WO2006011478A1 - 電気接続箱 - Google Patents
電気接続箱 Download PDFInfo
- Publication number
- WO2006011478A1 WO2006011478A1 PCT/JP2005/013646 JP2005013646W WO2006011478A1 WO 2006011478 A1 WO2006011478 A1 WO 2006011478A1 JP 2005013646 W JP2005013646 W JP 2005013646W WO 2006011478 A1 WO2006011478 A1 WO 2006011478A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- control circuit
- circuit board
- board
- power distribution
- distribution board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/026—Multiple connections subassemblies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
- H01R9/22—Bases, e.g. strip, block, panel
- H01R9/226—Bases, e.g. strip, block, panel comprising a plurality of conductive flat strips providing connection between wires or components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
Definitions
- the present invention relates to an electrical junction box in which an electrical component is accommodated in a housing.
- Patent Document 1 JP-A-8-322127
- the electrical components such as relays generate heat when energized, so that heat generated from adjacent electrical components is not sufficiently dissipated and heat may gradually accumulate. . If heat is accumulated, problems such as deformation of parts may occur, so it is desirable to dissipate heat quickly outside the electrical junction box.
- the present invention has been completed based on the above situation, and an object thereof is to improve the heat release property of an electrical junction box.
- the invention of claim 1 is characterized in that a distribution board formed by arranging a plurality of bus bars along an insulating board is accommodated in a housing, and In an electrical junction box in which electrical components such as relays are attached to the housing and connected to the power distribution board, an electronic circuit is provided on the insulating board different from the insulating board of the power distribution board.
- the configured control circuit board is provided so as to be perpendicular to the power distribution board. On the control circuit board, the electrical components controlled by the electronic circuit are mounted and the electrical components are mounted.
- a bus bar circuit composed of a plurality of bus bars is bonded to the surface opposite to the surface via an insulating adhesive layer, and the bus bar It is characterized in that a heat radiating means for radiating the heat of the control circuit board is bonded to the surface of the one circuit opposite to the control circuit board via an insulating adhesive layer.
- the invention according to claim 2 is the invention according to claim 1, wherein a predetermined one of the bus bars constituting the bus bar circuit bonded to the control circuit board is the control circuit.
- the circuit board is bent vertically with respect to the plate surface of the circuit board, and has a feature in that a tab piece for connection to the power distribution board is formed at the tip portion.
- the invention of claim 3 is the one described in claim 1 or 2, wherein the bus bar extending along the power distribution board extends toward the control circuit board.
- a tab piece is formed, and the tab piece on the distribution board side and the tab piece on the control circuit board side are connected by a female relay terminal or welding.
- control circuit board has a mounting surface of the electrical component facing the power distribution board. And the heat radiating means is directed to the opposite side of the power distribution board.
- the invention according to claim 5 is the one according to any one of claims 1 to 4, wherein a plurality of the electrical components are mounted on the control circuit board side, They are characterized in that they are located apart from each other and near the end of the control circuit board.
- a sixth aspect of the present invention is characterized in that, in any one of the first to fifth aspects of the present invention, the electrical component on the control circuit board side is a semiconductor relay. Have.
- control circuit board is located at an end of the power distribution board, and the control circuit board has a T-shaped arrangement extending on both sides of the power distribution board. It has a characteristic where it exists.
- the invention of claim 8 is the auxiliary housing according to any one of claims 1 to 7, wherein the housing accommodates the control circuit board.
- the auxiliary housing is characterized in that the surface opposite to the power distribution board is open.
- the invention of claim 9 is the heat dissipation device according to claim 8, wherein The means is characterized in that it is a heat radiating plate provided on the open surface side of the auxiliary housing.
- the invention of claim 10 is the one described in claim 8 or 9, wherein electrical components are attached to the housing from both the front and back sides of the power distribution board.
- the height dimension of the auxiliary housing in the direction perpendicular to the power distribution board is the highest height of the electrical components attached to the front surface side of the housing and the highest height of the electrical components attached to the rear surface side. It is characterized in that it is set to be within the range of the width.
- control circuit board since the control circuit board is arranged so as to be perpendicular to the distribution board, the projected area in the direction perpendicular to the plate surface of the distribution board is not increased. Electrical components can be mounted on the electrical junction box. This can improve the space efficiency of the electrical junction box.
- the amount of heat generated on the distribution board side can be suppressed. Thereby, it can prevent that a power distribution board becomes high temperature locally.
- the tab piece formed at the front end of the bus bar faces the direction perpendicular to the control circuit board. For this reason, when the tab piece is inserted into, for example, a female terminal fitting provided in the electric connection box and the control circuit board and the electric connection box are to be connected, the tab piece contacts the female terminal fitting. Even if the tab piece stagnates and deforms in the direction perpendicular to the plate surface, it is bent vertically and the stagnation deformation is stopped at the site, so the bus bar side attached to the control circuit board has a bus bar side. There is no force applied in the direction perpendicular to the plate surface. For this reason, when connecting the control circuit board and the electrical junction box, It is possible to prevent the heat radiation means and the control circuit board from being peeled off.
- the bus bar provided on the power distribution board is formed by punching a metal plate material. By processing the end portion of the bus bar into a tapered shape, it is possible to easily form a tab piece. Similarly, a tab piece can be easily formed by processing the end of the bus bar bonded to the control circuit board into a tapered shape.
- the control circuit board and the power distribution board can be connected by connecting the tab pieces thus easily formed by welding or by inserting them into the female relay terminal. As described above, according to the present invention, the connection process between the control circuit board and the power distribution board can be simplified as a whole.
- control circuit board since the control circuit board has the mounting surface directed toward the distribution board and the heat radiation means directed to the side opposite to the distribution board, heat from the heat radiation means can be efficiently dissipated. Thereby, it becomes possible to improve the heat dissipation of the electrical junction box.
- the plurality of electrical components mounted on the control circuit board side are located apart from each other and closer to the end of the control circuit board. As a result, it is possible to prevent the control circuit board from being locally heated due to the concentration of the heat generating components.
- a semiconductor relay In general, a semiconductor relay generates a larger amount of heat than a mechanical relay or a fuse.
- this semiconductor relay By mounting this semiconductor relay on the control circuit board side and providing heat dissipation means on this control circuit board to shorten the distance between the semiconductor relay and the heat dissipation means, heat generated from the semiconductor relay can be efficiently dissipated. . As a result, the heat dissipation of the electrical junction box can be improved.
- the control circuit board Located at the end of the board, this control circuit board has a ⁇ -shaped arrangement extending on both the front and back sides to which the electrical components of the power distribution board are attached. As a result, among the spaces extending in the direction orthogonal to the distribution board, the control circuit board can be arranged using the space originally occupied by the electrical components, so that the space efficiency of the electrical junction box can be improved. it can.
- the auxiliary housing is formed integrally with the housing of the electrical junction box, the size of the housing can be reduced as a whole compared to the case where both are formed separately.
- control circuit board can be assembled from the open surface side of the auxiliary housing, the assembly work of the control circuit board to the electrical junction box is facilitated.
- the heat sink provided on the control circuit board is positioned on the open side of the auxiliary housing, the entire electrical junction box is surrounded by the housing for protection.
- the heat generated from the electrical components mounted on the control circuit board can be efficiently dissipated outside the electrical junction box. Thereby, the heat dissipation of the electrical junction box can be improved.
- the electrical components are arranged on the housing from both the front and back sides of the distribution board, the maximum height of the electrical components attached to the front side of the housing and the back side of the space extending in the direction orthogonal to the distribution board
- the space divided by the maximum height and width of the electrical components attached to is designed to be occupied by the electrical junction box.
- auxiliary knitting and uzing are formed in the space occupied by the electrical junction box with the electrical components attached.
- FIG. 1 is a perspective view of an electrical junction box in the present embodiment.
- FIG. 2 is an exploded perspective view of the electrical junction box in the present embodiment.
- FIG. 3 is a bottom view of the electrical junction box in the present embodiment.
- FIG. 4 is a cross-sectional view of the electrical junction box in FIG.
- FIG. 5 is a cross-sectional view taken along line A_A showing the state before the electrical junction box is assembled in FIG. Explanation of symbols
- Insulating substrate (insulating substrate different from the insulating substrate of the distribution board)
- the electrical connection box 80 of the present embodiment is one in which the power distribution board 12 is accommodated in a flat housing 40 so that the plate surface faces in the vertical direction (see FIG. 4).
- the housing 40 is made of a synthetic resin, and is formed by joining a lower case 60 whose upper surface is open and an upper case 41 covering the open upper surface.
- the lower wall of the lower case 60 is connected to a relay mounting portion 62 that is recessed for mounting the relay 87 and a wire harness (not shown).
- a connector hood section 64 is formed.
- the lower part of the lower case 60 is A relay terminal inlet 63 that penetrates downward is formed, and a power distribution terminal 13 to be described later is inserted therein. Further, a power distribution terminal 13 to be described later passes through the bottom wall of the connector hood portion 64 and protrudes into the connector hood portion 64.
- the lower case 60 has a substantially rectangular shape when viewed from above, and the outer side surfaces of the side walls located on both sides in the longitudinal direction of the lower case 60 are located at positions near both ends.
- a lock projection 67 is formed for locking the lower case 60 and the upper case 41 by engaging with a lock piece 54 described later.
- the upper wall of the upper case 41 is connected to a fuse mounting portion 43 that is recessed for mounting the fuse 86 and a wire harness (not shown).
- Connector hood portion 46 is formed.
- the fuse mounting portion 43 is formed with a fuse terminal insertion port 44 penetrating the upper wall of the upper case 41 in the vertical direction, and a distribution terminal 13 to be described later is inserted therein. Further, a power distribution terminal 13 (described later) penetrates through the bottom wall of the connector hood portion 46 so as to protrude into the connector hood portion 46.
- the upper case 41 has a substantially rectangular shape when viewed from above.
- the upper case 41 has two outer side surfaces located on both sides in the longitudinal direction, and an upper case 41.
- a lance 50 for fixing the housing 40 to a vehicle body (not shown) is formed at a position near both ends of the outer side surfaces of the two side walls parallel to the longitudinal direction.
- the lock projection 67 is engaged with the lock projection 67 of the lower case 60.
- a lock piece 54 is formed to stop and fix the upper case 41 and the lower case 60.
- the upper case 41 and the lower case 60 are integrated by the upper case 41 being assembled from above the lower case 60 and the lock pieces 54 being inertially locked to the lock protrusions 67.
- the power distribution board 12 includes a plurality of bus bars 10 formed by punching a metal plate material in a plurality of layers (three layers in this embodiment), and an insulating plate 11 (in claim 1) between each layer. , Which corresponds to an insulating substrate constituting the distribution board).
- the predetermined end of the bus bar 10 is bent upward or downward, and the distribution end Child 13 Further, the end portion different from the power distribution terminal 13 is once bent and bent and then bent so as to protrude to the left front side in FIG. 2, and its tip end portion is formed in a slightly tapered shape.
- the distribution side tab piece 14 (corresponding to the distribution board side tab piece in claim 2 or claim 3) for connection to the control circuit board 21 is provided.
- the insulating plate 11 has a substantially rectangular shape, and on the plate surface, a plurality of through holes 15 communicating vertically are formed at predetermined positions for inserting the power distribution terminals 13. Has been.
- the power distribution terminals 13 protrude upward from the insertion holes 15.
- the power distribution terminals 13 protrude downward from the through holes 15. Then, the distribution-side tab pieces 14 protrude from the end of the distribution board 12 on the left front side in FIG. 2 side by side on the same plane.
- a control circuit board 21 is arranged at the end of the power distribution board 12.
- the control circuit board 21 is formed by forming a control circuit on one surface of the insulating board 20 by printed wiring means and mounting two semiconductor relays 24, 24 on this surface. What is the component mounting surface?
- a plurality of bus bars 10 are placed on the opposite side in a state of being electrically connected to the control circuit.
- an opening is formed in the insulating substrate 20, and heat generated in the semiconductor relay 24 is generated by soldering some terminals of the semiconductor relay 24 directly to the bus bar 10 through the opening. It may be configured to be able to transmit directly to the bus bar 10.
- the semiconductor relays 24, 24 are separated from each other, and one is located near the upper end of the control circuit board 21 and the other is located near the lower end of the control circuit board 21.
- the bus bar 10 is integrally bonded to the insulating substrate 20 through a thin adhesive sheet or adhesive layer (not shown) having insulating properties.
- a predetermined part of the bus bar group 10 is extended in a direction parallel to the plate surface of the control circuit board 21 and then bent so as to protrude to the component mounting surface side, and its tip part is slightly tapered.
- the control side tab piece 25 (corresponding to the tab piece on the control circuit board side in Claim 2 or Claim 3) is formed in a shape and is connected to the power distribution board 12.
- the control side tab pieces 25 are arranged on the same plane.
- the power distribution board 12 and the control circuit board 21 are electrically connected by inserting the power distribution side tab piece 14 and the control side tab piece 25 into the female relay terminal 30. It is connected.
- the female relay terminal 30 is formed in a substantially rectangular parallelepiped shape by punching a conductive metal plate into a predetermined shape by pressing and then bending it.
- the female relay terminal 30 is formed with a control-side tab piece inlet 31 for inserting the control-side tab piece 25 into the right side in FIG. Further, on the left side in FIG. 5, a distribution-side tab piece inlet 32 for inserting the distribution-side tab piece 14 is formed.
- An elastic contact piece 34 extends from the left end in FIG. 5 of the lower wall 33 of the female relay terminal 30 and is folded back to the right in FIG. This elastic contact piece 34 is bent twice so as to form a substantially S shape when viewed from the side.
- the bottom surface of the elastic contact piece 34 that protrudes downward and bends when viewed from the side serves as a control-side contact portion 36 for connection to the control-side tab piece 25.
- the upper surface of the elastic contact piece 34 that protrudes upward and bends when viewed from the side serves as a distribution side contact portion 35 for connecting to the distribution side tab piece 14.
- the upper wall of the female relay terminal 30 is formed so as to be lowered one step downward, and serves as a receiving portion 37 that contacts the power distribution side tab piece 14.
- the distribution-side tab piece 14 inserted from the left side in FIG. 4 into the distribution-side tab piece inlet 32 is in contact with the distribution-side contact portion 35 to bring the elastic contact piece 34 into place. Press down and press. As a result, the elastic contact piece 34 is squeezed and deformed, and the distribution-side tab piece 14 is sandwiched between the receiving portion 37 and the elastic contact piece 34 by its restoring elasticity.
- control side tab piece 25 inserted into the control side tab piece inlet 31 from the right in FIG. 4 contacts the control side contact portion 36 and presses the elastic contact piece 34 upward. ing. As a result, the elastic contact piece 34 is squeezed and deformed, and the control-side tab piece 25 is held between the lower wall 33 of the female relay terminal 30 and the elastic contact piece 34 due to its restoring elasticity.
- the heat radiating plate 22 for radiating the heat generated from the semiconductor relays 24, 24 has an insulating adhesive layer (not shown). Is glued through.
- the heat radiating plate 22 has a substantially rectangular shape, and is formed of a metal plate such as aluminum having high thermal conductivity.
- the heat radiating plate 22 includes a plurality of fins 26 and has mounting through holes 27 near the upper and lower ends. Is formed.
- a box-shaped lower case side auxiliary housing 68 opened to the left front side in FIG. 2 is formed on the left front side wall in FIG. 2 and can accommodate the control circuit board 21. It has become.
- a locking claw 58 that can be elastically deformed is formed at the end of the lower wall of the lower case side auxiliary housing 68 on the left front side in FIG.
- a cylindrical boss 81 for screwing the control circuit board 21 is formed to protrude to the left front side in FIG.
- a screw hole 82 is formed at the tip of the boss 81.
- an upper case side auxiliary housing 55 opened to the left front side in FIG. 2 is formed on the left front side wall in FIG. 2 so that the control circuit board 21 can be accommodated. It has become.
- an elastically deformable locking claw 58 is formed to hang downward.
- a cylindrical boss 81 for screwing the control circuit board 21 is formed in the upper case side auxiliary housing 55 so as to protrude to the left front side in FIG.
- a screw hole 82 is formed at the tip of the boss 81.
- the upper case side auxiliary housing 55 and the lower case side auxiliary housing 68 are integrally formed on the left front side of the housing 40 in FIG.
- the auxiliary housing 75 is formed with an opening 76 that opens to the left front side in FIG.
- the height H of the auxiliary housing 75 in the vertical direction is such that the top of the fuse 86 attached to the fuse attachment 43 and the top of the relay 87 attached to the relay attachment 62 It is set so that it is within the dimension W between (approximately equal here).
- the control circuit board 21 is arranged so as to be perpendicular to the power distribution board 12 and so that the heat radiating plate 22 is exposed to the outside of the housing 40.
- the 75 openings 76 are assembled from the open surface side.
- the control circuit board 21 is located at the end of the distribution board 12, and the control circuit board 21 is in a T-shaped arrangement extending on both sides of the distribution board 12.
- the upper and lower edges of the heat sink 22 are fitted inside the locking claws 58. It has been prevented from coming off.
- a screw 84 is inserted into the mounting through hole 27 of the heat sink 22 via a washer 85, and the screw 84 is screwed into the screw hole 82, whereby the control circuit board 21 is connected to the auxiliary housing 75. It is fixed to.
- control circuit board 21 is arranged so as to be perpendicular to the power distribution board 12, the electric circuit without increasing the projected area in the direction perpendicular to the plate surface of the power distribution board 12.
- the semiconductor relay 24 can be mounted on the connection box 80. Thereby, the space efficiency of the electrical junction box 80 can be improved.
- the fuse mounting portion 43 in the space extending in the direction orthogonal to the power distribution board 12 is provided.
- the space in the dimension W between the top of the mounted fuse 86 and the top of the relay 87 mounted on the relay mounting section 62 is occupied by the electrical junction box.
- the control circuit board 21 is located at the end of the power distribution board 12, and the control circuit board 21 has a T-shaped arrangement extending on both sides of the power distribution board 12.
- the vertical height dimension H of the auxiliary housing 75 is set so as to be within the above-described dimension W, and the control circuit board 21 is accommodated in the auxiliary housing 75.
- the control circuit board 21 can be arranged in the space originally occupied by the electrical junction box 80, and thus the space efficiency of the electrical junction box 80 can be improved.
- the mounting density of the relay 87, the fuse 86, the semiconductor relay 24, etc. accommodated in the electrical junction box 80 may be increased. There is a concern that the heat generated from these electrical components accumulates and becomes locally hot.
- a control circuit board 21 different from the power distribution board 12 on which the relay 87 and the fuse 86 are mounted is provided, and a semiconductor relay 24 having a large heat generation amount is mounted on the control circuit board 21 and this control circuit board 21 is mounted. Since the heat sink 22 is provided on the control circuit board 21, the heat of the semiconductor relay 24 force is quickly dissipated from the heat sink 22, and the heat dissipation of the electrical junction box 80 can be improved.
- the two semiconductor relays 24, 24 mounted on the control circuit board 21 are arranged apart from the upper and lower ends of the control circuit board 21, respectively. By concentrating the products, it is possible to prevent the control circuit board 21 from being locally heated.
- the semiconductor relay 24 on the control circuit board 21 side, the amount of heat generated on the power distribution board 12 side can be suppressed, so that it is possible to prevent the power distribution board 12 from being locally heated.
- control circuit board 21 is attached to the opening 76 of the auxiliary housing 75 from the open surface side, so that it becomes an obstacle during the assembly work. Therefore, the assembling work when the control circuit board 21 is accommodated in the auxiliary housing 75 is facilitated. Then, the control circuit board 21 and the power distribution board 12 are connected by an easy method of inserting the power distribution side tab piece 14 and the control side tab piece 25 formed at the end of the bus bar 10 into the female relay terminal 30. As a result, the process of assembling the control circuit board 21 to the electrical junction box 80 can be simplified as a whole.
- control-side tab piece 25 formed so as to protrude from the control circuit board 21 perpendicularly to the plate surface of the control circuit board 21 is inserted into the control-side tab piece insertion port 31 of the female relay terminal 30 as shown in FIG.
- the control-side tab piece 25 comes into contact with the distribution-side contact portion 36 from the right side in FIG.
- the control-side tab piece 25 may stagnate and deform in a direction perpendicular to the plate surface.
- the bus bar 10 on which the control-side tab piece 25 is formed is bent vertically on the plate surface of the control circuit board 21, so that the stagnation deformation of the control-side tab piece 25 is bent vertically. Absorbed in part.
- control circuit board 21 is configured to be provided with the heat radiating plate 22.
- the heat generated from the semiconductor relay 24 mounted on the control circuit board 21 is not limited to this.
- a configuration in which the heat radiating plate 22 is not provided may be employed as long as the configuration allows efficient dissipation.
- a heat radiating means other than the heat radiating plate 22 such as a heat pipe may be provided.
- the force that each of the two semiconductor relays 24, 24 is mounted at a position near the end of the control circuit board 21 is not limited to this.
- the control circuit 21 When small electrical components are mounted on the control circuit 21, there is little risk of local high temperatures due to the heat generated by the electrical components, so these electrical components are mounted near the center of the control circuit board 21. Even as a configuration.
- the semiconductor relay 24 is mounted on the control circuit board 21.
- the present invention is not limited to this, and the semiconductor relay 24 is disposed on the power distribution board 12 side.
- another heat generating component such as a mechanical relay or a resistor may be mounted on the control circuit board 21.
- the power distribution board 12 is formed by laminating a plurality of bus bars 10 in three layers via the insulating plate 11.
- the present invention is not limited to this, and the power distribution board 12 is formed by only one layer. It may be formed by laminating two layers or four or more layers with the insulating plate 11 interposed therebetween.
- the bus bar 10 and the insulating plate 11 are laminated so that the plate surfaces thereof are parallel to each other to form the power distribution board 12.
- the present invention is not limited to this.
- the plate surface of 11 and the plate surface of the bus bar 10 may be perpendicular to each other, and the plate surface of the insulating plate 11 and the bus bar 10 may be in contact with each other.
- the auxiliary housing 75 is formed integrally with the housing 40 of the electrical junction box 80.
- the present invention is not limited to this, and the auxiliary housing 75 is formed separately.
- the electric connection box 80 may be attached to the housing 40.
- the vertical height H of the auxiliary housing 75 is determined by the top of the fuse 86 attached to the fuse attachment 43 and the relay attached to the relay attachment 62.
- the dimension H may be set smaller than the dimension W. If sufficient space is available to install the auxiliary housing 75 in the direction perpendicular to the power distribution board 12, set dimension H larger than dimension W.
- the control-side tab piece 25 is formed at the tip portion where the tip of the bus bar 10 bonded to the control circuit board 21 is bent perpendicularly to the plate surface of the control circuit board 21.
- the present invention is not limited to this, and the control-side tab piece 25 may be formed at the tip of the bus bar 10 extending in parallel with the control circuit board 21.
- the distribution-side tab piece 14 is formed at the distal end of the distribution board 12 where the front end of the bus bar 10 is bent perpendicularly to the plate surface of the distribution board 12, and the control-side tab piece 25 thus formed is formed.
- the distribution side tab piece 14 may be connected to the female relay terminal 30 (or by welding).
- the tab piece 14 may be inserted into the alignment plate, and the stagnation deformation in the direction perpendicular to the plate surface of the control side tab piece 25 may be prevented.
- control-side tab piece 25 and the power-distribution-side tab piece 14 are configured to be connected to each other by the female relay terminal 30, and the force S is not limited thereto.
- the tab piece 25 and the power distribution side tab piece 14 may be connected by welding.
- control circuit board 21 is positioned at the end of the power distribution board 12, and the control circuit board 21 has a T-shaped arrangement extending on both sides of the power distribution board 12.
- control circuit board 21 is not limited to this, and the control circuit board 21 may be disposed vertically on either the board surface or the board surface of the power distribution board 12.
- the power distribution board 12 and the control circuit board 21 are arranged vertically.
- the present invention is not limited to this.
- the power distribution board 12 and the control circuit board 21 include: The board surface may be arranged side by side in the same direction on the same plane.
- the power distribution board 12 and the control circuit board 21 are arranged in two upper and lower layers with the board surface in parallel. It is good also as a structure which can be arranged arbitrarily.
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- Microelectronics & Electronic Packaging (AREA)
- Connection Or Junction Boxes (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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JP2006529338A JPWO2006011478A1 (ja) | 2004-07-27 | 2005-07-26 | 電気接続箱 |
US11/658,565 US7619896B2 (en) | 2004-07-27 | 2005-07-26 | Electrical junction box |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-219031 | 2004-07-27 | ||
JP2004219031 | 2004-07-27 |
Publications (1)
Publication Number | Publication Date |
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WO2006011478A1 true WO2006011478A1 (ja) | 2006-02-02 |
Family
ID=35786228
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/013646 WO2006011478A1 (ja) | 2004-07-27 | 2005-07-26 | 電気接続箱 |
Country Status (3)
Country | Link |
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US (1) | US7619896B2 (ja) |
JP (1) | JPWO2006011478A1 (ja) |
WO (1) | WO2006011478A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016096653A (ja) * | 2014-11-14 | 2016-05-26 | 住友電装株式会社 | 電気接続箱 |
KR102118528B1 (ko) * | 2020-01-03 | 2020-06-03 | (주)지디일렉스 | 분전반, 전동기 제어반(mcc), 수배전반, 자동제어반의 시퀀스 제어 모듈 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7983024B2 (en) * | 2007-04-24 | 2011-07-19 | Littelfuse, Inc. | Fuse card system for automotive circuit protection |
US8207454B2 (en) * | 2008-06-27 | 2012-06-26 | Lear Corporation | Electrical junction box |
JP5212019B2 (ja) * | 2008-10-28 | 2013-06-19 | 住友電装株式会社 | 電気接続箱および該電気接続箱の組立方法 |
KR101561045B1 (ko) | 2009-06-29 | 2015-10-16 | 한국단자공업 주식회사 | 전원 연결 박스 |
JP5333849B2 (ja) * | 2009-07-10 | 2013-11-06 | 住友電装株式会社 | 電気接続箱 |
US8139355B2 (en) | 2010-05-24 | 2012-03-20 | International Business Machines Corporation | Memory module connector having memory module cooling structures |
EP2461440B1 (de) * | 2010-12-03 | 2018-05-02 | ABB Schweiz AG | Stecksystem |
CN103582976A (zh) * | 2011-05-31 | 2014-02-12 | 伊顿公司 | ***式复合配电组件和包括该组件的*** |
JP5813387B2 (ja) * | 2011-06-21 | 2015-11-17 | 矢崎総業株式会社 | 電気接続箱 |
EP2779337B1 (en) * | 2011-11-07 | 2017-06-28 | AutoNetworks Technologies, Ltd. | Electrical junction box |
JP5950336B2 (ja) * | 2012-03-22 | 2016-07-13 | 矢崎総業株式会社 | 電子部品モジュール |
JP5875154B2 (ja) * | 2012-07-25 | 2016-03-02 | 矢崎総業株式会社 | 電気接続箱 |
US8922992B2 (en) * | 2012-11-12 | 2014-12-30 | Dell Products L.P. | System and design of cost effective chassis design for networking products |
JP6297904B2 (ja) * | 2014-04-21 | 2018-03-20 | 矢崎総業株式会社 | 被支持部材と支持体との係止構造 |
US9472365B1 (en) | 2015-05-19 | 2016-10-18 | Lear Corporation | Relay system having dual relays configured as heat sinks for one another |
US10787084B2 (en) * | 2017-03-17 | 2020-09-29 | Ford Global Technologies, Llc | Busbar with dissimilar materials |
US10368465B2 (en) * | 2017-09-07 | 2019-07-30 | Lear Corporation | Electrical unit |
JP7019271B2 (ja) * | 2019-04-25 | 2022-02-15 | 矢崎総業株式会社 | 電気接続箱 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6363988U (ja) * | 1986-10-15 | 1988-04-27 | ||
JPH11285132A (ja) * | 1998-03-27 | 1999-10-15 | Yazaki Corp | 電気接続箱 |
JP2003324823A (ja) * | 2002-04-25 | 2003-11-14 | Auto Network Gijutsu Kenkyusho:Kk | 車載用電源分配器 |
Family Cites Families (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6363988A (ja) | 1986-09-04 | 1988-03-22 | オムロン株式会社 | 位置決めステ−ジ機構の駆動方法 |
JPH0461417A (ja) | 1990-06-28 | 1992-02-27 | Nec Corp | 半導体集積回路装置 |
JP2569292Y2 (ja) * | 1990-10-01 | 1998-04-22 | 矢崎総業株式会社 | 積層ブスバー配線板 |
CN1050810C (zh) * | 1993-06-09 | 2000-03-29 | 利尔Eeds因特瑞尔公司 | 复合式联接器 |
US5339922A (en) * | 1993-11-15 | 1994-08-23 | Richard Benante | Tree stand for hunters |
JPH08322127A (ja) | 1995-05-23 | 1996-12-03 | Sumitomo Wiring Syst Ltd | 電気接続箱に収容するバスバーと絶縁板の積層構造 |
JPH11243618A (ja) * | 1998-02-23 | 1999-09-07 | Sumitomo Wiring Syst Ltd | 電気接続箱 |
JP3334640B2 (ja) * | 1998-09-02 | 2002-10-15 | 住友電装株式会社 | 電気接続箱及びその製造方法 |
JP3785276B2 (ja) * | 1998-09-10 | 2006-06-14 | 矢崎総業株式会社 | 電気接続箱 |
US6494723B2 (en) * | 2000-03-31 | 2002-12-17 | Autonetworks Technologies, Ltd. | Terminal that provides connection between a wire circuit and a printed circuit, and electric junction box including said terminal |
JP2001327044A (ja) * | 2000-05-16 | 2001-11-22 | Auto Network Gijutsu Kenkyusho:Kk | 車両用パワーディストリビュータ |
EP1209036A3 (en) * | 2000-11-28 | 2003-11-19 | Sumitomo Wiring Systems, Ltd. | Electrical junction box for a vehicle |
JP3733857B2 (ja) * | 2000-12-04 | 2006-01-11 | 住友電装株式会社 | 電子制御ユニットを備えたジャンクションボックス |
JP4357762B2 (ja) * | 2001-03-30 | 2009-11-04 | 株式会社オートネットワーク技術研究所 | 車両用パワーディストリビュータ |
JP3977609B2 (ja) * | 2001-04-27 | 2007-09-19 | 矢崎総業株式会社 | 電気接続箱 |
JP2002330526A (ja) * | 2001-04-27 | 2002-11-15 | Yazaki Corp | 電気接続箱 |
JP3833495B2 (ja) * | 2001-04-27 | 2006-10-11 | 矢崎総業株式会社 | 電気接続箱 |
JP2002330522A (ja) * | 2001-04-27 | 2002-11-15 | Yazaki Corp | 電気接続箱 |
JP2002330525A (ja) * | 2001-04-27 | 2002-11-15 | Yazaki Corp | 電気接続箱 |
JP2003079027A (ja) * | 2001-09-03 | 2003-03-14 | Sumitomo Wiring Syst Ltd | ジャンクションボックス |
JP3927017B2 (ja) | 2001-11-26 | 2007-06-06 | 株式会社オートネットワーク技術研究所 | 回路構成体及びその製造方法 |
JP4002427B2 (ja) | 2001-11-26 | 2007-10-31 | 株式会社オートネットワーク技術研究所 | 回路構成体の製造方法 |
JP3958590B2 (ja) * | 2002-01-23 | 2007-08-15 | 株式会社オートネットワーク技術研究所 | 電気接続箱用配電ユニット及び電気接続箱 |
JP3958589B2 (ja) * | 2002-01-23 | 2007-08-15 | 株式会社オートネットワーク技術研究所 | 電気接続箱 |
JP2003243834A (ja) * | 2002-02-20 | 2003-08-29 | Fujikura Ltd | 多層フレキシブルプリント基板及び多層フラットケーブル並びにこれらを用いた電気接続箱 |
JP4022440B2 (ja) | 2002-07-01 | 2007-12-19 | 株式会社オートネットワーク技術研究所 | 回路ユニット |
JP2004072907A (ja) * | 2002-08-06 | 2004-03-04 | Sumitomo Wiring Syst Ltd | 電気接続箱 |
US6926541B2 (en) * | 2002-08-30 | 2005-08-09 | Yazaki Corporation | Mounting structure of electric junction box |
US7099155B2 (en) * | 2003-02-14 | 2006-08-29 | Autonetworks Technologies, Ltd. | Distribution unit and electric connection box including the same |
JP2005312129A (ja) * | 2004-04-19 | 2005-11-04 | Auto Network Gijutsu Kenkyusho:Kk | 電気接続箱 |
-
2005
- 2005-07-26 WO PCT/JP2005/013646 patent/WO2006011478A1/ja active Application Filing
- 2005-07-26 JP JP2006529338A patent/JPWO2006011478A1/ja active Pending
- 2005-07-26 US US11/658,565 patent/US7619896B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6363988U (ja) * | 1986-10-15 | 1988-04-27 | ||
JPH11285132A (ja) * | 1998-03-27 | 1999-10-15 | Yazaki Corp | 電気接続箱 |
JP2003324823A (ja) * | 2002-04-25 | 2003-11-14 | Auto Network Gijutsu Kenkyusho:Kk | 車載用電源分配器 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016096653A (ja) * | 2014-11-14 | 2016-05-26 | 住友電装株式会社 | 電気接続箱 |
KR102118528B1 (ko) * | 2020-01-03 | 2020-06-03 | (주)지디일렉스 | 분전반, 전동기 제어반(mcc), 수배전반, 자동제어반의 시퀀스 제어 모듈 |
Also Published As
Publication number | Publication date |
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JPWO2006011478A1 (ja) | 2008-05-01 |
US7619896B2 (en) | 2009-11-17 |
US20080310121A1 (en) | 2008-12-18 |
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