TWI823981B - 切割膜基材用樹脂組成物、切割膜基材及切割膜 - Google Patents

切割膜基材用樹脂組成物、切割膜基材及切割膜 Download PDF

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TWI823981B
TWI823981B TW108128323A TW108128323A TWI823981B TW I823981 B TWI823981 B TW I823981B TW 108128323 A TW108128323 A TW 108128323A TW 108128323 A TW108128323 A TW 108128323A TW I823981 B TWI823981 B TW I823981B
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Taiwan
Prior art keywords
dicing film
resin
base material
ethylene
film base
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TW108128323A
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English (en)
Chinese (zh)
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TW202018033A (zh
Inventor
中野重則
佐久間雅巳
髙岡樹
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日商三井 陶氏聚合化學股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04Homopolymers or copolymers of ethene
    • C08L23/08Copolymers of ethene
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04Homopolymers or copolymers of ethene
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04Homopolymers or copolymers of ethene
    • C08L23/08Copolymers of ethene
    • C08L23/0807Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
    • C08L23/0815Copolymers of ethene with aliphatic 1-olefins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04Homopolymers or copolymers of ethene
    • C08L23/08Copolymers of ethene
    • C08L23/0846Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C08L23/0869Acids or derivatives thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04Homopolymers or copolymers of ethene
    • C08L23/08Copolymers of ethene
    • C08L23/0846Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C08L23/0869Acids or derivatives thereof
    • C08L23/0876Neutralised polymers, i.e. ionomers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/02Homopolymers or copolymers of acids; Metal or ammonium salts thereof
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • C09J7/24Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • C09J7/24Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/241Polyolefin, e.g.rubber
    • C09J7/243Ethylene or propylene polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29Laminated material

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Dicing (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW108128323A 2018-08-08 2019-08-08 切割膜基材用樹脂組成物、切割膜基材及切割膜 TWI823981B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018149562 2018-08-08
JP2018-149562 2018-08-08

Publications (2)

Publication Number Publication Date
TW202018033A TW202018033A (zh) 2020-05-16
TWI823981B true TWI823981B (zh) 2023-12-01

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TW108128323A TWI823981B (zh) 2018-08-08 2019-08-08 切割膜基材用樹脂組成物、切割膜基材及切割膜

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Country Link
JP (1) JP6928183B2 (ja)
KR (1) KR102483810B1 (ja)
CN (1) CN112236469B (ja)
TW (1) TWI823981B (ja)
WO (1) WO2020031928A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117063262A (zh) * 2021-03-18 2023-11-14 三井-陶氏聚合化学株式会社 切割膜基材用树脂组合物、切割膜基材、及切割膜
JP2023066585A (ja) * 2021-10-29 2023-05-16 タキロンシーアイ株式会社 半導体製造テープ用基材フィルム
JP2023066587A (ja) * 2021-10-29 2023-05-16 タキロンシーアイ株式会社 半導体製造テープ用基材フィルム
WO2023176620A1 (ja) * 2022-03-14 2023-09-21 三井・ダウポリケミカル株式会社 バックグラインドフィルム基材用樹脂組成物、バックグラインドフィルム基材およびバックグラインドフィルム

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000345129A (ja) * 1999-03-30 2000-12-12 Toyo Chem Co Ltd 半導体ウエハ用シート
TW201202382A (en) * 2010-03-31 2012-01-16 Furukawa Electric Co Ltd Wafer processing tape

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH097976A (ja) 1995-06-23 1997-01-10 Furukawa Electric Co Ltd:The 半導体ウエハ固定用粘着テープ
WO2008153149A1 (ja) * 2007-06-14 2008-12-18 Du Pont-Mitsui Polychemicals Co., Ltd. 澱粉質系材料配合樹脂組成物
JP4934620B2 (ja) 2008-03-25 2012-05-16 古河電気工業株式会社 ウエハ加工用テープ
JP2010182761A (ja) 2009-02-04 2010-08-19 Furukawa Electric Co Ltd:The 半導体ウエハ加工用フィルム及びその基材フィルム
JP2011040449A (ja) * 2009-08-07 2011-02-24 Du Pont Mitsui Polychem Co Ltd ダイシングテープ用基材、ダイシングテープ、半導体装置の製造方法
CN102337089B (zh) * 2010-07-07 2014-01-29 古河电气工业株式会社 晶片加工用胶带和使用其的半导体加工方法
KR101742647B1 (ko) * 2011-12-26 2017-06-01 듀폰-미츠이 폴리케미칼 가부시키가이샤 레이저 다이싱용 필름 기재, 레이저 다이싱용 필름 및 전자부품의 제조방법
JP6472972B2 (ja) * 2013-10-23 2019-02-20 三井・デュポンポリケミカル株式会社 ダイシングテープ基材用樹脂組成物およびダイシングテープ基材
JP6264126B2 (ja) 2014-03-20 2018-01-24 日立化成株式会社 ウエハ加工用テープ
JP6554708B2 (ja) * 2015-11-20 2019-08-07 三井・ダウポリケミカル株式会社 ダイシングフィルム基材用樹脂組成物、ダイシングフィルム基材およびダイシングフィルム
CN110178203B (zh) * 2016-12-27 2023-05-23 三井—陶氏聚合化学株式会社 切割膜基材及切割膜

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000345129A (ja) * 1999-03-30 2000-12-12 Toyo Chem Co Ltd 半導体ウエハ用シート
TW201202382A (en) * 2010-03-31 2012-01-16 Furukawa Electric Co Ltd Wafer processing tape

Also Published As

Publication number Publication date
CN112236469A (zh) 2021-01-15
KR102483810B1 (ko) 2023-01-03
CN112236469B (zh) 2023-07-14
KR20210029792A (ko) 2021-03-16
WO2020031928A1 (ja) 2020-02-13
TW202018033A (zh) 2020-05-16
JP6928183B2 (ja) 2021-09-01
JPWO2020031928A1 (ja) 2021-03-11

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