TWI701281B - 液晶性樹脂組合物及***成形品 - Google Patents

液晶性樹脂組合物及***成形品 Download PDF

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Publication number
TWI701281B
TWI701281B TW105142417A TW105142417A TWI701281B TW I701281 B TWI701281 B TW I701281B TW 105142417 A TW105142417 A TW 105142417A TW 105142417 A TW105142417 A TW 105142417A TW I701281 B TWI701281 B TW I701281B
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TW
Taiwan
Prior art keywords
resin
resin composition
mass
less
liquid crystalline
Prior art date
Application number
TW105142417A
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English (en)
Chinese (zh)
Other versions
TW201739843A (zh
Inventor
依藤大輔
石附愛
Original Assignee
日商寶理塑料股份有限公司
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Application filed by 日商寶理塑料股份有限公司 filed Critical 日商寶理塑料股份有限公司
Publication of TW201739843A publication Critical patent/TW201739843A/zh
Application granted granted Critical
Publication of TWI701281B publication Critical patent/TWI701281B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/06—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
TW105142417A 2015-12-22 2016-12-21 液晶性樹脂組合物及***成形品 TWI701281B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015250528 2015-12-22
JP2015-250528 2015-12-22

Publications (2)

Publication Number Publication Date
TW201739843A TW201739843A (zh) 2017-11-16
TWI701281B true TWI701281B (zh) 2020-08-11

Family

ID=59090229

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105142417A TWI701281B (zh) 2015-12-22 2016-12-21 液晶性樹脂組合物及***成形品

Country Status (5)

Country Link
JP (1) JP6225297B1 (ja)
KR (1) KR101915731B1 (ja)
CN (1) CN108431138B (ja)
TW (1) TWI701281B (ja)
WO (1) WO2017110646A1 (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6899636B2 (ja) * 2016-08-31 2021-07-07 三井化学株式会社 低誘電性樹脂組成物、硬化物、ドライフィルム、フィルム、プリプレグ、金属張積層板、プリント配線基板および電子機器
JP6513322B1 (ja) * 2017-09-12 2019-05-15 ポリプラスチックス株式会社 耐摺動摩耗部材用液晶性樹脂組成物及びそれを用いた耐摺動摩耗部材
EP3705257B1 (en) * 2017-10-30 2023-07-12 Kuraray Co., Ltd. Waterproof component and electronic equipment provided with the same, method for waterproofing an insert molded body, and method for waterproofing electronic equipment
US10829634B2 (en) 2017-12-05 2020-11-10 Ticona Llc Aromatic polymer composition for use in a camera module
KR101901662B1 (ko) 2018-04-27 2018-09-27 주식회사 더원테크 휴대용 통신 단말기의 방수용 유심 트레이 및, 그 제조 방법
KR102397208B1 (ko) * 2018-11-15 2022-05-12 포리프라스틱 가부시키가이샤 액정성 수지 조성물 및 상기 액정성 수지 조성물의 성형품을 포함하는 커넥터
KR20200060585A (ko) 2018-11-21 2020-06-01 삼성전자주식회사 액정 고분자, 복합체 조성물, 성형품, 전지 케이스, 및 전지
EP3932979A4 (en) * 2019-02-25 2022-12-28 Kuraray Co., Ltd. WATERPROOF ELEMENT, ELECTRONIC EQUIPMENT COMPRISING SUCH WATERPROOF ELEMENT, METHOD OF SEALING BY MEANS OF AN INSERT MOLDED BODY, AND METHOD OF SEALING FOR ELECTRONIC EQUIPMENT
EP3932987A4 (en) * 2019-02-25 2022-11-23 Kuraray Co., Ltd. WATERPROOF COMPONENT, ELECTRONIC EQUIPMENT COMPRISING THE SAME, WATERPROOFING METHOD USING INSERT MOLDED BODY, AND WATERPROOFING METHOD FOR ELECTRONIC EQUIPMENT
US11086200B2 (en) 2019-03-20 2021-08-10 Ticona Llc Polymer composition for use in a camera module
JP2020151980A (ja) * 2019-03-20 2020-09-24 三井化学株式会社 金属樹脂複合体の製造方法および金属樹脂複合体
JP7461959B2 (ja) 2019-03-20 2024-04-04 ティコナ・エルエルシー カメラモジュールのためのアクチュエータアセンブリ
JP7355523B2 (ja) * 2019-05-16 2023-10-03 上野製薬株式会社 液晶ポリマー組成物
KR20210052795A (ko) * 2019-10-31 2021-05-11 한화솔루션 주식회사 결정화 속도가 향상된 고분자 조성물 및 그의 제조방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4889886A (en) * 1986-12-10 1989-12-26 Polyplastics Co., Ltd. Liquid crystal polyester composition
JP2003268241A (ja) * 2002-03-13 2003-09-25 Toray Ind Inc 成形品用液晶性樹脂組成物および成形回路基板
CN104341721A (zh) * 2013-07-23 2015-02-11 宝理塑料株式会社 照相机模块用液晶性树脂组合物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3182756B2 (ja) * 1989-02-06 2001-07-03 東レ株式会社 熱可塑性樹脂組成物の製造方法
JP3635861B2 (ja) * 1997-05-20 2005-04-06 東レ株式会社 液晶性樹脂組成物
JP4450902B2 (ja) * 1999-10-08 2010-04-14 ポリプラスチックス株式会社 液晶性ポリマー組成物
CN101305056B (zh) * 2005-10-13 2011-09-14 宝理塑料株式会社 注塑成型用液晶性树脂组合物
JP4932695B2 (ja) * 2007-12-27 2012-05-16 ポリプラスチックス株式会社 液晶性ポリマー組成物
JP2012021147A (ja) * 2010-06-16 2012-02-02 Toray Ind Inc 液晶性ポリエステル樹脂組成物及びそれからなるコネクター
EP2695913B1 (en) * 2011-04-06 2017-04-26 Toray Industries, Inc. Liquid crystal polyester resin composition and metal composite molding using same
KR101895654B1 (ko) * 2012-02-29 2018-09-05 도레이 카부시키가이샤 액정 폴리에스테르 수지 조성물

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4889886A (en) * 1986-12-10 1989-12-26 Polyplastics Co., Ltd. Liquid crystal polyester composition
JP2003268241A (ja) * 2002-03-13 2003-09-25 Toray Ind Inc 成形品用液晶性樹脂組成物および成形回路基板
CN104341721A (zh) * 2013-07-23 2015-02-11 宝理塑料株式会社 照相机模块用液晶性树脂组合物

Also Published As

Publication number Publication date
JP6225297B1 (ja) 2017-11-01
WO2017110646A1 (ja) 2017-06-29
KR20180081151A (ko) 2018-07-13
TW201739843A (zh) 2017-11-16
CN108431138A (zh) 2018-08-21
JPWO2017110646A1 (ja) 2017-12-21
KR101915731B1 (ko) 2018-11-06
CN108431138B (zh) 2019-07-09

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