JP2007019512A - 携帯電子装置用のサーマルソリューション - Google Patents
携帯電子装置用のサーマルソリューション Download PDFInfo
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- JP2007019512A JP2007019512A JP2006186778A JP2006186778A JP2007019512A JP 2007019512 A JP2007019512 A JP 2007019512A JP 2006186778 A JP2006186778 A JP 2006186778A JP 2006186778 A JP2006186778 A JP 2006186778A JP 2007019512 A JP2007019512 A JP 2007019512A
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- Prior art keywords
- heat
- thermal
- graphite
- thermal solution
- solution
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
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- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Computer Hardware Design (AREA)
- Electromagnetism (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Carbon And Carbon Compounds (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Telephone Set Structure (AREA)
- Transmitters (AREA)
Abstract
【解決手段】熱源を含んでなる第一部品と、前記第一部品から熱が伝達される第二部品とを含んでなる携帯電子装置、および、2つの主表面を含んでなるサーマルソリューションを含んでなり、前記サーマルソリューションが、その主表面の一方が前記第一部品と作動接触するように配置されて、前記第一部品と前記第二部品との間に挿入されている、携帯電子装置用の熱を放散および遮蔽するシステムであって、前記サーマルソリューションが、少なくとも一枚のフレキシブルグラファイトのシートを含んでなる。
【選択図】図3
Description
Claims (14)
- 熱源を含んでなる第一部品と、前記第一部品から熱が伝達される第二部品とを含んでなる携帯電子装置、および、2つの主表面を含んでなるサーマルソリューションを含んでなり、
前記サーマルソリューションが、その主表面の一方が前記第一部品と作動接触するように配置されて、前記第一部品と前記第二部品との間に挿入されている、携帯電子装置用の熱を放散および遮蔽するシステムであって、
前記サーマルソリューションが、少なくとも一枚のフレキシブルグラファイトのシートを含んでなる、システム。 - 前記電子装置が、前記第一部品に直接隣接していない所に配置された放熱装置をさらに含んでなり、さらに前記サーマルソリューションの主表面の一方が前記放熱装置と作動接触する、請求項1に記載のシステム。
- 前記放熱装置が、吸熱源、ヒートパイプ、ヒートプレートまたはそれらのいずれかの組合せを含んでなる、請求項2に記載のシステム。
- 前記サーマルソリューションが、少なくとも約140W/m°Kの面内熱伝導率を有する、請求項1に記載のシステム。
- 前記サーマルソリューションが、約12W/m°K以下の面貫通熱伝導率を有する、請求項4に記載のシステム。
- 前記サーマルソリューションが、そのサーマルソリューションの上に保護被覆をさらに含んでなる、請求項1に記載のシステム。
- 前記保護被覆が、前記フレキシブルグラファイトの少なくとも一枚のシートの面貫通熱伝導率未満の熱伝導率を有する、請求項6に記載のシステム。
- 熱伝達材料が、前記サーマルソリューションと前記第一部品との間に配置される、請求項1に記載のシステム。
- 前記熱伝達材料が、金属または熱界面を含んでなる、請求項8に記載のシステム。
- 前記電子装置が携帯電話であり、前記第一部品が、前記携帯電話の電力増幅器またはデジタル信号プロセッサーを含んでなる、請求項1に記載のシステム。
- 前記電子装置が携帯電話であり、前記第二部品が、前記携帯電話のバッテリーを含んでなる、請求項1に記載のシステム。
- 前記電子装置が携帯電話であり、前記第二部品が、前記携帯電話のキーパッドを含んでなる、請求項1に記載のシステム。
- 反射性材料が、前記サーマルソリューションと前記携帯電話のキーパッドとの間に配置される、請求項12に記載のシステム。
- 前記電子装置が携帯電話であり、前記第二部品が、前記携帯電話のケースを含んでなる、請求項13に記載のシステム。
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US11/176,596 US7292441B2 (en) | 2003-11-25 | 2005-07-07 | Thermal solution for portable electronic devices |
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JP2008003574U Continuation JP3147891U6 (ja) | 2005-07-07 | 2008-05-30 | サーマルソリューションを有する携帯電話 |
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JP2007019512A true JP2007019512A (ja) | 2007-01-25 |
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JP2006186778A Pending JP2007019512A (ja) | 2005-07-07 | 2006-07-06 | 携帯電子装置用のサーマルソリューション |
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US (1) | US7292441B2 (ja) |
EP (2) | EP1993337B1 (ja) |
JP (1) | JP2007019512A (ja) |
KR (1) | KR100935275B1 (ja) |
CN (4) | CN103747661A (ja) |
AT (2) | ATE407546T1 (ja) |
DE (1) | DE602006002563D1 (ja) |
ES (1) | ES2375672T3 (ja) |
TW (1) | TW200704356A (ja) |
WO (1) | WO2007008342A2 (ja) |
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DE602006002563D1 (de) | 2008-10-16 |
CN103747661A (zh) | 2014-04-23 |
US20060126304A1 (en) | 2006-06-15 |
CN103124491A (zh) | 2013-05-29 |
ES2375672T3 (es) | 2012-03-05 |
WO2007008342A2 (en) | 2007-01-18 |
EP1742524B1 (en) | 2008-09-03 |
KR20070006583A (ko) | 2007-01-11 |
EP1742524A1 (en) | 2007-01-10 |
ATE407546T1 (de) | 2008-09-15 |
ATE532396T1 (de) | 2011-11-15 |
JP3147891U (ja) | 2009-01-29 |
US7292441B2 (en) | 2007-11-06 |
TW200704356A (en) | 2007-01-16 |
EP1993337B1 (en) | 2011-11-02 |
EP1993337A2 (en) | 2008-11-19 |
WO2007008342A3 (en) | 2007-12-27 |
EP1993337A3 (en) | 2009-02-25 |
KR100935275B1 (ko) | 2010-01-06 |
CN1893808A (zh) | 2007-01-10 |
CN103078975A (zh) | 2013-05-01 |
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