WO2005019132A1 - 高熱伝導性部材及びその製造方法ならびにそれを用いた放熱システム - Google Patents
高熱伝導性部材及びその製造方法ならびにそれを用いた放熱システム Download PDFInfo
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- WO2005019132A1 WO2005019132A1 PCT/JP2004/012671 JP2004012671W WO2005019132A1 WO 2005019132 A1 WO2005019132 A1 WO 2005019132A1 JP 2004012671 W JP2004012671 W JP 2004012671W WO 2005019132 A1 WO2005019132 A1 WO 2005019132A1
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Definitions
- the present invention relates to a highly conductive material comprising carbon (0) as a main component and an s ⁇ method thereof. Further, the present invention relates to an application system including the highly conductive sound device. About.
- the present invention also relates to a high acknowledgment degree having a high acknowledgment degree in the direction.
- the age at which the electric power is cooled as described above is mainly to cool the heat by guiding the heat to a low-temperature region.
- a material made of a highly conductive metal for example, copper (Cu), aluminum (A 1), or the like is often used.
- carbonite (C) graphite has properties such as leak-proofing properties, chemical resistance, high conductivity, and high conductivity. It is expected to be a substitute for i-books.
- Graphite has a crystal structure as shown in FIG. More specifically, carbon (C) Planar structure of a six-membered ring consisting of atoms 6 (dalaphen layer). From this crystal structure, the properties of graphite are two directions: the direction perpendicular to the graphene layer (c-axis direction) and the direction parallel to the dalafen layer (a-b axis direction, perpendicular to the c-axis). Direction).
- a heat conduction sound with improved conduction characteristics is obtained by dispersing graphite powder in a silicone resin matrix (Japanese Patent Application Laid-Open Nos. 61-145266 and 01-040586). JP-A-03-009552, JP-A-09-102562, JP-A-09-283955, JP-A-2002-299534, JP-A-2002-363421, JP-A-2003-105108 etc) .
- Fig. 10 shows a schematic diagram of the heat conductive sound disclosed therein ( «Example 1).
- FIG. 12 shows a schematic diagram of the acknowledgment sound (3) disclosed in these publications. «In iJ3, the method of treating organic high-order liver sheets can produce a polycrystalline structure with extremely high in-plane orientation (from 600 to 100 W / mK). It is shown to provide.
- the adipose conductivity using graphite as the adipose substance is more sexual and dog-free than the conventional copper (cu) and aluminum (AD). It is said that it is excellent in such points.
- an object of the present invention is to provide a high heat conductive member that can exhibit higher heat conductivity in the layer direction while utilizing the high conductivity in the plane direction where the graphite f flies.
- the inventor of the present invention has earnestly worked to solve the problem, and as a result, has found that a carbon material having a specific structure can achieve the above object, and has completed the present invention.
- the present invention relates to the following highly highly conductive materials and methods, and a heat dissipation system using the same.
- the conductivity / II in the direction perpendicular to the c-axis is in the range of 40 OW / mK or more and 100 OW / mK or less,
- the thickness of the filem is 10 m or more and 300 m or less. Attached high appreciation sound.
- the highly conductive carbon according to the above item 10 wherein the tertiary s-carbon iii body is at least one of a carbon nanotube, a fullerene, a diamond, and a danmond-like carbon.
- the mixed solution is a mixed solution containing polyamic acid and at least one kind of dispersed particles of carbon particles and precursor particles thereof.
- the process is as follows: 1) Pre-baking step in the range of 100 to 150 ° C and 2) Firing in the temperature range of 200 to 300 ° C Item 19.
- This is a combustible system that includes a heat source, noise suppression, and
- FIG. 1 is a schematic view of a high heat conductive sound according to the present invention.
- FIG. 2 is a schematic view of the high heat conductive member of the present invention.
- FIG. 3 is a schematic diagram of a high heat conductive sound according to the present invention.
- FIG. 4 is a diagram showing a crystal structure of graphite.
- FIG. 5 is a view showing a typical X-ray diffraction pattern of an oriented graphite structure.
- FIG. 6 is a schematic diagram showing a process from an organic high-molecular-weight film to an oriented graphite structure.
- FIG. 7 is a manufacturing process diagram of the high conductivity type in Example 11-11.
- FIG. 8 is a diagram showing an example of a temperature program of a firing step in Example 1-1.
- FIG. 9 is a schematic diagram of a heat radiation system using the high conductivity of the present invention.
- FIG. 10 is a schematic diagram of a conventional heat conductive sound attachment (Example 1).
- FIG. 11 is a schematic view of a conventional acknowledgment (3 ⁇ 43 ⁇ 4Example 2).
- Figure 12 is a schematic diagram of a conventional heat conductive sound attachment (Example 3).
- the high-acoustic sound of the present invention is a highly-acoustic mouthpiece formed by dispersing carbon particles in a graphite matrix.
- the conductivity ⁇ II in the direction perpendicular to the ffJtSc axis is in the range of 40 OWZm ⁇ k or more and 100 OW / m ⁇ K or less.
- Disgusting Acknowledgment rate in the TO direction along the c-axis is in the range of ⁇ ⁇ ⁇ 10 W / m ⁇ k or more and 100 W / m-k or less.
- the graphite matrix of the present invention has a graphite structure. That is, a laminated body of a dalaphen layer composed of a plurality of six-membered carbon rings is formed. Therefore, the c-axis of each dalaphen layer in the graphite matrix is substantially 5 °. However, the graphite matrix does not need to have a complete graphite structure. It is sufficient that at least the peak of the (002 ") plane (where n indicates self fiber) exists in the X-ray diffraction pattern of the graphite-based matrix. In the X-ray diffraction pattern, at least the (002) and (004) planes — It is desirable that the
- the X-ray diffraction pattern has a (002 ") plane peak (where n indicates the fiber itself). It is more desirable that the peak of ⁇ is not observed.
- the graphite matrix preferably has a crystal plane spacing (d) in the range of 0.3335 nm ⁇ 0.340 nm or less as determined by X-ray diffraction. Incidentally, the reported value of single crystal graphite is 0.335 nm.
- the inside of the graphite matrix contains voids. Due to the size of the pores, the density of the highly conductive material of the present invention can be smaller than the original graphite value ((2.26 g / cm 3 ). That is, the density of the high thermal conductive member of the present invention is generally preferably in the range of 0.3 g / cm 3 or more and 2 g / cm 3 or less, and more preferably in the range of 0.6 g cm 3 or more and 1.5 gZ cm 3 or less. More preferably.
- the carbon particles serve as a talent for the matrix.
- the carbon particles have a function of thermally transferring heat transmitted through the graphite matrix not only in the plane direction but also between the graphene layers and transmitting the heat in the layer direction (thickness direction).
- the type of carbon particles is not particularly good as long as it has the ability to hide.
- it is particularly preferable to be at least one of 1) a graphite particle and 2) a carbon body (carbon structure particle) of the graphite.
- graphite particles As the dispersing material, it is preferable to use graphite having high conductivity (especially, graphite having high crystallinity).
- graphite having high conductivity especially, graphite having high crystallinity.
- Graphite particles as a dispersing material can be made of any material as long as it has a relatively high acknowledgment characteristic as described above. Suitable As a guideline of the usable graphite particles, the determination may be made directly by the magnitude of the conductivity, or indirectly by the crystallinity obtained by X-ray diffraction. For example, as a standard in the X-ray diffraction method, one having a crystal plane spacing in the range of 0.335 to 0.340 nm can be used as in the case of the graphite matrix.
- Graphite particles can be obtained by subjecting graphite to grinding or the like.
- the method of the pulverization is not p-arm, and may be performed using a device such as a pole mill, a jet mill, a high-speed rotating mill, etc .; In particular, it is easy to pulverize by the jet mill method. In the pulverization treatment, the uniformity of the particle size can also be improved by using. Further, after the pulverization, if necessary, it can be processed according to a known method.
- the carbon structure (particles) as the dispersing material it is preferable to use a carbon structure having high thermal conductivity (particularly a carbon structure having high crystallinity), like the graphite particles.
- a carbon structure having high thermal conductivity particularly a carbon structure having high crystallinity
- single-walled carbon nanotubes (SWNT), multi-walled carbon nanotubes (MWNT), and other carbon nanotubes can be used as carbon nano-coils (CNC), fullerenes, natural diamonds, high-pressure synthetic diamonds, impregnated synthetic diamonds, gas phase Synthetic diamond or the like can be used.
- 1 SX can select two or more types.
- the carbon nanotube also includes a carbon nanohorn or the like.
- the size of the carbon structure When the size of the carbon structure is large, it can be pulverized as necessary to make smaller particles. This is advantageous for dispersing in a graphite matrix.
- the method of pulverizing the large-sized carbon structure can be carried out in the same manner as the pulverizing treatment of the undesired graphite.
- the knitted carbon particles are graphite.
- the content of the carbon particles can be determined in accordance with the desired conductivity, the type of the carbon particles, and the like. In general, it should be in the range of 10% by weight to 10% by weight.
- the weight is preferably in the range from 0 to 0 weight ppm to 7% by weight.
- the particle size of the carbon particles can be set according to the desired conductivity and the like.
- the average particle size is in the range of 0.05 m or more, preferably in the range of 0.05 m to 20 m, and more preferably in the range of 0.1 ⁇ m to 4 m. Good.
- the shape of the carbon particles is not limited, and may be any one of a spherical shape, an irregular shape, a flake shape (flake shape), and a difficult shape.
- the shape of the till self-carbon particles is preferably flaky.
- the high-conductivity sound is provided in a manner such that the rejection coefficient ⁇ II in the direction perpendicular to the c-axis is in a range of 40 OW / m ⁇ k or more and 100 OW / m ⁇ K or less. In particular, it is preferably in the range of 70 OW / m ⁇ K or more and 100 OW / m ⁇ K or less.
- the thermal conductivity ⁇ in the direction parallel to the c-axis is in the range of 1 OW / mK or more and 100 WZmK or less, particularly 50 W / mK or more and 100 W / It is desirable to be within m ⁇ K.
- the shape of the highly conductive material of the present invention is not particularly limited, but is preferably a film (sheet).
- a film sheet
- its thickness can be directly determined according to the application, usage, etc., but it should be in the range of 10 m or more and 300 m or less. It is better.
- the direction of the c-axis of the graphite matrix is substantially equal to the thickness direction of the undesired S film.
- the dalaphen layer of the unfavorable S-graphite matrix be aligned so that the c-axis is almost perpendicular to the film surface (main surface).
- the range of the above-described conductivity ⁇ ⁇ 10 WZm ⁇ k or more and 10 OW / m ⁇ k or less can be secured as the thickness-direction conductivity. That is, it is a T ability to provide a highly conductive sound with excellent iH conductivity even in the thickness direction.
- the thermal conductivity / II in the film surface (principal surface) direction is in the range of 40 OW / m ⁇ k or more and 100 OW / m ⁇ K or less.
- the high-acoustic-conductivity sound of the present invention (especially a film-like high-accuracy-conductivity attachment) is a flexible Is preferable. That is, it is desirable that it be bendable. As a result, the degree of freedom in design can be increased, and it is also possible to use it for wide-ranging applications.
- the flexibility in the present specification indicates the bending resistance to the bending treatment.
- the flexibility can be freely controlled by the formation of pores, the thickness of the highly conductive sound, the type of carbon particles, and the like.
- the inclusion of voids makes it possible to further improve the number of times of bending resistance, which is a T function.
- the method of the present invention is not well-suited to the method, the following method is particularly preferable.
- a mixed solution containing a raw material capable of forming organic high ⁇ *: and at least one kind of carbon particles and precursor particles thereof is prepared.
- any material capable of forming a highly oriented graphite structure by the heat treatment in the third step may be used.
- polyimide ( ⁇ I) polyamide ( ⁇ ), polyphenylene terephthalamide ( ⁇ ⁇ ⁇ ), polyphenylene oxadiazole ( ⁇ D), polybenzothiazole ( ⁇ ⁇ ⁇ ), polyben Zobisthiazole ( ⁇ ⁇ ⁇ ), polyphenylene benzoimidazole ( ⁇ ⁇ ⁇ ), polyphenylene benzozoimidazole ( ⁇ ⁇ ⁇ ⁇ ), polythiazole ( ⁇ ⁇ ), polyparaphenylene vinylene (PPV) , Polyamide imide, polyacrylonitrile and the like.
- polyimide is preferred is there.
- these organic polymers can be used as raw materials as they are, and their precursors can also be used as the raw materials.
- the purpose is to form a polyimide coating film in the second step, it is an ability to use the precursor polyamic acid as a source material.
- a reaction product liquid obtained by reacting a monomer which can constitute an organic high amount is used as a material.
- ⁇ ffl can be.
- At least one kind of carbon particles and its precursor particles is used.
- the same carbon particles as those described above can be used.
- at least one of the carbon structures of 1) graphite particles and 2) graphite can be suitably used.
- the precursor of the carbon particles may be any as long as it becomes carbon particles (preferably graphite particles) depending on the process.
- Polyimide PI
- Polyamide PA
- Polyamide imide Polyphenylene terephthalamide
- PP TA Polyphenylene oxaziazole
- PBT Polybenzothiazole
- PBBO Polybenzothiazole
- PBI Polyphenylene benzoimidazole
- PPBI polyphenylene benzobisimidazole
- PT polyparaphenylene vinylene
- PAN polyacrylonitrile
- polyimide is preferred. These may be known or commercially available products.
- powdery Toray's “Dupont-view“ Rikipton ”” or the like can be used with care.
- an appropriate solvent can be used.
- a solution obtained by dissolving the above various organic polymers or a precursor thereof in a solvent can be suitably used as a raw material capable of forming an organic liver.
- Such a solution includes the night of a reaction product obtained by reacting a monomer capable of forming an organic polymer.
- the solvent those capable of dissolving these organic molecules and the like are preferable.
- ffil may be selected from H-like organic solvents such as dimethylacetamide and N-methylpyrrolide according to the kind of the desired organic polymer.
- 1 S may be used as a mixture of two or more kinds.
- a progress additive may be added to the above-mentioned mixed solution as needed.
- a filler such as calcium hydrogen phosphate may be appropriately mixed in to ease the chargeability of the formed organic polymer.
- the nuclei of each component in the mixed solution may be set to ⁇ !: So as to obtain a highly audible sound as indicated by i.
- the solid content of the mixture is not particularly limited as long as the components can be uniformly mixed. However, in terms of HIS, it is better to set the solid content in the range of 5 wt% to 5 wt%.
- a mixed liquid is used to form a film in which self particles are dispersed in an organic high liver body.
- the formation method is not limited.
- the mixture can be formed by applying the above-mentioned mixture on an appropriate base material.
- a coating method for example, a hair, a spray, a doctor blade, a roller, or any other printing method may be used.
- the type of reward can also be translated into various materials such as metals, alloys, resins, ceramics, etc. Therefore, it is possible to form a straight line with the help of a criticism.
- the thickness of the film is not limited, it can be appropriately adjusted to be the thickness of the film when a film-shaped highly conductive sound is manufactured. For example, it can be adjusted so that the thickness of the obtained film is in the range of 10 m or more and 300 m or less. In this case, if necessary, two or three layers can be laminated.
- a precursor of an organic high liver When a precursor of an organic high liver is used as a raw material in the first step, it can be converted into a target organic high body by performing a predetermined treatment.
- a polyamic acid which is a precursor of polyimide
- a polyamic acid body is formed using a mixed solution containing the polyamic acid, and then the polyamic acid is formed.
- the amide acid is converted into a polyimide film by imidization.
- the method of imidization may be in accordance with the method of ⁇ ⁇ ⁇ . For example, it is possible to imidize a polyamide acid by heating it with a predetermined pressure.
- the high appreciation sound is obtained by summarizing the editing.
- the processing conditions may be appropriately set to the conditions under which the matrix of the coating film becomes graphite.
- it can be preferably carried out in a TO gas atmosphere at a temperature in the range of 1000 ° C to 300 ° C.
- the inert gas for example, at least one kind of gas such as argon, helium, and nitrogen can be used.
- the awakening time may be determined according to the arbitration etc. ⁇ "
- a process consisting of two steps of 1) baking in a separation range of 1000 or more and 1500 or less) ⁇ ⁇ T pre-baking step and 2) main baking step of baking in a temperature range of 200 Ot or more and 3000 or less is performed. Is preferred.
- the components of the organic liver are converted into carbon (C) components (oxygen ( ⁇ ), nitrogen (N), ⁇ element ( ⁇ ), etc.) by extracting the organic liver as described above. .
- the heat treatment time depends on the shape or size of the test bridge to be fired, but is usually within a range of 0.5 hours to 5 hours.
- the ffii ⁇ for entering the pre-firing process is not skillful, but ⁇ is in the range of l ° CZmin to 15: / min, especially 3 ° CZmin to 1Omin. It is preferable to heat in the range. Furthermore, although the cooling after the pre-baking is good, it is usually preferable to cool in the range of S ⁇ / min to 20X / min, especially in the range of 5 / min to 10 / min.
- the firing in order to obtain a graphite having higher orientation, the firing is performed at a predetermined value selected from the range of 2000Jt from 2000 to 300 Ot :. At that time, once The degree of orientation of the obtained graphite matrix can be further increased by performing the intermediate treatment at a predetermined heating temperature (a temperature range of approximately 200 ° C. or more and 240 ° C. or less).
- a predetermined heating temperature a temperature range of approximately 200 ° C. or more and 240 ° C. or less.
- the heat treatment time depends on the shape or size of the sample to be fired, but is usually in the range of 0.5 hours to 10 hours.
- the degree of elevation of 1 degree for entering the main calcination step or intermediate treatment is not limited, but in terms of H ⁇ ⁇ , it is in the range of 5 ° C / min or more and 15 / min or less, particularly 5 / min or more and 10 ° or more. It is preferable to heat in the range of CZmin or less. In addition, although it does not fall after the main baking treatment, it can be cooled down to 1 "T in the range of 5 ° C / min or more and 2 OV min or less, especially in the range of 5 ° C / min or more. Preferred.
- the present invention relates to an aggressive system including a heat source, a heat source, and a high-frequency conductive member.
- a heat source thermally connected through the high-conductive member.
- the heat-conducting member is a heat-conducting member according to claim 1.
- the heat dissipation system of the present invention can be used for parts requiring heat countermeasures, such as conventional various electronic devices or devices. That is, the system of the present invention can be used in place of the wisteria system of the device of ⁇ *>.
- the system of the present invention can be used in place of the wisteria system of the device of ⁇ *>.
- air-cooled fins are used as sound attachments! ⁇ , By interposing a high thermal conductive member between the air-cooling fin and the heat source, efficient heat dissipation (cooling) can be performed.
- the high thermal conductivity is thermally connected to the heat source and the heat source. That is, it is sufficient to arrange the heat source so that the heat is efficiently transmitted from the heat source to the high-conductivity sound and further from the high-conductivity to the heat sink.
- the high applicability is directly attributable to the source of heat and the capacity of the fuel.
- the size, shape, and arrangement of the heat source, high conductivity, and direction are not limited, and M may be designed to efficiently combust.
- the film surface when using a film-like high thermal conductivity sound attachment, it is usually arranged so that the film surface (main surface) is in contact with the heat generating portion or the heat dissipation sound attachment. be able to.
- FIGS. 9 (a) to 9 (c) it is possible to install a heat-generating part or a fouling so as to dislike the film surface.
- FIG. 1 shows a schematic diagram of the high thermal conductivity sound attachment according to the first embodiment of the present invention.
- the conductive tone is mainly composed of a graphite structure 1 in which the c-axis is oriented substantially parallel to the thickness direction, and graphite particles dispersed almost uniformly in the graphite structure 1. Consists of three.
- the graphite structure 1 has a structure in which the graphene layers 2 each having a six-membered carbon ring structure are stacked with correlation as described above.
- the graphite originally has a fixed position when the dalaphen layer is not merely leaked (see Fig. 4), and the graphite is stacked while the positional relationship is jf.
- FIG. 5 shows a typical X-ray diffraction pattern of the graphite structure 1.
- the half width of the main peak around 26.5 ° shown in Fig. 5 is preferably 1 ° or less.
- the half width has a correlation with the crystallinity, and in the present invention, the narrower the half width, the more preferable.
- the thermal conductivity / II in the plane direction of the graphite structure 1 having such crystallinity (orientation) itself is »40 OW / m ⁇ K or more, depending on the product. Also in the present invention, it is preferable that the in-plane direction ⁇ ⁇ II be 40 OW / m ⁇ K or more.
- the graphite structure 1 used as a matrix in the present invention is not limited as long as the graphite in the surface direction is high. Can be used. In particular, graphite obtained by baking and heating an organic polymer (eg, polyimide) as a carbon precursor has a near-ray structure similar to a single crystal.
- the carbon particles 3 applied in the present invention not only transmit the heat passing through the graphite structure 1 in the surface direction, but also thermally connect between the daraphen layers 2 (that is, between the laminated graphene layers). Also, it has a function to propagate heat also in the layer direction (thickness direction). Therefore, as the carbon particles 3, it is preferable to use a graphite powder having high conductivity, that is, a graphite powder having high crystallinity.
- oriented graphite powder having very high in-plane conductivity is very useful as carbon particles.
- those obtained by pulverizing a highly oriented graphite sheet manufactured in good faith with an organic material are preferable from the viewpoints of crystallinity (recognition) and homogeneity.
- a carbon structure can be used as the carbon particles 3.
- This carbon structure also has the function of not only heating the surface of the graphite structure 1 in the plane direction, but also extruding the fiber between the dalaphen layers 2 to excite the heat in the layer direction (thickness direction). You. Therefore, it is preferable to use a carbon structure having high conductivity, particularly a carbon structure having high crystallinity.
- the particle size of Ritsuko Charcoal 3 may be any size as long as it can be uniformly dispersed in the graphite structure.
- a method of forming a graphite structure by firing an organic polymer 0.1 m or more and 5 m or less so as not to inhibit the dalaphite formation. It is preferable to use a carbon cube in the range of
- the above-mentioned ready-made graphite particles can be used, and in the firing step of converting the organic polymer as a base material into graphite, predetermined carbon particles (such as graphite particles) are formed.
- the obtained organic liver material can also be used as a raw material for carbon particles. For example, by heat-treating an organic polymer in which powdered polyimide having a particle size in the range of 0.1 lm ⁇ 10; m or less is dispersed, the organic high liver body (matrix) can be graphitized and edited. Fine powder Polyimide can also be graphitized. As a result, it is possible to obtain a highly transparent sound with darafite particles dispersed in the graphite structure.
- Step (I) Organic high ⁇ with dispersed graphite particles. It consists of a step of obtaining a body, and a step (I I) of converting it into a graphite by taking care of it.
- polyimide can be suitably used as the organic polymer.
- the precursor polyamic acid can be used as a raw material. Therefore, in the second embodiment, a description will be given of a method of applying force as an example.
- step (I) of forming the organic powder containing graphite powder will be described.
- Graphite particle height ⁇ ⁇ is a first organic high liver, a predetermined amount of graphite particles 3 are mixed and dispersed in a polyamic acid solution, molded into a predetermined shape, and then heated, ⁇ water reaction, etc. By doing so, the desired organic height can be obtained. At this time, a touch can be used if necessary.
- the self-organization of the organic high liver depending on the kind of the organic high used.
- the type of the organic component, the organic liver, the type of the solvent, etc. are determined so that a material having a predetermined orientation and having mixed graphite particles 3 dispersed therein can be obtained. . That! ;
- Add to the solution prepared by mixing, if necessary, adding bandages, adjusting the viscosity, etc. and win. ⁇ Apply to the desired use form by applying. By volatilizing the solvent in this state, the first organic solid is solidified.
- the ⁇ it condition at the time of preparation it can be carried out in a room, which is a normal operation, but it is also possible to heat the solvent within the ⁇ it range of the boiling point of the solvent depending on the machine.
- a reaction process such as heating and dehydration
- heat treatment in a nitrogen atmosphere or a vacuum atmosphere is typically used.
- dehydration can be performed by a chemical reaction.
- an optimal method can be selected according to the type of the organic polymer to be formed and the like. In particular, from the viewpoint of ease of production, it is preferable to carry out the method by heating in a temperature range of 100 to 400 ° C.
- step (II) oriented darahite is obtained from the graphite height.
- the process itself may be the same as the above-described method of firing the ⁇ liver sheet (product name “Kapton J Toray Dupont Co., Ltd.”) described in Japanese Patent Application Laid-Open No. 07-109171. .
- the second organic polymer which is a carbon precursor, is pre-baked, and the carbon (C) components (oxygen (O), nitrogen (N), 7K element (H), etc.) contained in the organic high liver I ⁇ .
- the treatment time and the treatment time depend on the dog and size of the baking treatment, but it is 0.5 to 1000 to 1500 ° C in an atmosphere of argon (Ar) or nitrogen (N 2 ) or a mixed atmosphere thereof. It should be longer than 5 hours.
- heating is preferably performed in a range of rCZmin to 15 ° CZmin, particularly, in a range of 3 ° C / in to 10 / min.
- the cooling efficiency after pre-firing it is possible to cool in the range of 5 ° C / min to 20 ° C / min, especially in the range of 5 ° C / min to 10 ° C / min. preferable.
- the in-plane heat transfer ⁇ and the degree of orientation of the graphite structure obtained after the present treatment can be increased.
- the pre-baked organic liver is fully baked in the range of 2,000 ° C. to 3,000: in order to obtain oriented graphite.
- an intermediate treatment m3 ⁇ 42oo or more and 2400 or less
- the force r ′ to increase the degree of orientation of the obtained graphite structure 1 can be reduced.
- the mixture is heated from room temperature to a predetermined intermediate temperature in a range of 5 ° C./min or more and 1 O / min or less, and tested for 1 hour, and then again, and then subjected to heating.
- the actual condition is generally 2000 to 3000 ° C Heat in the following temperature range for 0.5 to 10 hours.
- the cooling rate should be 5 ° C / min or more and 20 ° CZmin or less, especially 5 ° CZmin or more 1 (TCZmin or less).
- the graphite structure 1 having high surface direction conductivity of the present invention can be formed, and further, the layer structure can be improved by the action of the graphite particles 3 dispersed in the structure.
- the conductivity is also improved.
- Figure 6 shows the anti-sickle diagram for the above process.
- the daraphen layer is oriented while being properly oriented by adjusting the conditions (mainly by adjusting the above, or by mixing and sintering the filler described above).
- the density of the obtained graphite object 1 is determined by the value of the original graphite. ( ⁇ 2. 2 6 g / cm 3) is off to less than (0. 3 ⁇ 2 g / cm 3) .
- the state of the voids formed graphite structure is shown in FIG. 2 In the graphite structure 1, a large number of holes 4 are present.
- the obtained graphite structure 1 has flexibility, is hard to be cut even when bent, and can be easily deformed with respect to IS. Such characteristics have the effect of increasing the design flexibility when performing ⁇ ffl as an additional sound and reducing the heat resistance with the heat source.
- the 3 ⁇ 4 ⁇ -like manufacturing process may be the same as that of the form 2 of the dragon.
- step (I) a carbon precursor is added to the first organic high-molecular weight solution dissolved in the solvent. After mixing and dispersing the organic liver, which is the body, into a predetermined shape, it is solidified by evaporating the solvent, and the second organic, which is easily graphitized by performing a dehydration reaction or the like by calorific heat, is used. Synthesize polymer (polyimide).
- the next step (II) may be performed in the same manner as in the second embodiment.
- the second organic height becomes a graphite structure having a high in-plane conductivity, and the organic polymer dispersed therein is also carbonized and further converted into graphite.
- the organic polymer dispersed therein is also carbonized and further converted into graphite.
- the high-acceptance sound of the present invention has a structure in which a graphite structure having a high in-plane conductivity is divided into carbon particles that supplement the layer-direction conductivity, so that an overall high-acceptance sound is obtained. It is possible to provide a high sound conductive sound with a guiding function. As a result, heat efficiently propagates also in the layer direction (thickness direction) via the carbon particles. As a result, it becomes possible to improve the layer direction lou ⁇ as compared with that of the graphite structure insect.
- the knitted graphiteite structure contains voids, the carbon particles that facilitate the transmission in the layer direction can be easily contained in a suitable form and obtained. As a result, flexibility and character can be provided.
- the flexibility in the present specification refers to a bending resistance against a bending process.
- the B shrinkage indicates the deformability with respect to the compression treatment.
- the inclusion of voids increases the degree of adhesion to a heat source, etc., and reduces the thermal resistance. It becomes ⁇ j ability to suppress.
- a graphite structure having a high orientation can be produced relatively easily, and carbon particles can be produced relatively easily in a desired state. Dispersing in a structure is a function.
- the second organic high liver is made of polyimide.
- the difficult system of the present invention since the sound of a high self-guidance sound is inverted, the excellent sound-guidance can be exhibited not only in the plane direction but also in the layer direction. As a result, it is possible to build a highly combustible combustion system.
- a sheet-shaped highly conductive member when used, its flexibility reduces the degree of freedom in the shape of the heat dissipation system, and allows the design of a male system that can be used in various applications. It becomes.
- the high conductivity of the present invention is useful not only as a heat dissipation system material used in parts requiring heat countermeasures such as various electronic devices such as CPUs and lasers, but also in various forms. Because it can be processed in a wide range, it can be applied to applications that require heat uniformity, such as wide stage applications such as plate stages and mask stages.
- a polyamic acid cat was prepared as a precursor of polyimide, Takako. Nitrogen (New 2) in a dry box filled with gas, and stirred with bis (4-Aminofu Eniru) ether 5. 0 0 g and dimethyl ⁇ Seto amide 1 2 0 m l in 51 ⁇ 2 flasks, was dissolved .
- the solution was combined with 5.45 g of pyromellitic anhydride and stirred for about 3 hours to synthesize polyamic acid, the first organic high ⁇ material.
- the synthesized polyamic acid was mixed with 5% by weight of a graphite powder (conductivity: ⁇ 20 OW / m ⁇ K) having an average particle size of 4 m, which was milled with a jet mill, and the mixture was mixed with a pole mill.
- the dispersion was carried out uniformly for a certain period of time. Note that the particle size of the graphite powder was not limited to 4, and even a slightly larger (> 20 m) or smaller particle could be dispersed almost uniformly.
- the polyamic acid solution containing the graphite powder thus produced was applied to a slide glass to form a polyamide powder-containing polyamide resin (thickness: ⁇ 500 m). After 1 hour in a nitrogen atmosphere, it was heated for 1 hour in a vacuum oven for 2 hours (room) and then heated to 100 ° C for 1 hour. My own solvent component was evolved and the graphite powder was dispersed inside to form polyamic acid.
- the above polyamide resin was ⁇ g in a glass tube oven, evacuated and then treated with 30 Ot: for 1 hour to imidize the polyamide ⁇ E.
- the obtained polyimide film was peeled off from the slide glass, and the thickness was measured with a micrometer to be about 50 m.
- the temperature was raised from room temperature to 1200 ° C. in an Ar atmosphere at 3 ° C. Z min, and the pre-firing was performed at 1200 ° C. for 3 hours.
- the degree of elevation may be determined in consideration of the type and shape of the organic high liver membrane to be treated, but it is generally preferable that the range be 15: Zmin or less.
- the temperature was lowered to room temperature at a temperature drop of 5 t: / min. In general, it is not necessary to control the descent at the time of cooling as strictly as the rise ffii ⁇ , but it is preferably 10 ° C / min or less, and in this example, 5 ° C / in was adopted.
- the organic liver is heated to release nitrogen, oxygen, and hydrogen, so that the weight ratio becomes 50 to 60% of the starting material, and the carbon powder in which the graphite powder is dispersed! Changes to ⁇ . Therefore, the dispersed graphite powder has no effect.
- the sample was further transferred to an ultra high temperature and main firing was performed.
- Figure 8 (b) shows the temperature profile. In the present embodiment, up to 100 O: was performed at an elevated temperature of 100 ° C./min, and then an intermediate process of 2 ° C. was performed at 220 ° C. for 1 hour as 5 ° C. Zmin.
- the rate of increase was 5 / min up to the main firing temperature of 2700 ° C., and the i3 ⁇ 4f time at 2700 ° C. was 3 hours.
- the cooling rate after the main firing temperature was maintained was 5 ° C / min up to 220 ° C, then 10 / min up to 130 ° C, and 2 O / min up to room temperature.
- the graphiteite structure obtained in this way (hereinafter sometimes simply referred to as “structure”) had an expansion of 100 m.
- the cross section of the ⁇ ⁇ which which, was found to have a graphite structure with a layer of dalaphen. Void (figure
- the heat conduction characteristics of the graphite structure containing the graphite powder obtained in the above steps were evaluated.
- the in-plane conductivity ⁇ II was similar to that of 60 O WZm ′ K, which is an age value not including the graphite powder.
- the conductivity ⁇ 'in the layer direction (thickness direction) was 25 WZm'K force S, which is several times that of. Therefore, by mixing / dispersing the graphite powder in the highly-oriented graphite structure, it is possible to obtain a graphite structure having high conductivity in the layer direction. And confirmed.
- the graphite structure produced in this example has a large number of fine pores inside, it is possible to obtain a high thermal conductive material having excellent flexibility and compressibility as a result.
- a high thermal conductive material having excellent flexibility and compressibility as a result.
- Example 1-2 the darafite particles used in Example 1-1 were further pulverized, and the particle diameter was set to 0.1 to 0.3/zm@S.
- the graphite particles were mixed / dispersed in polyamic acid, which is the first organic solvent, at a concentration of 3 M%, a highly transparent tone consisting of a graphite structure was formed in the same process.
- the surface orientation was 60 OWZm'K as in Example 1 described above.
- the stratified direction was improved to 5 OW / m ⁇ K. This is thought to be due to the fact that the dispersibility of the mixed graphite particles increased and the thermal fiber between the graphene layers increased as a result of the finer particles.
- the size of the above-mentioned darafite powder was changed in the range of 0.05 to 20 m to produce a graphiteite structure. As a result, it was confirmed that the layer direction ⁇ was improved in each case.
- Example 13 the graphite particles used in Example 1-1 were further pulverized, and the particle diameter was set to 0.1 to 0.3.
- the content of the graphite particles added to the polyamic acid, which is the first organic high liver solution, is changed in the range of 10 ppm to 10 wt%, and the high-conductivity sound composed of the graphite structure is obtained. An appendix was formed.
- the ⁇ II in the plane direction was 60 OW / m ⁇ K as in the above-mentioned Example 1.
- the thermal conductivity in the layer direction / ⁇ was 10-5 OWZm ⁇ K.
- the temperature of the polyamide acid was adjusted so that the polyimide was about 15 m, and the second Polyimide, which is an organic liver, was produced.
- the obtained ⁇ was inferior in flexibility compared to the sample of Example 1-1 described above, but had a slightly inferior property such as resistance to flexing fiber.
- the in-plane conductivity ⁇ II was 980 W / ⁇ K.
- the thermal conductivity ⁇ ⁇ in the layer direction maintained a value of 5 OW / m ⁇ K. This is thought to be due to the fact that the degree of orientation in the plane direction was increased by the decrease in the amount of vacancies.
- FIG. 3 shows a schematic image diagram of the high-conductivity sound having the graphite structure obtained in the present embodiment.
- the in-plane H3 ⁇ 4i ⁇ ⁇ II was almost the same as 60 OW / m' ⁇ .
- the conductivity ⁇ ⁇ in the layer direction was 80 W / m ⁇ K. This is considered to be because the thermal conductivity of the graphite powder dispersed in the graphite structure was higher than that of the conventional graphite material, so that the thermal connection in the layer direction was improved.
- the graphite powder composed of the PGS graphite sheet was further finely crushed (particle size: 0.2 to 0.4 m) to produce a similar graphite structure.
- the direction of the layer was improved to 98WZm * K.
- Example 1-1 Although the carbon precursor organic polymer material used in Example 1-1 was polyimide, the organic high liver material was also used to produce a graphite powder-containing darafite structure by the same manufacturing method as described above. Has been confirmed to be ⁇ r ability. After mixing the graphite powder into each precursor brain and solidifying it, heat it. ” ⁇ The organic polymer obtained by the water reaction etc. is calcined with a specified profile to obtain a highly conductive sound. An appendix was made. Specifically, polyamide (PA), polyphenylene terephthalamide (PPTA), polyphenylene oxaziazole (POD), polybenzothiazole (PBT), polybenzobisthiazol (PBBO) ), Polyphenylenebenzoimidazole (P
- Graphite structure containing graphite powder was obtained using organic high-molecular-weight materials such as BI), polyphenylene benzobisimidazole (PPBI), polythiazole (PT), and polyparaphenylene vinylene (PPV).
- organic high-molecular-weight materials such as BI), polyphenylene benzobisimidazole (PPBI), polythiazole (PT), and polyparaphenylene vinylene (PPV).
- a polyimide powder having an average particle diameter of 5 to 10 m was mixed with a polyamic acid solution to form a polyamide powder in which a powder of a high material was dispersed, and then the polyamide acid was polyimide.
- the polyimide obtained in the above steps was placed in an electric furnace and fired.
- the temperature profile adopted in the present embodiment was the same as that of the above-mentioned Embodiment 1-1. As a result, first, in the pre-firing ⁇ stage, the second organic layer was heated and changed into a carbon film, and the organic layer contained therein was also carbonized.
- the second organic high ⁇ changes to a graphite structure in which the dalaphen layer is laminated in layers, and at the same time, the portion where the organic high ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ also. It was confirmed that the layered structure was graphitized to 1 ".
- the thermal conductivity of the graphite powder-containing graphite structure obtained as described above was determined by fHffi.
- the plane direction ⁇ f ⁇ ⁇ II was about 6 O OWZm ′ K as in Example 1.
- the amount of acknowledgment in the layer direction 01 was 20 to 4 OW / m'K.
- FIG. 9 (a) shows a configuration in which the high-intensity conductive material 9 of the present invention is brought into close contact between the developing device 8 and the thigh device 10 to perform combustion.
- PPS graphite sheet manufactured by Matsushita was applied. The measurement was performed under the pressure of 1 ⁇ ] mouth (10 NZcm 2 ).
- the thermal resistance of the copper plate was 1.0 ° C / W, and that of the highly oriented graphite sheet was 0.4/W@ ⁇ .
- the use of the highly conductive guinea pig of the present invention improved the anti-inflammatory properties to 0.3 ° C / W.
- Example 2-1 An example in which a carbon nanotube (CNT)) is used as a carbon structure material, polyimide is adopted as an organic high-organic body that mixes / disperses the CNT, and a dalafite structure is manufactured by firing it will be described. .
- CNT carbon nanotube
- a polyamic acid was prepared as a precursor to the lungs of polyimide.
- the procedure is as follows: in a dry box filled with nitrogen (N 2 ) gas,
- a polyamic acid solution as a first organic polymer was synthesized by adding 5.45 g of pyromellitic anhydride to the above and stirring for about 3 hours.
- the obtained polyamic acid was mixed with 0.5% by weight of CNTs (length: 11 m) powdered by a jet mill or the like, and the mixture was uniformly mixed in the ⁇ ⁇ ⁇ ⁇ ⁇ by performing a mill for 12 hours.
- the CNT-containing polyamic acid solution prepared in this manner was applied to a slide glass to form a CNT-containing polyamic acid thin film (thickness: ⁇ 150 ⁇ m).
- This fiber was rubbed for 1 hour in a ⁇ ⁇ ⁇ ⁇ atmosphere, then straight-sickled in a vacuum oven at room temperature for 2 hours, and then heated to 100 ° C for 1 hour. As a result, an orange-colored film was obtained.
- the obtained film was placed in a glass tube oven, evacuated, and then agitated at 300 ° C. for 1 hour to form a CNT-containing polyimide film.
- the polyimide film obtained was peeled off from the slide glass, and the thickness was measured with a micrometer.
- FIG. 8 (a) shows the profile of the pre-firing in this example.
- the temperature was raised from room temperature to 120 Ot in an Ar atmosphere at a rate of 3 / min, and was maintained at a preliminary firing temperature of 1200 for 3 hours.
- the temperature rise may be determined in consideration of the type and shape of the organic high film to be baked. However, the range is preferably l: / min or more and 15 5 ⁇ n or less. So we adopted 3 n.
- the mixture was cooled to room temperature at a temperature decrease of 1 at a rate of 5 ⁇ / min. " ⁇ In terms of cooling Si, it is strict Although it is not necessary to control tightly, it is preferably 1 ° C / min or more and 10 V / min or less, and 5 ° C / min was employed in the present embodiment.
- the organic high liver membrane is heated to release nitrogen, oxygen, and oxygen.
- the starting material, CNT 50 to 60% by weight of the starting material, CNT, is dispersed and carbonized. Turns into a film. Therefore, it has no effect on the dispersed CNTs.
- Figure 8 (b) shows the temperature profile.
- the temperature was raised to 100 ° C. at an elevation I of 1 O / min, and then an intermediate process of 220 was performed as 5 ⁇ : / ⁇ i ⁇ , and an intermediate i3 ⁇ 4t of 1 hour was provided.
- the heating rate was 5 ° C. Z min until the main firing temperature was 2700, and the holding time at 2700 was 3 hours. Cooling after the main firing temperature was maintained, the cooling rate was 5 ° C / min up to 220 ° C, then 1 O: Zmin until 1300 ° C, and 2 X / min up to room temperature. did.
- the graphiteite structure thus obtained was about 30 // m.
- SEM E-SEM
- CNTs that had been pre-mixed / dispersed across the dalaphen layer oriented in the plane direction were also found to be self-placed.
- the crystal structure of the formed graphite structure was described by X-ray diffraction analysis. As a result, the same graphite (02) as in FIG. 5 and its higher order peak were observed. From this, it was found that even in the age containing CNT, the ⁇ -graphite structure with sufficient plane orientation was obtained.
- Example 2-1 In the same process as in Example 2-1 when producing a highly transparent sound-attaching made of a graphite structure, the mixing / decomposition of the CNT was changed.
- CNT was changed in the range of 10 ppm to 10% by weight to form a highly conductive tone with a graphite structure.
- the in-plane direction compensation II was 900 to 98 OW / m ⁇ K, as in the case of the S-Example 2-1.
- the heat ⁇ ⁇ ⁇ in the layer direction was 10 to 70 W / m ⁇ K.
- Example 2-1 In the same process as in Example 2-1, the pith of the polyamic acid sickle was adjusted so that the polyimide Ml was about 50 m, and a polyimide film as a second organic liver was prepared.
- the value of 5 OW / m ⁇ K was maintained in the layer direction. This is considered to be due to the fact that the degree of orientation in the plane direction was slightly reduced by including the voids.
- the graphite structure manufactured in this example is covered with a large number of invertible vacancy regions. As a result, the graphite structure has excellent flexibility and EB shrinkage. I was able to get talent.
- Example 2-1 a highly transparent conductive material was prepared using CNT.
- diamond particles were added to the graphite structure.
- diamond particles having an average particle size of 1 m were mixed with polyamic acid to form a polyimide, and then stiffened in the same manner as in the case of the Kojimi example. A structure was prepared.
- Example 2-1 Although the carbon precursor organic high-molecular material used in Example 2-1 was polyimide, a carbon-structure-containing graphitic structure was also manufactured using the same organic high-liver material as described above. Has been confirmed to be ⁇ r ability. A carbon structure is added to each of the precursor solutions to form a toughened product, and a film obtained by a carothermal J-water polymerization reaction or the like is fired with a predetermined profile to produce a highly conductive portion. did it.
- polyimides include polyphenylene terephthalamide (PPTA), polyphenylene oxasaziazo (PD), polybenzothiazole (PBT), polybenzobisthiazol (PBBII), ⁇ R using organic polymers such as polyphenylene benzoimidazole (PBI), polyphenylene benzobisimidazole (PPB I), polythiazole (PT), and polyparaphenylene vinylene (PPV) also have a carbon structure A body-containing graphite structure was obtained.
- PPTA polyphenylene terephthalamide
- PD polyphenylene oxasaziazo
- PBT polybenzothiazole
- PBBII polybenzobisthiazol
- ⁇ R using organic polymers such as polyphenylene benzoimidazole (PBI), polyphenylene benzobisimidazole (PPB I), polythiazole (PT), and polyparaphenylene vinylene (PPV) also have a carbon structure A body
- Examples 2-1 and 2-4 were CNT and diamond
- a carbon body-containing Daraphite structure can be manufactured using the same manufacturing method as that described above. I confirmed that it was functional. Specifically, it has been able to obtain highly conductive sound (graphite structure containing carbon structure) with carbon structures such as fullerene and diamond-like carbon particles.
- a male system was assembled using the highly conductive material comprising the graphite structure obtained in Examples 2-1 to 2-6, and the thigh was measured.
- FIG. 9A shows a system in which the high-conductivity sound attachment 9 according to the present invention is brought into close contact between the emission 8 and the heat radiation attachment 10. For comparison, the same was applied to the case where copper and orientational graphite sheet were applied. Measuring is 13 ⁇ 4!] Pressure This was performed under (1 ONZcm 2 ).
- the thermal resistance of the copper plate was 1.0 ° C / W, and that of the highly oriented graphite sheet was 0.4 ° C / W @.
- the highly transparent component of the present invention was used, it was confirmed that the characteristics were improved to 0.3: / W.
- the radiation improvement power was similarly obtained.
Abstract
Description
Claims
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JP2005513396A JP3948000B2 (ja) | 2003-08-26 | 2004-08-26 | 高熱伝導性部材及びその製造方法ならびにそれを用いた放熱システム |
US11/242,907 US7252795B2 (en) | 2003-08-26 | 2005-10-05 | High thermal conductivite element, method for manufacturing same, and heat radiating system |
US11/822,334 US7402340B2 (en) | 2003-08-26 | 2007-07-05 | High thermal conductive element, method for manufacturing same, and heat radiating system |
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US11615999B1 (en) * | 2022-07-22 | 2023-03-28 | GuangDong Suqun New Material Co., Ltd | Oriented heat conducting sheet and preparation method thereof, and semiconductor heat dissipating device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06100367A (ja) * | 1992-09-16 | 1994-04-12 | Osaka Gas Co Ltd | 異方性炭素−炭素複合材料およびその製造方法 |
JP2000323633A (ja) * | 1999-05-10 | 2000-11-24 | Mitsubishi Pencil Co Ltd | 炭素放熱体及びその製造方法 |
JP2002308611A (ja) * | 2001-04-06 | 2002-10-23 | Ube Ind Ltd | グラファイト層状シ−ト物及びその製造方法 |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS544895A (en) * | 1977-06-14 | 1979-01-13 | Kanebo Ltd | Production of impermeable carbon molded element |
JPS58147087A (ja) | 1982-02-25 | 1983-09-01 | Sumitomo Electric Ind Ltd | 半導体素子用ヒ−トシンク |
JPS6012747A (ja) | 1983-07-01 | 1985-01-23 | Sumitomo Electric Ind Ltd | エレクトロニクスデバイス用ヒートシンクおよびその製造法 |
JPS61145266A (ja) | 1984-12-19 | 1986-07-02 | Sumitomo Electric Ind Ltd | 接着剤 |
JPS62119161A (ja) * | 1985-11-14 | 1987-05-30 | 呉羽化学工業株式会社 | 可撓性炭素材料およびその製造方法 |
JPS649869U (ja) | 1987-07-08 | 1989-01-19 | ||
DE3871660T2 (de) * | 1987-08-26 | 1993-01-21 | Matsushita Electric Ind Co Ltd | Verfahren zur herstellung eines graphitfilms oder -blatts und strahlungsoptische vorrichtung, in der das graphitblatt verwendet wird. |
JPH0732134Y2 (ja) | 1987-09-02 | 1995-07-26 | 三菱鉛筆株式会社 | 水性ボールペン等のノック式筆記具 |
US4882103A (en) * | 1987-11-09 | 1989-11-21 | Mitsubishi Pencil Co., Ltd. | Process for producing carbon product having coarse and dense structure |
JPH02243097A (ja) * | 1989-01-20 | 1990-09-27 | Mitsubishi Pencil Co Ltd | 全炭素質音響機器用振動板の製造法 |
JP2976481B2 (ja) * | 1989-05-10 | 1999-11-10 | 松下電器産業株式会社 | フィルム状グラファイトの製造方法 |
JPH039552A (ja) | 1989-06-07 | 1991-01-17 | Idemitsu Petrochem Co Ltd | 高熱伝導性部材 |
JP3345986B2 (ja) | 1993-10-15 | 2002-11-18 | 松下電器産業株式会社 | グラファイト熱伝導体およびそれを用いたコールドプレート |
JPH09102562A (ja) | 1995-10-06 | 1997-04-15 | Kobe Steel Ltd | 高熱伝導性基板及びその製造方法 |
JPH09283955A (ja) | 1996-04-10 | 1997-10-31 | Matsushita Electric Works Ltd | 放熱シート |
US5863467A (en) | 1996-05-03 | 1999-01-26 | Advanced Ceramics Corporation | High thermal conductivity composite and method |
JPH10168502A (ja) | 1996-12-10 | 1998-06-23 | Osaka Gas Co Ltd | 高熱伝導率複合材 |
TW385298B (en) | 1997-04-04 | 2000-03-21 | Ucar Carbon Tech | Oxidation and corrosion resistant flexible graphite composite sheet and method |
JP2001068608A (ja) | 1999-08-26 | 2001-03-16 | Ube Ind Ltd | 熱伝導体およびそれを用いた電気・電子機器 |
JP2002299534A (ja) | 2001-04-02 | 2002-10-11 | Denso Corp | 放熱材およびその製造方法 |
US7341781B2 (en) * | 2001-04-04 | 2008-03-11 | Graftech International Holdings Inc. | Material useful for preparing embossed flexible graphite article |
GB2375501B (en) * | 2001-05-03 | 2003-07-09 | Morgan Crucible Co | Extrusion of graphitic bodies |
JP4714371B2 (ja) | 2001-06-06 | 2011-06-29 | ポリマテック株式会社 | 熱伝導性成形体及びその製造方法 |
JP4746803B2 (ja) | 2001-09-28 | 2011-08-10 | 株式会社ファインラバー研究所 | 熱伝導性電磁波シールドシート |
JP2003128475A (ja) * | 2001-10-18 | 2003-05-08 | Mitsubishi Pencil Co Ltd | 炭素質多孔体およびその製造方法 |
US7071258B1 (en) * | 2002-10-21 | 2006-07-04 | Nanotek Instruments, Inc. | Nano-scaled graphene plates |
EP1657226B1 (en) * | 2003-08-20 | 2014-12-17 | Denki Kagaku Kogyo Kabushiki Kaisha | Spraying method employing a spraying material |
WO2005019132A1 (ja) * | 2003-08-26 | 2005-03-03 | Matsushita Electric Industrial Co., Ltd. | 高熱伝導性部材及びその製造方法ならびにそれを用いた放熱システム |
US7108917B2 (en) * | 2004-01-28 | 2006-09-19 | Advanced Energy Technology Inc. | Variably impregnated flexible graphite material and method |
-
2004
- 2004-08-26 WO PCT/JP2004/012671 patent/WO2005019132A1/ja active Application Filing
- 2004-08-26 JP JP2005513396A patent/JP3948000B2/ja not_active Expired - Fee Related
-
2005
- 2005-10-05 US US11/242,907 patent/US7252795B2/en active Active
-
2007
- 2007-07-05 US US11/822,334 patent/US7402340B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06100367A (ja) * | 1992-09-16 | 1994-04-12 | Osaka Gas Co Ltd | 異方性炭素−炭素複合材料およびその製造方法 |
JP2000323633A (ja) * | 1999-05-10 | 2000-11-24 | Mitsubishi Pencil Co Ltd | 炭素放熱体及びその製造方法 |
JP2002308611A (ja) * | 2001-04-06 | 2002-10-23 | Ube Ind Ltd | グラファイト層状シ−ト物及びその製造方法 |
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Also Published As
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US20070259186A1 (en) | 2007-11-08 |
JP3948000B2 (ja) | 2007-07-25 |
US7252795B2 (en) | 2007-08-07 |
US20060035085A1 (en) | 2006-02-16 |
US7402340B2 (en) | 2008-07-22 |
JPWO2005019132A1 (ja) | 2006-10-19 |
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