＯＦＦする。（３）基板を位置合わせして載置する。（４）スプレー噴射により噴射した溶液を塗布する。（５）基板を排出する。以降（１）〜（５）の繰り返しを行う。本形態では、マスクを非接触で加熱するのでマスクにヒータを組み込む必要がなく、マスクを単純な構成とすることができる。 Next, a modification of this embodiment will be described. For example, a non-contact heating method can be mentioned. As shown in FIG. 3, it is also possible to provide the infrared heater at a remote position and heat the mask by a non-contact heating method. In this case, as described above, there is a problem that the substrate is heated at the same time. However, it is preferable to solve the problem by operating the heaters in the following order. (1) Turn on the heater to heat. (2) The heater is turned off when the specified mask surface temperature is reached. (3) The substrate is aligned and placed. (4) A solution sprayed by spraying is applied. (5) The substrate is discharged. Thereafter, the steps (1) to (5) are repeated. In this embodiment, since the mask is heated in a non-contact manner, it is not necessary to incorporate a heater in the mask, and the mask can be configured simply.
また、本実施形態では、前記表面マスクは代えずに、前記被塗布材を複数個処理すると好適であるが、これに限られない。 In the present embodiment, it is preferable to process a plurality of the coated materials without changing the surface mask, but the present invention is not limited to this.
前記表面温度は、前記塗布雰囲気の温度よりも１０℃以上の温度から摂氏１５０℃以下の温度とすると好適であるがこれに限られない。前記表面温度は、前記塗布雰囲気の温度よりも２０℃以上の温度から摂氏１００℃以下の温度とすると好適であるがこれに限られない。前記表面温度は、前記塗布雰囲気の温度よりも３０℃以上の温度から摂氏８０℃以下の温度とすると好適であるがこれに限られない。 The surface temperature is preferably 10 ° C. or more to 150 ° C. or less than the temperature of the coating atmosphere, but is not limited thereto. The surface temperature is preferably 20 ° C. or more to 100 ° C. or less than the temperature of the coating atmosphere, but is not limited thereto. The surface temperature is preferably 30 ° C. or more to 80 ° C. or less than the temperature of the coating atmosphere, but is not limited thereto.
本実施形態では、前記表面温度について、ヒータを用いて高温にすると好適であるが、これに限られない。前記表面温度について、前記表面マスクと非接触で高温にすると好適であるが、これに限られない。前記ヒータは、前記表面マスクに接触させられると好適であるが、これに限られない。前記塗布されている間は、前記表面温度の高温化を停止すると好適であるが、これに限られない。 In the present embodiment, the surface temperature is preferably set to a high temperature using a heater, but is not limited thereto. The surface temperature is preferably high without contact with the surface mask, but is not limited thereto. The heater is preferably brought into contact with the surface mask, but is not limited thereto. While the coating is being applied, it is preferable to stop increasing the surface temperature, but the present invention is not limited to this.
本実施形態では、前記被塗布材が半導体基板、有機トランジスタ基板、有機ＥＬ素子構成層のうち少なくとも一つであると好適であるが、これに限られない。前記有機ＥＬ素子構成層は、基板、陽極、有機機能層の各層、陰極、基板側の保護バリア膜、封止膜のうち少なくとも１層であると好適であるが、これに限られない。前記塗布物が揮発性の低い成分を含む（乾燥しにくい）と好適であるが、これに限られない。前記塗布雰囲気とは、前記被塗布材の表面温度であると好適であるが、これに限られない。 In the present embodiment, the material to be coated is preferably at least one of a semiconductor substrate, an organic transistor substrate, and an organic EL element constituent layer, but is not limited thereto. The organic EL element constituent layer is preferably at least one layer among the substrate, the anode, each layer of the organic functional layer, the cathode, the protective barrier film on the substrate side, and the sealing film, but is not limited thereto. Although it is preferable that the coated material contains a component having low volatility (it is difficult to dry), the present invention is not limited to this. The coating atmosphere is preferably the surface temperature of the material to be coated, but is not limited thereto.
Claims (28)
前記塗布物の塗布時における前記表面マスクの表面温度を、塗布雰囲気よりも高温とする塗布物被塗布材の製造方法。 The surface of the material to be coated is a surface mask on which a mask pattern is formed in which the corresponding portion where the coated material is applied to the surface of the material to be coated is penetrated and the corresponding portion is prevented from being coated on the surface of the material to be coated. A coating material surface coating material produced by spraying and coating the coating material from a spray nozzle through the surface mask,
The manufacturing method of the coating material to-be-coated material which makes the surface temperature of the said surface mask at the time of application | coating of the said coating material higher than application | coating atmosphere.
前記表面マスクを交換せずに同一のマスクを用い、前記被塗布材を複数個処理する塗布物被塗布材の製造方法。 It is a manufacturing method of the coated article application material according to claim 1,
A method of manufacturing a coated material to be coated, in which a plurality of the coated materials are processed using the same mask without replacing the surface mask.
前記表面温度は、前記塗布雰囲気の温度よりも１０℃以上の温度から摂氏１５０℃以下の温度とする塗布物被塗布材の製造方法。 It is a manufacturing method of the coated article application material according to claim 1 or 2,
The surface temperature is a manufacturing method of a material to be coated, which is set to a temperature of 10 ° C. or higher to 150 ° C. or lower than the temperature of the coating atmosphere.
前記表面温度は、前記塗布雰囲気の温度よりも２０℃以上の温度から摂氏１００℃以下の温度とする塗布物被塗布材の製造方法。 It is a manufacturing method of the coated article coated material according to claim 3,
The surface temperature is a manufacturing method of a material to be coated, which is set to a temperature of 20 ° C. or higher to 100 ° C. or lower than the temperature of the coating atmosphere.
前記表面温度は、前記塗布雰囲気の温度よりも３０℃以上の温度から摂氏８０℃以下の温度とする塗布物被塗布材の製造方法。 It is a manufacturing method of the coated article application material according to claim 4,
The surface temperature is a manufacturing method of a material to be coated, which is set to a temperature of 30 ° C. or higher to 80 ° C. or lower than the temperature of the coating atmosphere.
前記表面温度は、塗布物の固形分のガラス転移温度、沸点、昇華温度のいずれかの温度以下とする塗布物被塗布材の製造方法。 It is a manufacturing method of the coated article application material according to claim 1,
The said surface temperature is a manufacturing method of the coating material target material made into the glass transition temperature of the solid content of a coating material, the boiling point, or the sublimation temperature below.
前記表面温度について、ヒータを用いて高温にする塗布物被塗布材の製造方法。 It is a manufacturing method of the coated article application material according to any one of claims 1 to 6,
About the said surface temperature, the manufacturing method of the coating material to-be-coated material which makes it high temperature using a heater.
前記表面温度について、前記表面マスクと非接触で高温にする塗布物被塗布材の製造方法。 It is a manufacturing method of the coated article application material according to any one of claims 1 to 7,
The manufacturing method of the coating material to be coated, in which the surface temperature is set high without contact with the surface mask.
前記ヒータは、前記表面マスクに接触させられる塗布物被塗布材の製造方法。 It is a manufacturing method of the coated article coated material according to claim 6,
The heater is a manufacturing method of a coated material to be coated, which is brought into contact with the surface mask.
前記塗布されている間は、前記表面温度の高温化を停止する塗布物被塗布材の製造方法。 It is a manufacturing method of the coated article application material according to any one of claims 1 to 9,
A method of manufacturing a material to be coated on which an increase in the surface temperature is stopped during the coating.
前記被塗布材が半導体基板、有機トランジスタ基板、有機ＥＬ素子構成層のうち少なくとも一つである塗布物被塗布材の製造方法。 It is a manufacturing method of the coated article coated material according to any one of claims 1 to 10,
The manufacturing method of the coating material coating material whose said coating material is at least 1 among a semiconductor substrate, an organic transistor substrate, and an organic EL element structural layer.
前記有機ＥＬ素子構成層は、基板、陽極、有機機能層の各層、陰極、基板側の保護バリア膜、封止膜のうち少なくとも１層である塗布物被塗布材の製造方法。 It is a manufacturing method of the coated article application material according to claim 11,
The organic EL element constituent layer is a method for producing a coated material to be coated, which is at least one layer among a substrate, an anode, organic functional layers, a cathode, a protective barrier film on the substrate side, and a sealing film.
前記塗布物が揮発性の低い溶媒成分を含む塗布物被塗布材の製造方法。 It is a manufacturing method of the coated article coated material according to any one of claims 1 to 12,
The manufacturing method of the coating material to-be-coated material in which the said coating material contains a solvent component with low volatility.
前記塗布雰囲気とは、前記被塗布材の表面である塗布物被塗布材の製造方法。 It is a manufacturing method of the coated article application material according to any one of claims 1 to 13,
The coating atmosphere is a method for manufacturing a coated material to be coated, which is the surface of the coated material.
前記塗布物の塗布時における前記表面マスクの表面温度を、塗布雰囲気よりも高温とする塗布物被塗布材の製造装置。 The surface of the material to be coated is a surface mask on which a mask pattern is formed in which the corresponding portion where the coated material is applied to the surface of the material to be coated is penetrated and the corresponding portion is prevented from being coated on the surface of the material to be coated. A coating material surface coating material manufacturing apparatus formed by spraying and coating the coating material from a spray nozzle through the surface mask,
An apparatus for manufacturing a material to be coated on which a surface temperature of the surface mask at the time of coating the coated material is higher than a coating atmosphere.
前記表面マスクを交換せずに同一のマスクを用い、前記被塗布材を複数個処理する塗布物被塗布材の製造装置。 It is a manufacturing apparatus of the coated article application material according to claim 15,
An apparatus for manufacturing a material to be coated using the same mask without replacing the surface mask and processing a plurality of the materials to be coated.
前記表面温度は、前記塗布雰囲気の温度よりも１０℃以上の温度から摂氏１５０℃以下の温度とする塗布物被塗布材の製造装置。 It is a manufacturing apparatus of the coated article application material according to claim 15 or 16,
The apparatus for manufacturing a material to be coated, in which the surface temperature is set to a temperature of 10 ° C. or higher to 150 ° C. or lower than the temperature of the coating atmosphere.
前記表面温度は、前記塗布雰囲気の温度よりも２０℃以上の温度から摂氏１００℃以下の温度とする塗布物被塗布材の製造装置。 It is a manufacturing apparatus of the coated article application material according to claim 17,
The apparatus for manufacturing a material to be coated, in which the surface temperature is 20 ° C. or higher to 100 ° C. or lower than the temperature of the coating atmosphere.
前記表面温度は、前記塗布雰囲気の温度よりも３０℃以上の温度から摂氏８０℃以下の温度とする塗布物被塗布材の製造装置。 It is a manufacturing apparatus of the coated article application material according to claim 18,
The apparatus for manufacturing a coated material to be coated, wherein the surface temperature is set to a temperature of 30 ° C. or higher to 80 ° C. or lower than the temperature of the coating atmosphere.
前記表面温度は、塗布物の固形分のガラス転移温度、沸点、昇華温度のいずれかの温度以下とする塗布物被塗布材の製造装置。 It is a manufacturing apparatus of the coated article application material according to claim 15,
The said surface temperature is a manufacturing apparatus of the coating material coated material made into the glass transition temperature of the solid content of a coating material, the boiling point, or the sublimation temperature below.
前記表面温度について、ヒータを用いて高温にする塗布物被塗布材の製造装置。 An apparatus for manufacturing a material to be coated according to any one of claims 15 to 20,
An apparatus for manufacturing a material to be coated that is heated to a high temperature using a heater.
前記表面温度について、前記表面マスクと非接触で高温にする塗布物被塗布材の製造装置。 It is a manufacturing apparatus of the coated material to be coated according to any one of claims 15 to 21,
An apparatus for manufacturing a material to be coated, which makes the surface temperature high without contact with the surface mask.
前記ヒータは、前記表面マスクに接触させられる塗布物被塗布材の製造装置。 It is a manufacturing apparatus of the coated article application material according to claim 21,
The heater is an apparatus for manufacturing a material to be coated that is brought into contact with the surface mask.
前記塗布されている間は、前記表面温度の高温化を停止する塗布物被塗布材の製造装置。 An apparatus for manufacturing a material to be coated according to any one of claims 15 to 23,
An apparatus for manufacturing a material to be coated that stops the increase in the surface temperature during the coating.
前記被塗布材が半導体基板、有機トランジスタ基板、有機ＥＬ素子構成層のうち少なくとも一つである塗布物被塗布材の製造装置。 An apparatus for manufacturing a coated material to be coated according to any one of claims 15 to 24,
An apparatus for manufacturing a material to be coated, wherein the material to be coated is at least one of a semiconductor substrate, an organic transistor substrate, and an organic EL element constituent layer.
前記有機ＥＬ素子構成層は、基板、陽極、有機機能層の各層、陰極、基板側の保護バリア膜、封止膜のうち少なくとも１層である塗布物被塗布材の製造装置。 It is a manufacturing apparatus of the coated article application material according to claim 25,
The organic EL element constituent layer is an apparatus for manufacturing a coated material to be coated, which is at least one of a substrate, an anode, each layer of an organic functional layer, a cathode, a protective barrier film on the substrate side, and a sealing film.
前記塗布物が揮発性の低い溶媒成分を含む塗布物被塗布材の製造装置。 27. An apparatus for manufacturing a material to be coated according to any one of claims 15 to 26, wherein:
An apparatus for manufacturing a coated material to be coated, wherein the coated material includes a low-volatile solvent component.
前記塗布雰囲気とは、前記被塗布材の表面である塗布物被塗布材の製造装置。 An apparatus for manufacturing a material to be coated according to any one of claims 15 to 27,
The coating atmosphere is an apparatus for manufacturing a coated material to be coated, which is the surface of the coated material.
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| JP2005036908A JP2006218460A (en) | 2005-02-14 | 2005-02-14 | Method and apparatus for producing coating material-coated material |
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