TWI719055B - 加工裝置的搬運機構 - Google Patents

加工裝置的搬運機構 Download PDF

Info

Publication number
TWI719055B
TWI719055B TW105131084A TW105131084A TWI719055B TW I719055 B TWI719055 B TW I719055B TW 105131084 A TW105131084 A TW 105131084A TW 105131084 A TW105131084 A TW 105131084A TW I719055 B TWI719055 B TW I719055B
Authority
TW
Taiwan
Prior art keywords
processing
area
unloading
workpiece
loading
Prior art date
Application number
TW105131084A
Other languages
English (en)
Chinese (zh)
Other versions
TW201726299A (zh
Inventor
福岡武臣
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201726299A publication Critical patent/TW201726299A/zh
Application granted granted Critical
Publication of TWI719055B publication Critical patent/TWI719055B/zh

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
TW105131084A 2015-10-27 2016-09-26 加工裝置的搬運機構 TWI719055B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015211175A JP6679157B2 (ja) 2015-10-27 2015-10-27 加工装置の搬送機構
JP2015-211175 2015-10-27

Publications (2)

Publication Number Publication Date
TW201726299A TW201726299A (zh) 2017-08-01
TWI719055B true TWI719055B (zh) 2021-02-21

Family

ID=58712105

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105131084A TWI719055B (zh) 2015-10-27 2016-09-26 加工裝置的搬運機構

Country Status (3)

Country Link
JP (1) JP6679157B2 (ja)
CN (1) CN106956370B (ja)
TW (1) TWI719055B (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6987450B2 (ja) * 2017-12-15 2022-01-05 株式会社ディスコ 切削装置
JP6973931B2 (ja) * 2017-12-25 2021-12-01 株式会社ディスコ 切削装置
JP7062446B2 (ja) * 2018-01-17 2022-05-06 株式会社ディスコ 切削装置の搬送機構
JP6976660B2 (ja) * 2018-02-07 2021-12-08 株式会社ディスコ 加工装置
JP7294777B2 (ja) * 2018-07-09 2023-06-20 株式会社ディスコ 被加工物の乾燥方法及び切削装置
JP7278059B2 (ja) * 2018-11-16 2023-05-19 株式会社ディスコ 加工システム
JP2020191328A (ja) * 2019-05-20 2020-11-26 株式会社ディスコ 搬送機構及び板状物の搬送方法
US11173631B2 (en) 2019-06-17 2021-11-16 Disco Corporation Cutting apparatus
JP2021009981A (ja) * 2019-07-03 2021-01-28 株式会社ディスコ 加工装置
JP7372098B2 (ja) * 2019-09-20 2023-10-31 コマツNtc株式会社 ワイヤソー及びワイヤソーのワークの搬入出方法
CN113681333B (zh) * 2021-08-09 2022-10-04 中建三局集团有限公司 一种钢板坡口加工用的切割机及其加工方法
TWI779844B (zh) * 2021-09-23 2022-10-01 捷拓科技股份有限公司 取置治具

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005353723A (ja) * 2004-06-09 2005-12-22 Apic Yamada Corp 切断装置、及び切断方法
JP2010118376A (ja) * 2008-11-11 2010-05-27 Disco Abrasive Syst Ltd 搬送機構
JP2014135333A (ja) * 2013-01-09 2014-07-24 Mitsuboshi Diamond Industrial Co Ltd 吸着昇降装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4458694B2 (ja) * 2001-02-26 2010-04-28 株式会社日立ハイテクノロジーズ 基板搬送装置及び露光装置
US20110141448A1 (en) * 2009-11-27 2011-06-16 Nikon Corporation Substrate carrier device, substrate carrying method, substrate supporting member, substrate holding device, exposure apparatus, exposure method and device manufacturing method
JP5229363B2 (ja) * 2010-11-04 2013-07-03 村田機械株式会社 搬送システム及び搬送方法
JP5773841B2 (ja) * 2011-10-27 2015-09-02 株式会社ディスコ ユニット搬出入装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005353723A (ja) * 2004-06-09 2005-12-22 Apic Yamada Corp 切断装置、及び切断方法
JP2010118376A (ja) * 2008-11-11 2010-05-27 Disco Abrasive Syst Ltd 搬送機構
JP2014135333A (ja) * 2013-01-09 2014-07-24 Mitsuboshi Diamond Industrial Co Ltd 吸着昇降装置

Also Published As

Publication number Publication date
CN106956370B (zh) 2020-06-05
JP2017084950A (ja) 2017-05-18
TW201726299A (zh) 2017-08-01
CN106956370A (zh) 2017-07-18
JP6679157B2 (ja) 2020-04-15

Similar Documents

Publication Publication Date Title
TWI719055B (zh) 加工裝置的搬運機構
TWI816945B (zh) 晶圓分割裝置
JP7282461B2 (ja) 検査装置、及び加工装置
TWI689027B (zh) 被加工物之搬運托盤
TW201711788A (zh) 被加工物的支持治具
KR20180113165A (ko) 절삭 장치
TWI806950B (zh) 切削裝置
TW201941282A (zh) 切割裝置
KR102486302B1 (ko) 가공 장치
CN108231641B (zh) 加工装置的搬送机构
JP2017112227A (ja) 加工装置
TWI715727B (zh) 封裝基板之處置方法
JP6653562B2 (ja) 加工装置
JP6579929B2 (ja) 加工装置
JP2016092237A (ja) フレームユニット
JP2014027170A (ja) シート貼付装置およびシート貼付方法
JP2018032825A (ja) 被加工物のアライメント方法
JP2021009981A (ja) 加工装置
JP2018078209A (ja) 搬送装置、加工装置及び搬送方法
JP6855130B2 (ja) 加工装置
JP6976660B2 (ja) 加工装置
JP6448456B2 (ja) 加工装置
JP6061529B2 (ja) 搬送機構
JP2020092166A (ja) 搬送装置
JP2008241444A (ja) 加工装置