WO2006085457A1 - Procede et equipement pour la production d’elements revetus et masque de surface - Google Patents

Procede et equipement pour la production d’elements revetus et masque de surface Download PDF

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Publication number
WO2006085457A1
WO2006085457A1 PCT/JP2006/301628 JP2006301628W WO2006085457A1 WO 2006085457 A1 WO2006085457 A1 WO 2006085457A1 JP 2006301628 W JP2006301628 W JP 2006301628W WO 2006085457 A1 WO2006085457 A1 WO 2006085457A1
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WO
WIPO (PCT)
Prior art keywords
coated
manufacturing
mask
gap
coating material
Prior art date
Application number
PCT/JP2006/301628
Other languages
English (en)
Japanese (ja)
Inventor
Kenichi Nagayama
Original Assignee
Pioneer Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pioneer Corporation filed Critical Pioneer Corporation
Publication of WO2006085457A1 publication Critical patent/WO2006085457A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/16—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
    • B05B12/20—Masking elements, i.e. elements defining uncoated areas on an object to be coated
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing

Definitions

  • the present invention relates to a method and apparatus for manufacturing a coated material to be coated, a surface mask, in particular, a corresponding portion where the coated material is coated on the surface of the coated material, and is applied to the surface of the coated material. Cover the surface of the material to be coated with a surface mask on which a mask pattern in which corresponding portions to be prevented from penetrating are formed, spray the coating material from the spray nozzle through the surface mask, and apply the coating material.
  • the present invention relates to a coating material manufacturing method and manufacturing apparatus, and a surface mask. Background art
  • a method for producing a coated material to be coated is reported which covers the surface of the coated material, sprays the coated material from the spray nozzle through the surface mask, and coats it! Speak.
  • Patent Document 2 For example, as a method for manufacturing a material to be coated, a technique for forming an organic functional layer into a predetermined shape using a mask and using a mask is described in Patent Document 2, below. It is also disclosed in Patent Document 3 below.
  • Patent Document 2 there is a technique for forming an organic functional layer having a predetermined shape by injecting a composition containing dispersed particles of an organic compound with an inert gas and passing through an opening of a mask. Disclosed.
  • Patent Document 3 discloses a method for forming an organic functional layer in which a solution in which a polymer EL material is dissolved is sprayed in a vacuum atmosphere.
  • Paragraph “0034” of the same document describes a technique in which a red light emitting layer is formed using a pixel coating mask, and then the blue and green light emitting layers are sequentially formed by shifting the mask by a predetermined amount.
  • Patent Document 1 Japanese Patent Laid-Open No. 2001-297876
  • Patent Document 2 Japanese Patent Laid-Open No. 2002-343566
  • Patent Document 3 Japanese Patent Laid-Open No. 2003-257631
  • the droplet force that has come into consideration does not consider the intrusion between the mask and the substrate.
  • the coating is applied close to each other, as shown in Fig. 7 of this application, the liquid incident between the mask and the substrate penetrates between the mask and the substrate due to the capillary phenomenon, and the pattern accuracy of the organic functional layer deteriorates. was there. In particular, this problem became prominent when a coating solution that was difficult to dry was used to form a good film.
  • the present invention has been made in view of the above problems, and it is a main object of the present invention to provide a manufacturing method and manufacturing apparatus for a coated material to which a coated material is applied with higher accuracy, and a surface mask. Target.
  • a mask pattern is formed in which a corresponding portion where the coated material is applied to the surface of the material to be coated penetrates and a corresponding portion which prevents the coated material from being applied to the surface of the material to be coated is not penetrated.
  • the surface of the material to be coated is covered with a surface mask, and the coated material is sprayed from the spray nozzle through the surface mask and applied to the surface of the material to be coated.
  • a gap having a thickness larger than the diameter of the droplet of the sprayed coating is formed by separating the back of the mask, and after the gap is formed, the coating is sprayed and applied.
  • a mask pattern is formed in which a corresponding portion where a coated material is applied to the surface of a material to be coated penetrates and a corresponding portion which prevents the coated material from being applied to the surface of the material to be coated is not penetrated.
  • the surface of the material to be coated is covered with a surface mask, and the coated material is sprayed from the spray nozzle through the surface mask and applied.
  • a gap having a thickness larger than the diameter of the droplet of the sprayed coating is formed by separating the back of the mask, and after the gap is formed, the coating is sprayed and applied.
  • the present invention is used in a method for producing a coating material surface coating material that covers and coats a surface of a material to be coated, and sprays and coats a coating material such as a spray nozzle, and the coating material is the material to be coated. Corresponding parts that are applied to the surface penetrate, and corresponding parts that prevent it from being applied to the surface of the material to be coated do not penetrate.
  • FIG. 1 is a diagram schematically illustrating an apparatus for manufacturing a material to be coated in the present embodiment.
  • FIG. 2 is a cross-sectional view of an organic EL element in the present embodiment.
  • FIG. 3 is a diagram schematically illustrating an apparatus for manufacturing a material to be coated in the present embodiment.
  • FIG. 4 is a diagram schematically illustrating an apparatus for manufacturing a material to be coated in the present embodiment.
  • FIG. 5 is a diagram schematically illustrating an apparatus for manufacturing a material to be coated in the present embodiment.
  • FIG. 6 is a diagram schematically illustrating an apparatus for manufacturing a material to be coated in the present embodiment.
  • FIG. 7 is a diagram schematically illustrating an apparatus for manufacturing a material to be coated in the prior art.
  • Fig. 1 shows a surface mask with a mask pattern in which the corresponding part where the applied material is applied to the surface of the material to be applied penetrates and the corresponding part which prevents the applied material from being applied to the surface of the material to be applied is not penetrated.
  • the surface of the material to be coated is covered with 1 mm, and the coated material is sprayed from the spray nozzle through the surface mask and applied, and the surface mask is applied from the surface of the material to be coated.
  • An organic EL device that forms a gap having a thickness larger than the diameter of the droplet of the sprayed coating material by spraying the coating material and sprays the coating material after forming the gap.
  • the manufacturing equipment is shown. [0014] The organic EL device manufacturing apparatus of FIG.
  • a surface mask disposed on the substrate surface, a nozzle disposed on the surface mask, a nozzle for spray application, and a solution for supplying a coating liquid to the application nozzle.
  • a feeding device In the surface mask, an opening is formed through a corresponding portion where the coated material is applied to the surface of the material to be coated. Only on the substrate, the spray (droplet ejected) from the nozzle is applied to the substrate surface as a solution applied to the substrate only through the opening.
  • the thickness of the gap between the mask and the substrate is set to a distance equal to or larger than the diameter of the droplets crushed into a mist by the nozzle.
  • the gap g ⁇ droplet diameter a.
  • the gap is formed so that the gap between the mask and the substrate is larger than the diameter of the droplet.
  • the solvent used in the solution has a very high drying rate. Although it cannot be unequivocally stated due to the size of the mist-like droplets, the coating atmosphere, the distance between the nozzle and the substrate, etc., it is preferable that at least one solvent constituting the solution to be used has low volatility.
  • the boiling point should be at least 100 ° C, preferably 150 ° C, and most preferably 200 ° C.
  • the mask used in the present invention is preferably made of a material that does not dissolve in the coating solution.
  • a metal such as stainless steel or a resin such as polyimide is suitable.
  • the gap between the mask and the substrate may be at least larger than the size of the droplet immediately before reaching the substrate. If the gap is too large, it is not preferable because the pattern is blurred by droplets incident obliquely on the mask.
  • the size of the gap is preferably 1Z10 or less of the dimension of the mask opening or lmm or less, most preferably lZlOO or less of the dimension of the mask opening. Or 0.1mm or less is desirable.
  • the size of the droplet can be measured, for example, using laser light. Since it is often difficult to measure the size of a droplet just before it reaches the substrate, it is possible to use the size of the droplet just after it ejects from the nozzle. This is because the droplets ejected from the nozzle force are dried and become small before reaching the substrate, but they do not become large.
  • the size of the droplet immediately after ejecting from the nozzle cannot be generally stated depending on the type of solution and spray conditions, but is generally 1 to: LOOO / zm. If the size of the droplet immediately after ejecting the nozzle is too small, the droplet will dry and lose fluidity when it reaches the substrate, resulting in insufficient leveling and a uniform film cannot be formed. On the other hand, if the size of the droplet immediately after ejecting the nozzle is too large, a large gap between the mask and the substrate must be taken.
  • the size of the droplet immediately after ejecting the nozzle is preferably 10 to: LOO / zm.
  • the size of a droplet has a distribution close to a normal distribution with a certain width at a certain size. In that case, it is desirable to make the gap larger than the largest observed droplet. However, the gap may be larger than the average of the droplet size distribution + 3 ⁇ .
  • the distance between the mask and the substrate is detected by a sensor, and the mask is moved up and down by a gap adjusting mechanism so that the gap is within the scope of the present invention.
  • the gap sensor between the mask and the substrate may be arbitrary, but for example, an optical sensor that is often used for measuring the gap between the photomask and the substrate in a photoresist exposure apparatus may be used.
  • the mask is moved up and down to adjust the gap.
  • the substrate may be moved up and down, or both the mask and the substrate may be powered.
  • the gap between the mask and the substrate is equal to or greater than the diameter of the droplet, the droplets that come in contact with the mask back surface and both sides of the substrate surface are prevented from entering between the mask and the substrate due to capillary action. it can.
  • Fig. 2 shows the structure of the organic EL device manufactured by the manufacturing equipment shown in Fig. 1.
  • the light emitting functional layer is mainly made of organic material, holes are injected from the anode, electrons are injected from the cathode, and recombined in the light emitting layer to emit light.
  • the organic functional layer of an organic EL device usually consists of multiple layers with each function, such as hole injection layer, Z hole transport layer, Z light-emitting layer, Z electron transport layer, and Z electron injection layer.
  • Each of these organic functional layers is usually made of an organic material, and may be made of a high molecular weight organic material when it is made of a low molecular weight organic material.
  • Organic functional layers made of low molecular organic materials are generally produced by a dry process (vacuum process) such as vapor deposition, while organic functional layers made of high molecular organic materials are generally produced by spin coating, blade coating, dipping, In general, they are formed by wet processes such as spraying and printing.
  • vacuum process vacuum process
  • organic functional layers made of high molecular organic materials are generally produced by spin coating, blade coating, dipping, In general, they are formed by wet processes such as spraying and printing.
  • An example of an organic functional layer made of an organic substance soluble in an organic solvent is disclosed in, for example, JP-A-2003-74611. JP 2003-7461, pp. 0023 to “0024” on page 6, PEDOT, polyarine, polyparaphenylene-biylene derivatives, polythiophene derivatives, polyparaphenylene derivatives, poly Examples include alkylphenolene and polyacetylene derivatives.
  • these polymer materials are toluene, benzene, black benzene, dichlorobenzene, black form, tetralin, xylene, anisole, dichloromethane, y butyrolatathone,
  • the precursor is dissolved in one or more selected from solvents such as butyralsolvol, cyclohexane, NMP (N-methyl 2-pyrrolidone), dimethyl sulfoxide, cyclohexanone, dioxane or THF (tetrahydrofuran). And it forms into a film by a spin coat method.
  • organic functional layers can be formed using any known film forming method.
  • an organic functional layer that also has soluble organic strength can be formed by a wet process.
  • a coating solution in which a material is dissolved in a solvent is usually used.
  • PGME propyleneglycol monomethyl ether
  • PGME A propyleneglycol monomethyl ether acetate
  • ⁇ L acid ethynole DMAc (NN-dimethyla cetamide)
  • MEK methyl ethyl ketone
  • MIBK methyl isobutyl ketone
  • I PA iso pr
  • solvents such as opyl alcohol
  • ethanol can be used.
  • the organic functional layer can be formed by a wet process.
  • the spray method is a method of forming a film by spraying a nozzle force solution in the form of a mist, for example, as disclosed in FIG. 1 of JP-A-2001-297876.
  • the organic functional layer needs to be patterned into a predetermined shape.
  • a method as shown in FIG. 2 of JP-A-2001-297876 can be used.
  • 2001-297876 as described in “002 8” of the same document, it is not limited to a mask matched to a red, green, and blue light emission pattern, and is not limited to this.
  • a technique capable of forming a film by exchanging a plurality of masks is disclosed. In this method, masks with different light emission shapes are provided in the mask plate storage chamber, and the mask plate exchange robot replaces the masks with different patterns as appropriate to produce organic EL elements that can display various patterns. It is possible.
  • the conventional technique pays no attention to the gap between the mask and the substrate, whereas in the present invention, the gap between the mask and the substrate is sprayed. Actively and precisely control the diameter of the droplets atomized by.
  • the organic EL manufacturing apparatus may be provided with a spacer inserted between a mask and a substrate.
  • a spacer inserted between a mask and a substrate.
  • it is sufficient to prepare multiple types of spacers with different thicknesses. Since only the spacer is inserted, the mechanism is simple and the cost of the device can be reduced.
  • the organic EL manufacturing apparatus may be provided with an apparatus for observing droplets.
  • the size of the droplet changes due to the replacement of the droplet or the change of the spray conditions. Therefore, if there is a device for observing droplets, the mask-substrate gap can be determined quickly. [0037] By observing the droplet in real time and measuring the diameter of the droplet, and controlling the gap adjustment mechanism so that the gap between the mask and the substrate can be minimized, the pattern accuracy is further improved. Application can be performed. Since the gap can be controlled to the minimum necessary in real time, the organic functional layer can be formed with good pattern accuracy.
  • the mask in FIG. 4 has a protrusion (support) that protrudes larger than the diameter of the droplet.
  • the convex portion may be at any position.
  • it may be formed on a part of the mask shielding portion.
  • a conventional spray mask has a simple flat plate shape.
  • the spray mask according to the present invention has a convex portion. This eliminates the need for the gap adjusting mechanism in the coating apparatus.
  • the thickness of the gap is preferably 1Z10 or less of the shortest opening diameter of the penetrating portion, but is not limited thereto.
  • the thickness of the gap is preferably 1Z100 or less, which is the shortest opening diameter of the penetrating portion, but is not limited thereto.
  • the thickness of the gap is preferably 1 mm or less, but is not limited thereto.
  • the thickness of the gap is preferably 0.1 mm or less, but is not limited thereto.
  • the present invention it is preferable to use the substantially maximum value of the diameter of the droplet as the value of the diameter of the droplet, but the present invention is not limited to this.
  • the value of the droplet diameter is preferably the average value of the droplet diameters + 3 ⁇ , but is not limited thereto.
  • the present invention is not limited to this.
  • the material to be coated is preferably at least one of a semiconductor substrate, an organic transistor substrate, and an organic EL device constituent layer, but is not limited thereto.
  • the organic EL device component layer is preferably at least one of the substrate, anode, organic functional layer, cathode, protective barrier film on the substrate side, and sealing film, but is not limited thereto. It is preferable that the coating material contains a low-volatile solvent component (it is difficult to dry! / ⁇ ), but is not limited to this.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

La présente invention concerne un procédé pour la production d’éléments revêtus avec une grande précision, un équipement pour la production d ceux-ci et un masque de surface. Un procédé pour la production d’un élément revêtu qui consiste à recouvrir une surface d’un substrat avec un masque de surface ayant une configuration de masque composée de zones débouchantes correspondant aux parties de surface du substrat devant être revêtues et de zones non débouchantes correspondant aux parties de celle-ci ne devant pas être revêtues et à souffler une matière de revêtement depuis une buse vers le substrat à travers le masque, le masque étant en outre réglé de manière telle que l’arrière du masque est séparé de la surface du substrat pour ainsi former un espace plus grand que le diamètre des gouttelettes soufflées de la matière de revêtement, suivi du soufflage.
PCT/JP2006/301628 2005-02-14 2006-02-01 Procede et equipement pour la production d’elements revetus et masque de surface WO2006085457A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005-036907 2005-02-14
JP2005036907A JP2008104894A (ja) 2005-02-14 2005-02-14 塗布物被塗布材の製造方法および製造装置、表面マスク

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WO2006085457A1 true WO2006085457A1 (fr) 2006-08-17

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TW (1) TW200638788A (fr)
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Publication number Priority date Publication date Assignee Title
CN104607342A (zh) * 2013-11-05 2015-05-13 沈阳芯源微电子设备有限公司 旋转外环粘贴保护装置
DE102014116076A1 (de) * 2014-11-04 2016-05-04 Osram Opto Semiconductors Gmbh Verfahren zum Aufbringen eines Materials auf einer Oberfläche

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001297876A (ja) * 2000-04-12 2001-10-26 Tokki Corp 有機ｅｌ表示素子の製造方法および製造装置
JP2001351779A (ja) * 2000-06-07 2001-12-21 Tdk Corp 有機ｅｌ素子の製造方法、および有機ｅｌ素子
JP2002343566A (ja) * 2001-05-21 2002-11-29 Semiconductor Energy Lab Co Ltd 発光装置の作製方法
JP2003257631A (ja) * 2002-02-28 2003-09-12 Sanyo Electric Co Ltd 有機ｅｌ素子の形成方法
JP2005078892A (ja) * 2003-08-29 2005-03-24 Optrex Corp 有機ｅｌ表示素子、その製造方法およびマスク

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001297876A (ja) * 2000-04-12 2001-10-26 Tokki Corp 有機ｅｌ表示素子の製造方法および製造装置
JP2001351779A (ja) * 2000-06-07 2001-12-21 Tdk Corp 有機ｅｌ素子の製造方法、および有機ｅｌ素子
JP2002343566A (ja) * 2001-05-21 2002-11-29 Semiconductor Energy Lab Co Ltd 発光装置の作製方法
JP2003257631A (ja) * 2002-02-28 2003-09-12 Sanyo Electric Co Ltd 有機ｅｌ素子の形成方法
JP2005078892A (ja) * 2003-08-29 2005-03-24 Optrex Corp 有機ｅｌ表示素子、その製造方法およびマスク

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TW200638788A (en) 2006-11-01

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