JP6579929B2 - 加工装置 - Google Patents
加工装置 Download PDFInfo
- Publication number
- JP6579929B2 JP6579929B2 JP2015230740A JP2015230740A JP6579929B2 JP 6579929 B2 JP6579929 B2 JP 6579929B2 JP 2015230740 A JP2015230740 A JP 2015230740A JP 2015230740 A JP2015230740 A JP 2015230740A JP 6579929 B2 JP6579929 B2 JP 6579929B2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- chuck table
- unit
- precut
- workpieces
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Description
4 基台
4a,4b 開口
6 搬入側テーブル(載置部)
8 第1搬送ユニット(搬送手段)
10 X軸移動テーブル
12 防塵防滴カバー
14 チャックテーブル
14a 保持面
16 切削ユニット(加工ユニット、加工手段)
18 スピンドルハウジング
20 切削ブレード
22 搬出側テーブル
24 第2搬送ユニット
26 プレカットユニット(プレカット手段)
28 切削ブレード
30 洗浄ユニット(ノズル)
32 保持ハンド
34 吸引パッド
36 吸引路
38 バルブ
40 吸引源
11 被加工物(第1被加工物)
13 被加工物(第2被加工物)
Claims (1)
- 板状の第1被加工物が載置される載置部と、第1被加工物を分割して得られる第2被加工物を保持面で保持するチャックテーブルと、該チャックテーブルで保持した第2被加工物を加工する加工手段と、該載置部に載置された第1被加工物を保持して搬送する搬送手段と、該搬送手段で保持した第1被加工物をカットして該保持面に対応した大きさの複数の第2被加工物に分割するプレカット手段と、を備え、
該プレカット手段は、該搬送手段の移動経路内に設置され、
該搬送手段を移動しながら、該搬送手段で保持した第1被加工物に該プレカット手段を切り込ませることで、第1被加工物を該チャックテーブルへ搬送する前に複数の第2被加工物に分割し、
該搬送手段は、第2被加工物にそれぞれ対応する第1被加工物の複数の領域を保持できるように構成されており、該プレカット手段で第1被加工物を複数の第2被加工物に分割してから、複数の第2被加工物を順に該チャックテーブルへ搬送することを特徴とする加工装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015230740A JP6579929B2 (ja) | 2015-11-26 | 2015-11-26 | 加工装置 |
KR1020160153194A KR102463650B1 (ko) | 2015-11-26 | 2016-11-17 | 가공 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015230740A JP6579929B2 (ja) | 2015-11-26 | 2015-11-26 | 加工装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017098465A JP2017098465A (ja) | 2017-06-01 |
JP6579929B2 true JP6579929B2 (ja) | 2019-09-25 |
Family
ID=58803853
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015230740A Active JP6579929B2 (ja) | 2015-11-26 | 2015-11-26 | 加工装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6579929B2 (ja) |
KR (1) | KR102463650B1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022083106A (ja) * | 2020-11-24 | 2022-06-03 | Towa株式会社 | 切断装置及び切断品の製造方法 |
JP2022083118A (ja) * | 2020-11-24 | 2022-06-03 | Towa株式会社 | 切断装置及び切断品の製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09148275A (ja) * | 1995-11-17 | 1997-06-06 | Disco Abrasive Syst Ltd | 大口径ウェーハのダイシングシステム |
JP4339452B2 (ja) | 1999-07-09 | 2009-10-07 | 株式会社ディスコ | Csp基板分割装置 |
JP2005129567A (ja) | 2003-10-21 | 2005-05-19 | Trecenti Technologies Inc | 半導体装置の製造方法 |
KR100596505B1 (ko) * | 2004-09-08 | 2006-07-05 | 삼성전자주식회사 | 소잉/소팅 시스템 |
JP2009302369A (ja) | 2008-06-16 | 2009-12-24 | Disco Abrasive Syst Ltd | 板状物の加工方法及び加工装置 |
JP2014093444A (ja) | 2012-11-05 | 2014-05-19 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP6228058B2 (ja) | 2014-03-28 | 2017-11-08 | 株式会社東京精密 | 半導体製造装置及び半導体の製造方法 |
-
2015
- 2015-11-26 JP JP2015230740A patent/JP6579929B2/ja active Active
-
2016
- 2016-11-17 KR KR1020160153194A patent/KR102463650B1/ko active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
JP2017098465A (ja) | 2017-06-01 |
KR20170061599A (ko) | 2017-06-05 |
KR102463650B1 (ko) | 2022-11-03 |
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