JP4535786B2 - 含銅スズ粉、その含銅スズ粉を含む混合粉体、その含銅スズ粉の製造方法、及び、その含銅スズ粉又は混合粉体を用いた導電ペースト - Google Patents
含銅スズ粉、その含銅スズ粉を含む混合粉体、その含銅スズ粉の製造方法、及び、その含銅スズ粉又は混合粉体を用いた導電ペースト Download PDFInfo
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 231
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims description 157
- 229910052802 copper Inorganic materials 0.000 title claims description 144
- 239000010949 copper Substances 0.000 title claims description 144
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- 239000011812 mixed powder Substances 0.000 title claims description 8
- 239000000843 powder Substances 0.000 claims description 88
- 238000006467 substitution reaction Methods 0.000 claims description 59
- 238000000034 method Methods 0.000 claims description 32
- 239000002245 particle Substances 0.000 claims description 30
- 239000011164 primary particle Substances 0.000 claims description 28
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 26
- 238000007747 plating Methods 0.000 claims description 21
- 239000007858 starting material Substances 0.000 claims description 20
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 13
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 11
- 235000002906 tartaric acid Nutrition 0.000 claims description 11
- 239000011975 tartaric acid Substances 0.000 claims description 11
- 239000002002 slurry Substances 0.000 claims description 10
- 230000008859 change Effects 0.000 claims description 9
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 4
- 150000001879 copper Chemical class 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- 238000001556 precipitation Methods 0.000 claims description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims 1
- 239000000243 solution Substances 0.000 description 29
- 229910000679 solder Inorganic materials 0.000 description 25
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 16
- 238000001000 micrograph Methods 0.000 description 11
- 239000004020 conductor Substances 0.000 description 10
- 238000011049 filling Methods 0.000 description 10
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 description 9
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 9
- 235000011150 stannous chloride Nutrition 0.000 description 9
- 239000001119 stannous chloride Substances 0.000 description 9
- 235000010323 ascorbic acid Nutrition 0.000 description 8
- 229960005070 ascorbic acid Drugs 0.000 description 8
- 239000011668 ascorbic acid Substances 0.000 description 8
- 238000000889 atomisation Methods 0.000 description 8
- 238000004090 dissolution Methods 0.000 description 7
- 239000002253 acid Substances 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000008139 complexing agent Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 238000009125 cardiac resynchronization therapy Methods 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 235000011167 hydrochloric acid Nutrition 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000004482 other powder Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
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- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B15/00—Obtaining copper
- C22B15/0063—Hydrometallurgy
- C22B15/0084—Treating solutions
- C22B15/0089—Treating solutions by chemical methods
- C22B15/0091—Treating solutions by chemical methods by cementation
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- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B3/00—Extraction of metal compounds from ores or concentrates by wet processes
- C22B3/20—Treatment or purification of solutions, e.g. obtained by leaching
- C22B3/44—Treatment or purification of solutions, e.g. obtained by leaching by chemical processes
- C22B3/46—Treatment or purification of solutions, e.g. obtained by leaching by chemical processes by substitution, e.g. by cementation
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
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- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
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Description
本件発明に係る含銅スズ粉の第1の特徴は、銅粉スラリーに対し、スズ置換メッキ液を10分以上の時間をかけて緩やかに添加し、銅粉スラリーの含有する銅粉の銅成分を溶解させ、銅粉を構成する銅をスズで置換する湿式置換法で製造した含銅スズ粉であって、平均一次粒径が5μm以下の粉粒で構成され、且つ、未置換の残留銅量が30wt%以下というものである。そして、含銅スズ粉としたのは、鉛を含むこともなく、半田粉及びスズ粉に近い性状を備えているためである。
本件発明に係る含銅スズ粉の製造は、スズ置換メッキ液として、塩化第1スズを1g/l〜200g/l、チオ尿素を10g/l〜500g/l、酒石酸を10g/l〜400g/l含む水溶液を用い、銅粉スラリーに対し、当該スズ置換メッキ液を10分以上の時間をかけて緩やかに添加し、銅粉スラリーが含有する銅粉の銅成分を溶解させ、銅粉を構成する銅をスズで置換して析出させる湿式置換法を用いることを特徴とする。
本件発明に係る含銅スズ粉は、融点の低いスズ成分が70%以上を占めている。従って、本件発明に係る含銅スズ粉のみを含む導電性ペーストに加工して、ビアホール等の導体形成を行い、ペーストの有機剤を除去しようとすると、ビアホール内の充填性がいかに向上しても、含銅スズ粉を充填した状態での空隙が発生しているのが常であり、その含銅スズ粉の粉粒同士が融着すれば寸法変化を起こすのが当然である。即ち、導体としての寸法安定性を良好に保つにも自ずと限界が生じるのである。
本件発明に係る含銅スズ粉及び上記混合粉体等の金属粉体は、有機剤と混合することにより導電性ペーストに加工され、チップ部品の電極形成、プリント配線板の回路形成及びビアホール形成等に用いられる。本件発明に係る微粒の含銅スズ粉を用いることで、従来のスズ粉及び半田粉を用いては形成出来なかった回路の厚さ、幅、回路エッジの直線性等に高い精度の導体形成が可能となるのである。
<本件発明に係る含銅スズ粉を製造するための実施形態>
本件発明に係る含銅スズ粉の製造は、銅粉とスズ置換メッキ液とを接触させ、銅粉を構成する銅成分を溶解させ同時にスズを置換析出させる湿式置換法を採用するものであり、スズ置換メッキ液には、塩化第1スズ、チオ尿素、酸溶液を含む水溶液を用いることが好ましいのである。
Claims (8)
- 銅粉スラリーに対し、スズ置換メッキ液を10分以上の時間をかけて緩やかに添加し、銅粉スラリーの含有する銅粉の銅成分を溶解させ、銅粉を構成する銅をスズで置換する湿式置換法で製造した含銅スズ粉であって、
平均一次粒径が5μm以下の粉粒で構成され、且つ、未置換の残留銅量が30wt%以下であることを特徴とする含銅スズ粉。 - 前記含銅スズ粉を構成する粉粒は、略球状粉粒である請求項1に記載の含銅スズ粉。
- 前記含銅スズ粉を構成する粉粒は、フレーク粉状である請求項1に記載の含銅スズ粉。
- 前記含銅スズ粉を構成する粉粒の平均アスペクト比が1〜20の扁平形状である請求項3に記載の含銅スズ粉。
- 出発原料である銅粉の平均一次粒径及び扁平形状粉の場合のアスペクト比の値を基準とし、
得られた含銅スズ粉の平均一次粒径及び扁平形状粉の場合のアスペクト比の変化率が−20%〜+5%である請求項1〜請求項4のいずれかに記載の含銅スズ粉。 - 請求項1〜請求項5のいずれかに記載の含銅スズ粉と他の粉体とを混合して得られる混合粉体。
- 請求項1〜請求項5のいずれかに記載の含銅スズ粉を製造する方法であって、
スズ置換メッキ液として、塩化第1スズを1g/l〜200g/l、チオ尿素を10g/l〜500g/l、酒石酸を10g/l〜400g/l含む水溶液を用い、
銅粉スラリーに対し、当該スズ置換メッキ液を10分以上の時間をかけて緩やかに添加し、銅粉スラリーが含有する銅粉の銅成分を溶解させ、銅粉を構成する銅をスズで置換して析出させる湿式置換法を用いることを特徴とする含銅スズ粉の製造方法。 - 請求項1〜請求項5のいずれかに記載の含銅スズ粉又は請求項6に記載の混合粉体を用いたことを特徴とした導電性ペースト。
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JP2004181818A JP4535786B2 (ja) | 2004-06-18 | 2004-06-18 | 含銅スズ粉、その含銅スズ粉を含む混合粉体、その含銅スズ粉の製造方法、及び、その含銅スズ粉又は混合粉体を用いた導電ペースト |
PCT/JP2005/011157 WO2005123308A1 (ja) | 2004-06-18 | 2005-06-17 | 含銅スズ粉及びその含銅スズ粉の製造方法並びにその含銅スズ粉を用いた導電性ペースト |
CNA2005800178304A CN1960826A (zh) | 2004-06-18 | 2005-06-17 | 含铜锡粉及该含铜锡粉的制造方法以及采用了该含铜锡粉的导电膏 |
CA002571135A CA2571135A1 (en) | 2004-06-18 | 2005-06-17 | Copper-containing tin powder and method for producing the copper-containing tin powder, and electroconductive paste using the copper-containing tin powder |
US11/629,888 US20080042111A1 (en) | 2004-06-18 | 2005-06-17 | Copper-Containing Tin Powder, Method for Producing the Copper-Containing Tin Powder and Electro-Conductive Paste Using the Copper-Containing Tin Powder |
EP05751501A EP1772212A1 (en) | 2004-06-18 | 2005-06-17 | Copper-containing tin powder and method for producing the copper-containing tin powder, and electroconductive paste using the copper-containing tin powder |
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JP2004181818A JP4535786B2 (ja) | 2004-06-18 | 2004-06-18 | 含銅スズ粉、その含銅スズ粉を含む混合粉体、その含銅スズ粉の製造方法、及び、その含銅スズ粉又は混合粉体を用いた導電ペースト |
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US (1) | US20080042111A1 (ja) |
EP (1) | EP1772212A1 (ja) |
JP (1) | JP4535786B2 (ja) |
CN (1) | CN1960826A (ja) |
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KR101146410B1 (ko) | 2006-07-27 | 2012-05-17 | 주식회사 엘지화학 | 은, 구리, 및 주석을 포함하는 합금 나노입자 및 그제조방법 |
EP2082825B1 (en) * | 2008-01-18 | 2014-07-30 | Napra Co., Ltd. | Wiring board having a hole with a metal wiring formed therein, and method for producing the same |
JP2010053409A (ja) * | 2008-08-28 | 2010-03-11 | Sumitomo Electric Ind Ltd | 金属粉末の製造方法および金属粉末、導電性ペースト、積層セラミックコンデンサ |
JP5754582B2 (ja) * | 2011-02-28 | 2015-07-29 | 三菱マテリアル株式会社 | プリコート用ハンダペースト |
JP2013094836A (ja) * | 2011-11-02 | 2013-05-20 | Mitsubishi Materials Corp | プリコート用ハンダペースト及びその製造方法 |
CN102717062A (zh) * | 2012-05-29 | 2012-10-10 | 金悦通电子(翁源)有限公司 | 一种pcb板修补用高可靠性纳米材料 |
CN104028769A (zh) * | 2014-06-10 | 2014-09-10 | 铜陵国传电子材料科技有限公司 | 一种高生坯强度雾化铜粉的制作方法 |
DE102014008756A1 (de) * | 2014-06-12 | 2015-12-17 | Pfisterer Kontaktsysteme Gmbh | Vorrichtung zum Kontaktieren eines elektrischen Leiters sowie Anschluss- oder Verbindungseinrichtung mit einer solchen Vorrichtung |
JP6256616B2 (ja) * | 2015-04-22 | 2018-01-10 | 日立金属株式会社 | 金属粒子およびその製造方法、被覆金属粒子、金属粉体 |
CN110551900B (zh) * | 2019-09-29 | 2021-05-14 | 湖南仁发材料科技有限公司 | 一种镀锡铜废碎料和铜电解液的联合处理方法 |
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- 2005-06-17 CA CA002571135A patent/CA2571135A1/en not_active Abandoned
- 2005-06-17 CN CNA2005800178304A patent/CN1960826A/zh active Pending
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CA2571135A1 (en) | 2005-12-29 |
CN1960826A (zh) | 2007-05-09 |
JP2006002234A (ja) | 2006-01-05 |
US20080042111A1 (en) | 2008-02-21 |
EP1772212A1 (en) | 2007-04-11 |
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