TWI823981B - 切割膜基材用樹脂組成物、切割膜基材及切割膜 - Google Patents
切割膜基材用樹脂組成物、切割膜基材及切割膜 Download PDFInfo
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- TWI823981B TWI823981B TW108128323A TW108128323A TWI823981B TW I823981 B TWI823981 B TW I823981B TW 108128323 A TW108128323 A TW 108128323A TW 108128323 A TW108128323 A TW 108128323A TW I823981 B TWI823981 B TW I823981B
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- Prior art keywords
- dicing film
- resin
- base material
- ethylene
- film base
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- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
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- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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- C08J5/18—Manufacture of films or sheets
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
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- C—CHEMISTRY; METALLURGY
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- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
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- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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- C08L33/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
- C09J7/243—Ethylene or propylene polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- Chemical Kinetics & Catalysis (AREA)
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JP2023066585A (ja) * | 2021-10-29 | 2023-05-16 | タキロンシーアイ株式会社 | 半導体製造テープ用基材フィルム |
JP2023066587A (ja) * | 2021-10-29 | 2023-05-16 | タキロンシーアイ株式会社 | 半導体製造テープ用基材フィルム |
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JP2000345129A (ja) * | 1999-03-30 | 2000-12-12 | Toyo Chem Co Ltd | 半導体ウエハ用シート |
TW201202382A (en) * | 2010-03-31 | 2012-01-16 | Furukawa Electric Co Ltd | Wafer processing tape |
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JPH097976A (ja) | 1995-06-23 | 1997-01-10 | Furukawa Electric Co Ltd:The | 半導体ウエハ固定用粘着テープ |
WO2008153149A1 (ja) * | 2007-06-14 | 2008-12-18 | Du Pont-Mitsui Polychemicals Co., Ltd. | 澱粉質系材料配合樹脂組成物 |
JP4934620B2 (ja) | 2008-03-25 | 2012-05-16 | 古河電気工業株式会社 | ウエハ加工用テープ |
JP2010182761A (ja) | 2009-02-04 | 2010-08-19 | Furukawa Electric Co Ltd:The | 半導体ウエハ加工用フィルム及びその基材フィルム |
JP2011040449A (ja) * | 2009-08-07 | 2011-02-24 | Du Pont Mitsui Polychem Co Ltd | ダイシングテープ用基材、ダイシングテープ、半導体装置の製造方法 |
CN102337089B (zh) * | 2010-07-07 | 2014-01-29 | 古河电气工业株式会社 | 晶片加工用胶带和使用其的半导体加工方法 |
KR101742647B1 (ko) * | 2011-12-26 | 2017-06-01 | 듀폰-미츠이 폴리케미칼 가부시키가이샤 | 레이저 다이싱용 필름 기재, 레이저 다이싱용 필름 및 전자부품의 제조방법 |
JP6472972B2 (ja) * | 2013-10-23 | 2019-02-20 | 三井・デュポンポリケミカル株式会社 | ダイシングテープ基材用樹脂組成物およびダイシングテープ基材 |
JP6264126B2 (ja) | 2014-03-20 | 2018-01-24 | 日立化成株式会社 | ウエハ加工用テープ |
JP6554708B2 (ja) * | 2015-11-20 | 2019-08-07 | 三井・ダウポリケミカル株式会社 | ダイシングフィルム基材用樹脂組成物、ダイシングフィルム基材およびダイシングフィルム |
CN110178203B (zh) * | 2016-12-27 | 2023-05-23 | 三井—陶氏聚合化学株式会社 | 切割膜基材及切割膜 |
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JP2000345129A (ja) * | 1999-03-30 | 2000-12-12 | Toyo Chem Co Ltd | 半導体ウエハ用シート |
TW201202382A (en) * | 2010-03-31 | 2012-01-16 | Furukawa Electric Co Ltd | Wafer processing tape |
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WO2020031928A1 (ja) | 2020-02-13 |
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