CN104607342A - Rotary outer ring adhesion protecting device - Google Patents
Rotary outer ring adhesion protecting device Download PDFInfo
- Publication number
- CN104607342A CN104607342A CN201310542162.3A CN201310542162A CN104607342A CN 104607342 A CN104607342 A CN 104607342A CN 201310542162 A CN201310542162 A CN 201310542162A CN 104607342 A CN104607342 A CN 104607342A
- Authority
- CN
- China
- Prior art keywords
- outer shroud
- outer ring
- rotary outer
- silicagel pad
- silica gel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
- B05B12/16—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
- B05B12/20—Masking elements, i.e. elements defining uncoated areas on an object to be coated
- B05B12/24—Masking elements, i.e. elements defining uncoated areas on an object to be coated made at least partly of flexible material, e.g. sheets of paper or fabric
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention relates to a device for spraying and applying liquid medicine to wafers in the field of semiconductor equipment, in particular to a rotary outer ring adhesion protecting device. The device is arranged on the upper surface of a rotary outer ring on the periphery of a hot disk and has a protection effect on the upper surface of the rotary outer ring. The device is a silica gel pad, attachment adhesive is arranged on the back side of the silica gel pad, and the silica gel pad adheres to the upper surface of the rotary outer ring through the attachment adhesive. When the wafers are correspondingly manufactured, chemical agents remain on the silica gel pad on the upper surface of the rotary outer ring, when the chemical agents need to be cleaned out, it is only needed that the layer of the silica gel pad is removed from the upper surface of the rotary outer ring, then, a layer of new silica gel pad adheres to the upper surface of the rotary outer ring, then, the rotary outer ring is installed on equipment again, the corresponding manufacture procedure can be performed again, and the device is convenient and fast to use.
Description
Technical field
The present invention relates to the equipment in field of semiconductor devices, wafer being carried out to sprayed coating liquid, specifically a kind of outer shroud that rotates pastes protective device.
Background technology
At present, along with the variation of manufacture of semiconductor, PROCESS FOR TREATMENT a lot of in equipment becomes increasingly complex, and often needs crystal column surface sprayed coating chemical liquid in the fabrication process, according to different manufacturing process, time of sprayed coating liquid have long have short.And the chemical liquid of institute's sprayed coating is not identical yet in different processing procedure, and also often need heat wafer after sprayed coating liquid, because of the chemical liquid of sprayed coating and the change of device interior temperature humidity, can cause to be arranged on hot plate edge rotation outer shroud upper surface and have the residual of chemical liquid and medicine stain, processing procedure can be affected for a long time, at set intervals, rotation outer shroud need be taken off from equipment, and clean in device external, after liquor residue and medicine stain are removed, be reinstalled in again on equipment, and after repeatedly manual cleaning, rotate outer shroud will reach its service life, need again change.
Summary of the invention
For the problems referred to above, the object of the present invention is to provide a kind of outer shroud that rotates to paste protective device, this device is arranged on and rotates on outer shroud upper surface, easy for installation, quick.
To achieve these goals, the present invention is by the following technical solutions:
A kind of outer shroud that rotates pastes protective device, and described device is arranged on the peripheral upper surface rotating outer shroud of heat dish, shields to the upper surface rotating outer shroud.
Described device is silicagel pad, and the back side of described silicagel pad is provided with attachment glue and passes through attachment glue on the upper surface rotating outer shroud.The thickness of described silicagel pad is 0.5mm.
After wafer carries out sprayed coating chemical agent, chemical agent remains in the silicagel pad of rotation outer shroud upper surface, this one deck silicagel pad is thrown off from the upper surface rotating outer shroud, and then is reinstalled on equipment after pasting the new silicagel pad of last layer.
Advantage of the present invention and beneficial effect are:
1. the present invention pastes one deck silicagel pad silicagel pad on the upper surface rotating outer shroud, and structure is simple, convenient disassembly.
2. the present invention adopts high performance silicon rubber cushion to be pasted onto on the upper surface of rotation outer shroud; thus the upper surface rotating outer shroud is protected; therefore extend the service life rotating outer shroud; this device have when using Non-energy-consumption, noiseless, unlubricated, be convenient to the advantages such as dismounting and change, be specially adapted in full-automatic running device, vacuum, the particular surroundings such as ultra-clean.
3. the present invention's performance rational in infrastructure is stablized; the maintenance of parts and easy to loading and unloading, just discardable after the silicagel pad rotated on outer shroud uses, rotate outer shroud itself and then needn't clean; only need again paste the new silicagel pad of one deck just can, be applicable to the occasion that various needs are protected rotation outer shroud upper surface.
Accompanying drawing explanation
Fig. 1 is that the present invention rotates the front exploded perspective view of outer shroud stickup;
Fig. 2 is mounting structure figure of the present invention;
Fig. 3 is A-A sectional view in Fig. 2;
Fig. 4 is I place enlarged drawing in Fig. 3;
Fig. 5 is the sectional view after the present invention installs;
Fig. 6 is II place enlarged drawing in Fig. 5.
Wherein: 1 for rotating outer shroud, and 2 is silicagel pad, 3 is heat dish.
Detailed description of the invention
Below in conjunction with accompanying drawing, the invention will be further described.
As shown in figures 1 to 6, device of the present invention is arranged on the peripheral upper surface rotating outer shroud 1 of heat dish 3, shields to the upper surface rotating outer shroud 1.Described device can adopt thickness to be the silicagel pad 2 of 0.5mm, and the back side of described silicagel pad 2 is provided with attachment glue and by attachment glue on the upper surface rotating outer shroud 1.Be pasted onto the silicagel pad 2 rotating outer shroud 1 upper surface to contact with chemical agent in processing procedure, and the upper surface rotating outer shroud 1 does not contact with chemical agent.After silicagel pad 2 after stickup uses a period of time on equipment, can throw off, and again can paste the new silicagel pad of one deck 2 on the upper surface rotating outer shroud 1.
The specific embodiment of the present invention:
As shown in Figure 1, silicagel pad 2 is pasted onto on the upper surface of rotation outer shroud 1, the material rotating outer shroud 1 is PTFE (polytetrafluoroethylene (PTFE)), at the back side of silicagel pad 2 with attachment glue, had the one side of glue be pasted onto rotate outer shroud 1 upper surface on (silicagel pad thickness is only 0.5mm), and then the rotation outer shroud 1 pasted is arranged on equipment, carry out corresponding manufacturing process, in processing procedure, chemical liquid meeting sprayed coating is in the silicagel pad 2 rotating outer shroud 1 upper surface, in equipment operation a period of time, silicagel pad 2 can remain some liquids and medicine stain, now clear up without the need to rotation outer shroud 1 is taken off from equipment, only the silicagel pad 2 contaminated by chemical liquid need be thrown off from the upper surface rotating outer shroud 1, and then the silicagel pad 2 that stickup one deck is new is again just passable, installation and maintenance are easy.
The present invention is applicable to equipment wafer being carried out to sprayed coating liquid, is especially suitable in manufacture of semiconductor for carrying the lower protection rotating outer shroud of wafer heat dish.Silicagel pad 2 on rotation outer shroud 1 used in the present invention is commercial products, purchases in meter Si meter company, and model is RBAMA0.5-300; Silicagel pad 2 is chemical resistance, and thickness is 0.5mm and the high performance silicon rubber cushion of a sideband attachment glue, shields to the upper surface rotating outer shroud 1.
Claims (4)
1. rotate outer shroud and paste a protective device, it is characterized in that: described device is arranged at heat dish (3) periphery and rotates on the upper surface of outer shroud (1), shields to the upper surface rotating outer shroud (1).
2. paste protective device by rotation outer shroud according to claim 1; it is characterized in that: described device is silicagel pad (2), the back side of described silicagel pad (2) is provided with attachment glue and passes through attachment glue on the upper surface rotating outer shroud (1).
3. paste protective device by rotation outer shroud according to claim 2, it is characterized in that: the thickness of described silicagel pad (2) is 0.5mm.
4. paste protective device by the rotation outer shroud described in Claims 2 or 3; it is characterized in that: carry out sprayed coating chemical agent on wafer after; chemical agent remains in the silicagel pad (2) of rotation outer shroud (1) upper surface; this one deck silicagel pad (2) is thrown off from the upper surface rotating outer shroud (1), and then is reinstalled on equipment after pasting the new silicagel pad of last layer (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310542162.3A CN104607342A (en) | 2013-11-05 | 2013-11-05 | Rotary outer ring adhesion protecting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310542162.3A CN104607342A (en) | 2013-11-05 | 2013-11-05 | Rotary outer ring adhesion protecting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104607342A true CN104607342A (en) | 2015-05-13 |
Family
ID=53142141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310542162.3A Pending CN104607342A (en) | 2013-11-05 | 2013-11-05 | Rotary outer ring adhesion protecting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104607342A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002316084A (en) * | 2001-04-19 | 2002-10-29 | Tdk Corp | Spin coating apparatus using mask and mask for spin coating |
| CN1659022A (en) * | 2002-05-03 | 2005-08-24 | 吉奥马斯克股份有限公司 | Improved adhesive tape for masking |
| CN101104780A (en) * | 2006-02-28 | 2008-01-16 | 日东电工株式会社 | Masking tape for board |
| JP2008104894A (en) * | 2005-02-14 | 2008-05-08 | Pioneer Electronic Corp | Process and equipment for production of material coated with coating material and surface mask |
| CN101992165A (en) * | 2009-08-27 | 2011-03-30 | 沈阳芯源微电子设备有限公司 | Device for chemical liquid spraying treatment of round lamellar object |
-
2013
- 2013-11-05 CN CN201310542162.3A patent/CN104607342A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002316084A (en) * | 2001-04-19 | 2002-10-29 | Tdk Corp | Spin coating apparatus using mask and mask for spin coating |
| CN1659022A (en) * | 2002-05-03 | 2005-08-24 | 吉奥马斯克股份有限公司 | Improved adhesive tape for masking |
| JP2008104894A (en) * | 2005-02-14 | 2008-05-08 | Pioneer Electronic Corp | Process and equipment for production of material coated with coating material and surface mask |
| CN101104780A (en) * | 2006-02-28 | 2008-01-16 | 日东电工株式会社 | Masking tape for board |
| CN101992165A (en) * | 2009-08-27 | 2011-03-30 | 沈阳芯源微电子设备有限公司 | Device for chemical liquid spraying treatment of round lamellar object |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3641115B2 (en) | Substrate processing equipment | |
| US9406542B2 (en) | Retention device and retention method | |
| CN106663640B (en) | Method of providing an electronic device and electronic device thereof | |
| WO2017080512A1 (en) | Surgical instrument and installation method for rfid tag for surgical instrument | |
| TW201901781A (en) | Wafer processing method | |
| CN103909474A (en) | System and Method for CMP Station Cleanliness | |
| CN104607342A (en) | Rotary outer ring adhesion protecting device | |
| TWI437627B (en) | Substrate cleaning process | |
| CN105415102A (en) | Method for grinding and polishing CdZnTe wafer without wax | |
| CN111250455A (en) | Wafer cleaning device | |
| JP2005252173A (en) | Method for manufacturing semiconductor device and device usable for it | |
| JP2015126092A (en) | Cleaning substrate and method for cleaning substrate processing device | |
| CN207542199U (en) | polishing assembly | |
| CN208427504U (en) | A kind of wet process equipment liquid stream physics decontaminating apparatus | |
| JP2008258330A (en) | Single wafer processing cleaner | |
| JPS6253773A (en) | Apparatus for applying organic film | |
| CN204775167U (en) | Special sponge dish of anhydrous carwash and anhydrous car washer | |
| CN105513994A (en) | Mechanism for preventing pollution to back of wafer | |
| KR200476530Y1 (en) | Nozzle module and cleaning apparatus having the same | |
| KR101446390B1 (en) | Filter device having silicone gasket on hefa filter bezels | |
| KR101466756B1 (en) | Wafer cleaning apparatus and method | |
| JP2013201248A (en) | Substrate housing container and foreign object removal method | |
| TWI748279B (en) | Substrate processing apparatus | |
| KR102596300B1 (en) | Substrate cleaning apparatus | |
| JP7349784B2 (en) | Substrate processing system and substrate processing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150513 |
|
| WD01 | Invention patent application deemed withdrawn after publication |