WO2002028574A1 - Functional alloy particles - Google Patents

Functional alloy particles Download PDF

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Publication number
WO2002028574A1
WO2002028574A1 PCT/JP2001/008687 JP0108687W WO0228574A1 WO 2002028574 A1 WO2002028574 A1 WO 2002028574A1 JP 0108687 W JP0108687 W JP 0108687W WO 0228574 A1 WO0228574 A1 WO 0228574A1
Authority
WO
WIPO (PCT)
Prior art keywords
melting point
alloy particles
initial minimum
minimum melting
functional alloy
Prior art date
Application number
PCT/JP2001/008687
Other languages
English (en)
French (fr)
Inventor
Shuichi Nakata
Yasuki Shimamura
Original Assignee
Asahi Kasei Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Kabushiki Kaisha filed Critical Asahi Kasei Kabushiki Kaisha
Priority to EP01972661A priority Critical patent/EP1327491B1/en
Priority to JP2002532390A priority patent/JP4342176B2/ja
Priority to KR1020037004633A priority patent/KR100615870B1/ko
Priority to AU2001292338A priority patent/AU2001292338A1/en
Priority to DE60142119T priority patent/DE60142119D1/de
Priority to US10/398,114 priority patent/US7169209B2/en
Publication of WO2002028574A1 publication Critical patent/WO2002028574A1/ja

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/10—Sintering only
    • B22F3/1035—Liquid phase sintering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/07—Metallic powder characterised by particles having a nanoscale microstructure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/103—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing an organic binding agent comprising a mixture of, or obtained by reaction of, two or more components other than a solvent or a lubricating agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/16—Metallic particles coated with a non-metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17—Metallic particles coated with metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10—Processes characterised by the sequence of their steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/302—Cu as the principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12229—Intermediate article [e.g., blank, etc.]
    • Y10T428/12236—Panel having nonrectangular perimeter
    • Y10T428/1225—Symmetrical
PCT/JP2001/008687 2000-10-02 2001-10-02 Functional alloy particles WO2002028574A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
EP01972661A EP1327491B1 (en) 2000-10-02 2001-10-02 Functional metal alloy particles
JP2002532390A JP4342176B2 (ja) 2000-10-02 2001-10-02 機能性合金粒子
KR1020037004633A KR100615870B1 (ko) 2000-10-02 2001-10-02 기능성 합금 입자
AU2001292338A AU2001292338A1 (en) 2000-10-02 2001-10-02 Functional alloy particles
DE60142119T DE60142119D1 (de) 2000-10-02 2001-10-02 Teilchen einer funktionellen metalllegierung.
US10/398,114 US7169209B2 (en) 2000-10-02 2001-10-02 Functional alloy particles

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000301762 2000-10-02
JP2000-301762 2000-10-02

Publications (1)

Publication Number Publication Date
WO2002028574A1 true WO2002028574A1 (en) 2002-04-11

Family

ID=18783241

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2001/008687 WO2002028574A1 (en) 2000-10-02 2001-10-02 Functional alloy particles

Country Status (9)

Country Link
US (1) US7169209B2 (ja)
EP (1) EP1327491B1 (ja)
JP (1) JP4342176B2 (ja)
KR (1) KR100615870B1 (ja)
CN (1) CN1273249C (ja)
AU (1) AU2001292338A1 (ja)
DE (1) DE60142119D1 (ja)
TW (1) TW516979B (ja)
WO (1) WO2002028574A1 (ja)

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JP2003286457A (ja) * 2002-03-28 2003-10-10 Asahi Kasei Corp 異方導電性接着シートおよびその製造方法
JP2003286456A (ja) * 2002-03-28 2003-10-10 Asahi Kasei Corp 異方性を有する導電性接着シートおよびその製造方法
JP2005276873A (ja) * 2004-03-23 2005-10-06 Tatsuta System Electronics Kk プリント配線板用シールドフィルム及びその製造方法
JP2006281292A (ja) * 2005-04-01 2006-10-19 Asahi Kasei Electronics Co Ltd 導電性フィラー、及び低温はんだ材料
WO2006109573A1 (ja) 2005-04-01 2006-10-19 Asahi Kasei Emd Corporation 導電性フィラー、及びはんだ材料
JP2007035490A (ja) * 2005-07-28 2007-02-08 Asahi Kasei Electronics Co Ltd 接続部材
JP2007169763A (ja) * 2005-12-26 2007-07-05 Osaka Univ 二種以上の金属からなる金属ナノ粒子及びその形成方法
JP2008183582A (ja) * 2007-01-30 2008-08-14 Asahi Kasei Electronics Co Ltd 導電性フィラー、及びはんだペースト
JP2011062752A (ja) * 2010-10-26 2011-03-31 Asahi Kasei E-Materials Corp 導電性フィラー、及び低温はんだ材料
JP2013045650A (ja) * 2011-08-24 2013-03-04 Tamura Seisakusho Co Ltd 異方性導電性ペースト
WO2015133343A1 (ja) * 2014-03-07 2015-09-11 積水化学工業株式会社 導電ペースト、接続構造体及び接続構造体の製造方法
WO2018105745A1 (ja) * 2016-12-09 2018-06-14 日立化成株式会社 組成物、接着剤、焼結体、接合体及び接合体の製造方法
WO2018105126A1 (ja) * 2016-12-09 2018-06-14 日立化成株式会社 組成物、接着剤、焼結体、接合体及び接合体の製造方法
WO2018105128A1 (ja) * 2016-12-09 2018-06-14 日立化成株式会社 組成物、接着剤、焼結体、接合体及び接合体の製造方法
DE112018002186T5 (de) 2017-04-27 2020-01-09 Mitsubishi Electric Corporation Halbleitereinheit, leistungswandlungsvorrichtung und verfahren zur herstellung einer halbleitereinheit
CN112743255A (zh) * 2019-10-30 2021-05-04 深圳市聚飞光电股份有限公司 锡膏及其制备方法、发光器件
WO2024070436A1 (ja) * 2022-09-28 2024-04-04 綜研化学株式会社 異方導電性材料、異方導電性シートおよび異方導電性ペースト並びに接続構造体および接続構造体の製造方法

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CN113088736B (zh) * 2021-04-07 2022-05-17 安徽飞翔新材料科技有限公司 一种铜合金材料的制备方法
CN113798735B (zh) * 2021-10-25 2023-04-25 浙江亚通新材料股份有限公司 一种焊片/焊环表面涂覆助焊剂的方法

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CN1273249C (zh) 2006-09-06
EP1327491A1 (en) 2003-07-16
AU2001292338A1 (en) 2002-04-15
EP1327491B1 (en) 2010-05-12
CN1471446A (zh) 2004-01-28
KR100615870B1 (ko) 2006-08-25
TW516979B (en) 2003-01-11
US20040079194A1 (en) 2004-04-29
DE60142119D1 (de) 2010-06-24
KR20030063352A (ko) 2003-07-28
EP1327491A4 (en) 2006-11-22
JP4342176B2 (ja) 2009-10-14
JPWO2002028574A1 (ja) 2004-02-12
US7169209B2 (en) 2007-01-30

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