JP2015226005A - 多層配線基板及びその製造方法 - Google Patents
多層配線基板及びその製造方法 Download PDFInfo
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- JP2015226005A JP2015226005A JP2014111182A JP2014111182A JP2015226005A JP 2015226005 A JP2015226005 A JP 2015226005A JP 2014111182 A JP2014111182 A JP 2014111182A JP 2014111182 A JP2014111182 A JP 2014111182A JP 2015226005 A JP2015226005 A JP 2015226005A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
- B29C66/028—Non-mechanical surface pre-treatments, i.e. by flame treatment, electric discharge treatment, plasma treatment, wave energy or particle radiation
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- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
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- B29C66/723—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered
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- B29C66/7392—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic
- B29C66/73921—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the material of at least one of the parts being a thermoplastic characterised by the materials of both parts being thermoplastics
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
- B29C66/9141—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
- B29C66/91411—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature of the parts to be joined, e.g. the joining process taking the temperature of the parts to be joined into account
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/90—Measuring or controlling the joining process
- B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
- B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
- B29C66/9192—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams
- B29C66/91921—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature
- B29C66/91931—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined
- B29C66/91935—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges in explicit relation to another variable, e.g. temperature diagrams in explicit relation to another temperature, e.g. to the softening temperature or softening point, to the thermal degradation temperature or to the ambient temperature in explicit relation to the fusion temperature or melting point of the material of one of the parts to be joined lower than said fusion temperature
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- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C2791/004—Shaping under special conditions
- B29C2791/009—Using laser
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29C66/00—General aspects of processes or apparatus for joining preformed parts
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- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/73—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset
- B29C66/731—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the intensive physical properties of the material of the parts to be joined, by the optical properties of the material of the parts to be joined, by the extensive physical properties of the parts to be joined, by the state of the material of the parts to be joined or by the material of the parts to be joined being a thermoplastic or a thermoset characterised by the intensive physical properties of the material of the parts to be joined
- B29C66/7311—Thermal properties
- B29C66/73115—Melting point
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
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- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/0079—Liquid crystals
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
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Abstract
Description
特許文献1に開示された手法では、溝に配線パターンが形成された複数の熱可塑性樹脂基板を軟化温度以上に加熱し、圧着している。すなわち、熱圧着工程において、基板全体が軟化してしまうため、配線溝形状が変形し、配線に求められる所望の電気特性が得られなくなる虞があった。
第1の熱可塑性樹脂基板の表面に溝を形成する工程と、
前記第1の熱可塑性樹脂基板の前記表面に光を照射することにより、前記第1の熱可塑性樹脂基板を構成する樹脂よりも融点の低い樹脂からなる改質層を形成する工程と、
前記第1の熱可塑性樹脂基板の前記溝に流動性を有する導電材料を充填する工程と、
前記改質層が形成された前記第1の熱可塑性樹脂基板の前記表面に、第2の熱可塑性樹脂基板を熱圧着する工程と、を備え、
前記改質層を形成する工程において、
前記第1の熱可塑性樹脂基板の前記溝の周囲には前記光を照射せず、前記改質層を形成しないものである。
また、前記溝を形成する工程において、波長が250nm以下かつ1回当たりの出力が1W以下の紫外線レーザ光を繰り返し照射することにより前記溝を形成することが好ましい。このような構成により、溝の表面に親水性を付与することができる。
さらに、前記改質層を形成する工程において、前記光として前記紫外線レーザ光を照射することが好ましい。溝と改質層とを同時に形成することができる。ここで、前記光として前記紫外線レーザ光を1回のみ照射することが好ましい。
表面の溝に配線が形成された第1の熱可塑性樹脂基板と、
前記第1の熱可塑性樹脂基板の前記表面に積層された第2の熱可塑性樹脂基板と、
前記第1の熱可塑性樹脂基板と前記第2の熱可塑性樹脂基板との界面に形成され、かつ、前記第1の熱可塑性樹脂基板を構成する樹脂よりも融点の低い樹脂からなる改質層と、を備え、
前記改質層は、前記界面において前記第1の熱可塑性樹脂基板の前記溝の周囲には形成されていないものである。
図1〜図9を参照して、本発明の第1の実施の形態に係る多層配線基板の製造方法について説明する。図1、図2、図5、図7〜図9は、第1の実施の形態に係る多層配線基板の製造方法を示す断面図である。図3は、第1の実施の形態に係る第1配線基板10において導体インクを充填した様子を示す顕微鏡写真である。図4は、比較例に係る第1配線基板において導体インクを充填した様子を示す顕微鏡写真である。図6は、図5に対応した平面図である。
次に、図10及び図11を参照して、その他の実施の形態について説明する。
まず、図10は、図8の変形例である。図10に示すように、第1配線基板10の表面上に第2配線基板20の裏面を積層する前に、第2配線基板20の裏面にも改質層22cを形成してもよい。ここで、改質層12aが配線溝11の周囲に形成されていないのと同様に、改質層22cはビアホール21bの周囲には形成されていない。
例えば、レーザ光をスキャンするのでなく、マスクを用いて紫外線ランプにより一括露光して配線溝、ビアホール及び配線基板表面の改質層を形成することもできる。しかしながら、レーザ光をスキャンする方が、高価なマスクを使用する必要がないため、コスト的に有利である。
10a サブ基板
10b サブ基板
11 配線溝
12a 改質層
12b 改質層
12c 改質層
13 配線
20 第2配線基板
21a 配線溝
21b ビアホール
22a 改質層
22b 改質層
22c 改質層
23a 配線
23b 埋め込みビア
Claims (6)
- 第1の熱可塑性樹脂基板の表面に溝を形成する工程と、
前記第1の熱可塑性樹脂基板の前記表面に光を照射することにより、前記第1の熱可塑性樹脂基板を構成する樹脂よりも融点の低い樹脂からなる改質層を形成する工程と、
前記第1の熱可塑性樹脂基板の前記溝に流動性を有する導電材料を充填する工程と、
前記改質層が形成された前記第1の熱可塑性樹脂基板の前記表面に、第2の熱可塑性樹脂基板を熱圧着する工程と、を備え、
前記改質層を形成する工程において、
前記第1の熱可塑性樹脂基板の前記溝の周囲には前記光を照射せず、前記改質層を形成しない、
多層配線基板の製造方法。 - 熱圧着する工程において、
前記改質層を構成する樹脂の融点よりも高く、前記第1の熱可塑性樹脂基板を構成する樹脂の融点よりも低い温度に加熱する、
請求項1に記載の多層配線基板の製造方法。 - 前記溝を形成する工程において、
波長が250nm以下かつ1回当たりの出力が1W以下の紫外線レーザ光を繰り返し照射することにより前記溝を形成する、
請求項1又は2に記載の多層配線基板の製造方法。 - 前記改質層を形成する工程において、
前記光として前記紫外線レーザ光を照射する、
請求項3に記載の多層配線基板の製造方法。 - 前記改質層を形成する工程において、
前記光として前記紫外線レーザ光を1回のみ照射する、
請求項4に記載の多層配線基板の製造方法。 - 表面の溝に配線が形成された第1の熱可塑性樹脂基板と、
前記第1の熱可塑性樹脂基板の前記表面に積層された第2の熱可塑性樹脂基板と、
前記第1の熱可塑性樹脂基板と前記第2の熱可塑性樹脂基板との界面に形成され、かつ、前記第1の熱可塑性樹脂基板を構成する樹脂よりも融点の低い樹脂からなる改質層と、を備え、
前記改質層は、前記界面において前記第1の熱可塑性樹脂基板の前記溝の周囲には形成されていない、
多層配線基板。
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