TWI613938B - 多層配線板及多層配線板之製造方法 - Google Patents

多層配線板及多層配線板之製造方法 Download PDF

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TWI613938B
TWI613938B TW104116239A TW104116239A TWI613938B TW I613938 B TWI613938 B TW I613938B TW 104116239 A TW104116239 A TW 104116239A TW 104116239 A TW104116239 A TW 104116239A TW I613938 B TWI613938 B TW I613938B
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thermoplastic resin
resin sheet
wiring board
adjustment layer
channel
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TW104116239A
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TW201607381A (zh
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小川貴志
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豐田自動車股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
    • B29C66/028—Non-mechanical surface pre-treatments, i.e. by flame treatment, electric discharge treatment, plasma treatment, wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
    • B29C66/723—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/739—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
    • B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
    • B29C66/9141—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
    • B29C66/91411—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature of the parts to be joined, e.g. the joining process taking the temperature of the parts to be joined into account
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
    • B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
    • B29C66/9192—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams
    • B29C66/91921—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature
    • B29C66/91931—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined
    • B29C66/91935—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined lower than said fusion temperature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2791/00—Shaping characteristics in general
    • B29C2791/004—Shaping under special conditions
    • B29C2791/009—Using laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
    • B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
    • B29C66/7311—Thermal properties
    • B29C66/73115—Melting point
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0079—Liquid crystals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/22—Presence of unspecified polymer
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    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2201/01—Dielectrics
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    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
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    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
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    • H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
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    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/465—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer having channels for the next circuit layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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  • Microelectronics & Electronic Packaging (AREA)
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  • Production Of Multi-Layered Print Wiring Board (AREA)
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Abstract

一種多層配線板之製造方法包括：形成槽道(11)於第一熱塑性樹脂板(10)之表面上；藉由施加光線於槽道周圍區域以外之第一熱塑性樹脂板(10)之表面之區域，以形成調整層(12b)，其係由熔點低於構成第一熱塑性樹脂板的樹脂熔點之樹脂構成；使用具有流體性之導電性材料填注第一熱塑性樹脂板之槽道；及藉由熱壓接合將第二熱塑性樹脂板(20)接合於第一熱塑性樹脂板之表面，調整層即形成於表面上。

Description

多層配線板及多層配線板之製造方法
本發明關於一種多層配線板及多層配線板之製造方法。
在一般使用之多層配線板中，跡線之圖案係藉由施加蝕刻於黏接至樹脂板的銅箔形成。惟，此多層配線板並不適合在高電流狀況下使用，因為可用於多層配線板中的銅箔厚度有限。
日本專利申請公開2013-211349(JP 2013-211349A)號揭露多層配線板，其中跡線之圖案係藉由在樹脂板上形成槽道及使用導電漿填注槽道形成。在此多層配線板中，可以藉由增大各槽道之深度形成較厚配線層。因此，JP 2013-211349A中所述之多層配線板比上述一般使用之多層配線板更適用於高電流狀況。比欲施加於一般用途家庭電器之電流高的電流需施加於車用多層配線板。因此，吾人仍需要具有較厚配線層之多層配線板。
根據JP 2013-211349A中所述之技術，複數個熱塑性樹脂板(其中跡線形成於槽道中)加熱至等於或較高於其軟化溫度之溫度，所以熱塑性樹脂板可在壓力下接合。易言之，在熱壓接合期間，熱塑性樹脂板完全軟化。此即導致槽道變形及跡線無法取得所需電氣特徵之可能性。
本發明提供一種多層配線板及多層配線板之製造方法。
根據本發明之第一態樣之一種多層配線板之製造方法包括：形成槽道於第一熱塑性樹脂板之表面上；藉由施加光線於槽道周圍區域以外之第一熱塑性樹脂板之表面之區域，以形成調整層，其係由熔點低於構成第一熱塑性樹脂板的樹脂熔點之樹脂構成；使用具有流體性之導電性材料填注第一熱塑性樹脂板之槽道；及藉由熱壓接合將第二熱塑性樹脂板接合於第一熱塑性樹脂板之表面，調整層即形成於表面上。
在根據本發明之第一態樣之製造方法中，由熔點低於構成第一熱塑性樹脂板的樹脂熔點之樹脂構成的調整層係形成於第一熱塑性樹脂板之表面上。惟，調整層並未形成於第一熱塑性樹脂板之槽道周圍區域中。因此，當第二熱塑性樹脂板藉由熱壓接合而接合於第一熱塑性樹脂板之表面時，即可抑制槽道變形。
在本發明之第一態樣中，在熱壓接合時，第二熱塑性樹脂板加熱至較高於構成調整層的樹脂熔點之溫度，並且較低於構成第一熱塑性樹脂板的樹脂熔點之溫度。
在本發明之第一態樣中，槽道可藉由重覆施加波長250奈米以下之紫外線雷射光及每次施加功率1瓦以下而形成。依此方式，槽道之表面被製成親水性。
再者，調整層可藉由施加紫外線雷射光做為光線而形成。依此，槽道及調整層可以同時形成。再者，調整層可藉由施加紫外線雷射光做為單次光線而形成。
根據本發明之第二態樣之一種多層配線板之製造方法包括：第一熱塑性樹脂板、第二熱塑性樹脂板、及調整層。第一熱塑性樹脂板具有表面可供槽道形成於上。跡線形成於槽道中。第二熱塑性樹脂板疊置於第一熱塑性樹脂板之表面上。調整層形成於槽道周圍區域以外之第一熱塑性樹脂板與第二熱塑性樹脂板之間的界面區域上。調整層係由熔點低於構成第一熱塑性樹脂板的樹脂熔點之樹脂構成。
在根據本發明之第二態樣之多層配線板中，調整層並未形成於第一熱塑性樹脂板之槽道周圍區域中。因此，當第二熱塑性樹脂板藉由熱壓接合而接合於第一熱塑性樹脂板之表面時，即可抑制槽道變形。
如上所述，本發明之第一態樣提供的製造方法可減低槽道因熱壓接合所致之變形發生。本發明之第二 態樣提供的多層配線板則可減低槽道因熱壓接合所致之變形。
10‧‧‧第一配線板
10a,10b‧‧‧子板
11‧‧‧跡線槽
12a,12b,12c‧‧‧調整層
13‧‧‧跡線
20‧‧‧第二配線板
21a‧‧‧跡線槽
21b‧‧‧通孔
22a,22b,22c‧‧‧調整層
23a‧‧‧跡線
23b‧‧‧埋層通孔
本發明示範性實施例之特性、優點、及技術與結構上的重要性將參考附圖說明於後，圖中相同參考編號表示相同元件，其中：圖1係截面圖，揭示根據本發明第一實施例用於多層配線板之製造方法；圖2係截面圖，揭示根據本發明第一實施例之製造方法；圖3係顯微照片，揭示根據本發明第一實施例之第一配線板之跡線槽以導電油墨填注之狀態；圖4係顯微照片，揭示根據對比範例之第一配線板之跡線槽以導電油墨填注之狀態；圖5係截面圖，揭示根據本發明第一實施例之製造方法；圖6係對應於圖5之平面圖；圖7係截面圖，揭示根據本發明第一實施例之製造方法；圖8係截面圖，揭示根據本發明第一實施例之製造方法；圖9係截面圖，揭示根據本發明第一實施例之製造方法； 圖10係圖8所示製造方法之調整範例；及圖11係第一配線板之調整範例。
文後，本發明之示範性實施例將參考附圖詳細說明。惟，本發明並不限於文後之實施例。以下說明及附圖將適度簡化，以提供清楚之解說。
請參閱圖1至圖9，根據本發明第一實施例用於多層配線板之製造方法將說明於後。圖1、圖2、圖5、及圖7至圖9係截面圖，揭示根據第一實施例之製造方法。圖3係顯微照片，揭示根據本發明第一實施例之第一配線板之跡線槽以導電油墨填注之狀態。圖4係顯微照片，揭示根據對比範例之第一配線板之跡線槽以導電油墨填注之狀態。圖6係對應於圖5之平面圖。
首先，如圖1中所示，製備一由熱塑性樹脂製成之平坦狀第一配線板10，熱塑性樹脂例如液晶聚合物樹脂、聚醯亞胺樹脂、聚醯胺醯亞胺樹脂、或聚醚醚酮樹脂。第一配線板10之厚度例如大約為30微米至300微米。
接著，第一配線板10之一第一表面重覆進行掃描，同時雷射光施加於第一表面，藉此形成跡線槽11，如圖2中所示。在圖2所示之範例中形成有三道跡線槽11。各跡線槽11之深度例如大約為20微米至200微米。對於雷射光，較佳使用具有波長250奈米以下之低功 率紫外線雷射光。較明確說，較佳使用每次掃描功率1瓦以下之準分子雷射。在此情況下，第一配線板10之第一表面每次掃描切割例如大約0.3微米。因此，為了形成具有深度30微米之各跡線槽11，第一配線板10之第一表面即進行例如大約100次掃描。
藉由使用波長250奈米以下之紫外線雷射光及每次掃描功率1瓦以下，一親水性調整層12a形成於各跡線槽11之表面(即側壁及底表面)上。因此，當跡線槽11在稍後執行之步驟中以導電油墨填注時，導電油墨擴散到各跡線槽11之每一角落。結果，貼合於跡線槽11之形狀的跡線13(如圖7)即形成。再者，跡線槽11與跡線13之間的黏接也獲改善。圖3揭示具有一表面可供親水性調整層形成於其上的跡線槽11(具有寬度50微米)在其填注導電油墨時的狀態。跡線槽11有令人滿意之潤濕性，及導電油墨因此散佈貼合於跡線槽11之形狀。
另方面，當雷射光之波長大於250奈米，或雷射光之每次掃描功率大於1瓦時，親水性調整層12a不形成且跡線槽11之表面被碳化。一旦跡線槽11之表面碳化，即難以令跡線槽11之表面呈現親水性。圖4揭示具有一碳化表面的跡線槽11(具有寬度50微米)填注導電油墨時的狀態。跡線槽之潤濕性不佳，因此導電油墨無法散佈貼合於跡線槽之形狀。
接著，供跡線槽11形成於其上的第一配線板10之第一表面僅進行一次掃描，同時雷射光施加於第一 表面，藉此形成一調整層12b，如圖5中所示。較佳使用和形成跡線槽11所用者相同之雷射光。在此情況中，可以同時形成圖2中所示之跡線槽11及圖5中所示之調整層12b。
調整層12b係一相似於調整層12a之膜，並且呈親水性。較明確說，由於雷射光的應用，構成調整層12a與調整層12b之樹脂中之聚合物間的鍵斷裂，致使構成調整層12a、12b之樹脂的熔點低於構成第一配線板10之樹脂的熔點。例如，若一由熔點300℃之液晶聚合物樹脂製成的配線板係以上述方式調整，則熔點降低大約10℃。其間，親水基(例如羥基)即鍵接於斷裂部位。因此，調整層12a與調整層12b即呈親水性。
圖6係對應於圖5之平面圖。換言之，圖5係沿圖6之線V-V所取之截面圖。如圖5及圖6中所示，形成於第一配線板10之第一表面上的調整層12b並未形成於跡線槽11周圍之區域中。較明確說，各跡線槽11與調整層12b之間的距離較佳等於或大於10微米，並且例如大約為50微米。此架構之效益將說明於後。
執行用於形成調整層12b之雷射光掃描次數可以是二次以上。惟，如上所述，第一配線板10之第一表面每次掃描切割例如0.3微米。因此，雷射光掃描次數越少越好，而且最好是一次。
接著，各跡線槽11全部填注含有細顆粒銀、銅、或類似者之導電油墨，導電油墨隨後變乾，藉此使跡 線13形成於跡線槽11中，如圖7中所示。因為親水性調整層12a形成於跡線槽11之表面上，導電油墨擴散到各跡線槽11之每個角落。當其無法一次供給所需之導電油墨量至跡線槽11時，導電油墨即在第一次供給之導電油墨變乾後，再次供給至跡線槽11。調整層12b可以在跡線13形成後形成，而不是在跡線13形成前形成。
接著，如圖8中所示，一第二配線板20之一第二表面疊置在第一配線板10之第一表面上。跡線槽21a及一通孔21b形成於第二配線板20之一第一表面上。跡線槽21a及通孔21b係以相同於第一配線板10之跡線槽11的形成方式形成。因此，調整層22a形成於各跡線槽21a之表面(即側壁及底表面)上及通孔21b之周邊壁表面上。再者，一調整層22b形成於第二配線板20之第一表面上。調整層22b係以相同於第一配線板10之調整層12b的形成方式形成。
接著，第二配線板20之跡線槽21a及通孔21b以導電油墨填注，導電油墨隨後變乾，藉此使跡線23a及一埋層通孔23b分別形成於跡線槽21a及通孔21b中，如圖9中所示。因為親水性調整層22a形成於跡線槽21a之表面上及通孔21b之表面上，導電油墨擴散到各跡線槽21a及通孔21b之每個角落。請注意，為了形成厚跡線、大直徑之通孔、大凸塊(圖中未示)、或類似者，較佳使用高黏度並且含有高體積比導電性材料之導電油墨(導電膠)。
接著，一第三配線板及後續配線板係以相同於將第二配線板20疊置在第一配線板10上的方式依序疊合。隨後，所有配線板透過熱壓接合一次接合。依此方式，多層式配線板即製成。在熱壓接合時，配線板加熱至較高於構成配線板之間所形成調整層12b與調整層22b的樹脂的熔點溫度，並且較低於構成配線板的熱塑性樹脂的熔點溫度，例如第一配線板10及第二配線板20。
因此，在熱壓接合時，第一配線板10及第二配線板20並未熔化，僅有形成於配線板之間的調整層12b與調整層22b熔化。在熱壓接合時熔化之調整層12b與調整層22b並未形成於跡線槽11、跡線槽21a、及通孔21b周圍之區域中。因此，在熱壓接合時，可以有效減少跡線槽11、跡線槽21a、通孔21b、及類似者發生變形。配線板之間的調整層12b、22b是在熔化後即凝固。因此，調整層12b、22b保持在製成之多層配線板中。
接著，請參閱圖10及圖11，本發明之其他實施例揭述如下。圖10係圖8所示製造方法之調整範例。如圖10中所示，在第二配線板20之第二表面疊置在第一配線板10之第一表面前，一調整層22c可形成於第二配線板20之第二表面上。如同調整層12a未形成於跡線槽11周圍區域中的情況，調整層22c亦未形成於通孔21b周圍區域中。
此架構使其得以進一步改善配線板間之黏接，同時有效減少跡線槽11、跡線槽21a、通孔21b及類 似者在第一實施例之熱壓接合中發生變形。此調整範例之其他架構相同於第一實施例者，因此其他架構之說明即不贅述。
圖11係第一配線板10之調整範例。如圖11中所示，兩子板(即子板10a及子板10b)可構成第一實施例之第一配線板10。子板10a係平板，及一調整層12c形成於子板10a之整個第一表面上。調整層12c係以相同於形成調整層12b的方式形成。另方面，通孔形成於子板10b中。藉由將子板10b疊置於子板10a上，即形成跡線槽11。
在圖11所示之調整範例中，各跡線槽11之深度是由子板10b之厚度決定。因此，各跡線槽11之深度在此調整範例中比在第一實施例中更容易調整。此調整範例之其他架構相同於第一實施例者，因此其他架構之說明即不贅述。
本發明並不限於上述實施例，而且本發明之上述實施例可在本發明之範疇內視需要調整。例如，在一配線板之一表面上的跡線槽、通孔、及調整層可以使用遮罩及紫外線燈將配線板進行單發曝光，以取代將配線板進行雷射光掃描。惟，就成本而言，雷射光掃描較為有利，因為不需要昂貴的遮罩。
10‧‧‧第一配線板
11‧‧‧跡線槽
12a,12b‧‧‧調整層

Claims (6)

  1. 一種多層配線板之製造方法，該製造方法之特徵在包含：形成槽道(11)於第一熱塑性樹脂板(10)之表面上；藉由施加光線於該槽道周圍區域以外之該第一熱塑性樹脂板之該表面之區域，以形成調整層(12b)，其係由熔點低於構成該第一熱塑性樹脂板的樹脂熔點之樹脂構成；使用具有流體性之導電性材料填注該第一熱塑性樹脂板之該槽道；及藉由熱壓接合將第二熱塑性樹脂板(20)接合於該第一熱塑性樹脂板之該表面，該調整層即形成於該表面上。
  2. 如申請專利範圍第1項之製造方法，其中在熱壓接合時，該第二熱塑性樹脂板加熱至較高於構成該調整層的樹脂熔點之溫度，並且較低於構成該第一熱塑性樹脂板的樹脂熔點之溫度。
  3. 如申請專利範圍第1或2項之製造方法，其中該槽道係藉由重覆施加波長250奈米以下之紫外線雷射光及每次施加功率1瓦以下之光線而形成。
  4. 如申請專利範圍第3項之製造方法，其中該調整層係藉由施加紫外線雷射光做為該光線而形成。
  5. 如申請專利範圍第4項之製造方法，其中該調整層係藉由施加紫外線雷射光做為單次光線而形成。
  6. 一種多層配線板，其特徵在包含：第一熱塑性樹脂板(10)，具有表面可供槽道(11)形成 於上；跡線(13)，形成於該槽道中；第二熱塑性樹脂板(20)，疊置於該第一熱塑性樹脂板之該表面上；及調整層(12b)，係由熔點低於構成該第一熱塑性樹脂板的樹脂熔點之樹脂構成，該調整層形成於該槽道周圍區域以外之該第一熱塑性樹脂板與該第二熱塑性樹脂板之間的界面區域上。
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